Chemical liquid discharge control system, chemical liquid discharge method, and semiconductor cleaning device

Abstract

The invention discloses a chemical liquid discharge control system, a chemical liquid discharge method and a semiconductor cleaning device. The discharge control system comprises a first sensor arranged in the process cavity and used for detecting whether chemical liquid exists in the process cavity or not, and the chemical liquid at least comprises first chemical liquid and second chemical liquid; the discharge valve group is arranged at the downstream of the temporary storage area, the temporary storage area is used for receiving the chemical liquid flowing in from the process cavity and at least comprises a first discharge valve and a second discharge valve, the first discharge valve is conducted to discharge the first chemical liquid, and the second discharge valve is conducted to discharge the second chemical liquid; and the second sensor is arranged in the temporary storage area, and when the second sensor detects that no first chemical liquid exists in the temporary storage area, the first discharge valve is closed, and a second chemical liquid is introduced into the process cavity. By means of the discharge control system, different chemical liquids can be discharged in a classified mode, waste liquid pollution is reduced, the overall process efficiency can be improved, and the discharge duration of the chemical liquids can be shortened.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor manufacturing, and particularly relates to a chemical liquid discharge control system, a chemical liquid discharge method, a semiconductor cleaning device, and a computer-readable storage medium. Background Art

[0002] In semiconductor cleaning equipment, different types of chemical solvents are often used for wafer cleaning, and the discharge of different types of chemical liquids also has corresponding requirements. If multiple different chemical liquids are mixed and discharged, problems such as low resource utilization rate, difficult recovery, and increased pollution risk will occur.

[0003] In the prior art, there are also some devices that can classify and discharge multiple chemical liquids. However, the discharge devices in the prior art are large and complex in structure, and lack functional components that can provide real-time feedback on whether the waste liquid has been completely discharged. If the first chemical liquid has not been completely discharged and at this time, the second chemical liquid starts to be discharged, then the purpose of classifying and discharging the waste liquid cannot be achieved. Therefore, the current discharge device must wait until the first chemical liquid is completely discharged before the second chemical liquid can be discharged, which will lead to an extended discharge time and affect the process efficiency of the upstream during this discharge process.

[0004] In order to solve the above problems existing in the prior art, there is an urgent need in the art for a chemical liquid discharge technology that can not only classify and discharge different chemical liquids, reduce waste liquid pollution, but also improve the overall process efficiency and shorten the discharge duration of chemical liquids. Summary of the Invention

[0005] The following presents a brief overview of one or more aspects to provide a basic understanding of these aspects. This overview is not an exhaustive survey of all contemplated aspects, and is neither intended to identify key or decisive elements of all aspects nor to define the scope of any or all aspects. Its sole purpose is to present some concepts of one or more aspects in a simplified form as a prelude to the more detailed description that follows.

[0006] To overcome the above-mentioned defects existing in the prior art, the present invention provides a chemical liquid discharge control system, a chemical liquid discharge method, a semiconductor cleaning device, and a computer-readable storage medium, which can not only classify and discharge different chemical liquids, reduce waste liquid pollution, but also improve the overall process efficiency and shorten the discharge duration of chemical liquids.

[0007] Specifically, the above chemical liquid discharge control system provided according to the first aspect of the present invention includes: a first sensor disposed in the process chamber for detecting whether there is a chemical liquid in the process chamber, wherein the chemical liquid at least includes a first chemical liquid and a second chemical liquid; a discharge valve group disposed downstream of the temporary storage area, the temporary storage area being used to receive the chemical liquid flowing in from the process chamber, at least including a first discharge valve and a second discharge valve, wherein the first discharge valve is opened to discharge the first chemical liquid, and the second discharge valve is opened to discharge the second chemical liquid; and a second sensor disposed in the temporary storage area, when the second sensor detects that there is no first chemical liquid in the temporary storage area, closing the first discharge valve and introducing the second chemical liquid into the process chamber.

