server

Abstract

The present application discloses a server, which relates to the field of mechanism design technology. The server includes: a chassis; a hard disk backplane, which is arranged in the chassis, and at least two links are arranged on the hard disk backplane; at least two flexible circuit boards, which are connected to the hard disk backplane, and each flexible circuit board is communicatively connected to a link; at least two main boards, and each main board is communicatively connected to a flexible circuit board. By connecting at least two main boards through flexible circuit boards, dual ownership of the hard disk is achieved, which avoids data loss when any main board fails, improves data security, and is simple to connect and operate. It can overcome the defects of cumbersome wiring, difficult installation, and wind-blocking cables caused by a large number of cables, which affect heat dissipation. The server of the present application can overcome the problems of easy data loss, cumbersome wiring, difficult installation, and easy heat dissipation in servers in related technologies. It can improve data security, is simple to install, and helps to improve the heat dissipation effect of the server.

Description

Technical Field

[0001] The present application relates to the technical field of mechanism design, and in particular to a server. Background Art

[0002] With the rapid development of artificial intelligence and big data industries, the demand for hard drive data reliability is becoming increasingly stringent. The hard drive backplane is connected to the motherboard via a cable, which in turn manages the hard drive.

[0003] However, in related technologies, the hard disk backplane is usually single-owned, that is, the hard disk backplane is managed by a mainboard. This means that when the mainboard fails, there is a risk of data loss, which is not conducive to improving data security and cannot meet the needs of industries with high data security requirements. Summary of the Invention

[0004] The present application provides a server to at least solve the problem in the related art that a server has a risk of data loss when a mainboard fails.

[0005] This application provides a server, including:

[0006] Chassis;

[0007] A hard disk backplane is provided in the chassis and has at least two links;

[0008] At least two flexible circuit boards are connected to the hard disk backplane, and each flexible circuit board is communicatively connected to a link;

[0009] At least two main boards, each main board is communicatively connected to a flexible circuit board.

[0010] Through this application, since at least two links are provided on the hard disk backplane, and each link is connected to a flexible circuit board, and at least two main boards are connected through the flexible circuit board, a single dual-home hard disk can divide the X4 signal, splitting the X4 signal into two 1:1 X2 signals. The two X2 signals are connected to the two main boards through two flexible circuit boards respectively, thereby realizing dual home of the hard disk, avoiding data loss when any main board fails, thereby improving data security, and being suitable for the use needs of high-security industries such as banks and securities.

[0011] On this basis, the flexible circuit board itself is a thin sheet with a thickness of a few tenths of a millimeter, so the flexible circuit board itself occupies a small volume, has less obstruction in the height direction of the server, and has a simple connection with the hard disk backplane. It can overcome the defects of cumbersome wiring and difficult installation caused by a large number of cables, and cables blocking the wind and affecting heat dissipation.

[0012] Secondly, in the related art, the hard disk backplane needs to transmit a large amount of signals, and the hard disk backplane is connected to the motherboard through a cable, so a connector for connecting the cables is required, which makes the hard disk backplane itself larger and easily affects the ventilation and heat dissipation in the chassis. The embodiment of the present application uses a flexible circuit board and a hard disk backplane for mixed pressure connection. The flexible circuit board can replace the hard disk backplane to implement some signal interaction functions, and the connection between the flexible circuit board and the hard disk backplane does not need to be achieved through a connector, thereby reducing the number of connectors on the hard disk backplane and the number of signals that the hard disk backplane needs to transmit, thereby helping to reduce the size of the hard disk backplane and reduce the number of layers of the hard disk backplane, helping to improve the heat dissipation in the chassis and reduce the manufacturing cost of the hard disk backplane.

[0013] Therefore, the server of the present application can overcome the problems of easy data loss, cumbersome wiring, difficult installation and easy impact on heat dissipation in servers in related technologies. It can improve data security, is simple to install, and helps to improve the heat dissipation effect of the server. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0015] Figure 1 A schematic diagram of a hard disk backplane, a flexible circuit board, a horizontal backplane, and a mainboard of a server provided in an embodiment of the present application;

[0016] Figure 2 for Figure 1 Schematic diagram of the interaction between the hard disk backplane, flexible circuit board, horizontal backplane and mainboard;

[0017] Figure 3 A schematic diagram of a hard disk backplane of a server according to an embodiment of the present application;

[0018] Figure 4 This is a schematic diagram of the connection between a hard disk backplane and a flexible circuit board of a server according to an embodiment of the present application;

[0019] Figure 5 A schematic diagram of a horizontal backplane and a mainboard of a server according to an embodiment of the present application;

[0020] Figure 6 A schematic diagram of a hard disk backplane, a flexible circuit board, a horizontal backplane, and a mainboard of a server according to an embodiment of the present application;

[0021] Figure 7This is an enlarged view of the connection between the flexible circuit board and the fixing member of a server according to an embodiment of the present application;

[0022] Figure 8 This is an enlarged view of a fixing component of a server according to an embodiment of the present application.

[0023] The above drawings include the following reference numerals:

[0024] 1. Hard disk backplane; 101. Backplane signal layer; 1011. Third sublayer; 1012. Fourth sublayer; 102. Backplane power layer; 103. Board body; 104. First hard disk connector; 105. Hard disk interface adapter board; 106. Second hard disk connector;

[0025] 2. Flexible circuit board; 201, flexible board signal layer; 2011, first sublayer; 2012, second sublayer; 202, flexible board power layer; 203, through hole;

[0026] 3. Mainboard; 301. Second connector; 302. Guide groove;

[0027] 4. Horizontal backplane; 401. First connector; 402. Backplane body; 403. Third connector; 404. Guide protrusion; 405. Horizontal board signal layer; 4051. Fifth sublayer; 4052. Sixth sublayer; 406. Horizontal board power layer;

[0028] 5. Fixing member; 501. Fixing member body; 5011. First folding plate; 5012. Second folding plate; 5013. Reinforcing rib;

[0029] 502, first connection portion; 503, mounting surface; 504, second connection portion. DETAILED DESCRIPTION

[0030] The following will be combined with the accompanying drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0031] It should be noted that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "back," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like, indicating positions or relationships, are based on the positions or relationships shown in the accompanying drawings and are intended solely for ease of description and simplification of the present application. They are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation, and therefore should not be construed as limiting the present application. The terms "mounted," "connected," and "connected" should be interpreted broadly, and may include, for example, fixed, removable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediary; and internal communication between two components. The terms "parallel," "perpendicular," and "equal" encompass the described conditions and conditions similar to the described conditions, provided that the range of the similar conditions is within an acceptable range of deviation, as determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes both absolute parallelism and approximate parallelism, where the acceptable deviation range for approximate parallelism may be, for example, within 5°; "perpendicular" includes both absolute perpendicularity and approximate perpendicularity, where the acceptable deviation range for approximate perpendicularity may also be, for example, within 5°. "Equal" includes both absolute equality and approximate equality, where the acceptable deviation range for approximate equality may be, for example, that the difference between the two is less than or equal to 5% of either. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0032] In order to make those skilled in the art better understand the present application, Figure 1 To the attached Figure 8 The present application is further described in detail with specific implementation methods.

