A semiconductor wafer inspection device

Abstract

The present invention discloses a semiconductor wafer detection device, which relates to the technical field of semiconductor wafer detection. It includes a wafer defect detection lamp group with adjustable height. A cabinet is fixed on the support plate of the wafer defect detection lamp group. A linear drive module is rotatably arranged in the cabinet. The linear drive module includes a slidable slider; a corner adjuster is rotatably connected to the slider. A forward adjustment component is fixed on the corner adjuster. A wafer chucking disc for chucking a wafer is fixed on the corner adjuster. A reciprocating swing drive component is slidably connected to the linear drive module; the linear drive module rotates to switch the sliding direction of the slider, and the following rotating wafer chucking disc switches to maintain a forward state through the forward adjustment component; the wafer is chucked by the wafer chucking disc, eliminating the need for the tester to hold the wafer for a long time, and the viewing angle of the wafer is more stable. During the forward and backward, left and right movement of the wafer, the scratches on the surface of the wafer are observed through the light reflection on the surface of the wafer.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor wafer detection, and particularly relates to a semiconductor wafer detection device. Background Art

[0002] Semiconductor wafers are one of the important basic materials for semiconductor device manufacturing. During production, in order to ensure the production quality of semiconductor wafers, a defect detection device is required to conduct spot checks on the defects of its production batches.

[0003] Currently, when using the wafer defect detection lamp SL8900 for spot checks, the wafer defect detection lamp SL8900 adopts a desktop design and mainly consists of 4 parts: a lamp head, a bracket, a cabinet, and a dimmer. Through the combination of an optical lens module, the illuminance at 30 cm can reach 400,000 lux, and it can detect defects as small as 1 um on the surface. It is mainly used for detecting surface defects of wafers, especially suitable for detecting defects of dust and foreign objects on the wafer surface.

[0004] When using the wafer defect detection lamp SL8900 to conduct spot checks on wafer pieces, the detection personnel need to hold the wafer piece by hand, and then continuously change the angle between the wafer piece and the cabinet through the arm to find the best viewing angle. After the best viewing angle is determined and the arm maintains this angle, the wafer piece is moved back and forth and left and right through the arm, and finally, the micro-scratches on the surface of the wafer piece are detected by the light reflection of the lamp head.

[0005] However, this detection method requires the arm to maintain the best viewing angle and move back and forth and left and right. The arm is in a tense state for a long time, causing soreness in the arm, and when the arm shakes, it will cause the problem of unstable viewing angle of the wafer piece. Summary of the Invention

[0006] The purpose of the present invention is to: in order to solve the problem that when traditional semiconductor wafer pieces are detected under a defect detection lamp, the arm needs to maintain the best viewing angle and move back and forth and left and right, the arm is in a tense state for a long time, causing soreness in the arm, and when the arm shakes, it will lead to the problem of unstable viewing angle of the wafer piece, and a semiconductor wafer detection device is proposed.

[0007] In order to achieve the above purpose, the present invention adopts the following technical solution: a semiconductor wafer detection device, including a wafer defect detection lamp group with adjustable height. A cabinet is fixed on the support plate of the wafer defect detection lamp group. A linear drive module is rotatably arranged in the cabinet. The linear drive module includes a slidable slider;

[0008] A angle adjuster is rotatably connected to the slider. A forward adjustment component is fixed on the angle adjuster. A wafer piece clamping disk for clamping the wafer piece is fixed on the angle adjuster. A reciprocating swing drive component is slidably connected to the linear drive module;

[0009] The linear drive module switches the sliding direction of the slider through rotation, and the wafer clamping disc that follows the rotation switches to maintain a positive state through the positive adjustment component;

[0010] The reciprocating swing drive component slides to the lower end of the angle adjusting rod of the angle adjuster. During the sliding, the angle adjusting rod drives the wafer clamping disc to reciprocate through the reciprocating swing drive component;

[0011] The reciprocating swing drive component slides away from the angle adjusting rod, and the wafer clamping disc slides at a fixed angle.

[0012] As a further description of a semiconductor wafer detection device of the above technology: The positive adjustment component includes a gear;

[0013] The linear drive module further includes a first guide rail adapted to the slider. A ball screw is rotatably provided on the first guide rail. The gear is rotatably connected to the second shaft hole of the slider through a drive shaft, and the angle adjuster is fixed to the upper end of the drive shaft;

[0014] The cabinet includes a housing fixed on the upper surface of the support plate. The first guide rail is fixed on the support circular plate, and the support circular plate is rotatably connected to the first shaft hole of the housing. An incomplete internal gear ring coaxial with the first shaft hole is fixed on the housing;

[0015] After rotation, the gear is magnetically fixed to the slider.

