Circuit board unit and electronic apparatus

Abstract

The invention relates to a circuit board unit and an electronic device. Useless radiation noise generated by current flowing through a connector unit is appropriately suppressed. The circuit board unit includes: a first circuit board; a second circuit board; a connector unit having a first connector mounted on the first circuit board and a second connector mounted on the second circuit board; and a metal member that connects the first circuit board and the second circuit board. The metal member has a first connection portion electrically connected to the first ground layer, a second connection portion electrically connected to the second ground layer, and a cover portion covering at least a portion of the connector unit. The cover portion has an opposing wall portion at least partially opposing the connector unit in a direction perpendicular to a plate surface of the first circuit board. The facing wall portion overlaps the first circuit board when viewed in a direction perpendicular to a board surface of the first circuit board, and the facing wall portion overlaps the second circuit board when viewed in a direction perpendicular to a board surface of the second circuit board.

Description

Technical Field

[0001] The present disclosure relates to a circuit board unit and an electronic device. Background Art

[0002] For example, a substrate connection structure for connecting printed circuit boards described in Patent Document 1 is known.

[0003] Patent Document 1: Japanese Unexamined Patent Application Publication No. 2011-222405

[0004] In the substrate connection structure as described above, when signals such as high-frequency signals flow from one printed circuit board to another printed circuit board, unnecessary radiation noise, that is, electromagnetic noise, is likely to be generated, and thus it is required to suppress unnecessary radiation noise. In the substrate connection structure of Patent Document 1, in order to suppress the electrostatic discharge noise applied to one printed circuit board from an external connector from flowing into the inter-substrate connector, a conduction member is provided that connects a portion of the ground layer at the peripheral portion of one printed circuit board that is separated from the inter-substrate connector to the ground layer of the other printed circuit board. However, in the countermeasure of providing such a conduction member, there is a problem that unnecessary radiation noise generated by the signal flowing through the inter-substrate connector cannot be suppressed. Summary of the Invention

[0005] One aspect of the circuit board unit of the present disclosure includes: a first circuit board having a first ground layer; a second circuit board having a second ground layer; a connector unit having a first connector mounted on the first circuit board and a second connector mounted on the second circuit board; and a metal member connecting the first circuit board and the second circuit board. The metal member has: a first connection portion electrically connected to the first ground layer; a second connection portion electrically connected to the second ground layer; and a cover portion covering at least a part of the connector unit. The cover portion has an opposed wall portion, and at least a part of the opposed wall portion is opposed to the connector unit in a direction perpendicular to the board surface of the first circuit board. When viewed in a direction perpendicular to the board surface of the first circuit board, the opposed wall portion overlaps the first circuit board, and when viewed in a direction perpendicular to the board surface of the second circuit board, the opposed wall portion overlaps the second circuit board.

[0006] One aspect of the electronic device of the present disclosure is characterized by including the above-described circuit board unit. Brief Description of the Drawings

[0007] Figure 1 It is a schematic configuration diagram showing a projector according to the first embodiment.

[0008] Figure 2It is a perspective view showing a part of the circuit board unit of the first embodiment.

[0009] Figure 3 It is a top view showing a part of the circuit board unit of the first embodiment.

[0010] Figure 4 It is a cross-sectional view showing a part of the circuit board unit of the first embodiment, which is Figure 3 the cross-sectional view taken along line IV-IV in

[0011] Figure 5 It is a cross-sectional view showing a part of the circuit board unit of the first embodiment, which is Figure 3 the cross-sectional view taken along line V-V in

[0012] Figure 6 It is a perspective view showing a part of the metal component of the first embodiment.

[0013] Figure 7 It is a cross-sectional view showing the metal component of the second embodiment.

[0014] Figure 8 It is a perspective view showing a part of the circuit board unit of the third embodiment.

[0015] Figure 9 It is a cross-sectional view showing a part of the circuit board unit of the third embodiment.

[0016] Figure 10 It is a cross-sectional view showing a part of the circuit board unit of the fourth embodiment.

[0017] Figure 11 It is a perspective view showing a part of the circuit board unit of the fifth embodiment.

[0018] Figure 12 It is a top view showing a part of the circuit board unit of the fifth embodiment.

[0019] Figure 13 It is a cross-sectional view showing a part of the circuit board unit of the fifth embodiment, which is Figure 12 the cross-sectional view taken along line XIII-XIII in

[0020] Figure 14 It is a perspective view showing a part of the circuit board unit of the sixth embodiment.

[0021] Figure 15 It is a cross-sectional view showing a part of the circuit board unit of the sixth embodiment.

[0022] Reference Numeral Explanation

[0023] 1: Projector (electronic device); 60, 360, 460, 560, 660: Circuit board unit; 61, 361, 461, 661: First circuit board; 61d, 62d, 361c, 362c, 661d, 662d: Signal line; 61g: First ground layer; 62, 362, 462, 662: Second circuit board; 62g: Second ground layer; 70, 670: Connector unit; 71, 671: First connector; 71a, 671a: First housing (holding part); 71b, 671b: First connecting member (connecting member); 72, 672: Second connector; 72a, 672a: Second housing (holding part); 72b, 672b: Second connecting member (connecting member); 80, 280, 380, 580, 680: Metal part; 80a, 280a, 380a, 580a, 680a: Cover part; 81, 381, 681: Opposing wall part; 83a, 383a: Protruding wall part (first protruding wall part); 83b, 383b: Protruding wall part (second protruding wall part); 83c, 83d: Bending part; 84a, 384a: Connecting wall part (first connecting wall part); 84b, 384b: Connecting wall part (second connecting wall part); 85a, 685a: First connecting part; 85b, 685b: Second connecting part; 361d, 362d: Conductive part; 461e, 462e: Ground pad part; 681a: First part; 681b: Second part; X: First horizontal direction (third direction); Y: Second horizontal direction (second direction, first direction); Z: Vertical direction (first direction, second direction). Detailed implementation mode

[0024] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. In the following embodiments, a projector will be described as an example of an electronic device.

[0025] In addition, the scope of the present disclosure is not limited to the following embodiments and can be arbitrarily changed within the scope of the technical idea of the present disclosure. In the following drawings, in order to easily understand each structure, the scale, quantity, etc. of each structure may sometimes be different from the actual structure.

[0026] <First Embodiment>

[0027] Figure 1 It is a schematic structural diagram showing a projector 1 as an electronic device of the present embodiment.

[0028] The projector 1 of the present embodiment is a projection type image display device that projects a color image on a screen SCR. As Figure 1As shown, the projector 1 includes a light source device 2, a uniform illumination optical system 40, a color separation optical system 3, a light modulation device 4R, a light modulation device 4G, a light modulation device 4B, a combining optical system 5, a projection optical device 6, and a control device 50. The light source device 2 emits illumination light WL toward the uniform illumination optical system 40.

[0029] The uniform illumination optical system 40 includes an integrating optical system 31, a polarization conversion element 32, and an overlapping optical system 33. The integrating optical system 31 includes a first lens array 31a and a second lens array 31b. The uniform illumination optical system 40 equalizes the intensity distribution of the illumination light WL emitted from the light source device 2 in the light modulation devices 4R, 4G, and 4B that are the illuminated regions, respectively. The illumination light WL emitted from the uniform illumination optical system 40 is incident on the color separation optical system 3.

[0030] The color separation optical system 3 separates the white illumination light WL into red light LR, green light LG, and blue light LB. The color separation optical system 3 includes a first dichroic mirror 7a, a second dichroic mirror 7b, a first reflector 8a, a second reflector 8b, a third reflector 8c, a first relay lens 9a, and a second relay lens 9b.

[0031] The first dichroic mirror 7a separates the illumination light WL from the light source device 2 into red light LR and other light, that is, green light LG and blue light LB. The first dichroic mirror 7a transmits the separated red light LR and reflects the other light, that is, green light LG and blue light LB. On the other hand, the second dichroic mirror 7b separates the other light into green light LG and blue light LB. The second dichroic mirror 7b reflects the separated green light LG and transmits the blue light LB.

[0032] The first reflector 8a is disposed in the optical path of the red light LR and reflects the red light LR that has passed through the first dichroic mirror 7a toward the light modulation device 4R. On the other hand, the second reflector 8b and the third reflector 8c are disposed in the optical path of the blue light LB and reflect the blue light LB that has passed through the second dichroic mirror 7b toward the light modulation device 4B. In addition, the green light LG is reflected by the second dichroic mirror 7b toward the light modulation device 4G.

[0033] The first relay lens 9a and the second relay lens 9b are disposed on the light emission side of the second dichroic mirror 7b in the optical path of the blue light LB. The first relay lens 9a and the second relay lens 9b correct the difference in the illumination distribution of the blue light LB caused by the fact that the optical path length of the blue light LB is longer than the optical path lengths of the red light LR and the green light LG.

[0034] The light modulation device 4R modulates the red light LR according to the image information to form image light corresponding to the red light LR. The light modulation device 4G modulates the green light LG according to the image information to form image light corresponding to the green light LG. The light modulation device 4B modulates the blue light LB according to the image information to form image light corresponding to the blue light LB.

[0035] The light modulation device 4R, the light modulation device 4G, and the light modulation device 4B use, for example, transmissive liquid crystal panels. In addition, polarizing plates (not shown) are respectively disposed on the incident side and the emission side of the liquid crystal panel, and are configured to allow only linearly polarized light in a specific direction to pass through.

[0036] Field lenses 10R, 10G, and 10B are respectively disposed on the incident sides of the light modulation device 4R, the light modulation device 4G, and the light modulation device 4B. The field lenses 10R, 10G, and 10B parallelize the principal rays of the red light LR, the green light LG, and the blue light LB incident on the respective light modulation devices 4R, 4G, and 4B.

[0037] The combining optical system 5 combines the image lights corresponding to the red light LR, the green light LG, and the blue light LB by incidentally receiving the image lights emitted from the light modulation device 4R, the light modulation device 4G, and the light modulation device 4B, and emits the combined image light toward the projection optical device 6. The combining optical system 5 uses, for example, a cross dichroic prism.

[0038] The projection optical device 6 is composed of a plurality of projection lenses. The projection optical device 6 magnifies and projects the image light combined by the combining optical system 5 onto the screen SCR. Thereby, an image is displayed on the screen SCR.

[0039] Next, the control device 50 will be described.

[0040] Figure 2 is a perspective view showing a part of the circuit board unit 60 in the control device 50. Figure 3 is a top view showing a part of the circuit board unit 60. Figure 4 is a cross-sectional view showing a part of the circuit board unit 60, which is a Figure 3 IV-IV cross-sectional view in. In addition, in Figure 4 regarding the connector unit 70 described later, the cross-section is not shown. Figure 5 is a cross-sectional view showing a part of the circuit board unit 60, which is a Figure 3 V-V cross-sectional view in. Figure 6 is a perspective view showing a part of the metal component 80 described later.

[0041] In each figure, the X-axis, Y-axis, and Z-axis are appropriately shown. The direction parallel to the X-axis is referred to as the "first horizontal direction X", the direction parallel to the Y-axis is referred to as the "second horizontal direction Y", and the direction parallel to the Z-axis is referred to as the "vertical direction Z". The first horizontal direction X, the second horizontal direction Y, and the vertical direction Z are mutually perpendicular directions. The side towards which the arrow of the Z-axis in the vertical direction Z points, i.e., the +Z side, is referred to as the "upper side", and the side opposite to the side towards which the arrow of the Z-axis points in the vertical direction Z, i.e., the -Z side, is referred to as the "lower side". The side towards which the arrow of the X-axis in the first horizontal direction X points, i.e., the +X side, is referred to as the "first horizontal direction side", and the side opposite to the side towards which the arrow of the X-axis points in the first horizontal direction X, i.e., the -X side, is referred to as the "other side of the first horizontal direction". The side towards which the arrow of the Y-axis in the second horizontal direction Y points, i.e., the +Y side, is referred to as the "second horizontal direction side", and the side opposite to the side towards which the arrow of the Y-axis points in the second horizontal direction Y, i.e., the -Y side, is referred to as the "other side of the second horizontal direction".

[0042] In addition, the vertical direction Z, the first horizontal direction X, and the second horizontal direction Y are only names used to illustrate the relative positional relationship and the like of each part, and the actual configuration relationship and the like can also be different from the configuration relationship shown by these names.

[0043] The control device 50 is a main board that controls each part of the projector 1 including the light source device 2. As Figures 2 to 5 shown, the control device 50 has a circuit board unit 60. As Figure 2 shown, the circuit board unit 60 includes a first circuit board 61, a second circuit board 62, and a connector unit 70. The first circuit board 61 and the second circuit board 62 are electrically connected to each other via the connector unit 70. In the present embodiment, the first circuit board 61 and the second circuit board 62 are plate-shaped with their plate surfaces facing the vertical direction Z, and extend along the first horizontal direction X and the second horizontal direction Y. The plate surface of the first circuit board 61 and the plate surface of the second circuit board 62 are perpendicular to the vertical direction Z.

[0044] In addition, in the present embodiment, the vertical direction Z corresponds to the "first direction" perpendicular to the plate surface of the first circuit board 61, the second horizontal direction Y corresponds to the "second direction" perpendicular to the first direction, and the first horizontal direction X corresponds to the "third direction" perpendicular to both the first direction and the second direction.

[0045] In the present embodiment, the surface of the first circuit board 61 and the surface of the second circuit board 62 are parallel to each other. In addition, in this specification, "certain objects are parallel to each other" includes not only the case where certain objects are strictly parallel to each other, but also the case where certain objects are substantially parallel to each other. The case where certain objects are substantially parallel to each other includes, for example, the case where the inclination of another object with respect to one object is about 15° or less.

[0046] As Figure 3 shown, in the present embodiment, the first circuit board 61 and the second circuit board 62 are arranged and disposed in a direction along the surfaces of the first circuit board 61 and the second circuit board 62. In the present embodiment, the first circuit board 61 and the second circuit board 62 are arranged and disposed in the second horizontal direction Y. The first circuit board 61 and the second circuit board 62 are disposed separately from each other in the second horizontal direction Y. In the present embodiment, the first circuit board 61 and the second circuit board 62 are disposed at the same position in the vertical direction Z.

[0047] In the present embodiment, the first circuit board 61 and the second circuit board 62 are printed circuit boards provided with wiring patterns made of copper foil. The first circuit board 61 and the second circuit board 62 are substrates having the same structure. In the following description, regarding the same structure as the first circuit board 61, part of the description of the second circuit board 62 may be omitted.

