A device for automatically taping a component

Abstract

The application relates to the technical field of device patching, and discloses a device automatic patching machine, which comprises a rack, a patching and mounting module arranged at the upper end of the rack, a horizontal plate arranged on the rack, side plates arranged on the horizontal plate, limiting tracks arranged on the side plates, baffles arranged on the limiting tracks, lifting components arranged on the baffles, drying components arranged above the lifting components, positioning components arranged between the two side plates, and buffer components arranged at the lower ends of the positioning components. The soldering pad is lifted to a proper height by the cylinder, and the lower end of the soldering pad is supported by the supporting plate. When the device is mounted on the soldering pad, the soldering pad will not be deformed as a whole due to excessive suction nozzle pressure, the device and the soldering pad are in good contact, the molten tin paste can be fully filled in the gap between the device and the soldering pad during reflow soldering, false welding is avoided, and the structural strength of the welding point and the stability of the electrical connection are ensured.

Description

Technical Field

[0001] This invention relates to the field of device placement technology, specifically to an automatic device placement machine. Background Technology

[0002] As electronic products become smaller and lighter, traditional through-hole mounting technology can no longer meet the needs of high-density and high-precision assembly. Therefore, surface mount technology (SMT) has emerged. SMT technology simplifies the production process, improves production efficiency, and reduces production costs by directly mounting components on the PCB pads and soldering them through processes such as reflow soldering. The pick-and-place machine is the core equipment of the SMT production line.

[0003] The development of SMT technology is inseparable from the advancement of soldering technology. The research and development of new soldering materials, such as lead-free solder paste, and the continuous improvement of soldering processes such as reflow soldering and wave soldering have provided a guarantee for the reliable connection between components and PCBs in SMT technology, ensuring the quality and stability of products.

[0004] When existing pick-and-place machines mount components onto thin PCB pads, the lack of sufficient support at the bottom of the PCB pads and the poor rigidity of thin PCB pads make them susceptible to concentrated local stress during the mounting process. This causes deformation of the PCB pads, which alters the contact state between the components and the pads, resulting in uneven gaps. Consequently, during reflow soldering, the melted solder paste cannot fully fill the gaps, leading to cold solder joints and reducing the mechanical strength and electrical connection stability of the solder joints.

[0005] In addition, during long-term use, the Z-axis (vertical direction) motion mechanism of the pick-and-place machine will experience a decrease in accuracy, which will cause excessive downward pressure of the nozzle during component placement, resulting in deformation of the PCB pads. At this time, the problem of insufficient support at the bottom of the PCB pads on the pick-and-place machine becomes more prominent. Summary of the Invention

[0006] The purpose of this invention is to provide an automatic device placement machine to solve the problems mentioned in the above process.

[0007] To achieve the above objectives, the present invention provides the following technical solution: an automatic component placement machine, comprising a frame, a placement module disposed on the upper end of the frame, a horizontal plate disposed on the frame, side plates symmetrically disposed on the upper surface of the horizontal plate, a limiting track symmetrically disposed on the side plate away from the horizontal plate, a baffle disposed on the limiting track away from the side plate, a lifting component disposed on one of the baffles, a drying component disposed above the lifting component, a positioning component disposed between the two side plates, the positioning component comprising a support plate, pulleys disposed at the four corners of the support plate, the pulleys being slidably disposed on the limiting track, and the positioning component being used to support and position the solder pads;

[0008] A buffer component is provided at the lower end of the positioning component. The buffer component is located in the area between the positioning component and the horizontal plate. The buffer component is used to buffer the rigid stress on the solder pad. A cylinder is provided at the lower end of the frame. The end of the cylinder away from the frame passes through the horizontal plate and is connected to the buffer component.

[0009] The buffer component includes an air cylinder and a piston plate slidably disposed inside the air cylinder. A piston rod is disposed at the end of the piston plate away from the horizontal plate. A guide plate is disposed at the piston rod away from the piston plate. A rotating cylinder is sleeved on the outside of the guide plate. Guide grooves are symmetrically disposed on the inside of the rotating cylinder. The end of the rotating cylinder away from the air cylinder is connected to a positioning component.

[0010] The piston rod is provided with a support rod array on its outer side, and the end face of the air cylinder away from the horizontal plate is provided with a sliding groove array. The support rod can slide in the sliding groove. A damper is provided at the end of the sliding groove away from the support rod. A slider is provided at the end of the damper near the support rod. A sliding roller is rotatably provided on the slider.