[0016] As a further description of a semiconductor wafer detection device of the above technology: On one side of the gear close to the slider, a second magnet and a third magnet are symmetrically fixed. The second magnet and the third magnet are spaced apart, and first magnets are symmetrically fixed on the slider.

[0017] As a further description of a semiconductor wafer detection device of the above technology: The support circular plate is fixed with a sealing circular plate through multiple support columns, and a ring plate coaxial with the first shaft hole is fixed above the housing;

[0018] A strip-shaped hole is opened on the sealing circular plate, and the drive shaft slides along the strip-shaped hole.

[0019] As a further description of a semiconductor wafer detection device of the above technology: An aperture corresponding ring groove is opened on the outer surface of the sealing circular plate, and the aperture corresponding ring groove is coaxial with the sealing circular plate.

[0020] As a further description of a semiconductor wafer detection device of the above technology: The angle adjuster includes an angle measuring seat. The angle measuring seat is inserted with a long screw rod with a butterfly nut. A plurality of fan-shaped grooves are opened on the angle measuring seat, and a corner plate is installed in each fan-shaped groove. The long screw rod passes through the installation hole opened on the corner plate;

[0021] Protractors coaxial with the long screw rod are fixed at both ends of the protractor seat, and an indicating groove pointing to the protractor is formed on the angle plate.

[0022] As a further description of a semiconductor wafer detection device of the above technology: The wafer clamping disk includes a support disk fixed on the angle plate. A wafer placement groove is formed on one side of the support disk. A plurality of screws are threadedly connected to the outer edge of the support disk, and a pressing needle is inserted on each screw.

[0023] The support disk is provided with finger holes.

[0024] As a further description of a semiconductor wafer detection device of the above technology: The reciprocating swing drive assembly includes a guide rod. A plurality of grooves are formed on the upper surface of the guide rod, and a plurality of chutes are formed at the bottom of the guide rod. A second guide rail is slidably arranged in the chute, and the second guide rail is fixed on the linear drive module.

[0025] As a further description of a semiconductor wafer detection device of the above technology: Limit plates are fixed at both ends of the second guide rail. A plurality of male magnetic buttons are fixed on the side of the limit plate close to the guide rod, and a plurality of female magnetic buttons are fixed on the side of the guide rod close to the male magnetic buttons.

[0026] As a further description of a semiconductor wafer detection device of the above technology: A bracket is fixed on the upper surface of the support plate. A support arm with a locking screw rod is slidably arranged on the bracket, and a lamp holder is fixed on the support arm. An operation hole is formed on one side of the bottom of the outer shell, and an operation rod is fixed on the side wall of the support circular plate.

[0027] In summary, due to adopting the above technology of a semiconductor wafer detection device, the beneficial effects of the present invention are as follows:

[0028] 1. The best viewing angle of the wafer is fixed by the angle adjuster, and the wafer is clamped by the wafer clamping disk, so that it is not necessary for the detector to hold the wafer for a long time, and the viewing angle of the wafer is more stable. The rotation of the linear drive module is used to switch the forward and backward, left and right moving states of the slider. During the switching process, the wafer clamping disk is switched by the forward adjustment component, so that when the wafer is in the forward and backward moving state and the left and right moving state, the detection surface of the wafer always faces the detector. During the forward and backward, left and right movement of the wafer, the scratches on the surface of the wafer are observed through the light reflection on the surface of the wafer.

[0029] 2. By sliding the reciprocating swing drive assembly towards and closer to the slider, during the forward and backward movement of the slider, the wafer chucking disc is driven by the reciprocating swing drive assembly to perform a reciprocating swing angle adjustment action within a certain angle range. Therefore, when the slider is in the forward and backward movement state, the reciprocating deflection angle of the wafer changes with the change of the wafer position, thereby changing the light reflection on the wafer surface. Therefore, when the wafer is moving in the forward and backward direction, through the reciprocating swing of the wafer, the inspector can more easily find scratches by observing the light reflection on the surface of the reciprocating swing wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 Shows a schematic structural diagram of the wafer chucking disc in the forward and backward movement state according to an embodiment of the present invention;

[0031] Figure 2 Shows a schematic structural diagram of the cabinet, linear drive module, support disc, and reciprocating swing drive assembly according to an embodiment of the present invention;

