Photosensitive composition, battery piece containing photosensitive composition and preparation method of battery piece

Abstract

The invention discloses a photosensitive composition, a battery piece containing the photosensitive composition and a preparation method, and the photosensitive composition comprises the following components in parts by weight: 30-70 parts of photosensitive resin, 5-30 parts of a photopolymerization monomer, 0.1-10 parts of a photoinitiator, 1-30 parts of a solvent, 0.05-5 parts of a thermosetting hardener and 0.1-5 parts of an auxiliary agent. The baking resistance of the photosensitive composition can be effectively improved, so that the quality of a battery piece is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of photovoltaic cells, and particularly to a photosensitive composition, a cell sheet comprising the photosensitive composition, and a preparation method thereof. Background Art

[0002] Before using copper to replace silver paste in existing double-sided high-efficiency cell sheets, it is necessary to use the yellow light process of wet film to make the electroplating pattern of the double-sided cell sheet. During operation, it is necessary to first coat and bake and cure the photosensitive composition on the first side of the cell sheet, and then coat and bake and cure the photosensitive composition on the second side of the cell sheet. However, as Figure 1 shown, when baking and curing the photosensitive composition on the second side of the cell sheet, the film layer of the photosensitive composition on the first side is prone to softening due to the secondary baking temperature causing the film layer to heat up again. Since the film layer of the photosensitive composition on the first side is in direct contact with the baking carrier (such as a furnace belt), the softened photosensitive composition on the first side will adhere to the baking carrier, thereby causing contact marks or holes to form in the film layer of the photosensitive composition on the first side, affecting the integrity of pattern transfer during subsequent exposure processes or causing the cell sheet to be plated with copper due to holes in the photosensitive composition during subsequent electroplating processes.

[0003] To solve this problem, a furnace belt structure as Figure 1 shown is designed in the industry. During baking, the cell sheet is supported by a support frame, and then the point contact type support method is adopted to prevent the film layer of the photosensitive composition on the first side from forming contact marks or holes due to contact with the furnace belt. However, this point contact type furnace belt structure has unstable support for the cell sheet, and the cell sheet is prone to displacement, sticking, or even fragmentation due to the influence of the return air of hot air during curing and baking. Therefore, the present invention aims to improve the baking resistance performance of the photosensitive composition from the perspective of its own properties. Summary of the Invention

[0004] To overcome the above disadvantages, the purpose of the present invention is to provide a photosensitive composition, a cell sheet comprising the photosensitive composition, and a preparation method thereof, which can effectively improve the baking resistance performance of the photosensitive composition, thereby improving the quality of the cell sheet.

[0005] One of the technical solutions adopted by the present invention is: a photosensitive composition, calculated by weight, comprising 30 to 70 parts of a photosensitive resin, 5 to 30 parts of a photopolymerizable monomer, 0.1 to 10 parts of a photoinitiator, 1 to 30 parts of a solvent, 0.05 to 5 parts of a thermosetting hardener, and 0.1 to 5 parts of an auxiliary agent.

[0006] The beneficial effect of the photosensitive composition of the present invention lies in: By adding a photopolymerizable monomer and a photoinitiator, the photosensitive resin can undergo a polymerization reaction under light, so that the photosensitive composition can have a high photosensitivity. Then, by adding a thermosetting hardener, the surface hardness of the photosensitive composition can be effectively improved. Furthermore, when the photosensitive composition is applied to the battery wafer, it can effectively inhibit the softening phenomenon during the secondary baking of the photosensitive composition, and prevent the formation of contact marks or holes on the surface of the photosensitive composition film layer due to contact with the baking carrier, thus affecting the quality of the final battery wafer.

[0007] Furthermore, the thermosetting hardener includes at least one of modified epoxy resins and their derivatives, modified amino resins and their derivatives, isocyanates and their derivatives; and the average molecular weight of the thermosetting hardener is 100 - 30000, and the reaction temperature is 80 - 120 °C.

