MSG temperature and pressure integrated sensor and assembling method thereof

Abstract

The invention discloses an MSG temperature and pressure integrated sensor and an assembling method thereof. The MSG temperature and pressure integrated sensor comprises an upper shell which is an electrical connecting piece; the signal transmission structure comprises a lower shell, a temperature and pressure measuring assembly and an external threaded connecting piece, the temperature and pressure measuring assembly is arranged in the lower shell and fixedly connected with the external threaded connecting piece, and the temperature and pressure measuring assembly comprises a metal support which is arranged at the bottom end of the lower shell to form a mounting cavity; the PCB conditioning circuit board and the metal support are electrically connected and installed in the installation cavity. The pressure sensing element is arranged at the bottom of the metal support, electrically connected with the PCB conditioning circuit board and located on the external threaded connecting piece. And the NTC temperature sensing element is electrically connected with the PCB conditioning circuit board and penetrates through the PCB conditioning circuit board to be inserted into the mounting cavity of the external threaded connecting piece, so that the PCB conditioning circuit board is coupled with the pressure sensing element and the NTC temperature sensing element to realize simultaneous processing and conversion of a conditioning circuit on a pressure signal and a temperature signal, and the integrated temperature and pressure sensor is formed.

Description

Technical Field

[0001] The present invention relates to the technical field of sensors, and particularly relates to an MSG temperature and pressure integrated sensor and an assembly method thereof. Background Art

[0002] A sensor is an important component in industrial control systems and automotive intelligent control systems, which is used to collect the information to be measured and convert the information into an electrical signal or other signals for output. Traditional sensors can only measure one physical quantity. With the development of intelligent control systems, sensors with a single measurement function can no longer meet the needs. In actual use, multiple parameters often need to be measured at one position, especially temperature and pressure parameters are often required to be obtained simultaneously. At this time, if single-function temperature and pressure sensors are used for separate measurement, it is difficult to ensure the identity and accuracy of the measured parameters. At the same time, when using two single-function sensors, the installation space is large, and a separate signal processing system needs to be set up, resulting in an increase in usage costs.

[0003] Currently, the temperature and pressure integrated sensors on the market are mainly ceramic capacitive sensors. The ceramic capacitance technology consists of three parts: a ceramic base, a variable ceramic diaphragm, and a sealed cavity in the middle. The ceramic base is fixed and sintered and fixed together with the variable ceramic diaphragm by means of glass paste or the like. A printed circuit is arranged inside between the two to form a variable capacitor. When the variable ceramic diaphragm senses pressure and deforms, the distance between the variable ceramic diaphragm and the ceramic base changes accordingly, so the capacitance also changes accordingly. Then, the signal is converted by an adjustment chip and output to the subsequent stage for use. The current defects of ceramic capacitive sensors are as follows: A rubber sealing ring is used between the ceramic and the housing to ensure airtightness. However, under long-term pressure or high pressure, the sealing ring will deform, the airtightness of the product will deteriorate, and measurement errors are likely to occur. In addition, some measured media have strong corrosiveness, and the rubber sealing ring has poor corrosion resistance, resulting in a short service life of the sensor. Moreover, the sensitivity of the ceramic capacitance technology is low, and the pressure resistance is low. It is generally used in medium and low pressure environments of 0.5 - 5 MPa and cannot be applied to high pressure (5 - 0 MPa) environments.

[0004] Therefore, to solve the above problems, the temperature and pressure integrated sensor has become an inevitable development direction in the industry, and problems such as separate installation of traditional single-function sensors, large installation space required, the need to set up a separate signal processing system, and inaccurate measurement data need to be solved. Summary of the Invention

[0005] The purpose of the present invention is to provide an MSG temperature and pressure integrated sensor and an assembly method thereof, which have a compact structure, are easy to install, have high reliability, a wide applicable pressure range, and high measurement accuracy.