[0033] In the related art, the hard disk backplane 1 and the motherboard 3 are connected by a large number of cables. There are problems such as cumbersome wiring and difficult installation to achieve interconnection through cables. As the number of front window disks and disk speeds of the server increase, the amount of cables used also increases. Not only does it cause a large area of cables to block the wind, but it also creates difficulties in achieving dual-ownership of the hard disk backplane 1. As a result, in the related art, the hard disk backplane 1 can only be connected to one motherboard 3, that is, the hard disk backplane 1 has a single ownership, and there is a risk of system downtime and data loss due to failure of the motherboard 3.

[0034] In the related art, the front side of the hard disk backplane 1 is provided with a hard disk connector for plugging in the hard disk. The back side of the hard disk backplane 1 is used to plug in the motherboard 3, thereby realizing the interconnection between the motherboard 3 and the hard disk.

[0035] However, due to the large amount of signals that the hard disk backplane 1 needs to transmit, the amount of wiring on the hard disk backplane 1 is large, and a large number of connectors need to be set up on the hard disk backplane 1, the size of the hard disk backplane 1 is large and the number of layers is large, resulting in a large size occupied by the hard disk backplane 1 along the width direction, affecting the ventilation and heat dissipation in the chassis. Even if holes are opened on the surface of the hard disk backplane 1, the heat dissipation effect is still not ideal due to the limited size of the holes on the surface of the hard disk backplane 1. In addition, due to the large amount of signals that the hard disk backplane 1 needs to transmit, the wiring link on the hard disk backplane 1 is long, the signal is significantly attenuated on the hard disk backplane 1, and it is very difficult to improve the signal transmission efficiency on the hard disk backplane 1. It can only rely on the upgrade of large-sized backplane materials to bring about improvements in signal transmission quality, which is costly.

[0036] like Figure 1 and Figure 6 As shown, an embodiment of the present application provides a server, which includes a chassis, a hard disk backplane 1 , at least two flexible circuit boards 2 , and at least two mainboards 3 .

[0037] The hard drive backplane 1 is located within the chassis and has at least two links. At least two flexible circuit boards 2 are connected to the hard drive backplane 1, each flexible circuit board 2 being communicatively connected to one link. Each mainboard 3 is communicatively connected to one flexible circuit board 2.

[0038] Through the present application, since at least two links are provided on the hard disk backplane 1, and each link is connected to a flexible circuit board 2, and at least two main boards 3 are connected through the flexible circuit board 2, a single dual-home hard disk can divide the X4 signal, splitting the X4 signal into two 1:1 X2 signals. The two X2 signals are respectively connected to the two main boards 3 through two flexible circuit boards 2, thereby realizing dual home of the hard disk, avoiding data loss when any main board 3 fails, thereby improving data security, and being suitable for use in high-security industries such as banks and securities.

[0039] On this basis, the flexible circuit board 2 itself is a thin sheet with a thickness of a few tenths of a millimeter, so the flexible circuit board 2 itself occupies a small volume, provides less obstruction in the height direction of the server, and has a simple connection with the hard disk backplane 1, which can overcome the defects of cumbersome wiring and difficult installation caused by a large number of cables, as well as cables blocking the wind and affecting heat dissipation.

[0040] Secondly, in the related art, the hard disk backplane 1 needs to transmit a large amount of signals, and the hard disk backplane 1 is connected to the mainboard 3 via a cable. Therefore, a connector for connecting the cables is required, which makes the hard disk backplane 1 itself larger in size and easily affects the ventilation and heat dissipation in the chassis. The embodiment of the present application uses a mixed-pressure connection between the flexible circuit board 2 and the hard disk backplane 1. The flexible circuit board 2 can replace the hard disk backplane 1 to implement part of the signal interaction function, and the connection between the flexible circuit board 2 and the hard disk backplane 1 does not need to be implemented through a connector, thereby reducing the number of connectors on the hard disk backplane 1 and the number of signals that the hard disk backplane 1 needs to transmit, thereby helping to reduce the size of the hard disk backplane 1 and reduce the number of layers of the hard disk backplane 1, helping to improve the heat dissipation in the chassis and reduce the manufacturing cost of the hard disk backplane 1.

[0041] Therefore, the server of the present application can overcome the problems of easy data loss, cumbersome wiring, difficult installation and easy impact on heat dissipation in servers in related technologies. It can improve data security, is simple to install, and helps to improve the heat dissipation effect of the server.

[0042] X4 and X2 signaling refer to the number of signal lanes in a PCIe (Peripheral Component Interconnect Express) interface. X4 signaling indicates four signal lanes in a PCIe interface. PCIe interfaces with X4 signaling offer higher bandwidth and data transfer rates, making them suitable for devices requiring high bandwidth. X2 signaling indicates two signal lanes in a PCIe interface. While X2 signaling offers lower bandwidth and data transfer rates, it can still meet the needs of some devices.

[0043] It should be noted that in the embodiment of the present application, the number of flexible circuit boards 2 and main boards 3 is not limited, and can be adaptively adjusted according to the usage requirements of the server. For example, in a preferred embodiment, there are two flexible circuit boards 2 and two main boards 3. A dual-way server is equipped with two processors, which can handle more tasks simultaneously, provide double the processing power, and perform better when processing complex calculations and resource-intensive applications, such as data-intensive processes, virtualization, high-performance computing and other scenarios. Two independent processors can more effectively distribute workloads, reduce resource contention, improve overall system performance, and achieve better multi-tasking capabilities. On this basis, the main board 3 of a dual-way server usually has more memory slots and expansion slots, which can support more memory and expansion cards, such as PCIe slots, SATA interfaces, etc., which are convenient for connecting various external devices and expansion cards to meet the needs of different application scenarios.

[0044] A communication connection refers to the exchange of signals between connected devices, enabling communication. Communication connection methods include wired and wireless. Wired connections use physical media such as network cables and optical fibers. For example, computers can be connected to a switch or router via a network cable to achieve communication within a local area network. Wireless connections, such as Wi-Fi, Bluetooth, and Zigbee, utilize radio waves for communication. Wireless connections offer flexibility and convenience, making them suitable for mobile devices and environments where cabling is difficult.

[0045] In one embodiment, the flexible printed circuit board 2 (FPC) is a highly reliable and flexible printed circuit board made of a flexible insulating substrate. It has the characteristics of high wiring density, light weight, thin thickness, and good bendability.

[0046] In one embodiment, the flexible circuit board 2 is preferably made of a substrate material with high ductility, and the thickness of the flexible circuit board 2 is reduced by controlling the number of layers of the flexible circuit board 2, thereby reducing the rigidity of the flexible circuit board 2.

[0047] For example, the substrate material of the flexible circuit board 2 is preferably, but not limited to, polyimide, polyester, polytetrafluoroethylene, polyethylene naphthalate, and liquid crystal display polymer.