[0011] In a preferred embodiment of the automatic chip mounter of the present invention, heating wires are laid longitudinally inside the support plate, an air cavity is formed inside the support plate, a drive plate is rotatably mounted on the lower surface of the support plate, connecting rods are hinged at both ends of the drive plate, and a positioning plate is hinged at the end of the connecting rod away from the drive plate.

[0012] In a preferred embodiment of the automatic chip mounter of the present invention, mounting blocks are symmetrically arranged on the upper surface of the positioning plate, and a right-angle bracket is rotatably mounted on the mounting blocks.

[0013] In a preferred embodiment of the automatic placement machine for the device described in this invention, the lifting component includes a lifting box, and a lifting plate is slidably disposed within the lifting box.

[0014] In a preferred embodiment of the automatic chip mounter of the present invention, the lifting box is provided with a lifting groove, the lifting groove is provided with an air outlet groove, a magnetic block is symmetrically arranged in the lifting groove, and a slidable horn plate is slidably arranged in the lifting groove.

[0015] In a preferred embodiment of the automatic chip mounter of the present invention, a water tank is provided on the lifting box, a baffle plate is provided inside the water tank, an exhaust box is provided on the water tank, and an array of exhaust grooves is provided on the exhaust box.

[0016] In a preferred embodiment of the automatic chip mounter for the device described in this invention, the drying component includes a drying box, and a drying plate is slidably disposed inside the drying box.

[0017] As a preferred embodiment of the automatic chip mounter of the device described in this invention, wherein: a drying groove is provided at one end of the drying box away from the support plate, a slidable horn plate is provided in the drying groove, and an opening and closing groove is provided on the horn plate.

[0018] As a preferred embodiment of the automatic chip mounter of the device described in this invention, wherein: a drying trough 2 is provided at one end of the drying box near the support plate, an emptying trough is provided in the drying trough 2, a slidable horn plate 3 is provided in the drying trough 2, and an opening and closing groove 2 is provided on the horn plate 3.

[0019] As a preferred embodiment of the automatic chip mounter of the present invention, the drying component further includes a drying rod one and a drying rod two. The drying rod one is slidably inserted into the drying rod two. The end of the drying rod one away from the drying rod two is connected to a lifting plate. The end of the drying rod two away from the drying rod one is provided with a connecting plate. The connecting plate is disposed in the drying box, and the two ends of the connecting plate are symmetrically hinged with pull rods. The end of the pull rod away from the connecting plate is hinged with a top rod. The two side walls of the drying box are provided with slots.

[0020] Compared with the prior art, the beneficial effects of the present invention are:

[0021] 1. By setting up a support plate and placing the pads on the upper surface of the support plate, and then using a cylinder to lift the pads to an appropriate height for component mounting, the support plate supports the lower end of the pads, so that the pads will not deform as a whole due to excessive downward pressure from the nozzle when the components are mounted on them. This ensures good contact between the components and the pads, so that when the pads with the components are mounted are reflowed, the molten solder paste can fully fill the gap between the components and the pads, avoiding cold solder joints and ensuring the structural strength of the solder joints and the stability of the electrical connection.

[0022] 2. By setting heating wires inside the support plate, the heat generated by the heating wires can preheat the pads and solder paste, thereby increasing the activity of the solder resist in the solder paste, and thus improving the reliability and conductivity of the solder joints.

[0023] 3. By setting up positioning components, the two positioning plates move closer to each other as the pads are lifted by the cylinder. At the same time, four right-angle brackets are used to position the pads on the support plate, thereby improving the mounting accuracy of the components.

[0024] 4. By setting up a buffer component, when the nozzle is mounting the device on the pad and the downward pressure is large, the support rod pushes the slider, the slider pushes the damper, and the damper consumes the downward pressure of the nozzle, so that the pad can properly avoid the nozzle, thereby avoiding local deformation or cracks of the pad due to rigid stress, and improving the mounting quality of the pad.

[0025] 5. By setting up an air cylinder, after the pads are pushed to an appropriate height, the humid gas can be discharged to the upper surface of the pads. The moisture is used to wet the solder paste on the pads, preventing the solder paste from becoming too dry and affecting the placement quality of the components. At the same time, by shifting the drying board, after the moisture is discharged, the nitrogen in the drying box will be discharged to the upper surface of the pads. The nitrogen is used to isolate the air from the pads and solder paste, reducing the contact between the moisture in the air and the solder paste, thereby preventing the solder paste from absorbing too much moisture. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the overall structure of the automatic chip mounter for the device of this invention.

[0027] Figure 2 This is a schematic diagram of a partial explosion of the buffer component of the automatic placement machine for the device of the present invention.

[0028] Figure 3 This is a schematic diagram of the structure of the damper and slider of the automatic placement machine for the device of the present invention.

