Field effect transistor multilayer packaging jig

Abstract

The invention provides a multi-layer packaging jig for a field effect transistor, and relates to the technical field of semiconductor packaging. The jig body assembly comprises a top plate, a supporting rod and a supporting frame. The bottom end of the supporting rod is perpendicularly and fixedly connected with the supporting frame. The two sets of mold assemblies are installed between the top plate and the movable plate and between the movable plate and the supporting frame correspondingly. The left side and the right side of the movable plate are connected to the supporting rods in a clamped mode. The connecting rods are fixedly connected to the left side and the right side in the movable plate. After packaging of the upper mold assembly is completed, the movable plate moves downwards to enable the lower mold assembly to complete mold closing, the field-effect tube is packaged through heating, at the moment, the upper lower mold assembly can be filled with a plastic packaging material through the input opening, preparation work is carried out, the waiting time is shortened, and the problem that when existing field-effect tube packaging work is carried out, the packaging efficiency is high is solved. And the next mold can be continuously completed after the mold is completed, the waiting interval time is relatively long, and the working efficiency is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor packaging, and in particular to a multi-layer packaging jig for field effect transistors. Background Art

[0002] In the plastic packaging process of semiconductor packaging, for the packaging of field effect transistors, a plastic packaging mold is usually used, and a set of mold frames is used to package the field effect transistors. During operation, it is necessary to wait for the completion of this mold before continuing to complete the next mold. The waiting interval time is relatively long, reducing the operation efficiency; before mold closing, if there are situations such as inaccurate movement, the mold closing is inaccurate and it is easy to crush and damage the field effect transistors. Then, calibration is carried out through the mold, but there is a risk of increased loss, and it is difficult to perform mold closing after calibration. Summary of the Invention

[0003] Embodiments of the present disclosure relate to a multi-layer packaging jig for field effect transistors. By setting a moving plate, two sets of mold components can be alternately packaged, reducing the waiting and interval time and improving the operation efficiency; by setting an upper calibration part and a lower calibration part, calibration can be performed before mold closing, thereby avoiding crushing and damaging the field effect transistors.

[0004] In a first aspect of the present disclosure, a multi-layer packaging jig for field effect transistors is provided, which specifically includes: a jig main body component, a mold component, a moving plate, and a connecting rod; the jig main body component includes a top plate, a support rod, and a support frame. The bottom surface of the top plate is fixedly welded with the support rod, and the bottom end of the support rod is vertically and fixedly connected to the support frame; two sets of mold components are provided and are respectively installed between the top plate and the moving plate and between the moving plate and the support frame; the left and right sides of the moving plate are clamped on the support rod; the connecting rod is fixedly connected to the left and right sides inside the moving plate. A second connecting plate is fixedly connected above the connecting rod, and a mounting plate is fixedly connected below the connecting rod; a third connecting plate is fixedly connected to the bottom of the mounting plate; a first connecting plate is installed on the bottom surface of the top plate above the second connecting plate. The first connecting plate and the second connecting plate form an upper calibration part; a fourth connecting plate is installed on the top surface of the support frame below the third connecting plate. The fourth connecting plate and the third connecting plate form a lower calibration part.

[0005] In at least some embodiments, two rectangular notches are respectively opened on the left and right sides of the moving plate. The left and right sides of the rectangular notch and the bottom surface of the moving plate are respectively fixedly connected with connecting angle plates through bolt assemblies. The other side of the connecting angle plate is connected with a clamping block through a screw rod. The clamping block is slidably clamped inside the inner chute. A hydraulic rod is fixedly connected to the top surface of the moving plate, and the fixed end of the hydraulic cylinder of the hydraulic rod is installed inside the hydraulic cylinder mounting cover.

[0006] In at least some embodiments, a second calibration insert block is fixedly connected to the bottom surface of the third connecting plate. A calibration rod is welded to the bottom surface of the second calibration insert block. A round hole is formed inside the third connecting plate, and a limiting rod passes through the round hole. A round hole is formed inside the fourth connecting plate, and a limiting rod passes through the round hole. A second calibration receiving block is fixedly clamped in the middle of the fourth connecting plate, and a calibration hole is formed inside the second calibration receiving block.

[0007] In at least some embodiments, two hydraulic cylinder mounting covers are fixedly welded to the top surface of the top plate. Inner sliding grooves are formed on one side of the opposite surfaces of the support rod in the left-right direction. A bottom plate is clamped to the top surface of the support frame. A limiting rod is inserted between the bottom plate and the top plate. And an angle support frame is fixedly connected to the angular connection between the support frame and the support rod through a bolt assembly.

