Electron beam excitation coating device

Abstract

The present application discloses an electron beam excitation coating device, which includes a fixed outer cavity, a movable inner cavity, an electron gun, a stage, a target, and a rotation driving mechanism. The movable inner cavity includes a first bellows, a second bellows, and a rotating connection ring. A motion track is provided on the inner wall of the fixed outer cavity. The emission end of the electron gun communicates with the movable inner cavity, and the power connection end is slidably arranged in the motion track. A power connection piece is provided in the motion track. After the power connection end contacts the power connection piece, the electron gun is powered on and can emit an electron beam into the movable inner cavity. The rotation driving mechanism is used to drive the rotating connection ring to drive the electron gun to rotate. Constrained by the motion track, the electron gun can rise or fall while rotating, so as to change the emission position of the electron beam. By adding an electron gun and using the electron gun to emit an electron beam, the amount of electrons in the cavity can be increased and the electron activity can be improved. The electron gun rises or falls while rotating, making the distribution of electrons in the movable inner cavity more uniform.

Description

Technical Field

[0001] This application relates to the technical field of wafer coating, and in particular to an electron beam excitation coating device. Background Art

[0002] In the field of semiconductor manufacturing, wafer coating is a crucial process. Its purpose is to form a thin film with specific functions on the surface of the wafer. By means of the thin film, the electrical properties, corrosion resistance, wear resistance and other characteristics of the wafer are improved, thereby ensuring the quality and performance of the chip.

[0003] Traditional wafer coating equipment applies an electric field in the reaction chamber to ionize reaction gas molecules under the action of the electric field to form plasma. This ionization method has many limitations. On the one hand, the distribution of the electric field in the reaction chamber is often uneven, which will cause the reaction gas in some areas to not be fully ionized and make the distribution of the plasma uneven, thus affecting the coating uniformity, the quality and performance of the thin film on the wafer, and further reducing the yield of the chip. On the other hand, the plasma density generated by traditional electric field ionization is relatively low. During the coating process, the positive ions in the plasma will bombard the target material, causing the target atoms to be sputtered out and deposited on the surface of the wafer to form a thin film. When the plasma density is low, the number of ions that can participate in bombarding the target material is limited, which will cause the sputtering rate of the target atoms to slow down, reduce the deposition rate of the thin film, and prolong the coating time. Summary of the Invention

[0004] The purpose of this application is to overcome the deficiencies existing in the prior art and provide an electron beam excitation coating device.

[0005] The present application provides an electron beam excitation coating device, comprising: a fixed outer cavity, on the inner wall of which there is a moving track spirally extending in the vertical direction; a movable inner cavity, arranged in the fixed outer cavity, for providing space for wafer coating; an electron gun, for emitting an electron beam into the movable inner cavity; a stage, arranged in the fixed outer cavity, for carrying the wafer and enabling the wafer to be exposed to the movable inner cavity; a target, arranged in the fixed outer cavity, above the stage and exposed to the movable inner cavity; wherein, the movable inner cavity includes: a first bellows, the top end of which is connected to the fixed outer cavity; a second bellows, the bottom end of which is connected to the fixed outer cavity; a rotating connection ring, rotatably arranged between the first bellows and the second bellows, on which there is a radially penetrating mounting hole for mounting the electron gun; the emitting end of the electron gun communicates with the movable inner cavity through the mounting hole; the power connection end of the electron gun is slidably arranged in the moving track; there is an electrical connection piece in the moving track for connecting to a power supply, and after the power connection end of the electron gun contacts the electrical connection piece, the electron gun is powered on and can emit an electron beam; the electron beam excitation coating device further includes a rotation driving mechanism for driving the rotating connection ring to rotate; during the coating process, the rotating connection ring rotates, driving the electron gun to rotate with it. Constrained by the moving track, the electron gun can rise or fall while rotating, thereby changing the emission position of the electron beam; driven by the electron gun, the rotating connection ring can also rise or fall while rotating, and the first bellows and the second bellows can undergo adaptive deformation, thereby ensuring the stability of the movement of the electron gun.

[0006] Further, the fixed outer cavity includes: a housing made of a metal material; a lining arranged inside the housing and made of an insulating material, on the inner wall of which there is a moving track; both the first bellows and the second bellows are connected to the housing for grounding.

[0007] Further, the bottom end of the first bellows is provided with a first connection groove, which is arranged in a T shape; the top end of the second bellows is provided with a second connection groove, which is arranged in an inverted T shape; on one side of the rotating connection ring close to the first bellows, there is a first connection block, and the shape of the first connection block is adapted to the first connection groove; on one side of the rotating connection ring close to the second bellows, there is a second connection block, and the shape of the second connection block is adapted to the second connection groove; such that the first connection block is clamped in the first connection groove and the second connection block is clamped in the second connection groove, and the rotating connection ring can not only be rotatably connected to the first bellows and the second bellows, but also pull the first bellows and the second bellows during the rising or falling process, causing them to deform.

[0008] Further, a ring of tooth structures is provided on the outer peripheral surface of the rotating connection ring; the rotation driving mechanism includes: a gear meshing with the tooth structures; a rotation driving member and a driving rod, the driving rod being connected to the gear, and the rotation driving member being configured to drive the driving rod to rotate; a limiting card slot is further provided on the outer peripheral surface of the rotating connection ring, and the gear is restricted within the limiting card slot to facilitate maintaining the meshing state with the tooth structures; during the coating process, the rotation driving member drives the driving rod to rotate, the driving rod drives the gear to rotate, and the gear drives the rotating connection ring and the electron gun to rotate through the tooth structures, and the electron gun rises or falls along the movement track during rotation.

[0009] Further, a transmission key extending in the vertical direction is provided on the surface of the driving rod; a key slot extending in the vertical direction is provided on the inner circumferential wall of the gear, and the gear and the driving rod are slidably connected through the transmission key and the key slot; during the coating process, the gear can rise or fall with the rotating connection ring, while the positions of the rotation driving member and the driving rod remain unchanged in the vertical direction.

[0010] Further, heat dissipation blocks are provided on the rotating connection ring, and the heat dissipation blocks face the electron gun; the electron beam emitted by the electron gun moves towards the heat dissipation blocks, and the heat dissipation blocks can solve the problem of local high temperature caused by concentrated electron shooting.

[0011] Further, the electron beam excitation coating device includes at least two electron guns, and the at least two electron guns are arranged at intervals on the rotating connection ring and their emission ends are staggered; the power connection pieces in the movement track are arranged in a grid shape, and when one electron gun moves to the power connection end to contact the power connection piece, the other electron guns do not contact the power connection piece; during the coating process, there is always one electron gun in a state of contacting the power connection piece at the power connection end, and the at least two electron guns can work alternately to avoid concentrated electron shooting at a single position.

[0012] Further, the electron beam excitation coating device further includes a permanent magnet, and the permanent magnet is arranged in the fixed outer cavity and on one side of the movable inner cavity; the permanent magnet can attract electrons, thereby improving the movement direction of the electrons emitted by the electron gun; as the electron gun rotates and ascends and descends continuously, the attractive force and the attracting direction of the electrons emitted by the electron gun from the permanent magnet change continuously, so as to facilitate electron diffusion and strengthen the random movement of electrons.

[0013] Further, a plurality of permanent magnets are provided in the fixed outer cavity, and the plurality of permanent magnets are distributed at intervals in a spiral shape in the vertical direction.

[0014] Further, during the coating process, the rotation driving mechanism drives the rotating connection ring to drive the electron gun to rotate; for each wafer coating, the electron gun ascends and descends back and forth once.