[0029] Figure 4 This is a top view of the positioning component of the automatic placement machine for the device of the present invention.

[0030] Figure 5 Automatic chip mounter for the device of this invention Figure 4 Enlarged structural diagram at point A in the middle.

[0031] Figure 6 This is a schematic diagram of the heating wire and air cavity of the automatic chip mounter for the device of the present invention.

[0032] Figure 7 This is a bottom view of the positioning component of the automatic placement machine for the device of the present invention.

[0033] Figure 8 This is a schematic diagram of a partial explosion of the lifting component of the automatic placement machine for the device of the present invention.

[0034] Figure 9 This is a cross-sectional structural schematic diagram of the water tank and exhaust box of the automatic chip mounter for the device of the present invention.

[0035] Figure 10 This is a schematic diagram of the structure of the drying tank 1 and the horn plate 2 of the automatic chip mounter of the present invention.

[0036] Figure 11 This is a schematic diagram of the structure of the drying tank 2 and the horn plate 3 of the automatic chip mounter of the present invention.

[0037] In the picture:

[0038] 1. Frame; 11. Mounting module; 12. Horizontal plate; 13. Side plate; 14. Limiting rail; 15. Baffle; 16. Cylinder;

[0039] 2. Lifting components; 21. Lifting box; 22. Lifting plate; 23. Lifting groove; 24. Air outlet groove; 25. Magnetic block one; 26. Horn plate one; 27. Water tank; 28. Water baffle; 29. ​​Exhaust box; 291. Exhaust groove;

[0040] 3. Drying components; 31. Drying box; 32. Drying plate; 33. Drying trough one; 34. O-corner plate two; 341. Opening and closing slot one; 35. Drying trough two; 351. Exhaust trough; 36. O-corner plate three; 361. Opening and closing slot two; 37. Drying rod one; 371. Drying rod two; 38. Connecting plate; 381. Pull rod; 382. Top rod; 39. Slot;

[0041] 4. Positioning components; 41. Support plate; 42. Pulley; 43. Heating wire; 44. Air chamber; 45. Drive plate; 46. Connecting rod; 47. Positioning plate; 48. Mounting block; 49. Right-angle bracket;

[0042] 5. Buffer component; 51. Air cylinder; 52. Piston plate; 53. Piston rod; 54. Guide plate; 55. Rotating cylinder; 56. Support rod; 57. Slide groove; 58. Damper; 59. Slider; 591. Sliding roller. Detailed Implementation

[0043] The features and exemplary embodiments of various aspects of the present invention will now be described in detail. Numerous specific details are set forth in the following detailed description to provide a thorough understanding of the invention. However, it will be apparent to those skilled in the art that the invention may be practiced without requiring some of these specific details. The following description of embodiments is merely intended to provide a better understanding of the invention by illustrating examples of the invention. The invention is by no means limited to any specific configurations and algorithms presented below, but covers any modifications, substitutions, and improvements to elements, components, and algorithms without departing from the spirit of the invention. Well-known structures and techniques are not shown in the drawings and the following description in order to avoid unnecessarily obscuring the invention.

[0044] Example 1

[0045] Reference Figure 1-8 As a first embodiment of the present invention, an automatic device placement machine is provided. This automatic device placement machine includes a frame 1, with a placement module 11 disposed on the upper end of the frame 1. The placement module 11 includes a transmission mechanism and a placement head disposed thereon. The transmission mechanism includes X, Y, and Z axis rotation mechanisms for realizing the movement of the placement head in a plane and vertical direction. The placement head is provided with a vacuum nozzle for picking up devices by vacuum adsorption. A horizontal plate 12 is disposed on the frame 1, and side plates 13 are symmetrically disposed on the upper surface of the horizontal plate 12. Limiting rails 1 are symmetrically disposed at the ends of the side plates 13 away from the horizontal plate 12. 4. A baffle 15 is provided at the end of the limiting track 14 away from the side plate 13. A buffer cotton is provided on the side of the baffle 15 away from the limiting track 14 and close to the horizontal plate 12. A lifting component 2 is provided on one baffle 15. A drying component 3 is provided above the lifting component 2. A positioning component 4 is provided between the two side plates 13. The positioning component 4 includes a support plate 41. Pulleys 42 are provided at the four corners of the support plate 41. The pulleys 42 are slidably arranged on the limiting track 14. The positioning component 4 is used to support and position the solder pad. A limiting rod is provided between the side plate 13 and the baffle 15. The limiting rod passes through the support plate 41.

