Ceramic matrix composite structure and manufacturing method thereof

Abstract

The invention relates to a ceramic matrix composite structure and a manufacturing method thereof. An electronic control method of manufacturing a ceramic matrix composite structure having a desired shape is provided. The electronic control method includes processing a plurality of ceramic matrix composite layers at a first location to form a stack of the plurality of ceramic matrix composite layers. The electronic control method also includes transporting the stack of the plurality of ceramic matrix composite layers from the first location to a second location remote from the first location. The electronic control method also includes processing the stack of the plurality of ceramic matrix composite layers at a second location to provide a ceramic matrix composite structure having a desired shape.

Description

[0001] Priority

[0002] This application claims priority to U.S. Patent Application No. 63 / 603,915, filed on November 29, 2023, the entire content of which is incorporated herein by reference. Technical Field

[0003] This application relates to composite structures, and more particularly to ceramic matrix composite structures and methods of manufacturing the same. Background Art

[0004] Ceramic matrix composites have different viscosities and textures than polymer matrix composites, and thus require different processing methods. The ceramic fibers of ceramic matrix composites are more brittle and harder than the carbon fibers of polymer matrix composites. The more brittle and harder fibers, combined with the different organic tackifier component resins of ceramic fibers, require different processing methods during the manufacture of ceramic matrix composite structures.

[0005] Conventional ceramic matrix composite structures are manufactured using a manual layup process. The disadvantage of using a manual layup process to manufacture ceramic matrix composite structures is the variability in the quality and consistency of the ceramic matrix composite structures. Therefore, manual inspection and rework are often required. Another disadvantage is that the manual layup process is time-consuming and requires skilled technicians. The overall result is an increase in cycle time and an increase in the labor cost of manufacturing ceramic matrix composite structures.

[0006] Although some progress has been made, those skilled in the art continue to conduct research and development work in the field of manufacturing ceramic matrix composite structures. Summary of the Invention

[0007] In one aspect, an electronically controlled method of manufacturing a non-polymeric structure having a desired shape is provided. The electronically controlled method includes transporting a stack containing at least a first non-polymeric layer and a second non-polymeric layer from a surface at a first location to a tool surface at a second location different from the first location, such that the stack of at least the first polymeric layer and the second polymeric layer can be manufactured into a non-polymeric structure having a desired shape at the second location.

[0008] In another aspect, an electronically controlled method of manufacturing a ceramic matrix composite structure having a desired shape is provided. The electronically controlled method includes processing a plurality of ceramic matrix composite layers at a first location to form a stack of the plurality of ceramic matrix composite layers. The electronically controlled method further includes transporting the stack of the plurality of ceramic matrix composite layers from the first location to a second location remote from the first location. The electronically controlled method further includes processing the stack of the plurality of ceramic matrix composite layers at the second location to provide a ceramic matrix composite structure having a desired shape.

[0009] In yet another aspect, an electronically controlled method of fabricating a ceramic matrix composite structure having a desired shape is provided. The electronically controlled method includes picking up a first ceramic matrix composite layer sandwiched between a first lower backing film and a first upper backing film, and placing the first ceramic matrix composite layer on a tabletop at a first location. The electronically controlled method further includes peeling off the first upper backing film from the upper surface of the first ceramic matrix composite layer, and picking up a second ceramic matrix composite layer sandwiched between a second lower backing film and a second upper backing film. The electronically controlled method further includes peeling off the second lower backing film from the lower surface of the second ceramic matrix composite layer, and placing the lower surface of the second ceramic matrix composite layer on the upper surface of the first ceramic matrix composite layer to form a stack of at least the first ceramic matrix composite layer and the second ceramic matrix composite layer. The electronically controlled method further includes transporting the stack of at least the first ceramic matrix composite layer and the second ceramic matrix composite layer from the tabletop at the first location to a tool surface at a second location different from the first location, such that the stack of at least the first ceramic matrix composite layer and the second ceramic matrix composite layer can be fabricated into a ceramic matrix composite structure having a desired shape at the second location.

[0010] Other aspects will become apparent from the following detailed description, the drawings, and the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 is a schematic block diagram of an apparatus for fabricating a ceramic matrix composite structure according to an embodiment.

[0012] Figure 2A is a front view of a first non-polymer layer being processed to provide a ceramic matrix composite structure.

[0013] Figure 2B is with Figure 2A A front view of a second non-polymer layer being processed with the first non-polymer layer to provide a ceramic matrix composite structure.

[0014] Figures 3A to 3M is a front view showing specific components of a manufacturing apparatus of Figure 1 at different positions during the fabrication of a ceramic matrix composite structure.

[0015] Figure 4A is Figures 3A to 3F An enlarged front view of an exemplary stack of ceramic matrix composite layers provided.

[0016] Figure 4B is Figures 3G to 3I An enlarged front view of an exemplary compressed stack of ceramic matrix composite layers provided.

[0017] Figure 5 is Figures 3J to 3MEnlarged front view of an exemplary ceramic matrix composite structure being manufactured.

[0018] Figure 6 Is a general flowchart depicting an exemplary method of manufacturing a ceramic matrix composite structure in one embodiment.