[0006] The present invention provides an MSG temperature and pressure integrated sensor, comprising: An upper housing, which is an open electrical connector. The electrical connector has a front end portion with built-in terminal blocks and a rear end portion installed in a lower housing. A signal transmission structure, which includes a lower housing, a temperature and pressure measurement component, and an external threaded connector. The temperature and pressure measurement component is arranged in the lower housing and fixedly connected to the external threaded connector. The temperature and pressure measurement component includes a pressure sensing element, an NTC temperature sensing element, a metal bracket, and a PCB conditioning circuit board. The metal bracket is arranged at the bottom end of the lower housing to form an installation chamber along the length direction of the lower housing. The PCB conditioning circuit board is electrically connected to the metal bracket and fixedly installed in the installation chamber to ensure that the PCB conditioning circuit board is grounded. The pressure sensing element is located at the lower end of the installation chamber, arranged at the bottom of the metal bracket, electrically connected to the PCB conditioning circuit board, and located on the external threaded connector. The NTC temperature sensing element is electrically connected to the PCB conditioning circuit board and passes through the PCB conditioning circuit board and the metal bracket and is inserted into the external threaded connector with an installation chamber, so that the PCB conditioning circuit board is coupled with the pressure sensing element and the NTC temperature sensing element to realize the simultaneous processing and conversion of the pressure signal and the temperature signal by the conditioning circuit, constituting an integrated sensor for temperature and pressure.

[0007] Preferably, the pressure sensing element includes an MSG pressure chip and a pressure chamber. The MSG pressure chip is formed on the upper surface of the pressure chamber by glass micro-melting sintering to form a standardized pressure sensor element. The pressure sensing element is bonded and bound to the PCB conditioning circuit board to form a Wheatstone bridge, which is used to obtain a voltage signal that changes with the deformation of the pressure chip under the action of the medium pressure according to the pressure chip. After being processed by the PCB conditioning circuit, the voltage signal is calibrated to a linear output proportional to the pressure received on the pressure chip.

[0008] Preferably, a contact spring is provided between the electrical connector and the PCB conditioning circuit board. The electrical connector is connected to the PCB conditioning circuit board through the contact spring for signal interaction with the PCB conditioning circuit board.

[0009] Preferably, a blind hole is provided at the top of the external threaded connector. The blind hole penetrates the bottom end of the external threaded connector and extends along the length direction of the external thread to form an installation chamber for inserting the NTC temperature sensing element into the installation chamber; and / or, a thermal conductive adhesive structure is provided at the bottom of the installation chamber to fill the gap in the installation chamber where the NTC temperature sensing element is installed to improve thermal conductivity.

[0010] Preferably, a medium through-hole is provided at the top of the external threaded connector. The medium through-hole forms a medium channel along the length direction of the external threaded connector, and the medium channel communicates with the pressure chamber.

[0011] Preferably, the lower housing, the pressure chamber and the external threaded connector are all made of stainless steel. The lower housing is in the form of a nut. The external threaded connector includes a front end portion connected to the external threaded connector and a rear end portion having a threaded connection with an external component. The lower housing is welded to the front end portion of the external threaded connector provided with the pressure chamber at the top to form an integral structure. Among them, the pressure chamber is a hollow stainless steel structure.

[0012] Preferably, a rubber seal is provided at the connection between the lower housing and the external threaded connector. The outer diameter of the rubber seal is larger than the outer diameters of the lower housing and the external threaded connector. The inner diameter of the rubber seal is smaller than the outer diameter of the lower housing. The inner diameter of the rubber seal is smaller than the inner diameter of the front end portion of the external threaded connector, and the inner diameter of the rubber seal is larger than the inner diameter of the rear end portion of the external threaded connector.

[0013] Preferably, a stainless steel seal circlip is provided at the bottom end of the external threaded connector to ensure the sealing performance when threadedly connected to an external measuring part.

[0014] Preferably, an O-ring seal is installed between the rear end portion of the electrical connector and the lower housing, and the seal is arranged above the PCB conditioning circuit board.

[0015] The present invention also provides an assembly method of the MSG temperature and pressure integrated sensor as described in the embodiments of the present invention, including the following steps: Laser weld the pressure sensing element, the external threaded connector and the lower housing into an integral structure; After fixedly installing the metal bracket at the bottom of the lower housing, install the PCB conditioning circuit board on the metal bracket so that the PCB conditioning circuit board is grounded and protects the circuits on the PCB conditioning circuit board; Establish an electrical connection between the electrical connector and the PCB conditioning circuit board through a contact spring, so that the external measuring part connected to the electrical connector can interact with the PCB conditioning circuit board in terms of signals; Flanging and closing the opening between the lower housing and the electrical connector; Install a seal circlip at the bottom of the external threaded connector to ensure the sealing performance when threadedly connected to an external measuring part; The NTC temperature sensing element is soldered to the PCB conditioning circuit board and installed in the installation cavity of the external threaded connector. At the same time, thermal conductive adhesive is injected at the bottom of the installation cavity to fill the gap in the installation cavity where the NTC temperature sensing element is installed, improving thermal conductivity.