[0032] Figure 3 Shows according to an embodiment of the present invention Figure 2 The enlarged structural diagram at A in;

[0033] Figure 4 Shows a partial structural diagram of the guide rod according to an embodiment of the present invention;

[0034] Figure 5 Shows according to an embodiment of the present invention Figure 2 The sectional structural diagram of the cabinet, support circular plate, and sealing circular plate in;

[0035] Figure 6 Shows a schematic structural diagram of the gear and angle measuring seat according to an embodiment of the present invention;

[0036] Figure 7 Shows a schematic structural diagram of the wafer chucking disc according to an embodiment of the present invention;

[0037] Figure 8 Shows according to an embodiment of the present invention Figure 6 The right view structural diagram;

[0038] Figure 9 Shows a schematic structural diagram of the slider according to an embodiment of the present invention;

[0039] Figure 10 Shows a schematic structural diagram of the linear drive module according to an embodiment of the present invention;

[0040] Figure 11 Shows a schematic structural diagram of the cabinet and the incomplete internal gear according to an embodiment of the present invention;

[0041] Figure 12 shows a schematic cross-sectional structure diagram of a cabinet and an incomplete internal gear according to an embodiment of the present invention;

[0042] Figure 13 shows a schematic structural diagram of the left and right traveling states of a wafer chucking disk according to an embodiment of the present invention.

[0043] Legend description:

[0044] 10. Wafer defect detection lamp group; 11. Support plate; 12. Bracket; 13. Support arm; 131. Locking screw; 14. Lamp head;

[0045] 20. Cabinet; 21. Ring plate; 211. Operation hole; 22. Outer shell; 221. First shaft hole;

[0046] 30. Linear drive module; 31. Slide block; 311. Second shaft hole; 312. First magnet; 32. Servo motor; 33. First guide rail; 34. Ball screw; 35. Support circular plate; 351. Operating rod; 352. Support column; 36. Sealing circular plate; 361. Strip hole; 362. Aperture corresponding ring groove; 37. Gear; 371. Drive shaft; 372. Second magnet; 373. Third magnet; 38. Incomplete internal gear ring; 381. Tooth; 382. Support rod;

[0047] 40. Angle adjuster; 41. Angle measuring seat; 411. Protractor; 412. Sector groove; 42. Long screw; 43. Butterfly nut; 44. Angle plate; 441. Mounting hole; 442. Indication groove; 45. Angle adjusting rod; 451. Roller;

[0048] 50. Wafer chucking disk; 51. Support disk; 511. Wafer placement groove; 512. Finger hole; 52. Screw; 53. Pressing pin;

[0049] 60. Reciprocating swing drive assembly; 61. Guide rod; 611. Chute; 62. Second guide rail; 63. Limit plate; 64. Male magnetic buckle; 65. Female magnetic buckle. Detailed implementation manners

[0050] Next, the technical solution of a semiconductor wafer detection device in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0051] As Figure 1 - Figure 13As shown in the figure, the present invention provides a semiconductor wafer detection device, which includes a wafer defect detection lamp group 10 with adjustable height. By adjusting the height of the wafer defect detection lamp group 10, the radiation aperture irradiated on the cabinet 20 can be adjusted. The cabinet 20 is fixed on the support plate 11 of the wafer defect detection lamp group 10. A linear drive module 30 is rotatably arranged in the cabinet 20. The linear drive module 30 includes a slidable slider 31. By rotating the linear drive module 30, the rotation of the slider 31 is driven, and then the sliding direction of the slider 31 is switched.

[0052] A angle adjuster 40 is rotatably connected to the slider 31. A positive adjustment component is fixed on the angle adjuster 40. A wafer clamping disk 50 for clamping the wafer is fixed at the upper end of the angle adjuster 40. By adjusting the angle between the wafer clamping disk 50 and the cabinet 20 through the angle adjuster 40, the wafer clamped on the wafer clamping disk 50 is fixed after being tilted to the optimal angle. When the wafer clamping disk 50 is tilted to the optimal angle and fixed, the reciprocating swing drive component 60 slidably connected to the linear drive module 30 is slid away from the angle adjuster 40. At this time, the wafer clamping disk 50 linearly slides along with the angle adjuster 40 and the slider 31.

[0053] By rotating the linear drive module 30, two different traveling directions (front - back or left - right directions) can be switched. And during the rotation process, the wafer clamping disk 50 passes through the positive adjustment component, and the angle of the wafer clamping disk 50 is switched, so that the wafer on the wafer clamping disk 50 can always maintain a positive state (that is, the side facing the detection personnel).

