Circuit board, circuit board, and method for manufacturing circuit board

Abstract

A circuit substrate is divided into a main body area and a plurality of bending areas, and the plurality of bending areas are adjacent to the main body area. The circuit substrate comprises a bendable circuit layer and a dielectric layer. The bendable circuit layer extends from the main body area to the plurality of bending areas. The dielectric layer is disposed on the bendable circuit layer. The dielectric layer comprises a first dielectric portion and a plurality of second dielectric portions, the first dielectric portion is located in the main body area, and the second dielectric portions are located in the bending areas respectively. Each of the plurality of second dielectric portions has a first sidewall facing the first dielectric portion, a second sidewall opposite the first sidewall, and a width between the first sidewall and the second sidewall, wherein a plurality of widths of the plurality of second dielectric portions are equal to each other. The circuit board can be electrically connected with the circuit substrate on the upper layer and the circuit substrate on the lower layer only through one-time reflow soldering technology, the productivity can be improved, and the manufacturing cost can be reduced. Gaps exist between the circuit substrates of the upper layer and the lower layer, and heat dissipation of electronic components is facilitated.

Description

Technical Field

[0001] The present invention relates to a circuit board, a circuit board, and a method for manufacturing a circuit board. Background Art

[0002] Currently, there is a stacked structure formed by stacking multiple circuit boards. In such a stacked structure, a support frame is provided between the lower circuit board on which electronic components are already installed and the upper circuit board, so that a space capable of accommodating electronic components can be formed between the lower circuit board and the upper circuit board. The support frame is usually made of a metal material and is welded to the aforementioned upper circuit board and lower circuit board, so that the upper and lower circuit boards can be electrically connected to each other.

[0003] However, the above support frame completely surrounds the electronic components on the lower circuit board, so that the electronic components are sealed in a closed space, resulting in the heat energy generated by the electronic components not being easily dissipated to the external environment, thereby affecting the performance of the electronic components. Secondly, the support frame is usually welded to the upper circuit board and the lower circuit board, so at least two soldering processes are required to dispose the support frame between the upper and lower circuit boards, which is not conducive to improving the throughput. In view of the above, there is an urgent need to develop a circuit board and a manufacturing method thereof to overcome the above disadvantages. Summary of the Invention

[0004] The circuit board provided by the present invention has a plurality of bent regions protruding outward, and these bent regions are used for bending and serving as a support structure between the circuit board and another circuit board. The support structure in the circuit board of the present invention is formed by bending the bent regions of the lower circuit board upward, and the support structure has a circuit structure. Therefore, the upper circuit board can be electrically connected to the lower circuit board through the support structure, thereby improving the integration of the circuit board. In addition, in this case, only one reflow soldering process can be used to electrically connect the upper circuit board and the lower circuit board, which can improve the throughput and reduce the manufacturing cost. At the same time, there is a gap between the upper and lower circuit boards in this case, which is beneficial to the heat dissipation of the electronic components.

[0005] The circuit board provided by at least one embodiment of the present invention is divided into a main region and a plurality of bending regions, wherein the plurality of bending regions are adjacent to the main region. The circuit board includes a bendable circuit layer and a dielectric layer. The bendable circuit layer extends from the main region to the plurality of bending regions. The dielectric layer is disposed on the bendable circuit layer, wherein the dielectric layer includes a first dielectric portion and a plurality of second dielectric portions. The first dielectric portion is located in the main region, and the plurality of second dielectric portions are respectively located in the plurality of bending regions. Each of the plurality of second dielectric portions has a first sidewall facing the first dielectric portion, a second sidewall opposite to the first sidewall, and a width between the first sidewall and the second sidewall, and the widths of the plurality of second dielectric portions are equal to each other. The first dielectric portion, the plurality of second dielectric portions, and the bendable circuit layer define a plurality of grooves, and each of the plurality of grooves is located between the first sidewall of the adjacent first dielectric portion and the second dielectric portion.

[0006] In at least one embodiment of the present invention, the first dielectric portion has a first stepped sidewall, and the first sidewall has a second stepped sidewall, and the first stepped sidewall faces the second stepped sidewall.

[0007] In at least one embodiment of the present invention, the width of each of the plurality of grooves gradually widens along the direction from the bendable circuit layer towards the dielectric layer.