[0008] In at least some embodiments, a connecting sleeve is sleeved outside the connecting rod. The top surface of the connecting sleeve supports the second connecting plate. Two round holes are formed inside the mounting plate, and a limiting rod passes through the round holes.

[0009] In at least some embodiments, a first calibration receiving block is clamped inside the first connecting plate. The first calibration receiving block is clamped inside the top plate. And a rectangular plate protruding from the top of the first calibration receiving block is fixedly connected to the top plate through a screw. A round hole is formed inside the first connecting plate, and a limiting rod passes through the round hole. And a calibration hole is formed inside the first calibration receiving block. A first calibration insert block is fixedly connected to the top surface of the second connecting plate. A calibration rod is welded to the top surface of the first calibration insert block. The calibration rod is located directly below the calibration hole inside the first calibration receiving block.

[0010] In at least some embodiments, a plastic encapsulation material input port is formed inside the lower mold part. When the lower mold part in the lower group is buckled with the upper mold part, the upper mold part below is higher than the fourth connecting plate. When the lower mold part in the upper group is buckled with the upper mold part, the lower mold part above is lower than the first connecting plate.

[0011] The present invention provides a field effect transistor multi-layer encapsulation jig, which has the following beneficial effects: When the present invention is in use, after the upper mold assembly completes the encapsulation, the moving plate moves downward to make the lower mold assembly complete the mold closing. The field effect transistor is encapsulated by heating. At this time, the plastic encapsulation material can be filled into the upper lower mold part through the input port for preparatory work, shortening the waiting time.

[0012] In addition, during the mold closing process of the upper mold assembly, the calibration rod is gradually inserted into the calibration hole of the first calibration receiving block as the first calibration insert block moves upward. After the calibration is completed, the mold closing is completed with the movement of the moving plate, ensuring accurate encapsulation and avoiding damage to the field effect transistor.

[0013] In addition, both the upper calibration piece and the lower calibration piece are assembled and firmly connected through bolt assemblies. The detachable and replaceable design enables them to be adapted for use with different models of die assemblies, improving the applicability and ensuring the die-closing accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings of the embodiments will be briefly introduced below.

[0015] The drawings in the following description only relate to some embodiments of the present invention and do not limit the present invention.

[0016] In the drawings: Figure 1 shows a schematic installation structure diagram of the die assembly of the present application; Figure 2 shows the present application Figure 1 from the right-side perspective structure diagram; Figure 3 shows a schematic structure diagram of the fixture main body assembly of the present application; Figure 4 shows a schematic structure diagram of the moving plate of the present application; Figure 5 shows a partial structure diagram of the bottom plate and the support rod of the present application; Figure 6 shows a schematic structure diagram of the connecting rod of the present application; Figure 7 shows a schematic structure diagram of the upper calibration piece of the present application; Figure 8 shows a schematic structure diagram of the lower calibration piece of the present application.

[0017] LIST OF REFERENCE NUMERALS 1. Fixture main body assembly; 11. Top plate; 1101. Hydraulic cylinder mounting cover; 1102. Limit rod; 12. Support rod; 1201. Inner sliding groove; 13. Support frame; 1301. Bottom plate; 1302. Corner support frame; 2. Die assembly; 21. Lower die part; 22. Upper die part; 3. Moving plate; 301. Connecting angle plate; 3011. Block; 302. Hydraulic rod; 4. Connecting rod; 401. Connecting sleeve; 402. Mounting plate; 5. Upper calibration piece; 51. First connecting plate; 5101. First calibration receiving block; 52. Second connecting plate; 5201. First calibration insertion block; 6. Lower calibration piece; 61. Third connecting plate; 6101. Second calibration insertion block; 62. Fourth connecting plate; 6201. Second calibration receiving block. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0018] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the following will clearly and completely describe the technical solutions of the embodiments of the present invention in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of the embodiments. Based on the described embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the scope of protection of the present invention.

