A nine-in-one integrated potting module

Abstract

The present invention relates to the technical field of power modules, and particularly to a nine-in-one integrated potting module. The nine-in-one integrated potting module includes a housing assembly, a chip assembly, and a potting body. The chip assembly includes a substrate, an inverter single tube, a PTC single tube, and terminals. The upper copper layer is divided into a first inverter unit area, a second inverter unit area, and a PTC unit area. Three inverter single tubes are configured on the inner chip in the first inverter unit area, one inverter single tube is configured on the inner chip in each of the second inverter unit areas, and the first and second inverter unit areas form a six-unit inverter part. One PTC single tube is configured on the inner chip in each of the PTC unit areas. Six inverter single tubes and three PTC single tubes are integrated into a single module, and a complete three-phase full-bridge inverter circuit and a PTC heating function unit are constructed within the single module, realizing the integrated integration of the electric drive and heating functions.

Description

Technical Field

[0001] The present invention relates to the technical field of power modules, and particularly to a nine-in-one integrated potting module. Background Art

[0002] New energy vehicles are different from traditional fuel vehicles. New energy vehicles do not have an engine, which causes in-vehicle heating to become a problem. As a positive temperature coefficient semiconductor material, PTC can generate heat by itself when powered on, and has the advantages of high heating efficiency, high power, no open flame, and safety. It is an ideal material for automotive heating devices. In the prior art, the frequency converter and the PTC mostly adopt a split layout. In the traditional solution, 6 power units of the frequency converter part and 3 units of the PTC heater are independently arranged, resulting in multiple installation areas needing to be reserved on the substrate, occupying a large area and being difficult to adapt to the trend of miniaturization of equipment. Summary of the Invention

[0003] In view of this, the present invention provides a nine-in-one integrated potting module to solve the above technical problems.

[0004] A nine-in-one integrated potting module includes a housing assembly, a chip assembly disposed on the housing assembly, and a potting body disposed on the housing assembly. The housing assembly includes a housing. The chip assembly includes a substrate, six inverter single tubes disposed on the substrate, three PTC single tubes disposed on the substrate, and a terminal assembly disposed on the substrate. The substrate has three layers, with a ceramic layer in the middle and upper and lower copper layers. The upper copper layer is provided with multiple channels. The upper copper layer is divided into a first inverter unit area, three second inverter unit areas, three PTC unit areas, multiple input terminal areas, multiple output terminal areas, and multiple signal terminal areas. Three inverter single tubes are disposed in the first inverter unit area, and one inverter single tube is separately disposed in each of the three second inverter unit areas. The three inverter single tubes in the first inverter unit area are electrically connected to the three second inverter unit areas respectively. The inverter single tubes in the three second inverter unit areas are electrically connected to the output terminal area respectively. The terminal assemblies are respectively disposed on the first inverter unit area and the three second inverter unit areas. Each inverter unit is electrically connected to the signal terminal area, and one PTC single tube is respectively disposed in each of the three PTC unit areas. The three PTC single tubes are electrically connected to the three output terminal areas respectively. The terminal assemblies are respectively disposed on each of the three PTC unit areas, and each PTC single tube is electrically connected to the signal terminal area.

[0005] Further, the housing assembly further includes four support columns disposed on the housing, and multiple creepage bosses disposed on the housing.

[0006] Furthermore, a circumferential limiting step is provided on the support column, and the height of the limiting step is the same as the height of the welding surface of the terminal.

[0007] Furthermore, the creepage boss is arranged on the top surface of the housing and is located between a plurality of terminals.

[0008] Furthermore, the terminal assembly is arranged on the housing, one end of the terminal assembly is connected to the substrate, the other end is bent towards the center of the housing, and the tail is wavy.

[0009] Furthermore, the terminal assembly includes a plurality of terminals, and one terminal is respectively arranged on the first frequency converter unit area, the second frequency converter unit area, the PTC unit area, the output terminal area, and the signal terminal area.