[0048] In one embodiment, the routing direction inside the flexible circuit board 2 is preferably set to be consistent with the extension direction of the flexible circuit board 2, so as to avoid the routing inside the flexible circuit board 2 from crossing as much as possible, and can ensure that the stress distribution on the conductor during the bending process is more uniform, and can reduce problems such as wire breakage and damage caused by stress concentration, thereby improving the flexibility and number of bends of the flexible board, extending its service life, and better adapting to bending usage scenarios.

[0049] It should be noted that, in the present application, the internal routing direction of the flexible circuit board 2 is consistent with the extension direction of the flexible circuit board 2, which means that the overall extension trend of the routing within the flexible circuit board 2 is consistent with the extension direction of the flexible circuit board 2. The angle formed between a small number of routing directions and the extension direction of the flexible circuit board 2 does not affect its falling within the protection scope of the present application.

[0050] In one embodiment, Figure 2 As shown, each link of the hard disk backplane 1 includes a stacked backplane signal layer 101 and a backplane power layer 102 , and the flexible circuit board 2 correspondingly includes a flexible board signal layer 201 and a flexible board power layer 202 .

[0051] Through such a setting, the two links on the hard disk backplane 1 can split the X4 signal into two 1:1 X2 signals. The backplane signal layer 101 in each link can be connected to the flexible board signal layer 201, and the backplane power layer 102 can be connected to the flexible board power layer 202, thereby facilitating the connection between the hard disk backplane 1 and the flexible circuit board 2.

[0052] In one embodiment, Figure 2 As shown, the flexible board signal layer 201 includes a first sub-layer 2011 and a second sub-layer 2012 that are stacked.

[0053] The present application increases the number of interactive signals and the flow capacity by adjusting the width of the flexible circuit board 2. By reasonably allocating the number of layers of the flexible circuit board 2, it can ensure that the width of the flexible circuit board 2 itself is moderate, so as not to affect the heat dissipation in the chassis, and the flexibility of the flexible circuit board 2 itself will not be affected by being too thick, thereby reducing the risk of damage to the flexible circuit board 2 during the bending process.

[0054] The flexible board signal layer 201 is set to include a first sublayer 2011 and a second sublayer 2012, which can ensure that the width of the flexible circuit board 2 is smaller than the size of the chassis along the width direction, so as to avoid the flexible circuit board 2 affecting the ventilation and heat dissipation inside the chassis, and the thickness of the flexible circuit board 2 can be within 0.36 mm to ensure the flexibility of the flexible circuit board 2.

[0055] It should be noted that, in the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of technical features indicated. Therefore, features specified as "first" or "second" may explicitly or implicitly include one or more of the aforementioned features.

[0056] In one embodiment, the backplane signal layer 101 includes a third sublayer 1011 and a fourth sublayer 1012 , and the third sublayer 1011 and the fourth sublayer 1012 can be connected to the first sublayer 2011 and the second sublayer 2012 , respectively.

[0057] As a convertible implementation, in an embodiment not shown in the accompanying drawings, the flexible board signal layer 201 can also be adaptively adjusted according to the complexity of the circuit. When the circuit is relatively simple, the flexible board signal layer 201 can also be set to one layer. When the circuit is more complex, the flexible board signal layer 201 can also be set to multiple layers.

[0058] In one embodiment, the flexible board power layer 202 is disposed between the first sub-layer 2011 and the second sub-layer 2012 .

[0059] This arrangement allows the middle flexible circuit board power layer 202 to function as an electromagnetic shielding layer, reducing mutual interference between the first sublayer 2011 and the second sublayer 2012, thereby improving the quality and stability of signal transmission. Furthermore, the first sublayer 2011, the flexible circuit board power layer 202, and the second sublayer 2012 form a symmetrical structure. Through a reasonable layout, the relative positions of the first sublayer 2011, the flexible circuit board power layer 202, and the second sublayer 2012 remain stable when the circuit board is bent or folded, reducing signal transmission interruptions or unstable power supply caused by bending, thereby improving the reliability of the flexible circuit board 2.

[0060] The first sub-layer 2011 and the second sub-layer 2012 can be used to carry high-speed signals, and the flexible board power layer 202 can be used to carry high-speed signals.

[0061] As a convertible implementation, in an embodiment not shown in the drawings, the first sublayer 2011 and the second sublayer 2012 are adjacent, and the flexible board power layer 202 is provided on the upper side or the lower side of the first sublayer 2011 and the second sublayer 2012 .

[0062] In one embodiment, along the thickness direction of the flexible circuit board 2 , the conductive structures in the first sub-layer 2011 , the flexible board power layer 202 , and the second sub-layer 2012 are staggered.

[0063] By making the conductive structure distribution areas in the first sublayer 2011, the flexible board power layer 202 and the second sublayer 2012 different, the thickness of the laminated mixed layer can be further reduced, thereby ensuring the flexibility of the flexible circuit board 2 and reducing the risk of damage to the flexible circuit board 2 during bending.

[0064] Furthermore, in terms of electrical performance, staggering the conductive structure can alter the transmission path of electromagnetic signals and reduce the impact of electromagnetic interference. This is particularly important for high-frequency signal transmission, as it improves signal integrity and stability. Staggered conductive structures can reduce reflections and crosstalk during signal transmission, improving signal quality and speed.

[0065] Secondly, the staggered distribution of the conductive structure can make the stress distribution between the conductive structure layers more uniform when the flexible circuit board 2 is bent or folded, reduce the risk of conductive structure breakage, improve the flexibility and durability of the flexible circuit board 2, and during repeated bending or folding, the staggered distribution of the conductive structure can better withstand mechanical stress, reduce fatigue damage, and extend the service life of the flexible circuit board 2.

[0066] In one embodiment, the conductive structure may be copper foil, but is not limited thereto. For example, in an embodiment not shown in the drawings, the conductive structure may also be made of materials such as aluminum, nickel, gold, silver, copper alloy, nickel alloy or graphene.

[0067] In one embodiment, the thickness of the first sub-layer 2011 and the second sub-layer 2012 is d1, and d1≤0.13 mm.

[0068] The thickness of the flexible board power layer 202 is d2, where d2≤0.1 mm.

[0069] The thickness of the flexible circuit board 2 is d3, and d3≤0.36 mm.

[0070] When the thicknesses of the first sublayer 2011 , the second sublayer 2012 , the flexible board power layer 202 and the flexible circuit board 2 are within the above ranges, the flexibility of the flexible circuit board 2 can be maximized and the rigidity of the flexible circuit board 2 can be reduced.

[0071] In one embodiment, Figure 1 and Figure 6 As shown, the server further includes a horizontal backplane 4. A first connector 401 is provided on the horizontal backplane 4, and a second connector 301 is provided on the mainboard 3. The first connector 401 is plugged into the second connector 301, and the flexible circuit board 2 is communicatively connected to the mainboard 3 through the horizontal backplane 4.

