Plasma apparatus

Abstract

The invention provides plasma equipment, and relates to the technical field of semiconductor equipment. The plasma equipment comprises a chamber base body, and the top wall of the chamber base body is provided with a first opening; the medium cylinder is located above the cavity base body and is in sealing fit with the cavity base body, so that the inner space of the cavity base body is communicated with the inner space of the medium cylinder through the first opening; the coil assembly is arranged outside the medium cylinder in a sleeving manner; the cooling cylinder is located between the medium cylinder and the coil assembly, and a preset gap is formed between the cooling cylinder and the medium cylinder; the cooling cylinder is provided with an air inlet hole for cooling air to enter; the cooling cylinder is provided with a first-layer cylinder wall and a second-layer cylinder wall, the first-layer cylinder wall is located on the inner side, facing the medium cylinder, of the second-layer cylinder wall, and a flow guide channel is formed between the first-layer cylinder wall and the second-layer cylinder wall; a plurality of air outlet holes are formed in the first layer of cylinder wall; the air outlet holes and the air inlet holes are respectively communicated with the flow guide channel. According to the invention, the medium cylinder can be cooled.

Description

Technical Field

[0001] The present disclosure relates to the technical field of semiconductor devices, and particularly to a plasma device. Background Art

[0002] In related technologies, ICP (Inductively Coupled Plasma Etcher) plasma etching equipment and ashing equipment are important process equipment in the semiconductor chip manufacturing process, and remote plasma technology has been widely applied to the above-mentioned equipment. The purpose of remote plasma technology is to generate plasma in a region far from the wafer, and the plasma processes the wafer after reaching the wafer region. However, a relatively high temperature is generated during the process of generating plasma. Summary of the Invention

[0003] The present disclosure provides a plasma device capable of dissipating heat from the dielectric cylinder and reducing the temperature of the dielectric cylinder.

[0004] The present disclosure provides a plasma device, including: a chamber base body, a first opening is provided on the top wall of the chamber base body; a dielectric cylinder, located above the chamber base body and hermetically fitted with the chamber base body, so that the internal space of the dielectric cylinder communicates with the internal space of the chamber base body through the first opening; a coil assembly, sleeved outside the dielectric cylinder; a cooling cylinder, located between the dielectric cylinder and the coil assembly and having a preset gap with the dielectric cylinder; the cooling cylinder is provided with an air inlet hole for cooling gas to enter; the cooling cylinder has a first layer of cylinder wall and a second layer of cylinder wall, the first layer of cylinder wall is located on the inner side of the second layer of cylinder wall facing the dielectric cylinder, and a diversion channel is formed between the first layer of cylinder wall and the second layer of cylinder wall; the first layer of cylinder wall is provided with a plurality of air outlet holes, and the air outlet holes and the air inlet hole are respectively communicated with the diversion channel; part of the air outlet holes are spaced along the axial direction of the cooling cylinder, and part of the air outlet holes are spaced along the circumferential direction of the cooling cylinder; wherein, under the guidance of the diversion channel, the cooling gas entering from the air inlet hole can flow to the plurality of air outlet holes, and after being discharged from the air outlet holes, enter the preset gap to dissipate heat from the dielectric cylinder.

[0005] In some embodiments, the cooling cylinder includes a vertical section and a bent section, the vertical section extends along the axial direction of the cooling cylinder, the vertical section is connected to the bent section, and the bent section extends in a direction away from the dielectric cylinder; the bent section is provided with the air inlet hole; at least part of the diversion channel is located in the vertical section.

[0006] In some embodiments, along the direction from bottom to top, the diameter of the air outlet hole gradually increases.

[0007] In some embodiments, along the direction from bottom to top, the distribution density of the air outlet holes gradually increases.

[0008] In some embodiments, the diameter of the air outlet holes is less than or equal to 5 mm.

[0009] In some embodiments, the preset gap between the cooling cylinder and the medium cylinder is less than or equal to 5 mm.

[0010] In some embodiments, the cooling cylinder is provided with a plurality of the long holes, and the length direction of the long holes is parallel to the axial direction of the cooling cylinder; at least two of the long holes are circumferentially spaced apart along the cooling cylinder; the first-layer cylinder wall is provided with the air outlet holes at a portion between two adjacent long holes along the circumference of the cooling cylinder.

