Structure for increasing heat absorption area of VC plate and manufacturing process

Abstract

The invention discloses a VC plate heat absorption area increasing structure and a manufacturing process, relates to the technical field of VC plate production, and aims to solve the problem of insufficient heat-conducting property caused by limited plane heat absorption area of a traditional VC plate. Honeycomb groove clusters are arranged in the lower base plate to form a multi-dimensional heat absorption surface, and the effective heat absorption area is remarkably increased; meanwhile, a heat conduction position is arranged in the second sinking groove area and makes direct contact with the copper supporting column, and the heat transfer path is optimized. The supporting column is wrapped with the sintered metal powder heat conduction piece, efficient phase change circulation of the liquid medium is achieved in combination with the capillary structure, the heat resistance is further reduced, and the heat conduction efficiency is improved. According to the design, heat distribution is optimized through the three-dimensional reflecting surface, the problem of local hot spots is effectively solved, the process compatibility is high, and the manufacturing cost is low. An innovative solution is provided for efficient heat dissipation of electronic equipment, and the overall heat conduction performance of the VC board is remarkably improved.

Description

Technical Field

[0001] The present invention relates to the technical field of VC board production, and specifically to a VC board structure with an increased heat absorption area and a manufacturing process thereof. Background Art

[0002] In the field of heat dissipation of electronic devices, a vapor chamber, as an efficient heat conduction device, is widely used in heat dissipation solutions for high-power density devices. However, traditional VC board designs mostly adopt a planar structure, and its heat absorption area is limited to a two-dimensional plane, making it difficult to further improve the heat conduction efficiency in a limited space. Specifically, a VC board with a planar structure can only absorb heat through its upper and lower surfaces, while the side and internal spaces are not fully utilized, which greatly limits its effective heat absorption area and thus affects the overall thermal conductivity.

[0003] To address this problem, although existing technologies have attempted to improve the heat absorption efficiency by increasing the complexity of the internal structure, they often face challenges such as complex processes, high costs, or increased thermal resistance. For example, some designs have introduced microchannels or fin structures, but while these structures increase the heat absorption area, they also increase the complexity of the flow path of the liquid medium, which may lead to an increase in thermal resistance and a decrease in heat transfer efficiency. In addition, the layout of the support columns and heat conducting components in traditional designs lacks targeted optimization and does not fully consider the characteristics of heat source distribution, resulting in a non-optimal heat transfer path and difficulty in effectively solving local hot spot problems.

[0004] The present invention aims to break through the limitations of the traditional planar design of VC boards, significantly increase the heat absorption area through innovative structural design, and optimize the heat transfer path to achieve a substantial improvement in thermal conductivity. By introducing multi-dimensional heat absorption surfaces and precise heat source management strategies, the present invention not only overcomes the inherent defect of the limited heat absorption area of the planar structure but also reduces the thermal resistance and improves the heat response speed by optimizing the synergistic effect of the support columns and heat conducting components, providing a new solution for efficient heat dissipation. Summary of the Invention

[0005] In view of the deficiencies of the prior art, the present invention provides a VC board structure with an increased heat absorption area and a manufacturing process thereof, solving the problems raised in the above background art.

[0006] To achieve the above objectives, the present invention is realized through the following technical solutions: In a first aspect, the present invention provides a VC board structure with an increased heat absorption area, including a lower base plate and an upper cover plate. The lower base plate is provided with a first sunken groove and a second sunken groove. A heat conducting position and a honeycomb groove cluster are arranged in the second sunken groove. After the lower base plate and the upper cover plate are welded and fixed, a sealed cavity is formed. A capillary structure and a plurality of support columns are sequentially arranged in the sealed cavity, and the outer part of the support column is wrapped with a heat conducting component.

[0007] Further, the heights of the support columns and the heat conducting members located in the second sunken groove area are respectively higher than those of the support columns and the heat conducting members located in the first sunken groove area, and the upper surfaces of all the support columns are in contact with the lower surface of the upper cover plate.