[0046] A buffer component 5 is provided at the lower end of the positioning component 4. The buffer component 5 is located in the area between the positioning component 4 and the horizontal plate 12. The buffer component 5 is used to buffer the rigid stress on the solder pad. A cylinder 16 is provided at the lower end of the frame 1. The end of the cylinder 16 away from the frame 1 passes through the horizontal plate 12 and is connected to the buffer component 5.

[0047] The buffer component 5 includes an air cylinder 51 and a piston plate 52 slidably disposed inside the air cylinder 51. Limiting plates are symmetrically arranged on the upper surface of the horizontal plate 12. The air cylinder 51 is engaged and slidably disposed between the two limiting plates. A one-way valve is provided on the upper part of the air cylinder 51 to allow gas from the external environment to enter the air cylinder 51. The telescopic end of the cylinder 16 passes through the horizontal plate 12 and is connected to the bottom of the air cylinder 51. A piston rod 53 is provided at the end of the piston plate 52 away from the horizontal plate 12. The end of the piston rod 53 away from the piston plate 52 passes through the air cylinder 51. A guide plate 54 is provided for the piston rod 53 away from the piston plate 52. A rotating cylinder 55 is sleeved on the outer side of the guide plate 54. Guide grooves are symmetrically arranged on the inner side of the rotating cylinder 55. Guide shafts are symmetrically arranged on the outer side of the guide plate 54. The guide shafts are slidably disposed in the guide grooves. The end of the rotating cylinder 55 away from the air cylinder 51 is connected to the positioning component 4.

[0048] A strut 56 is arranged in an array on the outer side of the piston rod 53. A slide groove 57 is arranged in an array on the end face of the air cylinder 51 away from the horizontal plate 12, allowing the strut 56 to slide within the slide groove 57. A piston groove is arranged in an array on the outer side of the piston rod 53, and the strut 56 is hinged within the piston groove. The piston groove communicates with the slide groove 57. A guide wheel is rotatably arranged on the end of the strut 56 away from its connection with the piston groove. The guide wheel engages and slides with the piston groove and the slide groove 57. A damper 58 is arranged on the end of the slide groove 57 away from the strut 56. The damper 58 is preferably a pneumatic damper 58, consisting of a cylinder and a piston, utilizing the compressibility of gas. The damping effect is provided by compression and viscosity. The compression and expansion of the gas absorbs and releases energy, and the viscous friction between the gas and the cylinder wall and piston during the flow also consumes energy, thus playing a damping role. A slider 59 is provided at one end of the damper 58 near the support rod 56. A sliding roller 591 is rotatably mounted on the slider 59. The slider 59 is engaged and slidably mounted in the slide groove 57. The sliding roller 591 is located on the side of the slider 59 away from the damper 58. The guide wheel can contact the sliding roller 591. The sliding roller 591 is used to reduce the frictional resistance when the guide wheel contacts and moves with the sliding roller 591.

[0049] Heating wires 43 are laid longitudinally inside the support plate 41. An air cavity 44 is opened inside the support plate 41. A drive plate 45 is rotatably mounted on the lower surface of the support plate 41. Connecting rods 46 are hinged at both ends of the drive plate 45. A positioning plate 47 is hinged at the end of the connecting rod 46 away from the drive plate 45. The heating wires 43 are electrically connected to a power source. When current flows through the heating wires 43, electrical energy is converted into heat energy. An air pipe is connected to the air cylinder 51. The end of the air pipe away from the air cylinder 51 is connected to the support plate 41, and the air cavity 44 is connected to the inside of the air cylinder 51. The side of the drive plate 45 away from the support plate 41 is fixedly connected to the rotating cylinder 55. The connecting rod 46 consists of a movable rod 1, a movable rod 2, and a spring 1. The movable rod 1 is inserted into the movable rod 2, and the spring 1 is connected to the movable rod 1 and the movable rod 2 respectively. The positioning plate 47 is slidably mounted on the lower surface of the support plate 41.

[0050] Mounting blocks 48 are symmetrically arranged on the upper surface of the positioning plate 47. A right-angle bracket 49 is rotatably mounted on the mounting block 48. A limiting shaft is provided on the upper surface of the positioning plate 47. The limiting shaft contacts the right-angle bracket 49 and can limit the right-angle bracket 49. An arc groove is opened on the upper surface of the positioning plate 47. A spring 2 is provided in the arc groove. A sliding shaft is connected to the spring 2. The sliding shaft can contact the right-angle bracket 49 under the elastic force of the spring 2. The middle area of ​​the right-angle bracket 49 is connected to the positioning plate 47. Rubber wheels are rotatably mounted at both ends of the right-angle bracket 49.