[0011] In some embodiments, the cooling cylinder is made of a metal material; or, the cooling cylinder is made of a dielectric material.

[0012] In some embodiments, the cooling cylinder is detachably connected to the chamber base.

[0013] In some embodiments, the plasma device further includes: a cover plate covering one end of the medium cylinder facing away from the chamber base; an air inlet device, and an air inlet pipeline of the air inlet device penetrates through the cover plate.

[0014] In the plasma device provided by the embodiments of the present disclosure, the cooling gas that enters from the air inlet holes of the cooling cylinder, is guided through the diversion channel to the air outlet holes, and then discharged to the medium cylinder can dissipate heat from the medium cylinder, reduce the temperature of the medium cylinder, improve or even avoid the problem that the medium cylinder melts due to high temperature, and moreover, by reducing the temperature difference inside the medium cylinder, improve the temperature uniformity of the medium cylinder, and improve or even avoid the problem that the medium cylinder cracks due to excessive temperature difference.

[0015] It should be understood that the content described in this part is not intended to identify the key or important features of the embodiments of the present disclosure, nor is it used to limit the scope of the present disclosure. Other features of the present disclosure will become easily understood through the following description. Description of the Drawings

[0016] The drawings are used to better understand the solution and do not constitute a limitation to the present disclosure. Among them:

[0017] Figure 1 is a schematic structural diagram of a plasma device according to an embodiment of the present disclosure;

[0018] Figure 2 is a partial cross-sectional schematic diagram of a plasma device according to an embodiment of the present disclosure;

[0019] Figure 3It is a three-dimensional structural schematic diagram of a cooling cylinder according to an embodiment of the present disclosure;

[0020] Figure 4 It is a cross-sectional schematic diagram of the cooling cylinder according to an embodiment of the present disclosure.

[0021] Explanation of reference numerals: 100 - chamber base; 200 - dielectric cylinder; 300 - coil assembly; 400 - cooling cylinder; 410 - first-layer cylinder wall; 411 - air inlet hole; 412 - diversion channel; 413 - air outlet hole; 420 - second-layer cylinder wall; 400a - vertical section; 400b - bent section; 430 - long hole; 440 - sealing ring; 500 - cover plate; 600 - air inlet device; 700 - vacuum pump; 800 - wafer. Specific embodiments

[0022] The following describes exemplary embodiments of the present disclosure with reference to the accompanying drawings. Various details of the embodiments of the present disclosure are included to facilitate understanding, and they should be considered merely exemplary. Therefore, those of ordinary skill in the art should recognize that various changes and modifications can be made to the embodiments described herein without departing from the scope and spirit of the present disclosure. Similarly, for clarity and conciseness, descriptions of well-known functions and structures are omitted in the following description.

[0023] In the related art, a plasma device includes a chamber base, a dielectric cylinder, and a coil assembly. A wafer area is provided in the chamber base, an ion excitation area is provided in the dielectric cylinder, and the coil assembly is located outside the dielectric cylinder. There is a certain distance between the ion excitation area and the wafer area. In order to ensure the concentration of the excited state components on the wafer surface, a relatively large power is used to generate plasma. When energy is fed into the coil assembly, the plasma concentration is the highest in the area corresponding to the coil in the coil assembly, and ions will bombard the dielectric cylinder, causing the temperature of the dielectric cylinder to rise, and then leading to problems such as melting of the dielectric cylinder. Moreover, since the coil is spiral, the coil is not evenly distributed relative to the dielectric cylinder, which will result in poor temperature uniformity of the dielectric cylinder, and then lead to problems such as rupture of the dielectric cylinder.

[0024] To overcome the above problems, this embodiment provides a plasma device. By providing a cooling cylinder outside the dielectric cylinder, the dielectric cylinder is cooled by the cooling gas entering the cooling cylinder, the temperature of the dielectric cylinder is reduced, the problem of melting of the dielectric cylinder due to high temperature is improved or even avoided, and the temperature difference inside the dielectric cylinder is reduced, the temperature uniformity of the dielectric cylinder is improved, and the problem of rupture of the dielectric cylinder due to excessive temperature difference is improved or even avoided.

[0025] The following takes the accompanying drawings as an example to illustrate the structure, function, and implementation process of the plasma device provided in this embodiment.

