A semiconductor sputtering system

Abstract

This invention provides a semiconductor sputtering method and system. A vertically adjustable structure (shutter) and another set of sputtering carriers are added to the middle of the original loading / unloading platform, allowing the two sets to shuttle back and forth. This design allows the equipment to perform loading, unloading, and sputtering operations simultaneously. While the first set of carriers is sputtering in the sputtering chamber, the second set of carriers can load a new substrate within the same time frame. Compared to the traditional single-carrier design, there is no need to wait for sputtering to complete before material replacement, significantly shortening the single production cycle and greatly increasing the output per unit time, resulting in a qualitative leap in production efficiency.

Description

Technical Field

[0001] This invention relates to the field of semiconductors, and more particularly to a semiconductor sputtering system. Background Technology

[0002] In the semiconductor manufacturing field, semiconductor mask sputtering is a crucial process, and its efficiency and quality have a decisive impact on the performance of semiconductor products and production benefits. Currently, the sputtering speed of traditional semiconductor masks is mainly reflected in two key aspects: the loading and unloading process, and the sputtering process itself.

[0003] The sputtering process involves bombarding a target with high-speed argon ions, causing the target atoms to be sputtered onto the surface of a photomask to form a thin film. The time for this process can be adjusted according to a pre-set process formula. By changing the sputtering time and related process parameters, such as the power of the sputtering equipment, the argon flow rate, and the material and quality of the target, the film characteristics and thickness can be effectively controlled to meet the diverse needs of semiconductor manufacturing. For example, the requirements for the thickness and properties of the thin film on the photomask vary greatly when manufacturing different types of chips. By flexibly adjusting the sputtering process parameters, products that meet the requirements can be produced.

[0004] However, in actual production, traditional semiconductor mask sputtering machines suffer from severe efficiency bottlenecks in the loading and unloading stages. Most current traditional equipment is equipped with only one loading unit, meaning that a new batch of sputtered products must be unloaded before loading can begin. During this process, the sputtering machine is idle and unable to perform core sputtering work, significantly extending the machine's downtime. Furthermore, operational details during loading and unloading, such as cumbersome loading and unloading actions, inaccurate positioning, and slow transmission speeds, further exacerbate the time waste. Statistics show that time wasted due to loading and unloading account for a significant proportion of the entire production cycle, severely reducing production efficiency, making it impossible to meet the growing market demand, increasing production costs, and weakening the company's competitiveness. Therefore, it is urgent to improve the loading and unloading design of traditional semiconductor mask sputtering machines to enhance production efficiency, reduce production costs, and strengthen the overall competitiveness of the industry. Summary of the Invention

[0005] To address the above problems, the present invention provides a semiconductor sputtering method, characterized by comprising:

[0006] The first object to be plated is placed on the first sputtering carrier on the first fixing seat;

[0007] Push the first fixing seat into the pre-sputtering chamber;

[0008] Close the pre-sputtering chamber gate and use a dry pump to evacuate it to the predetermined vacuum level;

[0009] The first object to be plated will undergo subsequent sputtering operations according to the process formula;

[0010] During the sputtering of the first object to be coated, the second object to be coated is placed on the second fixed seat on the second sputtering carrier, and then the second fixed seat is pushed to the lifting platform in the upper area of ​​the lifting structure, and then lowered to the lower area of ​​the lifting structure via the lifting platform to wait.

[0011] After sputtering is completed, the first plated object is moved back to the pre-sputtering chamber, the gate is opened to break the vacuum, and it is pulled out to the first sputtering carrier through the first fixed seat;

[0012] The second fixed seat is raised from the lower area of ​​the lifting structure to the upper area of ​​the lifting structure, and immediately pushed into the pre-sputtering chamber. The above-mentioned pre-sputtering chamber vacuuming and sputtering operation process is repeated.

[0013] During the sputtering of the second object to be coated, the first coated object is removed from the first fixed seat of the first sputtering carrier and the third object to be coated is placed in it. All the above operation steps are repeated to achieve continuous semiconductor sputtering operation.

[0014] In one embodiment of the present invention, the subsequent sputtering operation includes:

[0015] The heating operation is performed in the heating chamber;

[0016] The formal sputtering operation is carried out in the sputtering chamber;

[0017] Cooling operations are performed in the cooling chamber; and

[0018] Return to the pre-sputtering chamber.