[0015] The present application provides an electron beam excitation coating device, which includes a fixed outer cavity, a movable inner cavity, an electron gun, a carrier table, a target, and a rotation drive mechanism. The movable inner cavity includes a first bellows, a second bellows, and a rotating connection ring. A motion track is provided on the inner wall of the fixed outer cavity. The emission end of the electron gun communicates with the movable inner cavity, and the power connection end is slidably arranged in the motion track. A power connection piece is provided in the motion track. After the power connection end contacts the power connection piece, the electron gun is powered on and can emit an electron beam. The rotation drive mechanism is used to drive the rotating connection ring to drive the electron gun to rotate. Constrained by the motion track, the electron gun can rise or fall while rotating, thereby changing the emission position of the electron beam. By adding an electron gun and using the electron gun to emit an electron beam, the amount of electrons in the cavity can be increased, the electron activity can be improved, thereby promoting the ionization of reaction gas and increasing the plasma concentration, and further improving the sputtering rate of target atoms and enhancing the coating efficiency. Further, the electron gun rises or falls while rotating, making the distribution of electrons in the movable inner cavity more uniform, thereby avoiding the concentrated shooting of electrons on a fixed area in the cavity, which is beneficial to optimizing the distribution of plasma and improving the coating uniformity. The movable inner cavity is provided to form a relatively closed reaction chamber, which can not only stably install the electron gun by using the rotating connection ring and drive the electron gun to rotate, but also adaptively deform by using the first bellows and the second bellows when the electron gun moves, effectively maintaining the stability of the electron gun relative to the reaction chamber, so as to facilitate the movement and operation of the electron gun. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a schematic structural diagram of an electron beam excitation coating device provided by the present application;

[0017] Figure 2 is Figure 1 an enlarged view of a partial structure of the electron beam excitation coating device shown;

[0018] Figure 3 is Figure 2 an enlarged view of the structure within the circle in; DETAILED DESCRIPTION OF THE EMBODIMENTS

[0019] In order to make the above objects, features, and advantages of the present application more obvious and understandable, the following will describe the specific embodiments of the present application in detail with reference to the accompanying drawings. Many specific details are set forth in the following description in order to fully understand the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present application. Therefore, the present application is not limited by the specific embodiments disclosed below.

[0020] The present application provides an electron beam excitation coating device, including: a fixed outer cavity 110, on the inner wall of the fixed outer cavity 110, there is a movement track 110a spirally extending in the vertical direction; a movable inner cavity 120, arranged inside the fixed outer cavity 110, used to provide space for wafer coating; an electron gun 1, used to emit an electron beam into the movable inner cavity 120; a carrier 2, arranged inside the fixed outer cavity 110, used to carry the wafer and enable the wafer to be exposed to the movable inner cavity 120; a target 3, arranged inside the fixed outer cavity 110, above the carrier 2, and exposed to the movable inner cavity 120.

[0021] Specifically, reference can be made to Figure 1 and Figure 2 , in the illustrated embodiment, the fixed outer cavity 110 includes an upper cavity 110b and a lower cavity 110c. The upper cavity 110b is columnar, the lower cavity 110c is frame-shaped, the upper cavity 110b and the lower cavity 110c are interconnected, and there is a step 110d formed by the change of the inner diameter between the two.

[0022] Continue to refer to Figure 1 and Figure 2 , on the cylindrical inner wall of the upper cavity 110b, there is a coiled movement track 110a, and the electron gun 1 is slidably arranged in the movement track 110a. The movable inner cavity 120 is arranged in the upper cavity 110b. The movable inner cavity 120 is generally in a cylindrical shape with both upper and lower ends open. The upper end of the movable inner cavity 120 is fixedly connected to the inner cavity top of the upper cavity 110b, and the lower end is fixedly connected to the step 110d; the emission end of the electron gun 1 is inserted into the movable inner cavity 120 and can spray an electron beam into the movable inner cavity 120.

[0023] Continue to refer to Figure 1 and Figure 2 , on one side of the lower cavity 110c, there is a wafer inlet, and the wafer can enter and exit the fixed outer cavity 110 through the wafer inlet. The carrier 2 is arranged inside the lower cavity 110c and is directly opposite to the lower end opening of the movable inner cavity 120; the target 3 is arranged at the inner cavity top of the upper cavity 110b and is in the upper end opening of the movable inner cavity 120. The carrier 2 can be lifted and lowered. After the carrier 2 descends, it is directly opposite to the wafer inlet to facilitate the cooperation with a wafer loading device (such as a manipulator) to pick up the wafer; after receiving the wafer, the carrier 2 rises and can push the wafer into the movable inner cavity 120, and the surface of the wafer can be exposed directly below the target 3 through the lower end opening of the movable inner cavity 120.

[0024] The fixed outer cavity 110 and the movable inner cavity 120 are also provided with an air inlet and an air outlet to facilitate the circulation of the reaction gas.

[0025] During film coating, the carrier stage 2 pushes the wafer into the movable inner cavity 120, and the movable inner cavity 120 serves as a reaction chamber; the target 3 and the carrier stage 2 are energized to form an electric field; reaction gas for film coating is introduced into the movable inner cavity 120 through the gas inlet. Under the action of the electric field, the reaction gas is ionized to generate plasma. The positive ions in the plasma bombard the target 3 under the action of the collision between the electric field and electrons, so that the target atoms are sputtered out. The carrier stage 2 has a negative bias potential, which further attracts the target atoms to deposit on the surface of the wafer, and finally film coating is achieved.

[0026] Alternatively, during film coating, the carrier stage 2 pushes the wafer into the movable inner cavity 120, and the movable inner cavity 120 serves as a reaction chamber; the target 3 is energized and the carrier stage 2 is not energized; reaction gas for film coating is introduced into the movable inner cavity 120 through the gas inlet. The target 3 is energized, and the magnetron on the back of the target 3 rotates at a constant speed. Under the action of the electric field and magnetic field on the target surface, the reaction gas is ionized to form plasma. The positive ions in the plasma bombard the target 3 under the action of the electric field, and finally film coating is achieved.

[0027] Among them, the movable inner cavity 120 includes: a first bellows 121, the top end of the first bellows 121 is connected to the fixed outer cavity 110; a second bellows 122, the bottom end of the second bellows 122 is connected to the fixed outer cavity 110; a rotating connection ring 123, rotatably arranged between the first bellows 121 and the second bellows 122. A radially penetrating mounting hole is provided on the rotating connection ring 123, and the mounting hole is used to install the electron gun 1; the emitting end of the electron gun 1 communicates with the movable inner cavity 120 through the mounting hole; the power connection end of the electron gun 1 is slidably arranged in the movement track 110a; a power connection piece is provided in the movement track 110a, and the power connection piece is used to connect the power supply. After the power connection end of the electron gun 1 contacts the power connection piece, the electron gun 1 is energized and can emit an electron beam; the electron beam excitation coating device further includes a rotation driving mechanism 200, and the rotation driving mechanism 200 is used to drive the rotation of the rotating connection ring 123; during the coating process, the rotating connection ring 123 rotates, driving the electron gun 1 to rotate with it. Constrained by the movement track 110a, the electron gun 1 can rise or fall while rotating, so as to change the emission position of the electron beam; driven by the electron gun 1, the rotating connection ring 123 can also rise or fall while rotating, and the first bellows 121 and the second bellows 122 can undergo adaptive deformation, so as to ensure the stability of the movement of the electron gun 1.

[0028] The movement track 110a not only provides a sliding path for the electron gun 1, but also the power connection piece in the movement track 110a can connect the power supply to supply power to the electron gun 1, so that the electron gun 1 can emit an electron beam during the movement process.