[0026] Figure 1It is a schematic cross-sectional view of the plasma device in the embodiment of the present disclosure (with the vertical plane passing through the central axis of the plasma device as the cross-section plane); Figure 2 It is a partial cross-sectional view of the coil assembly, the cooling cylinder and the dielectric cylinder in the embodiment of the present disclosure; Figure 3 It is a three-dimensional structural view of the cooling cylinder in the embodiment of the present disclosure; Figure 4 It is a cross-sectional view of the cooling cylinder in the embodiment of the present disclosure (with the vertical plane passing through the central axis of the plasma device as the cross-section plane).

[0027] Please refer to Figures 1 to 4 , this embodiment provides a plasma device, including: a chamber base body 100, the top wall of the chamber base body 100 is provided with a first opening; a dielectric cylinder 200, located above the chamber base body 100 and hermetically cooperated with the chamber base body 100, so that the internal space of the chamber base body 100 is communicated with the internal space of the dielectric cylinder 200 through the first opening; a coil assembly 300, sleeved outside the dielectric cylinder 200; a cooling cylinder 400, located between the dielectric cylinder 200 and the coil assembly 300 and having a preset gap with the dielectric cylinder 200; the cooling cylinder 400 is provided with an air inlet hole 411 for cooling gas to enter; the cooling cylinder 400 has a first layer of cylinder wall 410 and a second layer of cylinder wall 420, the first layer of cylinder wall 410 is located on the inner side of the second layer of cylinder wall 420 facing the dielectric cylinder 200, and a diversion channel 412 is formed between the first layer of cylinder wall 410 and the second layer of cylinder wall 420; the first layer of cylinder wall 410 is provided with a plurality of air outlet holes 413, the air outlet holes 413 and the air inlet hole 411 are respectively communicated with the diversion channel 412; some of the air outlet holes 413 are spaced along the axial direction of the cooling cylinder 400, and some of the air outlet holes 413 are spaced along the circumferential direction of the cooling cylinder 400.

[0028] Among them, under the guidance of the diversion channel 412, the cooling gas entering from the air inlet hole 411 can flow to a plurality of air outlet holes 413, and after being discharged from the air outlet holes 413, it enters the preset gap, so as to be able to blow to the dielectric cylinder 200 to dissipate heat from the dielectric cylinder 200.

[0029] The chamber base body 100 is generally cylindrical or prismatic. The chamber base body 100 has an internal space, and the shape of the internal space can be set according to actual needs. For example, the internal space of the chamber base body 100 is generally cylindrical or prismatic. The internal space of the chamber base body 100 is used to accommodate the wafer 800. Generally, a support device for supporting the wafer 800 is arranged in the internal space of the chamber base body 100, and the support device can include at least one of the following: a tray, or a thimble, or an air bearing block, etc.

[0030] For the convenience of description, in this embodiment, the axial direction of the chamber base body 100 is taken as the vertical direction (or called the vertical direction); the direction of the chamber base body 100 facing the dielectric cylinder 200 is taken as the up (or called the top) as an example for description.

[0031] The chamber base 100 has a top end and a bottom end that are axially spaced apart along it. The top wall of the chamber base 100 is provided with a first opening for allowing gas to enter the internal space of the chamber base 100. Among them, the first opening can be a circular through-hole. In other examples, the first opening can also be polygonal, and the specific shape of the first opening can be set according to actual needs. Taking the chamber base 100 as a cylinder as an example, the diameter of the first opening can be approximately half of the outer diameter of the chamber base 100.

[0032] Above the chamber base 100, a dielectric cylinder 200 is provided. The dielectric cylinder 200 can be a hollow cylinder, and its internal space can provide space for generating ions. The dielectric cylinder 200 can be cylindrical. In other examples, the dielectric cylinder 200 can also be prismatic.

[0033] The dielectric cylinder 200 has a second opening, and the second opening of the dielectric cylinder 200 corresponds to the first opening of the chamber base 100, so that the internal space of the dielectric cylinder 200 is communicated with the internal space of the chamber base 100.