[0016] Due to the adoption of the above technical solutions, the present invention has the following advantages and positive effects compared with the prior art: 1. Through the coupling of the PCB conditioning circuit board with the pressure sensor unit and the temperature sensor unit, the present invention realizes the simultaneous processing and conversion of the pressure signal and the temperature signal by the conditioning circuit, obtaining an integrated temperature and pressure sensor. The structure is reasonable and compact, facilitating installation in the test environment and having a wider application range; the electrical connectors are standardized, eliminating the need for lead wires, making it easy to achieve automated production, with high production efficiency, and solving the problems of traditional single-function sensors that require lead wires, are difficult to perform automated wire arrangement operations, have low production efficiency, and are prone to damaging the wires. 2. High precision and high reliability: By adopting the MSG pressure chip and the NTC temperature sensing element and combining with a precise signal conditioning circuit, the present invention ensures that the sensor can still maintain high precision and high reliability under high-pressure environments. This design enables the sensor to operate stably in various harsh industrial environments and provide accurate measurement data.

[0017] 3. Integrated design: The present invention integrates the two measurement functions of pressure and temperature in one sensor, not only saving space but also simplifying the installation process. This integrated design improves work efficiency, reduces system complexity and maintenance costs.

[0018] 4. Good sealing performance: By using sealing measures such as rubber seals and stainless steel sealing circlips, the present invention effectively prevents medium leakage and ensures good sealing performance of the sensor under high-pressure environments. This is crucial for ensuring the long-term stable operation of the sensor.

[0019] 5. Easy to install and maintain: The sensor of the present invention has a simple and compact design, facilitating quick installation. At the same time, due to its robust and durable design, almost no maintenance is required, greatly reducing operating costs. Description of the Drawings

[0020] Figure 1-2 It is a schematic structural diagram of an MSG integrated temperature and pressure sensor in an embodiment of the present invention; Figure 3 It is an assembled structural diagram of an MSG integrated temperature and pressure sensor in an embodiment of the present invention; Figure 4-5 It is a cross-sectional view of the MSG integrated temperature and pressure sensor in an embodiment of the present invention with the rubber seal removed; Figure 6Schematic diagram of the pressure sensing element in the embodiment of the present invention; Figure 7-8 Schematic assembly diagram of the integral structure formed by the external threaded connector and the lower housing in the embodiment of the present invention; Wherein, 1 - external threaded connector; 20 - MSG pressure sensing element; 21 - pressure chamber; 22 - MSG pressure chip; 3 - lower housing; 4 - metal bracket; 51 - PCB conditioning circuit board; 52 - NTC temperature sensing element; 6 - contact spring; 70 - electrical connector; 8 - rubber seal; 9 - sealing snap ring; 11 - installation cavity; 12 - medium through hole; 13 - blind hole. Specific embodiments

[0021] The following specific examples illustrate the embodiments of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments. Various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention. It should be understood that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be understood as a limitation to the present invention. In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first", "second", etc. may explicitly or implicitly include one or more of such features. In the description of the present invention, unless otherwise specified, the meaning of "plurality" is two or more.

[0022] It should be noted that, unless otherwise clearly specified and limited, the terms "install", "connect", and "couple" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood through specific situations.