[0051] During use, first place the solder pads with solder paste printed on the surface on the support plate 41, then start the cylinder 16. The moving end of the cylinder 16 will push the air cylinder 51, and then the air cylinder 51 will move towards the piston plate 52. At this time, the air cylinder 51 inside the air cylinder 51 will enter the air chamber 44 through the air pipe under the action of the piston plate 52.

[0052] At the same time, the power will be turned on, so that the current flows through the heating wire 43. At this time, the electrical energy flowing through the heating wire 43 will be converted into heat energy. Then the heat generated by the heating wire 43 will be transferred to the solder pad, solder paste and gas in the air cavity 44 through the support plate 41.

[0053] Meanwhile, the guide shaft on the guide plate 54 slides along the guide groove, and then the rotating cylinder 55 rotates. The drive plate 45 rotates synchronously with the rotating cylinder 55. Then, the drive plate 45 pulls the two positioning plates 47 closer to each other through the connecting rod 46. Then, the mounting plates on the two positioning plates 47 approach each other. When one end of the right angle bracket 49 on the mounting plate contacts the pad, as the two positioning plates 47 continue to move, the right angle bracket 49 will gradually rotate until both ends of the right angle bracket 49 are in contact with the side of the pad. The right angle bracket 49 applies appropriate pushing force to the pad. By setting right angle brackets 49 at the four corners of the pad, the pad on the support plate 41 is positioned and clamped by the interaction of the four right angle brackets 49. During the rotation of the right angle bracket 49, the right angle bracket 49 pushes the sliding shaft to slide in the arc groove. At this time, the spring is deformed.

[0054] When the drive plate 45 pulls the positioning plate 47 through the connecting rod 46, when the right angle bracket 49 has positioned and clamped the solder pad, as the guide shaft on the guide plate 54 continues to drive the rotating cylinder 55 to rotate, the spring 1 will deform, and the movable rod 1 will gradually extend out from the movable rod 2 until the rotating cylinder 55 rotates to the limit position.

[0055] As the moving end of the cylinder 16 pushes the cylinder 51, piston plate 52, piston rod 53, guide plate 54, rotating cylinder 55, drive plate 45, and support plate 41, the pulley 42 slides linearly along the limit track 14. Then the support plate 41 will push the solder pad, so that the edge of the upper surface of the solder pad is in close contact with the buffer cotton on the lower surface of the baffle 15.

[0056] Meanwhile, as the air cylinder 51 moves toward the piston plate 52, the support rod 56 will slide from the piston groove into the slide groove 57. Then, the guide wheel at the end of the support rod 56 away from the piston rod 53 will contact the sliding roller 591 on the slider 59. As the piston rod 53 continues to retract into the air cylinder 51, the support rod 56 will further push the slider 59. At this time, the damper 58 will block the slider 59.

[0057] When the transmission mechanism drives the vacuum nozzle on the placement head to pick up and place the device, the support plate 41 supports the pad. At the same time, when the pressure under the vacuum nozzle is too high, the pad, support plate 41, drive plate 45, rotating cylinder 55, and piston rod 53 will move towards the air cylinder 51. At this time, the support rod 56 will further push the slider 59, and then the damper 58 will consume the pushing force of the support rod 56, so that the pad can move down appropriately when the pressure under the vacuum nozzle is too high.

[0058] Example 2

[0059] Reference Figure 1-9 This is the second embodiment of the present invention, which differs from the first embodiment in that:

[0060] The lifting component 2 includes a lifting box 21, a lifting plate 22 is slidably disposed inside the lifting box 21, the lifting box 21 is disposed on the upper surface of the baffle 15, a fixing rod 1 is symmetrically disposed inside the lifting box 21, the two ends of the fixing rod 1 are respectively connected to the upper and lower ends of the lifting box 21, and the fixing rod 1 passes through the lifting plate 22, a spring 3 is sleeved on the outside of the fixing rod 1, the spring 3 is disposed on the upper end of the lifting plate 22, an air pipe 2 is disposed on the support plate 41, the end of the air pipe 2 away from the support plate 41 is connected to the lifting box 21, and the air chamber 44 is connected to the inside of the lifting box 21.

[0061] The lifting box 21 is provided with a lifting groove 23, the lifting groove 23 is provided with an air outlet groove 24, the lifting groove 23 is symmetrically provided with a magnetic block 25, and the lifting groove 23 is slidably provided with a horn plate 26. The air outlet groove 24 penetrates the lifting box 21. The magnetic block 25 is embedded in the groove wall at both ends of the lifting groove 23. The two ends of the horn plate 26 are magnetic. The horn plate 26 can be attracted with the magnetic block 25 and can block the air outlet groove 24.