[0019] Figure 7 Is a flowchart depicting an exemplary electronic control method of manufacturing a non-polymeric structure having a desired shape in one embodiment.

[0020] Figure 8 Is a flowchart depicting an exemplary electronic control method of manufacturing a ceramic matrix composite structure having a desired shape in another embodiment.

[0021] Figure 9 Is a flowchart depicting an exemplary electronic control method of manufacturing a ceramic matrix composite structure having a desired shape in yet another embodiment.

[0022] Figure 10 Is a flowchart of an aircraft manufacturing and maintenance method.

[0023] Figure 11 Is a block diagram of an aircraft. Detailed Description

[0024] This application relates to ceramic matrix composite structures and methods for manufacturing the same. The specific constitution of the ceramic matrix composite structures and methods for manufacturing the same, as well as the industries in which the structures and methods are implemented, may vary. It should be understood that the following disclosure provides multiple embodiments or examples for implementing different features of various embodiments. Specific examples of components and arrangements are described to simplify the present disclosure. These are only examples and are not intended to be limiting.

[0025] For example, the following disclosure describes ceramic matrix composite structures and methods for manufacturing at least a portion of an aircraft, such as an aircraft exhaust structure. The ceramic matrix composite structures and methods for manufacturing the same may be implemented by an original equipment manufacturer (OEM) in accordance with commercial, military, and space regulations. It is contemplated that the disclosed ceramic matrix composite structures and methods for manufacturing the same may also be implemented in many other ceramic matrix composite manufacturing industries.

[0026] Refer to Figure 1, a schematic block diagram of an apparatus 100 for manufacturing a ceramic matrix composite structure according to an embodiment is shown. The apparatus 100 includes a table 102 having a tabletop 104 at a first position, and a tool 110 having a tool surface 112 at a second position different from (i.e., remote from) the first position. The tabletop 104 may include a releasable vacuum or static electricity that can hold a first layer of material in place on the tabletop 104 while placing and compressing other layers of material on the first layer. For example, the tabletop 104 may include a valve-actuated vacuum table. The tool surface 112 has an optional step 114 near the outer periphery of the tool 110. The apparatus 100 also includes a plurality of mechanisms, including a stripping mechanism 120, a pick-up mechanism 130, and a vacuum forming mechanism 140. The stripping mechanism 120 is located at the first position where the table 102 is located.

[0027] The pick-up mechanism 130 is a gripper end effector for picking up and placing sheets (e.g., layers) of material on the tabletop 104 of the table 102 or the tool surface 112 of the tool 110. The pick-up mechanism 130 may include, for example, an electrostatic gripper or a vacuum gripper. The pick-up mechanism 130 moves in opposite directions indicated by arrows X and Y between the first position where the table 102 is located and the second position where the tool 110 is located. The vacuum forming mechanism 140 includes a vacuum membrane 142 and is located at the second position where the tool 110 is located. The structures and operations of the stripping mechanism, the pick-up mechanism, and the vacuum forming mechanism are known and conventional and will therefore not be described further.

[0028] Although Figure 1 only one pick-up mechanism (i.e., the pick-up mechanism 130) is shown, it is conceivable to provide two pick-up mechanisms, one pick-up mechanism being associated with the first position and the other pick-up mechanism being associated with the second position. It is also conceivable to provide two stripping mechanisms, one stripping mechanism being associated with the first position and the other stripping mechanism being associated with the second position. For the purposes of simplicity and explanation, only one pick-up mechanism and only one stripping mechanism as shown in Figure 1 will be used and described herein.

[0029] Referring to Figure 2A , a front view of a first non-polymer layer 210 that is processed to provide a ceramic matrix composite structure is shown. The first non-polymer layer 210 includes a first ceramic matrix composite layer 212 sandwiched between a first upper backing film 211 and a first lower backing film 213. The first ceramic matrix composite layer 212 has a first fiber reinforcement 214 oriented in a first direction as shown by arrow A in Figure 2A . The first fiber reinforcement 214 includes ceramic fibers and the matrix is a ceramic-like material. Alternatively, the first ceramic matrix composite layer 212 may include having a matrix material pre-impregnated (e.g., C f / Si or SiC fa ceramic matrix composite layer of a fabric of (e.g., C / Si or SiC) / SiC).

[0030] The first ceramic matrix composite layer 212 is a non-polymeric material with a viscosity of about 3000 poise to 7000 poise. The viscosity of the first ceramic matrix composite layer 212 can vary with the change in the amount of water contained in the first ceramic matrix composite layer 212. Alternatively, the viscosity of the first ceramic matrix composite layer 212 can vary with the change in the amount of solvent (e.g., non-aqueous) contained in the first ceramic matrix composite layer 212. Other aqueous and non-aqueous compounds are also possible. For a given volume of the first ceramic matrix composite layer 212, the weight of the first ceramic matrix composite layer 212 is less than the weight of a metallic material (e.g., steel) of the same volume.