[0072] The horizontal backplane 4 itself can be connected to the flexible circuit board 2 by mixed pressure to simplify the connection process between the flexible board and the horizontal backplane 4. The horizontal backplane 4 itself can be hot-plugged and connected to the mainboard 3 through the first connector 401.

[0073] Through such a setting, a hot-swappable connection can be achieved between the horizontal backplane 4 and the mainboard 3. When the mainboard 3 fails and needs to be maintained, the faulty mainboard 3 can be maintained without powering off the equipment, ensuring that data is not lost, thereby improving data stability.

[0074] The horizontal backplane 4 is a circuit board used to connect the mainboard 3 and the flexible circuit board 2. It is typically made of a rigid material, possessing a certain degree of hardness and strength, providing stable support for the connection. Furthermore, the horizontal backplane 4 is connected to the flexible circuit board 2, leveraging the flexible nature of the flexible circuit board 2 to facilitate connection and wiring in various spatial layouts, adapting to the complex internal structures of various electronic devices. Printed circuits are designed on the horizontal backplane 4 for signal transmission and power distribution.

[0075] It should be noted that in the embodiment of the present application, the plane of the horizontal backplane 4 is set to be parallel to the plane of the mainboard 3. For example, in most cases, the server is horizontally placed, the plane of the mainboard 3 is parallel to the horizontal plane, and the plane of the horizontal backplane 4 is also set to be parallel to the horizontal plane.

[0076] As a convertible implementation mode, in an embodiment not shown in the accompanying drawings, the server is a vertical server. In this case, the mainboard 3 extends in the vertical direction, and the horizontal backplane 4 is also configured to extend in the vertical direction, which does not affect its falling within the scope of protection required by this application.

[0077] The type and specifications of the first connector 401 are determined according to specific application requirements. For example, in an optional embodiment, the first connector 401 and the second connector 301 are high-density connectors.

[0078] For example, in an optional embodiment, the first connector 401 is a high-density male connector, and the second connector 301 is a high-density female connector.

[0079] As a convertible implementation, in an embodiment not shown in the drawings, the first connector 401 and the second connector 301 can be pin-type connectors, socket-type connectors or other specially designed connectors to ensure reliable electrical connection and mechanical fixation.

[0080] As a convertible implementation, in an embodiment not shown in the drawings, the flexible circuit board 2 is connected to a first connector 401 , and the first connector 401 is plugged into the second connector 301 .

[0081] For example, a ZIF connector may be connected to the flexible circuit board 2. A ZIF (Zero Insertion Force) connector connects the flexible circuit board to the motherboard 3 via a socket with a clip. When inserting or removing the flexible circuit board, no additional insertion force is required because the clip design automatically grips and releases the gold fingers of the flexible circuit board.

[0082] As another alternative embodiment, not shown in the accompanying drawings, the flexible circuit board 2 and the horizontal backplane 4 are connected via a pin header connector. Pin header connectors are a common board-to-board connector that achieve an electrical connection between the flexible circuit board 2 and the horizontal backplane 4 by soldering pin headers and female connectors to the two. This connector offers advantages such as reliable connection and stable signal transmission, making it suitable for applications requiring high-quality signal transmission.

[0083] As a convertible implementation, in an embodiment not shown in the accompanying drawings, the flexible circuit board 2 and the horizontal backplane 4 can also be connected using HDI (high-density interconnection) technology, and electrical conduction between the flexible circuit board 2 and the horizontal backplane 4 can be achieved by connecting between layers.

[0084] In a preferred embodiment, a cushion and a spacer layer are provided between the flexible circuit board and the connector of the mainboard 3 to prevent the connector from damaging the flexible circuit board or the mainboard 3. The cushion can be made of a soft material such as a foam pad, and the spacer layer can be made of a smooth material such as a plastic layer to prevent the connector from scratching the flexible circuit board or generating fine particles.

[0085] As an alternative embodiment, not shown in the accompanying figures, the flexible circuit board 2 is directly connected to the mainboard 3 using a hybrid pressure connection, thereby forming a rigid-flexible board. This structure improves the overall strength and stability of the circuit board while ensuring a flexible connection, reducing deformation and damage during hot-swap operations.

[0086] In one embodiment, Figure 5 As shown, the horizontal backplane 4 includes a backplane body 402, a third connector 403 and a connecting line.

[0087] Among them, at least three links are provided on the backplane body 402. The at least three links include a first link, a second link, and a third link. The first link is communicatively connected to the flexible circuit board 2. The second link and the third link are connected between the first link and the mainboard 3. The third connector 403 is connected to the backplane body 402 and is communicatively connected to the second link and the third link. The third connectors 403 of the two horizontal backplanes 4 can be communicatively connected via a connecting line.

[0088] The third connector 403 can be used to achieve signal and power interconnection between the two horizontal backplanes 4. By replacing the flexible circuit board 2 and the hard disk backplane 1 with the third connector 403 to achieve interconnection, the signal and power lines inside the flexible circuit board 2 can be reduced, thereby reducing the width and thickness of the flexible circuit board 2, so as to ensure the flexibility of the flexible circuit board 2 while avoiding the flexible circuit board 2 blocking the ventilation and heat dissipation inside the chassis.

[0089] On this basis, when one of the horizontal backplanes 4 or one of the mainboards 3 fails, the signal of the faulty horizontal backplane 4 or mainboard 3 can be transmitted to the intact horizontal backplane 4 and mainboard 3 through the third connector 403 and the connecting line, thereby realizing the interaction between the hard disk and the mainboard 3 with the help of the intact horizontal backplane 4 and mainboard 3, and alarming the failure of the mainboard 3 or the horizontal backplane 4, thereby realizing redundant design of signals and power supply, ensuring data security, and reminding the operator to repair the faulty horizontal backplane 4 and mainboard 3 in time.

[0090] In addition, the third connector 403 can also ensure that when problems occur in the power supply and key signal interconnection of any horizontal backplane 4, redundant design of signals and power supply can be achieved through the interconnection cables between the two horizontal backplanes 4.

[0091] For example, in an optional embodiment, the third link and the fourth link respectively include a horizontal board signal layer 405 and a horizontal board power layer 406. The horizontal board signal layer 405 includes a fifth sublayer 4051 and a sixth sublayer 4052.

[0092] As a convertible implementation, in an embodiment not shown in the drawings, the connection between the two horizontal backplanes 4 is achieved through a flexible connector, and both ends of the flexible connector are respectively connected to one horizontal backplane 4 in a mixed pressure manner.

[0093] In one embodiment, a guide protrusion 404 is provided on one of the horizontal back plate 4 and the main plate 3 , and a guide groove 302 is provided on the other of the horizontal back plate 4 and the main plate 3 .

[0094] Through such a setting, during the process of mutual plugging of the first connector 401 of the horizontal backplane 4 and the second connector 301 of the mainboard 3, the guide protrusion 404 can be inserted into the guide groove 302 and guide the first connector 401 to align with the second connector 301 to achieve a blind plug connection between the horizontal backplane 4 and the mainboard 3.