[0023] As Figure 1-8 shown, the embodiment of the present invention provides an MSG temperature and pressure integrated sensor, which is applicable to an environment with high pressure such as 5 - 200 MPa, and includes: Upper housing, the upper housing is an electrical connector 70 with an opening, the electrical connector 70 has a front end portion with built-in terminal blocks and a rear end portion installed in the lower housing 3; Signal transmission structure, the signal transmission structure includes a lower housing 3, a temperature and pressure measurement component, and an external threaded connector 1, the temperature and pressure measurement component is arranged in the lower housing 3 and fixedly connected to the external threaded connector, The temperature and pressure measurement component includes a pressure sensing element 20, an NTC temperature sensing element 52, a metal bracket 4, and a PCB conditioning circuit board 51. The metal bracket 4 is arranged at the bottom end of the lower housing 3 to form an installation chamber along the length direction of the lower housing 3. The PCB conditioning circuit board 51 is electrically connected to the metal bracket 4 and fixedly installed in the installation chamber to ensure that the PCB conditioning circuit board 51 is grounded; The pressure sensing element 20 is located at the lower end of the installation chamber, is disposed at the bottom of the metal bracket 4, is electrically connected to the PCB conditioning circuit board 51, and is located on the external threaded connector 1; the NTC temperature sensing element 52 is electrically connected to the PCB conditioning circuit board 51, and passes through the PCB conditioning circuit board 51 and the metal bracket 4 and is inserted into the external threaded connector 1 having an installation chamber, so that the PCB conditioning circuit board 51 is coupled with the pressure sensing element 20 and the NTC temperature sensing element 52 to realize the simultaneous processing and conversion of the pressure signal and the temperature signal by the conditioning circuit, and an integrated sensor for temperature and pressure is formed. Among them, the metal bracket 4 is installed at the bottom of the lower housing 3 and fixed with glue. The PCB conditioning circuit board 51 is installed and fixed on the metal bracket 4 and is located above the pressure sensor element and at the designed required position. At the same time, the PCB conditioning circuit board 51 is electrically connected to the metal bracket 4. Among them, the MSG pressure sensing element 20 is laser welded to the external threaded connector 1, or can be connected in a manner of pressing into the coupling thread. The external threaded connector 1 and the lower housing 3 are processed separately and then formed by laser welding, or can be directly processed into one body. In this way, the MSG temperature and pressure integrated sensor integrates the temperature measurement and pressure measurement functions, greatly simplifies the system structure, and saves the installation space and wiring cost. The principle is as follows: in a high-pressure environment, after the pressure sensing element 20 senses the pressure change, it converts it into an electrical signal change, and this change is transmitted to the PCB conditioning circuit board 51 through the metal bracket 4. After receiving the pressure signal, the PCB conditioning circuit board 51 performs coupling processing with the temperature signal transmitted by the NTC temperature sensing element 52. The NTC temperature sensing element 52 is arranged closely to the pressure sensing element to ensure the synchronism and identity of the measured parameters of the two. In a high-pressure environment, the internal pressure and temperature signals of the sensor are transmitted to external devices through wires for display and analysis. Since the sensor adopts an integrated design, the interference and loss in the signal transmission process are reduced, so that accurate measurement of temperature and pressure can be realized. In addition, a sealing structure is provided inside the sensor to prevent the pressure and temperature signals from being interfered by the outside world. At the same time, high-temperature resistant and corrosion-resistant materials are used to make the sensor housing and internal components to ensure long-term stable operation in a high-pressure environment.

[0024] See Figure 6As shown, the pressure sensing element 20 includes an MSG pressure chip 22 and a pressure chamber 21. The MSG pressure chip 22 is formed into a standardized pressure sensor element on the upper surface of the pressure chamber 21 through glass micro-melting and sintering. When an external pressure acts on it, a slight deformation will occur. The above combination method ensures a tight connection between the pressure chip and the pressure chamber 21, enabling the external pressure to be accurately transmitted to the pressure chip. This deformation will cause changes in the electrical properties (such as resistance) inside the chip. The pressure sensing element 20 is bonded to the PCB conditioning circuit board 51 to form a Wheatstone bridge, which is used to obtain the voltage signal that changes with the deformation of the pressure chip under the action of the medium pressure. After being processed by the PCB conditioning circuit, the voltage signal is calibrated to a linear output proportional to the pressure on the pressure chip. The output signal is generally an analog signal or can also be a LIN communication signal. Among them, the pressure elastic body formed by the pressure chamber 21 itself can be stepped or non-stepped.