[0054] When in the front - back traveling state, the reciprocating swing drive component 60 slides to the lower end of the angle adjusting rod 45 of the angle adjuster 40. The slider 31 during front - back sliding drives the wafer clamping disk 50 through the reciprocating swing drive component 60 to perform a reciprocating swing angle adjustment action within a certain angle range. Therefore, when the slider 31 is in the front - back traveling state, the reciprocating deflection angle of the wafer at this time changes with the change of the wafer position, thereby changing the light reflection on the wafer surface. Therefore, when the wafer travels in the front - back direction, through the reciprocating swing of the wafer, the detection personnel can more easily find scratches by observing the light reflection on the surface of the reciprocating swing wafer.

[0055] The reciprocating swing drive assembly 60 slides away from the angle adjustment rod 45, fixes the optimal viewing angle of the wafer through the angle adjuster 40, and clamps the wafer through the wafer clamping disc 50. It is not necessary for the inspector to hold the wafer for a long time. By rotating the linear drive module 30, the forward and backward and left and right traveling states of the slider 31 are switched, realizing the fixed-angle sliding of the wafer clamping disc 50. And during the switching process, the wafer clamping disc 50 is switched through the forward adjustment component, so that the wafer always faces the inspector when in the forward and backward traveling states and the left and right traveling states. During the forward and backward and left and right movement of the wafer, the scratches on the wafer surface are observed through the light reflection on the wafer surface.

[0056] As Figure 5 , Figure 6 , Figure 8 , Figure 9 shown, the forward adjustment component includes a gear 37, the gear 37 is coaxially fixed with the drive shaft 371, and the angle adjuster 40 is fixed at the upper end of the drive shaft 371;

[0057] As Figure 10 shown, the linear drive module 30 further includes a first guide rail 33 adapted to the slider 31. The slider 31 is threadedly connected to the ball screw 34. The ball screw 34 is rotatably arranged on the first guide rail 33. One end of the ball screw 34 is coaxially fixed with the output shaft of the servo motor 32 through a coupling. The housing of the servo motor 32 is fixed on the first guide rail 33. By driving the rotation of the ball screw 34 by the servo motor 32, the slider 31 slides along the first guide rail 33 under the action of the thread;

[0058] As Figure 5 , Figure 8 shown, the gear 37 is rotatably connected to the second shaft hole 311 of the slider 31 through the coaxially fixed drive shaft 371 in cooperation with bearings. Therefore, by rotating the gear 37 and the drive shaft 371, the angle adjuster 40 and the wafer clamping disc 50 can be driven to rotate and adjust;

[0059] As Figure 5 , Figure 11 , Figure 12 shown, the cabinet 20 includes a housing 22 fixed on the upper surface of the support plate 11. The top of the housing 22 is an open structure. The first shaft hole 221 at the center of the housing 22 is directly below the lamp head 14. The first guide rail 33 is fixed on the support circular plate 35. The lower surface of the support circular plate 35 is rotatably connected to the first shaft hole 221 of the housing 22 through a shaft rod in cooperation with bearings. The support circular plate 35 and the first shaft hole 221 are coaxial. The upper inner wall of the housing 22 is fixed with an incomplete internal gear ring 38 through a plurality of annularly distributed support rods 382, and the incomplete internal gear ring 38 is coaxially arranged with the first shaft hole 221;

[0060] As Figure 5As shown, when the slider 31 slides to the end of the first guide rail 33 away from the servo motor 32, when the supporting circular plate 35 is rotated clockwise and passes through the incomplete inner gear ring 38, the gear 37 can mesh with the multiple teeth 381 of the incomplete inner gear ring 38, and the multiple teeth 381 drive the gear 37 to rotate 90° counterclockwise under the action of meshing, so that when the rotating supporting circular plate 35 switches the travel state of the slider 31, the gear 37 is driven by the multiple teeth 381 of the incomplete inner gear ring 38 to drive the drive shaft 371 and the angle adjuster 40 fixed on the drive shaft 371 to rotate 90° counterclockwise, so as to adjust the wafer clamping plate 50 and the clamped wafer to always face the inspection personnel when moving forward and backward and left and right;

[0061] In order to prevent the angle adjuster 40 and the wafer clamping plate 50 fixed above from shaking after rotation, the gear 37 is magnetically fixed to the slider 31 after the gear 37 rotates 90°, so that the wafer clamping plate 50 is positioned by the magnetic fixation of the gear 37 and the slider 31.

