Electronic device
By designing a shell structure with a heat sink in a solid-state drive, and using the airflow channel and support surface to enhance the heat dissipation effect, the problem of the reading and writing speed of the solid-state drive due to excessive temperature is solved, and a more efficient heat dissipation effect is achieved.
Patent Information
- Application Number
- CN202311607225.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-11-28
- Publication Date
- 2025-05-30
AI Technical Summary
The temperature of solid-state hard disks is too high due to the heat generated by internal electronic components, which reduces the reading and writing speed, and the prior art is difficult to effectively improve its heat dissipation efficiency.
An electronic device is designed including a housing, circuit assembly and a heat sink. The housing forms an airflow channel through the air inlet and the air outlet, and the heat sink is arranged between the first and second circuit boards, and is stably fixed by the support surface and the convex column to increase the contact area with the air to improve the heat dissipation effect.
By optimizing the design of the heat sink and the structure of the shell, the heat dissipation efficiency of the solid-state hard disk is significantly improved, and the problem of decreasing read and write speed due to excessive temperature is avoided.
Smart Images
Figure CN120071979A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to an electronic device. More specifically, the present invention relates to a solid-state drive (SSD) with a heat sink. Background Art
[0002] Due to the characteristics of fast read and write speed, light weight, and no noise of solid-state drives, they have been widely used by consumers.
[0003] However, as the capacity and speed of solid-state drives gradually increase, the heat generated by their internal electronic components is also increasing, so problems such as a decrease in read and write speed due to excessive temperature often occur.
[0004] In view of this, how to improve the heat dissipation efficiency of solid-state drives to avoid excessive temperature has become an important challenge for researchers in this technical field. Summary of the Invention
[0005] In view of the foregoing conventional problems, an embodiment of the present invention provides an electronic device, including a housing and a circuit assembly. The housing includes a lower housing and an upper housing connected to each other. An air inlet and an air outlet are formed between the lower housing and the upper housing. An air flow enters the electronic device through the air inlet and exits the electronic device through the air outlet. The circuit assembly is disposed inside the housing and includes a first circuit board, a second circuit board, and a heat sink. The heat sink is disposed between the first circuit board and the second circuit board.
[0006] In an embodiment, the electronic device further includes a connection unit electrically connecting the first circuit board and the second circuit board.
[0007] In an embodiment, the electronic device further includes a central processing unit, a plurality of memory elements, and a plurality of flash memories. The central processing unit and the memory elements are disposed on the first circuit board, and the flash memories are disposed on the second circuit board.
[0008] In an embodiment, the electronic device further includes a plurality of capacitor elements disposed on the same side of the heat sink and electrically connected to the first circuit board.
[0009] In an embodiment, the heat sink has a first groove and a second groove for respectively accommodating the connection unit and the capacitor elements.
[0010] In an embodiment, the connection unit includes a flexible circuit board or an electrical connector.
[0011] In one embodiment, the aforementioned electronic device further includes a screw. The aforementioned lower housing is formed with a protruding post. The aforementioned screw passes through the aforementioned upper housing and is locked into the aforementioned protruding post, and the aforementioned protruding post is formed with a supporting surface for supporting the aforementioned heat sink.
[0012] In one embodiment, the aforementioned electronic device further includes a first locking member and a second locking member. The aforementioned first locking member passes through the aforementioned first circuit board and is locked into the aforementioned lower housing, and the aforementioned second locking member passes through the aforementioned second circuit board and is locked into the tail end of the first locking member.
[0013] In one embodiment, the aforementioned electronic device further includes a positioning post fixed on the aforementioned first circuit board, and the aforementioned positioning post is formed with a convex portion for supporting the aforementioned heat sink.
[0014] In one embodiment, the aforementioned electronic device further includes a screw that passes through the aforementioned second circuit board and the aforementioned positioning post and is locked into the aforementioned first circuit board.
[0015] In one embodiment, one edge of the aforementioned heat sink is clamped between the aforementioned lower housing and the aforementioned upper housing.
[0016] In one embodiment, the aforementioned heat sink is formed with a plurality of bumps.
[0017] In one embodiment, the aforementioned electronic device further includes a heat pipe and a heat dissipation fin. The aforementioned heat pipe is disposed on the aforementioned heat sink and connected to the aforementioned heat dissipation fin, and the aforementioned heat pipe faces the aforementioned second circuit board. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1 An exploded view of the electronic device 100 according to an embodiment of the present invention is shown.