[0019] Embodiment: Please refer to the attached Figure 1 to the attached Figure 8 : The present invention provides a field effect transistor multi-layer packaging jig, including: a jig main body component 1, a mold component 2, a moving plate 3, and a connecting rod 4; the jig main body component 1 includes a top plate 11, a support rod 12, and a support frame 13. The bottom surface of the top plate 11 is fixedly welded to the support rod 12, and the bottom end of the support rod 12 is vertically and fixedly connected to the support frame 13; two sets of mold components 2 are provided and are respectively installed between the top plate 11 and the moving plate 3 and between the moving plate 3 and the support frame 13; the left and right sides of the moving plate 3 are clamped on the support rod 12; the connecting rod 4 is fixedly connected to the left and right sides inside the moving plate 3. A second connecting plate 52 is fixedly connected above the connecting rod 4, and a mounting plate 402 is fixedly connected below the connecting rod 4; the bottom of the mounting plate 402 is fixedly connected to a third connecting plate 61; above the second connecting plate 52 and on the bottom surface of the top plate 11, a first connecting plate 51 is installed. The first connecting plate 51 and the second connecting plate 52 form an upper calibration member 5; below the third connecting plate 61 and on the top surface of the support frame 13, a fourth connecting plate 62 is installed. The fourth connecting plate 62 and the third connecting plate 61 form a lower calibration member 6.

[0020] In the embodiments of the present disclosure, as shown in the attached Figure 3 and the attached Figure 5 shown, two hydraulic cylinder mounting covers 1101 are fixedly welded to the top surface of the top plate 11. Inner sliding grooves 1201 are provided on one side of the relative surface of the support rod 12 in the left and right directions. A bottom plate 1301 is clamped on the top surface of the support frame 13. A limiting rod 1102 is inserted between the bottom plate 1301 and the top plate 11. And at the angular connection between the support frame 13 and the support rod 12, an angular support frame 1302 is fixedly connected through a bolt assembly. The hydraulic cylinder mounting cover 1101 provides an installation foundation for the hydraulic cylinder, and the limiting rod 1102 can limit the up and down movement of the moving plate 3 to ensure vertical movement. By setting the angular support frame 1302, the stability of the connection between the support rod 12 and the support frame 13 can be strengthened.

[0021] In the embodiments of the present disclosure, as shown in the attached Figure 1 , the attached Figure 2 and the attached Figure 6As shown, a plastic encapsulation material inlet is provided inside the lower die module 21. When the lower group of lower die modules 21 are engaged with the upper die module 22, the lower upper die module 22 is higher than the fourth connecting plate 62. When the upper group of lower die modules 21 are engaged with the upper die module 22, the upper lower die module 21 is lower than the first connecting plate 51. By using the two sets of die assemblies 2, when the upper set of die assemblies 2 encapsulates the field effect transistor, materials can be fed into the lower die module 21 of the lower set. After the upper die assembly 2 completes the encapsulation, it moves downward, enabling the lower set of die assemblies 2 to encapsulate the field effect transistor. At this time, materials can be fed into the lower die module 21 of the upper set, thereby shortening the waiting time, improving the encapsulation efficiency, and increasing the production capacity.

[0022] In the embodiment of the present disclosure, as shown in the attached Figure 6 figure, two rectangular notches are respectively provided on the left and right sides of the moving plate 3. The left and right sides of the rectangular notches and the bottom surface of the moving plate 3 are respectively fixedly connected by bolt assemblies to the connecting angle plates 301. The other side of the connecting angle plate 301 is connected by a screw rod to the clamping block 3011. The clamping block 3011 is slidably clamped inside the inner chute 1201. The top surface of the moving plate 3 is fixedly connected to the hydraulic rod 302. The fixed end of the hydraulic cylinder of the hydraulic rod 302 is installed inside the hydraulic cylinder mounting cover 1101. By using the inner chute 1201, the clamping block 3011 can slide up and down, meeting the moving requirements of the moving plate 3 while improving the moving stability and ensuring accurate die docking.

[0023] In the embodiment of the present disclosure, as shown in the attached Figure 6 figure, a connecting sleeve 401 is sleeved outside the connecting rod 4. The top surface of the connecting sleeve 401 supports the second connecting plate 52. Two circular holes are provided inside the mounting plate 402, and the limiting rod 1102 passes through the circular holes. By using the connecting rod 4, the third connecting plate 61 and the second connecting plate 52 can be assembled together. By using the connecting sleeve 401, the height difference between the second connecting plate 52 and the lower die module 21 in the upper set of die assemblies 2 can be compensated, ensuring that the height of the upper calibration part 5 is adapted to the die assembly 2. At the same time, the connecting area can be increased, and the load can be evenly dispersed.