[0062] like Figure 6 , Figure 8 , Figure 9 As shown, a second magnet 372 and a third magnet 373 are symmetrically fixed on one side of the gear 37 close to the slider 31, and the second magnet 372 and the third magnet 373 are arranged at intervals. A first magnet 312 is symmetrically fixed on the slider 31, and the second magnet 372 and the third magnet 373 are both magnetically attracted to the first magnet 312. When the slider 31 is in a forward and backward movement state, the second magnet 372 is magnetically attracted to the first magnet 312 at this time. When the slider 31 rotates clockwise, the gear 37 is meshed and driven by the incomplete inner gear ring 38, and the gear 37 rotates counterclockwise, and the second magnet 372 is disengaged from the first magnet 312. When the tooth 381 is disengaged from the gear 37, the gear 37 rotates counterclockwise by 90°, and the third magnet 373 is magnetically attracted to the first magnet 312. In the process of completing the wafer clamping plate 50, the magnets can be mutually magnetically attracted to each other, so that the rotated gear 37 is fixed on the slider 31.

[0063] like Figure 2 , Figure 5 , Figure 10 As shown, the support circular plate 35 is fixed with a sealing circular plate 36 through a plurality of support columns 352, and a ring plate 21 coaxial with the first axial hole 221 is fixed above the shell 22, the upper surface of the sealing circular plate 36 abuts against the lower surface of the ring plate 21, and the sealing circular plate 36 is placed between the incomplete inner tooth ring 38 and the ring plate 21, and the lower surface of the sealing circular plate 36 abuts against the upper surface of the incomplete inner tooth ring 38. The outer diameter of the sealing circular plate 36 is larger than the inner diameter of the ring plate 21, so that the top opening of the shell 22 is covered by the sealing circular plate 36 to improve the overall aesthetics and reduce foreign matter from falling into the shell 22;

[0064] As shown Figure 10 in FIG., a strip-shaped hole 361 is formed in the sealing circular plate 36, the length direction of the strip-shaped hole 361 is arranged along the sliding direction of the slider 31, and the driving shaft 371 at the upper end of the gear 37 slides along the strip-shaped hole 361. That is to say, the linear driving module 30 is shielded in the outer shell 22 through the sealing circular plate 36 and fixedly supported by a plurality of support columns 352, so that the sealing circular plate 36 can follow the support circular plate 35 to rotate.

[0065] As shown Figure 5 in FIG., an aperture corresponding annular groove 362 is formed on the outer surface of the sealing circular plate 36. The aperture corresponding annular groove 362 is coaxial with the sealing circular plate 36, and the axis of the sealing circular plate 36 is placed directly below the lamp cap 14. When replacing the lamp caps 14 with different color temperatures and colors, since the different radiation apertures of the lens also vary with the height change of the lamp cap 14, when replacing and adjusting the height of the lamp cap 14, the lamp cap 14 is energized to irradiate the upper surface of the sealing circular plate 36, and when the outer edge of the radiation aperture irradiated by the lamp cap 14 coincides with the aperture corresponding annular groove 362, the adjustment of the height of the lamp cap 14 can be completed. Furthermore, it is not necessary for the tester to measure the diameter of the radiation aperture with a ruler, improving the adjustment efficiency of the lamp cap 14.

[0066] As shown Figure 3 and Figure 6 and Figure 7 and Figure 8 in FIG., the angle adjuster 40 includes an angle measuring seat 41. The angle measuring seat 41 is inserted with a long screw rod 42 with a wing nut 43. A plurality of sector-shaped grooves 412 are formed in the angle measuring seat 41, and a corner plate 44 is installed in each sector-shaped groove 412. The wafer clamping disc 50 is fixed at the upper ends of the plurality of corner plates 44. The long screw rod 42 passes through the mounting holes 441 formed in the corner plates 44. Therefore, the wafer clamping disc 50 and the corner plates 44 can be adjusted in angle along the sector-shaped grooves 412 with the long screw rod 42 as the axis. After the angle adjustment, by clockwise rotating the wing nut 43, under the action of extrusion and / or friction, the angle measuring seat 41 clamps the corner plates 44 and the wafer clamping disc 50 to position the wafer after the angle adjustment. After loosening the wing nut 43, at this time, the corner plates 44 are deflected with the long screw rod 42 as the axis through the cooperation of the mounting holes 441 and the long screw rod 42;

[0067] Protractor 411 coaxial with the long screw 42 is fixed at both ends of the protractor block 41. An indicating groove 442 pointing to the protractor 411 is provided on the angle plate 44. When the wafer chucking disk 50 is vertically perpendicular to the support plate 11, the indicating groove 442 indicates the zero scale line position of the protractor 411 at this time. By rotating the angle plate 44, the indicating groove 442 rotates around the axis of the protractor 411, and then the angle of the protractor 411 corresponding to the indicating groove 442 can be observed, so as to judge the included angle between the wafer and the cabinet 20.