[0019] In another embodiment of the present invention, in the semiconductor sputtering process:

[0020] It must satisfy T(S) = T(L); and

[0021] T(S) + T(cool) = T(L);

[0022] Where T(L) is the loading / unloading time, which is 20 to 30 minutes; T(S) is the sputtering time, which is 40 to 50 minutes; and T(cooling) is the chamber cooling time, which is 5 to 15 minutes.

[0023] In another embodiment of the present invention, the time T(L) for plating objects of different sizes is not fixed, and the pick-up and drop time T(L_small) for small-sized plating objects is greater than the pick-up and drop time T(L_large) for large-sized plating objects. When sputtering different-sized plating objects is performed, there is an idle time T(idle). At this time:

[0024] It must satisfy T(S) = T(L_large) + T(idle); and

[0025] T(S)+T(coo l)=T(L big)+T(idle).

[0026] The present invention also provides a semiconductor sputtering system, characterized in that it comprises:

[0027] The sputtering carrier includes a first sputtering carrier and a second sputtering carrier. The first sputtering carrier is used to support a first fixed seat for placing a first object to be sputtered, and the second sputtering carrier is used to support a second fixed seat for placing a second object to be sputtered.

[0028] The sputtering machine chamber is equipped with a gate that can be closed and opened, and is connected to a dry pump to receive the fixed seat and the workpiece to be sputtered pushed in from the sputtering carrier. After the gate is closed, the dry pump is used to pump the chamber to a predetermined vacuum level.

[0029] The lifting structure has an upper area and a lower area, as well as a lifting platform that can be raised and lowered. The lifting platform is used to lower a second fixed seat placed on a second sputtering carrier from the upper area to the lower area for waiting, and to raise the second fixed seat in the lower area to the upper area.

[0030] The conveying device is used to push the first fixed seat from the first sputtering carrier into the sputtering machine cavity, and after the sputtering is completed, pull the first fixed seat where the first plated object is located from the sputtering machine cavity back to the first sputtering carrier; it is also used to push the second fixed seat from the second sputtering carrier to the upper area of ​​the lifting structure, and push the second fixed seat located in the upper area of ​​the lifting structure into the sputtering machine cavity.

[0031] The control system is used to control the opening and closing of the gate of the sputtering machine cavity, the operation of the dry pump, the lifting and lowering of the lifting platform, the operation of the conveying device, and the process execution of the sputtering machine cavity.

[0032] In one embodiment of the present invention, the fixing base is specially designed, and its surface is made of a material with a high coefficient of friction and stable chemical properties, which can firmly fix the object to be plated and prevent the object to be plated from shifting or shaking during subsequent pushing.

[0033] In another embodiment of the present invention, the pushing device is driven by a servo motor, which can precisely adjust the movement speed and stroke according to the size and weight of the object to be plated.

[0034] In another embodiment of the present invention, the sputtering machine cavity includes:

[0035] The pre-sputtering chamber is used for pre-sputtering treatment of the object to be plated.

[0036] The heating chamber is connected to the pre-sputtering chamber and is used to heat the object to be plated.

[0037] A sputtering chamber, connected to the heating chamber, is used to perform sputtering operations on the workpiece to be sputtered from the pre-sputtering chamber according to the process formula; and

[0038] The cooling chamber is connected to the sputtering chamber and is used to cool the plated object.

[0039] In another embodiment of the present invention, the conveying device includes a pushing mechanism and a pulling mechanism. The pushing mechanism is used to push the fixed seat from the sputtering carrier into the sputtering machine cavity, send it from the pre-sputtering chamber into the subsequent chamber, and push the second fixed seat to the upper area of ​​the lifting structure and advance the pre-sputtering chamber. The pulling mechanism is used to pull the first fixed seat from the pre-sputtering chamber back to the first sputtering carrier.

[0040] In another embodiment of the present invention, the pre-sputtering chamber is provided with a vacuum sensor for detecting the vacuum level inside the chamber. The vacuum sensor is connected to the control system, and the control system controls the operation of the dry pump based on the vacuum level information fed back by the vacuum sensor.