[0008] The circuit board provided by at least one embodiment of the present invention includes a first circuit board, a plurality of support structures, and a second circuit board. The first circuit board includes a dielectric layer and a bendable circuit layer, and the dielectric layer is disposed above the bendable circuit layer. The plurality of support structures are disposed above the first circuit board. The bendable circuit layer includes a first circuit portion located in the first circuit board and a plurality of second circuit portions located in the plurality of support structures. The first circuit portion connects the plurality of second circuit portions, and each of the plurality of second circuit portions extends from the first circuit portion to the support structure, wherein the first circuit portion and the second circuit portions are not coplanar. The second circuit board covers the plurality of support structures and the first circuit board and is electrically connected to the first circuit board through the plurality of support structures.

[0009] In at least one embodiment of the present invention, the dielectric layer includes a first dielectric portion having a first stepped sidewall and a second dielectric portion having a second stepped sidewall, and when the bendable circuit layer is folded, the first stepped sidewall is joined to the second stepped sidewall.

[0010] In at least one embodiment of the present invention, the circuit board further includes a bonding material, and the bonding material is disposed between the plurality of support structures and the second circuit board.

[0011] In at least one embodiment of the present invention, the top of each of the plurality of support structures includes a conductive circuit layer, and the conductive circuit layer is electrically connected to the second circuit board.

[0012] In at least one embodiment of the present invention, the inner wall of each of the plurality of support structures has a conduction line layer, and the conduction line layer is electrically connected to the bendable line layer.

[0013] In at least one embodiment of the present invention, there are a plurality of gaps between the first circuit board, the second circuit board, and the plurality of support structures, where each gap is located between two adjacent support structures and communicates with the accommodation space between the first circuit board and the second circuit board.

[0014] The manufacturing method of the circuit board provided by at least one embodiment of the present invention includes the following steps: providing a first circuit board, where the first circuit board is divided into a main area and a plurality of bending areas, the plurality of bending areas are adjacent to the main area, the first circuit board includes a dielectric layer and a bendable line layer, the dielectric layer is disposed above the bendable line layer, and the bendable line layer extends from the main area to the plurality of bending areas; folding the plurality of bending areas to the main area, where the first line portion of the bendable line layer is located on the outermost layer of the first circuit board, and the second line portion of each of the bendable line layers is located on the outer wall surface of the plurality of support structures, so that the first line portion and the second line portion are not coplanar; disposing a second circuit board on the first circuit board, where the second circuit board covers the plurality of support structures and the first circuit board and is electrically connected to the first circuit board through the plurality of support structures.

[0015] In at least one embodiment of the present invention, the manufacturing method of the circuit board further includes: before folding the plurality of bending areas to the main area, installing electronic components on the upper surface of the first circuit board.

[0016] In at least one embodiment of the present invention, the manufacturing method of the circuit board further includes: after folding the plurality of bending areas to the main area, fixing the plurality of support structures on the upper surface of the first circuit board by using a dispensing material. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] When read in conjunction with the accompanying drawings, various aspects of the present application can be best understood from the following detailed description. It should be understood that, in accordance with standard practice in the industry, the various features are not drawn to scale. In fact, for clarity, the dimensions of the various features can be arbitrarily increased or decreased.

[0018] Figures 1 to 6 FIG. is a perspective view of a circuit board in various process stages according to an embodiment of the present invention.

[0019] Figure 7A is according to an embodiment of the present invention Figure 1 partial cross-sectional view of line A - A' of.

[0020] Figure 7BA partial cross-sectional schematic view of line B-B' of Figure 3 according to one embodiment of the present invention.

[0021] Figure 8A A partial cross-sectional schematic view of line A-A' of Figure 1 according to another embodiment of the present invention.

[0022] Figure 8B A partial cross-sectional schematic view of line B-B' of Figure 3 according to another embodiment of the present invention. Detailed implementation manners

[0023] In the following text, in order to clearly present the technical features of this case, the dimensions (such as length, width, thickness, and depth) of the components in the drawings (such as circuit boards, dielectric layers, and bendable circuit layers, etc.) will be enlarged in an unequal proportion, and the number of some components will be reduced. Therefore, the descriptions and explanations of the following embodiments are not limited to the number of components in the drawings and the dimensions and shapes presented by the components, but should cover the dimensions, shapes, and the deviations of both caused by actual processes and / or tolerances. For example, the flat surfaces shown in the drawings may have rough and / or non-linear features, and the acute angles shown in the drawings may be rounded. Therefore, the components presented in the drawings of this case are mainly for illustration purposes and are not intended to accurately depict the actual shapes of the components, nor are they intended to limit the scope of the patent application of this case.