[0019] Figure 2 Shown Figure 1 is an exploded view of the circuit component E1 in
[0020] Figure 3 Shown Figure 1 is a perspective view of the assembled electronic device 100 shown in
[0021] Figure 4 Shown Figure 1 is another perspective view of the assembled electronic device 100 shown in
[0022] Figure 5 is a perspective view showing the first locking member 10 locking the first circuit board MB inside the lower housing H1.
[0023] Figure 6 is a perspective view showing the heat sink P disposed above the first circuit board MB.
[0024] Figure 7 Partial enlarged sectional view showing the first circuit board MB and the heat sink P disposed inside the lower housing H1.
[0025] Figure 8 Perspective view showing the second circuit board SB locked above the heat sink P by the second locking member 20.
[0026] Figure 9 Indicating Figure 3 Partial enlarged sectional view along the line A1 - A2 in
[0027] Figure 10 Perspective view showing the heat sink P of an embodiment of the present invention.
[0028] Figure 11 Exploded view showing the electronic device 200 of another embodiment of the present invention.
[0029] Figure 12 Indicating Figure 11 Perspective view showing the first circuit board MB and the connection unit R installed inside the lower housing H1 in
[0030] Figure 13 Perspective view showing the positioning posts 30 provided on the first circuit board MB passing through the heat sink P.
[0031] Figure 14 Indicating Figure 11 Another perspective view of the circuit component E2 in
[0032] Figure 15 Partial enlarged sectional view showing the screw 40 passing through the second circuit board SB and the positioning posts 30 and then locked into the lower housing H1.
[0033] Figure 16 Perspective view showing the heat sink P of another embodiment of the present invention disposed above the first circuit board MB.
[0034] Figure 17 Indicating Figure 16 Perspective view showing the heat pipe P4 connected to the heat dissipation fins FN provided on the top side of the heat sink P in
[0035] Description of reference numerals
[0036] 100: Electronic device
[0037] 200: Electronic device
[0038] 10: First locking member
[0039] 20: Second locking member
[0040] 30: Positioning post
[0041] 31: Convex part
[0042] 40: Screw
[0043] C: Capacitor component
[0044] E1: Circuit component
[0045] E2: Circuit component
[0046] F: Connection unit
[0047] FN: Heat dissipation fin
[0048] G1: Air inlet
[0049] G2: Air outlet
[0050] H1: Lower housing
[0051] H11: Boss
[0052] H12: Bearing surface
[0053] H13: Support surface
[0054] H2: Upper housing
[0055] H21: Contact surface
[0056] MB: First circuit board
[0057] MB1: Central processing unit
[0058] MB2: Memory component
[0059] N: Flash memory
[0060] P: Heat sink
[0061] P1: First groove
[0062] P2: Second groove
[0063] P3: Bump
[0064] P4: Heat pipe
[0065] R: Connection unit
[0066] R1: First connector
[0067] R2: Second connector
[0068] S: Screw
[0069] SB: Second circuit board Detailed implementation manners
[0070] The following describes the electronic device according to an embodiment of the present invention. However, it can be easily understood that the embodiments of the present invention provide many suitable inventive concepts that can be implemented in a wide variety of specific backgrounds. The specific embodiments disclosed are merely used to illustrate the use of the present invention in a specific manner and are not intended to limit the scope of the present invention.
[0071] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It is understood that these terms, such as those defined in a commonly used dictionary, should be interpreted to have a meaning consistent with the relevant technology and the background or context of this disclosure, and should not be interpreted in an idealized or overly formal manner, unless specifically defined herein.
[0072] Regarding the foregoing and other technical contents, features, and effects of the present invention, they will be clearly presented in the following detailed description of a preferred embodiment with reference to the accompanying drawings. The directional terms mentioned in the following embodiments, such as: up, down, left, right, front, or back, etc., are only with reference to the directions of the attached drawings. Therefore, the directional terms used in the embodiments are for illustration and not for limiting the present invention.
[0073] First, please refer to Figure 1 、 2 、3, and 4, where Figure 1 shows an exploded view of the electronic device 100 according to an embodiment of the present invention, Figure 2 shows Figure 1 an exploded view of the circuit component E1 in Figure 3 shows Figure 1 a perspective view of the assembled electronic device 100 shown in Figure 4 shows Figure 1 another perspective view of the assembled electronic device 100 shown in
[0074] As shown in Figure 1 、 2 、3, and 4, an electronic device 100 according to an embodiment of the present invention is, for example, a solid-state drive (SSD), which mainly includes a lower housing H1, an upper housing H2, and a circuit component E1. The lower housing H1 and the upper housing H2 can be fixed by screws S to form a housing of the electronic device 100, and the circuit component E1 is disposed between the lower housing H1 and the upper housing H2.