[0010] Furthermore, the terminal assembly connected to the first frequency converter unit area is the DC+ input terminal of the frequency converter unit area, and the terminal assembly connected to the second frequency converter unit area is the AC output terminal of the frequency converter unit area.

[0011] Furthermore, the terminal connected to the PTC unit area is the DC+ input terminal of the PTC unit.

[0012] Furthermore, the potting body is formed by potting liquid epoxy in the housing.

[0013] Compared with the prior art, the upper copper layer of the nine-in-one integrated potting module provided by the present invention is provided with multiple channels through chemical etching, dividing the upper copper layer into a first frequency converter unit area, three second frequency converter unit areas, three PTC unit areas, multiple input terminal areas, multiple output terminal areas, and multiple signal terminal areas. Three inverter single tubes are arranged in the first frequency converter unit area, one inverter single tube is separately arranged in each of the second frequency converter unit areas, and one PTC single tube is respectively arranged in each of the PTC unit areas. By reconstructing the multi-layer circuit topology of the upper copper layer, a complete three-phase full-bridge inverter circuit is built in a single module while integrating the PTC heating function unit, integrating them into a single module, realizing the nine-in-one integration of the electric drive and heating functions. During production, it can be directly formed by reflow soldering once, without complex assembly processes, saving costs and improving the integration level. In addition, the height of the limiting step is the same as the height of the welding surface of the terminal assembly. One end of the terminal assembly is connected to the substrate, and the other end bends towards the center of the housing and the tail is wavy to reduce the stress generated during installation and module use vibration. The inner folding structure of the terminal assembly cooperates with the design of the limiting step to realize automatic alignment welding of the PCB board, and at the same time significantly reduces the space occupied by the terminals horizontally, leaving a layout area for other components on the PCB board, realizing high-density integration. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 FIG. is a schematic structural diagram of a nine-in-one integrated potting module provided by the present invention.

[0015] Figure 2 is Figure 1 exploded structural diagram of the nine-in-one integrated potting module.

[0016] Figure 3 is Figure 1 side view of the substrate of the nine-in-one integrated potting module.

[0017] Figure 4 is Figure 1 top view when the circuit of the nine-in-one integrated potting module is connected.

[0018] Figure 5 is Figure 1 terminal connection numbering diagram of the nine-in-one integrated potting module.

[0019] Figure 6 is Figure 1 circuit connection diagram of the PTC single tube of the nine-in-one integrated potting module.

[0020] Figure 7 is Figure 1Circuit connection diagram of the inverter single tube in the nine-in-one integrated potting module. Detailed implementation manners

[0021] The following further details the specific embodiments of the present invention. It should be understood that the description of the embodiments of the present invention herein is not intended to limit the protection scope of the present invention.

[0022] As Figures 1 to 7 shown, it is a schematic structural diagram of the nine-in-one integrated potting module provided by the present invention. The nine-in-one integrated potting module includes a housing assembly 100, a chip assembly 200 disposed on the housing assembly 100, and a potting body 300 disposed on the housing assembly 100. It can be imagined that the nine-in-one integrated potting module further includes some other functional modules, such as connection components, mounting components, etc., which are well-known technologies to those skilled in the art and will not be elaborated herein.

[0023] The housing assembly 100 includes a housing 110, four support columns 120 disposed on the housing 110, and a plurality of creepage bosses 130 disposed on the housing 110.

[0024] The housing 110 has a rectangular frame structure with a hollow center. The housing 110 is used to accommodate the chip assembly 200 and to pot the potting body 300. The housing 110 is configured to cooperate with a heat dissipation substrate (not shown in the figure) provided with heat dissipation fins. When the chip assembly 200 operates, the heat generated is conducted to the heat dissipation substrate, and the heat dissipation fins are immersed in the coolant in the water channel, thereby exchanging heat with the flowing coolant to take away the chip heat. This should be prior art and will not be elaborated herein.