[0008] Furthermore, the photosensitive resin includes at least one of carboxylated polyacrylic resin, carboxylated polyurethane, carboxylated polyimide resin, carboxylated epoxy resin; and the average molecular weight of the photosensitive resin is 1000 - 50000, and the solid acid value is 50 - 150 mgKOH / g. Furthermore, the carboxylated epoxy resin includes at least one of carboxyl-modified bisphenol A epoxy resin, carboxyl-modified bisphenol F epoxy resin, carboxyl-modified phenolic epoxy resin, carboxyl-modified o-cresol novolac epoxy resin. Furthermore, the photoinitiator includes at least one of trichloroacetophenone, p-tert-butylacetophenone, benzophenone, 2-chlorobenzophenone, p,p'-bis(dimethylamino)benzophenone, benzil, benzoin, benzoin methyl ether, benzoin isopropyl ether, benzoin isobutyl ether, 2-(o-fluorophenyl)-4,5-diphenylimidazole. Furthermore, the photopolymerizable monomer includes at least one of tricyclodecane dimethanol diacrylate, polypropylene glycol diacrylate, 1,6-hexanediol diacrylate, dipropylene glycol diacrylate, tripropylene glycol diacrylate, 1,4-butanediol diacrylate, ethoxylated bisphenol A diacrylate, 2-methyl-1,3-propanediol diacrylate, ethylene glycol dimethacrylate, tricyclodecane dimethanol dimethacrylate, tripropylene glycol dimethacrylate, 1,4-butanediol dimethacrylate, polyethylene glycol dimethacrylate, ethoxylated bisphenol A dimethacrylate, triethylene glycol dimethacrylate, diethylene glycol dimethacrylate, 2-hydroxyethyl methacrylate phosphate, tris(2-hydroxyethyl)isocyanuric acid triacrylate, trimethylolpropane triacrylate, pentaerythritol triacrylate, ethoxylated trimethylolpropane triacrylate, pentaerythritol tetraacrylate, ethoxylated pentaerythritol tetraacrylate, bis(trimethylolpropane) tetraacrylate, propoxylated pentaerythritol tetraacrylate, poly(dipentaerythritol) hexaacrylate.

[0009] Further, the solvent includes at least one of methanol, ethanol, n-propanol, isopropanol, ethylene glycol, propylene glycol, acetone, methyl ethyl ketone, cyclohexanone, N-methyl-2-pyrrolidone, toluene, xylene, triethylene glycol monomethyl ether, triethylene glycol monoethyl ether, ethyl cellosolve acetate, butyl cellosolve acetate, carbitol acetate, ethyl carbitol acetate, butyl carbitol acetate, propylene glycol monomethyl ether acetate, and benzoguanamine. Further, the additives include at least one of BYK-300, BYK-301, BYK-302, BYK-306, BYK-310, BYK-314, BYK-315, BYK-320, BYK-322, BYK-323, BYK-326, BYK-327, BYK-330, BYK-331, BYK-332, BYK-333, BYK-337, BYK-342, BYK-345, BYK-346, BYK-347, BYK-348, BYK-349, BYK-350, BYK-352, BYK-354, BYK-355, BYK-356, BYK-359, BYK-370, BYK-377, and BYK-378. The second technical solution adopted by the present invention is: a battery chip including the photosensitive composition described in any one of the above. The battery chip of the present invention can effectively avoid surface defects (contact marks or holes) of the film layer caused by the photosensitive composition being softened by baking and adhering to the baking carrier, thereby ensuring the product yield of subsequent yellow light treatment and electroplating treatment.