[0029] Specifically, reference can be made to Figure 1 and Figure 2, in the illustrated embodiment, from top to bottom, the movable inner cavity 120 is composed of a first corrugated pipe 121, a rotating connection ring 123, and a second corrugated pipe 122. The top end of the first corrugated pipe 121 is connected to the inner cavity top of the upper cavity 110b, and the bottom end of the second corrugated pipe 122 is connected to the step 110d. The corrugated pipes have the structural characteristics of elastic deformation. They can undergo adaptive deformation when the electron gun 1 moves, which is beneficial to the sealing of the movable inner cavity 120 and can also ensure the stability of the electron gun 1. The rotating connection ring 123 is rotatably arranged between the two corrugated pipes. The electron gun 1 passes through the mounting hole. Since the mounting hole radially penetrates the rotating connection ring 123, the emitting end of the electron gun 1 can communicate with the movable inner cavity 120, and the power connection end can be slidably connected to the moving track 110a; when the power connection end moves to contact the power connection piece in the moving track 110a, the electron gun 1 is powered on and can emit an electron beam into the movable inner cavity 120.

[0030] The electron beam has high energy and directivity. After the electron beam enters the reaction chamber, it will collide with the reaction gas molecules, thereby promoting the ionization of the reaction gas. The introduction of the electron beam can increase the amount of electrons in the cavity, thereby effectively making up for the deficiencies of traditional electric field ionization and improving the density of the plasma. At the same time, the electron beam can also improve the activity of electrons, further promoting the ionization of the reaction gas and promoting the plasma to bombard the target 3, thereby increasing the ionization rate of the target atoms and improving the film quality.

[0031] The rotation driving mechanism 200 can adopt any structure such as a motor or a rotary cylinder that can drive the rotating connection ring 123 to rotate. During the coating process, the electron gun 1 rotates under the drive of the rotating connection ring 123. At this time, the electron gun 1 will also move along the spiral moving track 110a. Under the constraint and guidance of the moving track 110a, the electron gun 1 can carry the rotating connection ring 123 to rise or fall while rotating, thereby changing the emission position of the electron beam. When the rotating connection ring 123 rises and falls, the first corrugated pipe 121 and the second corrugated pipe 122 can undergo adaptive deformation, thereby ensuring that the electron gun 1 always moves and works stably. The rotation and lifting of the electron gun 1 are beneficial to the uniform distribution of the electron beam emitted by it in the reaction chamber, thereby further optimizing the plasma distribution and improving the coating uniformity.

[0032] In a specific embodiment, during film coating, the carrier stage 2 holds the wafer and exposes its surface directly below the target 3. The wafer is located in the movable inner cavity 120, which forms a relatively enclosed and stable reaction chamber. The target 3 and the carrier stage 2 are powered on, and a reaction gas for film coating is introduced into the movable inner cavity 120. The reaction gas is ionized to generate plasma, and positive ions bombard the target 3 under the action of electron collision. At the same time, the rotation drive mechanism 200 drives the rotation connection ring 123 to rotate, and the electron gun 1 slides along the movement track 110a and contacts the power connection piece in the movement track 110a to be powered on. The electron gun 1 emits an electron beam. During the film coating process, the electron gun 1 rotates and moves up and down, so that the electron beam can act on the entire reaction chamber. By emitting the electron beam with the electron gun 1, a more uniform and high-density plasma environment can be formed in the reaction chamber. In such an environment, more ions can participate in the process of bombarding the target 3, thereby increasing the ionization rate of target atoms and improving the film quality. At the same time, the rotation and up-and-down movement of the electron gun 1 make the plasma distribute more evenly, which is beneficial to improving the uniformity of the film coating on the wafer surface and helps to improve the yield and overall performance of the chip.

[0033] In summary, the electron beam excitation film coating device provided in this application adds an electron gun 1. By using the electron gun 1 to emit an electron beam, the amount of electrons in the cavity is increased and the electron activity is improved, which can promote the ionization of the reaction gas and increase the plasma concentration, thereby increasing the ionization rate of target atoms and improving the film quality. Further, the electron gun 1 rises or falls while rotating, changing the emission position of the electron beam, making the distribution of electrons in the movable inner cavity 120 more uniform, thus avoiding the concentrated shooting of electrons in a fixed area in the cavity, which is beneficial to optimizing the distribution of plasma and improving the uniformity of film coating. The movable inner cavity 120 is provided to form a relatively enclosed reaction chamber, which can not only stably install the electron gun 1 and drive the electron gun 1 to rotate by using the rotation connection ring 123, but also adaptively deform the first bellows 121 and the second bellows 122 when the electron gun 1 moves, effectively maintaining the stability of the electron gun 1 relative to the reaction chamber, so as to facilitate the movement and operation of the electron gun 1.

[0034] To facilitate the entry and exit of the reaction gas into and out of the movable inner cavity 120, in one embodiment, the bottom end of the second bellows 122 is provided with an extended section 124 extending downward. When the bottom end of the second bellows 122 abuts against the step 110d, the extended section 124 is inserted into the lower cavity 110c. A circle of air holes 125 is provided on the extended section 124. The lower cavity 110c is provided with an air inlet and an air outlet. The air inlet is connected to the reaction gas supply device, and the air outlet is connected to the vacuum pumping device. During film coating, the reaction gas is introduced into the lower cavity 110c through the air inlet and then flows into the movable inner cavity 120 through the air holes 125. Part of the reaction gas is ionized, and another part of the reaction gas that does not participate in the ionization reaction and the waste generated during film coating can flow out through the air holes 125 and be evacuated by the vacuum pumping device.

[0035] Since the extension section 124 is close to the lower cavity 110c, during the coating process, the air hole 125 will be adjacent to the carrier 2 and the wafer. Therefore, after the reaction gas enters from the air hole 125, it can quickly be in the electric field formed after the carrier 2 is powered on, so as to make full use of the electric field and achieve efficient ionization.

[0036] Optionally, balls are arranged in the movement track 110a; when the electron gun 1 travels along the movement track 110a, the balls can reduce the friction between themselves and the electron gun 1 by rotating, thereby promoting the movement of the electron gun 1.

[0037] Among them, the balls are high-precision spherical parts, usually made of materials with wear resistance and low friction coefficient, such as stainless steel, ceramics, etc. A plurality of balls are evenly embedded in the movement track 110a and can freely roll in the movement track 110a.

[0038] When the electron gun 1 travels along the movement track 110a, it contacts the balls and applies pressure to the balls; since the balls are spherical structures, they will rotate under the action of pressure; the rotation of the balls can convert the sliding friction between the electron gun 1 and the movement track 110a into rolling friction, and the friction of rolling friction is much smaller than that of sliding friction. Therefore, the friction force received by the electron gun 1 during movement will be reduced. The smaller friction force makes the electron gun 1 move more smoothly during movement and can reduce energy loss, so as to facilitate the electron gun 1 to respond efficiently to the drive and achieve stable rotation and lifting movement.

[0039] By reducing the wear between the electron gun 1 and the movement track 110a, the service life of the electron gun 1 and the movement track 110a can also be extended, and the equipment maintenance cost can be reduced.

[0040] Optionally, the electrical connection piece is a metal piece, and the electrical connection piece is embedded in the movement track 110a.

[0041] At this time, the electrical connection piece is made of a metal material that is convenient for conducting electricity (such as copper alloy or aluminum alloy with good conductivity, wear resistance and corrosion resistance, etc.). It is installed in the movement track 110a and can contact the electrical connection end of the electron gun 1, so as to achieve contact conduction, so as to facilitate the electron gun 1 to emit an electron beam after being powered on.