[0062] A water tank 27 is provided on the lifting box 21. A baffle plate 28 is provided inside the water tank 27. An exhaust box 29 is provided on the water tank 27. An exhaust channel 291 is arranged in an array on the exhaust box 29. The water tank 27 is located at one end of the lifting box 21 near the exhaust channel 24. The water tank 27 is filled with water. The baffle plate 28 is located at the upper end of the water surface. An air hole is arranged in an array on the baffle plate 28. An air pipe 3 is connected to the exhaust channel 24 of the lifting box 21. The end of the air pipe 3 away from the lifting box 21 is connected to the lower end of the water tank 27. A one-way valve 2 is provided at the connection between the air pipe 3 and the water tank 27. The gas in the lifting box 21 can be introduced into the water tank 27 through the air pipe 3.

[0063] The exhaust box 29 is located at the end of the water tank 27 away from the lifting box 21. The upper end of the water tank 27 is provided with an air pipe 4. The end of the air pipe 4 away from the water tank 27 is connected to the exhaust box 29. The gas in the water tank 27 can be introduced into the exhaust box 29 through the air pipe 4. Then the gas introduced into the exhaust box 29 can be discharged through the exhaust channel 291 and directed toward the support plate 41.

[0064] During use, as the support plate 41 rises, the gas in the air cylinder 51 enters the air chamber 44 through the first air pipe. The gas entering the air chamber 44 is then heated. After being heated, the gas in the air chamber 44 enters the lifting box 21 through the second air pipe. At this time, the air outlet 24 is blocked by the first horn plate 26.

[0065] As the gas in the lifting box 21 gradually increases, the lifting plate 22 will move towards the drying component 3 under the action of gas pressure. At this time, the spring is deformed. When the lifting plate 22 moves to a certain position, the lifting plate 22 will push the horn plate 26, causing the horn plate 26 to be pushed and lifted by the lifting plate 22. Then the horn plate 26 will no longer block the air outlet groove 24.

[0066] At this time, the gas in the lifting box 21 enters the water tank 27 through the air outlet 24, air pipe three, and one-way valve two. At the same time, the lifting plate 22 will gradually return to its original position under the elastic force of spring three. The gas entering the water tank 27 through air pipe three will first come into contact with the water, and then the gas will be discharged from the water surface and enter the exhaust box 29 through air pipe four. The gas in the exhaust box 29 will then be discharged through multiple exhaust channels 291. At this time, the gas discharged from the exhaust channel 291 has a high humidity.

[0067] Before the gas is discharged from the exhaust channel 291, the support plate 41 has already lifted the pad to contact the buffer plate on the baffle 15. When the gas containing moisture is discharged from the exhaust channel 291 toward the pad, the moisture will wet the solder paste on the pad, preventing the solder paste from drying out too much before the device is mounted, which would affect the mounting quality of the device.

[0068] The remaining structure is the same as that in Example 1.

[0069] Example 3

[0070] Reference Figure 1-11 This is the third embodiment of the present invention, which differs from the second embodiment in that:

[0071] The drying component 3 includes a drying box 31, in which a drying plate 32 is slidably disposed. The drying box 31 is located at the upper end of the lifting box 21. Two fixing rods are symmetrically arranged at the upper end of the drying plate 32. The end of the fixing rods away from the drying plate 32 passes through the upper end of the drying box 31. A spring four is sleeved on the outside of the fixing rods two. The spring four is located at the upper end of the drying plate 32. A nitrogen storage tank is provided on the frame 1. The nitrogen storage tank is connected to the drying box 31 through a pipe. A nitrogen groove is opened on the drying box 31. The nitrogen storage tank is connected to the interior of the drying box 31. The nitrogen storage tank is filled with nitrogen. Nitrogen is an inert and dry gas. An air pump is provided in the nitrogen storage tank. The nitrogen in the nitrogen storage tank can enter the drying box 31 through the nitrogen groove.

[0072] A drying groove 33 is provided at the end of the drying box 31 away from the support plate 41. A slidable horn plate 34 is provided in the drying groove 33. An opening and closing groove 341 is provided on the horn plate 34. The nitrogen tank is connected to the drying groove 33. Both the horn plate 34 and the drying plate 32 can seal the nitrogen tank. Magnetic blocks 2 are embedded in the upper and lower walls of the drying groove 35. Both the upper and lower ends of the horn plate 34 are magnetic. The horn plate 34 can be attracted to the magnetic blocks 2.