[0010] The third technical solution adopted by the present invention is: a method for preparing the battery chip described above, including the following steps: (1) Prepare the photosensitive composition: fully mix the photosensitive resin, photopolymerizable monomer, photoinitiator, solvent, thermosetting hardener, and additives in a set ratio and let it stand for a period of time to obtain the photosensitive composition; (2) Prepare the photosensitive composition film layer on the first side: print the photosensitive composition with a thickness of 5 - 20 μm on the first side of the battery chip substrate; place the second side of the battery chip substrate downward on the baking carrier, and then cure and bake the photosensitive composition printed on the first side of the battery chip substrate for 1 - 10 minutes at a temperature of 100 - 120°C; (3) Prepare the photosensitive composition film layer on the second side; print the photosensitive composition with a thickness of 5 - 20 μm on the second side of the battery chip substrate processed in step (2); place the first side of the battery chip electrode downward on the baking carrier, and then cure and bake the photosensitive composition printed on the second side of the battery chip substrate to obtain the required battery chip; the baking time is 1 - 10 minutes and the temperature is 80 - 100°C.

[0011] The beneficial effects of the method for preparing the battery chip of the present invention are as follows: In step (1), by adding a thermosetting hardener, the hardness of the photosensitive composition itself can be effectively improved, thereby improving the baking resistance of the photosensitive composition. In step (3), during the curing and baking process of the photosensitive composition film layer on the second surface of the battery chip substrate, the photosensitive composition film layer on the first surface of the battery chip substrate will not soften and adhere to the baking carrier due to secondary baking, ensuring the quality of the battery chip. Moreover, during the curing and baking processes of steps (2) and (3), both sides of the battery chip substrate are directly placed on the baking carrier, thereby ensuring stable support for the battery chip substrate during the baking process and avoiding problems such as displacement and dropping of the battery chip during baking due to insufficient support. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 is a schematic diagram of the furnace belt structure in the background art of the present invention; Figure 2 is a schematic diagram of the structure of the battery chip placed on the baking carrier in step (2) of the embodiment of the present invention; Figure 3 is a schematic diagram of the structure of the battery chip placed on the baking carrier in step (3) of the embodiment of the present invention; Figure 4 is a photograph of the photosensitive composition film layer on the first surface of Embodiments 1-7 and Comparative Examples 1-2 of the present invention taken under a microscope. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0013] The following elaborates on the preferred embodiments of the present invention in detail, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making a clearer and more definite definition of the protection scope of the present invention. It should be noted that the following embodiments are for better further understanding of the present invention and are not limited to the best embodiments. They do not limit the content and protection scope of the present invention. Any product identical or similar to the present invention obtained by anyone under the inspiration of the present invention or by combining the features of the present invention with other existing technologies falls within the protection scope of the present invention.

[0014] It should be noted that in the description of this specification, the descriptions referring to terms such as "one embodiment", "some embodiments", "schematic embodiments", "examples", "specific examples", or "some examples" etc. mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0015] In addition, for those without specific experimental procedures or conditions noted in the examples, the operations or conditions of the conventional experimental procedures described in the literature in this field can be followed. In the examples, the numerical ranges indicated by "~" represent ranges that include the values recorded before and after "~" as the minimum and maximum values, respectively. For the reagents or instruments without the manufacturer noted, they are all conventional reagent products that can be obtained through commercial purchase.

[0016] Examples The photosensitive composition of the present invention, by weight, includes 30 to 70 parts of a photosensitive resin, 5 to 30 parts of a photopolymerizable monomer, 0.1 to 10 parts of a photoinitiator, 1 to 30 parts of a solvent, 0.05 to 5 parts of a thermosetting hardener, and 0.1 to 5 parts of an auxiliary agent.