[0041] The present invention has the following beneficial effects:

[0042] (1) A vertically adjustable structure (shutter) and another set of sputtering carriers are added to the middle of the original loading / unloading platform, allowing the two sets to shuttle back and forth. This design allows the equipment to perform loading, unloading, and sputtering operations simultaneously. While the first set of fixed seats is sputtering in the sputtering chamber, the second set of fixed seats can load the new material to be sputtered within that time. Compared to the traditional single fixed seat design, there is no need to wait for the sputtering to complete before changing materials, which greatly shortens the single production cycle, significantly increases the output per unit time, and enables a qualitative leap in production efficiency.

[0043] (2) The two sets of fixed seats operate in a non-interfering mode, making full use of the equipment's running time. The sputtering chamber no longer has idle periods and always maintains efficient operation. This not only reduces the equipment's idle time but also allows the equipment to complete more sputtering processes within the same working time, improving the equipment's utilization efficiency. Attached Figure Description

[0044] Figure 1 A schematic diagram of a semiconductor sputtering system structure according to an embodiment of the present invention is shown;

[0045] Figure 2 A schematic diagram of the original sputtering platform structure in the prior art is shown;

[0046] Figure 3 This diagram illustrates a comparison of the time required for a semiconductor sputtering process according to an embodiment of the present invention and a sputtering process in the prior art; and

[0047] Figure 4A flowchart of a semiconductor sputtering process according to an embodiment of the present invention is shown. Detailed Implementation

[0048] In the following description, the invention is described with reference to various embodiments. However, those skilled in the art will recognize that the embodiments may be practiced without one or more specific details or with other alternatives and / or additional methods, materials, or components. In other instances, well-known structures, materials, or operations are not shown or described in detail so as not to obscure the inventive points of the invention. Similarly, for illustrative purposes, specific quantities, materials, and configurations are set forth to provide a comprehensive understanding of embodiments of the invention. However, the invention is not limited to these specific details.

[0049] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. In this specification, references to "an embodiment" or "this embodiment" mean that a particular feature, structure, or characteristic described in connection with that embodiment is included in at least one embodiment of the invention. The phrase "in one embodiment" appearing throughout this specification does not necessarily refer to the same embodiment in all instances.

[0050] Figure 1 A schematic diagram of a semiconductor sputtering system structure is shown in one embodiment of the present invention.

[0051] like Figure 1 As shown, this system includes:

[0052] The system includes a first sputtering carrier 110 and a second sputtering carrier 120. The first sputtering carrier 110 is used to stably support the first fixed seat for placing the first object to be coated, providing stable support and positioning for the first object to be coated before entering the sputtering process; the second sputtering carrier 120 is responsible for supporting the second fixed seat for placing the second object to be coated, ensuring the orderly flow of the object to be coated in the system.

[0053] The sputtering machine chamber 300 has a continuous process channel, which consists of: a pre-sputtering chamber 301, a heating chamber 302, a sputtering chamber 303, and a cooling chamber 304.

[0054] The pre-sputtering chamber 301 is equipped with a gate that can be flexibly closed and opened, and is connected to a dry pump. Its main function is to receive the fixture and workpiece to be sputtered pushed in from the sputtering carrier. After the workpiece enters, the gate is quickly closed, and then the dry pump is used to evacuate the environment inside the chamber to a predetermined vacuum level, creating suitable vacuum conditions for subsequent sputtering operations.

[0055] Heating chamber 302: In this chamber, the system will perform heating operations according to the pre-set process formula.

[0056] Sputtering chamber 303: In this chamber, the system performs precise sputtering operations on the object to be plated according to a pre-set process formula, so as to form a thin film that meets the requirements on the surface of the object to be plated.

[0057] Cooling chamber 304: In this chamber, the system will perform cooling operations according to the pre-set process formula.

[0058] The lifting structure 200 has an upper zone A0 and a lower zone A2, as well as a lifting platform that enables lifting. The lifting platform can smoothly lower the second fixed seat placed on the second sputtering carrier from the upper zone A0 to the lower zone A2 for waiting, and at the same time, it can accurately raise the second fixed seat in the lower zone A2 to the upper zone A0 at the appropriate time, so as to realize the orderly scheduling and storage of the object to be coated.

[0059] The conveying device is a crucial component for transferring the material to be coated between different chambers and carriers. It accurately pushes the first fixed seat from the first sputtering carrier into the pre-sputtering chamber 301, then from the pre-sputtering chamber into the heating chamber 302, and subsequently into the sputtering chambers 303 and cooling chamber 304. After sputtering, it pulls the first fixed seat containing the coated material back from the cooling chamber 304 to the pre-sputtering chamber 301, and finally back to the first sputtering carrier. Furthermore, the conveying device also pushes the second fixed seat from the second sputtering carrier to the upper section A0 of the lifting structure, and then pushes the second fixed seat located in the upper section A0 into the pre-sputtering chamber, ensuring the efficiency and smoothness of the entire material conveying process.