[0042] The shape and size of the metal piece need to be processed according to the shape and size of the movement track 110a, and are firmly installed at a position convenient for contacting the electrical connection end of the electron gun 1 by means of welding, clamping or bolt fixing, etc. To ensure good contact between the metal piece and the electrical connection end of the electron gun 1, the contact part can be surface-treated, such as polishing, silver plating, etc., to reduce the contact resistance.

[0043] Optionally, a conductive layer formed by spraying a metal material is provided on the track surface of the movement track 110a for contacting the electron gun 1, and the conductive layer is used as the electrical connection piece.

[0044] At this time, the conductive layer is formed on the track surface through a spraying process, so that a metal coating with good conductivity adheres to the moving track 110a. When the electron gun 1 moves to contact the conductive layer, contact conduction is achieved.

[0045] In a specific embodiment, the track surface of the moving track 110a for contacting the electron gun 1 is pre-treated first, such as cleaning, roughening, etc., to enhance the adhesion of the metal coating. Then, a selected metal material is sprayed on the track surface to form a conductive layer by means of a spraying process, such as thermal spraying, cold spraying or plasma spraying. After spraying, the conductive layer is detected to ensure that it meets the requirements of electrical conductivity.

[0046] Compared with using a metal electrical connection piece, the method of spraying a metal material on the track surface to form a conductive layer reduces the number of parts and the processing complexity, and can reduce the manufacturing cost. Moreover, the conductive layer is integrally formed with the track surface, reducing the failures caused by the loosening or damage of parts, and can also reduce the maintenance difficulty and maintenance cost.

[0047] The two forms of electrical connection pieces provide diverse choices. In actual equipment, flexible selection can be made according to the specific design requirements, usage environment and cost budget of the device. For some devices with high space requirements or those that need to simplify the structure, spraying a conductive layer on the track surface is more suitable; while for occasions that require frequent replacement of the electrical connection piece or have extremely high requirements for conductivity, the metal electrical connection piece can better meet the needs, thus enhancing the adaptability and versatility of the device.

[0048] To ensure that the electrical connection end of the electron gun 1 can always tightly press against the electrical connection piece, optionally, an elastic piece group is provided on the side of the electrical connection end of the electron gun 1. The elastic piece group is composed of a plurality of arc-shaped elastic pieces. One end of these elastic pieces is connected to the electrical connection end of the electron gun 1, and the other end freely extends and bends towards the electrical connection piece. The plurality of elastic pieces are evenly distributed in a ring around the electrical connection end.

[0049] Among them, the elastic piece is made of a material with good elasticity and conductivity, such as beryllium bronze or phosphor bronze. When the electron gun 1 approaches the electrical connection piece, the elastic piece contacts the electrical connection piece first. Since one end of the elastic piece is fixed on one side of the electrical connection end, when its free end is squeezed by the electrical connection piece and deforms, the tendency of the elastic piece to restore its original shape will generate a force pointing towards the electrical connection piece direction and act on the electrical connection end. That is to say, when the elastic piece is squeezed, the stress generated inside it will cause it to generate an elastic force towards the electrical connection piece direction, and this elastic force will push the electrical connection end towards the electrical connection piece direction, so that the electrical connection end more tightly presses against the electrical connection piece.

[0050] This design can utilize the elastic characteristics of the elastic sheet to adapt to the possible slight position deviation between the power connection sheet and the power connection end, thereby ensuring the reliability of contact and conduction. In particular, when multiple electron guns 1 are provided and the electron guns 1 need to work alternately, the electron guns 1 will constantly contact or leave the power connection sheet. Adding an elastic sheet group can ensure that the electron gun 1 will abut against the power connection sheet after entering the position of the power connection sheet, thereby achieving contact and conduction.

[0051] Optionally, a threaded hole is provided on the shell of the electron gun 1, and an adjusting bolt is provided in the threaded hole; the adjusting bolt corresponds to the elastic sheet one by one, and the adjusting bolt is against the elastic sheet to connect the fixed end of the electron gun 1; the position of the fixed end of the elastic sheet can be adjusted by rotating the adjusting bolt, thereby changing the bending degree and elastic force of the free end of the elastic sheet.

[0052] During use, if it is found that the contact between the terminal and the terminal plate is not tight enough, the adjusting bolt can be tightened appropriately to further bend the elastic plate, thereby increasing the elastic force on the terminal and ensuring that the terminal and the terminal plate fit tightly.

[0053] Optionally, a first insulating buffer pad is provided between the elastic sheet and the housing of the electron gun 1 , and a second insulating buffer pad is also provided at the portion where the elastic sheet contacts the power connection sheet.

[0054] The first insulating cushion is made of rubber or silicone material, which can buffer the pressure of the elastic sheet on the electron gun 1 shell to avoid damage to the shell due to excessive elastic force of the elastic sheet. At the same time, it can play an insulating role to prevent short circuit between the elastic sheet and the electron gun 1 shell.

[0055] The second insulating buffer pad is made of materials with good insulation and low friction coefficient such as polytetrafluoroethylene, which can not only ensure the insulation between the elastic sheet and the power connection sheet, but also reduce the friction between the elastic sheet and the power connection sheet, thereby extending the service life of the elastic sheet and the power connection sheet.

[0056] Optionally, the fixed outer cavity 110 includes: an outer shell made of metal material; an inner liner arranged in the outer shell and made of insulating material, and a moving track 110a is opened on the inner wall of the inner liner; the first bellows 121 and the second bellows 122 are both connected to the outer shell for grounding.

[0057] The housing is made of metal material and is the outer frame that fixes the outer cavity 110. Metal materials are usually selected from materials with certain strength and good conductivity, such as stainless steel, aluminum alloy, etc., to ensure the overall robustness of the device and provide a good conductor for grounding. Grounding the housing can conduct static electricity or leakage current generated during the operation of the device to the ground, thereby ensuring the safety of operators and equipment.

[0058] The inner lining is located inside the outer shell and is made of insulating materials such as ceramics and polytetrafluoroethylene. A movement track 110a is provided on the inner wall of the inner lining facing away from the outer shell, which is used to guide the movement of the electron gun 1 and provide an installation position for the electrical connection piece. The selection of insulating materials can prevent the electron gun 1 from leaking electricity during movement and ensure the safety of the device operation.

[0059] For details, please refer to Figure 1 and Figure 2 . In the illustrated embodiment, the fixed outer cavity 110 includes an upper cavity 110b and a lower cavity 110c. The upper cavity 110b includes an outer shell and an inner lining, and the lower cavity 110c only includes an outer shell; the inner lining is arranged in a cylindrical shape, fits the inner wall of the outer shell and surrounds the movable inner cavity 120. The top of the outer shell of the upper cavity 110b is closed to form the cavity top of the fixed outer cavity 110, and a step 110d is formed at the bottom of the outer shell of the upper cavity 110b and is connected to the outer shell of the lower cavity 110c.

[0060] Continue to refer to Figure 1 and Figure 2 . The top end of the first bellows 121 is connected to the cavity top of the upper cavity 110b (i.e., the top wall formed by the outer shell of the upper cavity 110b) to achieve grounding; the bottom end of the second bellows 122 is connected to the step 110d, which also achieves grounding. During the coating process, the electron beam emitted by the electron gun 1 and the electrons generated by the ionization of the reaction gas will move in the reaction chamber. The grounded movable inner cavity 120 can timely conduct away these redundant electrons, prevent the accumulation of electrons in the cavity to form an electrostatic field, avoid damage to the coating process and equipment caused by electrostatic discharge, and ensure the use safety.