[0048] As Figure 4 shown, the first circuit board 61 has first insulating layers 61a, 61b, a first wiring layer 61c, and a first ground layer 61g. The first insulating layer 61a is laminated on the upper side of the first ground layer 61g. The first insulating layer 61b is laminated on the lower side of the first ground layer 61g. The first wiring layer 61c is laminated on the upper side of the first insulating layer 61a. The first wiring layer 61c is a layer formed by a plurality of wiring patterns made of copper foil. The first wiring layer 61c has signal lines 61d electrically connected to the first connector 71. As Figure 3 shown, the signal lines 61d extend in the second horizontal direction Y. A plurality of signal lines 61d are arranged in the first horizontal direction X. The plurality of signal lines 61d include signal lines 61d through which high-frequency signals flow. The high-frequency signal is, for example, a signal of 20 MHz or more. In addition, in Figure 3 , only a part of the plurality of signal lines 61d is illustrated.

[0049] Although illustration is omitted, the first wiring layer 61c is covered with a resist layer except for, for example, portions electrically connected to electronic components on the upper surface of the first circuit board 61. The upper surface of the first circuit board 61 is formed by the upper surface of the first wiring layer 61c, the upper surface of the resist layer, and first ground pad portions 61i and 61j described later. In the present embodiment, the upper surface of the first circuit board 61 is the upper side plate surface of the first circuit board 61 and is a mounting surface for mounting electronic components and the like.

[0050] As Figure 4 shown, in the present embodiment, the first ground layer 61g is an inner layer that forms part of the first circuit board 61. The first ground layer 61g is a layer whose potential becomes the reference potential in the circuit board unit 60. The first ground layer 61g is formed, for example, by a solid pattern made of copper foil. The first ground layer 61g is also referred to as a reference plane.

[0051] As Figure 3 shown, a pair of first ground pad portions 61i and 61j are formed on the upper surface of the first circuit board 61. The pair of first ground pad portions 61i and 61j are provided at intervals in the first horizontal direction X. The first ground pad portion 61i is on the +X side, which is the first horizontal direction side, relative to the first ground pad portion 61j. In the present embodiment, when viewed in the up-down direction Z, each of the first ground pad portions 61i and 61j has a rectangular shape. As Figure 5 shown, in the present embodiment, the first ground pad portion 61i is provided on the same layer as the first wiring layer 61c and is electrically connected to the first ground layer 61g via a through hole 61v formed in the first insulating layer 61a. Although illustration is omitted, the first ground pad portion 61j is also electrically connected to the first ground layer 61g in the same manner as the first ground pad portion 61i. In addition, the pair of first ground pad portions 61i and 61j may be portions where a part of the first ground layer 61g is exposed on the upper surface of the first circuit board 61 through an opening formed in the first insulating layer 61a.

[0052] The second circuit board 62 is disposed at intervals on the +Y side, which is the second horizontal direction side of the first circuit board 61. As Figure 4 shown, the second circuit board 62 has second insulating layers 62a and 62b, a second wiring layer 62c, and a second ground layer 62g. The second insulating layers 62a and 62b, the second wiring layer 62c, and the second ground layer 62g are the same layers as the first insulating layer 61a, the first insulating layer 61b, the first wiring layer 61c, and the first ground layer 61g in the first circuit board 61, respectively. The second wiring layer 62c has signal lines 62d electrically connected to the second connector 72. As Figure 3As shown, the signal line 62d extends in the second horizontal direction Y. A plurality of signal lines 62d are arranged in the first horizontal direction X. The plurality of signal lines 62d include the signal lines 62d through which high-frequency signals flow. The high-frequency signal is, for example, a signal of 20 MHz or higher. Additionally, in Figure 3 only a part of the plurality of signal lines 62d is illustrated.

[0053] As Figure 3 shown, a pair of second ground pad portions 62i, 62j are formed on the upper surface of the second circuit board 62. The pair of second ground pad portions 62i, 62j are provided at intervals in the first horizontal direction X. The pair of second ground pad portions 62i, 62j are respectively the same as the pair of first ground pad portions 61i, 61j. Each of the pair of first ground pad portions 61i, 61j and each of the pair of second ground pad portions 62i, 62j are arranged and configured at intervals in the second horizontal direction Y. As Figure 5 shown, the second ground pad portion 62i is provided on the same layer as the second wiring layer 62c and is electrically connected to the second ground layer 62g via a through hole 62v formed in the second insulating layer 62a. Although not shown, the second ground pad portion 62j is also electrically connected to the second ground layer 62g in the same manner as the second ground pad portion 62i. In addition, the pair of second ground pad portions 62i, 62j may also be a part of the second ground layer 62g that is exposed on the upper surface of the second circuit board 62 through an opening formed in the second insulating layer 62a.

[0054] The connector unit 70 relays signal transmission between the first circuit board 61 and the second circuit board 62. As Figure 3 shown, in the present embodiment, when viewed in the up-down direction Z, the connector unit 70 has a substantially rectangular shape that is longer in the first horizontal direction X. Additionally, in Figure 2 the illustration of the first connecting member 71b and the second connecting member 72b described later is omitted, and the connector unit 70 is schematically shown.

[0055] As Figure 4 shown, the connector unit 70 has a first connector 71 and a second connector 72. The first connector 71 is mounted on the upper surface of the first circuit board 61. The second connector 72 is mounted on the upper surface of the second circuit board 62. The first connector 71 is connected to the second connector 72 in the second horizontal direction Y. That is, in the present embodiment, the connection direction of the first connector 71 and the second connector 72 is the second horizontal direction Y.

[0056] In the present embodiment, the first connector 71 is a female connector, and the second connector 72 is a male connector. The first connector 71 and the second connector 72 are fitted to each other in the second horizontal direction Y to be electrically connected. That is, in the present embodiment, the fitting direction of the first connector 71 and the second connector 72 is the second horizontal direction Y.

[0057] The first connector 71 includes a first housing 71a and a plurality of first connecting members 71b. The first housing 71a is a resin component that holds the plurality of first connecting members 71b. The first housing 71a is formed, for example, by insert molding with the plurality of first connecting members 71b as insert parts. The first housing 71a has a substantially rectangular parallelepiped box shape. The first housing 71a is in contact with the upper surface of the first circuit board 61. In addition, the first housing 71a may be separated from the upper surface of the first circuit board 61 with a gap upward. The first housing 71a protrudes from the first circuit board 61 toward the second horizontal direction side, that is, the +Y side. The first housing 71a is a holding part that holds the plurality of first connecting members 71b.

[0058] The plurality of first connecting members 71b are held by the first housing 71a. A part of each first connecting member 71b is buried in the first housing 71a. The first connecting member 71b is a metal and elongated plate-like component. As Figure 3 shown, the plurality of first connecting members 71b are arranged at intervals in the first horizontal direction X. As Figure 4 shown, the first connecting member 71b has a first extension part 71c, a second extension part 71d, and a substrate connection part 71e.

[0059] The first extension part 71c extends along the second horizontal direction Y. The end on the second horizontal direction side, that is, the +Y side of the first extension part 71c is exposed in an unillustrated recess formed in the first housing 71a and opening toward the second horizontal direction side. The end on the other second horizontal direction side, that is, the -Y side of the first extension part 71c protrudes from the first housing 71a toward the other second horizontal direction side and is exposed from the first housing 71a. Thus, the first connecting member 71b of the first connector 71 protrudes from the first housing 71a in the second horizontal direction Y.

[0060] The second extension part 71d extends downward and obliquely toward the other second horizontal direction side from the end on the other second horizontal direction side, that is, the -Y side of the first extension part 71c. The substrate connection part 71e extends from the lower end of the second extension part 71d toward the other second horizontal direction side. The substrate connection part 71e is electrically connected to the first circuit board 61. Thus, the first connecting member 71b is electrically connected to the first circuit board 61. As Figure 3As shown, the substrate connection portions 71e of the plurality of first connectors 71b are electrically connected to the plurality of signal lines 61d, respectively. More specifically, the substrate connection portion 71e contacts a portion of the signal line 61d exposed on the upper surface of the first circuit board 61 and is electrically connected to the signal line 61d.

[0061] As Figure 4 shown, the second connector 72 is located on the second horizontal direction side, i.e., the +Y side, of the first connector 71. The second connector 72 includes a second housing 72a and a plurality of second connectors 72b. The second housing 72a is a resin component that holds the plurality of second connectors 72b. The second housing 72a is, for example, manufactured by insert molding with the plurality of second connectors 72b as insert components. The second housing 72a has a substantially rectangular parallelepiped box shape. The second housing 72a contacts the upper surface of the second circuit board 62. In addition, the second housing 72a may be separated and disposed at a gap upward from the upper surface of the second circuit board 62. The second housing 72a protrudes toward the other side in the second horizontal direction, i.e., the -Y side, from the second circuit board 62. The second housing 72a is a holding portion that holds the plurality of second connectors 72b.

[0062] The plurality of second connectors 72b are held by the second housing 72a. A part of each second connector 72b is buried in the second housing 72a. The second connector 72b is a metal and elongated plate-like component. As Figure 3 shown, the plurality of second connectors 72b are arranged at intervals in the first horizontal direction X. The plurality of second connectors 72b are respectively arranged on the second horizontal direction side, i.e., the +Y side, with respect to the plurality of first connectors 71b.

[0063] As Figure 4 shown, the second connector 72b has a first extension portion 72c, a second extension portion 72d, and a substrate connection portion 72e. The first extension portion 72c extends along the second horizontal direction Y. The end on the other side in the second horizontal direction of the first extension portion 72c is inserted into a recess (not shown) formed in the first housing 71a and contacts the first extension portion 71c of the first connector 71b exposed in the recess. Thereby, the first connector 71b and the second connector 72b are electrically connected to each other. The end on the second horizontal direction side, i.e., the +Y side, of the first extension portion 72c protrudes from the second housing 72a toward the second horizontal direction side and is exposed from the second housing 72a. Thereby, the second connector 72b of the second connector 72 protrudes from the second housing 72a toward the second horizontal direction Y.

[0064] The second extension portion 72d extends downward from the end portion on the second horizontal direction side, i.e., the +Y side, of the first extension portion 72c and toward the inclined second horizontal direction side. The substrate connection portion 72e extends from the lower end portion of the second extension portion 72d toward the second horizontal direction side. The substrate connection portion 72e is electrically connected to the second circuit board 62. Thus, the second connection member 72b is electrically connected to the second circuit board 62. As Figure 3 shown, the substrate connection portions 72e of the plurality of second connection members 72b are respectively electrically connected to the plurality of signal lines 62d. More specifically, the substrate connection portion 72e contacts a portion of the signal line 62d exposed on the upper surface of the second circuit board 62 and is electrically connected to the signal line 62d.

[0065] The circuit board unit 60 includes a metal member 80 that connects the first circuit board 61 and the second circuit board 62. The metal member 80 electrically connects the first ground layer 61g and the second ground layer 62g. As Figure 2 and Figure 6 shown, in the present embodiment, the metal member 80 is a metal plate member. The metal member 80 is formed by performing stamping on a metal plate. The material constituting the metal member 80 may be any metal without particular limitation. In addition, a conductive member such as carbon may be used instead of the metal member 80.

[0066] As Figure 2 shown, the metal member 80 has a cover portion 80a and a pair of fixing portions 82a, 82b. The cover portion 80a is a portion that covers at least a part of the connector unit 70. In the present embodiment, the cover portion 80a is in a substantially rectangular parallelepiped box shape that opens downward. The cover portion 80a covers the connector unit 70 from above. The cover portion 80a covers the connector unit 70 from above, from both sides in the first horizontal direction X, and from both sides in the second horizontal direction Y. The cover portion 80a covers at least a part of the gap in the second horizontal direction Y between the first circuit board 61 and the second circuit board 62 from above. The cover portion 80a has opposing wall portions 81, protruding wall portions 83, connecting wall portions 84, and bent portions 83c, 83d.

[0067] The opposing wall portion 81 is plate-shaped with its plate surface facing the up-down direction Z. The plate surface of the opposing wall portion 81 is perpendicular to the up-down direction Z. In the present embodiment, the opposing wall portion 81 is in the shape of a substantially rectangular plate that is long in the first horizontal direction X. The opposing wall portion 81 is located above the connector unit 70. At least a part of the opposing wall portion 81 opposes the connector unit 70 in a direction perpendicular to the plate surface of the first circuit board 61, that is, in the up-down direction Z. In the present embodiment, substantially the whole of the opposing wall portion 81 except for the two edge portions in the first horizontal direction X and the two edge portions in the second horizontal direction Y opposes the connector unit 70 in the up-down direction Z. The opposing wall portion 81 has a part that opposes the first connector 71 in the up-down direction Z and a part that opposes the second connector 72 in the up-down direction Z. The opposing wall portion 81 opposes the first housing 71a, the first connecting member 71b, the second housing 72a, and the second connecting member 72b in the up-down direction Z.

[0068] The opposing wall portion 81 covers at least a part of the connector unit 70 from above. In the present embodiment, the opposing wall portion 81 has a part that covers the first connector 71 from above and a part that covers the second connector 72 from above. In the present embodiment, the opposing wall portion 81 covers the entire connector unit 70 from above. When observed in the up-down direction Z, the opposing wall portion 81 overlaps with the connector unit 70, and has a part that overlaps with the first circuit board 61 and a part that overlaps with the second circuit board 62. In other words, when observed in a direction perpendicular to the plate surface of the first circuit board 61, the opposing wall portion 81 overlaps with the first circuit board 61, and when observed in a direction perpendicular to the plate surface of the second circuit board 62, the opposing wall portion 81 overlaps with the second circuit board 62. The edge portion on the other side in the second horizontal direction, that is, the -Y side, of the opposing wall portion 81 is located above the first circuit board 61. The edge portion on one side in the second horizontal direction, that is, the +Y side, of the opposing wall portion 81 is located above the second circuit board 62.

[0069] As Figure 4 shown, the end portion on the other side in the second horizontal direction, that is, the -Y side, of the opposing wall portion 81 is further on the other side in the second horizontal direction than the end portion on the other side in the second horizontal direction of the first connecting member 71b. In other words, the end portion on the -Y side of the opposing wall portion 81 on the side where the first connecting member 71b protrudes from the first housing 71a is further outside than the end portion of the first connecting member 71b on the side where the first connecting member 71b protrudes from the first housing 71a. In the present embodiment, the end portion on the other side in the second horizontal direction of the first connecting member 71b is the end portion on the other side in the second horizontal direction of the substrate connection portion 71e.