[0008] Optionally, in some embodiments of the present invention, a liquid guiding valve group is included between the process chamber and the temporary storage area for controlling the chemical liquid in the process chamber to flow into the temporary storage area. When the first sensor detects that there is the first chemical liquid in the process chamber, the liquid guiding valve group is opened to enable the first chemical liquid to flow into the temporary storage area. When the first sensor does not detect the first chemical liquid, the liquid guiding valve group is closed and the second chemical liquid is introduced into the process chamber.

[0009] Optionally, in some embodiments of the present invention, a wafer stage and a nozzle are included in the process chamber. The wafer stage is used to carry the wafer to be processed, and the nozzle is used to provide the corresponding chemical liquid to the wafer in the process chamber according to the process requirements.

[0010] Optionally, in some embodiments of the present invention, the end of the discharge valve group is connected to a discharge tank group for classifying and discharging different chemical liquids. Among them, the end of the first drain valve is connected to a first discharge tank for receiving the discharge of the first chemical liquid, and the end of the second drain valve is connected to a second discharge tank for receiving the discharge of the second chemical liquid.

[0011] In addition, the above chemical liquid discharge method provided according to the second aspect of the present invention uses the above chemical liquid discharge control system provided according to the first aspect of the present invention to perform a chemical liquid discharge operation. The chemical liquid discharge method includes the following steps: detecting whether there is a first chemical liquid flowing down from the process chamber in the temporary storage area; and in response to not detecting the first chemical liquid in the temporary storage area, closing the first discharge valve and introducing the second chemical liquid into the process chamber.

[0012] Optionally, in some embodiments of the present invention, the step of detecting whether there is a first chemical solution flowing down from the process chamber in the detection buffer area includes: introducing the first chemical solution into the process chamber to perform a first process; in response to the first sensor detecting the presence of the first chemical solution in the process chamber, opening the liquid guiding valve group to enable the first chemical solution to flow into the buffer area; and continuously detecting, through the second sensor, whether there is the first chemical solution flowing down from the process chamber in the buffer area.

[0013] Optionally, in some embodiments of the present invention, after the step of continuously detecting, through the second sensor, whether there is the first chemical solution flowing down from the process chamber in the buffer area, it further includes: in response to the second sensor detecting the presence of the first chemical solution in the buffer area, controlling to open the first discharge valve to enable the first chemical solution to be discharged into the corresponding first discharge tank through the first discharge valve.

[0014] Optionally, in some embodiments of the present invention, the step of closing the first discharge valve and introducing the second chemical solution into the process chamber in response to no detection of the first chemical solution in the buffer area includes: in response to the second sensor detecting no first chemical solution in the buffer area, closing the liquid guiding valve group; introducing the second chemical solution into the process chamber to perform a second process; in response to the completion of the second process, detecting whether the first discharge valve is closed; and in response to the first discharge valve being in a closed state, opening the liquid guiding valve group to enable the second chemical solution in the process chamber to flow into the buffer area.

[0015] In addition, the above-mentioned semiconductor cleaning device provided according to the third aspect of the present invention includes: a process chamber for introducing various chemical solutions to perform various process treatments on the wafers inside; a buffer area provided downstream of the process chamber for receiving the chemical solution flowing out from the process chamber; a discharge valve group provided downstream of the buffer area, including a first discharge valve and a second discharge valve, the first discharge valve being conducted to discharge the first chemical solution, and the second discharge valve being conducted to discharge the second chemical solution; a memory; and a processor, the processor being connected to the memory and configured to implement the above-mentioned chemical solution discharge method provided by the second aspect of the present invention.

[0016] In addition, according to the fourth aspect of the present invention, there is also provided a computer-readable storage medium, on which computer instructions are stored. When the computer instructions are executed by a processor, the above-mentioned chemical solution discharge method provided by the second aspect of the present invention is implemented. Description of the Drawings

[0017] After reading the detailed description of the embodiments of the present disclosure in conjunction with the following drawings, the above features and advantages of the present invention can be better understood. In the drawings, the components are not necessarily drawn to scale, and components with similar relevant characteristics or features may have the same or similar reference numerals.