[0034] The dielectric cylinder 200 can be fixedly connected and sealed with the pore wall of the first opening. Exemplarily, the pore wall of the first opening can be stepped. The first opening includes a first pore section and a second pore section. The first pore section is located above the second pore section, and the diameter of the first pore section is larger than that of the second pore section. In this way, a support surface is formed at the connection of the first pore section and the second pore section. The dielectric cylinder 200 is inserted into the first pore section, and the dielectric cylinder 200 is supported on the support surface. In order to improve the sealing reliability, a sealing ring 440 can be provided between the outer wall of the dielectric cylinder 200 and the pore wall of the first pore section, or a sealing ring 440 can be provided between the bottom end surface of the dielectric cylinder 200 and the support surface.

[0035] The dielectric cylinder 200 also has a third opening, and the third opening is located at the top of the dielectric cylinder 200. The top end of the dielectric cylinder 200 can be covered with a cover plate 500, and the cover plate 500 is used to block the third opening. In other examples, the cover plate 500 can also be integrally provided with the dielectric cylinder 200.

[0036] The plasma device can also include an air inlet device 600. The inlet pipeline of the air inlet device 600 passes through the cover plate 500 to supply gas into the dielectric cylinder 200.

[0037] A coil assembly 300 is sleeved outside the dielectric cylinder 200. The coil assembly 300 is used to excite the gas in the internal space of the dielectric cylinder 200 to form plasma when supplied with energy, through radio frequency or microwave. Among them, the power of the energy supplied to the coil assembly 300 can be set according to actual needs.

[0038] The coil assembly 300 may include a coil body and a coil mount for fixedly connecting the coil body to other components of the plasma device. For example, the coil mount may fixedly connect the coil body to the chamber base 100; the structure of the coil mount may be set according to actual needs.

[0039] A cooling cylinder 400 is provided between the coil assembly 300 and the dielectric cylinder 200. The cooling cylinder 400 is used to convey the cooling gas blown towards the dielectric cylinder 200 to cool the dielectric cylinder 200. The cooling cylinder 400 is relatively close to the dielectric cylinder 200 to ensure that the gas discharged from the cooling cylinder 400 can blow towards the dielectric cylinder 200 as much as possible.

[0040] The cooling cylinder 400 may be a cylindrical structure sleeved outside the dielectric cylinder 200. There is a certain gap between the dielectric cylinder 200 and the cooling cylinder 400, so that the cooling gas discharged from the cooling cylinder 400 can flow in this gap, increasing the contact area between the cooling gas and the dielectric cylinder 200. The shape of the cooling cylinder 400 may be the same as that of the dielectric cylinder 200. For example, when the dielectric cylinder 200 is cylindrical, the cooling cylinder 400 may also be cylindrical, and the inner diameter of the dielectric cylinder 200 is slightly larger than the outer diameter of the dielectric cylinder 200.

[0041] The cooling cylinder 400 may be a double-layer structure. Exemplarily, the cooling cylinder 400 includes a first layer of cylinder wall 410 and a second layer of cylinder wall 420; the first layer of cylinder wall 410 is located on the inner side of the second layer of cylinder wall 420 facing the dielectric cylinder 200, that is, the first layer of cylinder wall 410 is closer to the dielectric cylinder 200; a diversion channel 412 is formed between the first layer of cylinder wall 410 and the second layer of cylinder wall 420. The first layer of cylinder wall 410 is provided with a plurality of air outlet holes 413. The cooling cylinder 400 is also provided with an air inlet hole 411. The air outlet holes 413 and the air inlet hole 411 are respectively communicated with the diversion channel 412. In this way, the cooling gas enters from the air inlet hole 411, is guided by the diversion channel 412, and finally is discharged from the air outlet holes 413 and blows towards the dielectric cylinder 200.

[0042] Some of the air outlet holes 413 are spaced along the axial direction of the cooling cylinder 400, and some of the air outlet holes 413 are spaced along the circumferential direction of the cooling cylinder 400. In this way, a relatively large number of air outlet holes 413 can be set, and the distribution of the air outlet holes 413 is relatively uniform, which is beneficial to improving the cooling effect on the dielectric cylinder 200.

[0043] The cooling cylinder 400 is made of a metal material; at this time, the cooling cylinder 400 can also be used as a Faraday cylinder. Alternatively, the cooling cylinder 400 is made of a dielectric material; the dielectric material may include one of the following: ceramics, quartz.