[0025] The MSG pressure sensing element 20 adopted in this embodiment: The MEMS pressure chip is formed into a unified and standardized pressure sensing element 20 on the outer surface of the top of the pressure chamber 21 through glass micro-melting and sintering, as shown in Figure 1-3As shown, it is convenient for mass production and reduces product costs. It forms different sensor structures with other parts through welding, assembly and other methods to meet the needs of different users. Its pressure chamber 21 is made of corrosion-resistant stainless steel and other materials, isolating the pressure chip from the working medium, improving the corrosion resistance of the product, and having higher durability and reliability. Further, by changing the thickness of the top of the pressure chamber 21, the top of the pressure chamber is usually composed of a thin layer of material, which can be metal, silicon or other materials suitable for pressure detection. In a pressure sensor, this top structure may be directly exposed to the measured pressure, or it may be a sealed diaphragm that transmits the pressure to the detection element below, so as to meet the measurement requirements of different pressures, and its measurement range can reach 5 - 200 MPa. The pressure sensing element 20 adopted in this embodiment can also use the metal sputtering thin film technology to make thin film resistors on the stainless steel pressure chamber 21 and form a Wheatstone bridge with the PCB conditioning circuit. The NTC temperature sensing element 52 in the MSG temperature and pressure integrated sensor is very sensitive to temperature changes. When the ambient temperature changes, the resistance value of the NTC temperature sensing element 52 will change accordingly. This change in resistance value is captured by the PCB conditioning circuit board 51 and converted into a corresponding electrical signal, which can be expressed as a specific temperature value after being processed. The pressure sensing element 20 is located at the lower end of the installation chamber and is electrically connected to the PCB conditioning circuit board 51. When an external pressure acts on the sensor, the pressure sensing element 20 will deform, and this deformation causes changes in the electrical properties (such as resistance, capacitance, etc.) inside the pressure sensing element 20, thereby generating an electrical signal related to the magnitude of the pressure. The PCB conditioning circuit board 51 receives and processes this electrical signal and finally converts it into a specific pressure value. Due to the high sensitivity of the MSG pressure chip 22 and the high-precision conversion ability of the Wheatstone bridge, the MSG temperature and pressure integrated sensor can achieve high-precision measurement of external pressure; the glass micro-melting and sintering technology and the bonding and binding technology ensure the firm connection and stable transmission between the pressure sensing element 20 and the PCB conditioning circuit board 51, which enables the sensor to maintain stable performance output during long-term operation; the filter and amplifier in the PCB conditioning circuit board 51 can effectively remove noise interference and amplify weak signals, thereby improving the anti-interference ability and measurement accuracy of the sensor; the output signal can be converted and transmitted as needed, such as converted into a LIN communication signal, etc. This enables the sensor to flexibly adapt to different application scenarios and requirements.

[0026] In one embodiment, the lower housing 3, the pressure chamber 21, and the external threaded connector 1 are all made of stainless steel. The lower housing 3 is in the form of a nut. The external threaded connector 1 includes a front end portion connected to the external threaded connector 1 and a rear end portion having a threaded connection with an external component. The lower housing 3 is welded to the front end portion of the external threaded connector 1 where the pressure chamber 21 is provided at the top, forming an integral structure. Among them, the pressure chamber 21 is a hollow stainless steel structure. It can be understood that the pressure chamber 21, the lower housing 3, and the external threaded connector 1 are processed separately, and their materials are all made of stainless steel, and then laser welded into a single component. Refer to Figure 4-5 As shown, the use of stainless steel material can significantly improve the corrosion resistance of the sensor, enabling it to operate stably for a long time in a humid and highly corrosive environment; the lower housing 3 is designed as a nut structure and fixed to the external threaded connector 1 by welding, forming an integral structure, enhancing the structural strength of the sensor, enabling it to withstand greater pressure and vibration shocks; the design of the external threaded connector 1 allows the sensor to be conveniently thread-connected to other components, and also facilitates disassembly and maintenance, reducing the cost and time of installation and maintenance; the design of the pressure chamber 21 ensures that the MSG pressure chip 22 can accurately sense the change in external pressure and convert it into an electrical signal for output. This improves the measurement accuracy and stability of the sensor.

[0027] In one embodiment, a blind hole 13 is provided at the top of the external threaded connector 1. The blind hole 13 penetrates the bottom end of the external threaded connector 1 and extends along the length direction of the external thread to form an installation cavity for inserting the NTC temperature sensing element 52 into the installation cavity; a heat-conducting adhesive structure is provided at the bottom of the installation cavity to fill the gap in the installation cavity where the NTC temperature sensing element 52 is installed to improve heat conductivity.

[0028] In one embodiment, a medium through-hole 12 is provided at the top of the external threaded connector 1. The medium through-hole 12 forms a medium channel along the length direction of the external threaded connector 1, and the medium channel is communicated with the pressure chamber 21. It can be understood that the external threaded connector 1 is provided with a medium through-hole 12, which is communicated with the pressure chamber 21; an installation cavity for an NTC temperature sensing element. A slender long tube protrudes from the bottom of the external threaded connector 1, and the middle is processed into a blind hole 13. The NTC temperature sensing element 52 is inserted, and heat-conducting adhesive is injected at the bottom. The above through-hole and blind hole 13 ensure the isolation of the pressure chip and the NTC temperature sensing element 52 from the medium.