[0095] The guide protrusion 404 is preferably, but not limited to, a guide pin or a guide needle. In one embodiment, the guide groove 302 is formed on the inner circumference of the guide sleeve. As an alternative embodiment, in an embodiment not shown in the drawings, the guide groove 302 can be directly formed on the horizontal back plate 4 or the main plate 3.

[0096] In one embodiment, the guide protrusion 404 is formed on the horizontal back plate 4 , and the guide groove 302 is formed on the main plate 3 .

[0097] As an alternative implementation, in an embodiment not shown in the drawings, the guide protrusion 404 is formed on the main plate 3 , and the guide groove 302 is formed on the horizontal back plate 4 .

[0098] In one embodiment, the guide protrusions 404 are provided in pairs on the horizontal back plate 4 and are respectively provided on both sides of the first connector 401 ; the guide grooves 302 are provided in pairs on the main board 3 and are respectively provided on both sides of the second connector 301 .

[0099] By such a setting, the horizontal backplane 4 can be prevented from tilting during the process of being plugged into the mainboard 3, and a blind plug connection between the horizontal backplane 4 and the mainboard 3 can be achieved, thereby ensuring that the horizontal backplane 4 can be quickly and accurately docked with the mainboard 3, reducing the time required for the plugging operation, helping to improve the assembly efficiency of the server, and avoiding multiple plugging and unplugging attempts due to misalignment of the plugging, reducing the connection efficiency, and even causing damage to the connector.

[0100] In one embodiment, the guide protrusions 404 are arranged on both sides of the horizontal back plate 4 in the vertical direction. As a convertible embodiment, in an embodiment not shown in the accompanying drawings, the guide protrusions 404 can also be optionally arranged on both sides of the horizontal back plate 4 in the horizontal direction.

[0101] In one embodiment, the guide grooves 302 are arranged on both sides of the main board 3 in the vertical direction. As a variable implementation method, in an embodiment not shown in the accompanying drawings, the guide grooves 302 can also be optionally arranged on both sides of the horizontal back panel 4 in the horizontal direction.

[0102] In one embodiment, at least two motherboard trays spaced apart in the vertical direction are further provided in the server, and each motherboard tray can be fixed with a motherboard 3 .

[0103] The horizontal backplane 4 can be optionally plugged into the mainboard 3 and limited to the mainboard tray.

[0104] As a convertible implementation, in an embodiment not shown in the accompanying drawings, the horizontal backplane 4 is limited by a separate limiting bracket, or is fixed to the chassis by limiting members such as buckles or clips to ensure the stability of the horizontal backplane 4.

[0105] In one embodiment, the hard disk backplane 1 includes a board body 103 , a first hard disk connector 104 , a hard disk interface adapter board 105 and a second hard disk connector 106 .

[0106] The first hard disk connector 104 is provided on the board body 103 and can be plugged into the first hard disk. The hard disk interface adapter board 105 is connected to the first hard disk connector 104. The second hard disk connector 106 is connected to the hard disk interface adapter board 105 and can be plugged into the second hard disk.

[0107] The interaction between the hard drive and the hard drive backplane 1 is achieved through the plugging of hard drive connectors. Different types of hard drives require different types of hard drive connectors. In this embodiment, the hard drive backplane 1 is provided with a first connector 401, which is connected to a second hard drive connector 106 via a hard drive interface adapter board 105. This allows the same hard drive backplane 1 to be plugged into two different hard drives, thereby expanding the application range of the hard drive backplane 1 and reducing the development effort for a single hard drive backplane 1.

[0108] As a convertible implementation, in an embodiment not shown in the drawings, only one type of hard disk connector is provided on the hard disk backplane 1 and is suitable for plugging with one type of hard disk.

[0109] For example, when a U.2 NVME SSD (i.e., a solid-state drive with a U.2 interface and NVMe protocol) is configured, the hard disk backplane 1 may optionally be connected with a U.2 connector (SFF-8639 connector. It is an interface standard for high-speed serial connections in servers and storage systems, supporting PCIe and SAS protocols).

[0110] When configuring an EDSFF SSD (Enterprise and Data Center SSD Form Factor, a solid-state drive with a standard form factor for enterprise and data center storage), the hard disk backplane 1 can optionally be connected to an EDSFF connector.

[0111] In one embodiment, Figure 3 As shown, the first hard disk connector 104 is a U.2 connector, and the second hard disk connector 106 is an EDSFF connector.

[0112] Through such a setting, the hard disk backplane 1 of the embodiment of the present application can be suitable for both traditional U.2 hard disks and new generation hard disks based on the EDSFF specification, such as E3.S / L hard disks, etc., and can meet the usage requirements of most hard disks on the market.

[0113] On this basis, the U.2 connector is connected to the EDSFF connector via a U.2 connector to EDSFF connector interface adapter board. Since the EDSFF connector is smaller than the U.2 connector, the EDSFF mating connector is placed on the hard drive backplane 1, which helps reduce the cost of the hard drive backplane 1 and avoids occupying the ventilation area in the chassis. On this basis, the EDSFF connector can currently meet the PCIE 6.0 transmission requirements and is more conducive to subsequent rate evolution.

[0114] Among them, the connection between the U.2 connector and the U.2 connector to EDSFF connector interface adapter board, and the connection between the U.2 connector to EDSFF connector interface adapter board and the EDSFF connector are preferably but not limited to welding connections.

[0115] In one embodiment, the U.2 connector typically has a specific pinout and interface shape, and the U.2 connector to EDSFF connector interface adapter board is designed with a corresponding interface for receiving the U.2 connector. The U.2 connector is inserted into the corresponding interface of the U.2 connector to EDSFF connector interface adapter board, ensuring that the pins are aligned accurately to achieve a physical connection.

[0116] In one embodiment, the other end of the U.2 connector to EDSFF connector interface adapter board is typically designed with an interface that matches the EDSFF connector. The interface of the adapter board is mated with the EDSFF connector to ensure that the interface shape and pin arrangement are consistent to achieve physical connection.

[0117] As a convertible implementation, in an embodiment not shown in the accompanying drawings, the board body 103 may optionally be connected to an EDSFF connector, the EDSFF connector is connected to an EDSFF connector to U.2 connector interface adapter board, and the U.2 connector is connected to the EDSFF connector to U.2 connector interface adapter board.

[0118] In one embodiment, Figure 7 and Figure 8 As shown, a fixing portion is provided in the chassis, and the fixing portion is located on one side of the flexible circuit board 2 . The server further includes a fixing member 5 .

[0119] The fixing member 5 includes a fixing member body 501 , a first connecting portion 502 and a mounting surface 503 .

[0120] The first connection portion 502 is formed on the fixing body 501 and is used to connect to the fixing portion. The mounting surface 503 is formed on the fixing body 501. The second connection portion 504 is formed on the mounting surface 503. The second connection portion 504 is used to connect to the flexible circuit board 2. In the direction from the hard disk backplane 1 to the motherboard 3, the mounting surface 503 is inclined toward the direction close to the corresponding motherboard 3, such as Figure 6 and Figure 8 As shown, the acute angle A formed between the mounting surface 503 and the horizontal plane is less than 30°.