[0068] As Figure 7 shown in the figure, the wafer chucking disk 50 includes a support disk 51 fixed on the angle plate 44. A wafer placement groove 511 is provided on the side of the support disk 51 away from the support 12. The wafer is placed in the wafer placement groove 511 to prevent the wafer from slipping. And a plurality of screws 52 are threadedly connected to the outer edge of the support disk 51, and a pressing pin 53 is inserted on each screw 52. The pressing pin 53 is rotated to the front end of the wafer placement groove 511, and then the wafer can be clamped in the support disk 51. And in order to prevent the pressing pin 53 and the support disk 51 from wearing the wafer, a silica gel layer is wrapped on the surfaces of the pressing pin 53 and the support disk 51;

[0069] When the wafer in the wafer placement groove 511 needs to be taken out of the support disk 51, through the finger hole 512 provided on the support disk 51, the finger can penetrate through the back surface of the wafer into the finger hole 512 to push out the wafer, and then turn it over to perform scratch detection.

[0070] As Figure 3 、 Figure 4 shown in the figure, a plurality of grooves are provided on the upper surface of the guide rod 61. The grooves are of V-shaped structure. An angle adjusting rod 45 is fixed to the angle plate 44 close to the guide rod 61. The angle adjusting rod 45 is arranged parallel to the long screw 42, and a roller 451 is coaxially rotatably connected to the angle adjusting rod 45, so as to reduce the friction with the guide rod 61 through the rotation of the roller 451;

[0071] The guide rod 61 is arranged along the sliding direction of the slider 31. When the slider 31 slides in the front-back traveling state, the roller 451 closely moves on the upper surface of the guide rod 61. And when it reaches the bottom of the groove, the included angle between the wafer and the cabinet 20 is 60° at this time. When the roller 451 reaches the top of the slope along the slope of the groove, the included angle between the sliding wafer and the cabinet 20 is 30° at this time. Then when the angle adjusting rod 45 fits and slides along the groove, the angle plate 44 performs a reciprocating lifting action within the angle range of 30° - 60° with the long screw 42 as the axis, and finally realizes the wafer swinging within the angle range of 30° - 60° when the wafer is detected in the front-back direction.

[0072] As Figure 3 、 Figure 4As shown, the guide rod 61 is provided with a plurality of slide grooves 611, and a second guide rail 62 is slidably provided in the slide grooves 611. The second guide rail 62 is fixed on the linear drive module 30. The guide rod 61 slides along a direction perpendicular to the movement of the slider 31. When the wafer on the support plate 51 needs to move forward and backward at a fixed angle, the guide rod 61 slides to the left along the second guide rail 62, so that the angle adjustment rod 45 is separated from the guide rod 61. When the guide rod 61 needs to be used to lift the wafer reciprocatingly, the guide rod 61 is slid toward the angle adjustment rod 45 and placed under the angle adjustment rod 45.

[0073] It is worth noting that the end of the guide rod 61 close to the angle adjustment rod 45 is lower than the angle adjustment rod 45, so when the angle adjustment rod 45 rotates with the recliner 40, the problem of interference between the angle adjustment rod 45 and the guide rod 61 can be avoided;

[0074] like Figure 3 As shown, both ends of the second guide rail 62 are fixed with limiting plates 63, and a plurality of male magnetic buckles 64 are fixed on the side of the limiting plate 63 close to the guide rod 61, and a plurality of female magnetic buckles 65 are fixed on the side of the guide rod 61 close to the male magnetic buckles 64. The male magnetic buckles 64 and the female magnetic buckles 65 are magnetically attracted to each other, and the guide rod 61 is slid to the left, and the male magnetic buckles 64 and the female magnetic buckles 65 on the left are magnetically attracted to each other. At this time, the guide rod 61 is away from the angle adjustment rod 45 and fixed, and then the guide rod 61 is slid to the right, and at this time, the right side of the guide rod 61 is fixed by the male magnetic buckles 64 and the female magnetic buckles 65.