[0018] Figure 1 The structural schematic diagram of a semiconductor cleaning device provided according to some embodiments of the present invention is shown;

[0019] Figure 2 The structural block diagram of the semiconductor cleaning device provided according to some embodiments of the present invention is shown; and

[0020] Figure 3 The flowchart of a chemical liquid discharging method provided according to some embodiments of the present invention is shown.

[0021] Reference numerals:

[0022] 10 Semiconductor cleaning device;

[0023] 100 Process chamber;

[0024] 110 First sensor;

[0025] 120 Wafer stage;

[0026] 130 Nozzle;

[0027] 140 Wafer;

[0028] 200 Temporary storage area;

[0029] 210 Second sensor;

[0030] 220 Liquid guiding valve group;

[0031] 300 Discharge valve group;

[0032] 310 First discharge valve;

[0033] 311 First discharge tank;

[0034] 320 Second discharge valve;

[0035] 321 Second discharge tank;

[0036] 410 Memory;

[0037] 420 Processor; and

[0038] Steps S310 - S320. Detailed implementation manners

[0039] The following specific embodiments illustrate the implementation manners of the present invention, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. Although the description of the present invention will be introduced in conjunction with preferred embodiments, this does not mean that the features of this invention are limited to this implementation manner. On the contrary, the purpose of introducing the invention in conjunction with the implementation manner is to cover other alternatives or modifications that may extend based on the claims of the present invention. In order to provide a deep understanding of the present invention, many specific details will be included in the following description. The present invention can also be implemented without using these details. In addition, in order to avoid confusing or obscuring the key points of the present invention, some specific details will be omitted in the description.

[0040] In the description of the present invention, it should be noted that unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0041] In addition, the "upper", "lower", "left", "right", "top", "bottom", "horizontal", and "vertical" used in the following description should be understood as the orientations shown in this paragraph and the relevant drawings. This relative term is only for the convenience of description, and it does not mean that the device described needs to be manufactured or operated in a specific orientation, so it should not be understood as a limitation to the present invention.

[0042] It can be understood that although terms such as "first", "second", and "third" can be used here to describe various components, regions, layers, and / or parts, these components, regions, layers, and / or parts should not be limited by these terms, and these terms are only used to distinguish different components, regions, layers, and / or parts. Therefore, the first component, region, layer, and / or part discussed below can be called the second component, region, layer, and / or part without departing from some embodiments of the present invention.

[0043] As described above, in the prior art, there are also some devices that can classify and discharge various chemical liquids. However, the discharge devices in the prior art are large and complex in structure, and lack functional components that can provide real-time feedback on whether the waste liquid has been discharged completely. If the first chemical liquid has not been discharged completely and at this time, the second chemical liquid starts to be discharged, then the purpose of classifying and discharging the waste liquid cannot be achieved. Therefore, the current discharge device must wait until the first chemical liquid is discharged completely before the second chemical liquid can be discharged, which will cause the discharge time to be prolonged during this discharge process and affect the process efficiency of the upstream.

[0044] In order to solve the above-mentioned problems existing in the prior art, the present invention provides a chemical liquid emission control system, a chemical liquid emission method, a semiconductor cleaning device, and a computer-readable storage medium, which can not only classify and discharge different chemical liquids to reduce waste liquid pollution, but also improve the overall process efficiency and shorten the emission time of the chemical liquid.

[0045] In some non-limiting embodiments, the chemical liquid discharge control system provided by the first aspect of the present invention can be used to implement the chemical liquid discharge method provided by the second aspect of the present invention. In addition, the chemical liquid discharge control system provided by the first aspect of the present invention can also be configured in the semiconductor cleaning device provided by the third aspect of the present invention.

[0046] Specifically, see Figure 1 , Figure 1 A schematic structural diagram of a semiconductor cleaning device provided according to some embodiments of the present invention is shown.