[0031] Referring Figure 2B , shows a front view of a second non-polymeric layer 220 that is processed with the first non-polymeric layer 210 of Figure 2A to provide a ceramic matrix composite structure. The second non-polymeric layer 220 includes a second ceramic matrix composite layer 222 sandwiched between a second upper backing film 221 and a second lower backing film 223. The second ceramic matrix composite layer 222 has a second fiber reinforcement 224 oriented in a second direction as shown by the arrow B in Figure 2B . The second direction B of the second fiber reinforcement 224 intersects (e.g., is perpendicular to) the first direction A of the first fiber reinforcement 214. It is conceivable that the second direction B of the second fiber reinforcement 224 does not intersect (e.g., is parallel to) the first direction A of the first fiber reinforcement 214. The second fiber reinforcement 224 includes ceramic fibers, and the matrix is a ceramic-like material. Alternatively, the second ceramic matrix composite layer 222 can include a ceramic matrix composite layer of a fabric pre-impregnated with a matrix material (e.g., C f / Si or SiC f / SiC).

[0032] The second ceramic matrix composite layer 222 is a non-polymeric material with a viscosity of about 3000 poise to 7000 poise. The viscosity of the second ceramic matrix composite layer 222 can vary with the change in the amount of water contained in the second ceramic matrix composite layer 222. Alternatively, the viscosity of the second ceramic matrix composite layer 222 can vary with the change in the amount of solvent (e.g., non-aqueous) contained in the second ceramic matrix composite layer 222. Other aqueous and non-aqueous compounds are also possible. For a given volume of the second ceramic matrix composite layer 222, the weight of the second ceramic matrix composite layer 222 is less than the weight of a metallic material (e.g., steel) of the same volume.

[0033] Referring Figures 3A to 3M , the front view shows specific components of a manufacturing apparatus 100 of Figure 1 at different positions during the manufacture of a ceramic matrix composite structure. Overall, Figures 3A to 3F showsFigure 2A and 2B the first non-polymer layer 210 and the second material layer 220 are processed to provide a stack 400 that includes a second upper backing film 221, a first ceramic matrix composite layer 212, a second ceramic matrix composite layer 222, and a first lower backing film 213 (as Figure 4A shown). Figures 3G to 3I It is shown that the stack 400 is processed to convey the stack 400 from the stage 102 at the first position to the tool 110 at the second position. Figures 3J to 3M It is shown that the stack 400 is processed to provide a compressed stack 450 (as Figure 4B shown), thereby manufacturing a shaped ceramic matrix composite structure that includes the first ceramic matrix composite layer 212 and the second ceramic matrix composite layer 222 (as Figure 5 shown). Figure 5 shown).

[0034] As Figure 3A shown, the pick-up mechanism 130 picks up the first non-polymer layer 210 that includes the first ceramic matrix composite layer 212, the first lower backing film 213, and the first upper backing film 211( Figure 2A ). As Figure 3B shown, the pick-up mechanism 130 lowers the first non-polymer layer 210 onto the stage 102. Then the pick-up mechanism 130 is lifted from the stage 102, and the first upper backing film 211 is removed by the peeling mechanism 120, as Figure 3C shown, leaving the first ceramic matrix composite layer 212 and the first lower backing film 213 on the stage 102. Then, after the peeling mechanism 120 removes the second lower backing film 223 from the second material layer 220, the second ceramic matrix composite layer 222 together with the second upper backing film 221 is placed above the stage 102, as Figure 3D shown. Thus, Figure 3D the pick-up mechanism 130 in

[0035] lifts the second ceramic matrix composite layer 222 and the second upper backing film 221. Figure 3E shown, the pick-up mechanism 130 lowers the second ceramic matrix composite layer 222 and the second upper backing film 221 onto the first ceramic matrix composite layer 212 that is already on the stage 102 to compress the first ceramic matrix composite layer 212 and the second ceramic matrix composite layer 222 together. Then, as Figure 3F shown, the pick-up mechanism 130 is lifted from the stage 102, leaving the stack 400 that contains the second ceramic matrix composite layer 222 and the second upper backing film 221 above the first ceramic matrix composite layer 212 and the first lower backing film 213( Figure 4A ). Sufficient pressure is applied to the stack 400 to enable the stack 400 to be handled, but the pressure should not be too high to avoid the stack 400 being unable to form the final tool profile.

[0036] Then, as shown in Figure 3G , the pick-up mechanism 130 is lowered onto the stack 400 to lift the stack 400 from the table 102, as shown in Figure 3H . Then, the pick-up mechanism 130 moves from the first position where the table 102 is located, as shown in Figure 3H , to the second position where the tool 110 is located, as shown in Figure 3I .

[0037] After removing the first lower backing film 213 (which is optional at this manufacturing point), then the pick-up mechanism 130 lowers the stack 400 (minus the first lower backing film 213 if it has been removed) onto the tool 110, as shown in Figure 3J . After lifting the pick-up mechanism 130 as shown in Figure 3K , the vacuum film 142 ( Figure 1 ) is placed on the tool 110, which is referred to as "bagging" the stack 400 with the vacuum film 142. The vacuum forming mechanism 140 applies a vacuum to compress the stack 400 (minus the first lower backing film 213 if it has been removed) in Figure 4A to the shape of the tool 110, thereby providing a compressed stack 450, as shown in Figure 3L . The compressed stack 450 is shown enlarged in Figure 4B .