[0024] In addition, spatial relative terms such as "below", "beneath", "lower than", "above", "over", and other similar terms are used herein for the convenience of describing the relationship between one component or feature in the drawing and another component or feature. The spatial relative terms cover not only the orientations depicted in the drawings but also other orientations when the device is in use or operation. That is, when the orientation of the device is different from that in the drawings (rotated 90 degrees or in other orientations), the spatial relative terms used in this disclosure can be correspondingly interpreted.

[0025] It will be understood that although terms such as "first", "second", etc. may be used herein to describe various components, these components should not be limited by these terms. These terms are only used to distinguish one component from another. For example, without departing from the scope of the embodiment, the first component may be referred to as the second component, and similarly, the second component may be referred to as the first component. As used herein, the term "and / or" includes any and all combinations of one or more of the related listed items.

[0026] Figures 1 to 6 A three-dimensional schematic view of circuit board 100 (please refer to Figure 6 ) at various stages of the process. Please refer to Figure 1, the circuit board 110 is divided into a main region MR and a plurality of bending regions BR, and the plurality of bending regions BR are adjacent to the main region MR. Specifically, the plurality of bending regions BR are respectively located around the main region MR. It can be understood that the plurality of bending regions BR protrude outward from the side boundary of the main region MR, and the length of the plurality of bending regions BR is less than the length of the boundary of the main region MR. For example, in this embodiment, the shape of each bending region BR is strip-shaped, and the main region MR can protrude from both ends of each bending region BR, as Figure 1 shown. The circuit board 110 extends along the XY plane and has a thickness extending along the Z direction.

[0027] It should be noted that Figures 1 to 6 the accompanying drawings shown are only used to illustrate the relative positions of the main region MR, the bending regions BR and each component, and the detailed descriptions of the layer structures in the main region MR and the bending regions BR and the grooves formed between the main region MR and the bending regions BR will be in Figure 7A , Figure 7B , Figure 8A and Figure 8B presented.

[0028] Figure 7A is a partial cross-sectional schematic diagram of line A-A' of Figure 1 according to an embodiment of the present invention. The circuit board 110 includes dielectric layers 112, 114, and 116 and a bendable circuit layer 118. The dielectric layers 112, 114, and 116 are disposed above the bendable circuit layer 118. Specifically, the dielectric layers 112, 114, and 116 include first dielectric portions 112a, 114a, and 116a and second dielectric portions 112b, 114b, and 116b. The first dielectric portions 112a, 114a, and 116a are located in the main region MR, while the second dielectric portions 112b, 114b, and 116b are located in the bending regions BR.

[0029] As Figure 7A shown, the bendable circuit layer 118 includes a first circuit portion 118a and a second circuit portion 118b. The first circuit portion 118a is connected to the second circuit portion 118b, and the bendable circuit layer 118 extends from the main region MR to the bending regions BR. In some embodiments, the bendable circuit layer 118 can be formed, for example, by 1 layer or at least 2 layers of copper foil. In other embodiments, the bendable circuit layer 118 can be, for example, the circuit layer of a flexible circuit board (FCB). Therefore, Figure 7A a flexible substrate can be disposed below the bendable circuit layer 118 in

[0030] AsFigure 7A As shown, the second dielectric portions 112b, 114b, and 116b have first sidewalls 112bs1, 114bs1, and 116bs1 and second sidewalls 112bs2, 114bs2, and 116bs2. The first sidewalls 112bs1, 114bs1, and 116bs1 face the first sidewalls 112as1, 114as1, and 116as1 of the first dielectric portions 112a, 114a, and 116a.

[0031] Please refer to Figure 1 and Figure 7A simultaneously. There is a width W between the first sidewall 112bs1 and the second sidewall 112bs2 of the second dielectric portion 112b, and the widths of the plurality of second dielectric portions are equal to each other. In other words, please refer to Figure 1 . The widths W in the four bending regions BR are equal to each other.