[0047] like Figure 1 As shown, in some embodiments of the present invention, a semiconductor cleaning device 10 may include: a process chamber 100, for introducing multiple chemical liquids to perform multiple process treatments on a wafer 140 therein, for example, at least a first chemical liquid and a second chemical liquid may be introduced to perform corresponding first process treatments and second process treatments; a temporary storage area 200, which may be arranged downstream of the process chamber 100, for receiving the chemical liquid flowing out of the process chamber 100; and a discharge valve group 300, which may be arranged downstream of the temporary storage area 200. Optionally, the discharge valve group 300 may include at least a first discharge valve 310 and a second discharge valve 320, for corresponding discharges of different chemical liquids, for example, the first chemical liquid and the second chemical liquid. When the first discharge valve 310 is turned on, the first chemical liquid may be discharged, and when the second discharge valve 320 is turned on, the second chemical liquid may be discharged.

[0048] For further information, see Figure 2 , Figure 2 A structural block diagram of a semiconductor cleaning device provided according to some embodiments of the present invention is shown.

[0049] like Figure 2 As shown, the semiconductor cleaning device 10 may also be configured with a memory 410 and a processor 420. The memory 410 may include but is not limited to the computer-readable storage medium provided in the fourth aspect of the present invention, on which computer instructions are stored. The processor 420 may be connected to the memory 410 and configured to execute the computer instructions stored in the memory 410 to implement the chemical liquid discharge method provided in the second aspect of the present invention.

[0050] The working principle of the above-mentioned semiconductor cleaning device 10 will be described below in conjunction with some embodiments of the chemical liquid discharge method, especially the working principle of the chemical liquid discharge control system included therein. Those skilled in the art can understand that these embodiments of the chemical liquid discharge method are only some non-limiting implementation manners provided by the present invention, aiming to clearly show the main concept of the present invention and provide some specific solutions convenient for the public to implement, rather than being used to limit all working manners or all functions of the semiconductor cleaning device 10. Similarly, the semiconductor cleaning device 10 is also a non-limiting implementation manner provided by the present invention and does not limit the implementation subject of each step in these chemical liquid discharge methods.

[0051] Please continue to refer to Figure 1 , the semiconductor cleaning device 10 may include a chemical liquid discharge control system. Specifically, the chemical liquid discharge control system may include a first sensor 110, a second sensor 210, and a discharge valve group 300. The first sensor 110 may be disposed in the process chamber 100 to detect whether there is chemical liquid in the process chamber 100. Optionally, the chemical liquid introduced into the process chamber 100 may include at least a first chemical liquid and a second chemical liquid. A temporary storage area 200 may be provided downstream of the process chamber 100 to receive the chemical liquid flowing in from the process chamber 100. The discharge valve group 300 may be disposed downstream of the temporary storage area 200 to conduct and discharge the chemical liquid temporarily stored in the temporary storage area 200.

[0052] As Figure 1 shown, in some embodiments, when the chemical liquid introduced into the process chamber 100 includes at least a first chemical liquid and a second chemical liquid, the discharge valve group 300 may also include at least a first discharge valve 310 and a second discharge valve 320. The first discharge valve 310 may be conducted to discharge the corresponding first chemical liquid, and the second discharge valve 320 may be conducted to discharge the corresponding second chemical liquid.

[0053] Furthermore, in the temporary storage area 200, a second sensor 210 may also be included. The second sensor 210 may be used to detect whether there is chemical liquid flowing in from the process chamber 100 in the temporary storage area 200. Assume that a first chemical liquid is introduced into the upstream process chamber for a first process. After the first process is completed in the upstream process chamber 100, the first chemical liquid may flow into the downstream temporary storage area 200. When the second sensor 210 in the temporary storage area 200 detects that there is no first chemical liquid, the chemical liquid discharge control system may control to close the first discharge valve 310 and may introduce another different chemical liquid, such as a second chemical liquid, into the process chamber 100 to perform a second process.

[0054] Specifically, in some alternative embodiments, the upstream process chamber 100 may include a wafer stage 120 and a nozzle 130. The wafer stage 120 is used to carry the wafer 140 to be processed. The nozzle 130 may be disposed above the wafer stage 120 and is used to spray corresponding chemical liquids onto the wafer 140 on the wafer stage 120 below according to different process requirements.