[0061] The insulating design of the inner lining and the grounding connection of the outer shell can prevent current leakage during the operation of the electron gun 1, thus ensuring the personal safety of the operator and the normal operation of the equipment, and reducing or even eliminating the risks of equipment damage and personal injury caused by electric leakage. Further, connecting the first bellows 121 and the second bellows 122 to the outer shell to achieve grounding can avoid the electrical safety problems of the movable inner cavity 120 caused by electrostatic accumulation or electric leakage, further enhance the electrical safety during the operation of the device, and make the equipment operation more reliable.

[0062] By grounding the movable inner cavity 120, the electrostatic problem caused by the accumulation of electrons during the coating process is effectively solved, and the influence of electrostatic discharge on the coating quality is avoided, such as preventing the film from appearing pinholes, defects, etc., improving the yield rate of the coated products. Timely conducting away electrons reduces the risk of equipment failure or damage caused by static electricity, ensures the stable operation of the equipment, extends the service life of the equipment, and at the same time reduces the safety hazard of the operator being electrocuted when contacting the charged equipment.

[0063] It is easy to understand that to ensure the stability of the active cavity 120 and the electron gun 1, it is necessary not only for the rotating connection ring 123 to be able to rotate relative to the bellows, but also for the rotating connection ring 123 to be able to drive the bellows to lift and deform.

[0064] In one embodiment, the upper side of the rotating connection ring 123 is rotatably connected to the first bellows 121 through a set of bearings or a slewing bearing, and the lower side is rotatably connected to the second bellows 122 through another set of bearings or a slewing bearing.

[0065] In another embodiment, the bottom end of the first bellows 121 is provided with a first connection groove, and the first connection groove is arranged in a T shape; the top end of the second bellows 122 is provided with a second connection groove, and the second connection groove is arranged in an inverted T shape; a first connection block is provided on one side of the rotating connection ring 123 close to the first bellows 121, and the shape of the first connection block is adapted to the first connection groove; a second connection block is provided on one side of the rotating connection ring 123 close to the second bellows 122, and the shape of the second connection block is adapted to the second connection groove; so that the first connection block is clamped in the first connection groove, the second connection block is clamped in the second connection groove, and the rotating connection ring 123 can not only be rotatably connected to the first bellows 121 and the second bellows 122, but also drive the first bellows 121 and the second bellows 122 to deform during the rising or falling process.

[0066] Specifically, refer to Figure 2 , in the illustrated embodiment, the top end of the first bellows 121 is connected to the inner cavity top of the fixed outer cavity 110, and a first connection groove that is open downward is provided on the bottom surface, and the cross section of the first connection groove is in a T shape. Correspondingly, a first connection block with a T-shaped cross section is provided on the upper surface of the rotating connection ring 123 close to the first bellows 121, and the first connection block is clamped in the first connection groove and can slide in the first connection groove.

[0067] Continue to refer to Figure 2 , the bottom end of the second bellows 122 is connected to the step 110d in the fixed outer cavity 110, and a second connection groove that is open upward is provided on the top surface, and the cross section of the second connection groove is in an inverted T shape with a top end. The first connection groove and the second connection groove are symmetric structures, which is convenient for processing. Correspondingly, a second connection block with an inverted T-shaped cross section is provided on the lower surface of the rotating connection ring 123 close to the second bellows 122, and the second connection block is clamped in the second connection groove and can slide in the second connection groove.

[0068] Since the fit between the connection block and the connection groove is not completely fixed, but allows relative rotation while ensuring the connection strength, when the rotary drive mechanism 200 drives the rotary connection ring 123 to rotate, the rotary connection ring 123 can rotate around its own central axis (which is also the longitudinal central axis of the reaction chamber). The horizontal part of the T-shaped or inverted T-shaped structure can not only enhance the connection stability between the connection block and the connection groove, prevent the displacement of the first connection block or the second connection block in the horizontal direction, but also pull or push the bellows when the rotary connection ring 123 moves up or down. The vertical part of the T-shaped or inverted T-shaped structure is conducive to the tight fit between the connection block and the connection groove, so as to better transmit the acting forces of rotation and lifting. When the bellows is subjected to tensile or thrust forces, it will deform to adapt to the position change of the rotary connection ring 123, maintain the support for the rotary connection ring 123, and ensure the stable positions of the rotary connection ring 123 and the electron gun 1. The annular structures of the connection groove and the connection block can also limit each other, playing a role in guiding the rotation of the rotary connection ring 123.

[0069] The T-shaped connection block and connection groove solve the problem that the rotary connection ring 123 and the first bellows 121 and the second bellows 122 need to be rotatably connected and move synergistically during the lifting process; by utilizing the elastic characteristics of the bellows, the stability of the rotary connection ring 123 during rotation and lifting is ensured, avoiding shaking or deviation caused by unstable connection, which is beneficial to the stability of the movement of the electron gun 1.

[0070] Optionally, to improve the convenience of the rotation of the rotary connection ring 123, balls are provided on the inner walls of the first connection groove and the second connection groove. When the first connection block and the second connection block move in the corresponding connection grooves, the balls can reduce the friction between themselves and the connection block by rotating, thereby promoting the rotation of the connection block.

[0071] Specifically, a plurality of installation grooves are uniformly formed on the inner walls of the first connection groove and the second connection groove, and the balls are rotatably embedded in the installation grooves. The top surfaces of the balls protrude from the installation grooves to facilitate contact with the first connection block and the second connection block on the rotary connection ring 123. The balls can be made of materials with high hardness, good wear resistance and low friction coefficient, such as ceramics or stainless steel, to ensure a long-term stable low-friction rotation effect.

[0072] For the convenience of the rotating connection ring 123 to rotate around the longitudinal central axis of the reaction chamber, in one embodiment, a ring of tooth structures 201 is provided on the outer peripheral surface of the rotating connection ring 123; the rotation driving mechanism 200 includes: a gear 210 engaged with the tooth structure 201; a rotation driving member 221 and a driving rod 222, the driving rod 222 is connected to the gear 210, and the rotation driving member 221 is used to drive the driving rod 222 to rotate; a limiting card slot 202 is also provided on the outer peripheral surface of the rotating connection ring 123, and the gear 210 is limited within the limiting card slot 202 to facilitate maintaining the meshing state with the tooth structure 201; during the coating process, the rotation driving member 221 drives the driving rod 222 to rotate, the driving rod 222 drives the gear 210 to rotate, and the gear 210 drives the rotating connection ring 123 and the electron gun 1 to rotate through the tooth structure 201, and the electron gun 1 rises or falls along the movement track 110a during the rotation process.

[0073] Specifically, reference can be made to Figure 1 and Figure 2 , in the illustrated embodiment, the fixed end of the rotation driving member 221 (which can be a rotating cylinder, a motor, etc.) is arranged in the lower cavity 110c. One end of the driving rod 222 is connected to the output shaft of the rotation driving member 221, and the other end passes through the step 110d and is connected to the gear 210 in the upper cavity 110b, and the driving rod 222 can transmit the rotational power generated by the rotation driving member 221 to the gear 210.

[0074] With reference to Figure 3 , the main body of the rotating connection ring 123 is generally in a circular ring shape. A ring of tooth structures 201 capable of meshing with the gear 210 is provided at the lower end of the rotating connection ring 123. Baffle plates are provided on the upper and lower sides of the tooth structure 201, and a limiting card slot 202 is formed between the two baffle plates, and at least part of the gear 210 is located in the limiting card slot 202 and is restricted by the limiting card slot 202. During the coating process, the rotating connection ring 123 will rise or fall while rotating with the electron gun 1, and the limiting card slot 202 can drive the gear 210 to rise or fall with the rotating connection ring 123, so as to ensure that the gear 210 is always meshed with the tooth structure 201 and can transmit rotational power to the tooth structure 201.