[0017] Among them, the average molecular weight of the photosensitive resin is 1000 to 50000, and the solid acid value is 50 to 150 mgKOH / g. Specifically, the photosensitive resin includes at least one of a carboxylated polyacrylic resin, a carboxylated polyurethane, a carboxylated polyimide resin, and a carboxylated epoxy resin. Among them, the carboxylated polyacrylic resin is formed by thermal polymerization of at least one acrylic acid monomer (such as acrylic acid monomers and methacrylic acid monomers). The carboxylated epoxy resin includes at least one of a carboxylic acid-modified bisphenol A epoxy resin, a carboxylic acid-modified bisphenol F epoxy resin, a carboxylic acid-modified phenolic epoxy resin, and a carboxylic acid-modified o-cresol novolac epoxy resin. The photopolymerizable monomer includes at least one of tricyclodecane dimethanol diacrylate, polypropylene glycol diacrylate, 1,6-hexanediol diacrylate, dipropylene glycol diacrylate, tripropylene glycol diacrylate, 1,4-butanediol diacrylate, ethoxylated bisphenol A diacrylate, 2-methyl-1,3-propanediol diacrylate, ethylene glycol dimethacrylate, tricyclodecane dimethanol dimethacrylate, tripropylene glycol dimethacrylate, 1,4-butanediol dimethacrylate, polyethylene glycol dimethacrylate, ethoxylated bisphenol A dimethacrylate, triethylene glycol dimethacrylate, diethylene glycol dimethacrylate, 2-hydroxyethyl methacrylate phosphate, tris(2-hydroxyethyl) isocyanurate triacrylate, trimethylolpropane triacrylate, pentaerythritol triacrylate, ethoxylated trimethylolpropane triacrylate, pentaerythritol tetraacrylate, ethoxylated pentaerythritol tetraacrylate, bis-trimethylolpropane tetraacrylate, propoxylated pentaerythritol tetraacrylate, and polydiethylene glycol pentaacrylate.

[0018] The photoinitiator includes at least one of trichloroacetophenone, p-tert-butylacetophenone, benzophenone, 2-chlorobenzophenone, p,p'-bis(dimethylamino)benzophenone, benzil, benzoin, benzoin methyl ether, benzoin isopropyl ether, benzoin isobutyl ether, 2-(o-fluorophenyl)-4,5-diphenylimidazole. The solvent includes at least one of methanol, ethanol, n-propanol, isopropanol, ethylene glycol, propylene glycol, acetone, methyl ethyl ketone, cyclohexanone, N-methyl-2-pyrrolidone, toluene, xylene, triethylene glycol monomethyl ether, triethylene glycol monoethyl ether, ethyl cellosolve acetate, butyl cellosolve acetate, carbitol acetate, ethyl carbitol acetate, butyl carbitol acetate, propylene glycol monomethyl ether acetate, and benzoguanamine. The thermosetting hardener includes at least one of modified epoxy resin and its derivatives, modified amino resin and its derivatives, and isocyanate and its derivatives. Further, the average molecular weight of the thermosetting hardener is 100 to 30,000, and the reaction temperature is 80 to 120 °C.

[0019] The auxiliary agent includes at least one of BYK-300, BYK-301, BYK-302, BYK-306, BYK-310, BYK-314, BYK-315, BYK-320, BYK-322, BYK-323, BYK-326, BYK-327, BYK-330, BYK-331, BYK-332, BYK-333, BYK-337, BYK-342, BYK-345, BYK-346, BYK-347, BYK-348, BYK-349, BYK-350, BYK-352, BYK-354, BYK-355, BYK-356, BYK-359, BYK-370, BYK-377, BYK-378. The present invention also provides a method for preparing a battery cell, including the following steps: (1) Prepare a photosensitive composition: fully mix a photosensitive resin, a photopolymerizable monomer, a photoinitiator, a solvent, a thermosetting hardener, and an auxiliary agent in a set ratio and then let it stand for a period of time to obtain the photosensitive composition; (2) Prepare a photosensitive composition film layer on the first side: print a photosensitive composition with a thickness of 5 to 20 μm on the first side of the battery cell substrate; place the second side of the battery cell substrate downward on a baking carrier, and then cure and bake the photosensitive composition printed on the first side of the battery cell substrate, with a baking time of 1 to 10 minutes and a temperature of 100 to 120 °C; (3) Prepare the photosensitive composition film layer on the second side; print a photosensitive composition with a thickness of 5 - 20 μm on the second side of the cell substrate after being processed in step (2); place the first side of the cell electrode downward on a baking carrier, and then cure and bake the photosensitive composition printed on the second side of the cell substrate to obtain the required cell; the baking time is 1 - 10 min and the temperature is 80 - 100 °C.