[0060] The control system, as the core of the entire semiconductor sputtering system, is responsible for coordinating and controlling the operation of various components. It can precisely control the opening and closing of the gate of the sputtering machine cavity 300 to ensure the chamber's sealing and vacuum level regulation; control the operation of the dry pump to achieve the predetermined vacuum level requirements; control the lifting structure 200 to ensure the orderly scheduling of the materials to be sputtered; control the operation of the conveying device to achieve accurate transfer of the materials to be sputtered; and control the process execution of the sputtering machine cavity 300 to ensure that the sputtering process conforms to the preset process formula.

[0061] The following will combine Figure 2 A schematic diagram of the original sputtering platform structure in the prior art is provided to explain in detail the differences between the present invention and the original art.

[0062] The working principle of the original sputtering platform is as follows:

[0063] 1. Place the object to be plated into the mounting bracket of the loading platform. At this time, the loading platform is located... Figure 2 Upper section A0 area of ​​the central lifting structure;

[0064] 2. Push the fixing seat of the first sputtering carrier 110 into the pre-sputtering chamber 301 for sputtering;

[0065] 3. Close the gate and start the dry pump to create a vacuum;

[0066] 4. Sputtering is performed in the sputtering machine cavity 300 according to the process formula;

[0067] 5. After sputtering is completed, the deposited material is returned to the pre-sputtering chamber 301, breaking the vacuum;

[0068] 6. Open the gate and pull the fixed seat out to the unloading platform, wherein the loading and unloading are on the same platform, namely the first sputtering carrier 110 in this invention;

[0069] 7. Remove the plated items one by one from the mounting bracket;

[0070] Repeat steps 1-7.

[0071] This shows that the original sputtering technology involved loading the next batch of materials after the previous batch of sputtering was completed.

[0072] Figure 4 A semiconductor sputtering process diagram according to an embodiment of the present invention is shown.

[0073] like Figure 4 As shown, the present invention provides a semiconductor sputtering method, comprising:

[0074] The first object to be plated is placed on the first fixed seat on the first sputtering carrier 110. At this time, the first sputtering carrier is located at... Figure 1 Middle A1 area;

[0075] Push the first fixed seat into the pre-sputtering chamber 301 of the sputtering machine cavity 300;

[0076] Close the gate of the pre-sputtering chamber 301 and use a dry pump to evacuate it to the predetermined vacuum level;

[0077] The first object to be plated is sputtered in the sputtering machine cavity 300 according to the process formula;

[0078] During the sputtering of the first object to be coated, the second object to be coated is placed on the second fixed seat, and the second fixed seat is placed on the second sputtering carrier 120. Then the second fixed seat is pushed to the upper area A0 of the lifting structure and lowered to the lower area A2 of the lifting structure via the lifting platform to wait.

[0079] After sputtering is completed, the first plated object is moved back to the pre-sputtering chamber 301, the gate is opened to break the vacuum, and it is pulled out to the first sputtering carrier 110 through the first fixed seat;

[0080] The second fixed seat is raised from the lower layer area A2 of the lifting structure to the upper layer area A0 of the lifting structure, and the pre-sputtering chamber 301 for sputtering is immediately advanced, and the above sputtering operation process is repeated.

[0081] During the sputtering of the second object to be deposited, the first deposited object is removed from the first fixed seat of the first sputtering carrier 110 and the third object to be deposited is placed in it. All the above operation steps are repeated to achieve continuous semiconductor sputtering operation.

[0082] As can be seen from the above process, this invention adds a vertically adjustable structure (shutter) and another set of sputtering carriers to the middle of the original loading / unloading platform, allowing the two sets to shuttle back and forth. This design allows the equipment to perform loading, unloading, and sputtering operations simultaneously. While the first set of fixed seats is sputtering in the sputtering chamber, the second set of fixed seats can load new materials to be sputtered within that time. Compared to the traditional single fixed seat design, there is no need to wait for sputtering to complete before material replacement, greatly shortening the single production cycle, significantly increasing the output per unit time, and achieving a qualitative leap in production efficiency.