[0008] Further, the bottom ends of the support columns located in the second sunken groove are in contact with the heat conducting positions.

[0009] Further, the capillary structure is provided with through holes, and the bottom ends of the support columns extend below the capillary structure through the through holes and are in contact with the liquid media in the first sunken groove and the second sunken groove.

[0010] Further, the materials of the lower seat plate and the upper cover plate are copper, aluminum or stainless steel plates.

[0011] Further, the material of the support columns is copper, and the heat conducting members are made by sintering metal powders with good heat conducting performance.

[0012] Further, each honeycomb groove in the honeycomb groove cluster is a polyhedron structure.

[0013] In a second aspect, the present invention also provides a manufacturing process for a VC plate with an increased heat absorption area structure, including the following steps: S1. Place the blank plate for making the lower seat plate on the upper part of the lower die base; S2. The punching press drives the upper die base, the punch and the punching avoidance column to move downward as a whole and press the blank; S3. Utilize the first protrusion and the second protrusion of the upper die base to cooperate with the third sunken groove and the fourth sunken groove of the lower die base to press and form the first sunken groove and the second sunken groove on the blank; S4. During the stamping process, form the honeycomb groove cluster on the surface of the second sunken groove by the honeycomb protrusion cluster at the bottom end of the punch; S5. Form the heat conducting positions on the surface of the second sunken groove through the punching avoidance columns fixed inside the punch, and then the VC plate with an increased heat absorption area can be obtained.

[0014] The present invention provides a VC plate with an increased heat absorption area structure and a manufacturing process. Compared with the prior art, it has the following beneficial effects: 1. The present invention sets a honeycomb groove cluster inside the VC plate and adopts a polyhedron structure design. Compared with the traditional flat structure, the effective heat absorption area is increased several times. This three-dimensional heat absorption surface enhances the primary heat absorption ability by increasing the heat radiation reception dimension and lays a foundation for efficient heat conduction.

[0015] 2. By setting a heat conduction position in the second sinking groove area and directly contacting the support column, a point heat source collection node is formed. This design avoids the possible heat diffusion delay of the honeycomb groove structure, ensures that heat is quickly transferred to the support column, and significantly improves the heat response speed.

[0016] 3. The support column is made of copper and is wrapped with a sintered metal powder heat conduction component on the outside to form a composite heat conduction channel. The high thermal conductivity of the copper support column combined with the optimized porosity of the heat conduction component significantly reduces the thermal resistance and makes the heat transfer efficiency significantly higher than that of the traditional structure.

[0017] 4. The liquid medium realizes an efficient evaporation-condensation cycle through the capillary structure in the closed cavity. When the heat source temperature exceeds the phase change temperature of the medium, the liquid medium in the second sinking groove area is preferentially vaporized, and the vapor diffuses to the cooler upper cover plate for condensation. After releasing the latent heat, it flows back through the capillary structure to form a uniform gas phase layer, further improving the overall heat transfer performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic exploded view of the VC plate in the present invention; Figure 2 It is a schematic structural view of the lower seat plate in the present invention; Figure 3 It is a half-sectional view of the assembled VC plate in the present invention; Figure 4 It is a schematic exploded view of the stamping die in the manufacturing process of the present invention; Figure 5 It is a schematic structural view of the punch in the manufacturing process of the present invention; Figure 6 It is a schematic structural view of the upper die base in the manufacturing process of the present invention; Figure 7 It is a schematic assembled view of the stamping die in the manufacturing process of the present invention; Figure 8 It is a half-sectional view of the assembled stamping die in the manufacturing process of the present invention; Figure 9 It is a top view of a single honeycomb groove in the present invention.