[0025] A limiting step 121 is provided on the support column 120. The limiting step 121 is used to support an external PCB board (not shown in the figure). The height of the limiting step 121 is the same as the height of the welding surface of the following terminals, so as to ensure automatic alignment during module welding and reduce manual adjustment steps. At the same time, the height is limited. After the PCB board is welded to the module, there is a space between the PCB board and the chip assembly 200, and small components such as capacitors and resistors can be placed in this space to optimize the internal layout to the greatest extent.

[0026] The creepage bosses 130 are disposed on the top surface of the housing 110 and between the following multiple terminals. The creepage bosses 130 are used to increase the surface path length between two conductive components, that is, between adjacent two terminals, directly extending the creepage distance. In high-voltage equipment, sufficient creepage distance can prevent problems such as leakage, arc discharge, or short circuit, so that the creepage distance can be increased without increasing the housing size.

[0027] The chip component 200 includes a substrate 210, six inverter single transistors 220 disposed on the substrate 210, three PTC single transistors 230 disposed on the substrate 210, and a terminal component 240 disposed on the substrate 210.

[0028] The substrate 210 has three layers. The middle ceramic layer 211 provides excellent insulation and thermal conductivity, and the upper and lower layers are the upper copper layer 212 and the lower copper layer 213 for realizing circuit connection and heat dissipation.

[0029] The upper copper layer 212 is provided with multiple channels 214 by chemical etching, dividing the upper copper layer 212 into a first inverter unit area 215, three second inverter unit areas 216, three PTC unit areas 217, multiple output terminal areas 218, and multiple signal terminal areas 219.

[0030] Three inverter single transistors 220 are disposed in the first inverter unit area 215, which serve as the upper bridge arm of the three-phase circuit. Each of the second inverter unit areas 216 is separately provided with an inverter single transistor 220, which is the lower bridge arm of the three-phase circuit.

[0031] The three inverter single transistors 220 in the first inverter unit area 215 are respectively electrically connected to the three second inverter unit areas 216, so that the emitter of the inverter single transistor 220 of the upper bridge arm is connected to the collector of the inverter single transistor 220 of the lower bridge arm.

[0032] The inverter single transistors 220 in the three second inverter unit areas 216 are respectively electrically connected to the output terminal area 218. Through the terminal component 240 on the output terminal area 218 as the DC-output terminal of the inverter unit area, the emitter-collector of the inverter single transistor 220 of the lower bridge arm is connected to the DC-output terminal.

[0033] The terminal component 240 is respectively disposed on the first inverter unit area 215 and the three second inverter unit areas 216. The terminal component 240 connected to the first inverter unit area 215 is the DC+ input terminal of the inverter unit area, and the terminal component 240 connected to the second inverter unit area 216 is the AC output terminal of the inverter unit area, outputting three-phase alternating current to the motor load.

[0034] Each of the inverter single transistors 220 is electrically connected to the signal terminal area 218. The terminal assembly 240 on the signal terminal area 218 serves as the drive signal terminal of the inverter unit area, and is used to control conduction and cutoff. Through the above connection, the C pole of the inverter single transistor 220 in the upper bridge arm is connected to the DC+ input terminal, the E pole is connected to the C pole of the inverter single transistor 220 in the lower bridge arm and outputs to the AC output terminal, and the G pole is connected to the drive signal terminal to receive the control signal provided by the drive circuit to control conduction or cutoff. The C pole of the inverter single transistor 220 in the lower bridge arm is connected to the E pole of the inverter single transistor 220 in the upper bridge arm, the E pole is connected to the DC- output terminal, and the G pole is connected to the drive signal terminal to receive the control signal provided by another drive circuit to conduct complementarily with the upper bridge arm. Furthermore, a three-phase full-bridge inverter circuit is formed to convert direct current into three-phase alternating current and output it to the motor load.