[0029] It can be understood that the embodiment of the present invention provides an MSG temperature-pressure integrated sensor, which includes an electrical connector 70, a contact spring 6, an NTC temperature sensing element 52, a PCB conditioning circuit board 51, a metal bracket 4, a pressure sensor element, a lower housing 3, an external thread connector 1, and a sealing snap ring 9 connected in sequence. The pressure sensing element 20 is formed by glass micro-melting and sintering an MEMS pressure chip on the outer surface of the top of the pressure chamber 21, and then laser welding it to the external thread connector 1; the external thread connector 1 is laser welded to the lower housing 3; the pressure sensor element is bonded to the PCB conditioning circuit; the electrical connector 70 is connected to the PCB conditioning circuit by the contact spring 6; the PCB conditioning circuit board 51 is connected with an NTC temperature sensor element, and the NTC temperature sensing element 52 is inserted into the installation cavity of the external thread connector 1. After the lower housing 3 and the electrical connector 70 are assembled, the flanging of the lower housing 3 is closed to fix the electrical connector 70. The coupling of the PCB conditioning circuit board 51 with the pressure sensor unit and the temperature sensor unit realizes the simultaneous processing and conversion of the pressure signal and the temperature signal by the conditioning circuit, obtaining a temperature and pressure integrated sensor with a reasonable and compact structure, which is convenient to be installed in the test environment and has a wider application range. The electrical connector 70 is standardized, does not require lead-out wires, is easy to realize automated production, has high production efficiency, and solves the problems of traditional single-function sensors that require lead-out wires, are difficult to perform automated wire arrangement operations, have low production efficiency, and are prone to damage to the wires.

[0030] In one embodiment, a contact spring 6 is provided between the electrical connector 70 and the PCB conditioning circuit board 51, and the electrical connector 70 is connected to the PCB conditioning circuit board 51 through the contact spring 6 for signal interaction with the PCB conditioning circuit board 51. This MSG temperature and pressure integrated sensor utilizes the close cooperation among the electrical connector 70, the contact spring 6, and the PCB conditioning circuit board 51 to achieve accurate perception and measurement of the ambient temperature. The NTC temperature sensing element 52, as the core component for temperature sensing, has its resistance value change converted into an electrical signal, and through steps such as signal conditioning, analog-to-digital conversion, and temperature calculation, an accurate temperature measurement result is finally obtained.

[0031] In one embodiment, see Figure 7-8As shown, a rubber seal 8 is provided at the connection between the lower housing 3 and the external threaded connector 1. The outer diameter of the rubber seal 8 is larger than the outer diameters of the lower housing 3 and the external threaded connector 1. The inner diameter of the rubber seal 8 is smaller than the outer diameter of the lower housing 3 and smaller than the inner diameter of the front end portion of the external threaded connector 1, and the inner diameter of the rubber seal 8 is larger than the inner diameter of the rear end portion of the external threaded connector 1. The design of the rubber seal 8 ensures the tightness of the connection and effectively prevents the infiltration of external media (such as gases and liquids). Its outer diameter is larger than those of the lower housing 3 and the external threaded connector 1, and the inner diameter is smaller than the outer diameter of the lower housing 3. Such a size design enables the rubber seal 8 to form an effective sealing barrier at the connection. The rubber seal 8 is usually made of corrosion-resistant materials and can resist the erosion of various chemical media. In an environment containing corrosive substances, the rubber seal 8 can protect the connection from corrosion, thereby extending the service life of the sensor. The rubber seal 8 not only functions as a seal but also enhances the structural stability of the connection to a certain extent. Its elasticity and plasticity can absorb and buffer external impacts and vibrations, protecting the internal components of the sensor from damage. The design of the rubber seal 8 makes the installation and maintenance of the sensor more convenient. During installation, the rubber seal 8 can provide additional friction to help fix the connection. During maintenance, if the sensor needs to be disassembled, the elasticity of the rubber seal 8 also facilitates disassembly and reinstallation.