[0075] like Figure 2 , Figure 5 , Figure 12 , Figure 13 As shown, a bracket 12 is fixed on the upper surface of the support plate 11, a support arm 13 with a locking screw 131 is slidably provided on the bracket 12, and a lamp holder 14 is fixed on the support arm 13; by adjusting the height of the support arm 13 on the bracket 12 and abutting and fixing the bracket 12 with the locking screw 131, the height of the lamp holder 14 can be adjusted, and finally the radiation aperture of the lamp holder 14 is adjusted;

[0076] An operating hole 211 is provided on one side of the bottom of the shell 22, and an L-shaped operating rod 351 is fixed to the side wall of the supporting circular plate 35. One end of the operating rod 351 that passes through the operating hole 211 is placed outside the shell 22. The operating rod 351 is parallel to the first guide rail 33, and the angle between the two ends of the operating hole 211 and the first axial hole 221 is 90°. Therefore, when the handle at the outer end of the operating rod 351 is pushed and abutted against the two ends of the operating hole 211, the supporting circular plate 35 can be driven to rotate 90° through the operating rod 351.

[0077] Working principle:

[0078] (I) Adjustment of lamp holder 14:

[0079] Replace the lamp head 14 with different lenses or colors as needed, and slide the support arm 13 onto the bracket 12, power on the lamp head 14 and irradiate the upper surface of the sealing circular plate 36, then adjust the support arm 13 up and down so that the radiation aperture corresponds to the aperture corresponding ring groove 362, and fix the support arm 13 on the bracket 12 with the locking screw 131 to complete the height adjustment of the lamp head 14;

[0080] (II) Wafer installation:

[0081] Move the multiple pressing pins 53 away from the wafer placement groove 511, put the wafer into the wafer placement groove 511, then press the wafer with the pressing pins 53, and turn the screws 52 clockwise to squeeze and fix the pressing pins 53 in the support plate 51, so as to complete the installation of the wafer;

[0082] (III) Angle adjustment for wafer fixed angle detection:

[0083] Loosen the butterfly nut 43 and adjust the angle of the support plate 51 to find the best viewing angle, then turn the butterfly nut 43 clockwise to fix the support plate 51 and the angle plate 44 on the angle measuring seat 41;

[0084] Then, the guide rod 61 is slid to the left away from the angle adjustment rod 45 and is magnetically attracted to the limit plate 63 on the left side;

[0085] (IV) Wafer sliding detection:

[0086] The servo motor 32 is powered on and drives the ball screw 34 to rotate clockwise. Under the action of the thread, the slider 31 is pushed to slide toward the end away from the servo motor 32. The slider 31 slides in the front-to-back direction along the first guide rail 33. At this time, the inspector observes the scratches through the light reflection on the surface of the wafer. When the slider 31 abuts against the end of the first guide rail 33 away from the servo motor 32, the servo motor 32 stops.

[0087] (V) Wafer sliding left and right switching:

[0088] Push and hold the operating rod 351 to drive the supporting circular plate 35, the sealing circular plate 36 and the first guide rail 33 to rotate clockwise. After the gear 37 passes through the teeth 381 of the incomplete inner gear ring 38, the gear 37 rotates 90° counterclockwise after the meshing of the incomplete inner gear ring 38. The second magnet 372 disengages from the first magnet 312, and the third magnet 373 rotates to the position of the first magnet 312 and is magnetically attracted. When the operating rod 351 abuts against the inner wall of the operating hole 211, the slider 31 and the supporting plate 51 rotate 90° at this time, and the wafer placement slot 511 faces the inspector, completing the travel state switching.

[0089] (VI) Wafer left and right sliding detection:

[0090] The servo motor 32 is started to drive the ball screw 34 counterclockwise, and the ball screw 34 drags the slider 31 to slide from right to left. At this time, the inspection personnel observe the scratches through the light reflection on the surface of the wafer;

[0091] (VII) Detection of reciprocating swing angle adjustment when the wafer slides back and forth:

[0092] Loosen the butterfly nut 43, then place the guide rod 61 under the roller 451, and then repeat the above step (iv) to complete the wafer moving in the front-back direction, while swinging with the long screw 42 as the axis. The inspector observes the scratches through the light reflection on the surface of the swinging wafer;

[0093] When it is necessary to inspect the other side of the wafer, just remove the wafer, turn it around and install it in the wafer placement groove 511, then the servo motor 32 drives the ball screw 34 to rotate clockwise, the slider 31 slides from left to right, and after it hits the end of the first guide rail 33, the operating rod 351 is rotated counterclockwise and rotated 90° around the first axial hole 221. During this process, the incomplete internal gear ring 38 drives the gear 37 to drive the support plate 51 to rotate 90° clockwise, and then the servo motor 32 is started again to drive the ball screw 34 to rotate counterclockwise, and the slider 31 is pulled to slide in the direction of the inspector.