[0019] In the figure: 1. Lower seat plate; 11. First sunken groove; 12. Second sunken groove; 13. Honeycomb groove cluster; 131. First upper inclined plane; 132. Second upper inclined plane; 133. Third upper inclined plane; 134. Fourth upper inclined plane; 135. First middle inclined plane; 136. Second middle inclined plane; 137. Third middle inclined plane; 138. Fourth middle inclined plane; 139. Bottom surface; 14. Heat conduction position; 2. Upper cover plate; 3. Capillary structure; 31. Through hole; 4. Support column; 5. Heat conduction part; 6. Lower die base; 61. Third sunken groove; 62. Fourth sunken groove; 7. Upper die base; 71. First protrusion; 72. Second protrusion; 73. First mounting hole; 8. Punch; 81. Honeycomb protrusion cluster; 82. Second mounting hole; 9. Stamping avoidance column. Detailed implementation mode

[0020] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention. Embodiment 1

[0021] Please refer to Figures 1-3 and Figure 9 , the present invention provides a technical solution: a VC plate structure for increasing the heat absorption area, including a lower seat plate 1 and an upper cover plate 2 fixed on the upper part of the lower seat plate 1. A first sunken groove 11 is arranged inside the lower seat plate 1. A second sunken groove 12 is arranged at the inner bottom end of the first sunken groove 11. A plurality of heat conduction positions 14 are arranged at the inner bottom end of the second sunken groove 12. And a honeycomb groove cluster 13 is arranged around the plurality of heat conduction positions 14 at the inner bottom end of the second sunken groove 12. The arrangement of the honeycomb groove cluster 13 adds several side surfaces compared with a plane. That is to say, for the formed VC heat pipe, its heat absorption area will be greatly increased, and correspondingly, the heat conduction performance of the entire VC heat pipe can also be greatly improved. After the edges of the lower seat plate 1 and the upper cover plate 2 are welded and fixed, the first sunken groove 11 and the second sunken groove 12 form a sealed cavity. In the sealed cavity, a capillary structure 3 and a plurality of support columns 4 are arranged in a stacked manner from bottom to top. The plurality of support columns 4 are laid and connected on the upper surface of the capillary structure 3, and a heat conduction part 5 is wrapped and fixed outside each support column 4. In addition, a liquid medium is arranged in the sealed cavity, and the liquid medium can be evaporated; Due to the existence of the second sinking groove 12 and the need to ensure that the upper surfaces of all support columns 4 are flush, that is, in contact with the lower surface of the upper cover plate 2, the support columns 4 located in the area of the second sinking groove 12 have a higher height than the support columns 4 located in the area of the first sinking groove 11. Similarly, the heat conducting members 5 located in the area of the second sinking groove 12 also have a higher height than the heat conducting members 5 located in the area of the first sinking groove 11; Several support columns 4 located in the second sinking groove 12 have their bottom ends in contact with the corresponding heat conducting positions 14, so that the heat conduction effect of the support columns 4 will not be affected by the existence of the honeycomb groove cluster 13; A number of through holes 31 are reserved inside the capillary structure 3. The bottom end of each support column 4 can extend below the capillary structure 3 through the through holes 31, abut against the first sinking groove 11 and the second sinking groove 12, and can be in contact with the liquid medium in the first sinking groove 11 and the second sinking groove 12 to quickly conduct the heat of the liquid medium; The lower base plate 1 and the upper cover plate 2 are both made of copper, aluminum or stainless steel plates. The capillary structure 3 belongs to the prior art, and the specific structure and heat conduction principle will not be elaborated here. The support columns 4 are made of copper and have excellent heat conduction performance. The heat conducting members 5 are components obtained by sintering metal powders with good heat conduction performance and can quickly absorb the heat conducted by the support columns 4.

[0022] Each honeycomb groove in the honeycomb groove cluster 13 is a polyhedron structure. The more faces are set, the larger the heat absorption area and the better the heat conduction performance. As shown in the appendix Figure 9 As shown, after stamping and forming, the top of the honeycomb groove cluster 13 has a first upper inclined surface 131, a second upper inclined surface 132, a third upper inclined surface 133, and a fourth upper inclined surface 134 respectively around it, and the middle of the honeycomb groove cluster 13 has a first middle inclined surface 135, a second middle inclined surface 136, a third middle inclined surface 137, and a fourth middle inclined surface 138 respectively around it, and the bottom has a bottom surface 139. The sum of the areas of these surfaces will be larger than the area of the plane body, so as to greatly improve the heat absorption efficiency.

