A substrate-less chip packaging device and method

Abstract

The present invention provides a substrate-free chip packaging device and method, which relates to the field of chip packaging. It includes a frame body, and a material taking component, a rotating component, a glue injection component, a drying component, and a driving component for taking materials are arranged on the frame body. The rotating component is arranged at the upper part of the frame body. The rotating component includes a rotating disk rotatably installed on the frame body. Product boxes are evenly arranged on the circumference of the rotating disk. Air outlet holes penetrating the rotating disk are arranged in the product boxes. A mating gear is fixedly connected to the lower part of the rotating disk. A position sensor is arranged at a position corresponding to the product box on the rotating disk. Through the arranged glue injection component, the glue injection part is used to perform glue injection operation on the surface of the product. Under the action of the anti-adhesive film and the injection hole, the glue liquid at each place is ensured to be uniform, no glue liquid is carried, the outer surface of the product is prevented from bulging, and under the action of the knocking part, the air bubbles in the glue liquid are discharged and the glue liquid is made uniform, improving the appearance quality of the packaging glue liquid.

Description

Technical Field

[0001] The present invention relates to the technical field of chip packaging, and specifically relates to a substrate-free chip packaging device and method. Background Art

[0002] Substrate-free chip packaging is an advanced integrated circuit packaging method. By removing the substrate in traditional packaging and directly forming a redistribution layer on the chip, the same functions as the packaging substrate are achieved. Since the substrate is removed, this packaging method can reduce the signal transmission path, improve signal integrity, and at the same time reduce the packaging volume, which is beneficial to the thin and light design of the device.

[0003] In related technologies, such as a substrate-free LED chip packaging structure with the publication number of CN202948967U, in which the chip part is located in the cavity of the thermal conductive adhesive, the thermal conductive adhesive is located on the housing with a reflective insulating layer. After forming the above packaging structure, it is necessary to seal the chip with glue to complete the overall packaging.

[0004] The commonly used glue-sealing method is to inject glue liquid on the upper surface of the product. After the glue liquid cools and forms, the packaging can be completed. However, the glue liquid is easily carried away by the glue injection head, resulting in excessive local glue liquid and a bulging appearance, which affects the appearance quality of the packaging glue liquid. Summary of the Invention

[0005] Aiming at the deficiencies of the prior art, the present invention provides a substrate-free chip packaging device and method, which solves the problem that during packaging, the glue liquid is easily carried away by the glue injection head, resulting in excessive local glue liquid and a bulging appearance, which affects the appearance quality of the packaging glue liquid.

[0006] To achieve the above objectives, the present invention is realized through the following technical solutions: A substrate-free chip packaging device includes a frame body, and a material taking component for taking materials is arranged on the frame body; it further includes:

[0007] A rotating component, the rotating component is arranged on the upper part of the frame body. The rotating component includes a rotating disk rotatably installed on the frame body. Product boxes are evenly arranged on the circumference of the rotating disk. Air outlet holes penetrating the rotating disk are arranged in the product boxes. A mating gear is fixedly connected to the lower part of the rotating disk. Position sensors are arranged at positions corresponding to the product boxes on the rotating disk. A through hole corresponding to the position of the air outlet hole is arranged at the material taking position of the frame body. An air pump is fixedly installed at the lower part of the frame body. The air outlet end of the air pump is fixedly connected to a ventilation box, and the ventilation box is communicated with the through hole;

[0008] A glue injection component, the glue injection component is arranged on the side of the frame body. The glue injection component includes a glue injection frame, a glue injection cylinder is fixedly installed on the glue injection frame, and the output end of the glue injection cylinder is fixedly connected to a glue injection part for glue injection;

[0009] Drying component, the drying component is arranged on the glue injection rack, and the drying component is used for drying the product after glue injection;

[0010] Driving component, the driving component is arranged on the frame body and is used for driving the rotating component to rotate;

[0011] A dust discharge inclined plane is arranged on the frame body at the position of the driving component. The bottom of the dust discharge inclined plane is fixedly connected with a dust discharge frame, and a bag for collecting dust can be adhered to the dust discharge frame. By setting the glue injection component, the glue injection part is used to perform glue injection operation on the surface of the product. Under the action of the anti-adhesive film and the injection hole, the glue liquid at each part is ensured to be uniform, and no glue liquid is carried, avoiding protrusions on the outer surface of the product. Under the action of the knocking part, the bubbles in the glue liquid are discharged and the glue liquid is made uniform, improving the appearance quality of the encapsulating glue liquid.