[0044] The cooling cylinder 400 is detachably installed in the ion device, facilitating the maintenance or replacement of the cooling cylinder 400. For example, the bottom of the cooling cylinder 400 can be bolted or clamped to the chamber base 100 through an intermediate connector such as a mounting bracket.

[0045] For the plasma device provided in this embodiment, through the above settings, the cooling gas that enters through the air inlet hole 411 of the cooling cylinder 400 and is guided through the diversion channel 412 to the air outlet hole 413 and then discharged to the medium cylinder 200 can dissipate heat from the medium cylinder 200, reduce the temperature of the medium cylinder 200, improve or even avoid the problem of the medium cylinder 200 melting due to high temperature, and by reducing the temperature difference inside the medium cylinder 200, improve the temperature uniformity of the medium cylinder 200, and improve or even avoid the problem of the medium cylinder 200 cracking due to excessive temperature difference. Moreover, in this embodiment, the air inlet hole 411, the diversion channel 412, and the air outlet hole 413 are provided in the cooling cylinder 400, which will not affect the vacuum environment inside the medium cylinder 200 and can reduce the impact on the feeding efficiency of the coil assembly 300.

[0046] In some embodiments, the cooling cylinder 400 includes a vertical section 400a and a bent section 400b. The vertical section 400a extends along the axial direction of the cooling cylinder 400, and the bent section 400b extends along the radial direction of the cooling cylinder 400. Optionally, the bent section 400b can be perpendicular to the vertical section 400a.

[0047] Exemplarily, in order to improve the integrity of the cooling cylinder 400, the vertical section 400a can be a hollow cylinder; a structure extending in a direction away from the central axis of the cylinder is connected to the bottom end of the cylinder, and this structure forms the bent section 400b. Among them, the bent section 400b can be an annular structure; in other examples, the bent section 400b can include at least one block structure.

[0048] The bent section 400b is provided with an air inlet hole 411, and at least part of the diversion channel 412 can be located in the vertical section 400a. Exemplarily, the air inlet hole 411 penetrates through the bent section 400b, and the diversion channel 412 is located in the vertical section 400a; or, if the air inlet hole 411 does not penetrate through the bent section 400b, then a part of the diversion channel 412 is located in the vertical section 400a and another part is located in the bent section 400b, so that the diversion channel 412 is communicated with the air inlet hole 411.

[0049] In some examples, the bent section 400b is connected to the bottom end of the vertical section 400a. The bent section 400b is provided with an air inlet hole 411 connected to the cooling gas source. Exemplarily, an air inlet hole 411 is provided at one end of the bent section 400b facing away from the vertical section 400a, or rather, the first layer of the cylinder wall 410 is located on the end face of the bent section 400b facing away from the vertical section 400a, and the air inlet hole 411 is formed by enclosing with the second layer of the cylinder wall 420 located on the end face of the bent section 400b facing away from the vertical section 400a.

[0050] The cooling cylinder 400 may be provided with multiple rows of air outlet holes 413; among them, taking a straight line parallel to the axial direction of the cooling cylinder 400 and passing through the wall of the cooling cylinder 400 and through the air outlet holes 413 as a reference line, the multiple air outlet holes 413 passed through by this reference line may be one row of air outlet holes 413.

[0051] In the bent section 400b, air inlet holes 411 are provided at parts corresponding to at least two rows of oppositely arranged air outlet holes 413. Optionally, air inlet holes 411 are respectively provided at parts corresponding to each row of air outlet holes 413 in the bent section 400b, which is beneficial to improving the uniformity of the cooling effect. Or for the sake of simplifying the structure, among every two or three or four air outlet holes 413, air inlet holes 411 are provided at parts corresponding to one of the air outlet holes 413 in the bent section 400b. The number of the air inlet holes 411 can be specifically set according to actual needs.

[0052] Optionally, in order to improve the problem that the cooling gas loses energy during the upward flow from bottom to top, resulting in uneven cooling effects on the upper and lower parts of the medium cylinder 200, along the direction from bottom to top, the diameter of the air outlet holes 413 gradually increases, so as to improve the uniformity of the cooling effect on the medium cylinder 200. When specifically implemented, as the axial length of the cooling cylinder 400 increases, the ratio between the diameter of the air outlet holes 413 located above and the diameter of the air outlet holes 413 located below also increases. Among them, the ratio between the diameter of the air outlet holes 413 located above and the diameter of the air outlet holes 413 located below can be set according to actual needs.