[0055] Furthermore, the wafer stage 120 may be a rotating stage, which is used to support the wafer 140 to be processed and drive the wafer 140 thereon to rotate, so that the surface of the wafer 140 can be evenly sprayed with chemical liquids. Optionally, the chemical liquid may be a wafer cleaning liquid. In order to uniformly clean the surface of the wafer 140, the centrifugal force generated by the rotation of the wafer stage 120 can enhance the cleaning power of the cleaning liquid on the surface of the wafer 140.

[0056] Continuing as Figure 1 shown, a liquid guiding valve group 220 may be included between the process chamber 100 and the temporary storage area 200 to control the inflow of the chemical liquid in the process chamber 100 into the temporary storage area. In this embodiment, by setting the valve group structure, the drainage of the chemical liquid in the upstream process chamber 100 to the downstream temporary storage area 200 can be accelerated. When the first sensor 110 detects the presence of the first chemical liquid in the process chamber 100, the chemical liquid discharge control system can control the opening of the liquid guiding valve group 220 to enable the first chemical liquid to flow downward into the temporary storage area 200. When the first sensor 110 does not detect the first chemical liquid in the process chamber 100, the chemical liquid discharge control system can control the closing of the liquid guiding valve group 220 and can introduce a second chemical liquid into the process chamber 100 to perform a second process.

[0057] As Figure 1 shown, in some alternative embodiments, an emission trough group may also be connected to the end of the emission valve group 300 to classify and discharge different chemical liquids, which is beneficial for targeted recovery of different chemical liquids and reducing the pollution risk, etc. Specifically, the end of the first emission valve 310 may be connected to the first emission trough 311 to receive the emission of the first chemical liquid. The end of the second emission valve 320 may be connected to the second emission trough 321 to receive the emission of the second chemical liquid.

[0058] Next, please refer to Figure 3 , Figure 3 which shows a flowchart of a method for discharging a chemical liquid according to some embodiments of the present invention.

[0059] As Figure 3 shown, in some embodiments of the present invention, the method for discharging a chemical liquid may include the following step S310: detecting whether there is a first chemical liquid flowing down from the process chamber in the temporary storage area.

[0060] Please refer to Figure 1 for a combined understanding. Specifically, in some embodiments, the first chemical solution can be first selected to perform the first process on the wafer 140. For example, the wafer 140 can be cleaned through the first chemical solution. The first chemical solution can be sprayed onto the underlying wafer 140 via the nozzle 130. When the first sensor 110 in the process chamber 100 detects the presence of the first chemical solution in the process chamber 100, an electrical signal is transmitted to the chemical solution discharge control system, and the chemical solution discharge control system controls the opening of the liquid guiding valve group 220 so that the first chemical solution in the upstream process chamber 100 quickly flows into the downstream storage area 200. Through the second sensor 210 in the storage area 200, it continuously detects whether there is the first chemical solution flowing down from the process chamber 100 in the storage area 200. As soon as the second sensor 210 senses the inflow of liquid, it can feedback an electrical signal to the chemical solution discharge control system to control the opening of the first discharge valve 310 corresponding to the discharge of the first chemical solution downstream of the storage area 200, and the first chemical solution flows into the first discharge tank 311 through the opened first discharge valve 310.

[0061] As Figure 3 shown, the above chemical solution discharge method provided by the present invention may further include step S320: in response to the absence of the first chemical solution detected in the storage area, closing the first discharge valve and introducing the second chemical solution into the process chamber.

[0062] Specifically, in some embodiments, during the discharge process of the first chemical solution, when the second sensor 210 in the storage area 200 does not detect the first chemical solution, it indicates that the drainage of the first chemical solution in the process chamber 100 has been completed. Immediately, a signal can be sent to the chemical solution discharge control system to control the closing of the liquid guiding valve group 220.