[0073] A drying trough 35 is provided at one end of the drying box 31 near the support plate 41. An venting trough 351 is provided in the drying trough 35. A slidable horn plate 36 is provided in the drying trough 35. An opening and closing groove 361 is provided on the horn plate 36. The venting trough 351 passes through the drying box 31. Magnetic blocks 3 are embedded at the upper and lower ends of the drying trough 35. Both ends of the horn plate 36 are magnetic. The horn plate 36 can be attracted with the magnetic blocks 3 and can block the opening and closing groove 361. An air pipe 5 is provided at the venting trough 351. The end of the air pipe 5 away from the drying box 31 is connected to the exhaust box 29. The drying box 31 and the exhaust box 29 are internally connected.

[0074] The drying component 3 also includes a first drying rod 37 and a second drying rod 371. The first drying rod 37 is slidably inserted into the second drying rod 371. The end of the first drying rod 37 away from the second drying rod 371 is connected to the lifting plate 22. The end of the second drying rod 371 away from the first drying rod 37 is provided with a connecting plate 38. The connecting plate 38 is disposed in the drying box 31, and the two ends of the connecting plate 38 are symmetrically hinged with pull rods 381. The end of the pull rod 381 away from the connecting plate 38 is hinged with a top rod 382. The drying box 3... 1. Slots 39 are provided on both side walls. A limiting block is symmetrically provided on the end face of the drying plate 32 away from the second fixing rod. The top rod 382 is slidably provided in the limiting block. The top rod 382 can be locked in the slot 39. A guide rod is also provided in the middle area of ​​the end face of the drying plate 32 where the limiting block is provided. The end of the guide rod away from the drying plate 32 passes through the connecting plate 38 and is locked and slidably inserted into the second drying rod 371. A spring 5 is sleeved on the outside of the guide rod. The spring 5 is provided between the connecting plate 38 and the drying plate 32.

[0075] During use, when the lifting plate 22 rises, the drying rod 37 will gradually extend into the drying rod 371. When the drying rod 37 extends to the limit position inside the drying rod 371, the drying rod 37 will push the drying rod 371 to rise synchronously. At this time, the connecting plate 38 will push the push rod 382 through the pull rod 381. Since the push rod 382 is in contact with the inner wall of the drying box 31, the drying plate 32 will move away from the lifting plate 22.

[0076] Initially, the second horn plate 34 does not block the nitrogen tank, but the drying plate 32 does. When the drying plate 32 moves to contact the second horn plate 34, nitrogen can enter the drying box 31 through the nitrogen tank. When the drying plate 32 rises to its limit position, the push rod 382 moves to the slot 39 and extends into the slot 39. At the same time, the drying plate 32 pushes the second horn plate 34, causing it to block the nitrogen tank and preventing nitrogen from entering the drying box 31. Initially, the third horn plate 36 blocks the venting slot 351. When the drying plate 32 moves to its limit position, it pushes the third horn plate 36, at which point the third horn plate 36 will no longer block the venting slot 351.

[0077] When the lifting plate 22 descends, the drying rod 37 gradually extends from the drying rod 371. When the lifting plate 22 returns to its initial position, the drying rod 371 will pull the top rod 382 through the connecting plate 38 and the pull rod 381, causing the top rod 382 to separate from the slot 39. Then the drying plate 32 will return to its original position under the elastic force of the spring 4. At this time, the nitrogen in the drying box 31 will be introduced into the exhaust box 29 through the gas pipe 5, and then discharged to the solder pad through the exhaust groove 291.

[0078] When the drying plate 32 descends to its initial position, it will push the second horn plate 34, so that the second horn plate 34 will no longer block the nitrogen tank, but the drying plate 32 will block the nitrogen tank, preventing nitrogen from entering the drying box 31. At the same time, the drying plate 32 will push the third horn plate 36, so that the third horn plate 36 will reset and block the venting tank 351.

[0079] The remaining structure is the same as that in Example 2.

[0080] Different technical features appearing in different embodiments can be combined to achieve beneficial effects. Those skilled in the art, based on a study of the drawings, specification, and claims, should be able to understand and implement other variations of the disclosed embodiments. In the claims, the term "comprising" does not exclude other means or steps; the indefinite article "a" does not exclude a plurality; the terms "first" and "second" are used to identify names rather than to indicate any particular order. No reference numerals in the claims should be construed as limiting the scope of protection. The functionality of multiple parts appearing in the claims can be implemented by a single hardware or software module. The appearance of certain technical features in different dependent claims does not mean that these technical features cannot be combined to achieve beneficial effects.