[0070] The end portion of the opposing wall portion 81 on the second horizontal direction side, that is, the +Y side, is closer to the second horizontal direction side than the end portion of the second connecting member 72b on the second horizontal direction side. In other words, the end portion of the opposing wall portion 81 on the side where the second connecting member 72b protrudes from the second housing 72a, that is, the +Y side, is closer to the outside than the end portion of the second connecting member 72b on the side where the second connecting member 72b protrudes from the second housing 72a. In the present embodiment, the end portion of the second connecting member 72b on the second horizontal direction side is the end portion of the substrate connecting portion 72e on the second horizontal direction side.

[0071] The shortest distance in the vertical direction Z between the opposing wall portion 81 and the connector unit 70 is, for example, smaller than the dimension of the connector unit 70 in the vertical direction Z. The dimensions of the connector unit 70 in the vertical direction Z are, for example, equal to the dimensions of the first connector 71 and the second connector 72 in the vertical direction Z, respectively. The shortest distance in the vertical direction Z between the opposing wall portion 81 and the connector unit 70 is, for example, smaller than the distance in the second horizontal direction Y between the first circuit board 61 and the second circuit board 62. The shortest distance in the vertical direction Z between the opposing wall portion 81 and the connector unit 70 is, for example, about 0.5 mm or more and 20 mm or less. The shortest distance in the vertical direction Z between the opposing wall portion 81 and the connector unit 70 is, for example, preferably less than 10 mm. In the present embodiment, the shortest distance in the vertical direction Z between the opposing wall portion 81 and the connector unit 70 is the distance in the vertical direction Z between the lower surface of the opposing wall portion 81 and the upper surface of the first housing 71a and the distance in the vertical direction Z between the lower surface of the opposing wall portion 81 and the upper surface of the second housing 72a.

[0072] The protruding wall portion 83 protrudes from the opposing wall portion 81 toward one of the first circuit board 61 and the second circuit board 62. In the present embodiment, the protruding wall portion 83 is plate-shaped with the plate surface facing the second horizontal direction Y. The plate surface of the protruding wall portion 83 is perpendicular to the second horizontal direction Y. As Figure 2 shown, in the present embodiment, the protruding wall portion 83 is substantially rectangular plate-shaped and is longer in the first horizontal direction X. The dimension of the protruding wall portion 83 in the first horizontal direction X is smaller than the dimension of the opposing wall portion 81 in the first horizontal direction X. In the present embodiment, the protruding wall portion 83 is a portion bent in the vertical direction Z from the edge portion of the opposing wall portion 81 in the second horizontal direction Y.

[0073] In the present embodiment, a pair of protruding wall portions (first protruding wall portion) 83a and protruding wall portions (second protruding wall portion) 83b are provided on the protruding wall portion 83. The protruding wall portion 83a protrudes downward from the edge portion of the opposing wall portion 81 on the second horizontal direction other side, that is, the -Y side, toward the first circuit board 61. The protruding wall portion 83b protrudes downward from the edge portion of the opposing wall portion 81 on the second horizontal direction side, that is, the +Y side, toward the second circuit board 62. AsFigure 4 As shown, a pair of protruding wall portions 83a and 83b are provided with the connector unit 70 interposed therebetween in the second horizontal direction Y. The pair of protruding wall portions 83a and 83b are opposed to the connector unit 70 in the second horizontal direction Y. The protruding wall portion 83a is located at a position separated from the other side in the second horizontal direction of the first connector 71, and is opposed to the first connector 71 with a gap therebetween. The protruding wall portion 83a covers at least a part of the first connector 71 from the other side in the second horizontal direction. In the present embodiment, the protruding wall portion 83a covers substantially the whole of the first connector 71 except for the lower end portion from the other side in the second horizontal direction. The protruding wall portion 83b is located at a position separated from the one side in the second horizontal direction of the second connector 72, and is opposed to the second connector 72 with a gap therebetween. The protruding wall portion 83b covers at least a part of the second connector 72 from the one side in the second horizontal direction. In the present embodiment, the protruding wall portion 83b covers substantially the whole of the second connector 72 except for the lower end portion from the one side in the second horizontal direction.

[0074] In the present embodiment, a gap is provided between the protruding wall portion 83a and the first circuit board 61. That is, the lower end portion of the protruding wall portion 83a is located at a position spaced upward from the upper surface of the first circuit board 61. The lower end portion of the protruding wall portion 83a is lower than the first extension portion 71c. In the present embodiment, a gap is provided between the protruding wall portion 83b and the second circuit board 62. That is, the lower end portion of the protruding wall portion 83b is located at a position spaced upward from the upper surface of the second circuit board 62. The lower end portion of the protruding wall portion 83b is lower than the first extension portion 72c. The protruding wall portion 83a is located above the signal line 61d. The protruding wall portion 83b is located above the signal line 62d.

[0075] The shortest distance in the second horizontal direction Y between the protruding wall portion 83a and the first housing 71a is, for example, smaller than the dimension of the first housing 71a in the second horizontal direction Y. The shortest distance in the second horizontal direction Y between the protruding wall portion 83a and the first housing 71a is larger than the shortest distance in the vertical direction Z between the opposing wall portion 81 and the connector unit 70. The shortest distance in the second horizontal direction Y between the protruding wall portion 83a and the first housing 71a is, for example, about 0.5 mm or more and 20 mm or less. The shortest distance in the second horizontal direction Y between the protruding wall portion 83a and the first housing 71a is, for example, preferably less than 10 mm. The shortest distance in the second horizontal direction Y between the protruding wall portion 83b and the second housing 72a is the same as the shortest distance in the second horizontal direction Y between the protruding wall portion 83a and the first housing 71a. The shortest distance in the second horizontal direction Y between the protruding wall portion 83b and the second housing 72a is, for example, smaller than the dimension of the second housing 72a in the second horizontal direction Y.

[0076] The dimension in the vertical direction Z of the gap between the protruding wall portion 83a and the first circuit board 61 is smaller than the thickness of the first circuit board 61, that is, the dimension in the vertical direction Z of the first circuit board 61. The dimension in the vertical direction Z of the gap between the protruding wall portion 83a and the first circuit board 61 is, for example, about 0.5 mm or more and 20 mm or less. The dimension in the vertical direction Z of the gap between the protruding wall portion 83a and the first circuit board 61 is preferably less than 10 mm, for example. The dimension in the vertical direction Z of the gap between the protruding wall portion 83b and the second circuit board 62 is the same as the dimension in the vertical direction Z of the gap between the protruding wall portion 83a and the first circuit board 61. The dimension in the vertical direction Z of the gap between the protruding wall portion 83b and the second circuit board 62 is smaller than the thickness of the second circuit board 62, that is, the dimension in the vertical direction Z of the second circuit board 62.

[0077] As Figure 2 shown, the connecting wall portion 84 protrudes downward from the opposing wall portion 81. In the present embodiment, the connecting wall portion 84 is plate-shaped with a plate surface facing the first horizontal direction X. The plate surface of the connecting wall portion 84 is perpendicular to the first horizontal direction X. In the present embodiment, the connecting wall portion 84 is in the shape of a substantially rectangular plate that is long in the second horizontal direction Y. The dimension of the connecting wall portion 84 in the second horizontal direction Y is smaller than the dimension of the opposing wall portion 81 in the second horizontal direction Y. In the present embodiment, the connecting wall portion 84 is a portion bent in the vertical direction Z from the edge portion of the opposing wall portion 81 in the first horizontal direction X.

[0078] In the present embodiment, a pair of connecting wall portions (first connecting wall portion) 84a and connecting wall portions (second connecting wall portion) 84b are provided on the connecting wall portion 84. The connecting wall portion 84a protrudes downward from the edge portion of the opposing wall portion 81 on the first horizontal direction side, that is, the +X side. The connecting wall portion 84b protrudes downward from the edge portion of the opposing wall portion 81 on the other side of the first horizontal direction, that is, the -X side. The connecting wall portion 84a connects the fixing portion 82a and the opposing wall portion 81. The connecting wall portion 84b connects the fixing portion 82b and the opposing wall portion 81. That is, the connecting wall portion 84b is disposed on the side opposite to the connecting wall portion 84a and is connected to the opposing wall portion 81.

[0079] A pair of connecting wall portions 84a and 84b are provided with the connector unit 70 therebetween in the first horizontal direction X. The pair of connecting wall portions 84a and 84b face the connector unit 70 in the first horizontal direction X. The connecting wall portion 84a is located at a position separated from the first connector 71 and the second connector 72 on the first horizontal direction side, that is, the +X side, and faces the first connector 71 and the second connector 72 with a gap therebetween. The connecting wall portion 84a covers at least a part of the first connector 71 and at least a part of the second connector 72 from the first horizontal direction side. In the present embodiment, the connecting wall portion 84a covers the entire first connector 71 and the entire second connector 72 from the first horizontal direction side. The connecting wall portion 84b is located at a position separated from the first connector 71 and the second connector 72 on the other side of the first horizontal direction, that is, the -X side, and faces the first connector 71 and the second connector 72 with a gap therebetween. The connecting wall portion 84b covers at least a part of the first connector 71 and at least a part of the second connector 72 from the other side of the first horizontal direction. In the present embodiment, the connecting wall portion 84b covers the entire first connector 71 and the entire second connector 72 from the other side of the first horizontal direction.

[0080] The connecting wall portion 84a is located at a position separated from the protruding wall portions 83a and 83b on the first horizontal direction side, that is, the +X side. Gaps that connect the inside of the cover portion 80a to the outside of the cover portion 80a are respectively provided between the connecting wall portion 84a and the protruding wall portions 83a and 83b. The connecting wall portion 84b is located at a position separated from the protruding wall portions 83a and 83b on the other side of the first horizontal direction, that is, the -X side. Gaps that connect the inside of the cover portion 80a to the outside of the cover portion 80a are respectively provided between the connecting wall portion 84b and the protruding wall portions 83a and 83b. The pair of connecting wall portions 84a and 84b respectively extend from the upper side of the first circuit board 61 to the upper side of the second circuit board 62 along the second horizontal direction Y.

[0081] The bent portions 83c and 83d are portions bent from the edge of the protruding wall portion 83 in the first horizontal direction X to the second horizontal direction Y. The bent portion 83c is bent from the edge of the protruding wall portion 83a in the first horizontal direction X to the second horizontal direction side, that is, the +Y side. In the present embodiment, the bent portions 83c are respectively provided at both edges of the protruding wall portion 83a in the first horizontal direction X. The bent portion 83c on the first horizontal direction side, that is, the +X side, is inserted into the gap between the protruding wall portion 83a and the connecting wall portion 84a. The bent portion 83c on the other side of the first horizontal direction, that is, the -X side, is inserted into the gap between the protruding wall portion 83a and the connecting wall portion 84b. At least a part of each bent portion 83c is located between each connecting wall portion 84a, 84b and the first horizontal direction X of the connector unit 70. In the present embodiment, the portion on the second horizontal direction side of the bent portion 83c is located between each connecting wall portion 84a, 84b and the first horizontal direction X of the first connector 71. Each bent portion 83c may be in contact with each connecting wall portion 84a, 84b, or may be arranged at a gap from each connecting wall portion 84a, 84b.

[0082] As Figure 6 shown, the bent portion 83d is bent from the edge of the protruding wall portion 83b in the first horizontal direction X to the other side of the second horizontal direction, that is, the -Y side. In the present embodiment, the bent portions 83d are respectively provided at both edges of the protruding wall portion 83b in the first horizontal direction X. A pair of bent portions 83d and a pair of bent portions 83c are symmetrically arranged in the second horizontal direction Y. A pair of bent portions 83c and a pair of bent portions 83d are respectively arranged opposite to each other at an interval in the second horizontal direction Y. In the present embodiment, the portion on the other side of the second horizontal direction in the bent portion 83d is located between each connecting wall portion 84a, 84b and the first horizontal direction X of the second connector 72.

[0083] As Figure 2 shown, the fixing portions 82a and 82b are portions fixed to the first circuit board 61 and the second circuit board 62. The fixing portion 82a protrudes from the lower edge of the connecting wall portion 84a to the first horizontal direction side, that is, the +X side. In the present embodiment, the fixing portion 82a has a plate-like portion 85, a pair of cylindrical portions 82e and 82f, and a pair of engaging claw portions 82g and 82h.

[0084] The plate-like portion 85 is a plate-like part connected to the connecting wall portion 84a. The plate surface of the plate-like portion 85 is perpendicular to the vertical direction Z. In the present embodiment, the plate-like portion 85 is a substantially rectangular plate-like shape that is long in the second horizontal direction Y. The edge portion on the other side of the first horizontal direction of the plate-like portion 85, that is, the -X side, is connected to the lower end portion of the connecting wall portion 84a. In the present embodiment, the plate-like portion 85 is a portion bent from the lower edge portion of the connecting wall portion 84a in the first horizontal direction X. The lower surface of the plate-like portion 85 is in contact with the first ground pad portion 61i formed on the upper surface of the first circuit board 61 and the second ground pad portion 62i formed on the upper surface of the second circuit board 62. Thus, the plate-like portion 85 is electrically connected to the first ground layer 61g and the second ground layer 62g via the first ground pad portion 61i and the second ground pad portion 62i.

[0085] The portion of the plate-like portion 85 that is electrically connected to the first ground pad portion 61i is the first connection portion 85a that is electrically connected to the first ground layer 61g via the first ground pad portion 61i. The portion of the plate-like portion 85 that is electrically connected to the second ground pad portion 62i is the second connection portion 85b that is electrically connected to the second ground layer 62g via the second ground pad portion 62i. In the present embodiment, the first connection portion 85a is the portion on the other side of the second horizontal direction of the plate-like portion 85, that is, the -Y side. The second connection portion 85b is the portion on one side of the second horizontal direction of the plate-like portion 85, that is, the +Y side. In the present embodiment, the first connection portion 85a and the second connection portion 85b are connected to each other. The first connection portion 85a and the second connection portion 85b are connected to the connecting wall portion 84a. That is to say, in the present embodiment, the connecting wall portion 84a connects both the first connection portion 85a and the second connection portion 85b to the opposed wall portion 81.