[0038] After the stack 400 in Figure 4A (minus the first lower backing film 213 if it has been removed) is formed to the shape of the tool 110 to provide the compressed stack 450 in Figure 4B , the vacuum and the vacuum film 142 are removed, leaving the compressed stack 450 on the tool 110, as shown in Figure 3M . Thus, the compressed stack 450 shown in Figure 3M and Figure 4B is formed to the shape of the tool 110.

[0039] When the second upper backing film 221 is removed from the compressed stack 450, a ceramic matrix composite structure 500 is obtained, as shown in Figure 5 . The ceramic matrix composite structure 500 includes a formed second ceramic matrix composite layer 222 and a formed first ceramic matrix composite layer 212. During the process of placing the first ceramic matrix composite layer 212 and the second ceramic matrix composite layer 222 on the table 102 located at the first position, the first fiber reinforcement 214 ( Figure 2A ) of the first ceramic matrix composite layer 212 and the second fiber reinforcement 224 ( Figure 2B ) of the second ceramic matrix composite layer 222 are oriented relative to each other such that the first fiber reinforcement 214 and the second fiber reinforcement 224 reinforce each other.

[0040] In the ceramic matrix composite structure 500, the formed first ceramic matrix composite layer 212 has an optional flange 215, and the formed second ceramic matrix composite layer 222 has an optional flange 225. The optional flanges 215, 225 depend on the shape of the tool surface 112 of the tool 110 and whether an optional step 114 is provided near the outer periphery of the tool 110( Figure 1 ). The optional flanges 215, 225 provide a connection interface for mounting the ceramic matrix composite structure 500.

[0041] For example, an aircraft component or a part of an aircraft may include the ceramic matrix composite structure 500 having the optional flanges 215, 225. For example, the aircraft includes a missile, a launch vehicle, a high-speed aircraft, and a rocket. For example, the aircraft component includes an engine exhaust structure. Other types of aircraft and other aircraft components or systems are also possible.

[0042] Although the above exemplary ceramic matrix composite structure 500 includes two layers (i.e., the first ceramic matrix composite layer 212 and the second ceramic matrix composite layer 222), it is contemplated that the ceramic matrix composite structure includes more than three layers. It is also contemplated that the ceramic matrix composite structure includes only one layer.

[0043] In addition, although the above description describes removing the first lower backing film 213 before compressing the Figure 4A stack 400 into the shape of the tool 110, it is contemplated that the first lower backing film 213 is removed after compressing the stack 400. For example, Figure 4B the compressed stack 450 plus the first lower backing film 213 (assuming the first lower backing film 213 has not been removed previously) may need to be moved to a curing tool at another location to cure the compressed stack 450. In this case, the first lower backing film 213 can be removed after forming the compressed stack 450.

[0044] Referring to Figure 6 , the overall flow chart 600 depicts an exemplary method of manufacturing a ceramic matrix composite structure of an embodiment. In block 602, a ceramic matrix composite layer is picked up at a first location and then proceeds to block 604. In block 604, it is determined whether the ceramic matrix composite layer picked up in block 602 is the first layer picked up. If the determination in block 604 is affirmative (i.e., it is the first layer picked up), the process proceeds to block 606, where the picked-up first layer is placed and slightly compressed on a table at the first location and then enters block 614.

[0045] However, if the determination in block 604 is negative (i.e., it is not the first layer picked up), the process proceeds to block 607 to peel off the upper backing film of the previous layer on the stage located at the first position. Then, the process proceeds to block 608, where the lower backing film of the picked-up layer of block 602 is peeled off. Then, in block 610, the picked-up layer from block 602 is placed on the previous layer located on the stage. The process proceeds to block 614.

[0046] In block 614, it is then determined whether to add another ceramic matrix composite layer to fabricate a ceramic matrix composite structure. If the determination in block 614 is affirmative (i.e., another ceramic matrix composite layer is to be added), the process returns to block 602 to process the next ceramic matrix composite layer. However, if the determination in block 614 is negative (i.e., there are no additional ceramic matrix composite layers), the process proceeds to block 616, where a stack of one or more ceramic matrix composite layers is provided. Then, the process proceeds to block 618.

[0047] In block 618, the stack of one or more layers from block 616 is conveyed (i.e., moved) from the first position where the stage is located to the second position where the tool is located. After removing the lower backing film in the stack as shown in block 619, the stack of one or more layers is placed on the tool at the second position as shown in block 620.

[0048] At block 622, a vacuum film is placed on the tool, and then a vacuum is applied as shown in block 624 to compress the stack of ceramic matrix composite layers to the tool. The process proceeds to block 626, where the vacuum is removed first, and then before peeling off any remaining backing film (including the upper backing film of the last placed layer) from the compressed stack as shown in block 628. The process proceeds to block 630, where an in-situ inspection is provided to check whether the compressed stack is successfully placed, compressed, and the backing film is removed. After the inspection, the process proceeds to block 632, where a ceramic matrix composite structure is provided. The ceramic matrix composite structure includes at least one ceramic matrix composite layer and any ceramic matrix composite layers added in block 614. Then the process ends.