[0075] Specifically, during coating, the rotation driving member 221 is started to drive the driving rod 222 to drive the gear 210 to rotate. Since the gear 210 and the tooth structure 201 are meshed with each other, the gear 210 can drive the rotating connection ring 123 to rotate around the longitudinal central axis of the reaction chamber through the tooth structure 201. Since the upper and lower sides of the gear 210 are blocked by the groove walls of the limiting card slot 202, the limiting card slot 202 can drive the gear 210 to rise and fall along with the rotating connection ring 123 when the rotating connection ring 123 rises and falls, so as to facilitate the gear 210 to remain meshed with the tooth structure 201 and ensure that the entire driving system can operate continuously and stably.

[0076] In one embodiment, when the gear 210 moves up and down with the rotation connection ring 123, it drives the driving rod 222 and the rotation driving member 221 to move up and down as a whole.

[0077] In another embodiment, a transmission key extending in the vertical direction is provided on the surface of the driving rod 222; a key groove extending in the vertical direction is provided on the inner ring wall of the gear 210, and the gear 210 and the driving rod 222 are slidably connected through the transmission key and the key groove; during the coating process, the gear 210 can rise or fall with the rotation connection ring 123, while the positions of the rotation driving member 221 and the driving rod 222 in the vertical direction remain unchanged.

[0078] Specifically, a transmission key extending in the vertical direction is provided on the surface of the driving rod 222. The transmission key is usually rectangular or trapezoidal and is integrally formed or firmly connected to the driving rod 222 by mechanical processing. A key groove extending in the vertical direction is provided on the inner ring wall of the gear 210. The shape and size of the key groove are precisely matched with the transmission key to ensure that both can closely cooperate to transmit torque and enable the gear 210 to freely slide on the driving rod 222 in the vertical direction.

[0079] More specifically, the transmission key is embedded in the key groove, and the sides of the two are closely attached. When the driving rod 222 rotates, the transmission key can transmit the torque of the driving rod 222 to the gear 210 to ensure that the gear 210 rotates synchronously with the driving rod 222. In the vertical direction, the key groove provides a sliding space for the transmission key, enabling the gear 210 to move up and down along the driving rod 222.

[0080] During the coating process, the rotation driving member 221 drives the driving rod 222 to rotate. The transmission key and the key groove cooperate to reliably transmit the rotational movement of the driving rod 222 to the gear 210, causing the gear 210 to rotate synchronously. The gear 210 then drives the rotation connection ring 123 and the electron gun 1 to rotate through meshing with the tooth structure 201. Constrained by the movement track 110a, the electron gun 1 can rise or fall while rotating with the rotation connection ring 123, and the gear 210 rises or falls accordingly under the constraint of the limit card slot 202. Since the transmission key and the key groove are slidably connected, the gear 210 can freely slide in the vertical direction on the driving rod 222, while the positions of the rotation driving member 221 and the driving rod 222 in the vertical direction can remain unchanged.

[0081] The setting of the transmission key and the key groove neither hinders the transmission between the driving rod 222, the gear 210 and the tooth structure 201, nor causes the rotation driving member 221 and the driving rod 222 to move up and down, reducing the vibration and unstable factors that may be caused by the movement of these components. The stable driving structure helps to improve the smoothness of the movement of the rotation connection ring 123 and the electron gun 1, and can improve the uniformity and quality of the coating.

[0082] When the electron gun 1 emits an electron beam, the electron beam impacts forward and may hit a part of the rotatable connecting ring 123 directly in front of the electron gun 1. Since electrons have kinetic energy, during the impact on the rotatable connecting ring 123, the kinetic energy of the electrons is converted into heat energy, which will increase the temperature of the impacted area.

[0083] Optionally, to avoid severe heating of a single area, heat dissipation blocks are provided on the rotatable connecting ring 123, and the heat dissipation blocks face the electron gun 1 directly; the electron beam emitted by the electron gun 1 moves towards the heat dissipation blocks, and the heat dissipation blocks can solve the problem of local high temperature caused by concentrated electron shooting.

[0084] Specifically, the heat dissipation blocks are installed on the rotatable connecting ring 123 and face the electron gun 1 directly. The heat dissipation blocks are usually made of materials with high thermal conductivity, such as copper, aluminum, or heat-conducting ceramics, etc. The shape of the heat dissipation blocks can be designed according to the shape and range of the electron beam emitted by the electron gun 1. Commonly, they are in the shape of blocks or sheets, with a large heat dissipation surface area for efficient heat dissipation. Since the rotatable connecting ring 123 and the electron gun 1 maintain a relatively static motion state, the electron beam emitted by the electron gun 1 can always hit the heat dissipation blocks. With the characteristic of its own high thermal conductivity, the heat dissipation blocks can quickly absorb this heat and transfer the heat to the whole body rapidly. After absorbing heat, the heat dissipation blocks can dissipate the heat through three ways: heat conduction, heat convection, and heat radiation. Heat conduction is the transfer of heat from the high-temperature area to the low-temperature area inside the heat dissipation blocks; heat convection is to take away the heat through the flow of the surrounding gas or liquid medium. In the working environment of the coating device, it is usually a heat exchange with the gas inside the device; heat radiation is that the heat dissipation blocks radiate heat to the surrounding space in the form of electromagnetic waves. Through the synergistic effect of these three heat dissipation methods, the temperature of the area with concentrated electron shooting can be effectively reduced.

[0085] Optionally, to improve the heat dissipation effect of the heat dissipation blocks, a plurality of fins are provided on the surface of the heat dissipation blocks, and the fins can increase the heat dissipation surface area. The fins can be in the form of thin sheets, perpendicular to the main surface of the heat dissipation blocks and evenly distributed. When the heat is conducted to the heat dissipation blocks, heat exchange with the surrounding gas through the fins can accelerate the heat dissipation speed.

[0086] Optionally, heat pipes are integrated in the heat dissipation blocks. The heat pipes are filled with a volatile working fluid, and the phase change heat transfer of the working fluid in the heat pipes can be used to improve the heat dissipation effect. Specifically, when the heat is transferred to the evaporation section of the heat pipe, the working fluid quickly vaporizes, and the steam carries the heat to flow towards the condensation section. It liquefies when encountering cold in the condensation section, releases latent heat, and then returns to the evaporation section through the capillary structure. This efficient heat transfer method can enable the heat dissipation blocks to quickly dissipate the heat, thereby maintaining a lower temperature and ensuring the stable operation of the electron gun 1.

[0087] Optionally, the heat sink is of a hollow structure and filled with a liquid or gas medium with good heat dissipation performance inside. The liquid medium, such as thermal conductive silicone oil, has a high specific heat capacity and good fluidity, can absorb a large amount of heat and circulate inside the heat sink, and evenly disperse the heat; the gas medium, such as helium, has good thermal conductivity and can quickly take away the heat. This structure can effectively utilize the characteristics of the medium to improve the heat dissipation uniformity and efficiency of the heat sink.

[0088] Optionally, the electron beam excitation coating device provided by the present application includes at least two electron guns 1. The at least two electron guns 1 are arranged at intervals on the rotation connection ring 123 and their emission ends are staggered; the electrical connection pieces in the movement track 110a are arranged in a grid shape. When one electron gun 1 moves to the electrical connection end to contact the electrical connection piece, the other electron guns 1 do not contact the electrical connection piece; during the coating process, there is always one electron gun 1 in a state where the electrical connection end is in contact with the electrical connection piece, and the at least two electron guns 1 can work alternately, so as to avoid the electrons concentrating on shooting at a single position.