[0020] In step (1), by adding a thermosetting hardener, the hardness of the photosensitive composition itself can be effectively improved, thereby enhancing the baking resistance of the photosensitive composition. In step (3), during the curing and baking process of the second side of the cell substrate, the photosensitive composition film layer on the first side of the cell substrate will not soften and adhere to the baking carrier due to secondary baking, thus ensuring the product yield of subsequent yellow light treatment and electroplating treatment of the cell; and during the curing and baking processes of steps (2) and (3), both sides of the cell substrate are directly placed on the baking carrier, thereby ensuring stable support for the cell substrate during baking and avoiding problems such as displacement and dropping of the cell during baking due to insufficient support.

[0021] Further, step (1) specifically includes: first, mix the photosensitive resin, photopolymerizable monomer, solvent, and additives, and stir at a speed of 400 - 800 rpm for 10 - 30 min; then add a photoinitiator and a thermosetting hardener, and stir at a speed of 400 - 800 rpm for 100 - 120 min; after stirring, let it stand for 24 h to obtain the photosensitive composition.

[0022] Further, after step (3), the following steps are also included: (4) Expose the cured photosensitive composition film layer with a 365 nm or 405 nm light source through a photomask, and the exposure energy is 30 - 200 mJ; (5) Develop the exposed photosensitive composition film layer with a 1% potassium carbonate solution for 60 - 120 s; (6) Electroplate the developed cell, and after electroplating, soak it in a 3 - 5% potassium hydroxide aqueous solution at 45 °C for 3 min to remove the photosensitive composition film layer.

[0023] Example 1 Prepare Specimen 1 according to the following steps.

[0024] (1) Mix 55 parts of photosensitive resin, 30 parts of photopolymerizable monomer, 10 parts of solvent, and 1 part of additive, and stir at a speed of 600 rpm for 20 min; then add 5 parts of photoinitiator and 1 part of thermosetting hardener, and continue to stir at a speed of 600 rpm for 120 min; after stirring, let it stand for 24 h to obtain the photosensitive composition; among them, the photosensitive resin is purchased from Kaixincheng Co., Ltd., with the model SR237; the photopolymerizable monomer is purchased from Double Bond Chemical Co., Ltd., with the model 907; the photoinitiator is purchased from Changxing Chemical Industry Co., Ltd., with the model EM265; the solvent is triethanol monoethyl ether, purchased from Shanghai Kayin Chemical Co., Ltd.; the additive model is BYK-378; the thermosetting hardener is purchased from Changchun Chemical (Jiangsu) Co., Ltd., with the model MR-603; (2) Coating a photosensitive composition film layer with a thickness of 10 μm on the first side (i.e., the back side of the cell substrate) of the cell substrate by screen printing using the photosensitive composition prepared in step (1); then place the second side (i.e., the front side of the cell substrate) of the cell substrate downward and place it on a baking carrier (such as a furnace belt), and cure and bake the photosensitive composition film layer on the first side with hot air or infrared rays, with a baking time of 3 min and a temperature of 110 °C; (3) Coating a photosensitive composition film layer with a thickness of 10 μm on the second side of the cell substrate by screen printing using the photosensitive composition prepared in step (1); place the first side of the cell substrate facing and on the baking carrier, and cure and bake the photosensitive composition film layer on the second side with hot air or infrared rays, with a baking time of 3 min and a temperature of 90 °C.

[0025] Example 2 The difference between this example and Example 1 is that in step (1), the thermosetting hardener is 2 parts.

[0026] Example 3 The difference between this example and Example 1 is that in step (1), the thermosetting hardener is 3 parts.