[0024] In the embodiment of the present disclosure, as shown in the attached Figure 7 figure, a first calibration receiving block 5101 is clamped inside the first connecting plate 51. The first calibration receiving block 5101 is clamped inside the top plate 11, and the rectangular plate protruding from the top of the first calibration receiving block 5101 is fixedly connected to the top plate 11 by a screw rod. A circular hole is provided inside the first connecting plate 51, and the limiting rod 1102 passes through the circular hole. A calibration hole is provided inside the first calibration receiving block 5101. By using the first calibration receiving block 5101 to provide a calibration basis for positioning, before the upper die assembly 2 is closed, the die closing accuracy is further precisely positioned through pre-positioning, ensuring accurate encapsulation and avoiding damage to the field effect transistor.

[0025] In the embodiments of the present disclosure, as shown in the appendix Figure 7 As shown, a first calibration plug 5201 is fixedly connected to the top surface of the second connecting plate 52. A calibration rod is welded to the top surface of the first calibration plug 5201. The calibration rod is located directly below the calibration hole in the first calibration receiving block 5101. During the mold closing process of the upper mold assembly 2 above, the calibration rod is gradually inserted into the calibration hole of the first calibration receiving block 5101 as the first calibration plug 5201 moves upward. After calibration, the mold is closed as the moving plate 3 moves, and encapsulation is performed.

[0026] In the embodiments of the present disclosure, as shown in the appendix Figure 8 As shown, a second calibration plug 6101 is fixedly connected to the bottom surface of the third connecting plate 61. A calibration rod is welded to the bottom surface of the second calibration plug 6101. A circular hole is formed inside the third connecting plate 61, and the inside of the circular hole is penetrated by a limiting rod 1102. Using the second calibration plug 6101 to provide a calibration basis for positioning, before the mold closing of the lower mold assembly 2 below, the mold closing accuracy is further refined through a pre-positioning method.

[0027] In the embodiments of the present disclosure, as shown in the appendix Figure 8 As shown, a circular hole is formed inside the fourth connecting plate 62, and the inside of the circular hole is penetrated by a limiting rod 1102. A second calibration receiving block 6201 is fixedly clamped in the middle of the fourth connecting plate 62. A calibration hole is formed inside the second calibration receiving block 6201. During the mold closing process of the lower mold assembly 2 below, the calibration rod is gradually inserted into the calibration hole of the second calibration receiving block 6201 as the second calibration receiving block 6201 moves downward. After calibration, the mold is closed as the moving plate 3 moves, and encapsulation is performed.

[0028] Working principle of this embodiment: According to the model of the field effect transistor, select a suitable mold assembly 2 and install it between the top plate 11 and the moving plate 3 and between the moving plate 3 and the support frame 13. According to the heights of the upper mold part 22 and the lower mold part 21, select a matching upper calibration part 5 and lower calibration part 6. Place the field effect transistor to be encapsulated and the encapsulation material on the lower mold part 21. Start the hydraulic cylinder through the external circuit control terminal, and the hydraulic rod 302 drives the moving plate 3 to move; When the moving plate 3 moves upward, the calibration rod is gradually inserted into the calibration hole of the first calibration receiving block 5101 as the first calibration plug 5201 moves upward. After calibration, the mold is closed as the moving plate 3 moves, and encapsulation is performed; when the moving plate 3 moves downward, the calibration rod is gradually inserted into the calibration hole of the second calibration receiving block 6201 as the second calibration receiving block 6201 moves downward. After calibration, the mold is closed as the moving plate 3 moves, and encapsulation is performed. At this time, the plastic encapsulation material can be filled into the upper lower mold part 21 through the input port for preparatory work, shortening the waiting time.

[0029] In this article, the following points need to be noted: 1. The attached drawings of the embodiments of the present disclosure only relate to the structures involved in the embodiments of the present disclosure, and other structures can refer to the general design.

[0030] 2. Without conflict, the embodiments of the present disclosure and the features in the embodiments can be combined with each other to obtain new embodiments.

[0031] The above are only the specific implementation manners of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present disclosure can easily think of changes or substitutions, which should all be covered within the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure shall be subject to the protection scope of the claims.