[0053] Optionally, in order to improve the problem that the cooling gas loses energy during the upward flow from bottom to top, resulting in uneven cooling effects on the upper and lower parts of the medium cylinder 200, along the direction from bottom to top, the distribution density of the air outlet holes 413 gradually increases, so as to improve the uniformity of the cooling effect on the medium cylinder 200. Exemplarily, along the direction from bottom to top, the distance between two adjacent air outlet holes 413 in the axial direction gradually decreases. When specifically implemented, as the axial length of the cooling cylinder 400 increases, the ratio between the distribution density of the air outlet holes 413 in the upper region and the distribution density of the air outlet holes 413 in the lower region also increases. Among them, the ratio between the distribution density of the air outlet holes 413 in the upper region and the distribution density of the air outlet holes 413 in the lower region can be set according to actual needs.

[0054] In other examples, the vertical section 400a has an upper part, a lower part, and a middle part connecting between the upper part and the lower part; the bent section 400b may also be connected to the middle part or the upper part of the vertical section 400a.

[0055] In some embodiments, the diameter of the air outlet 413 is less than or equal to 5 mm. Exemplarily, the diameter of the air outlet 413 can be 0.5 mm, 1.0 mm, 1.5 mm, 2.0 mm, 2.5 mm, 3.0 mm, 3.5 mm, 4.0 mm, 4.5 mm, or 5.0 mm, or a value between any two of the above. Through the above settings, the cooling cylinder 400 can not only have a relatively large number of air outlets 413, but also ensure that the speed or pressure of the cooling gas flowing out of the air outlet 413 reaches a preset value, thereby ensuring the cooling effect on the medium cylinder 200.

[0056] In some embodiments, the preset gap between the cooling cylinder 400 and the medium cylinder 200 is less than or equal to 5 mm. Exemplarily, the preset gap between the cooling cylinder 400 and the medium cylinder 200 can be 0.5 mm, 1.0 mm, 1.5 mm, 2.0 mm, 2.5 mm, 3.0 mm, 3.5 mm, 4.0 mm, 4.5 mm, or 5.0 mm, or a value between any two of the above. Through the above settings, it can not only provide a diffusion space for the cooling gas discharged from the air outlet 413, but also prevent the diffusion range of the cooling gas from being too large and affecting the cooling effect on the medium cylinder 200.

[0057] In some embodiments, in order to reduce the self-weight and reduce the influence on the energy feeding efficiency of the coil assembly 300, the cooling cylinder 400 is provided with a plurality of long holes 430, and the length direction of the long holes 430 is parallel to the axial direction of the cooling cylinder 400. Among them, the long holes 430 can be at least located in the vertical section 400a of the cooling cylinder 400; for example, the long holes 430 are located in the vertical section 400a; or, for another example, most of the long holes 430 are located in the vertical section 400a, and a small part is located in the bending section 400b. In addition, when the cooling cylinder 400 is made of a metal material such as an aluminum alloy material, through the above settings, the cooling cylinder 400 can also achieve electrostatic shielding.

[0058] Among them, the long holes 430 can be arranged to penetrate along the thickness direction of the cooling cylinder 400. Or, the long holes 430 include: blind holes provided in the first layer of cylinder wall 410, and the orifice of the blind hole is located on the inner surface of the first layer of cylinder wall 410; and / or, blind holes provided in the second layer of cylinder wall 420, and the orifice of the blind hole is located on the outer surface of the second layer of cylinder wall 420. It can be understood that: when the long holes 430 penetrate along the thickness direction of the cooling cylinder 400, the long holes are not communicated with the diversion channel 412. The cooling cylinder 400 can be made by three-dimensional printing or integrally formed by an injection mold or a stamping process; or, the first layer of cylinder wall 410 and the second layer of cylinder wall 420 are fixedly connected by at least one of the following connection methods: bonding, clamping, screwing, welding, etc.

[0059] Optionally, at least two long holes 430 are circumferentially spaced apart along the cooling cylinder 400. An air outlet hole 413 is provided between two adjacent long holes 430 along the circumference of the cooling cylinder 400. The long holes 430 and the air outlet holes 413 are arranged at intervals in columns. For example, one or more columns of air outlet holes 413 are provided between two adjacent long holes 430 along the circumference of the cooling cylinder 400. For another example, one or more long holes 430 are provided between two adjacent columns of air outlet holes 413 along the circumference of the cooling cylinder 400.