[0063] At this time, the chemical solution discharge control system can control the introduction of the second chemical solution into the process chamber 100 to perform the second process. For example, the second chemical solution is sprayed using the nozzle 130 to clean the wafer 140. Since the liquid guiding valve group 220 is in the closed state when using the second chemical solution, even if there is still some first chemical solution remaining in the storage area 200 that has not been drained, the second chemical solution in the upstream process chamber 100 and the first chemical solution in the downstream storage area 200 will not mix with each other. Therefore, even if the first chemical solution in the storage area 200 has not been completely drained at this time, the second process based on the second chemical solution in the upstream process chamber 100 can be carried out simultaneously without affecting the upstream process, thereby improving the overall process efficiency and shortening the chemical solution discharge time.

[0064] After the second process is completed in the upstream process chamber 100, the chemical liquid discharge control system can detect whether the first discharge valve 310 is closed. When it is determined that the first discharge valve 310 is in the closed state, the liquid guiding valve group 220 can be opened to allow the second chemical liquid in the process chamber 100 to flow into the temporary storage area 200. In this embodiment, only after the second sensor 210 in the temporary storage area 200 completely fails to detect the first chemical liquid, the upper liquid guiding valve group 220 will be opened, and only then can the second chemical liquid flow into the temporary storage area 200.

[0065] Those skilled in the art can understand that the above solutions for the first chemical liquid and the second chemical liquid are only a non-limiting implementation manner provided by the present invention, aiming to clearly show the main concept of the present invention and provide a specific solution convenient for the public to implement, rather than limiting the protection scope of the present invention. Optionally, in some other embodiments, those skilled in the art can also classify and discharge various different types of chemical liquids based on the concept of the present invention to achieve the same technical effect.

[0066] In the above embodiments provided by the present invention, when using another chemical liquid for process treatment, even if the previous chemical liquid in the temporary storage area 200 has not been drained completely and the liquid guiding valve group 220 has not been opened, since the drainage time of the entire multiple chemical liquids is much shorter than the process time, as long as the previous chemical liquid in the temporary storage area 200 is drained completely, the liquid guiding valve group 220 can be immediately opened. Once the liquid guiding valve group 220 is opened, the other chemical liquid can immediately flow into the temporary storage area 200. At this time, the second chemical liquid may actually still be undergoing the second process, so it will not affect the overall process efficiency.

[0067] Those skilled in the art can understand that the positions and numbers of the first sensor 110 in the process chamber 100 and the second sensor 210 in the temporary storage area 200 are not limited to Figure 1 shown in Figure 1 The structure in is only a non-limiting implementation manner provided by the present invention, aiming to clearly show the main concept of the present invention and provide a specific solution convenient for the public to implement, rather than limiting the protection scope of the present invention. Optionally, in some other embodiments, those skilled in the art can also, based on the concept of the present invention, adopt multiple first sensors 110 and multiple second sensors 210, and arrange them at multiple positions in the detection areas, that is, in multiple positions in the process chamber 100 and the temporary storage area 200, or at lower positions, to provide real-time feedback on whether there is liquid in the detection areas.

[0068] Although the above methods are illustrated and described as a series of acts for simplicity of explanation, it should be understood and appreciated that the methods are not limited by the order of the acts, since according to one or more embodiments, some acts may occur in a different order and / or concurrently with other acts not illustrated and described herein or other acts that would be understood by those skilled in the art.

[0069] In summary, the present invention provides a chemical liquid discharge control system, a chemical liquid discharge method, a semiconductor cleaning device, and a computer-readable storage medium, which can not only classify and discharge different chemical liquids, reduce waste liquid pollution, but also improve the overall process efficiency and shorten the chemical liquid discharge time.

[0070] The foregoing description of the disclosure is provided to enable any person skilled in the art to make or use the disclosure. Various modifications to the disclosure will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other variations without departing from the spirit or scope of the disclosure. Thus, the disclosure is not intended to be limited to the examples and designs described herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A discharge control system for chemical liquids, characterized in that, it includes: A first sensor, disposed in the process chamber, for detecting whether there is a chemical liquid in the process chamber, wherein the chemical liquid at least includes a first chemical liquid and a second chemical liquid; A discharge valve group, disposed downstream of the temporary storage area, the temporary storage area is used to receive the chemical liquid flowing in from the process chamber, and at least includes a first discharge valve and a second discharge valve, wherein the first discharge valve is opened to discharge the first chemical liquid, and the second discharge valve is opened to discharge the second chemical liquid; and A second sensor, disposed in the temporary storage area, when the second sensor detects that there is no first chemical liquid in the temporary storage area, closes the first discharge valve, and introduces the second chemical liquid into the process chamber.