[0086] A pair of cylindrical portions 82e, 82f project upward from the plate-like portion 85. The pair of cylindrical portions 82e, 82f are cylindrical with openings facing upward. The pair of cylindrical portions 82e, 82f are arranged at intervals in the second horizontal direction Y. The cylindrical portion 82e is provided on the first connection portion 85a. The cylindrical portion 82f is provided on the second connection portion 85b.

[0087] A pair of engaging claw portions 82g, 82h project downward from the two edge portions in the second horizontal direction Y of the plate-like portion 85. The engaging claw portion 82g projects downward from the edge portion on the other side of the second horizontal direction of the plate-like portion 85, that is, the -Y side. The engaging claw portion 82h projects downward from the edge portion on one side of the second horizontal direction of the plate-like portion 85, that is, the +Y side. As Figure 5As shown, the engaging claw portion 82g is inserted into the engaging hole portion 61k formed in the first circuit board 61 from above. The engaging hole portion 61k penetrates the first circuit board 61 in the vertical direction Z. The engaging claw portion 82h is inserted into the engaging hole portion 62k formed in the second circuit board 62 from above. The engaging hole portion 62k penetrates the second circuit board 62 in the vertical direction Z.

[0088] A pair of internal threaded holes 82i, 82j are formed in the fixing portion 82a. The internal threaded hole 82i is formed in the first connecting portion 85a and penetrates the first connecting portion 85a and the cylindrical portion 82e in the vertical direction Z. The inner peripheral surface of the cylindrical portion 82e constitutes a part of the inner peripheral surface of the internal threaded hole 82i. An internal threaded portion is formed on the inner peripheral surface of the internal threaded hole 82i. The internal threaded hole 82j is formed in the second connecting portion 85b and penetrates the second connecting portion 85b and the cylindrical portion 82f in the vertical direction Z. The inner peripheral surface of the cylindrical portion 82f constitutes a part of the inner peripheral surface of the internal threaded hole 82j. An internal threaded portion is formed on the inner peripheral surface of the internal threaded hole 82j.

[0089] A metal bolt 91 for fixing the first connecting portion 85a to the first circuit board 61 is screwed into the internal threaded hole 82i. The bolt 91 passes through the through hole 61h formed in the first circuit board 61 from below and is screwed into the internal threaded hole 82i. The through hole 61h penetrates the first circuit board 61 in the vertical direction Z. The inner diameter of the through hole 61h is larger than the inner diameter of the internal threaded hole 82i. The upper end portion of the through hole 61h opens at the first ground pad portion 61i. The upper end portion of the bolt 91 protrudes upward from the cylindrical portion 82e. By fixing the first connecting portion 85a to the first circuit board 61 with the bolt 91, the lower surface of the first connecting portion 85a is appropriately pressed against the first ground pad portion 61i. Thereby, the first connecting portion 85a is appropriately electrically connected to the first ground pad portion 61i, and the first connecting portion 85a is appropriately electrically connected to the first ground layer 61g.

[0090] A metal bolt 92 for fixing the second connecting portion 85b to the second circuit board 62 is screwed into the internal threaded hole 82j. The bolt 92 passes through the through hole 62h formed in the second circuit board 62 from below and is screwed into the internal threaded hole 82j. The through hole 62h penetrates the second circuit board 62 in the vertical direction Z. The inner diameter of the through hole 62h is larger than the inner diameter of the internal threaded hole 82j. The upper end portion of the through hole 62h opens at the second ground pad portion 62i. The upper end portion of the bolt 92 protrudes upward from the cylindrical portion 82f. By fixing the second connecting portion 85b to the second circuit board 62 with the bolt 92, the lower surface of the second connecting portion 85b is appropriately pressed against the second ground pad portion 62i. Thereby, the second connecting portion 85b is appropriately electrically connected to the second ground pad portion 62i, and the second connecting portion 85b is appropriately electrically connected to the second ground layer 62g.

[0091] As Figure 2 shown, the fixing portion 82b is symmetrically arranged with respect to the fixing portion 82a in the first horizontal direction X. The fixing portion 82b has, similarly to the fixing portion 82a, a first connection portion electrically connected to the first ground layer 61g and a second connection portion electrically connected to the second ground layer 62g. The first connection portion 85a of the fixing portion 82b is electrically connected to the first ground layer 61g via the first ground pad portion 61j. The second connection portion 85b of the fixing portion 82b is electrically connected to the second ground layer 62g via the second ground pad portion 62j.

[0092] Between the first circuit board 61 and the second circuit board 62, a current Is1 flows through the connector unit 70 to transmit a signal. In Figure 4 this example, the current Is1 flowing from the first circuit board 61 to the second circuit board 62 is indicated by a dotted arrow. The current Is1 sequentially flows through the first connecting member 71b and the second connecting member 72b from the signal line 61d formed on the first circuit board 61, and flows through the signal line 62d formed on the second circuit board 62. When the current Is1 flows in this way, a return current Ir1 corresponding to the current Is1 flows.

[0093] In Figure 4 this example, the return current Ir1 indicated by the dotted arrow is a return current flowing from the second ground layer 62g of the second circuit board 62 to the first ground layer 61g of the first circuit board 61. After the return current Ir1 flows in the opposite direction to the current Is1 through the portion of the second ground layer 62g located below the signal line 62d, it flows from the second ground layer 62g to the protruding wall portion 83b. Here, in the present embodiment, the second ground layer 62g and the protruding wall portion 83b are not connected by a conductor, but the return current Ir1 generated with respect to the high-frequency current Is1 can propagate from the second ground layer 62g to the protruding wall portion 83b through capacitive coupling in space. The return current Ir1 flowing through the protruding wall portion 83b sequentially flows through the opposing wall portion 81 and the protruding wall portion 83a, and flows from the protruding wall portion 83a to the first ground layer 61g of the first circuit board 61. In the present embodiment, the protruding wall portion 83a and the first ground layer 61g are also not connected by a conductor, but the return current Ir1 generated with respect to the high-frequency current Is1 can propagate from the protruding wall portion 83a to the first ground layer 61g through capacitive coupling in space. The return current Ir1 flowing to the first ground layer 61g flows in the direction opposite to the current Is1 through the portion of the first ground layer 61g located below the signal line 61d.

[0094] Thus, in the present embodiment, the return path through which the return current Ir1 generated when the current Is1 flows through the connector unit 70 flows is formed by the metal member 80. Further, when the current Is1 flows from the second circuit board 62 to the first circuit board 61, the return current Ir1 flows in a direction opposite to the direction of the arrow of the dotted line shown in Figure 4 and flows from the first ground layer 61g to the second ground layer 62g.

[0095] According to the present embodiment, the circuit board unit 60 includes: a first circuit board 61 having a first ground layer 61g; a second circuit board 62 having a second ground layer 62g; a connector unit 70 having a first connector 71 mounted on the first circuit board 61 and a second connector 72 mounted on the second circuit board 62; and a metal member 80 connecting the first circuit board 61 and the second circuit board 62. The metal member 80 has a first connection portion 85a electrically connected to the first ground layer 61g, a second connection portion 85b electrically connected to the second ground layer 62g, and a cover portion 80a covering at least a part of the connector unit 70. The cover portion 80a has an opposed wall portion 81 at least a part of which is opposed to the connector unit 70 in the vertical direction Z perpendicular to the board surface of the first circuit board 61. When viewed in the vertical direction Z perpendicular to the board surface of the first circuit board 61, the opposed wall portion 81 overlaps with the first circuit board 61, and when viewed in the vertical direction Z perpendicular to the board surface of the second circuit board 62, the opposed wall portion 81 overlaps with the second circuit board 62.

[0096] Therefore, the opposed wall portion 81 can be disposed close to the connector unit 70, and it is easy for the return current Ir1 to propagate between the first ground layer 61g of the first circuit board 61 and the opposed wall portion 81, and between the second ground layer 62g of the second circuit board 62 and the opposed wall portion 81. As a result, as described above, the return path through which the return current Ir1 flows between the first circuit board 61 and the second circuit board 62 can be appropriately provided by the metal member 80. Therefore, the electromagnetic field generated by the return current Ir1 flowing through the metal member 80 can be appropriately used to cancel the electromagnetic field generated by the current Is1 flowing through the connector unit 70. Therefore, it is possible to appropriately suppress the unnecessary radiation noise generated by the current Is1 flowing through the connector unit 70 connecting the first circuit board 61 and the second circuit board 62. In other words, the energy balance between the current Is1 flowing through the connector unit 70 and the return current Ir1 is such that unnecessary energy is not easily generated, and therefore, it is possible to appropriately suppress the unnecessary radiation noise caused by the unnecessary energy.

[0097] In addition, since the metal component 80 has the first connection portion 85a and the second connection portion 85b, the first ground layer 61g of the first circuit board 61 and the second ground layer 62g of the second circuit board 62 can be electrically connected via the metal component 80. As a result, the potential of each ground layer can be stabilized more appropriately. Therefore, the useless radiation noise caused by the current Is1 flowing along each ground layer to signal lines 61d, 62d, etc. can be suppressed more appropriately.

[0098] In addition, through the metal component 80, a path for the return current such as the first ground layer 61g and the second ground layer 62g can be provided with respect to the connector unit 70. Therefore, even if the respective connectors of the connector unit 70 are separated from the respective circuit boards, a path for the return current Ir1 can be provided with respect to the respective connectors separated from the respective circuit boards through the metal component 80. As a result, compared with the case where the metal component 80 is not provided, the path of the return current Ir1 provided in each wiring layer of each connector and each circuit board can be shortened. Therefore, the path of the return current Ir1 of each connector can be easily designed, and the deterioration of the quality of the signal flowing through each connector can be suppressed.

[0099] In addition, by covering at least a part of the connector unit 70 with the cover portion 80a of the metal component 80, at least a part of the electromagnetic wave generated from the connector unit 70 can be blocked by the cover portion 80a. As a result, the leakage of the electromagnetic wave generated from the connector unit 70 to the outside of the circuit board unit 60 can be suppressed.

[0100] In addition, according to the present embodiment, the cover portion 80a has a protruding wall portion 83 that protrudes from the opposing wall portion 81 toward one of the first circuit board 61 and the second circuit board 62. The protruding wall portion 83 faces the connector unit 70 in the second horizontal direction Y perpendicular to the up-down direction Z perpendicular to the board surface of the first circuit board 61. Therefore, the protruding wall portion 83 can be brought close to the first ground layer 61g of the first circuit board 61 or the second ground layer 62g of the second circuit board 62. As a result, the return current Ir1 can be easily propagated between the first ground layer 61g or the second ground layer 62g and the metal component 80. Therefore, the return current Ir1 can flow more appropriately through the metal component 80, and the useless radiation noise caused by the current Is1 flowing through the connector unit 70 can be suppressed more appropriately. In addition, since the protruding wall portion 83 can cover the connector unit 70 in the second horizontal direction Y, a part of the electromagnetic wave generated from the connector unit 70 can be blocked by the protruding wall portion 83. As a result, the leakage of the electromagnetic wave generated from the connector unit 70 to the outside of the circuit board unit 60 can be further suppressed.

[0101] In addition, according to the present embodiment, the cover portion 80a has a protruding wall portion 83 that protrudes from the opposing wall portion 81 toward the other circuit board of the first circuit board 61 and the second circuit board 62. In the present embodiment, the protruding wall portion 83 that protrudes toward the first circuit board 61 is the protruding wall portion 83a as the first protruding wall portion, and the protruding wall portion 83 that protrudes toward the second circuit board 62 is the protruding wall portion 83b as the second protruding wall portion. The protruding wall portion 83a and the protruding wall portion 83b are provided with the connector unit 70 interposed therebetween in the second horizontal direction Y. The protruding wall portion 83a as the first protruding wall portion protrudes from the opposing wall portion 81 toward the first circuit board 61. The protruding wall portion 83b as the second protruding wall portion protrudes from the opposing wall portion 81 toward the second circuit board 62. Therefore, the protruding wall portion 83a can be disposed close to the first ground layer 61g, and the protruding wall portion 83b can be disposed close to the second ground layer 62g. Thereby, the return current Ir1 can be easily propagated between the first ground layer 61g and the metal member 80 and between the second ground layer 62g and the metal member 80. Therefore, the return current Ir1 can flow more appropriately through the metal member 80, and the useless radiation noise caused by the current Is1 flowing through the connector unit 70 can be more appropriately suppressed.

[0102] In addition, according to the present embodiment, a gap is provided between the protruding wall portion 83 and each circuit board. Therefore, signal lines 61d and 62d connected to the connector unit 70 can be formed in the portions of the upper surfaces of the respective circuit boards that face the protruding wall portion 83. Thereby, complication of the wiring pattern formed on each circuit board can be suppressed.

[0103] In addition, according to the present embodiment, the cover portion 80a has a connecting wall portion 84 that connects at least one of the first connecting portion 85a and the second connecting portion 85b to the opposing wall portion 81. The connecting wall portion 84 faces the connector unit 70 in the first horizontal direction X perpendicular to both the vertical direction Z and the second horizontal direction Y. Therefore, at least one of the first connecting portion 85a and the second connecting portion 85b can be connected to the opposing wall portion 81 by the connecting wall portion 84 to support the opposing wall portion 81. Thereby, the opposing wall portion 81 can be appropriately disposed at a position facing the connector unit 70 in the vertical direction Z. In addition, the connector unit 70 can be covered by the connecting wall portion 84 in the first horizontal direction X, so that a part of the electromagnetic wave generated from the connector unit 70 can be blocked by the connecting wall portion 84. Thereby, leakage of the electromagnetic wave generated from the connector unit 70 to the outside of the circuit board unit 60 can be further suppressed.

[0104] In addition, according to the present embodiment, the cover portion 80a has a connecting wall portion 84a as a first connecting wall portion, and a connecting wall portion 84b as a second connecting wall portion, which is disposed on the side opposite to the connecting wall portion 84a as the first connecting wall portion and is connected to the opposing wall portion 81. The connecting wall portion 84a and the connecting wall portion 84b are provided with the connector unit 70 therebetween in the first horizontal direction X. Therefore, the opposing wall portion 81 can be supported by the connecting wall portion 84a and the connecting wall portion 84b. Thus, the opposing wall portion 81 can be disposed more stably with respect to the connector unit 70. In addition, it is possible to suppress the opposing wall portion 81 from being cantilever-supported in the first horizontal direction X, and thus it is possible to suppress electrical vibration at the end portion of the opposing wall portion 81 in the first horizontal direction X. Thereby, it is possible to suppress the opposing wall portion 81 from becoming an antenna that emits useless radiation noise.