[0012] Preferably, the material taking component includes a feeding motor fixedly installed at the lower part of the frame body. The output end of the feeding motor is fixedly connected with a feeding arm. A feeding cylinder is fixedly installed on the feeding arm, and the output end of the feeding cylinder is fixedly connected with a feeding suction cup.

[0013] Preferably, the glue injection part includes a receiving frame fixedly installed at the output end of the glue injection cylinder. The lower part of the receiving frame is adapted to the product box. A anti-adhesive film is fixedly connected to the surface of the receiving frame that contacts the upper surface of the product box. A conduction pad is fixedly connected inside the receiving frame. A vibration tube is fixedly connected to the lower part of the conduction pad. An injection hole is arranged at the lower part of the vibration tube. A receiving part is arranged on the conduction pad. A glue injection motor is fixedly installed in the middle of the receiving frame. The upper output end of the glue injection motor drives the receiving part to perform glue injection operation through a gear transmission part. The lower output end of the glue injection motor is fixedly connected with a knocking part for periodically knocking the vibration tube.

[0014] Preferably, the receiving part includes a receiving cylinder. The lower part of the receiving cylinder is fixedly connected with an injection tube extending into the vibration tube. The inner wall of the injection tube is fixedly connected with an inner convex ring at the same height as the knocking part. A pushing part is arranged inside the inner convex ring. The pushing part includes a driving inclined block, a pushing frame, and a pushing ring that are fixed as a whole. The upper part of the receiving cylinder is fixedly connected with a glue inlet tube. A spiral blade is rotatably connected inside the receiving cylinder. At least one communication cavity is arranged on the side wall of the receiving cylinder. The communication cavity communicates the bottom cavity and the top cavity of the receiving cylinder with each other. An exhaust hole is arranged on the top wall of the receiving cylinder; The gear transmission part includes a driving gear and a driven gear that mesh with each other. The driving gear is fixedly connected with the upper output end of the glue injection motor, and the driven gear is fixedly connected with the spiral blade.

[0015] Preferably, the knocking member includes a mounting sleeve fixedly installed at the lower output end of the glue injection motor. An elastic strip is fixedly connected to the mounting sleeve. Notches for swinging are alternately arranged on the elastic strip. A knocking head is fixedly connected to the end of the elastic strip away from the mounting sleeve, and a counterweight ball is fixedly connected to the knocking head.

[0016] Preferably, the drying assembly includes a blowing shell and a heat insulation shell fixed together. A fan is installed on the blowing shell, and an electric heating tube is fixedly installed in the heat insulation shell. A wiping member for wiping off excess glue is fixedly connected to the outside of the heat insulation shell.

[0017] Preferably, the wiping member includes a wiping frame. A wiping tip is arranged on one side of the wiping frame close to the product box after glue injection. A rotatable wiping belt is arranged at the lower part of the wiping frame, and a rotatable adhesive member is arranged at the upper part of the wiping frame. The adhesive member is used for adhering the glue on the wiping belt. The lower surface of the wiping belt is flush with the upper surface of the product box. The adhesive member includes an adhesive roller. An adhesive sleeve is adhesively connected to the outer surface of the adhesive roller. Self-rotating clamping members are fixedly connected to both ends of the adhesive roller, and the self-rotating clamping members cooperate with the upper part of the wiping frame.

[0018] Preferably, the driving assembly includes a driving motor fixedly installed at the lower part of the frame body. The output end of the driving motor is fixedly connected to a driving gear. A cleaning brush disc is detachably connected to the upper part of the driving gear. The driving gear meshes with a mating gear, and the bristles on the lower surface of the cleaning brush disc contact the upper surface of the mating gear.

[0019] The present invention also provides a substrate-less chip packaging method, which uses a substrate-less chip packaging device as described above, including the following steps:

[0020] Step 1: Use the material taking assembly to put the product to be packaged into the product box.