[0032] In one embodiment, a stainless steel sealing circlip 9 is provided at the bottom end of the external threaded connector 1 to ensure the sealing performance when threadedly connected to an external measuring part.

[0033] In one embodiment, an O-ring seal is installed between the rear end portion of the electrical connector 70 and the lower housing 3, and the seal is disposed above the PCB conditioning circuit board 51. It can be understood that the electrical connector 70 includes electrical connection terminals, is installed in the lower housing 3, an O-ring seal is installed between it and the lower housing 3, and it is located above the PCB conditioning circuit board 51. It is electrically connected to the signal transmission end of the PCB conditioning circuit board 51 by a contact spring 6 for signal interaction with the PCB conditioning circuit board 51.

[0034] Based on the same inventive concept, an embodiment of the present invention further provides an assembly method for the above MSG temperature and pressure integrated sensor. The temperature-pressure sensor includes a lower housing 3 made of stainless steel metal, an external threaded connector 1, a pressure chamber 21, a metal bracket 4, a PCB conditioning circuit board 51, an NTC temperature sensing element 52, an electrical connector 70, and a sealing circlip 9. The external threaded connector 1 is provided with a communicating medium channel and an installation cavity for the NTC temperature sensing element 52. The installation cavity is actually a slender long tube protruding from the bottom of the external threaded connector 1, and the middle is processed into a blind hole 13. Thermal conductive adhesive is injected into the bottom of the installation cavity. The MSG pressure sensing element 20: Two MEMS pressure chips are sintered on the outer surface of the top of the pressure chamber 21 through glass micro-melting.

[0035] Specifically, it includes the following steps: Weld the pressure sensing element 20, the external threaded connector 1, and the lower housing 3 into an integrated structure by laser welding; After fixedly installing the metal bracket 4 at the bottom of the lower housing 3, install the PCB conditioning circuit board 51 on the metal bracket 4, so that the PCB conditioning circuit board 51 is grounded and plays a protective role for the circuits on the PCB conditioning circuit board 51; Establish an electrical connection between the electrical connector 70 and the PCB conditioning circuit board 51 through a contact spring, so that the external measurement parts connected to the electrical connector 70 can interact with the PCB conditioning circuit board 51 in terms of signals; Flange and close the opening between the lower housing 3 and the electrical connector 70, and fix the electrical connector 70 and the lower housing 3 by flanging and closing the opening; Install a sealing circlip 9 at the bottom of the external threaded connector 1 to ensure the sealing performance when threadedly connecting with external measurement parts; Solder the NTC temperature sensing element 52 to the PCB conditioning circuit board and install it into the installation cavity of the external threaded connector 1. At the same time, inject thermal conductive adhesive into the bottom of the installation cavity to fill the gap in the installation cavity where the NTC temperature sensing element 52 is installed to improve the thermal conductivity.

[0036] The above has described the embodiments of the present invention in detail with reference to the drawings, but the present invention is not limited to the above embodiments. Even if various changes are made to the present invention, provided that these changes fall within the scope of the claims of the present invention and their equivalent technologies, they still fall within the protection scope of the present invention.

Claims

1. A MSG temperature and pressure integrated sensor, characterized in that: include: An upper housing, the upper housing being an electrical connector having an opening, the electrical connector having a front end portion with a built-in wiring terminal and a rear end portion installed in the lower housing; The signal transmission structure comprises a lower shell, a temperature and pressure measurement component and an external threaded connector, wherein the temperature and pressure measurement component is arranged in the lower shell and fixedly connected to the external threaded connector. The temperature and pressure measurement assembly includes a pressure sensor element, an NTC temperature sensor element, a metal bracket and a PCB conditioning circuit board. The metal bracket is arranged at the bottom end of the lower shell to form an installation chamber along the length direction of the lower shell. The PCB conditioning circuit board and the metal bracket are electrically connected and fixedly installed in the installation chamber to ensure that the PCB conditioning circuit board is grounded. The pressure sensing element is located at the lower end of the installation chamber, is arranged at the bottom of the metal bracket, is electrically connected to the PCB conditioning circuit board, and is located on the external threaded connector; the NTC temperature sensing element is electrically connected to the PCB conditioning circuit board, and is inserted into the external threaded connector with the installation cavity through the PCB conditioning circuit board and the metal bracket, so that the PCB conditioning circuit board is coupled with the pressure sensing element and the NTC temperature sensing element to realize the simultaneous processing and conversion of the pressure signal and the temperature signal by the conditioning circuit, thereby forming an integrated sensor of temperature and pressure.