[0035] One PTC single transistor 230 is respectively arranged in each of the PTC unit areas 217. The PTC single transistor 230 is a switch for controlling whether the in-vehicle PTC heater works. The three PTC single transistors 230 are respectively electrically connected to the three output terminal areas 218. The terminal assembly 240 on the output terminal area 218 serves as the DC- output terminal, that is, the emitter of the PTC single transistor 230 is connected to the output terminal area 218.

[0036] One terminal assembly 240 is arranged on each of the PTC unit areas 217. This terminal serves as the DC+ input terminal, that is, the collector of the PTC single transistor 230 is connected to the terminal assembly 240 serving as the DC+ input.

[0037] Each of the PTC single transistors 230 is electrically connected to the signal terminal area 218, that is, the gate of the PTC single transistor 230 is connected to the signal terminal area 218. The terminal assembly 240 on the signal terminal area 218 serves as the GE signal terminal for controlling conduction and cutoff. When there is voltage between the DC+ input terminal and the DC- output terminal, and there is also voltage on the GE signal terminal, the independent PTC single transistor 230 will conduct, and current will flow to the in-vehicle PTC.

[0038] The terminal assembly 240 includes a plurality of terminals (1 to 33). One terminal is respectively arranged on the first inverter unit area 215, the second inverter unit area 216, the PTC unit area 217, the output terminal area 218, and the signal terminal area 219. The terminals connected to different areas are connected to different external electronic devices, so as to realize the connection between the module and the external electronic devices through the terminal assembly 240. The connection is as Figure 5 、 Figure 6 、 Figure 7 shown.

[0039] Integrate the six inverter units and three PTC units that were separately installed and did not require connection in the prior art into a single module, saving costs and improving the degree of integration. During reproduction, it can be directly formed by reflow soldering once, without a complex assembly process, eliminating multiple installation steps and connecting cables. It should be noted that the chip component 200 is also provided with a thermistor, and both ends of the thermistor are respectively connected to an external temperature detection circuit through terminals 20 and 21, so as to monitor the module temperature in real time and prevent overheating damage. This should be prior art and will not be elaborated here.

[0040] The terminal component 240 is arranged on the housing 110. One end of the terminal component 240 is connected to the substrate 210, and the other end is bent towards the center of the housing 110 and the tail is wavy. The end of the terminal component 240 bent towards the center of the housing 110 is connected to the PCB board by reflow soldering through tin plating. By folding the terminal component 240 inward, the space occupied by the terminals horizontally is significantly reduced, creating a layout area for other components on the PCB board and achieving high-density integration. The tail of the terminal is designed as an elastic structure. When the module is installed or vibrated externally, mechanical stress can be released through elastic deformation, avoiding the fracture of the solder joints or the terminal tails due to long-term stress. It is applicable to high-vibration scenarios such as automotive air-conditioning compressors, significantly improving the environmental adaptability of the module.

[0041] The potting body 300 is formed by potting liquid epoxy in the housing 110. The liquid epoxy has high mechanical strength, excellent insulation properties and chemical corrosion resistance, and has a higher glass transition temperature (TG). Therefore, using the liquid epoxy as the internal seal for potting the chip component 200 has higher reliability.