[0105] In addition, according to the present embodiment, a pair of fixing portions 82a, 82b respectively connected to the pair of connecting wall portions 84a, 84b are provided, and a first connecting portion 85a and a second connecting portion 85b are respectively provided in the respective fixing portions 82a, 82b. Therefore, the first ground layer 61g and the second ground layer 62g can be more appropriately electrically connected by the pair of first connecting portions 85a and the pair of second connecting portions 85b. Thus, the potential of each ground layer can be more appropriately stabilized. Therefore, it is possible to more appropriately suppress useless radiation noise caused by the current Is1 flowing along each ground layer to the signal lines 61d, 62d, etc.

[0106] In addition, according to the present embodiment, the metal member 80 is a metal plate member. The protruding wall portion 83 is a portion bent in the up-and-down direction Z from the edge portion of the opposing wall portion 81 in the second horizontal direction Y. The connecting wall portion 84 is a portion bent in the up-and-down direction Z from the edge portion of the opposing wall portion 81 in the first horizontal direction X. In this way, by separately bending the protruding wall portion 83 and the connecting wall portion 84 with respect to the opposing wall portion 81, it is possible to easily adjust the size of the protruding wall portion 83 in the up-and-down direction Z and the size of the connecting wall portion 84 in the up-and-down direction Z separately. Therefore, the cover portion 80a can be easily manufactured according to the size of the connector unit 70 in the up-and-down direction Z, etc.

[0107] In addition, according to the present embodiment, the cover portion 80a has bent portions 83c, 83d bent from the edge portion of the protruding wall portion 83 in the first horizontal direction X to the second horizontal direction Y. At least a part of the bent portions 83c, 83d is disposed between the connecting wall portion 84 and the connector unit 70 in the first horizontal direction X. Therefore, it is possible to block at least a part of the gap between the protruding wall portion 83 and the connecting wall portion 84 generated when the protruding wall portion 83 and the connecting wall portion 84 are respectively bent, by the bent portions 83c, 83d. Thereby, the connector unit 70 can be more appropriately covered by the cover portion 80a, and it is possible to further suppress the leakage of electromagnetic waves generated from the connector unit 70 to the outside.

[0108] In addition, according to the present embodiment, the plate surface of the first circuit board 61 and the plate surface of the second circuit board 62 are parallel to each other. The first circuit board 61 and the second circuit board 62 are arranged and disposed in the second horizontal direction Y along the plate surface of the first circuit board 61 and the plate surface of the second circuit board 62. Therefore, it is easy to form the metal component 80 into a relatively simple structure, and it is easy to appropriately cover the connector unit 70 connecting the first circuit board 61 and the second circuit board 62 by the cover portion 80a.

[0109] In addition, according to the present embodiment, the first connection portion 85a and the second connection portion 85b are connected to each other. Therefore, compared with the case where the first connection portion 85a and the second connection portion 85b are separately provided, the complication of the structure of the metal component 80 can be suppressed. In addition, the first ground layer 61g and the second ground layer 62g can be electrically connected via the mutually connected first connection portion 85a and second connection portion 85b. Therefore, it is easy to more appropriately electrically connect the first ground layer 61g and the second ground layer 62g.

[0110] In addition, according to the present embodiment, the first connecting member 71b of the first connector 71 protrudes from the first housing 71a that holds the first connecting member 71b. The opposing wall portion 81 opposes the first connecting member 71b and the first housing 71a in the vertical direction Z perpendicular to the plate surface of the first circuit board 61. The end portion of the opposing wall portion 81 on the side where the first connecting member 71b protrudes from the first housing 71a is located outside the end portion of the first connecting member 71b on the side where the first connecting member 71b protrudes from the first housing 71a. Therefore, it is easy to appropriately cover the first connector 71 from above by the opposing wall portion 81. In addition, when a protruding wall portion 83a protruding downward is provided at the end portion of the opposing wall portion 81 on the side where the first connecting member 71b protrudes from the first housing 71a, the protruding wall portion 83a can be arranged at a position that does not overlap with the first connecting member 71b in the vertical direction Z. Therefore, contact between the lower end portion of the protruding wall portion 83a and the first connecting member 71b can be suppressed, and the lower end portion of the protruding wall portion 83a can be appropriately close to the first circuit board 61. As a result, it is possible to make the return current Ir1 flow more easily between the protruding wall portion 83a and the first ground layer 61g. The same applies to the relationship between the second connecting member 72b of the second connector 72 and the opposing wall portion 81.

[0111] Hereinafter, embodiments different from the above-described embodiment will be described. In the description of each of the following embodiments, for structures that are the same as those described before the description of each embodiment, the description may be omitted by appropriately assigning the same reference numerals and the like. In addition, for parts corresponding to the respective parts of the structure described before the description of each embodiment, the same names are assigned and different reference numerals are assigned, and points different from the above-described structure are described, and points the same as the above-described structure may be omitted from the description. In addition, as the structures for which the description is omitted in each of the following embodiments, within a non-contradictory range, the same structures as those described before each embodiment can be adopted.

[0112] <Second Embodiment>

[0113] In this embodiment, the shape of the metal component 280 is different from that of the first embodiment. Figure 7 It is a cross-sectional view showing the metal component 280 of this embodiment. As Figure 7 shown, the cover portion 280a of the metal component 280 is different from the cover portion 80a of the first embodiment and does not have the bent portions 83c and 83d. Therefore, the bending process for forming the bent portions 83c and 83d is not required. As a result, the metal component 280 can be easily manufactured. Other structures of the cover portion 280a are the same as those of the cover portion 80a in the first embodiment. Other structures of the metal component 280 are the same as those of the metal component 80 in the first embodiment.

[0114] <Third Embodiment>

[0115] In this embodiment, the shape of the metal component 380 is different from that of the first embodiment. Figure 8 It is a perspective view showing a part of the circuit board unit 360 of this embodiment. Figure 9 It is a cross-sectional view showing a part of the circuit board unit 360 of this embodiment. As Figure 8 and Figure 9 shown, in the cover portion 380a of the metal component 380, a pair of protruding wall portions 383a and 383b and a pair of connecting wall portions 384a and 384b are connected to each other in the direction of surrounding the connector unit 70, and a four-sided frame-shaped wall portion surrounding the connector unit 70 along an axis extending in the vertical direction Z is formed. In this embodiment, the cover portion 380a is formed by performing a drawing process on a metal plate. The upper end portions of the four-sided frame-shaped wall portion formed by the pair of protruding wall portions 383a and 383b and the pair of connecting wall portions 384a and 384b are connected to the outer peripheral edge portion of the opposing wall portion 381 over the entire circumference.

[0116] As Figure 9As shown, the protruding wall portion (first protruding wall portion) 383a is in contact with the first circuit board 361. More specifically, the lower end portion of the protruding wall portion 383a is in contact with the upper surface of the first circuit board 361. A protruding edge portion 383f that protrudes toward the other side in the second horizontal direction, that is, the -Y side, is formed at the lower end portion of the protruding wall portion 383a. The protruding edge portion 383f is in contact with the upper surface of the first circuit board 361. As Figure 8 shown, the protruding edge portion 383f extends in the first horizontal direction X and connects the fixing portion 382a and the fixing portion 382b. The fixing portions 382a and 382b are the same as the fixing portions 82a and 82b in the first embodiment except that the engaging claw portions 82g and 82h are not provided.

[0117] As Figure 9 shown, the protruding wall portion (second protruding wall portion) 383b is in contact with the second circuit board 362. More specifically, the lower end portion of the protruding wall portion 383b is in contact with the upper surface of the second circuit board 362. A protruding edge portion 383g that protrudes toward one side in the second horizontal direction, that is, the +Y side, is formed at the lower end portion of the protruding wall portion 383b. The protruding edge portion 383g is in contact with the upper surface of the second circuit board 362. The protruding edge portion 383g extends in the first horizontal direction X and connects the fixing portion 382a and the fixing portion 382b. Other structures of the cover portion 380a are the same as those of the cover portion 380a in the first embodiment. Other structures of the metal member 380 are the same as those of the metal member 80 in the first embodiment.

[0118] A pad portion 361e that is electrically connected to the first connection member 71b is formed on the upper surface of the first circuit board 361. A signal line 361c is formed on the lower surface of the first circuit board 361. The pad portion 361e and the signal line 361c are electrically connected by a conduction portion 361d. The conduction portion 361d is, for example, a through hole that penetrates the first circuit board 361 in the vertical direction Z. In the present embodiment, the first connection member 71b is electrically connected to the signal line 361c via the conduction portion 361d formed in the first circuit board 361, and the signal line 361c is provided on the surface of the first circuit board 361 that is opposite to the surface on which the first connection member 71b is connected. Other structures of the first circuit board 361 are the same as those of the first circuit board 61 in the first embodiment.

[0119] On the upper surface of the second circuit board 362, a pad portion 362e electrically connected to the second connection member 72b is formed. On the lower surface of the second circuit board 362, a signal line 362c is formed. The pad portion 362e and the signal line 362c are electrically connected through a conduction portion 362d. The conduction portion 362d is, for example, a through hole that penetrates the second circuit board 362 in the vertical direction Z. In the present embodiment, the second connection member 72b is electrically connected to the signal line 362c via the conduction portion 362d formed in the second circuit board 362, and the signal line 362c is provided on the surface of the second circuit board 362 on the side opposite to the surface to which the second connection member 72b is connected. Other structures of the second circuit board 362 are the same as those of the second circuit board 62 in the first embodiment. Other structures of the circuit board unit 360 are the same as those of the circuit board unit 60 in the first embodiment.

[0120] According to the present embodiment, the protruding wall portion 383a contacts the first circuit board 361. Therefore, the protruding wall portion 383a can be appropriately arranged close to the first ground layer 61g. Thereby, the return current Ir1 can flow more easily between the protruding wall portion 383a and the first ground layer 61g. In addition, according to the present embodiment, the protruding wall portion 383b contacts the second circuit board 362. Therefore, the protruding wall portion 383b can be appropriately arranged close to the second ground layer 62g. Thereby, the return current Ir1 can flow more easily between the protruding wall portion 383b and the second ground layer 62g.

[0121] In addition, according to the present embodiment, the first connection member 71b is electrically connected to the signal line 361c provided on the surface of the first circuit board 361 on the side opposite to the surface to which the first connection member 71b is connected via the conduction portion 361d formed in the first circuit board 361. Therefore, even if the protruding wall portion 383a contacts the first circuit board 361, the first connection member 71b can be appropriately connected to the signal line 361c. In addition, according to the present embodiment, the second connection member 72b is electrically connected to the signal line 362c provided on the surface of the second circuit board 362 on the side opposite to the surface to which the second connection member 72b is connected via the conduction portion 362d formed in the second circuit board 362. Therefore, even if the protruding wall portion 383b contacts the second circuit board 362, the second connection member 72b can be appropriately connected to the signal line 362c.

[0122] In addition, according to the present embodiment, the upper end portions of the four-frame-shaped wall portions formed by the pair of protruding wall portions 383a and 383b and the pair of connecting wall portions 384a and 384b are connected to the outer peripheral edge portion of the opposing wall portion 381 over the entire circumference. Therefore, by means of this four-frame-shaped wall portion, it is possible to surround the connector unit 70 over the entire circumference around the axis extending in the vertical direction Z, and to suppress the generation of gaps between the opposing wall portion 381, the protruding wall portions 383a and 383b, the connecting wall portion (first connecting wall portion) 384a, and the connecting wall portion (second connecting wall portion) 384b. As a result, it is possible to more easily shield the electromagnetic waves generated from the connector unit 70 by the cover portion 380a. Therefore, it is possible to more appropriately suppress the leakage of the electromagnetic waves generated from the connector unit 70 to the outside. In addition, in the case of such a structure, by performing a drawing process on the metal plate, it is possible to easily form the cover portion 380a having the opposing wall portion 381, the pair of protruding wall portions 383a and 383b, and the pair of connecting wall portions 384a and 384b. Therefore, it is possible to easily manufacture the metal component 380.

[0123] In addition, in the present embodiment, as Figure 9 shown by the double-dashed line in the figure, the signal line 361c may also be provided in the inner layer of the first circuit board 361. Even in this case, it is possible to bring the protruding wall portion 383a into contact with the first circuit board 361 and appropriately connect the first connector 71b to the signal line 361c. In addition, as Figure 9 shown by the double-dashed line in the figure, the signal line 362c may also be provided in the inner layer of the second circuit board 362. In this case, it is also possible to bring the protruding wall portion 383b into contact with the second circuit board 362 and appropriately connect the second connector 72b to the signal line 362c.

[0124] <Fourth Embodiment>

[0125] The difference between the present embodiment and the third embodiment is that the protruding wall portions 383a and 383b of the metal component 380 are electrically connected to the respective ground layers. Figure 10 It is a cross-sectional view showing a part of the circuit board unit 460 of the present embodiment. As Figure 10 shown, a ground pad portion 461e is formed on the upper surface of the first circuit board 461. In the present embodiment, the ground pad portion 461e and the pad portion 361e are provided on the same layer and are electrically connected to the first ground layer 61g via a through hole 461f formed in the first insulating layer 61a. In addition, the ground pad portion 461e may also be a part of the first ground layer 61g that is exposed on the upper surface of the first circuit board 461 through an opening formed in the first insulating layer 61a. The lower end portion of the protruding wall portion 383a is in contact with the ground pad portion 461e. Thus, the protruding wall portion 383a is electrically connected to the first ground layer 61g via the ground pad portion 461e.

[0126] On the upper surface of the second circuit board 462, a ground pad portion 462e is formed. In the present embodiment, the ground pad portion 462e and the pad portion 362e are provided on the same layer and are electrically connected to the second ground layer 62g via a through hole 462f formed in the second insulating layer 62a. In addition, the ground pad portion 462e may be a part of the second ground layer 62g that is exposed on the upper surface of the second circuit board 462 through an opening formed in the second insulating layer 62a. The lower end portion of the protruding wall portion 383b contacts the ground pad portion 462e. Thus, the protruding wall portion 383b is electrically connected to the second ground layer 62g via the ground pad portion 462e.

[0127] Other structures of the first circuit board 461 are the same as those of the first circuit board 361 in the third embodiment. Other structures of the second circuit board 462 are the same as those of the second circuit board 362 in the third embodiment. Other structures of the circuit board unit 460 are the same as those of the circuit board unit 360 in the third embodiment.