[0060] In other examples, long holes 430 may also be provided between two axially spaced air outlet holes 413 along the cooling cylinder 400; or, long holes 430 may also be provided between two circumferentially spaced air outlet holes 413 along the cooling cylinder 400.

[0061] In some embodiments, the plasma device may further include a recovery device for recovering the cooling gas in the gap between the dielectric cylinder 200 and the cooling cylinder 400, which is conducive to timely discharging the cooling gas after heat exchange with the dielectric cylinder 200 from the gap between the dielectric cylinder 200 and the cooling cylinder 400.

[0062] Exemplarily, the recovery device includes a recovery tray. The recovery tray is provided with a central hole, which can be used to cooperate with at least one of the cover plate 500, the dielectric cylinder 200, and the cooling cylinder 400; at least part of the recovery tray can be sleeved outside the dielectric cylinder 200, or at least part of the recovery tray can be sleeved outside the cooling cylinder 400, or at least part of the recovery tray can be sleeved outside the cover plate 500. The recovery tray is provided with recovery holes, and the recovery holes can extend along the inner circumference of the recovery tray, that is, the inner wall of the central hole, or there are multiple recovery holes and they are evenly distributed along the inner circumference of the recovery tray. A recovery channel is arranged inside the recovery tray, and the recovery channel is communicated with each recovery hole. The recovery tray may also be provided with an interface, and the interface is communicated with the recovery channel. The interface can be connected to a recovery pipeline; the recovery pipeline can be connected to a suction component or a component capable of accommodating gas. The cooled gas after heat exchange can enter the recovery tray from the recovery holes and be guided through the recovery channel and then discharged into the recovery pipeline from the interface.

[0063] When the air inlet hole 411 of the cooling cylinder 400 is located at the bottom, the recovery tray can be arranged close to the top of the cooling cylinder 400; exemplarily, there is a preset distance between the top end surface of the cooling cylinder 400 and the bottom end surface of the cover plate 500, and at least part of the recovery tray can be located between the top end of the cooling cylinder 400 and the bottom end of the cover plate 500, or the gap between the top end surface of the cooling cylinder 400 and the bottom end surface of the cover plate 500 is communicated with the recovery holes of the recovery tray, so that the cooled gas after heat exchange can enter the recovery tray from the recovery holes.

[0064] Optionally, a first valve may be provided in the gas source device for supplying the cooling gas; a second valve is provided at the inlet end of the recovery device. For example, the second valve may be installed at the interface of the recovery tray; the first valve and the second valve are respectively communicatively connected to the control device of the plasma device, and the control device is used to respectively control the working states of the first valve and the second valve, such as controlling the opening and closing and the opening degree of the valves. For example, the control device controls the first valve to open and controls the second valve to open at every preset time interval to timely discharge the cooling gas after heat exchange with the medium cylinder 200 from the gap between the medium cylinder 200 and the cooling cylinder 400. For another example, after the cooling of the medium cylinder 200 is completed, the control device controls the first valve to close, and controls the second valve to close after a preset time interval to ensure that all the gas in the gap between the medium cylinder 200 and the cooling cylinder 400 is discharged.

[0065] In some embodiments, a vacuum pump 700 is installed at the lower end of the chamber base 100. The vacuum pump 700 is communicatively connected to the control device, and the vacuum pump 700 is used to process the internal space of the chamber base 100 into a vacuum environment.

[0066] It can be understood that the other constitutions and functions of the plasma device in this embodiment are known to those skilled in the art. To reduce redundancy, they will not be described in detail here.

[0067] In the description of this specification, it should be understood that the orientation or positional relationships indicated by the terms "length", "width", "thickness", "upper", "lower", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", etc. are based on the orientation or positional relationships shown in the drawings, and are only for the convenience of describing the present disclosure and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present disclosure.

[0068] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present disclosure, "a plurality" means two or more unless otherwise specifically defined.

[0069] In this disclosure, unless otherwise clearly defined and limited, terms such as "installed", "connected", "linked", "fixed", etc. shall be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection, an electrical connection, or a communication connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in this disclosure can be understood according to specific circumstances.