[0083] Figure 3 A schematic diagram of the sputtering process time in the present invention and the prior art is shown.

[0084] The production process of large-scale sputtering equipment generally includes two parts:

[0085] T(L): Loading / Unloading (Original sputtering platform steps 1, 2, 3, 5, 6, 7)

[0086] T(S): Sputtering (Step 4 of the original sputtering platform)

[0087] As shown in the figure, in the original sputtering process, the second part P2 is loaded only after the sputtering operation of the first part P1 is completed. However, in the present invention, the loading operation of the second part P2 is performed during the sputtering process of the first part P1, so that the sputtering operation of the second part P2 is performed immediately after the sputtering operation of the first part P1 is completed.

[0088] In one embodiment of the present invention, the optimal production volume must satisfy T(S) = T(L). Here, T(L) is the loading / unloading time, typically 20 to 30 minutes. This is because in actual production, the loading and unloading process involves operations such as handling, positioning, and fixing the workpiece to be plated, and its time is affected by factors such as the size and weight of the workpiece and the efficiency of the handling equipment. T(S) is the sputtering time, typically 40 to 50 minutes. The sputtering time mainly depends on the process formulation, the type of sputtering target, and the sputtering parameters. When T(S) = T(L), it means that the loading / unloading and sputtering processes can be perfectly matched, and there will be no waiting or backlog at any stage of the production line, thus achieving the optimal production volume.

[0089] In another embodiment of the invention, the optimal operating state must satisfy T(S) + T(cool) = T(L). Here, T(cool) is the chamber cooling time, typically 5 to 15 minutes. During the sputtering process, a large amount of heat is generated within the chamber, requiring cooling to ensure normal operation of the equipment and sputtering quality. When T(S) + T(cool) = T(L), it indicates that the loading / unloading process is completed simultaneously with one sputtering cycle and chamber cooling, resulting in a highly efficient and stable operating state for the entire production system, maximizing equipment utilization.

[0090] In one embodiment of the present invention, if the sizes of the objects to be plated differ between different batches, the pick-and-place time T(Lsmall) for smaller objects is greater than that for larger objects. This is because although smaller objects are smaller in size, they require more precise positioning and handling during pick-and-place to avoid inaccurate placement or collisions, resulting in a relatively longer pick-and-place time. Larger objects, due to their larger size, are easier to handle and position, but their larger surface area may lead to a longer sputtering time. When sputtering different sized objects, there is an idle time T(idle).

[0091] At this point, the optimal production rate must satisfy T(S) = T(L_large) + T(idle). This means that after considering the loading / unloading time and idle time of large-sized items to be plated, the sputtering time should be matched accordingly to ensure that the production line achieves optimal production efficiency when handling items of different sizes. The optimal operating state must satisfy T(S) + T(cooling) = T(L_large) + T(idle), that is, when the sum of the sputtering time and the chamber cooling time is equal to the sum of the loading / unloading time and idle time of large-sized items, the entire production system is in optimal operating condition, the equipment can be fully utilized, and the continuity and stability of production are guaranteed. In actual production, the operating speed of the loading / unloading equipment and the sputtering process parameters can be reasonably adjusted according to the size of the items to be plated and the production task to optimize the time allocation of T(L), T(S), and T(cooling) to achieve the best production effect.

[0092] Although the above embodiments have been described, those skilled in the art, once they understand the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the above descriptions are merely embodiments of the present invention and do not limit the scope of patent protection of the present invention. Any equivalent structural or procedural transformations made using the content of the present invention's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the scope of patent protection of the present invention.