[0049] Referring to Figure 7 , flowchart 700 depicts an exemplary electronic control method for fabricating a non-polymer structure having a desired shape in an embodiment. In block 702, a stack of at least a first non-polymer layer and a second non-polymer layer is conveyed from a surface at a first position to a tool surface at a second position different from the first position, such that the stack of materials of at least the first polymer layer and the second polymer layer can be fabricated into a non-polymer structure having a desired shape at the second position. Then the process ends.

[0050] Referring to Figure 8, Flowchart 800 depicts an exemplary electronic control method for manufacturing a ceramic matrix composite structure having a desired shape in another embodiment. In block 802, a plurality of ceramic matrix composite layers are processed at a first location to form a stack of the plurality of ceramic matrix composite layers. The process proceeds to block 804, where the stack of the plurality of ceramic matrix composite layers is transported from the first location to a second location remote from the first location. Then, in block 806, the stack of the plurality of ceramic matrix composite layers is processed at the second location to provide a ceramic matrix composite structure having a desired shape. Then the process ends.

[0051] Referring to Figure 9 , Flowchart 900 depicts an exemplary electronic control method for manufacturing a ceramic matrix composite structure having a desired shape in another embodiment. In block 902, a first ceramic matrix composite layer sandwiched between a first lower backing film and a first upper backing film is picked up. Then, in block 904, the ceramic matrix composite layer is placed on a tabletop at a first location. The process proceeds to block 906, where the first upper backing film is peeled off from the upper surface of the first ceramic matrix composite layer. The process proceeds to block 908.

[0052] In block 908, a second ceramic matrix composite layer sandwiched between a second lower backing film and a second upper backing film is picked up. Then, in block 910, the second lower backing film is peeled off from the lower surface of the second ceramic matrix composite layer, and then the process proceeds to block 912.

[0053] In block 912, the lower surface of the second ceramic matrix composite layer is placed on the upper surface of the first ceramic matrix composite layer to form a stack of at least the first and second ceramic matrix composite layers. Then, in block 914, the electronic control method further includes transporting the stack of at least the first and second ceramic matrix composite layers from the tabletop at the first location to a tool surface at a second location different from the first location, such that the stack of at least the first and second ceramic matrix composite layers can be manufactured into a ceramic matrix composite structure having a desired shape at the second location.

[0054] By providing the above ceramic matrix composite structure (e.g., Figure 5 the ceramic matrix composite structure 500 shown in

[0055] Another advantage is that the placement and compression of the ceramic matrix composite layer onto the tool is automated, thereby improving first-pass quality and end-product consistency. The result is reduced rework, reduced touch labour, reduced cycle time, and thus lower overall manufacturing costs.

[0056] Yet another advantage is that a structure made of a ceramic-based material (e.g., Figure 5 the ceramic matrix composite structure 500) weighs less than a structure of the same configuration made of a non-ceramic material (e.g., metal). Additionally, a ceramic-based material has a far greater ability to withstand high temperatures during the operational use of the structure than a non-ceramic material. Ceramic-based materials can withstand temperatures up to 2400 degrees Fahrenheit. The high-temperature capability of ceramic-based materials allows a structure made of such material (e.g., a thermal shield aircraft component or an aircraft exhaust structure) to be exposed to a constant high temperature (e.g., 1500 degrees Fahrenheit, beyond the limits of most metals) during the operational use of the structure. Thus, the ceramic matrix composite structures fabricated in accordance with the present disclosure not only have the desired weight advantage but also have the desired thermal characteristics in applications where weight and thermal characteristics are considered important.

[0057] Examples of the present disclosure may be described in the context of an aircraft manufacturing and maintenance method 1100 as shown in Figure 10 and an aircraft 1102 as shown in Figure 11 . During the pre-production period, the aircraft manufacturing and maintenance method 1100 may include aircraft 1102 specification and design 1104 and material procurement 1106. During production, component / subassembly manufacturing 1108 and system integration 1110 of the aircraft 1102 are performed. Thereafter, the aircraft 1102 may go through certification and delivery 1112 for service entry 1114. During service by a customer, the aircraft 1102 is scheduled for routine maintenance and servicing 1116, which may also include modification, reconfiguration, refurbishment, etc.

[0058] Each process of method 1100 may be performed or implemented by a system integrator, a third party, and / or an operator (e.g., a customer). For the purposes of this description, a system integrator may include, but is not limited to, any number of aircraft manufacturers and major system subcontractors; a third party may include, but is not limited to, any number of vendors, subcontractors, and suppliers; and an operator may be an airline, a leasing company, a military entity, a service organization, etc.

[0059] As shown in Figure 11As shown, an aircraft 1102 produced by an exemplary method 1100 may include a fuselage 1118 having a plurality of systems 1120 and an interior 1122. Examples of the plurality of systems 1120 may include one or more of a propulsion system 1124, an electrical system 1126, a hydraulic system 1128, and an environmental system 1130. Any number of other systems may be included.