[0032] Please refer to Figure 7A again. The first dielectric portions 112a, 114a, and 116a, the second dielectric portions 112b, 114b, and 116b, and the bendable circuit layer 118 define a groove R (not shown in Figure 1 ). The groove R is located between the first sidewalls 112as1, 114as1, and 116as1 of the first dielectric portions 112a, 114a, and 116a and the first sidewalls 112bs1, 114bs1, and 116bs1 of the second dielectric portions 112b, 114b, and 116b. The width of the groove R gradually widens along the direction from the bendable circuit layer 118 toward the dielectric layers 112, 114, and 116, as shown in Figure 7A . In other words, the width (i.e., the distance) between the first sidewall 112as1 and the first sidewall 112bs1 is less than the width (i.e., the distance) between the first sidewall 114as1 and the first sidewall 114bs1, and the width (i.e., the distance) between the first sidewall 114as1 and the first sidewall 114bs1 is less than the width (i.e., the distance) between the first sidewall 116as1 and the first sidewall 116bs1.

[0033] As shown in Figure 7A , the first sidewalls 112as1, 114as1, and 116as1 of the first dielectric portions 112a, 114a, and 116a have first stepped sidewalls. The first sidewalls 112bs1, 114bs1, and 116bs1 of the second dielectric portions 112b, 114b, and 116b have second stepped sidewalls. The first stepped sidewalls face the second stepped sidewalls. In other words, the first stepped sidewalls are formed by the first sidewalls 112as1, 114as1, and 116as1, and the second stepped sidewalls are formed by the first sidewalls 112bs1, 114bs1, and 116bs1.

[0034] In other embodiments, the circuit substrate 110 may include only one dielectric layer. For example, Figure 7A the circuit substrate 110 in Figure 7A may include only the dielectric layer 112, while the dielectric layers 114 and 116 in

[0035] Please refer to Figure 2 and install the electronic component 120 on the upper surface ts of the circuit substrate 110. The electronic component 120 may be, for example, a capacitor, a resistor, an inductor, a central processing unit (CPU), and / or a graphics processing unit (GPU), but is not limited thereto. It can be understood that the size, quantity, and arrangement of the electronic component 120 are not limited to Figure 2 shown, and other sizes, quantities, and arrangements of the electronic component 120 are also included in the embodiments of the present invention.

[0036] Please refer to Figure 3 and fold the plurality of bending regions BR (please refer to Figure 2 ) to the main body region MR. Figure 7B is a partial cross-sectional view of the line B - B' of Figure 3 according to an embodiment of the present invention.

[0037] Specifically, please refer to Figure 3 , Figure 7A and Figure 7B simultaneously. After rotating the bending region BR by about 90 degrees to the main body region MR, the original second dielectric portions 112b, 114b, and 116b and the second circuit portion 118b form a support structure SS located in the main body region MR.

[0038] Please refer to Figure 7B, the first circuit portion 118a of the bendable circuit layer 118 is located on the outermost layer of the circuit substrate 110, and the second circuit portion 118b of the bendable circuit layer 118 is located on the outer wall surface of the support structure SS, so that the first circuit portion 118a and the second circuit portion 118b are not coplanar. That is to say, the first circuit portion 118a is a structure extending along the XY plane, while the second circuit portion 118b is a structure extending along the YZ plane. It can be understood that the support structure SS described in this article includes the second dielectric portions 112b, 114b, and 116b and the second circuit portion 118b.

[0039] Still referring to Figure 7B , since the first side walls 112as1, 114as1, and 116as1 of the first dielectric portions 112a, 114a, and 116a have first stepped side walls, and the first side walls 112bs1, 114bs1, and 116bs1 of the second dielectric portions 112b, 114b, and 116b have second stepped side walls, after folding about 90 degrees in the bending region BR, the first stepped side wall engages the second stepped side wall. In other words, the first stepped side wall and the second stepped side wall cooperate with each other, and the first dielectric portions 112a, 114a, and 116a and the support structure SS form a structure with close contact.

[0040] It can be understood that the height of the support structure SS depends on the width W of the second dielectric portion 112b (please refer to Figure 7A ). The width W of the second dielectric portion 112b (i.e., the height of the support structure SS) can be adjusted according to the actual requirements of the circuit board.

[0041] Please refer to Figure 4 , after bending a plurality of bending regions BR (please refer to Figure 2 ) to the main body region MR, the plurality of support structures SS are fixed to the upper surface ts of the circuit substrate 110 by using the dispensing material 130. The dispensing material 130 can be, for example, a resin material. The dispensing material 130 can prevent the second dielectric portions 112b, 114b, and 116b (please refer to Figure 7B ) from being deformed after being stacked, and can also prevent the second dielectric portions 112b, 114b, and 116b from flipping back to the planar state as shown in Figure 7B .