[0075] Specifically, a plurality of screws S can pass through the upper housing H2 and be locked into the bosses H11 of the lower housing H1 ( Figure 1 ), so that the lower housing H1 and the upper housing H2 can be fixed to each other.
[0076] On the other hand, from Figure 1, 2 It can be seen that the aforementioned circuit component E1 mainly includes a first circuit board MB, a second circuit board SB, a heat sink P, a connection unit F, and a plurality of capacitor components C. Among them, a central processing unit MB1 and a memory component MB2 are provided on the aforementioned first circuit board MB, a flash memory N is provided on the aforementioned second circuit board SB, and the aforementioned heat sink P is provided between the first and second circuit boards MB and SB.
[0077] It should be understood that the aforementioned first and second circuit boards MB and SB, and the aforementioned heat sink P can be locked to each other through a first locking member 10 and a second locking member 20 ( Figure 2 ).
[0078] In this embodiment, the aforementioned connection unit F is a flexible printed circuit board (FPC), which can be used to electrically connect the first and second circuit boards MB and SB. The aforementioned capacitor component C is electrically connected to the first circuit board MB, and the connection unit F and the capacitor component C are located on opposite sides of the first circuit board MB.
[0079] It should be particularly noted that the heat sink P in this embodiment has a first groove P1 and a second groove P2, which can be used to accommodate the aforementioned connection unit F and capacitor component C respectively, thereby avoiding interference between the heat sink P and the connection unit F or capacitor component C during assembly.
[0080] From Figure 3 , 4 It can be seen that an air inlet G1 is formed on the right side of the electronic device 100, and an air outlet G2 is formed on the left side of the electronic device 100. Among them, the aforementioned air inlet G1 and air outlet G2 are located between the lower housing H1 and the upper housing H2, and the air flow can enter the interior of the electronic device 100 from the air inlet G1 and discharge the heat generated by the electronic components on the first and second circuit boards MB and SB through the air outlet G2.
[0081] As Figure 4 shown, the aforementioned air inlet G1 and air outlet G2 are located on opposite sides of the electronic device 100, and the first circuit board MB protrudes from the aforementioned air outlet G2. It should be understood that since the capacitor component C is provided on the same side of the first circuit board MB and is far from the air flow path between the air inlet G1 and the air outlet G2, it will not affect the air flow movement between the air inlet G1 and the air outlet G2, thereby greatly improving the heat dissipation effect of the electronic device 100.
[0082] Next, please refer to Figure 5 , 6 , 7 together, where Figure 5 shows a three-dimensional view of the first locking member 10 locking the first circuit board MB inside the lower housing H1, Figure 6A perspective view showing the heat sink P disposed above the first circuit board MB. Figure 7 A partially enlarged sectional view showing the first circuit board MB and the heat sink P disposed inside the lower housing H1.
[0083] As Figure 5 shown, during the assembly process of the electronic device 100, first, the connecting unit F and the first circuit board MB can be placed together inside the lower housing H1, where the first fastener 10 can lock the first circuit board MB and the lower housing H1 to each other.
[0084] Next, as Figure 6 、 7 shown, the heat sink P can be further placed above the first circuit board MB and made to contact a bearing surface H12 inside the lower housing H1 ( Figure 7 ). Among them, the stud H11 located inside the lower housing H1 will pass through the heat sink P and support the heat sink P by its support surface H13, so that the heat sink P can be stably positioned at a preset position inside the lower housing H1.
[0085] Please also refer to Figure 8 、 9 , where Figure 8 is a perspective view showing the second fastener 20 locking the second circuit board SB above the heat sink P. Figure 9 represents along Figure 3 a partially enlarged sectional view of the line segment A1 - A2 in
[0086] As Figure 8 shown, after installing the heat sink P inside the lower housing H1, the second fastener 20 can be used to pass through the second circuit board SB and lock the second circuit board SB above the heat sink P. It can be seen from Figure 9 that the aforementioned second fastener 20 passes through the second circuit board SB and locks into the end of the first fastener 10 (such as a hexagon stud), so that the first and second circuit boards MB, SB can be fixedly joined to each other.