[0128] According to the present embodiment, the protruding wall portion 383a is electrically connected to the first ground layer 61g via the ground pad portion 461e formed on the board surface of the first circuit board 461. Therefore, the first ground layer 61g can be electrically connected to the metal component 380. Thus, the return current Ir1 can flow more easily between the protruding wall portion 383a and the first ground layer 61g. In addition, according to the present embodiment, the protruding wall portion 383b is electrically connected to the second ground layer 62g via the ground pad portion 462e formed on the board surface of the second circuit board 462. Therefore, the second ground layer 62g can be electrically connected to the metal component 380. Thus, the return current Ir1 can flow more easily between the protruding wall portion 383b and the second ground layer 62g.

[0129] <Fifth Embodiment>

[0130] This embodiment is different from the first embodiment in that the protruding wall portions 83a and 83b and the bent portions 83c and 83d are not provided on the metal component 580. Figure 11 It is a perspective view showing a part of the circuit board unit 560 of this embodiment. Figure 12 It is a top view showing a part of the circuit board unit 560 of this embodiment. Figure 13 It is a cross-sectional view showing a part of the circuit board unit 560 of this embodiment, which is a Figure 12 cross-sectional view taken along XIII-XIII in

[0131] As Figures 11 to 13As shown, in the circuit board unit 560 of the present embodiment, the cover portion 580a of the metal component 580 is different from that of the first embodiment and does not have the protruding wall portions 83a, 83b and the bent portions 83c, 83d. Other structures of the cover portion 580a are the same as those of the cover portion 80a in the first embodiment. The metal component 580 has the same fixing portions 382a, 382b as those in the third embodiment. Other structures of the metal component 580 are the same as those of the metal component 80 in the first embodiment. Other structures of the circuit board unit 560 are the same as those of the circuit board unit 60 in the first embodiment.

[0132] As Figure 12 shown, in the present embodiment, when the current Is1 flows through the connector unit 70, return currents Ir2, Ir3 flowing through different paths are generated. In addition, in Figures 11 to 13 , an example of the case where the current Is1 flows from the first circuit board 61 to the second circuit board 62 is shown.

[0133] As Figure 13 shown, the return current Ir2 is the return current flowing through the opposed wall portion 81. In the present embodiment, since the protruding wall portions 83a, 83b are not provided, the return current Ir2 flowing in the second ground layer 62g directly propagates to the edge portion on the second horizontal direction side of the opposed wall portion 81. In this case, the return current Ir2 flows in the opposed wall portion 81 in a state of electric field distribution. The return current Ir2 flowing in the opposed wall portion 81 in a state of electric field distribution flows from the edge portion on the other second horizontal direction side of the opposed wall portion 81 to the first ground layer 61g. In Figure 11 , the return current Ir2 generated by the current Is1 flowing through a pair of the first connecting members 71b and the second connecting members 72b is indicated by a dotted arrow. The return current Ir2 flowing in a state of electric field distribution is larger closer to the first connecting member 71b and the second connecting member 72b and smaller farther away from the first connecting member 71b and the second connecting member 72b.

[0134] As Figure 12 shown, the return current Ir3 is the return current flowing through the fixing portions 382a, 382b. The return current Ir3 includes the return current Ir3 flowing from the second ground layer 62g of the second circuit board 62 to the first ground layer 61g of the first circuit board 61 through the fixing portion 382a and the return current Ir3 flowing from the second ground layer 62g of the second circuit board 62 to the first ground layer 61g of the first circuit board 61 through the fixing portion 382b. The amount of the return current Ir3 is larger than the amount of the return current Ir2. The return current Ir2 and the return current Ir3 branch from the second ground layer 62g, flow through different portions of the metal component 580, and merge at the first ground layer 61g.

[0135] As described above, in the present embodiment, the return currents Ir2 and Ir3 corresponding to the current Is1 flowing through the connector unit 70 also appropriately flow through the metal member 580. Therefore, it is possible to appropriately suppress the generation of unnecessary radiation noise caused by the current flowing through the connector unit 70.

[0136] In addition, according to the present embodiment, it is not necessary to provide the protruding wall portions 83a and 83b on the metal member 580, so the structure of the metal member 580 can be further simplified. Thereby, the metal member 580 can be more easily manufactured.

[0137] <Sixth Embodiment>

[0138] In the present embodiment, compared with the first embodiment, the relative arrangement of the first circuit board 661 and the second circuit board 662 is different. Figure 14 FIG. is a perspective view showing a part of the circuit board unit 660 of the present embodiment. Figure 15 FIG. is a cross-sectional view showing a part of the circuit board unit 660 of the present embodiment.

[0139] As Figure 14 and Figure 15 shown, in the present embodiment, the plate surfaces of the first circuit board 661 and the second circuit board 662 face in directions intersecting each other. More specifically, the plate surface of the first circuit board 661 faces the second horizontal direction Y. The plate surface of the second circuit board 662 faces the vertical direction Z. The first circuit board 661 is separately arranged above the end portion on the other side, i.e., the -Y side, in the second horizontal direction of the second circuit board 662. In the present embodiment, when viewed from the first horizontal direction X, the first circuit board 661 and the second circuit board 662 are arranged along an L shape.

[0140] In addition, in the present embodiment, the "first direction" perpendicular to the plate surface of the first circuit board 661 is the second horizontal direction Y. The "second direction" perpendicular to the first direction is the vertical direction Z. The "third direction" perpendicular to both the first direction and the second direction is the first horizontal direction X.

[0141] The first connector 671 and the second connector 672 of the connector unit 670 are connected in the vertical direction Z. The first connector 671 is located above the second connector 672. The first connector 671 is the same as the first connector 71 in the first embodiment except that the orientation of the first circuit board 661 to which it is mounted is different. As Figure 15As shown, the first connector 671 has a first housing 671a as a holding portion and a first connecting member 671b held by the first housing 671a. The first connecting member 671b has a first extension portion 671c, a second extension portion 671d, and a substrate connecting portion 671e. The first extension portion 671c extends in the vertical direction Z. The lower end portion of the first extension portion 671c is exposed within a recess (not shown) formed in the downward side opening of the first housing 671a. The upper end portion of the first extension portion 671c protrudes upward from the first housing 671a and is exposed from the first housing 671a. Thus, the first connecting member 671b of the first connector 671 protrudes upward from the first housing 671a.

[0142] The second extension portion 671d extends from the upper end portion of the first extension portion 671c toward the other side in the second horizontal direction, that is, the -Y side and the obliquely upward side direction. The substrate connecting portion 671e extends upward from the end portion on the other side in the second horizontal direction of the second extension portion 671d. The substrate connecting portion 671e is electrically connected to the signal line 661d formed on the surface on the first horizontal direction side, that is, the +Y side, of the first circuit board 661.

[0143] The second connector 672 has a second housing 672a as a holding portion and a second connecting member 672b held by the second housing 672a. The second connecting member 672b has a first extension portion 672c, a second extension portion 672d, a third extension portion 672f, and a substrate connecting portion 672e. The first extension portion 672c extends in the second horizontal direction Y. The end portion on the first horizontal direction side, that is, the +Y side, of the first extension portion 672c protrudes from the second housing 672a toward the first horizontal direction side and is exposed from the second housing 672a. Thus, the second connecting member 672b of the second connector 672 protrudes from the second housing 672a in the second horizontal direction Y. The second extension portion 672d extends from the end portion on the first horizontal direction side of the first extension portion 672c downward and obliquely toward the first horizontal direction side. The substrate connecting portion 672e extends from the lower end portion of the second extension portion 672d toward the first horizontal direction side. The substrate connecting portion 672e is electrically connected to the signal line 662d formed on the upper surface of the second circuit board 662.

[0144] The third extension portion 672f extends upward from the end portion on the other side in the second horizontal direction, that is, the -Y side, of the first extension portion 672c. The upper end portion of the third extension portion 672f is inserted into a recess (not shown) formed in the first housing 671a and contacts the first extension portion 671c of the first connecting member 671b exposed within the recess. Thus, the first connecting member 671b and the second connecting member 672b are electrically connected to each other.

[0145] As Figure 14As shown, the metal component 680 is a metal plate component. The metal component 680 has a cover portion 680a and fixing portions 682a, 682b, 682c, 682d. The cover portion 680a has an opposing wall portion 681 and a bent portion 684. The opposing wall portion 681 has a first portion 681a and a second portion 681b. The first portion 681a and the second portion 681b are connected to each other and bent with respect to each other.

[0146] The first portion 681a is a portion that opposes the connector unit 670 in the second horizontal direction Y perpendicular to the plate surface of the first circuit board 661. In the present embodiment, the first portion 681a is a substantially rectangular plate shape with a plate surface facing the second horizontal direction Y and being long in the first horizontal direction X. The first portion 681a is located on the second horizontal direction side, i.e., the +Y side, of the first connector 671 and the second connector 672, and opposes the first connector 671 and the second connector 672 with a gap in the second horizontal direction Y.

[0147] As Figure 15 shown, the first portion 681a opposes the first side surface 671g in the side surfaces of the first connector 671. The first side surface 671g is a surface on the second horizontal direction side, i.e., the +Y side, of the first housing 671a. The first portion 681a also opposes the side surface 672g on the second horizontal direction side of the second housing 672a. In the present embodiment, the first portion 681a covers the entire connector unit 670 except for the lower end portion of the second connector 672 from the second horizontal direction side. The first portion 681a is located at a position separated from the upper side of the second circuit board 662. The lower end portion of the first portion 681a is lower than the first extension portion 672c and higher than the substrate connection portion 672e. When observed in the second horizontal direction Y perpendicular to the plate surface of the first circuit board 661, the first portion 681a overlaps with the first circuit board 661, and when observed in the vertical direction Z perpendicular to the plate surface of the second circuit board 662, the first portion 681a overlaps with the second circuit board 662.

[0148] The first portion 681a is closer to the second horizontal direction side, i.e., the +Y side, than the substrate connection portion 672e. In the present embodiment, the first portion 681a is an end portion on the second horizontal direction side of the opposing wall portion 681. That is, the end portion of the opposing wall portion 681 on the second horizontal direction side, i.e., the +Y side, where the second connecting member 672b protrudes from the second housing 672a as a holding portion, is located outside the end portion of the second connecting member 672b on the side where the second connecting member 672b protrudes from the second housing 672a.

[0149] The distance in the second horizontal direction Y between the first part 681a and the first housing 671a of the first connector 671 is, for example, smaller than the dimension of the connector unit 670 in the up-and-down direction Z. The distance in the second horizontal direction Y between the first part 681a and the first housing 671a is, for example, smaller than the dimension of the first connector 671 in the up-and-down direction Z and the dimension of the second connector 672 in the up-and-down direction Z. The distance in the second horizontal direction Y between the first part 681a and the first housing 671a is, for example, about 0.5 mm or more and 20 mm or less. The distance in the second horizontal direction Y between the first part 681a and the first housing 671a is, for example, preferably less than 10 mm. The distance in the second horizontal direction Y between the first part 681a and the first housing 671a is the same as the distance in the second horizontal direction Y between the first part 681a and the second housing 672a.

[0150] The second part 681b is a part that faces the connector unit 670 in the up-and-down direction Z perpendicular to the board surface of the second circuit board 662. As Figure 14 shown, in the present embodiment, the second part 681b is a substantially rectangular plate shape with the board surface facing the up-and-down direction Z and being long in the first horizontal direction X. The second part 681b protrudes from the upper end of the first part 681a to the other side in the second horizontal direction, that is, the -Y side. In the present embodiment, the second part 681b is a part bent from the upper end of the first part 681a to the other side in the second horizontal direction, that is, the -Y side.

[0151] The second part 681b is located above the first connector 671 and faces the first connector 671 with a gap in the up-and-down direction Z. As Figure 15 shown, the second part 681b faces the second side surface 671h of the first connector 671 that is different from the first side surface 671g. The second side surface 671h is the upper surface of the first housing 671a. In the present embodiment, the second part 681b covers the entire connector unit 670 from above except for the end on the other side in the second horizontal direction, that is, the -Y side, of the first connector 671. The second part 681b is located at a position separated from the first circuit board 661 on the first horizontal direction side, that is, the +Y side. The end on the other side in the second horizontal direction of the second part 681b is on the other side in the second horizontal direction than the first extension part 671c and on the first horizontal direction side than the board connection part 671e. When observed in the second horizontal direction Y perpendicular to the board surface of the first circuit board 661, the second part 681b overlaps with the first circuit board 661, and when observed in the up-and-down direction Z perpendicular to the board surface of the second circuit board 662, the second part 681b overlaps with the second circuit board 662.

[0152] The second part 681b is located above the substrate connection part 671e. In the present embodiment, the second part 681b is the upper end of the opposing wall part 681. That is, the opposing wall part 681 is located outside the end of the first connecting member 671b on the side where the first connecting member 671b protrudes from the first housing 671a serving as a holding part, that is, the upper end, compared to the end of the first connecting member 671b on the side where the first connecting member 671b protrudes from the first housing 671a.

[0153] The distance in the vertical direction Z between the second part 681b and the first housing 671a is, for example, smaller than the dimension of the connector unit 70 in the second horizontal direction Y. The distance in the vertical direction Z between the second part 681b and the first housing 671a is, for example, smaller than the distance in the second horizontal direction Y between the first part 681a and the first housing 671a. The distance in the vertical direction Z between the second part 681b and the first housing 671a is, for example, about 0.5 mm or more and 20 mm or less. The distance in the vertical direction Z between the second part 681b and the first housing 671a is, for example, preferably less than 10 mm.

[0154] As Figure 14 shown, the bending part 684 is the part that bends from the first part 681a and connects the first part 681a and the first connecting part 685a. In the present embodiment, the bending part 684 bends from the first part 681a to the other side in the second horizontal direction, that is, the -Y side. In the present embodiment, the bending part 684 is a substantially rectangular plate shape with the plate surface facing the first horizontal direction X and being long in the second horizontal direction Y. The bending part 684 is provided with a pair of bending parts 684a and 684b. The bending part 684a extends from the edge of the first part 681a on the first horizontal direction side, that is, the +X side, to the other side in the second horizontal direction. The bending part 684b extends from the edge of the first part 681a on the other side in the first horizontal direction, that is, the -X side, to the other side in the second horizontal direction. The pair of bending parts 684a and 684b are arranged with the connector unit 670 therebetween in the first horizontal direction X. The bending part 684a connects the first part 681a and the first connecting part 685a in the fixing part 682a. The bending part 684b connects the first part 681a and the first connecting part 685a in the fixing part 682b.