[0042] Please refer to Figure 5 , a bonding material 140 is provided on the plurality of support structures SS. The bonding material 140 can be, for example, solder paste, but is not limited thereto.

[0043] Please refer to Figure 6, the circuit board 150 is disposed on the circuit board 110, wherein the circuit board 150 covers a plurality of support structures SS and the circuit board 110, and is electrically connected to the circuit board 110 through the plurality of support structures SS. In other words, the bonding material 140 (please refer to Figure 5 ) is disposed between the plurality of support structures SS and the circuit board 150. It can be understood that the circuit board 150 and the circuit board 110 are electrically connected together by reflow soldering the bonding material 140.

[0044] It should be noted that, please refer to Figure 6 , there are a plurality of gaps G between the circuit board 150, the plurality of support structures SS and the circuit board 110, and each of the gaps G is located between two adjacent support structures SS. Each of the gaps G communicates with the accommodation space (not shown) between the circuit boards 150 and 110, which is also the space where the electronic component 120 is located, so that the outside air can enter the space where the electronic component 120 is located from the gap G, thereby facilitating the heat dissipation of the electronic component 120 on the circuit board 110.

[0045] Please refer to again Figure 6 and Figure 7B , the top of the support structure SS includes a conductive line layer 160 (as shown in Figure 7B ), and the conductive line layer 160 is electrically connected to the circuit board 150 (as shown in Figure 6 ). It can be understood that the conductive line layer 160 is formed in advance before bending the second dielectric portions 112b, 114b and 116b and the second line portion 118b. In addition, the conductive line layer 160 can be formed by laser cutting conductive blind vias.

[0046] Figure 8A is a partial cross-sectional view of line A-A' of Figure 1 according to another embodiment of the present invention. Figure 8B is a partial cross-sectional view of line B-B' of Figure 3 according to another embodiment of the present invention. Figure 8A The difference between Figure 7A and Figure 8B lies in the distribution of the conductive line layer 160, and the difference between Figure 7B and

[0047] also lies in the distribution of the conductive line layer 160. Figure 8A and Figure 8B , the inner wall iw of the support structure SS has a conductive line layer 160, and this conductive line layer 160 is electrically connected to the bendable line layer 118. The conductive line layer 160 can be formed by laser cutting conductive blind vias.

[0048] In summary, the circuit board provided by the present invention has a plurality of bent regions protruding outward, and these bent regions are used for bending and serving as a support structure between the circuit board and another circuit board. The support structure in the circuit board of the present invention is formed by bending the bent regions of the lower circuit board upward, and the support structure has a circuit structure. Therefore, the upper circuit board can be electrically connected to the lower circuit board through the support structure, thereby improving the integration of the circuit board. In addition, in this case, only one reflow soldering process can be used to electrically connect the upper circuit board and the lower circuit board, which can improve production capacity and reduce the manufacturing cost of additionally arranging a support frame. Secondly, there is a gap between the upper and lower circuit boards in this case, which communicates with the accommodation space between the upper and lower circuit boards, thereby facilitating the heat dissipation of electronic components.

[0049] The features of multiple embodiments are outlined above so that those skilled in the art can better understand the aspects of the present application. Those skilled in the art should understand that the present application can be easily used as a basis for designing or modifying other processes and structures in order to achieve the same purposes and / or realize the same advantages as the embodiments introduced herein. Those skilled in the art should also recognize that such equivalent structures do not depart from the spirit and scope of the present application, and various changes, substitutions, and modifications can be made herein without departing from the spirit and scope of the present application.

[0050]