[0060] The disclosed devices and methods may be used during any one or more stages of an aircraft manufacturing and servicing method 1100. As an example, components or sub-components corresponding to component / sub-component manufacturing 1108, system integration 1110, and / or maintenance and servicing 1116 may be assembled using the disclosed devices and methods. As another example, the fuselage 1118 may be constructed using the disclosed devices and methods. Moreover, one or more device instances, method instances, or combinations thereof may be used during component / sub-component manufacturing 1108 and / or system integration 1110, such as to substantially accelerate the assembly of the aircraft 1102 (such as the fuselage 1118 and / or the interior 1122) or reduce the cost of the aircraft. Similarly, when the aircraft 1102 is in service (such as, but not limited to, maintenance and servicing 1116), one or more of the system examples, method examples, or combinations thereof may be utilized.

[0061] Additionally, the present disclosure includes examples in accordance with the following clauses:

[0062] 1. An electronic control method for manufacturing a ceramic matrix composite structure having a desired shape, the electronic control method comprising the steps of:

[0063] Processing a first ceramic matrix composite layer and a second ceramic matrix composite layer at a first location to form a stack, wherein the processing comprises:

[0064] Peeling an upper backing film from an upper surface of the first ceramic matrix composite layer;

[0065] Peeling a lower backing film from a lower surface of the second ceramic matrix composite layer; and

[0066] After peeling the lower backing film, placing the lower surface of the second ceramic matrix composite layer above the upper surface of the first ceramic matrix composite layer;

[0067] Transporting the stack from the first location to a second location remote from the first location; and

[0068] Processing the stack at the second location to obtain a ceramic matrix composite structure having a desired shape.

[0069] 2. The electronic control method according to clause 1, further comprising:

[0070] Position a vacuum film for the stack at a second position to provide a vacuum seal for the stack.

[0071] 3. The electronic control method according to clause 2, further comprising:

[0072] Evacuate to draw the vacuum film for the stack.

[0073] 4. The electronic control method according to clause 3, further comprising:

[0074] Release the vacuum.

[0075] 5. The electronic control method according to clause 1, wherein the first ceramic matrix composite layer and the second ceramic matrix composite layer each comprise a matrix and a fiber reinforcement within the matrix.

[0076] 6. The electronic control method according to clause 5, wherein the matrix comprises a ceramic-like material, and the fiber reinforcement within the matrix comprises ceramic fibers.

[0077] 7. The electronic control method according to clause 1, wherein the first ceramic matrix composite layer and the second ceramic matrix composite layer each comprise a fabric pre-impregnated with a matrix material.

[0078] 8. The electronic control method according to clause 1, further comprising:

[0079] Orient the fiber reinforcements of the first ceramic matrix composite layer and the second ceramic matrix composite layer respectively such that when manufacturing a ceramic matrix composite structure having a desired shape, the fiber reinforcements reinforce each other.

[0080] 9. The manufacture of a part of an aircraft, comprising the electronic control method according to clause 1.

[0081] 10. The manufacture of an aircraft component having a plurality of flanges, comprising the electronic control method according to clause 1.

[0082] 11. The manufacture of a thermal shield aircraft component, comprising the electronic control method according to clause 1.

[0083] 12. An electronic control method for manufacturing a ceramic matrix composite structure having a desired shape, the electronic control method comprising the following steps:

[0084] Pick up a first ceramic matrix composite layer sandwiched between a first lower backing film and a first upper backing film;

[0085] Place the first ceramic matrix composite layer on a tabletop at a first position;

[0086] Peel off the first upper backing film from the upper surface of the first ceramic matrix composite layer;

[0087] Pick up the second ceramic matrix composite layer sandwiched between the second lower backing film and the second upper backing film;

[0088] Peel off the second lower backing film from the lower surface of the second ceramic matrix composite layer;

[0089] Place the lower surface of the second ceramic matrix composite layer above the upper surface of the first ceramic matrix composite layer to form a stack comprising at least the first ceramic matrix composite layer and the second ceramic matrix composite layer; and

[0090] Transport the stack from the tabletop at the first position to the tool surface at a second position different from the first position, such that the stack can be fabricated into a ceramic matrix composite structure having a desired shape at the second position.

[0091] 13. The electronic control method according to clause 12, further comprising:

[0092] Before transporting the stack from the tabletop at the first position to the tool surface at the second position, peel off the first lower backing film from the lower surface of the first ceramic matrix composite layer.

[0093] 14. The electronic control method according to clause 12, further comprising:

[0094] After transporting the stack from the tabletop at the first position to the tool surface at the second position, shape the stack into the shape of the tool surface, and then peel off the first lower backing film from the lower surface of the first ceramic matrix composite layer.

[0095] 15. The electronic control method according to clause 12, further comprising:

[0096] Place a vacuum film for the stack to provide a vacuum seal for the stack.

[0097] 16. The electronic control method according to clause 15, further comprising:

[0098] Evacuate to draw the vacuum film for the stack, thereby shaping the stack into the shape of the tool surface at the second position.