[0155] The fixing portions 682a and 682b are the portions fixed to the first circuit board 661. The fixing portion 682a has a first connecting portion 685a and a cylindrical portion 682j. The first connecting portion 685a is a substantially rectangular plate shape with the plate surface facing the second horizontal direction Y and being long in the vertical direction Z. The first connecting portion 685a of the fixing portion 682a protrudes from the end portion on the other side, i.e., the -Y side, of the bending portion 684a in the second horizontal direction to the first horizontal direction side, i.e., the +X side. The first connecting portion 685a of the fixing portion 682a is electrically connected to the first ground layer 61g via the first ground pad portion 661i. The cylindrical portion 682j is a cylindrical shape protruding from the first connecting portion 685a to the second horizontal direction side, i.e., the +Y side. An internal threaded hole 682h penetrating the first connecting portion 685a and the cylindrical portion 682j in the second horizontal direction Y is formed in the fixing portion 682a. A bolt 691 for fixing the fixing portion 682a to the first circuit board 661 is screwed into the internal threaded hole 682h from the other side in the second horizontal direction, i.e., the -Y side.

[0156] The fixing portion 682b is symmetrically arranged with the fixing portion 682a in the first horizontal direction X. The first connecting portion 685a of the fixing portion 682b protrudes from the end portion on the other side in the second horizontal direction of the bending portion 684b to the other side in the first horizontal direction, i.e., the -X side. The first connecting portion 685a of the fixing portion 682b is electrically connected to the first ground layer 61g via the first ground pad portion 661j. Other structures of the fixing portion 682b are the same as those of the fixing portion 682a.

[0157] The fixing portions 682c and 682d are the portions fixed to the second circuit board 662. The fixing portion 682c has a second connecting portion 685b, a cylindrical portion 682r, and a connecting arm portion 682k. The connecting arm portion 682k is connected to the lower end portion of the edge portion on the first horizontal direction side, i.e., the +X side, of the first portion 681a. The connecting arm portion 682k protrudes downward from the first portion 681a. In the present embodiment, the connecting arm portion 682k is a substantially rectangular plate shape with the plate surface facing the second horizontal direction Y.

[0158] The second connecting portion 685b of the fixing portion 682c protrudes from the lower end portion of the connecting arm portion 682k toward the second horizontal direction side, that is, the +Y side. The second connecting portion 685b is a substantially square plate shape with the plate surface facing the vertical direction Z. The second connecting portion 685b of the fixing portion 682c is electrically connected to the second ground layer 62g via the second ground pad portion 662i. In the present embodiment, the first connecting portion 685a and the second connecting portion 685b are not directly connected to each other. That is, the first connecting portion 685a and the second connecting portion 685b are separated from each other. The cylindrical portion 682r is a cylindrical shape protruding upward from the second connecting portion 685b. An internal threaded hole 682p penetrating the second connecting portion 685b and the cylindrical portion 682r in the vertical direction Z is formed in the fixing portion 682c. The bolt 692 for fixing the fixing portion 682c to the second circuit board 662 is screwed into the internal threaded hole 682p from the lower side.

[0159] The fixing portion 682d and the fixing portion 682c are symmetrically arranged in the first horizontal direction X. The fixing portion 682d is connected to the lower end portion of the edge portion on the other side, that is, the -X side, of the first portion 681a in the first horizontal direction. The second connecting portion 685b of the fixing portion 682d is electrically connected to the second ground layer 62g via the second ground pad portion 662j. Other structures of the fixing portion 682d are the same as other structures of the fixing portion 682c.

[0160] Between the first circuit board 661 and the second circuit board 662, a current Is2 flows through the connector unit 670 to transmit a signal. In Figure 15 example, the current Is2 flowing from the first circuit board 661 to the second circuit board 662 is indicated by a dotted arrow. The current Is2 sequentially flows through the first connector 671b and the second connector 672b from the signal line 661d formed on the first circuit board 661, and flows through the signal line 662d formed on the second circuit board 662. When the current Is2 flows in this way, a return current Ir4 corresponding to the current Is2 flows.

[0161] In Figure 15In the example, the return current Ir4 indicated by the dashed arrow is a return current that flows from the second ground layer 62g of the second circuit board 662 to the first ground layer 61g of the first circuit board 661. After the return current Ir4 flows through the portion of the second ground layer 62g located below the signal line 662d in a direction opposite to the current Is2, it flows from the second ground layer 62g to the first portion 681a of the opposed wall portion 681. Here, the second ground layer 62g and the first portion 681a are not connected by a conductor, but the return current Ir4 generated with respect to the high-frequency current Is2 can propagate from the second ground layer 62g to the first portion 681a through capacitive coupling in space. The return current Ir4 flowing through the first portion 681a flows from the first portion 681a to the second portion 681b and from the second portion 681b to the first ground layer 61g of the first circuit board 661. The second portion 681b and the first ground layer 61g are also not connected by a conductor, but the return current Ir4 generated with respect to the high-frequency current Is2 can propagate from the second portion 681b to the first ground layer 61g through capacitive coupling in space. The return current Ir4 flowing in the first ground layer 61g flows in a direction opposite to the current Is2 in the portion of the first ground layer 61g located on the other side of the second horizontal direction of the signal line 661d. Thus, in the present embodiment, the return path through which the return current Ir4 flows when the current Is2 flows through the connector unit 670 is formed by the metal member 680. Further, when the current Is2 flows from the second circuit board 662 to the first circuit board 661, the return current Ir4 flows in a direction opposite to the direction of the arrow of the dashed line Figure 15 shown and flows from the first ground layer 61g to the second ground layer 62g.

[0162] According to the present embodiment, the plate surfaces of the first circuit board 661 and the second circuit board 662 face in directions intersecting each other. The opposed wall portion 681 has a first portion 681a opposed to the connector unit 670 in the second horizontal direction Y perpendicular to the plate surface of the first circuit board 661, and a second portion 681b opposed to the connector unit 670 in the vertical direction Z perpendicular to the plate surface of the second circuit board 662. Therefore, the opposed wall portion 681 can be appropriately arranged with respect to the connector unit 670 that connects the first circuit board 661 and the second circuit board 662 with their plate surfaces intersecting each other, and a return path for the return current Ir4 to pass through the opposed wall portion 681 can be formed. Thereby, generation of useless radiation noise caused by the current flowing through the connector unit 670 can be appropriately suppressed. In addition, since the connector unit 670 can be covered from two different directions by the first portion 681a and the second portion 681b, it is easy to appropriately block the electromagnetic waves generated from the connector unit 670 by the opposed wall portion 681. Thereby, leakage of the electromagnetic waves generated from the connector unit 670 to the outside of the circuit board unit 660 can be suppressed.

[0163] Further, according to the present embodiment, the first portion 681a and the second portion 681b are connected to each other and bent with respect to each other. Therefore, by bending the opposed wall portion 681, the first portion 681a and the second portion 681b can be easily formed. Thereby, while simplifying the structure of the opposed wall portion 681, generation of useless radiation noise caused by the current flowing into the connector unit 670 can be appropriately suppressed.

[0164] Further, according to the present embodiment, the first connection portion 685a and the second connection portion 685b are separated from each other. Therefore, compared with the case where the first connection portion 685a and the second connection portion 685b are connected to each other, the degree of freedom in arranging the portions for connecting the respective connection portions on each circuit board can be increased. Therefore, according to the electronic components and wiring patterns mounted on each circuit board, etc., it is easy to appropriately arrange the portions for connecting the respective connection portions on each circuit board.

[0165] In addition, in the present embodiment, the first portion 681a can also be regarded as an "opposed wall portion", the second portion 681b can be regarded as a "projecting wall portion", and the bent portion 684 can be regarded as a "connecting wall portion". In this case, as the connecting wall portion, the bent portion 684 only connects the first connection portion 685a among the first connection portion 685a and the second connection portion 685b to the first portion 681a as the opposed wall portion.

[0166] Embodiments of the present disclosure are not limited to the above-described embodiments, and the following structures and methods can also be adopted. The metal component can be of any structure as long as it has a first connection portion, a second connection portion, and a cover portion. The number of the first connection portions and the number of the second connection portions only need to be one or more respectively, and there is no particular limitation. For example, in the above-described first embodiment, only one of the fixing portions 82a and 82b may be provided. Each connection portion can be connected to each circuit board in any manner. Each connection portion can also be connected to each circuit board by solder. The cover portion can be of any structure as long as it has an opposing wall portion. The entire opposing wall portion can also oppose the connector unit. In the above-described sixth embodiment, the opposing wall portion 681 may be composed of the first portion 681a without providing the second portion 681b.

[0167] The connector unit can be of any structure as long as it has a first connector and a second connector that are connected to each other. The first connector and the second connector can be connected to each other in any manner. The first circuit board and the second circuit board can be of any structure as long as they each have a ground layer. The first circuit board and the second circuit board can be arranged arbitrarily with respect to each other. The first circuit board and the second circuit board can also be flexible circuit boards.

[0168] In addition, in the above-described first embodiment, an example of applying the present disclosure to a transmissive projector has been described, but the present disclosure can also be applied to a reflective projector. Here, "transmissive" refers to a type in which a liquid crystal light valve such as a liquid crystal panel transmits light. "Reflective" refers to a type in which the liquid crystal light valve reflects light. In addition, the light modulation device is not limited to a liquid crystal panel or the like, and for example, it can also be a light modulation device using micromirrors.

[0169] In addition, in the above-described first embodiment, an example of the projector 1 using three light modulation devices 4R, 4G, and 4B has been described, but the present disclosure can also be applied to a projector using only one light modulation device or a projector using four or more light modulation devices.

[0170] In addition, the electronic device equipped with a circuit board and the electronic device equipped with a circuit board unit are not limited to projectors, and can also be other electronic devices.

[0171] In addition, the respective structures and respective methods described in this specification can be appropriately combined within a range where they do not conflict with each other.

[0172] [Summary of the Present Disclosure]

[0173] Hereinafter, the summary of the present disclosure is noted.

[0174] (Note 1)

[0175] A circuit board unit, characterized by comprising: a first circuit board having a first ground layer; a second circuit board having a second ground layer; a connector unit having a first connector mounted on the first circuit board and a second connector mounted on the second circuit board; and a metal component connecting the first circuit board and the second circuit board, the metal component having: a first connection portion electrically connected to the first ground layer; a second connection portion electrically connected to the second ground layer; and a cover portion covering at least a part of the connector unit, the cover portion having an opposing wall portion, at least a part of which opposes the connector unit in a direction perpendicular to the plane of the first circuit board, and when viewed in a direction perpendicular to the plane of the first circuit board, the opposing wall portion overlaps with the first circuit board, and when viewed in a direction perpendicular to the plane of the second circuit board, the opposing wall portion overlaps with the second circuit board.

[0176] According to this structure, the opposing wall portion can be arranged close to the connector unit, and it is easy for the return current to propagate between the first ground layer of the first circuit board and the opposing wall portion, and between the second ground layer of the second circuit board and the opposing wall portion. Thus, a return path for the return current to flow between the first circuit board and the second circuit board can be appropriately set by the metal component. Therefore, by utilizing the electromagnetic field generated by the return current flowing in the metal component, the electromagnetic field generated by the current flowing in the connector unit can be appropriately canceled. Therefore, the useless radiation noise generated by the current flowing through the connector unit connecting the first circuit board and the second circuit board can be appropriately suppressed. In other words, the energy balance between the current flowing through the connector unit and the return current is such that no excess energy is easily generated, so the useless radiation noise caused by this excess energy can be appropriately suppressed.

[0177] In addition, since the metal component has a first connection portion and a second connection portion, the first ground layer of the first circuit board and the second ground layer of the second circuit board can be electrically connected via the metal component. Thus, the potential of each ground layer can be more appropriately stabilized. Therefore, the useless radiation noise caused by the current flowing along each ground layer to a signal line or the like can be more appropriately suppressed.

[0178] In addition, through the metal component, a path for return current such as a first ground layer and a second ground layer can be provided relative to the connector unit. Therefore, even if the respective connection members of the connector unit are separated from the respective circuit boards, a path for return current can be provided relative to the respective connection members separated from the respective circuit boards through the metal component. As a result, compared with the case where the metal component is not provided, the path of the return current provided in each connection member and each wiring layer of the circuit board can be shortened. Therefore, the path of the return current of each connection member can be easily designed, and deterioration in the quality of the signal flowing through each connection member can be suppressed.

[0179] In addition, by covering at least a part of the connector unit with the cover portion of the metal component, at least a part of the electromagnetic wave generated from the connector unit can be blocked by the cover portion. As a result, leakage of the electromagnetic wave generated from the connector unit to the outside of the circuit board unit can be suppressed.

[0180] (Supplementary Note 2)

[0181] In the circuit board unit according to Supplementary Note 1, the cover portion has a first protruding wall portion that protrudes from the opposing wall portion toward one of the first circuit board and the second circuit board, and the first protruding wall portion faces the connector unit in a second direction perpendicular to the first direction, where the first direction is a direction perpendicular to the plane of the first circuit board.

[0182] According to this structure, the first protruding wall portion can be brought close to the first ground layer of the first circuit board or the second ground layer of the second circuit board. As a result, it becomes easy for the return current to propagate between the first ground layer or the second ground layer and the metal component. Therefore, the return current can flow more appropriately through the metal component, and generation of unnecessary radiation noise caused by the current flowing through the connector unit can be more appropriately suppressed. In addition, since the first protruding wall portion can cover the connector unit in the second direction, a part of the electromagnetic wave generated from the connector unit can be blocked by the first protruding wall portion. As a result, leakage of the electromagnetic wave generated from the connector unit to the outside of the circuit board unit can be further suppressed.

[0183] (Supplementary Note 3)

[0184] In the circuit board unit according to Supplementary Note 2, the cover portion has a second protruding wall portion that protrudes from the opposing wall portion toward the other of the first circuit board and the second circuit board, and the first protruding wall portion and the second protruding wall portion are provided with the connector unit interposed therebetween in the second direction, the first protruding wall portion protrudes from the opposing wall portion toward the first circuit board, and the second protruding wall portion protrudes from the opposing wall portion toward the second circuit board.