[0070] In this disclosure, unless otherwise clearly defined and limited, the first feature being "on" or "under" the second feature may include the direct contact between the first and second features, or may include the situation where the first and second features are not in direct contact but in contact through additional features between them. Moreover, the first feature being "above", "over" and "on top of" the second feature includes the first feature being directly above and obliquely above the second feature, or merely indicating that the horizontal height of the first feature is higher than that of the second feature. The first feature being "under", "beneath" and "underneath" the second feature includes the first feature being directly below and obliquely below the second feature, or merely indicating that the horizontal height of the first feature is lower than that of the second feature.

[0071] The above disclosure provides many different embodiments or examples for implementing different structures of the present disclosure. To simplify the disclosure of the present disclosure, the components and settings of specific examples are described above. Of course, they are only examples and are not intended to limit the present disclosure. In addition, the present disclosure may repeat reference numerals and / or reference letters in different examples. This repetition is for the purpose of simplification and clarity, and does not itself indicate the relationship between the various embodiments and / or settings discussed.

[0072] As described above, it is only the specific implementation manner of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present disclosure can easily think of various changes or substitutions, and these should all be covered within the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be subject to the protection scope of the claimed rights.

Claims

1. A plasma device comprising: A chamber base, wherein a top wall of the chamber base is provided with a first opening; a medium cylinder, located above the chamber base and sealingly matched with the chamber base, so that the inner space of the medium cylinder is connected with the inner space of the chamber base through the first opening; A coil assembly is sleeved outside the dielectric cylinder; A cooling cylinder is located between the dielectric cylinder and the coil assembly, and has a preset gap with the dielectric cylinder; the cooling cylinder is provided with an air inlet hole for cooling gas to enter; the cooling cylinder has a first layer of cylinder wall and a second layer of cylinder wall, the first layer of cylinder wall is located on the inner side of the second layer of cylinder wall facing the dielectric cylinder, and a guide channel is formed between the first layer of cylinder wall and the second layer of cylinder wall; the first layer of cylinder wall is provided with a plurality of air outlet holes, and the air outlet holes and the air inlet holes are respectively connected to the guide channel; some of the air outlet holes are distributed at intervals along the axial direction of the cooling cylinder, and some of the air outlet holes are distributed at intervals along the circumferential direction of the cooling cylinder; Wherein, under the guidance of the guide channel, the cooling gas entering from the air inlet can flow to the plurality of air outlets, and enter the preset gap after being discharged from the air outlets, so as to dissipate the heat of the dielectric cylinder.

2. According to the plasma equipment according to claim 1, the cooling tube includes a vertical section and a bending section, the vertical section extends along the axial direction of the cooling tube, the vertical section is connected to the bending section, and the bending section extends in a direction away from the dielectric tube; the bending section is provided with the air inlet hole; at least part of the guide channel is located in the vertical section. The plasma equipment according to claim 2 , wherein a bottom end of the vertical section is connected to the bent section. The plasma device according to claim 3 , wherein the diameter of the gas outlet gradually increases from bottom to top. 5 . The plasma device according to claim 3 , wherein the distribution density of the gas outlet holes gradually increases from bottom to top.

6. The plasma device according to claim 1, wherein the diameter of the gas outlet hole is less than or equal to 5 mm; And / or, a preset gap between the cooling cylinder and the medium cylinder is less than or equal to 5 mm.

7. The plasma device according to claim 1, wherein the cooling tube is provided with a plurality of long holes, and the length direction of the long holes is parallel to the axial direction of the cooling tube; At least two of the long holes are spaced apart along the circumference of the cooling cylinder; The first layer of the cylinder wall is located between two adjacent long holes along the circumferential direction of the cooling cylinder, and is provided with the air outlet holes. 8 . The plasma equipment according to claim 1 , wherein the cooling tube is made of metal material; or, the cooling tube is made of dielectric material. 9 . The plasma equipment according to claim 1 , wherein the cooling cylinder is detachably connected to the chamber base.

10. The plasma device according to claim 1, further comprising: A cover plate, which is arranged to cover an end of the medium tube away from the chamber base; An air intake device, wherein an air intake pipeline of the air intake device is arranged through the cover plate.

Images