[0023] When this VC heat sink is in use, the honeycomb groove cluster 13 adopts a polyhedron honeycomb groove design, and each honeycomb groove forms a three-dimensional heat absorption surface through a multi-faceted structure such as a hexahedron / octahedron. Compared with the plane structure, its effective heat absorption area can be increased by several times or more. The primary heat absorption is strengthened by increasing the heat radiation receiving dimension. The heat conducting position 14 at the bottom of the second sinking groove 12 is in direct contact with the support column 4 to form a point heat source collection node. When the equipment generates local high temperature, the heat is quickly transferred to the support column through the heat conducting position, avoiding the heat diffusion delay caused by the honeycomb groove structure; In addition, the support columns 4 located in the area of the second sinking groove 12 adopt a variable cross-section design, and their height is increased by 0.3 - 0.5 mm in the area of the first sinking groove 11 to compensate for the depth difference of the groove body, ensuring that the tops of all support columns 4 are in full contact with the upper cover plate 2. The thermal conductivity of the copper support column 4 is 401 W / m·K, and the porosity of the external sintered metal powder heat conducting part 5 is optimized to 45%, forming a composite heat conduction channel, and the heat transfer efficiency is greatly improved compared with the traditional structure; When the temperature of the heat source exceeds the phase change temperature of the medium, such as 60°C for pure water, the liquid medium in the area of the second sinking groove 12 first vaporizes, and the steam diffuses upward. After encountering the relatively cold upper cover plate 2, it condenses and releases latent heat. The condensate flows back to the sinking groove through the pores with a pore diameter of 0.02 - 0.05 mm of the capillary structure 3. The steam forms a uniform gas phase layer in the closed cavity, and transfers heat to the entire surface of the upper cover plate 2 through molecular collision. With the three-dimensional reflecting surface of the honeycomb groove cluster 13, the standard deviation of the heat distribution will be greatly reduced, effectively solving the local hot spots caused by the edge effect. Embodiment 2

[0024] Please refer to Figures 4-8 , the present invention provides a technical solution: a manufacturing process for a VC plate with an increased heat absorption area structure, including the following steps: S1. Place the blank plate for manufacturing the lower seat plate 1 on the upper part of the lower die base 6; S2. The punching machine drives the overall downward movement of the upper die base 7, the punch 8, and the punching avoidance column 9, and presses them on the blank of the lower seat plate 1; S3. The protrusion one 71 and the protrusion two 72 provided on the lower surface of the upper die base 7, in cooperation with the third sinking groove 61 and the fourth sinking groove 62 of the lower die base 6, cause the blank of the lower seat plate 1 to be pressed into the first sinking groove 11 and the second sinking groove 12; S4. During the stamping process, the honeycomb protrusion cluster 81 at the bottom end of the punch 8 fixedly installed inside the mounting hole one 73 will be pressed and formed into the honeycomb groove cluster 13 on the surface of the second sinking groove 12 under the action of a huge punching force; S5. A plurality of punching avoidance columns 9 fixedly installed inside the punch 8 will form a plurality of heat conduction positions 14 on the surface of the second sinking groove 12 during the pressing process, and that's it.

[0025] In summary, aiming at the problems of limited heat absorption area and insufficient thermal conductivity in the plane design of the traditional VC plate, the following core innovations and technical solutions significantly improve the heat conduction efficiency: Multi-dimensional heat absorption surface: A honeycomb groove cluster is arranged inside the lower seat plate, and a polyhedron structure design is adopted to greatly increase the effective heat absorption area and strengthen the primary heat absorption capacity.

[0026] Precise heat source management: Heat conduction positions are arranged in the area of the second sinking groove, which are in direct contact with the copper support columns, forming dot-shaped heat source collection nodes, optimizing the heat transfer path, and improving the heat response speed.