[0087] After combining the second circuit board SB with the first circuit board MB, the upper housing 20 can be covered on the top side of the second circuit board SB, and one edge of the aforementioned heat sink P is clamped and fixed between the abutting surface H21 of the upper housing 20 and the bearing surface H12 of the lower housing H1 (as shown in the area B in Figure 9 ) to prevent the heat sink P from loosening or shifting. Finally, the screw S can be passed through the upper housing H2 and locked into the aforementioned stud H11 of the lower housing H1 to complete the assembly process of the entire electronic device 100.
[0088] Next, please refer to Figure 10 , where Figure 10 is a perspective view of the heat sink P according to an embodiment of the present invention. AsFigure 10 As shown, in one embodiment, a plurality of bumps P3 may also be formed on the surface of the heat sink P to increase the contact area between the heat sink P and the air, thereby greatly improving the heat dissipation efficiency of the heat sink P.
[0089] Please also refer to Figure 11 、 12 、13, wherein Figure 11 FIG. 13 shows an exploded view of an electronic device 200 according to another embodiment of the present invention, Figure 12 which shows Figure 11 a perspective view of the first circuit board MB and the connection unit R in FIG. 13 mounted inside the lower housing H1. Figure 13 FIG. 15 shows a perspective view of the positioning posts 30 provided on the first circuit board MB passing through the heat sink P.
[0090] As Figure 11 shown, the main difference between the electronic device 200 of this embodiment and the electronic device 100 in Figures 1 - 9 is that the connection unit R in this embodiment is a board-to-board (BTB) electrical connector, which can be used to electrically connect the first and second circuit boards MB and SB to form a circuit assembly E2, and a heat sink P is provided between the first and second circuit boards MB and SB.
[0091] As Figure 12 shown, during the assembly process of the electronic device 200, first, the first connector R1 in the connection unit R and the first circuit board MB can be placed together inside the lower housing H1. In addition, at least one hollow metal positioning post 30 is mounted on the upper surface of the first circuit board MB through surface mount technology (SMT). Then, as Figure 13 shown, the heat sink P can be placed above the first circuit board MB, and the positioning posts 30 located above the first circuit board MB are passed through the heat sink P.
[0092] Please also refer to Figure 11 、 14 、15, wherein Figure 14 FIG. 15 shows Figure 11 another perspective view of the circuit assembly E2 in Figure 15 FIG. 15 shows a partially enlarged cross-sectional view of the screw 40 passing through the second circuit board SB and the positioning post 30 and then locked into the lower housing H1.
[0093] As Figure 14 、 15As shown, after the first circuit board MB, the positioning posts 30, and the heat sink P are sequentially placed at the predetermined positions within the lower housing H1, the second circuit board SB can be placed above the positioning posts 30. At the same time, the second connector R2 fixed to the edge of the second circuit board SB is electrically joined to the first connector R1 on the first circuit board MB. Then, the screws 40 can be sequentially passed through the second circuit board SB and the positioning posts 30 and locked into the interior of the lower housing H1( Figure 15 ), so that the first circuit board MB, the heat sink P, and the second circuit board SB can be fixed between the lower housing H1 and the upper housing H2. In this embodiment, the first connector R1 disposed on the first circuit board MB and the second connector R2 disposed on the second circuit board SB can be board-to-board connectors with 440 pins, and the aforementioned first connector R1 and second connector R2 jointly form the aforementioned connection unit R (as Figure 11 , 14 shown).
[0094] As can be seen from Figure 15 , since a convex portion 31 is formed on the side of the aforementioned positioning post 30, it can be used to support the heat sink P and form a gas flow channel between the first circuit board MB and the heat sink P. In this way, it is beneficial for the air flow to pass through and discharge heat from the electronic device 200; similarly, the aforementioned second circuit board SB is disposed on the top of the positioning post 30, and a gas flow channel can also be formed between it and the heat sink P, thereby also being able to facilitate the air flow to pass through and discharge heat from the electronic device 200.
[0095] In addition, as can also be seen from Figure 15 , one edge of the heat sink P will be clamped and fixed between the abutting surface H21 of the upper housing 20 and the bearing surface H12 of the lower housing H1 after assembly, thereby preventing the heat sink P from loosening or shifting. Finally, the screw S can be passed through the upper housing H2 and locked into the aforementioned convex post H11 of the lower housing H1( Figure 11 ), to complete the assembly process of the entire electronic device 200.