Claims

1. A semiconductor sputtering method, characterized in that, include: The first object to be plated is placed on the first sputtering carrier on the first fixing seat; Push the first fixing seat into the pre-sputtering chamber; Close the pre-sputtering chamber gate and use a dry pump to evacuate it to the predetermined vacuum level; The first object to be plated will undergo subsequent sputtering operations according to the process formula; During the sputtering of the first object to be coated, the second object to be coated is placed on the second fixed seat on the second sputtering carrier, and then the second fixed seat is pushed to the lifting platform in the upper area of ​​the lifting structure, and then lowered to the lower area of ​​the lifting structure via the lifting platform to wait. After sputtering is completed, the first plated object is moved back to the pre-sputtering chamber, the gate is opened to break the vacuum, and it is pulled out to the first sputtering carrier through the first fixed seat; The second fixed seat is raised from the lower area of ​​the lifting structure to the upper area of ​​the lifting structure, and immediately pushed into the pre-sputtering chamber. The above-mentioned pre-sputtering chamber vacuuming and sputtering operation process is repeated. During the sputtering of the second object to be deposited, the first deposited object is removed from the first fixed seat of the first sputtering carrier and the third object to be deposited is placed in it. All the above operation steps are repeated to achieve continuous semiconductor sputtering operation. In the semiconductor sputtering process: The loading and unloading time T(L) for different sized objects is not fixed. The loading and unloading time T(L_small) for smaller sized objects is greater than that for larger sized objects. When sputtering objects of different sizes, there is an idle time T(idle). It must satisfy T(S) + T(cool) = T(L_large) + T(idle); Where T(L) is the loading / unloading time, which is 20 to 30 minutes; T(S) is the sputtering time, which is 40 to 50 minutes; and T(cool) is the chamber cooling time, which is 5 to 15 minutes.

2. The semiconductor sputtering method as described in claim 1, characterized in that, The subsequent sputtering operation includes: The heating operation is performed in the heating chamber; The formal sputtering operation is carried out in the sputtering chamber; Cooling operations are performed in the cooling chamber; and Return to the pre-sputtering chamber.

3. A semiconductor sputtering system, characterized in that, include: The sputtering carrier includes a first sputtering carrier and a second sputtering carrier. The first sputtering carrier is used to support a first fixed seat for placing a first object to be sputtered, and the second sputtering carrier is used to support a second fixed seat for placing a second object to be sputtered. The sputtering machine chamber is equipped with a gate that can be closed and opened, and is connected to a dry pump to receive the fixed seat and the workpiece to be sputtered pushed in from the sputtering carrier. After the gate is closed, the dry pump is used to pump the chamber to a predetermined vacuum level. The lifting structure has an upper area and a lower area, as well as a lifting platform that can be raised and lowered. The lifting platform is used to lower a second fixed seat placed on a second sputtering carrier from the upper area to the lower area for waiting, and to raise the second fixed seat in the lower area to the upper area. The conveying device is used to push the first fixed seat from the first sputtering carrier into the sputtering machine cavity, and after the sputtering is completed, pull the first fixed seat where the first plated object is located from the sputtering machine cavity back to the first sputtering carrier; it is also used to push the second fixed seat from the second sputtering carrier to the upper area of ​​the lifting structure, and push the second fixed seat located in the upper area of ​​the lifting structure into the sputtering machine cavity. A control system is used to control the opening and closing of the sputtering machine cavity gate, the operation of the dry pump, the lifting and lowering of the lifting platform, the operation of the conveying device, and to perform any step of the method as described in claims 1 to 2.

4. The semiconductor sputtering system as described in claim 3, characterized in that, The mounting base is specially designed, and its surface is made of a material with a high coefficient of friction and stable chemical properties.

5. The semiconductor sputtering system as described in claim 3, characterized in that, The conveying device is driven by a servo motor.

6. The semiconductor sputtering system as described in claim 3, characterized in that, The sputtering machine cavity includes: The pre-sputtering chamber is used for pre-sputtering treatment of the object to be plated. The heating chamber is connected to the pre-sputtering chamber and is used to heat the object to be plated. A sputtering chamber, connected to the heating chamber, is used to perform sputtering operations on the workpiece to be sputtered from the pre-sputtering chamber according to the process formula; and The cooling chamber is connected to the sputtering chamber and is used to cool the plated object.

7. The semiconductor sputtering system as described in claim 3, characterized in that, The conveying device includes a pushing mechanism and a pulling mechanism. The pushing mechanism is used to push the fixed seat from the sputtering carrier into the sputtering machine cavity, send it from the pre-sputtering chamber into the subsequent chamber, and push the second fixed seat to the upper area of ​​the lifting structure and advance the pre-sputtering chamber. The pulling mechanism is used to pull the first fixed seat back from the pre-sputtering chamber to the first sputtering carrier.

8. The semiconductor sputtering system as described in claim 6, characterized in that, The pre-sputtering chamber is equipped with a vacuum sensor for detecting the vacuum level inside the chamber. The vacuum sensor is connected to the control system, and the control system controls the operation of the dry pump based on the vacuum level information fed back by the vacuum sensor.

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