[0094] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field within the technical scope disclosed by the present invention can make equivalent replacements or changes to a semiconductor wafer detection device and its inventive concept according to the technology of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A semiconductor wafer inspection device, characterized in that, It includes a wafer defect detection lamp group with adjustable height. A cabinet is fixed on the support plate of the wafer defect detection lamp group. A linear drive module is rotatably arranged in the cabinet. The linear drive module includes a slidable slider. A angle adjuster is rotatably connected to the slider. A forward adjustment component is fixed on the angle adjuster. A wafer chucking plate for clamping a wafer is fixed on the angle adjuster. A reciprocating swing drive component is slidably connected to the linear drive module. The reciprocating swing drive component includes a guide rod. A plurality of grooves are formed on the upper surface of the guide rod. A plurality of chutes are formed at the bottom of the guide rod. A second guide rail is slidably arranged in the chute. The second guide rail is fixed on the linear drive module. The forward adjustment component includes a gear. The linear drive module further includes a first guide rail adapted to the slider. A ball screw is rotatably arranged on the first guide rail. The gear is rotatably connected to the second shaft hole of the slider through a drive shaft. The angle adjuster is fixed to the upper end of the drive shaft. The cabinet includes a housing fixed on the upper surface of the support plate. The first guide rail is fixed on a support circular plate. The support circular plate is rotatably connected to the first shaft hole of the housing. An incomplete internal gear ring coaxially arranged with the first shaft hole is fixed on the housing. After rotation, the gear is magnetically fixed to the slider. Second magnets and third magnets are symmetrically fixed on one side of the gear close to the slider. The second magnets and the third magnets are arranged at intervals. First magnets are symmetrically fixed on the slider. The linear drive module switches the sliding direction of the slider through rotation. The wafer chucking plate following the rotation switches to maintain a forward state through the forward adjustment component. The reciprocating swing drive component slides to the lower end of the angle adjustment rod of the angle adjuster. During the sliding, the angle adjustment rod drives the wafer chucking plate to reciprocate through the reciprocating swing drive component. The reciprocating swing drive component slides away from the angle adjustment rod, and the wafer chucking plate slides at a fixed angle.

2. The semiconductor wafer inspection device according to claim 1, wherein, The support circular plate fixes a sealing circular plate through a plurality of support columns. A ring plate coaxially arranged with the first shaft hole is fixed above the housing. A strip-shaped hole is formed on the sealing circular plate. The drive shaft slides along the strip-shaped hole.

3. A semiconductor wafer inspection device according to claim 2, characterized in that, An aperture corresponding ring groove is formed on the outer surface of the sealing circular plate. The aperture corresponding ring groove is coaxially arranged with the sealing circular plate.

4. A semiconductor wafer inspection device according to claim 1, characterized in that The angle adjuster includes an angle measuring seat. A long screw rod with a wing nut is inserted into the angle measuring seat. A plurality of sector-shaped grooves are formed on the angle measuring seat. A corner plate is installed in each sector-shaped groove. The long screw rod passes through the installation hole formed on the corner plate. Angle measuring instruments coaxially arranged with the long screw rod are fixed at both ends of the angle measuring seat. An indicating groove pointing to the angle measuring instrument is formed on the corner plate.

5. A semiconductor wafer inspection device according to claim 4, wherein, The wafer chucking plate includes a support plate fixed on the corner plate. A wafer placement groove is formed on one side of the support plate. A plurality of screws are threadedly connected to the outer edge of the support plate. A pressing needle is inserted on each screw. Finger holes are formed on the support plate.

6. A semiconductor wafer inspection device according to claim 1, wherein, Limit plates are fixed at both ends of the second guide rail. A plurality of male magnetic buttons are fixed on one side of the limit plate close to the guide rod. A plurality of female magnetic buttons are fixed on one side of the guide rod close to the male magnetic buttons.

7. A semiconductor wafer inspection device according to claim 1, characterized in that, A bracket is fixed on the upper surface of the support plate. A support arm with a locking screw rod is slidably arranged on the bracket. A lamp head is fixed on the support arm. An operation hole is formed on one side of the bottom of the housing. An operation rod is fixed on the side wall of the support circular plate.

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