[0096] Next, please refer to Figure 16 , 17 together, where Figure 16 shows a perspective view of the heat sink P of another embodiment of the present invention disposed above the first circuit board MB, Figure 17 shows Figure 16 a perspective view of a heat pipe P4 connected to the heat dissipation fins FN provided on the top side of the heat sink P in
[0097] As shown in Figure 16 , 17 In this embodiment, the heat sink P and Figures 1 - 15The main difference of the heat sink P therein is that: a heat pipe P4 is provided on the top side of the heat sink P in this embodiment, and heat dissipation fins FN are provided at one end of the heat sink P.
[0098] Specifically, the aforementioned heat pipe P4 can be made of copper or aluminum, and faces the second circuit board SB. In addition, the heat pipe P4 connects the heat sink P and the aforementioned heat dissipation fins FN, so that the heat generated by the electronic components on the first and second circuit boards MB and SB (especially the second circuit board SB) can be quickly discharged from the electronic device.
[0099] For example, the heat sink P in each of the aforementioned embodiments can be made of a metal material (such as an aluminum plate). In addition, in one embodiment, the aforementioned heat sink P can also be in direct contact with the first and second circuit boards MB and SB, which can further simplify the mechanism and contribute to the miniaturization of the electronic device (such as a solid-state drive).
[0100] Although the embodiments of the present invention and their advantages have been disclosed above, it should be understood that any person with ordinary knowledge in the relevant technical field can make changes, substitutions, and modifications without departing from the spirit and scope of the present invention. In addition, the protection scope of the present invention is not limited to the processes, machines, manufactures, compositions of matter, devices, methods, and steps in the specific embodiments described in the specification. Any person with ordinary knowledge in the relevant technical field can understand the processes, machines, manufactures, compositions of matter, devices, methods, and steps developed currently or in the future from the disclosure of the present invention. As long as they can perform substantially the same functions or achieve substantially the same results as those in the embodiments described herein, they can be used according to the present invention. Therefore, the protection scope of the present invention includes the above-mentioned processes, machines, manufactures, compositions of matter, devices, methods, and steps. In addition, each claim constitutes an individual embodiment, and the protection scope of the present invention also includes the combination of each claim and embodiment.
[0101] Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the present invention. Any person familiar with this technology can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to that defined by the appended claims.
Claims
1. An electronic device, characterized in that, comprising: a housing including a lower housing and an upper housing connected to each other, wherein an air inlet and an air outlet are formed between the lower housing and the upper housing, and an air flow enters the electronic device through the air inlet and exits the electronic device through the air outlet; and a circuit assembly disposed inside the housing, including a first circuit board, a second circuit board and a heat sink, wherein the heat sink is disposed between the first circuit board and the second circuit board.
2. The electronic device according to claim 1, characterized in that, the electronic device further includes a connection unit electrically connecting the first circuit board and the second circuit board.
3. The electronic device according to claim 2, characterized in that, the electronic device further includes a central processing unit, a plurality of memory elements and a plurality of flash memories, wherein the central processing unit and the plurality of memory elements are disposed on the first circuit board, and the plurality of flash memories are disposed on the second circuit board.
4. The electronic device according to claim 2, characterized in that, the electronic device further includes a plurality of capacitor elements disposed on the same side of the heat sink and electrically connected to the first circuit board.
5. The electronic device according to claim 4, characterized in that, the heat sink has a first groove and a second groove for respectively accommodating the connection unit and the plurality of capacitor elements.
6. The electronic device according to claim 2, characterized in that, the connection unit includes a flexible circuit board or an electrical connector.
7. The electronic device according to claim 2, characterized in that, the electronic device further includes a screw, the lower housing is formed with a stud, the screw passes through the upper housing and is locked into the stud, and the stud is formed with a supporting surface for supporting the heat sink.
8. The electronic device according to claim 2, characterized in that, the electronic device further includes a first locking member and a second locking member, the first locking member passes through the first circuit board and is locked into the lower housing, and the second locking member passes through the second circuit board and is locked into the tail end of the first locking member.
9. The electronic device according to claim 2, characterized in that, the electronic device further includes a positioning post fixed on the first circuit board, and the positioning post is formed with a convex portion for supporting the heat sink.
10. The electronic device according to claim 9, characterized in that, the electronic device further includes a screw passing through the second circuit board and the positioning post and locked into the first circuit board.
11. The electronic device according to claim 2, characterized in that, one edge of the heat sink is clamped between the lower housing and the upper housing.
12. The electronic device according to claim 2, characterized in that, the heat sink is formed with a plurality of bumps.
13. The electronic device according to claim 2, characterized in that, the electronic device further includes a heat pipe and a heat dissipation fin, the heat pipe is disposed on the heat sink and connected to the heat dissipation fin, and the heat pipe faces the second circuit board.