[0089] Specifically, at least two electron guns 1 are arranged at intervals on the rotation connection ring 123, and their emission ends are staggered, which can avoid the electron beam emitted by the working electron gun 1 from hitting the non-working electron gun 1. The electrical connection pieces in the movement track 110a are arranged in a grid shape. This grid-shaped structure is designed to cooperate with the alternate operation of multiple electron guns 1. The position and shape of the electrical connection pieces are precisely planned to ensure that only the electrical connection end of one electron gun 1 is connected to the electrical connection piece when the rotation connection ring 123 rotates, and each electron gun 1 can work alternately in an orderly manner.

[0090] During the coating process, the rotation connection ring 123 rotates under the drive of the rotation drive mechanism 200, driving multiple electron guns 1 to rotate synchronously. Since the electrical connection pieces are arranged in a grid shape, when an electron gun 1 on the rotation connection ring 123 rotates to a grid position with an entity, this electron gun 1 contacts and conducts electricity with the electrical connection piece, while the other electron guns 1 on the rotation connection ring 123 are all in grid positions without entities. Therefore, the other electron guns 1 will not work. As the rotation connection ring 123 continues to rotate, each electron gun 1 is sequentially connected and then disconnected from the power supply to achieve alternate operation. In this way, the emission position of the electron beam in the movable inner cavity 120 continuously changes. On the one hand, it can avoid the electrons concentrating on shooting at a single position and solve the problem of local high temperature caused by the concentrated bombardment of electrons. On the other hand, the electrons are dispersed and act on different regions, which is beneficial to uniform distribution.

[0091] Optionally, the electron beam excitation coating device provided by the present application further includes a permanent magnet, which is arranged in the fixed outer cavity 110 and fixed to one side of the movable inner cavity 120; the permanent magnet can attract electrons, thereby improving the movement direction of the electrons emitted by the electron gun 1; as the electron gun 1 rotates and moves up and down continuously, the attractive force and the attraction direction of the electrons emitted by the electron gun 1 from the permanent magnet change continuously, so as to facilitate electron diffusion and strengthen the random movement of electrons.

[0092] Among them, the permanent magnet can be arranged at any position between the fixed outer cavity 110 and the movable inner cavity 120. For example, the permanent magnet can be embedded in the inner wall of the movable inner cavity 120 and avoid the movement track 110a. When the electron gun 1 makes a rotational lifting movement, it will continuously change the relative position with the permanent magnet and the angle between the electron beam and the permanent magnet.

[0093] The permanent magnet generally uses a high-magnetic material, such as a neodymium iron boron permanent magnet, which has strong magnetism. Its shape and size are designed according to the internal space of the device and the requirements for the influence on electron movement. It is commonly a cuboid or a cylinder to ensure that a magnetic field with sufficient intensity can be generated at a specific position. The permanent magnet is fixed to one side of the movable inner cavity 120, and the magnetic field generated by it can cover the movement area of electrons in the movable inner cavity 120.

[0094] Specifically, the permanent magnet generates a magnetic field. The electrons emitted by the electron gun 1 carry negative charges and will be affected by the Lorentz force in the magnetic field. According to the Lorentz force formula F = qvBsinθ, where q is the electron charge, v is the electron velocity, B is the magnetic field strength, and θ is the angle between the electron velocity direction and the magnetic field direction, it can be known that the electrons will deflect towards the permanent magnet, thereby changing the movement direction of the electrons. As the electron gun 1 rotates and moves up and down continuously, the relative position between the permanent magnet and the electron gun 1 changes continuously, and the magnitude and direction of the Lorentz force received by the electrons also change accordingly. This makes the movement trajectory of electrons in the movable inner cavity 120 more complex, no longer limited to simple straight lines or regular curves, so as to realize electron diffusion and strengthen the randomness of electron movement, so as to facilitate the full diffusion of electrons into the movable inner cavity 120, thereby improving the plasma environment in the reaction chamber. The efficient diffusion and uniform distribution of electrons can promote the ionization of reaction gases, prompt the sputtering and deposition of target atoms, thereby improving the coating efficiency, ensuring the coating uniformity, and enhancing the quality of coating products. A more uniform plasma distribution also helps to improve the coating efficiency, while reducing equipment losses caused by plasma non-uniformity and extending the service life of the equipment.

[0095] Optionally, a plurality of permanent magnets are arranged in the fixed outer cavity 110, and the plurality of permanent magnets are distributed at intervals along the vertical direction and in a spiral pattern.

[0096] For example, the plurality of permanent magnets are arranged at intervals along the extension direction of the movement track 110a.

[0097] It is easy to understand that each permanent magnet generates an independent magnetic field, such that multiple permanent magnets are spirally and spacedly distributed in the vertical direction, and their magnetic fields can be superimposed on each other. In this way, the electrons emitted by the electron gun 1 will be jointly affected by the magnetic fields of multiple permanent magnets during their movement. Due to the spiral distribution of the permanent magnets, the magnitude and direction of the magnetic force received by the electrons continuously change with their positions, which enables the electrons to be affected by the magnetic field to varying degrees at different heights and angles, further enhancing the diffusion and random movement of the electrons, strengthening the regulation of the electron movement, increasing the collision probability between the electrons and the reaction gas, facilitating more sufficient ionization of the reaction gas, thereby optimizing the plasma environment and improving the coating efficiency.

[0098] As the electron gun 1 rotates and moves up and down, the relative positions of the electrons and the permanent magnets continuously change. At different positions, the electrons receive different magnetic forces, thereby changing their movement directions. The spiral distribution of multiple permanent magnets increases the complexity of the electron movement trajectories, can prevent the electrons from concentrating in specific areas, and improves the uniformity of the action of the electrons on the gas and the plasma.

[0099] Adding permanent magnets can also expand the magnetic field coverage range of the permanent magnets, ensuring that the electrons in the reaction chamber can always be affected by the magnetic field of the permanent magnets, and the spiral distribution of the permanent magnets enables the electrons to be attracted and guided at different positions, realizing the change and diffusion of the electron movement directions. The permanent magnets can cooperate with the movable inner cavity 120 to create a spatial environment conducive to the uniform distribution of electrons.

[0100] Optionally, during the coating process, the rotation driving mechanism 200 drives the rotation connection ring 123 to drive the electron gun 1 to rotate; for each wafer coating, the electron gun 1 moves up and down once back and forth.

[0101] In a specific embodiment, the rotary drive mechanism 200 is composed of a rotary drive member 221, a drive rod 222, and a gear 210. The rotary drive member 221 is usually a motor and is the source of power; the drive rod 222 connects the rotary drive member 221 and the gear 210 and can transmit the rotary motion of the rotary drive member 221 to the gear 210; the gear 210 meshes with the tooth structure 201 on the outer peripheral surface of the rotary connection ring 123, and the rotation of the gear 210 can drive the rotary connection ring 123 to rotate. The rotary connection ring 123 is provided with a radially penetrating mounting hole for mounting the electron gun 1; the emission end of the electron gun 1 communicates with the movable inner cavity 120 through the mounting hole, and the power connection end is slidably arranged in the movement track 110a on the inner wall of the fixed outer cavity 110. A power connection piece is arranged in the movement track 110a, and the power connection piece is connected to the power supply and can provide conditions for powering on the electron gun 1. During the coating process, the rotary drive member 221 is started to generate rotary power, and the drive rod 222 transmits this power to the gear 210. The gear 210 rotates under the drive of the drive rod 222, further driving the rotary connection ring 123 and the electron gun 1 thereon to rotate synchronously; since the movement track 110a extends vertically in a spiral along the inner wall of the fixed outer cavity 110, when the electron gun 1 rotates, it will rise or fall along the movement track 110a while rotating under the constraint of the movement track 110a.