Symbol Description

[0051] 100: Circuit board

[0052] 110: Circuit substrate

[0053] 112, 114, 116: Dielectric layer

[0054] 112a, 114a, 116a: First dielectric part

[0055] 112as1, 114as1, 116as1: First side wall

[0056] 112bs1, 114bs1, 116bs1: First side wall

[0057] 112bs2, 114bs2, 116bs2: Second side wall

[0058] 112b, 114b, 116b: Second dielectric part

[0059] 118: Bendable circuit layer

[0060] 118a: First circuit part

[0061] 118b: Second circuit part

[0062] 120: Electronic component

[0063] 130: Dispensing material

[0064] 140: Bonding material

[0065] 150: Circuit board

[0066] 160: Conductive trace layer

[0067] ts: Upper surface

[0068] iw: Inner wall

[0069] MR: Main body region

[0070] BR: Bending region

[0071] SS: Support structure

[0072] R: Groove

[0073] W: Width

[0074] A - A’: Line

[0075] B - B’: Line

[0076] X, Y, Z: Directions

Claims

1. A circuit board, characterized in that, the circuit board is divided into a main area and a plurality of bent areas, wherein the plurality of bent areas are adjacent to the main area, and the circuit board includes: a bendable circuit layer extending from the main area to the plurality of bent areas; and a dielectric layer disposed on the bendable circuit layer, wherein the dielectric layer includes a first dielectric portion and a plurality of second dielectric portions, the first dielectric portion is located in the main area, and the plurality of second dielectric portions are respectively located in the plurality of bent areas, wherein each of the plurality of second dielectric portions has a first sidewall facing the first dielectric portion, a second sidewall opposite to the first sidewall, and a width between the first sidewall and the second sidewall, and the plurality of widths of the plurality of second dielectric portions are equal to each other, wherein the first dielectric portion, the plurality of second dielectric portions, and the bendable circuit layer define a plurality of grooves, and each of the plurality of grooves is located between the first sidewalls of the adjacent first dielectric portion and the second dielectric portion.

2. The circuit board according to claim 1, wherein the first dielectric portion has a first stepped sidewall, and the first sidewall has a second stepped sidewall, and the first stepped sidewall faces the second stepped sidewall.

3. The circuit board according to claim 1, wherein the width of each of the plurality of grooves gradually widens along the direction from the bendable circuit layer towards the dielectric layer.

4. A circuit board, characterized in that, comprising: a first circuit board including a dielectric layer and a bendable circuit layer, and the dielectric layer is disposed above the bendable circuit layer; a plurality of support structures disposed above the first circuit board, the bendable circuit layer includes a first circuit portion located in the first circuit board and a plurality of second circuit portions located in the plurality of support structures, wherein the first circuit portion connects the plurality of second circuit portions, and each of the plurality of second circuit portions extends from the first circuit portion to the support structure, and the first circuit portion and the second circuit portions are not coplanar; and a second circuit board covering the plurality of support structures and the first circuit board and electrically connected to the first circuit board through the plurality of support structures.

5. The circuit board according to claim 4, wherein the dielectric layer includes a first dielectric portion having a first stepped sidewall and a second dielectric portion having a second stepped sidewall, and the first stepped sidewall is connected to the second stepped sidewall.

6. The circuit board according to claim 4, wherein, further comprising a bonding material, and the bonding material is disposed between the plurality of support structures and the second circuit board.

7. The circuit board according to claim 4, wherein the top of each of the plurality of support structures includes a conductive circuit layer, and the conductive circuit layer is electrically connected to the second circuit board.

8. The circuit board according to claim 4, wherein an inner wall of each of the plurality of support structures has a conduction line layer, and the conduction line layer is electrically connected to the bendable line layer.

9. The circuit board according to claim 4, wherein there are a plurality of gaps between the first circuit board, the second circuit board, and the plurality of support structures, and each of the gaps is located between two adjacent support structures and communicates with the accommodation space between the first circuit board and the second circuit board.

10. A manufacturing method of a circuit board characterized in that it includes: providing a first circuit board, wherein the first circuit board is divided into a main area and a plurality of bending areas, the plurality of bending areas are adjacent to the main area, the first circuit board includes a dielectric layer and a bendable line layer, the dielectric layer is disposed above the bendable line layer, and the bendable line layer extends from the main area to the plurality of bending areas; folding the plurality of bending areas to the main area, wherein a first line portion of the bendable line layer is located on the outermost layer of the first circuit board, and a second line portion of each of the bendable line layers is located on an outer wall surface of the plurality of support structures, so that the first line portion and the second line portion are not coplanar; disposing a second circuit board on the first circuit board, wherein the second circuit board covers the plurality of support structures and the first circuit board and is electrically connected to the first circuit board through the plurality of support structures.

11. The manufacturing method of the circuit board according to claim 10, wherein it further includes: before folding the plurality of bending areas to the main area, installing electronic components on an upper surface of the first circuit board.

12. The manufacturing method of the circuit board according to claim 10, wherein it further includes: after folding the plurality of bending areas to the main area, fixing the plurality of support structures on the upper surface of the first circuit board by using a dispensing material.

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