[0121] With this arrangement, fixing member 5 can be connected to the fixing portion via first connecting portion 502, thereby being fixed inside the server chassis. Furthermore, flexible circuit board 2 can be connected to mounting surface 503 via second connecting portion 504, conforming to the surface of mounting surface 503. This not only improves the reliability of flexible circuit board 2's fixation, but also allows mounting surface 503 to guide the direction of flexible circuit board 2. When the acute angle formed between mounting surface 503 and the horizontal plane is set to less than 30°, the maximum angle of flexible circuit board 2 is guaranteed to be less than 30°, minimizing stress concentration caused by bending of the flexible circuit board.

[0122] In one embodiment, the first connecting portion 502 is a buckle, and a mounting hole is formed on the flexible circuit board 2. The buckle can pass through the mounting hole of the flexible circuit board 2, thereby limiting the position of the flexible circuit board 2.

[0123] It should be noted that, in the embodiment of the present application, the number of the first connecting parts 502 is not limited, so long as the connection between the fixing member 5 and the fixing part can be ensured to be reliable.

[0124] For example, in a preferred embodiment, the number of the first connecting parts 502 is at least two, which can ensure that the fixing part 5 is reliably fixed on the fixing part, the fixing part 5 is not easy to shake under the action of external force, and the installation efficiency of the fixing part 5 will not be affected due to the excessive number of fixing parts 5, thereby increasing the installation cost of the fixing part 5.

[0125] It should be noted that, in the embodiment of the present application, the number of the second connection parts 504 is not limited, so as to ensure a reliable connection between the flexible circuit board 2 and the fixing member 5 .

[0126] For example, in an optional embodiment, the number of the second connecting parts 504 is two, and they are spaced apart along the extension direction of the flexible circuit board 2, which can reliably fix the flexible circuit board 2, ensure that the shape of the flexible circuit board 2 is consistent with the mounting surface 503, and avoid shaking of the flexible circuit board 2 after being connected to the fixing member 5. The large number of connecting parts will not cause excessive occupation of the area of the flexible circuit board 2, and avoid increasing the manufacturing cost of the fixing member 5.

[0127] In a preferred embodiment, when the fixing member 5 is connected to the fixing portion, the two second connecting portions 504 are arranged at intervals in the horizontal direction. By such an arrangement, it is possible to easily control the inclination angle of the mounting surface 503, thereby ensuring that when the flexible circuit board 2 is connected to the mounting surface 503, the acute angle between the flexible circuit board 2 and the horizontal plane is less than 30°.

[0128] As a changeable implementation, in an embodiment not shown in the drawings, the connection between the flexible circuit board 2 and the fixing member 5 can also be selected to be bonding or the like.

[0129] The second connection portion 504 is a connection hole.

[0130] The fastener can pass through the fixing portion and the connecting hole, thereby achieving a reliable connection between the fixing member 5 and the fixing portion.

[0131] As a convertible implementation, in some embodiments not shown in the drawings, the connection between the fixing portion and the fixing member 5 can also be selected to be riveted, clamped or bonded.

[0132] As an alternative embodiment, in an embodiment not shown in the accompanying drawings, the fixing member 5 is formed with a first connecting hole and a second connecting hole connected to each other. The first connecting hole has a larger diameter than the second connecting hole, and the second connecting hole is formed on a convex bump. The first connecting hole of the fixing member 5 can be inserted over an I-shaped nail on the side wall of the chassis. The fixing member 5 is then moved to slide the I-shaped nail into the second connecting hole. The convex bump can then abut against the protruding head of the I-shaped nail, thereby tightening the fixing member 5 against the side wall of the chassis.

[0133] In an optional embodiment, the fixing member body 501 includes a first folding plate 5011 and a second folding plate 5012 .

[0134] The mounting surface 503 is formed on the first folding plate 5011. The second folding plate 5012 is arranged at an angle to the first folding plate 5011, and the second connecting portion is formed on the second folding plate 5012.

[0135] In an optional embodiment, the fixing body 501 further includes a reinforcing rib 5013. The reinforcing rib 5013 is connected between the first folding plate 5011 and the second folding plate 5012. The reinforcing rib 5013 can be used to enhance the structural strength of the fixing body 501.

[0136] In an optional embodiment, the fixing portion is the side wall of the chassis, the fixing members 5 are arranged in pairs and are respectively connected to the two side walls of the chassis, and each pair of fixing members 5 can be connected to the flexible circuit board 2 on both sides of the flexible circuit board 2.

[0137] By such an arrangement, the fixing member 5 can be connected to the flexible circuit board 2 on both sides of the flexible circuit board 2, thereby reliably limiting the flexible circuit board 2 and preventing vibration from affecting the reliability of the operation of the flexible circuit board 2. In addition, the fixing member 5 is connected to the side wall of the chassis, and there is no need to add other components in the chassis, which helps to reduce the number of parts in the server and can avoid increasing the wind resistance in the chassis due to the addition of a fixing part.

[0138] As a convertible implementation, in an embodiment not shown in the drawings, the fixing portion is independently provided and connected to the bottom and / or side wall of the chassis.

[0139] As an alternative implementation, in another embodiment not shown in the drawings, the fixing member 5 is provided on only one side of the flexible circuit board 2 .

[0140] In an optional embodiment, at least two main boards 3 are spaced apart in the vertical direction, and the flexible circuit boards 2 are arranged in pairs and are respectively connected to the top and bottom of the hard disk backplane 1 assembly.

[0141] By setting it in this way, it can be ensured that the flexible circuit board 2 does not occupy the space on the left and right sides of the chassis, so that the hard disk can be placed in the entire width direction of the chassis, and the number of hard disks is maximized.

[0142] On this basis, the two flexible circuit boards 2 are connected to the hard disk backplane 1 at the top and bottom of the hard disk backplane 1 respectively, which can ensure a smooth transition of the flexible circuit board 2 as a whole, avoid the flexible circuit board 2 from bending at a large angle during the extension process, avoid the flexible circuit board 2 from breaking, and ensure the reliability of the flexible circuit board 2.

[0143] In one embodiment, Figure 6 As shown, the bottom height of the hard disk backplane 1 is lower than the corresponding horizontal backplane 4, and the top height of the hard disk backplane 1 is higher than the corresponding horizontal backplane 4. Along the direction from the hard disk backplane 1 to the horizontal backplane 4, the top flexible circuit board 2 is bent downward, and the bottom flexible circuit board 2 is bent upward.

[0144] As a convertible embodiment, in an embodiment not shown in the accompanying drawings, the hard disk backplane 1 can also be set so that the top height and the bottom height are both higher than the corresponding horizontal backplane 4, or the top height and the bottom height are both lower than the corresponding horizontal backplane 4.