Claims

1. A field effect tube multilayer packaging tool, comprising: A jig main body component (1), a mold component (2), a movable plate (3) and a connecting rod (4); the characterised in that the jig main body component (1) comprises a top plate (11), a support rod (12) and a support frame (13); the support rod (12) is fixedly welded to the bottom surface of the top plate (11); the bottom end of the support rod (12) is vertically and fixedly connected to the support frame (13); the mold component (2) is provided with two groups and is respectively installed between the top plate (11) and the movable plate (3) and between the movable plate (3) and the support frame (13); the left and right sides of the movable plate (3) are clamped on the support rod (12); the connecting rod (4) is fixedly connected to the movable plate (3); ), a second connecting plate (52) is fixedly connected to the top of the connecting rod (4), and a mounting plate (402) is fixedly connected to the bottom of the connecting rod (402); a third connecting plate (61) is fixedly connected to the bottom of the mounting plate (402); a first connecting plate (51) is installed above the second connecting plate (52) and on the bottom surface of the top plate (11), and the first connecting plate (51) and the second connecting plate (52) form an upper calibration member (5); a fourth connecting plate (62) is installed below the third connecting plate (61) and on the top surface of the support frame (13), and the fourth connecting plate (62) and the third connecting plate (61) form a lower calibration member (6).

2. The field effect tube multilayer packaging jig according to claim 1, characterized in that: Two hydraulic cylinder mounting covers (1101) are fixedly welded to the top surface of the top plate (11); an inner slide groove (1201) is provided on one side of the opposite surface of the support rod (12) in the left and right directions; a bottom plate (1301) is clamped on the top surface of the support frame (13); a limiting rod (1102) is inserted between the bottom plate (1301) and the top plate (11); and an angle support frame (1302) is fixedly connected to the angle connection between the support frame (13) and the support rod (12) via a bolt assembly.

3. The field effect tube multilayer packaging tool according to claim 1, characterized in that: The lower mold (21) is provided with a plastic sealing material input port. When the lower group of lower molds (21) is buckled with the upper mold (22), the lower upper mold (22) is higher than the fourth connecting plate (62). When the upper group of lower molds (21) is buckled with the upper mold (22), the upper lower mold (21) is lower than the first connecting plate (51).

4. The field effect tube multilayer packaging jig according to claim 2, characterized in that: The movable plate (3) is provided with two rectangular notches on the left and right sides, respectively; the left and right sides of the rectangular notches and the bottom surface of the movable plate (3) are respectively fixedly connected with connecting angle plates (301) via bolt assemblies; the other side of the connecting angle plate (301) is connected with a clamping block (3011) via a screw rod; the clamping block (3011) is slidably clamped in the inner slide groove (1201); the top surface of the movable plate (3) is fixedly connected with a hydraulic rod (302); and the hydraulic cylinder fixed end of the hydraulic rod (302) is mounted in the hydraulic cylinder mounting cover (1101).

5. The field effect tube multilayer packaging jig according to claim 2, characterized in that: The connecting rod (4) is sleeved with a connecting sleeve (401) on its exterior, the connecting sleeve (401) supports the second connecting plate (52) on its top surface, and the mounting plate (402) has two circular holes formed inside, the interior of the circular holes being penetrated by a limiting rod (1102).

6. The field effect tube multilayer packaging jig according to claim 2, characterized in that: The first connection plate (51) is internally clamped with a first calibration receiving block (5101), the first calibration receiving block (5101) is clamped inside the top plate (11), and the interior of a rectangular plate protruding from the top of the first calibration receiving block (5101) is fastened to the top plate (11) via a screw, a circular hole is provided inside the first connection plate (51), the circular hole is penetrated by a limiting rod (1102), and a calibration hole is provided inside the first calibration receiving block (5101).

7. The field effect tube multilayer packaging jig according to claim 6, characterized in that: The top surface of the second connecting plate (52) is fixedly connected to the first calibration plug block (5201), and the top surface of the first calibration plug block (5201) is welded with a calibration rod, which is located directly below the calibration hole inside the first calibration receiving block (5101).

8. The field effect tube multilayer packaging tool according to claim 2, characterized in that: The bottom surface of the third connecting plate (61) is fixedly connected to a second calibration plug block (6101), the bottom surface of the second calibration plug block (6101) is welded to a calibration rod, and a circular hole is provided inside the third connecting plate (61), and a limiting rod (1102) penetrates the inside of the circular hole.

9. The field effect tube multilayer packaging jig according to claim 8, characterized in that: A circular hole is provided inside the fourth connecting plate (62), the inside of which is penetrated by a limiting rod (1102), a second calibration receiving block (6201) is fixedly clamped in the middle of the fourth connecting plate (62), and a calibration hole is provided inside the second calibration receiving block (6201).

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