[0099] 17. The electronic control method according to clause 16, further comprising:

[0100] Release the vacuum; and

[0101] After releasing the vacuum, provide a ceramic matrix composite structure having a desired shape and comprising a plurality of ceramic matrix composite layers.

[0102] 18. The electronic control method according to clause 12, wherein (i) the step of picking up a first ceramic matrix composite layer sandwiched between a first lower backing film and a first upper backing film includes picking up a first ceramic matrix composite layer having a first matrix and a fiber reinforcement within the first matrix, and (ii) the step of picking up a second ceramic matrix composite layer sandwiched between a second lower backing film and a second upper backing film includes picking up a second ceramic matrix composite layer having a second matrix and a fiber reinforcement within the second matrix.

[0103] 19. The electronic control method according to clause 18, wherein each of the first matrix and the second matrix comprises a ceramic-like material, and the fiber reinforcements within the first matrix and the second matrix comprise ceramic fibers.

[0104] 20. The electronic control method according to clause 12, wherein (i) the step of picking up a first ceramic matrix composite layer sandwiched between a first lower backing film and a first upper backing film includes picking up a first ceramic matrix composite layer having a first fabric pre-impregnated with a matrix material, and (ii) the step of picking up a second ceramic matrix composite layer sandwiched between a second lower backing film and a second upper backing film includes picking up a second ceramic matrix composite layer having a second fabric pre-impregnated with a matrix material.

[0105] 21. The electronic control method according to clause 18, further comprising:

[0106] During the process of placing the first ceramic matrix composite layer and the second ceramic matrix composite layer on the tabletop at the first position, orienting the fiber reinforcements of the first ceramic matrix composite layer and the second ceramic matrix composite layer respectively, such that when manufacturing a ceramic matrix composite structure with a desired shape, the fiber reinforcements reinforce each other.

[0107] 22. The manufacture of a part of an aircraft, which includes the electronic control method according to clause 12.

[0108] 23. The manufacture of an aircraft component having a plurality of flanges, which includes the electronic control method according to clause 12.

[0109] 24. The manufacture of a thermal shielding aircraft component, which includes the electronic control method according to clause 12.

[0110] 25. An electronic control method for manufacturing a non-polymer structure with a desired shape, the electronic control method comprising the following steps:

[0111] Conveying a stack comprising at least a first non-polymer layer and a second non-polymer layer from a tabletop at a first position to a tool surface at a second position different from the first position, so that the stack of at least the first polymer layer and the second polymer layer can be manufactured into a non-polymer structure with a desired shape at the second position.

[0112] 26. The electronic control method according to clause 25, wherein the step of conveying a stack of at least a first non-polymer layer and a second non-polymer layer from a tabletop at a first position to a tool surface at a second position includes:

[0113] Conveying a stack of at least a first non-polymer layer and a second non-polymer layer from a tabletop at a first position to a tool surface at a second position, wherein the first non-polymer layer and the second non-polymer layer comprise a ceramic matrix composite.

[0114] 27. The electronic control method according to clause 25, wherein the step of conveying a stack of at least a first non-polymer layer and a second non-polymer layer from a tabletop at a first position to a tool surface at a second position includes:

[0115] Conveying a stack of at least a first non-polymer layer and a second non-polymer layer from a tabletop at a first position to a tool surface at a second position.

[0116] 28. The electronic control method according to clause 25, wherein the step of conveying a stack of at least a first non-polymer layer and a second non-polymer layer from a tabletop at a first position to a tool surface at a second position includes:

[0117] Conveying a stack of at least first and second ceramic matrix composite layers having a fiber reinforcement from a tabletop at a first position to a tool surface at a second position.

[0118] 29. The electronic control method according to clause 25, wherein the step of conveying a stack of at least a first non-polymer layer and a second non-polymer layer from a tabletop at a first position to a tool surface at a second position includes:

[0119] Conveying a stack of at least a first non-polymer layer and a second non-polymer layer having a fabric pre-impregnated with a matrix material from a tabletop at a first position to a tool surface at a second position.

[0120] 30. The electronic control method according to clause 25, further comprising:

[0121] After conveying the stack from the first position to the second position, lowering the stack onto the tool surface at the second position.

[0122] 31. The electronic control method according to clause 25, further comprising:

[0123] Applying a vacuum to a stack of at least a first non-polymer layer and a second non-polymer layer to form a shaped stack conforming to the shape of the tool surface, thereby providing a non-polymer structure of a desired shape.

[0124] 32. The electronic control method according to clause 31, wherein the step of applying a vacuum to the stack of materials of at least the first and second non-polymer layers includes bagging the stack using a vacuum film.

[0125] 33. The electronic control method according to clause 31, further comprising:

[0126] Before applying the vacuum, positioning the vacuum film onto the stack to provide a vacuum seal for the first non-polymer layer and the second non-polymer layer.

[0127] 34. The electronic control method according to clause 31, further comprising:

[0128] After applying the vacuum, peeling off the backing film from the formed stack of at least the first non-polymer layer and the second non-polymer layer.