[0021] Step 2: Use the driving assembly to drive the rotating assembly to rotate the product box to directly below the glue injection assembly, and use the position sensor to ensure the accurate position of the product box.

[0022] Step 3: Use the glue injection assembly to inject glue into the product in the product box and knock and vibrate to remove air bubbles and make the glue liquid uniform.

[0023] Step 4: Use the driving assembly to drive the rotating assembly to rotate the product box after glue injection to below the material taking position.

[0024] Step 5: During Step 4, use the drying assembly to wipe off the excess glue on the surface of the product box, and then dry and solidify it.

[0025] Step 6: Use the air pump to discharge air from the air outlet hole to initially separate the product from the product box, and then use the material taking assembly to take out the packaged product.

[0026] The present invention provides a substrate - free chip packaging device and method. It has the following beneficial effects:

[0027] 1. Through the glue - injection component set in the present invention, the glue - injection part is used to perform glue - injection operation on the surface of the product. Under the action of the anti - sticking film and the injection hole, the glue liquid everywhere is ensured to be uniform, and no glue liquid is carried, avoiding protrusions on the outer surface of the product. Under the action of the knocking part, air bubbles in the glue liquid are discharged and the glue liquid is made uniform, improving the appearance quality of the packaging glue liquid.

[0028] 2. Through the air pump set in the present invention, the product can be cooled by air flow, so that the product is initially separated from the product box, facilitating the taking of the product.

[0029] 3. Through the driving component set in the present invention, while providing driving force, the cleaning brush disk can clean the mating gear, reducing the maintenance difficulty. Description of the Drawings

[0030] Figure 1 is a schematic structural diagram of the whole of the present invention;

[0031] Figure 2 is a schematic structural diagram of another perspective of the whole of the present invention;

[0032] Figure 3 is Figure 1 an enlarged view of part A in

[0033] Figure 4 is a three - dimensional view of the driving gear part of the present invention;

[0034] Figure 5 is a three - dimensional view of the drying component of the present invention;

[0035] Figure 6 is a three - dimensional view of another perspective of the drying component of the present invention;

[0036] Figure 7 is a three - dimensional view of the erasing part of the present invention;

[0037] Figure 8 is a three - dimensional view of the adhering part of the present invention;

[0038] Figure 9 is a three - dimensional view of the glue - injection component of the present invention;

[0039] Figure 10 is a three - dimensional view of the glue - injection part of the present invention;

[0040] Figure 11 is a three - dimensional view of another perspective of the glue - injection part of the present invention;

[0041] Figure 12Isometric view of the glue injection part of the present invention after removing the accommodation frame;

[0042] Figure 13 Isometric view of the accommodation part of the present invention;

[0043] Figure 14 Isometric view of the knocking part of the present invention;

[0044] Figure 15 Isometric view of the rotating assembly of the present invention;

[0045] Figure 16 Isometric view of the pushing part of the present invention.

[0046] Among them, 1. Frame body; 101. Dust exhaust inclined plane; 102. Dust exhaust frame; 2. Drying assembly; 201. Blowing shell; 202. Heat insulation shell; 203. Erasing part; 204. Electric heating pipe; 205. Fan; 2031. Erasing frame; 2032. Erasing tip; 2033. Erasing belt; 9. Adhesive part; 901. Adhesion roller; 902. Adhesion sleeve; 903. Self-rotating clamping part; 3. Glue injection assembly; 301. Glue injection frame; 302. Glue injection cylinder; 8. Glue injection part; 801. Accommodation frame; 802. Vibration pipe; 803. Conductive pad; 804. Accommodation part; 8041. Accommodation cylinder; 8042. Injection pipe; 8043. Communication cavity; 8044. Spiral blade; 8045. Glue inlet pipe; 8046. Exhaust hole; 805. Gear transmission part; 8051. Driven gear; 8052. Driving gear; 806. Glue injection motor; 807. Knocking part; 8071. Installation sleeve; 8072. Elastic strip; 8073. Knocking head; 8074. Counterweight ball; 808. Injection hole; 809. Anti-adhesion film; 401. Driving motor; 402. Driving gear; 403. Cleaning brush disc; 5. Rotating assembly; 501. Rotating disc; 502. Matching gear; 503. Position sensor; 504. Product box; 505. Air outlet; 601. Loading arm; 602. Loading cylinder; 603. Loading suction cup; 604. Loading motor; 7. Air pump; 701. Ventilation box; 11. Inner convex ring; 12. Pushing part; 1201. Driving inclined block; 1202. Pushing frame; 1203. Pushing ring. Detailed implementation manners