[0145] As a convertible implementation, in an embodiment not shown in the drawings, two flexible circuit boards 2 are connected to the hard disk backplane 1 on the left and right sides of the hard disk backplane 1 respectively.

[0146] In an optional embodiment, a through hole 203 is formed on the flexible circuit board 2 .

[0147] When the flexible circuit board 2 is bent, stress concentration occurs in the bending area. Providing through-holes 203 disperses the stress around through-holes 203, reducing the degree of stress concentration and thereby lowering the risk of the circuit board fracturing due to excessive stress during the bending process. Furthermore, through-holes 203 also provide a certain amount of deformation space for the material of the flexible circuit board 2 during bending, allowing the material to better adapt to shape changes during the bending process, reducing fractures caused by limited material deformation, and improving the reliability of the flexible circuit board 2. Secondly, during the process of providing through-holes 203, some defects within the material of the flexible circuit board 2, such as impurities and bubbles, can be removed, thereby improving the quality and uniformity of the material and reducing the risk of fractures caused by internal defects. Furthermore, through-holes 203 themselves can also be used to allow airflow, thereby facilitating ventilation and heat dissipation within the chassis.

[0148] In a preferred embodiment, the through hole 203 is formed in the bending area of the flexible circuit board 2 , thereby improving the reliability of the flexible circuit board 2 while avoiding occupying the space for wiring on the flexible circuit board 2 .

[0149] As an alternative implementation, in an embodiment not shown in the drawings, the through holes 203 are distributed at intervals throughout the flexible circuit board 2 .

[0150] In one embodiment, the through holes 203 are formed in the middle of the flexible circuit board 2 and are spaced apart along the length direction of the flexible circuit board 2 .

[0151] It should be noted that in the embodiments of the present application, the shape of the through hole 203 is not limited. For example, in one optional embodiment, the through hole 203 is a waist-shaped hole. As an alternative embodiment, in some embodiments not shown in the drawings, the through hole 203 can also be a circular hole, a square hole, an elliptical hole, a trapezoidal hole, or a special-shaped hole.

[0152] In one embodiment, Figure 4 As shown, the hard disk backplane 1 is press-fitted with the flexible circuit board 2. With this arrangement, the hard disk backplane 1 can be integrated with the flexible circuit board 2 by mixing and pressing during the processing stage, which greatly simplifies the connection process between the hard disk backplane 1 and the flexible circuit board 2.

[0153] On this basis, since the flexible circuit board 2 has good flexibility and bendability, it can adapt to different installation environments and space requirements. After being mixed-pressure connected with the hard disk backplane 1, it can better adapt to the tiny vibrations and displacements during the operation of the hard disk, reduce the unstable or interrupted signal transmission caused by vibration, and ensure the continuity and reliability of data transmission.

[0154] When the flexible circuit board 2 and the hard disk backplane 1 are connected at mixed voltage, reasonable wiring and electromagnetic shielding design can effectively reduce the impact of electromagnetic interference on signal transmission, improve the quality and stability of signal transmission, and reduce data transmission errors and packet loss.

[0155] Furthermore, the mixed-voltage connection between the flexible circuit board 2 and the hard drive backplane 1 reduces the complexity of connection points and wiring, thereby saving space and reducing costs. This mixed-voltage connection also improves production efficiency and product quality, reducing scrap and rework rates during the production process. During equipment maintenance and upgrades, the mixed-voltage connection between the flexible circuit board 2 and the hard drive backplane 1 facilitates component replacement or repair. Due to the flexible nature of the flexible circuit board 2, component replacement or repair requires no disassembly and rewiring of the entire circuit board; only the portion requiring replacement or repair needs to be repaired. This reduces maintenance difficulty and costs, and improves the maintainability and upgradeability of the equipment.

[0156] In one embodiment, the upper and lower parts of the hard disk backplane 1 are respectively provided with rigid-flex joints, and the hard disk backplane 1 is connected to the flexible circuit board 2 through the rigid-flex joints.

[0157] The flexible circuit board 2 is connected to the end of the hard disk backplane 1, which can reduce problems such as reflection and crosstalk during signal transmission, make signal transmission more stable, reduce signal attenuation, improve transmission quality, reduce data transmission errors, and have better electromagnetic compatibility. It can better control electromagnetic radiation and anti-interference capabilities, reduce the impact of electromagnetic interference on signal transmission, and enable the hard disk system to work stably even in complex electromagnetic environments.

[0158] As a convertible implementation, the connection between the flexible circuit board 2 and the hard disk backplane 1 can be selected as a welding connection or a board-to-board connector connection.

[0159] For example, in an embodiment not shown in the accompanying drawings, the flexible circuit board 2 and the hard drive backplane 1 are connected via a pin header connector. Pin header connectors are a common board-to-board connector that achieves an electrical connection between the flexible circuit board 2 and the hard drive backplane 1 by soldering pin headers and female connectors to the two. This connector offers advantages such as reliable connection and stable signal transmission, making it suitable for applications requiring high-quality signal transmission.

[0160] As a convertible implementation, in an embodiment not shown in the accompanying drawings, the flexible circuit board 2 and the hard disk backplane 1 can also be connected using HDI (high density interconnection) technology, and electrical conductivity between the flexible circuit board 2 and the hard disk backplane 1 can be achieved by connecting between layers.

[0161] It should be noted that the flexible circuit board 2 in the embodiment of the present application is first processed into one piece with the hard disk backplane 1 during the processing. Then, when the hard disk backplane 1 and the flexible circuit board 2 are installed, the flexible circuit board 2 is fixed on the fixing part 5 and the bending angle of the flexible circuit board 2 is ensured.

[0162] In one embodiment, the server is also equipped with an air cooling mechanism, and the hard drive backplane 1 can be positioned upstream or downstream of the air cooling mechanism's outlet direction. When the hard drive backplane 1 is positioned upstream of the air flow direction, cool air first flows through the hard drive backplane 1, removing heat generated by the hard drives before flowing to other components such as the CPU and memory. This improves the overall system's heat dissipation efficiency and prevents hard drive performance degradation or failure due to overheating.

[0163] In one embodiment, the server further includes a hard disk, which can be plugged into the hard disk backplane 1 .

[0164] In summary, the server of the embodiment of the present application has the following beneficial effects:

[0165] 1. The server of the embodiment of the present application achieves dual hard drive ownership through the flexible circuit board 2. Compared with solutions using hard board connections or cables, it has greater advantages in improving production convenience, optimizing heat dissipation of the entire machine, and reducing single points of failure.

[0166] 2. In the server of the embodiment of the present application, the flexible circuit board 2 and the horizontal backplane 4 can replace the hard disk to realize the function of partial signal interaction, thereby reducing the signal complexity of the hard disk backplane 1, and further helping to reduce the size and number of layers of the hard disk backplane 1. This not only reduces the wind resistance of the entire system, but also avoids the defects such as long routing links on the hard disk backplane 1, large signal attenuation, which is not conducive to improving signal transmission efficiency, and high failure rate caused by integrating all signals on the hard disk backplane 1. In addition, there is no need to upgrade the backplane material of a large size to achieve improvement in signal transmission quality, which helps to reduce the investment cost of the hard disk backplane 1.