[0042] Compared with the prior art, multiple channels 214 are provided on the upper copper layer 212 of the nine-in-one integrated potting module provided by the present invention through chemical etching, and the upper copper layer 212 is divided into a first frequency converter unit area 215, three second frequency converter unit areas 216, three PTC unit areas 217, multiple input terminal areas 217, multiple output terminal areas 218, and multiple signal terminal areas 219. Three inverter single tubes 220 are arranged in the first frequency converter unit area 215, one inverter single tube 220 is separately arranged in each of the second frequency converter unit areas 216, and one PTC single tube 230 is respectively arranged in each of the PTC unit areas 217. Six inverter units and three PTC units of an air conditioner compressor motor in the prior art are separately installed. Through the multi-layer circuit topology reconstruction of the upper copper layer, a complete three-phase full-bridge inverter circuit is constructed in a single module, and at the same time, the PTC heating function unit is integrated into a single module, realizing the nine-in-one integration of the electric drive and heating functions. During production, it can be directly formed by reflow soldering once, without a complex assembly process, saving costs and improving the integration degree. In addition, the height of the limiting step 121 is the same as the height of the welding surface of the terminal assembly 240. One end of the terminal assembly 240 is connected to the substrate 210, and the other end is bent towards the center of the housing 110 and the tail is wavy to reduce the stress generated during installation and module use vibration. The inner folding structure of the terminal assembly 240 is designed in cooperation with the limiting step 121 to realize the automatic alignment welding of the PCB board, and at the same time significantly reduce the space occupied by the terminals horizontally, leaving a layout area for other components on the PCB board, realizing high-density integration.

[0043] The above are only the preferred embodiments of the present invention and are not used to limit the protection scope of the present invention. Any modifications, equivalent replacements or improvements within the spirit of the present invention are all covered within the scope of the claims of the present invention.

Claims

1. A nine-in-one integrated potting module, characterized in that: The nine-in-one integrated potting module includes a housing assembly, a chip assembly disposed on the housing assembly, and a potting body disposed on the housing assembly. The housing assembly includes a housing. The chip assembly includes a substrate, six inverter single tubes disposed on the substrate, three PTC single tubes disposed on the substrate, and a terminal assembly disposed on the substrate. The substrate has three layers, with a ceramic layer in the middle and upper and lower copper layers. The upper copper layer is provided with multiple channels, which divide the upper copper layer into a first inverter unit area, three second inverter unit areas, three PTC unit areas, multiple input terminal areas, multiple output terminal areas, and multiple signal terminal areas. Three inverter single tubes are disposed in the first inverter unit area, and one inverter single tube is separately disposed in each of the three second inverter unit areas. The three inverter single tubes in the first inverter unit area are electrically connected to the three second inverter unit areas respectively. The inverter single tubes in the three second inverter unit areas are electrically connected to the output terminal area respectively. The terminal assembly is disposed on the first inverter unit area and the three second inverter unit areas respectively. Each inverter unit is electrically connected to the signal terminal area. One PTC single tube is disposed in each of the three PTC unit areas. The three PTC single tubes are electrically connected to the three output terminal areas respectively. The terminal assembly is disposed on each of the three PTC unit areas. Each PTC single tube is electrically connected to the signal terminal area.

2. The nine-in-one integrated potting module according to claim 1, wherein: The housing assembly further includes four support columns disposed on the housing, and multiple creepage bosses disposed on the housing.

3. The nine-in-one integrated potting module according to claim 2, wherein: A limit step is disposed on the support column, and the height of the limit step is the same as the height of the welding surface of the terminal.

4. The nine-in-one integrated potting module according to claim 2, wherein: The creepage bosses are disposed on the top surface of the housing and are located between multiple terminals.

5. The nine-in-one integrated potting module according to claim 1, characterized in that: The terminal assembly is disposed on the housing. One end of the terminal assembly is connected to the substrate, and the other end is bent toward the center of the housing and the tail is wavy.

6. The nine-in-one integrated potting module according to claim 1, characterized in that: The terminal assembly includes multiple terminals. One terminal is disposed on each of the first inverter unit area, the second inverter unit area, the PTC unit area, the output terminal area, and the signal terminal area.

7. The nine-in-one integrated potting module according to claim 6, characterized in that: The terminal assembly connected to the first inverter unit area is the DC+ input terminal of the inverter unit area, and the terminal assembly connected to the second inverter unit area is the AC output terminal of the inverter unit area.

8. The nine-in-one integrated potting module according to claim 6, wherein: The terminal connected to the PTC unit area is the DC+ input terminal of the PTC unit.

9. The nine-in-one integrated potting module according to claim 1, characterized in that: The potting body is formed by liquid epoxy potting in the housing.

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