[0047] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0048] Such as Figures 1 - 16As shown in the figure, an embodiment of the present invention provides a substrate - less chip packaging device, including a frame 1, and a material - taking component for taking materials is arranged on the frame 1;

[0049] The material - taking component includes a loading motor 604 fixedly installed at the lower part of the frame 1. The output end of the loading motor 604 is fixedly connected with a loading arm 601. A loading cylinder 602 is fixedly installed on the loading arm 601. The output end of the loading cylinder 602 is fixedly connected with a loading suction cup 603;

[0050] Reference Figure 1 、 Figure 2 Refer to

[0051] The material - taking component can complete putting the unpackaged products into the product box 504, and can also complete taking out the packaged products from the product box 504. Specifically: the loading motor 604 works under the control of a peripheral controller, driving the loading arm 601 to rotate. The rotation angle can be a preset value. For example, the rotation angles are 45 degrees clockwise, 45 degrees counter - clockwise, 90 degrees clockwise, and 90 degrees counter - clockwise. The rotation of the loading arm 601 drives the loading cylinder 602 to move synchronously. When the loading cylinder 602 is above the product, under the action of a peripheral air source, the loading cylinder 602 drives the loading suction cup 603 to move downwards. The loading suction cup 603 can adsorb the product by suction and release the product by stopping suction, thus completing the automatic loading and unloading actions.

[0051] It further includes:

[0052] A rotating component 5 is arranged at the upper part of the frame 1. The rotating component 5 includes a rotating disk 501 rotatably installed on the frame 1. Product boxes 504 are evenly arranged on the circumference of the rotating disk 501. Air outlet holes 505 penetrating the rotating disk 501 are arranged in the product boxes 504. A mating gear 502 is fixedly connected to the lower part of the rotating disk 501. Position sensors 503 are arranged at the positions corresponding to the product boxes 504 on the rotating disk 501. A through - hole corresponding to the position of the air outlet hole 505 is arranged at the material - taking position of the frame 1. An air pump 7 is fixedly installed at the lower part of the frame 1. The air outlet end of the air pump 7 is fixedly connected with an air - passing box 701, and the air - passing box 701 is communicated with the through - hole;

[0053] Reference Figure 1 、 Figure 15, in this embodiment, four product boxes 504 are selected. The product box 504 has a cavity adapted to the substrate - less chip product, ensuring that the substrate - less chip product can be normally placed in the product box 504. The substrate - less chip product is an existing chip structure. The position sensor 503 is used to detect the position of the product box 504, ensuring the accurate position of the product box 504 and improving the accuracy of glue injection and material picking. When the air pump 7 is powered on, it can generate an air flow. The air flow enters the air outlet hole 505 through the ventilation box 701 and is blown out from the air outlet hole 505. Due to the blockage of the product, the air flow will be fully dispersed. The air pressure will not only push the product to initially separate it from the product box 504, but also cool the product, improving the quality of glue curing. The air flow blown out in this part can also provide a certain protection distance for the adsorption of the product by the feeding suction cup 603, avoiding the feeding suction cup 603 directly squeezing the product and causing damage to the chip product, thus improving the quality of the chip product.

[0054] The glue injection assembly 3 is arranged on the side of the frame body 1. The glue injection assembly 3 includes a glue injection frame 301. A glue injection cylinder 302 is fixedly installed on the glue injection frame 301. The output end of the glue injection cylinder 302 is fixedly connected to a glue injection part 8, and the glue injection part 8 is used for glue injection.

[0055] Reference Figure 9 , under the action of an external air source, the output end of the glue injection cylinder 302 can drive the glue injection part 8 to move to complete the glue injection operation. The glue injection frame 301 can be used to provide an installation space for the container storing the glue liquid of the external device.