[0027] Example 4 The difference between this example and Example 1 is that in step (1), the thermosetting hardener is 4 parts.

[0028] Example 5 The difference between this example and Example 3 is that in step (1), the thermosetting hardener is 5 parts.

[0029] Example 6 The difference between this example and Example 3 is that in step (1), the thermosetting hardener is 3 parts; and in step (2), the baking temperature is 100 °C.

[0030] Example 7 The difference between this embodiment and Embodiment 3 is as follows: in step (1), the thermosetting hardener is 3 parts; and in step (2), the baking temperature is 120°C.

[0031] Comparative Example 1 The difference between this embodiment and Embodiment 3 is that no thermosetting hardener is added in step (1).

[0032] Comparative Example 2 The difference between this embodiment and Embodiment 3 is that no thermosetting hardener is added in step (1), and in step (2), the baking temperature is 120°C.

[0033] Test Example Use a microscope to observe whether contact marks or holes are formed on the surface of the first-side photosensitive composition film layer of Examples 1-7 and Comparative Examples 1-2 respectively, and the observation results shown in Table 1 will be obtained; at the same time, take surface photos of the first-side photosensitive composition film layer under the microscope.

[0034] Table 1 Observation Results of Examples 1-7 and Comparative Examples 1-2

[0035] According to the observation results of Examples 1-5 and Figure 4 It can be known that: as the addition amount of the thermosetting hardener gradually increases, the surface defects of the first-side photosensitive composition film layer will gradually decrease, thereby verifying that the addition of the thermosetting hardener can improve the baking resistance of the photosensitive composition.

[0036] According to the observation results of Examples 3, 6, and 7 and Figure 4 It can be known that: the baking temperature of the first-side photosensitive composition film layer will affect the degree of surface defects of the film layer; and when the baking temperature is higher than the reaction temperature of the thermosetting hardener (80-100°C), the surface defects of the film layer can be effectively reduced.

[0037] According to Examples 3, Comparative Examples 1-2 and Figure 4 It can be known that: no thermosetting hardener is added in Comparative Examples 1-2, resulting in serious surface defects on the first-side photosensitive composition film layers of Comparative Examples 1 and 2.

[0038] The above embodiments are only for illustrating the technical concept and features of the present invention, and the purpose is to enable those who are familiar with this technology to understand the content of the present invention and implement it, and it cannot be used to limit the protection scope of the present invention. Any equivalent changes or modifications made according to the spirit and essence of the present invention should be covered within the protection scope of the present invention.

Claims

1. A photosensitive composition, characterized in that: In parts by weight, the composition comprises 30 to 70 parts of a photosensitive resin, 5 to 30 parts of a photopolymerizable monomer, 0.1 to 10 parts of a photoinitiator, 1 to 30 parts of a solvent, 0.05 to 5 parts of a thermosetting hardener, and 0.1 to 5 parts of an auxiliary agent.

2. The photosensitive composition according to claim 1, characterized in that: The thermosetting hardener includes at least one of modified epoxy resin and its derivatives, modified amino resin and its derivatives, isocyanate and its derivatives; and the average molecular weight of the thermosetting hardener is 100-30000, and the reaction temperature is 80-120°C.

3. The photosensitive composition according to claim 1, characterized in that The photosensitive resin includes at least one of carboxylated polyacrylic resin, carboxylated polyurethane, carboxylated polyimide resin, and carboxylated epoxy resin; and the photosensitive resin has an average molecular weight of 1000-50000 and a solid acid value of 50-150 mgKOH / g.

4. The photosensitive composition according to claim 3, characterized in that: The carboxylated epoxy resin includes at least one of carboxylic acid-modified bisphenol A epoxy resin, carboxylic acid-modified bisphenol F epoxy resin, carboxylic acid-modified novolac epoxy resin, and carboxylic acid-modified o-cresol novolac epoxy resin.