2. The MSG temperature and pressure integrated sensor according to claim 1, characterized in that: The pressure sensing element includes an MSG pressure chip and a pressure cavity. The MSG pressure chip is sintered by glass micro-melting to form a standardized pressure sensor element on the upper surface of the pressure cavity; the pressure sensing element is bonded to a PCB conditioning circuit board by bonding to form a Wheatstone bridge, which is used to obtain a voltage signal according to the pressure chip under the action of the medium pressure, and the voltage signal changes with the deformation of the pressure chip. After being processed by the PCB conditioning circuit, the voltage signal is calibrated to a linear output proportional to the pressure on the pressure chip.

3. The MSG temperature and pressure integrated sensor according to claim 1, characterized in that: An electric shock spring is provided between the electrical connector and the PCB conditioning circuit board. The electrical connector is connected to the PCB conditioning circuit board via the electric shock spring and is used for signal interaction with the PCB conditioning circuit board.

4. The MSG temperature and pressure integrated sensor according to claim 1, characterized in that: A blind hole is provided at the top of the external threaded connector, the blind hole passes through the bottom end of the external threaded connector and extends along the length direction of the external thread to form an installation cavity, which is used to insert the NTC temperature sensor element into the installation cavity; And / or, a thermally conductive adhesive structure is provided at the bottom of the installation cavity to fill the gap in the installation cavity where the NTC temperature sensor element is installed to improve thermal conductivity.

5. The MSG temperature and pressure integrated sensor according to claim 2, characterized in that: A medium through hole is provided at the top of the external threaded connector. The medium through hole forms a medium channel along the length direction of the external threaded connector. The medium channel is communicated with the pressure chamber.

6. The MSG temperature and pressure integrated sensor according to claim 2, characterized in that: The lower shell, pressure chamber and external threaded connection are all stainless steel structures. The lower shell is a nut structure. The external threaded connection includes a front end portion connected to the external threaded connection and a rear end portion having a threaded connection to an external component. The lower shell is welded to the front end portion of the external threaded connection with the pressure chamber provided on the top to form an integrated structure, wherein the pressure chamber is a hollow stainless steel structure.

7. The MSG temperature and pressure integrated sensor according to claim 6, characterized in that: A rubber seal is provided at the connection between the lower shell and the external threaded connector, and the outer diameter of the rubber seal is larger than the outer diameter of the lower shell and the outer diameter of the external threaded connector, the inner diameter of the rubber seal is smaller than the outer diameter of the lower shell, the inner diameter of the rubber seal is smaller than the inner diameter of the front end portion of the external threaded connector, and the inner diameter of the rubber seal is larger than the inner diameter of the rear end portion of the external threaded connector.

8. The MSG temperature and pressure integrated sensor according to claim 1, characterized in that: A stainless steel sealing spring is arranged at the bottom end of the external threaded connection piece to ensure the sealing performance with the external measuring part when the threaded connection piece is connected.

9. The MSG temperature and pressure integrated sensor according to claim 1, characterized in that: An O-shaped sealing ring is installed between the rear end portion of the electrical connector and the lower shell, and the sealing ring is arranged above the PCB conditioning circuit board.

10. An assembly method of the MSG temperature-pressure integrated sensor according to any one of claims 1 to 9, characterized in that: The steps include: The pressure sensing element, the external threaded connector and the lower housing are welded into an integrated structure by laser welding; After the metal bracket is fixedly mounted on the bottom of the lower housing, the PCB conditioning circuit board is mounted on the metal bracket, so that the PCB conditioning circuit board is grounded and protects the circuit on the PCB conditioning circuit board; An electrical connection is established between the electrical connector and the PCB conditioning circuit board through an electric contact spring, so that an external measuring part connected to the electrical connector can perform signal interaction with the PCB conditioning circuit board; Performing flanging and closing forming between the lower housing and the electrical connector; Install a sealing circlip at the bottom of the external threaded connector to ensure the sealing performance when threadedly connected with the external measuring part; The NTC temperature sensing element is soldered to the PCB conditioning circuit board and installed in the installation cavity of the external threaded connector. At the same time, thermal conductive glue is injected into the bottom of the installation cavity to fill the gap in the installation cavity where the NTC temperature sensing element is installed to improve thermal conductivity.

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