[0102] Taking the electron gun 1 being at a high position before coating as an example for illustration, after the carrier 2 pushes the wafer into the movable inner cavity 120, coating starts, and the rotary connection ring 123 rotates, causing the electron gun 1 to descend while rotating along the movement track 110a; the total coating duration is 2N seconds; after N seconds from the start of coating, the electron gun 1 descends to a low position, and the rotary connection ring 123 rotates in the reverse direction, causing the electron gun 1 to rise while rotating along the movement track 110a; after 2N seconds from the start of coating, the electron gun 1 returns to the high position and the coating is completed.

[0103] One coating makes the electron gun 1 lift and lower back and forth. On the one hand, it can ensure that the electron beam is evenly diffused throughout the reaction chamber. On the other hand, it makes the coating process have a clear operation process and rhythm, facilitating the realization of automatic control, improving the coating efficiency, and being suitable for large-scale production.

[0104] The above embodiments only represent several implementation manners of the present application, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the patent application. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present application, several deformations and improvements can still be made, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application should be subject to the appended claims.

Claims

1. An electron beam excited coating device, characterized in that, Comprising: A fixed outer cavity (110), on the inner wall of which there is a movement track (110a) spirally extending in the vertical direction; A movable inner cavity (120), arranged inside the fixed outer cavity (110) and used to provide space for wafer coating; An electron gun (1), used to emit an electron beam into the movable inner cavity (120); A stage (2), arranged inside the fixed outer cavity (110) and used to carry a wafer and enable the wafer to be exposed to the movable inner cavity (120); A target (3), arranged inside the fixed outer cavity (110), above the stage (2) and exposed to the movable inner cavity (120); Wherein, the movable inner cavity (120) includes: A first bellows (121), the top end of which is connected to the fixed outer cavity (110); A second bellows (122), the bottom end of which is connected to the fixed outer cavity (110); A rotating connection ring (123), rotatably arranged between the first bellows (121) and the second bellows (122), and on the rotating connection ring (123) there is a radially penetrating mounting hole for mounting the electron gun (1); The emitting end of the electron gun (1) communicates with the movable inner cavity (120) through the mounting hole; The power connection end of the electron gun (1) is slidably arranged in the movement track (110a); There is an electrical connection piece in the movement track (110a), and the electrical connection piece is used to connect to a power supply. After the power connection end of the electron gun (1) contacts the electrical connection piece, the electron gun (1) is powered on and can emit an electron beam; The electron beam excitation coating device further includes a rotation driving mechanism (200), and the rotation driving mechanism (200) is used to drive the rotating connection ring (123) to rotate; During the coating process, the rotating connection ring (123) rotates, driving the electron gun (1) to rotate accordingly. Constrained by the movement track (110a), the electron gun (1) can rise or fall while rotating, thereby changing the emission position of the electron beam; Driven by the electron gun (1), the rotating connection ring (123) can also rise or fall while rotating, and the first bellows (121) and the second bellows (122) can undergo adaptive deformation to ensure the stability of the movement of the electron gun (1).

2. The electron beam excitation coating device according to claim 1, characterized in that, The fixed outer cavity (110) includes: A housing, made of a metal material; A lining, arranged inside the housing and made of an insulating material. The movement track (110a) is provided on the inner wall of the lining; Both the first bellows (121) and the second bellows (122) are connected to the housing for grounding; 3. The electron beam excitation coating device according to claim 1, characterized in that, The bottom end of the first bellows (121) is provided with a first connection groove, and the first connection groove is arranged in a T shape; The top end of the second bellows (122) is provided with a second connection groove, and the second connection groove is arranged in an inverted T shape; On one side of the rotating connection ring (123) close to the first corrugated pipe (121), there is a first connection block, and the shape of the first connection block is adapted to the first connection groove; On one side of the rotating connection ring (123) close to the second corrugated pipe (122), there is a second connection block, and the shape of the second connection block is adapted to the second connection groove; So that the first connection block is clamped in the first connection groove, the second connection block is clamped in the second connection groove, and the rotating connection ring (123) can not only be rotatably connected to the first corrugated pipe (121) and the second corrugated pipe (122), but also pull the first corrugated pipe (121) and the second corrugated pipe (122) during the rising or falling process, causing them to deform.

4. The electron beam excitation coating device according to claim 1, wherein A ring of tooth structure (201) is provided on the outer peripheral surface of the rotating connection ring (123); The rotation driving mechanism (200) includes: A gear (210) meshing with the tooth structure (201); A rotation driving member (221) and a driving rod (222), the driving rod (222) is connected to the gear (210), and the rotation driving member (221) is used to drive the driving rod (222) to rotate; A limiting card slot (202) is further provided on the outer peripheral surface of the rotating connection ring (123), and the gear (210) is limited within the limiting card slot (202) to facilitate maintaining the meshing state with the tooth structure (201); During the coating process, the rotation driving member (221) drives the driving rod (222) to rotate, the driving rod (222) drives the gear (210) to rotate, the gear (210) drives the rotating connection ring (123) and the electron gun (1) to rotate through the tooth structure (201), and the electron gun (1) rises or falls along the movement track (110a) during the rotation process.

5. The electron beam excitation coating device according to claim 4, characterized in that, A transmission key extending in the vertical direction is provided on the surface of the driving rod (222); A key groove extending in the vertical direction is provided on the inner peripheral wall of the gear (210), and the gear (210) and the driving rod (222) are slidably connected through the transmission key and the key groove; During the coating process, the gear (210) can rise or fall with the rotating connection ring (123), while the positions of the rotation driving member (221) and the driving rod (222) remain unchanged in the vertical direction.

6. The electron beam excitation coating device according to claim 1, characterized in that, A heat dissipation block is provided on the rotating connection ring (123), and the heat dissipation block faces the electron gun (1); The electron beam emitted by the electron gun (1) moves towards the heat dissipation block, and the heat dissipation block can solve the problem of local high temperature caused by concentrated electron shooting.

7. The electron beam excitation coating device according to claim 1, characterized in that, It includes at least two electron guns (1), and at least two electron guns (1) are arranged at intervals on the rotating connection ring (123) and the emission ends are staggered; The power connection pieces in the movement track (110a) are arranged in a grid shape. When one of the electron guns (1) moves to the power connection end to contact the power connection piece, the other electron guns (1) do not contact the power connection piece; During the coating process, one of the electron guns (1) is always in a state where the power connection end is in contact with the power connection piece, and at least two of the electron guns (1) can work alternately, so as to avoid the electrons concentrating on shooting a single position.

8. The electron beam excitation coating device according to claim 1, characterized in that, It further includes a permanent magnet, and the permanent magnet is arranged in the fixed outer cavity (110) and on one side of the movable inner cavity (120); The permanent magnet can attract electrons, thereby improving the movement direction of the electrons emitted by the electron gun (1); As the electron gun (1) rotates and moves up and down continuously, the attractive force and the attraction direction of the electrons emitted by the electron gun (1) from the permanent magnet change continuously, so as to facilitate the diffusion of electrons and strengthen the random movement of electrons.

9. The electron beam excitation coating apparatus according to claim 8, wherein, A plurality of the permanent magnets are arranged in the fixed outer cavity (110), and the plurality of permanent magnets are distributed at intervals in a spiral along the vertical direction.

10. The electron beam excitation coating device according to any one of claims 1-9, characterized in that, During the coating process, the rotation driving mechanism (200) drives the rotation connection ring (123) to drive the electron gun (1) to rotate; For each wafer coating, the electron gun (1) moves up and down once.

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