5. The photosensitive composition according to claim 1, characterized in that The photoinitiator includes at least one of trichloroacetophenone, p-tert-butylacetophenone, benzophenone, 2-chlorobenzophenone, p,p'-bis(dimethylamino)benzophenone, benzil, benzoin, benzoin methyl ether, benzoin isopropyl ether, benzoin isobutyl ether, and 2-(o-fluorophenyl)-4,5-diphenylbiimidazole.

6. The photosensitive composition according to claim 1, characterized in that: The photopolymerizable monomers include tricyclodecane dimethanol diacrylate, polypropylene glycol diacrylate, 1,6-hexanediol diacrylate, dipropylene glycol diacrylate, tripropylene glycol diacrylate, 1,4-butanediol diacrylate, ethoxylated bisphenol A diacrylate, 2-methyl-1,3-propanediol diacrylate, ethylene glycol dimethacrylate, tricyclodecane dimethanol dimethacrylate, tripropylene glycol dimethacrylate, 1,4-butanediol dimethacrylate, polyethylene glycol dimethacrylate, ethoxylated bisphenol A dimethacrylate, triethylene glycol dimethacrylate, diethylene glycol dimethacrylate, 2-hydroxyethyl methacrylate phosphate, tris(2-hydroxyethyl) At least one of isocyanuric acid triacrylate, trimethylolpropane triacrylate, pentaerythritol triacrylate, ethoxylated trimethylolpropane triacrylate, pentaerythritol tetraacrylate, ethoxylated pentaerythritol tetraacrylate, ditrimethylolpropane tetraacrylate, propoxylated pentaerythritol tetraacrylate, and polydipentaerythritol hexaacrylate.

7. The photosensitive composition according to claim 1, characterized in that: The solvent includes at least one of methanol, ethanol, n-propanol, isopropanol, ethylene glycol, propylene glycol, acetone, methyl ethyl ketone, cyclohexanone, N-methyl-2-pyrrolidone, toluene, xylene, triethylene glycol monomethyl ether, triethylene glycol monoethyl ether, ethyl cellosolve acetate, butyl cellosolve acetate, carbitol acetate, ethyl carbitol acetate, butyl carbitol acetate, propylene glycol monomethyl ether acetate and benzoguanamine.

8. The photosensitive composition according to claim 1, characterized in that: The auxiliaries include BYK-300, BYK-301, BYK-302, BYK-306, BYK-310, BYK-314, BYK-315, BYK-320, BYK-322, BYK-323, BYK-326, BYK-327, BYK-330, BYK-331, BYK-332, BYK-333, BYK-337, BYK-342, BYK-345, BYK-346, BYK-347, BYK-348, BYK-349, BYK-350, BYK-352, BYK-354, BYK-355, At least one of BYK-356, BYK-359, BYK-370, BYK-377, BYK-378.

9. A battery cell, characterized in that: The photosensitive composition comprises any one of claims 1 to 8.

10. A method for preparing a battery cell according to claim 9, characterized in that: The steps include: (1) Preparing a photosensitive composition: fully mixing a photosensitive resin, a photopolymerizable monomer, a photoinitiator, a solvent, a thermosetting hardener, and an auxiliary agent in a predetermined proportion and allowing the mixture to stand for a period of time to obtain a photosensitive composition; (2) Preparing a first-side photosensitive composition film layer: printing a photosensitive composition with a thickness of 5 to 20 μm on the first side of the cell substrate; placing the second side of the cell substrate facing downward on a baking carrier, and then curing and baking the photosensitive composition printed on the first side of the cell substrate, the baking time is 1 to 10 minutes, and the temperature is 100 to 120°C; (3) preparing a second-side photosensitive composition film layer; printing a photosensitive composition with a thickness of 5 to 20 μm on the second side of the cell substrate treated in step (2); placing the first side of the cell electrode facing downward on a baking carrier, and then curing and baking the photosensitive composition printed on the second side of the cell substrate to obtain the desired cell; the baking time is 1 to 10 minutes, and the temperature is 80 to 100°C.

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