Claims

1. An automatic component placement machine, comprising a frame, wherein a placement module is disposed at the upper end of the frame, characterized in that, The frame is provided with a horizontal plate, and side plates are symmetrically arranged on the upper surface of the horizontal plate. Limiting rails are symmetrically arranged at the ends of the side plates away from the horizontal plate. Baffles are arranged at the ends of the limiting rails away from the side plates. A lifting component is arranged on one of the baffles. A drying component is arranged above the lifting component. A positioning component is arranged between the two side plates. The positioning component includes a support plate. Pulleys are arranged at the four corners of the support plate. The pulleys are slidably arranged on the limiting rails. The positioning component is used to support and position the solder pads. A buffer component is provided at the lower end of the positioning component. The buffer component is located in the area between the positioning component and the horizontal plate. The buffer component is used to buffer the rigid stress on the solder pad. A cylinder is provided at the lower end of the frame. The end of the cylinder away from the frame passes through the horizontal plate and is connected to the buffer component. The buffer component includes an air cylinder and a piston plate slidably disposed inside the air cylinder. A piston rod is disposed at the end of the piston plate away from the horizontal plate. A guide plate is disposed at the piston rod away from the piston plate. A rotating cylinder is sleeved on the outside of the guide plate. Guide grooves are symmetrically disposed on the inside of the rotating cylinder. The end of the rotating cylinder away from the air cylinder is connected to a positioning component. The piston rod is provided with a support rod array on its outer side, and the end face of the air cylinder away from the horizontal plate is provided with a sliding groove array. The support rod can slide in the sliding groove. A damper is provided at the end of the sliding groove away from the support rod. A slider is provided at the end of the damper near the support rod. A sliding roller is rotatably provided on the slider. Heating wires are laid longitudinally inside the support plate, an air cavity is opened inside the support plate, a drive plate is rotatably mounted on the lower surface of the support plate, connecting rods are hinged at both ends of the drive plate, and a positioning plate is hinged at the end of the connecting rod away from the drive plate. The heat generated by the heating wire is transferred to the air chamber through the support plate; The upper surface of the positioning plate is symmetrically provided with mounting blocks, and a right-angle bracket is rotatably mounted on the mounting blocks; The upper surface of the positioning plate is provided with a limiting shaft, which contacts the right-angle frame and can limit the right-angle frame. The upper surface of the positioning plate is provided with an arc groove, and a second spring is provided in the arc groove. A sliding shaft is connected to the second spring, and the sliding shaft can contact the right-angle frame under the elastic force of the second spring. The middle area of ​​the right-angle frame is connected to the positioning plate, and rubber wheels are rotatably provided at both ends of the right-angle frame. By setting right-angle brackets at the four corners of the pads, the pads on the support plate are positioned and clamped by the interaction of the four right-angle brackets. During the rotation of the right-angle brackets, the right-angle brackets will push the sliding shaft to slide in the superior arc groove, at which time the spring is deformed.

2. The automatic chip mounter for devices according to claim 1, characterized in that: The lifting component includes a lifting box, and a lifting plate is slidably disposed inside the lifting box.

3. The automatic chip mounter for devices according to claim 2, characterized in that: The lifting box is provided with a lifting groove, the lifting groove is provided with an air outlet groove, a magnetic block is symmetrically arranged in the lifting groove, and a slidable horn plate is arranged in the lifting groove.

4. The automatic chip mounter for devices according to claim 2, characterized in that: The lifting box is equipped with a water tank, the water tank is equipped with a baffle plate, the water tank is equipped with an exhaust box, and the exhaust box is equipped with an array of exhaust slots.

5. The automatic chip mounter for devices according to claim 1, characterized in that: The drying component includes a drying box, and a drying plate is slidably disposed inside the drying box.

6. The automatic chip mounter for devices according to claim 5, characterized in that: The drying box has a drying groove one at the end away from the support plate, and a slidable horn plate two is provided in the drying groove one, with an opening and closing groove one on the horn plate two.

7. An automatic chip mounter for devices according to claim 5, characterized in that: The drying box is provided with a drying trough two at one end near the support plate. The drying trough two is provided with an emptying trough. A slidable horn plate three is provided in the drying trough two. The horn plate three is provided with an opening and closing groove two.

8. The automatic chip mounter for devices according to claim 1, characterized in that: The drying component further includes a drying rod one and a drying rod two. The drying rod one is slidably inserted into the drying rod two. The end of the drying rod one away from the drying rod two is connected to a lifting plate. The end of the drying rod two away from the drying rod one is provided with a connecting plate. The connecting plate is disposed inside the drying box, and the two ends of the connecting plate are symmetrically hinged with pull rods. The end of the pull rod away from the connecting plate is hinged with a top rod. The drying box has slots on both side walls.

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