2. The discharge control system according to claim 1, characterized in that, A liquid guiding valve group is included between the process chamber and the temporary storage area, for controlling the chemical liquid in the process chamber to flow into the temporary storage area. When the first sensor detects that there is the first chemical liquid in the process chamber, the liquid guiding valve group is opened to enable the first chemical liquid to flow into the temporary storage area. When the first sensor does not detect the first chemical liquid, the liquid guiding valve group is closed, and the second chemical liquid is introduced into the process chamber.

3. The discharge control system according to claim 1, characterized in that, The process chamber includes a wafer stage and a nozzle. The wafer stage is used to carry the wafer to be processed, and the nozzle is used to provide the corresponding chemical liquid to the wafer in the process chamber according to the process requirements.

4. The discharge control system according to claim 1, characterized in that, The end of the discharge valve group is connected to a discharge tank group to classify and discharge different chemical liquids. Among them, the end of the first drain valve is connected to a first discharge tank for receiving the discharge of the first chemical liquid, and the end of the second drain valve is connected to a second discharge tank for receiving the discharge of the second chemical liquid.

5. A method for discharging chemical liquids, characterized in that, Using the discharge control system for chemical liquids according to any one of claims 1 to 4 to perform the discharge operation of chemical liquids, the method for discharging chemical liquids includes the following steps: Detecting whether there is a first chemical liquid flowing down from the process chamber in the temporary storage area; and In response to not detecting the first chemical liquid in the temporary storage area, closing the first discharge valve, and introducing the second chemical liquid into the process chamber.

6. The discharge method according to claim 5, characterized in that, The step of detecting whether there is a first chemical liquid flowing down from the process chamber in the temporary storage area includes: Introducing the first chemical liquid into the process chamber to perform a first process; In response to the first sensor detecting that there is the first chemical liquid in the process chamber, opening the liquid guiding valve group to enable the first chemical liquid to flow into the temporary storage area; and Continuously detecting whether there is the first chemical liquid flowing down from the process chamber in the temporary storage area through the second sensor.

7. The discharge method according to claim 6, characterized in that, After the step of continuously detecting whether there is the first chemical liquid flowing down from the process chamber in the buffer zone through the second sensor, the method further includes: In response to the second sensor detecting the first chemical liquid in the buffer zone, controlling to open the first discharge valve so that the first chemical liquid is discharged to the corresponding first discharge tank through the first discharge valve.

8. The discharge method according to claim 5, wherein, the step of, in response to no detection of the first chemical liquid in the buffer zone, closing the first discharge valve and introducing the second chemical liquid into the process chamber includes: in response to the second sensor detecting no first chemical liquid in the buffer zone, closing the liquid guiding valve group; introducing the second chemical liquid into the process chamber to perform a second process; in response to completion of the second process, detecting whether the first discharge valve is closed; and in response to the first discharge valve being in a closed state, opening the liquid guiding valve group so that the second chemical liquid in the process chamber flows into the buffer zone.

9. A semiconductor cleaning device, wherein, it includes: a process chamber for introducing various chemical liquids to perform various process treatments on a wafer inside; a buffer zone provided downstream of the process chamber for receiving the chemical liquid flowing out of the process chamber; a discharge valve group provided downstream of the buffer zone, at least including a first discharge valve and a second discharge valve, wherein the first discharge valve is conducted to discharge the first chemical liquid, and the second discharge valve is conducted to discharge the second chemical liquid; a memory; and a processor, the processor is connected to the memory and is configured to implement the chemical liquid discharge method according to any one of claims 5 to 8.

10. A computer-readable storage medium, on which computer instructions are stored, wherein, when the computer instructions are executed by a processor, the chemical liquid discharge method according to any one of claims 5 to 8 is implemented.

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