[0129] 35. The electronic control method according to clause 34, further comprising:

[0130] Inspecting each of the first non-polymer layer, the second non-polymer layer, and the non-polymer structure to check the placement and compression of the first non-polymer layer and the second non-polymer layer and the removal of the backing film.

[0131] 36. The electronic control method according to clause 25, wherein for a given volume of the non-polymer structure, the weight of the non-polymer structure is less than the weight of a metal structure of the same volume.

[0132] 37. The manufacture of a part of an aircraft, comprising the electronic control method according to clause 25.

[0133] 38. The manufacture of an aircraft component having a plurality of flanges, comprising the electronic control method according to clause 25.

[0134] 39. The manufacture of a heat shield aircraft component, comprising the electronic control method according to clause 25.

[0135] 40. The electronic control method according to clause 2, further comprising vacuum compressing the stack.

[0136] Aspects of the disclosed embodiments can be implemented in software, hardware, firmware, or a combination thereof. The various elements of the system, individually or in combination, can be implemented as a computer program product (program of instructions) tangibly embodied in a machine-readable storage device (storage medium) for execution by a processor. The steps of the embodiments can be performed by a computer processor that executes a program tangibly embodied on a computer-readable medium to perform functions by operating on inputs and generating outputs. The computer-readable medium can be, for example, a memory, a removable medium such as a compact disc or a flash drive, such that a computer program embodying aspects of the disclosed embodiments can be loaded onto a computer.

[0137] The above-described devices and methods are described in the context of an aircraft. However, those of ordinary skill in the art will readily recognize that the disclosed devices and methods are applicable to a variety of applications, and the present disclosure is not limited to aircraft manufacturing applications. For example, the disclosed devices and methods can be implemented in a variety of vehicles, including, for example, helicopters, passenger ships, automobiles, marine products (ships, motors, etc.). Non-vehicle applications are also contemplated.

[0138] In addition, although the above description describes systems and methods for manufacturing ceramic matrix composite structures in the aerospace industry in accordance with military and space regulations, it is contemplated that the apparatus and methods can be implemented in accordance with applicable industry standards to facilitate the manufacture of ceramic matrix composite structures in any industry. Specific devices and methods can be selected and customized according to specific applications.

[0139] Furthermore, although various aspects of the disclosed embodiments have been shown and described, modifications may occur to those skilled in the art upon reading the specification. This application includes such modifications and is limited only by the scope of the claims.

Claims

1. An electronically controlled method for manufacturing a ceramic matrix composite structure having a desired shape, the electronically controlled method comprising: Processing the first ceramic matrix composite layer and the second ceramic matrix composite layer at a first location to form a stack, wherein the processing comprises: peeling off the upper backing film from the upper surface of the first ceramic matrix composite layer; peeling off the lower backing film from the lower surface of the second ceramic matrix composite layer; and After peeling off the lower backing film, placing the lower surface of the second ceramic matrix composite layer over the upper surface of the first ceramic matrix composite layer; transporting the stack from a first location to a second location remote from the first location; and The stack is processed at a second location to obtain a ceramic matrix composite structure having a desired shape.

2. The electronic control method according to claim 1, further comprising: A vacuum membrane is positioned against the stack at a second location to provide a vacuum seal against the stack.

3. The electronic control method according to claim 2, further comprising: A vacuum is drawn to draw the vacuum film against the stack.

4. The electronic control method according to claim 3, further comprising: Release the vacuum.

5. The electronic control method according to claim 1, wherein: The first ceramic matrix composite layer and the second ceramic matrix composite layer each include a matrix and a fiber reinforcement within the matrix.

6. An electronically controlled method for manufacturing a ceramic matrix composite structure having a desired shape, the electronically controlled method comprising: picking up a first ceramic matrix composite layer sandwiched between a first lower backing film and a first upper backing film; placing a first ceramic matrix composite layer on the table at a first location; peeling off the first upper backing film from the upper surface of the first ceramic matrix composite layer; picking up a second ceramic matrix composite layer sandwiched between a second lower backing film and a second upper backing film; peeling off the second lower backing film from the lower surface of the second ceramic matrix composite layer; placing a lower surface of a second ceramic matrix composite layer over an upper surface of the first ceramic matrix composite layer to form a stack comprising at least the first ceramic matrix composite layer and the second ceramic matrix composite layer; as well as The stack is transported from a table at a first location to a tool surface at a second location different from the first location so that the stack can be fabricated into a ceramic matrix composite structure having a desired shape at the second location.

7. An electronically controlled method for manufacturing a non-polymer structure having a desired shape, the electronically controlled method comprising: A stack comprising at least a first non-polymer layer and a second non-polymer layer is transported from a table at a first position to a tool surface at a second position different from the first position, so that the stack comprising at least the first polymer layer and the second polymer layer can be manufactured into a non-polymer structure having a desired shape at the second position.

8. Manufacture of a part of an aircraft comprising the electronic control method according to any one of claims 1 to 7.

9. Manufacture of an aircraft component having a plurality of flanges, comprising the electronic control method according to any one of claims 1 to 7.

10. Production of a heat shielded aircraft component comprising the electronic control method according to any one of claims 1 to 7.

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