[0027] Composite heat conduction channel: The outside of the support column is wrapped with a sintered metal powder heat conduction component, combined with the capillary structure to achieve an efficient phase change cycle of the liquid medium, reduce the thermal resistance, and improve the heat conduction efficiency.

[0028] Solve the local hot spot problem: Optimize the heat distribution through the three-dimensional reflecting surface of the honeycomb groove cluster, effectively solve the local hot spot problem caused by the edge effect of the traditional VC board, and improve the stability and service life of the device.

[0029] Process compatibility and cost effectiveness: Adopt stamping forming technology to synchronously complete the processing of key structures, simplify the production process, reduce costs, and ensure the structural consistency and reliability at the same time.

[0030] Through structural innovation and material optimization, the present invention has achieved a substantial improvement in the heat conduction performance of the VC board, providing an innovative solution for the efficient heat dissipation of electronic devices.

Claims

1. A VC plate structure with enlarged heat absorption area, comprising a lower base plate (1) and an upper cover plate (2), characterized in that: The lower seat plate (1) is provided with a first sinking groove (11) and a second sinking groove (12), wherein a heat conducting position (14) and a honeycomb groove cluster (13) are provided in the second sinking groove (12), and the lower seat plate (1) and the upper cover plate (2) are welded and fixed to form a closed cavity, wherein a capillary structure (3) and a plurality of support columns (4) are sequentially provided in the closed cavity, and the support columns (4) are wrapped with a heat conducting member (5) on the outside.

2. A VC plate structure for increasing heat absorption area according to claim 1, characterized in that: The heights of the support columns (4) and the heat-conducting components (5) located in the area of ​​the second sinking trough (12) are respectively higher than the heights of the support columns (4) and the heat-conducting components (5) located in the area of ​​the first sinking trough (11), and the upper surfaces of all the support columns (4) are in contact with the lower surface of the upper cover plate (2).

3. The VC plate structure with enlarged heat absorption area according to claim 1, characterized in that: Located at the bottom end of the support column (4) in the second sinking trough (12), it is in contact with the heat conducting position (14).

4. The VC plate structure for increasing heat absorption area according to claim 1, characterized in that: The capillary structure (3) is provided with a through hole (31), and the bottom end of the support column (4) extends to below the capillary structure (3) through the through hole (31) and contacts the liquid medium in the first sinking groove (11) and the second sinking groove (12).

5. The VC plate structure with enlarged heat absorption area according to claim 1, characterized in that: The lower seat plate (1) and the upper cover plate (2) are made of copper, aluminum or stainless steel plates.

6. The VC plate structure with enlarged heat absorption area according to claim 1, characterized in that: The support column (4) is made of copper, and the heat conducting member (5) is made of metal powder with good thermal conductivity through sintering.

7. The VC plate structure with enlarged heat absorption area according to claim 1, characterized in that: Each honeycomb slot in the honeycomb slot cluster (13) is a polyhedral structure.

8. A manufacturing process for a VC board structure with enlarged heat absorption area according to any one of claims 1 to 7, characterized in that: The following steps are involved: S1, placing a blank plate for making a lower seat plate (1) on the upper part of a lower die seat (6); S2, the punch press drives the upper die base (7), the punch (8), and the punch avoidance column (9) to move downward as a whole and press the blank; S3, using the protrusion 1 (71) and the protrusion 2 (72) of the upper die seat (7) to cooperate with the sinking groove 3 (61) and the sinking groove 4 (62) of the lower die seat (6), so as to press the blank into the sinking groove 1 (11) and the sinking groove 2 (12); S4, during the stamping process, the honeycomb protrusion cluster (81) at the bottom of the punch (8) is pressed on the surface of the second sinking groove (12) to form a honeycomb groove cluster (13); S5. A heat conducting position (14) is formed on the surface of the second sinking groove (12) by a punching avoidance column (9) fixed inside the punch (8), thereby obtaining a VC plate with an increased heat absorption area.

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