[0185] According to this structure, the first protruding wall portion can be arranged close to the first grounding layer, and the second protruding wall portion can be arranged close to the second grounding layer. Thus, it is possible to easily make the return current propagate between the first grounding layer and the metal component and between the second grounding layer and the metal component. Therefore, the return current can flow more appropriately through the metal component, and the generation of unnecessary radiation noise caused by the current flowing through the connector unit can be more appropriately suppressed.

[0186] (Supplementary Note 4)

[0187] In the circuit board unit according to Supplementary Note 2 or 3, a gap is provided between the first protruding wall portion and the one circuit board.

[0188] According to this structure, signal lines connected to the connector unit can be formed at a portion of the surface of the one circuit board that faces the first protruding wall portion. Thus, the complication of the wiring pattern formed on the one circuit board can be suppressed.

[0189] (Supplementary Note 5)

[0190] In the circuit board unit according to Supplementary Note 2 or 3, the first protruding wall portion is in contact with the one circuit board.

[0191] According to this structure, the first protruding wall portion can be appropriately arranged close to the grounding layer of the one circuit board. Thus, it is possible to make the return current flow more easily between the first protruding wall portion and the grounding layer.

[0192] (Supplementary Note 6)

[0193] In the circuit board unit according to Supplementary Note 5, the first protruding wall portion is electrically connected to the grounding layer provided on the one circuit board among the first grounding layer and the second grounding layer through a grounding pad portion formed on the surface of the one circuit board.

[0194] According to this structure, the grounding layer provided on the one circuit board can be electrically connected to the metal component. Thus, it is possible to make the return current flow more easily between the first protruding wall portion and the grounding layer.

[0195] (Supplementary Note 7)

[0196] In the circuit board unit according to Supplementary Note 5 or Supplementary Note 6, the connector unit has a connecting member electrically connected to the one circuit board, and the connecting member is electrically connected to a signal line provided on a surface of the one circuit board opposite to the side where the connecting member is connected or a signal line provided in an inner layer of the one circuit board through a conduction portion formed on the one circuit board.

[0197] According to this structure, even when the first protruding wall portion is brought into contact with a circuit board, the connecting member can be properly connected to the signal line.

[0198] (Supplementary Note 8)

[0199] The circuit board unit according to any one of Supplementary Notes 2-7, wherein the cover portion has a first connecting wall portion that connects at least one of the first connecting portion and the second connecting portion to the opposing wall portion, and the first connecting wall portion faces the connector unit in a third direction perpendicular to both the first direction and the second direction.

[0200] According to this structure, at least one of the first connecting portion and the second connecting portion can be connected to the opposing wall portion through the first connecting wall portion to support the opposing wall portion. Thereby, the opposing wall portion can be properly arranged at a position facing the connector unit in the first direction. In addition, since the connector unit can also be covered in the third direction by the first connecting wall portion, a part of the electromagnetic wave generated from the connector unit can be blocked by the first connecting wall portion. Thereby, the leakage of the electromagnetic wave generated from the connector unit to the outside of the circuit board unit can be further suppressed.

[0201] (Supplementary Note 9)

[0202] The circuit board unit according to Supplementary Note 8, wherein the cover portion has a second connecting wall portion that is arranged on the side opposite to the first connecting wall portion and is connected to the opposing wall portion, and the first connecting wall portion and the second connecting wall portion are provided with the connector unit interposed therebetween in the third direction.

[0203] According to this structure, the opposing wall portion can be supported by the first connecting wall portion and the second connecting wall portion. Thereby, the opposing wall portion can be arranged more stably with respect to the connector unit. In addition, the cantilever support of the opposing wall portion in the third direction can be suppressed, so that the vibration of the end portion of the opposing wall portion in the third direction can be suppressed. Thereby, it is possible to prevent the opposing wall portion from becoming an antenna that emits useless radiation noise.

[0204] (Supplementary Note 10)

[0205] The circuit board unit according to Supplementary Note 8 or 9, wherein the metal member is a metal plate member, the first protruding wall portion is a portion bent from the edge portion of the opposing wall portion in the second direction toward the first direction, and the first connecting wall portion is a portion bent from the edge portion of the opposing wall portion in the third direction toward the first direction.

[0206] According to this structure, by separately bending the first protruding wall portion and the first connecting wall portion with respect to the opposing wall portion, it is possible to easily and separately adjust the dimension in the first direction of the first protruding wall portion and the dimension in the first direction of the first connecting wall portion. Therefore, it is possible to easily manufacture the cover portion according to the dimension in the first direction of the connector unit and the like.

[0207] (Supplementary Note 11)

[0208] According to the circuit board unit described in Supplementary Note 10, wherein the cover portion has a bent portion that bends from the edge portion in the third direction of the first protruding wall portion toward the second direction, and at least a part of the bent portion is disposed between the first connecting wall portion and the connector unit in the third direction.

[0209] According to this structure, it is possible to block at least a part of the gap between the first protruding wall portion and the first connecting wall portion generated when the first protruding wall portion and the first connecting wall portion are separately bent by the bent portion. Thereby, it is possible to more appropriately cover the connector unit with the cover portion, and it is possible to further suppress the leakage of electromagnetic waves generated from the connector unit to the outside.

[0210] (Supplementary Note 12)

[0211] According to the circuit board unit described in any one of Supplementary Notes 1 to 11, wherein the board surfaces of the first circuit board and the second circuit board are parallel to each other, and the first circuit board and the second circuit board are arranged and disposed in a direction along the board surfaces of the first circuit board and the second circuit board.

[0212] According to this structure, it is easy to form the metal member into a relatively simple structure, and it is easy to appropriately cover the connector unit connecting the first circuit board and the second circuit board with the cover portion.

[0213] (Supplementary Note 13)

[0214] According to the circuit board unit described in Supplementary Note 1, wherein the board surfaces of the first circuit board and the second circuit board face in directions crossing each other, and the opposing wall portion has: a first portion that opposes the connector unit in a direction perpendicular to the board surface of the first circuit board; and a second portion that opposes the connector unit in a direction perpendicular to the board surface of the second circuit board.

[0215] According to this structure, with respect to a connector unit that connects a first circuit board and a second circuit board with their board surfaces crossing each other, an opposing wall portion can be appropriately arranged, and a return path through which a return current passes through the opposing wall portion can be formed. Thereby, useless radiation noise generated by the current flowing through the connector unit can be appropriately suppressed. In addition, since the connector unit can be covered from two different directions by the first portion and the second portion, it is possible to easily and appropriately shield the electromagnetic waves generated from the connector unit by the opposing wall portion. Thereby, the leakage of electromagnetic waves generated from the connector unit to the outside of the circuit board unit can be suppressed.

[0216] (Supplementary Note 14)

[0217] In the circuit board unit according to Supplementary Note 13, wherein the first portion and the second portion are connected to each other and bent with respect to each other.

[0218] According to this structure, by bending the opposing wall portion, the first portion and the second portion can be easily formed. Thereby, while simplifying the structure of the opposing wall portion, the generation of useless radiation noise caused by the current flowing into the connector unit can be appropriately suppressed.

[0219] (Supplementary Note 15)

[0220] In the circuit board unit according to any one of Supplementary Notes 1 - 14, wherein the first connection portion and the second connection portion are separated from each other.

[0221] According to this structure, compared with the case where the first connection portion and the second connection portion are connected to each other, the degree of freedom in arranging the portions connecting the respective connection portions on each circuit board can be increased. Therefore, according to the electronic components and wiring patterns mounted on each circuit board, etc., it is easy to appropriately arrange the portions connecting the respective connection portions on each circuit board.

[0222] (Supplementary Note 16)

[0223] In the circuit board unit according to any one of Supplementary Notes 1 - 14, wherein the first connection portion and the second connection portion are connected to each other.

[0224] According to this structure, compared with the case where the first connection portion and the second connection portion are separately provided at a distance from each other, the complication of the structure of the metal components can be suppressed. In addition, the first ground layer and the second ground layer can be electrically connected via the first connection portion and the second connection portion that are connected to each other. Therefore, it is easier to more appropriately electrically connect the first ground layer and the second ground layer.

[0225] (Supplementary Note 17)

[0226] The circuit board unit according to any one of Appendices 1 to 16, wherein the connecting member of the first connector protrudes from the holding portion of the first connector that holds the connecting member, the opposing wall portion opposes the connecting member and the holding portion in a direction perpendicular to the board surface of the first circuit board, and an end portion of the opposing wall portion on the side where the connecting member protrudes relative to the holding portion is located outside the end portion of the connecting member on the side where the connecting member protrudes relative to the holding portion.

[0227] According to this structure, it is easy to appropriately cover the first connector in the first direction by using the opposing wall portion. In addition, when a first protruding wall portion protruding toward the first circuit board is provided at an end portion of the opposing wall portion on the side where the first connecting member protrudes relative to the holding portion of the first connector, the first protruding wall portion can be arranged at a position that does not overlap with the first connecting member in the first direction. Therefore, contact between the first protruding wall portion and the first connecting member can be suppressed, and the first protruding wall portion can appropriately approach the first circuit board. As a result, the return current can flow more easily between the first protruding wall portion and the first ground layer.

[0228] (Appendix 18)

[0229] An electronic device, characterized in that it includes the circuit board unit according to any one of Appendices 1 to 17.

[0230] According to this structure, in the electronic device, generation of useless radiation noise caused by the current flowing through the connector unit can be appropriately suppressed.

Claims

1. A circuit substrate unit, characterized in that: have: A first circuit substrate having a first ground layer; A second circuit substrate having a second ground layer; a connector unit having a first connector mounted on the first circuit substrate and a second connector mounted on the second circuit substrate; as well as a metal component connecting the first circuit substrate and the second circuit substrate, The metal component has: a first connecting portion, electrically connected to the first ground layer; a second connection portion electrically connected to the second ground layer; and a cover portion covering at least a portion of the connector unit, The cover has an opposing wall portion, at least a portion of which is opposed to the connector unit in a direction perpendicular to the surface of the first circuit substrate. The opposing wall portion overlaps with the first circuit substrate when viewed in a direction perpendicular to the surface of the first circuit substrate, and overlaps with the second circuit substrate when viewed in a direction perpendicular to the surface of the second circuit substrate.

2. The circuit substrate unit according to claim 1, wherein: The cover portion includes a first protruding wall portion that protrudes from the opposing wall portion toward one of the first circuit substrate and the second circuit substrate. The first protruding wall portion and the connector unit are opposed to each other in a second direction perpendicular to a first direction, wherein the first direction is a direction perpendicular to a board surface of the first circuit substrate.

3. The circuit substrate unit according to claim 2, wherein: The cover portion has a second protruding wall portion that protrudes from the opposing wall portion toward the other of the first circuit substrate and the second circuit substrate. The first protruding wall portion and the second protruding wall portion are arranged across the connector unit in the second direction. The first protruding wall portion protrudes from the opposing wall portion toward the first circuit substrate. The second protruding wall portion protrudes from the opposing wall portion toward the second circuit substrate.

4. The circuit substrate unit according to claim 2, wherein: A gap is provided between the first protruding wall portion and the one circuit substrate.

5. The circuit substrate unit according to claim 2, wherein: The first protruding wall portion is in contact with the one circuit substrate.

6. The circuit substrate unit according to claim 5, wherein: The first protruding wall portion is electrically connected to a ground layer provided on the one circuit substrate, of the first ground layer and the second ground layer, via a ground land portion formed on a plate surface of the one circuit substrate.

7. The circuit substrate unit according to claim 5, wherein: The connector unit has a connector electrically connected to the one circuit substrate. The connector is electrically connected to a signal line provided on a surface of the circuit substrate opposite to a surface to which the connector is connected, or to a signal line provided in an inner layer of the circuit substrate, via a conductive portion formed on the circuit substrate.

8. The circuit substrate unit according to any one of claims 2 to 7, wherein: The cover portion includes a first connecting wall portion, the first connecting wall portion connecting at least one of the first connecting portion and the second connecting portion to the opposing wall portion, The first connection wall portion and the connector unit face each other in a third direction perpendicular to both the first direction and the second direction.

9. The circuit substrate unit according to claim 8, wherein: The cover portion has a second connecting wall portion, which is arranged on a side opposite to the first connecting wall portion and connected to the opposing wall portion. The first connection wall portion and the second connection wall portion are provided across the connector unit in the third direction.

10. The circuit substrate unit according to claim 8, wherein: The metal component is a sheet metal component, The first protruding wall portion is a portion bent from an edge of the opposing wall portion in the second direction toward the first direction. The first connecting wall portion is a portion bent from an edge portion of the opposing wall portion in the third direction toward the first direction.

11. The circuit substrate unit according to claim 10, wherein: The cover portion includes a bent portion that is bent from an edge of the first protruding wall portion in the third direction toward the second direction. At least a portion of the bent portion is disposed between the first connecting wall portion and the connector unit in the third direction.

12. The circuit substrate unit according to any one of claims 1 to 7, wherein: The board surface of the first circuit substrate and the board surface of the second circuit substrate are parallel to each other. The first circuit substrate and the second circuit substrate are arranged side by side in a direction along a board surface of the first circuit substrate and a board surface of the second circuit substrate.

13. The circuit substrate unit according to claim 1, wherein: The board surface of the first circuit substrate and the board surface of the second circuit substrate face in directions intersecting each other, The opposing wall portion has: a first portion, which is opposed to the connector unit in a direction perpendicular to a surface of the first circuit substrate; and The second portion is opposed to the connector unit in a direction perpendicular to a surface of the second circuit substrate.

14. The circuit substrate unit according to claim 13, wherein: The first portion and the second portion are connected to each other and bent to each other.

15. The circuit substrate unit according to any one of claims 1 to 7, wherein: The first connection portion and the second connection portion are separated from each other.

16. The circuit substrate unit according to any one of claims 1 to 7, wherein: The first connection portion and the second connection portion are connected to each other.

17. The circuit substrate unit according to any one of claims 1 to 7, wherein: The connecting piece of the first connector protrudes from a holding portion of the first connector that holds the connecting piece. The opposing wall portion is opposed to the connector and the holding portion in a direction perpendicular to the surface of the first circuit substrate. The end portion of the opposing wall portion on the side where the connector protrudes relative to the holding portion is located outside the end portion of the connector on the side where the connector protrudes relative to the holding portion.

18. An electronic device, characterized in that: A circuit board unit comprising the circuit board unit according to any one of claims 1 to 7.

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