[0167] 3. The server of the embodiment of the present application provides a hard drive adapter board design solution that converts the U.2 interface to the EDSFF interface, so that the EDSFF backplane is compatible with both U.2 hard drives and EDSFF hard drives, reducing the types of hard drive backplanes 1 to be developed and reducing the development workload of the hard drive backplane 1;

[0168] 4. The server of the embodiment of the present application provides a signal layering and interconnection solution for the hard disk backplane 1, the flexible circuit board 2, and the horizontal backplane 4, realizing the layered design of internal signal redundancy of the board.

[0169] 5. A fixing member 5 for fixing the flexible circuit board 2 is provided, which can ensure the fixing reliability of the flexible circuit board 2 and ensure that the maximum opening angle of the flexible circuit board 2 is less than 30°, thereby minimizing the stress concentration caused by the bending of the flexible circuit board 2.

[0170] The above is a detailed introduction to a server provided by the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only intended to help understand the method and core ideas of the present application. It should be noted that, for those skilled in the art, without departing from the principles of the present application, several improvements and modifications may be made to the present application, and such improvements and modifications also fall within the scope of protection claimed by the present invention.

Claims

1. A server, characterized in that: include: Chassis; A hard disk backplane (1) is provided in the chassis, and at least two links are provided on the hard disk backplane (1); At least two flexible circuit boards (2) are connected to the hard disk backplane (1), and each of the flexible circuit boards (2) is communicatively connected to one of the links; At least two mainboards (3), each mainboard (3) being communicatively connected to one flexible circuit board (2); the hard disk backplane (1) being capable of dividing an X4 signal into two 1:1 X2 signals, the two X2 signals being connected to the two mainboards (3) respectively through the two flexible circuit boards (2); A horizontal backplane (4), the flexible circuit board (2) and the horizontal backplane (4) are connected in a mixed pressure manner, a first connector (401) is provided on the horizontal backplane (4), a second connector (301) is provided on the mainboard (3), and the first connector (401) and the second connector (301) are plugged into each other.

2. The server according to claim 1, wherein: Each link of the hard disk backplane (1) comprises a backplane signal layer (101) and a backplane power layer (102) that are stacked, and the flexible circuit board (2) correspondingly comprises a flexible board signal layer (201) and a flexible board power layer (202).

3. The server according to claim 2, wherein: The flexible board signal layer (201) comprises a first sublayer (2011) and a second sublayer (2012) which are stacked.

4. The server according to claim 3, wherein: The flexible board power supply layer (202) is provided between the first sub-layer (2011) and the second sub-layer (2012).

5. The server according to claim 3, wherein: Along the thickness direction of the flexible circuit board (2), the conductive structures in the first sub-layer (2011), the flexible board power supply layer (202) and the second sub-layer (2012) are staggered.

6. The server according to claim 3, wherein: The thickness of the first sublayer (2011) and the second sublayer (2012) is d1, d1≤0.13mm; and / or, The thickness of the flexible board power supply layer (202) is d2, d2≤0.1mm; and / or, The thickness of the flexible circuit board (2) is d3, d3≤0.36mm.

7. The server according to any one of claims 1 to 6, characterized in that: The flexible circuit board (2) is communicatively connected to the main board (3) via the horizontal backplane (4).

8. The server according to claim 7, wherein: The horizontal back plate (4) comprises: A backplane body (402) is provided with at least three links, the at least three links including a first link, a second link and a third link, the first link being communicatively connected to the flexible circuit board (2), the second link and the third link being connected between the first link of the mainboard (3) and the mainboard (3); A third connector (403) is connected to the backplane body (402) and is in communication with the second link and the third link: A connecting line, through which the third connectors (403) of the two horizontal backplanes (4) can be communicatively connected.

9. The server according to claim 7, wherein: A guide protrusion (404) is provided on one of the horizontal back plate (4) and the main plate (3), and a guide groove (302) is provided on the other of the horizontal back plate (4) and the main plate (3).

10. The server according to claim 9, wherein: The guide protrusions (404) are arranged in pairs on the horizontal backplane (4) and are respectively arranged on both sides of the first connector (401); the guide grooves (302) are arranged in pairs on the mainboard (3) and are respectively arranged on both sides of the second connector (301).

11. The server according to any one of claims 1 to 6, characterized in that: The hard disk backplane (1) comprises: Board body(103); A first hard disk connector (104) is provided on the board body (103) and can be plugged into a first hard disk; A hard disk interface adapter plate (105), connected to the first hard disk connector (104); The second hard disk connector (106) is connected to the hard disk interface adapter plate (105) and can be plugged into a second hard disk.

12. The server according to claim 11, wherein: The first hard disk connector (104) is a U.2 connector, and the second hard disk connector (106) is an EDSFF connector.

13. The server according to any one of claims 1 to 6, characterized in that: A fixing portion is provided in the chassis, and the fixing portion is located on one side of the flexible circuit board (2). The server further comprises a fixing member (5), comprising: Fixing member body (501); a first connecting portion (502), formed on the fixing member body (501), and used for connecting to the fixing portion; A mounting surface (503) is formed on the fixing member body (501), and a second connecting portion (504) is formed on the mounting surface (503). The second connecting portion (504) is used to connect the flexible circuit board (2). In the direction from the hard disk backplane (1) to the main board (3), the mounting surface (503) is inclined toward the direction close to the corresponding main board (3), and the acute angle formed between the mounting surface (503) and the horizontal plane is less than 30°.

14. The server according to claim 13, wherein: The first connecting portion (502) is a snap-fit, and a mounting hole is formed on the flexible circuit board (2); and / or, The second connecting portion (504) is a connecting hole.

15. The server according to claim 13, wherein: The fixing member body (501) comprises: a first folding plate (5011), the mounting surface (503) being formed on the first folding plate (5011); The second folding plate (5012) is arranged at an angle to the first folding plate (5011), and the second connecting portion is formed on the second folding plate (5012).

16. The server according to claim 15, wherein: The fixing member body (501) further includes: A reinforcing rib (5013) is connected between the first folding plate (5011) and the second folding plate (5012).

17. The server according to claim 13, wherein: The fixing portion is a side wall of the chassis, the fixing members (5) are arranged in pairs and are respectively connected to the side walls on both sides of the chassis, and each pair of the fixing members (5) can be connected to the flexible circuit board (2) on both sides of the flexible circuit board (2).

18. The server according to any one of claims 1 to 6, characterized in that: At least two main boards (3) are arranged at intervals in the vertical direction, and the flexible circuit boards (2) are arranged in pairs and are respectively connected to the top and bottom of the hard disk backboard (1) assembly.

19. The server according to any one of claims 1 to 6, characterized in that: A through hole (203) is formed on the flexible circuit board (2).

20. The server according to any one of claims 1 to 6, characterized in that: The hard disk backplane (1) is press-connected with the flexible circuit board (2).

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