[0056] The glue injection part 8 includes a receiving frame 801 fixedly installed at the output end of the glue injection cylinder 302. The lower part of the receiving frame 801 is adapted to the product box 504. A non - sticking film 809 is fixedly connected to the surface of the receiving frame 801 that contacts the upper surface of the product box 504. A conduction pad 803 is fixedly connected inside the receiving frame 801. A vibration tube 802 is fixedly connected to the lower part of the conduction pad 803. An injection hole 808 is provided at the lower part of the vibration tube 802. A receiving part 804 is provided on the conduction pad 803. A glue injection motor 806 is fixedly installed in the middle of the receiving frame 801. The upper output end of the glue injection motor 806 drives the receiving part 804 to perform the glue injection operation through a gear transmission part 805. The lower output end of the glue injection motor 806 is fixedly connected to a knocking part 807 for periodically knocking the vibration tube 802.

[0057] Reference Figure 10 、 Figure 11 、 Figure 12, when injecting glue, the bottom of the accommodation frame 801 can be directly covered on the product box 504. The anti-adhesive film 809 is used to prevent the glue from adhering to the lower surface of the accommodation frame 801. The anti-adhesive film 809 uses existing materials, such as a polyimide film with an anti-adhesive agent coated on the surface. The conduction pad 803 and the vibration tube 802 are used to transmit vibration, so that the glue in the accommodation member 804 is synchronously vibrated. The vibration force is used to evenly distribute the glue and eliminate the air bubbles existing in the glue, making the glue uniform and improving the product appearance.

[0058] The accommodation member 804 includes an accommodation cylinder 8041. The lower part of the accommodation cylinder 8041 is fixedly connected with an injection tube 8042 extending into the vibration tube 802. The inner wall of the injection tube 8042 is fixedly connected with an inner convex ring 11 at the same height as the knocking member 807. A pushing member 12 is arranged inside the inner convex ring 11. The pushing member 12 includes a driving inclined block 1201, a pushing frame 1202, and a pushing ring 1203 that are fixed together. The upper part of the accommodation cylinder 8041 is fixedly connected with a glue inlet tube 8045. A spiral blade 8044 is rotatably connected inside the accommodation cylinder 8041. At least one communication cavity 8043 is arranged on the side wall of the accommodation cylinder 8041. The communication cavity 8043 communicates the bottom and the top cavity of the accommodation cylinder 8041 with each other. An exhaust hole 8046 is arranged on the top wall of the accommodation cylinder 8041; the gear transmission member 805 includes a driving gear 8052 and a driven gear 8051 that mesh with each other. The driving gear 8052 is fixedly connected with the upper output end of the glue injection motor 806. The driven gear 8051 is fixedly connected with the spiral blade 8044;

[0059] Reference Figure 13 、 Figure 12 、 Figure 16, The glue inlet tube 8045 is used for the peripheral glue source to enter the receiving cylinder 8041 under the action of gravity. During the glue injection operation, the glue injection motor 806 is energized to drive the driving gear 8052 to rotate. The driving gear 8052 drives the driven gear 8051 to rotate, and the driven gear 8051 drives the spiral blade 8044 to rotate. The spiral blade 8044 can push the glue in the upper part of the receiving cylinder 8041 to the lower part, and then inject it into the product box 504 through the injection hole 808 of the injection tube 8042, so that the glue covers the surface of the chip product. Due to the vibration force, the air bubbles in the glue will move from bottom to top, pass through the communication cavity 8043 and enter the upper part of the receiving cylinder 8041, and then be discharged to the outside through the exhaust hole 8046, ensuring that the glue does not contain air bubbles and improving the quality of the glue. At the same time, the inner convex ring 11 will undergo an inner convex deformation after being squeezed, thereby driving the driving inclined block 1201 to move upward, driving the pushing frame 1202 and the pushing ring 1203 to move upward, pushing the glue upward, using the driving force of the glue to accelerate the upward movement of the air bubbles, and improving the speed of exhausting air bubbles. When the thrust is lacking, it will return to its original position under the action of its own gravity and does not affect the normal use next time. The middle part of the pushing ring 1203 is hollow, which does not affect the normal injection of glue. The design of the driving inclined block 1201 with a gradually increasing cross-section from bottom to top ensures that while the pushing frame 1202 receives an upward thrust, the driving inclined block 1201 is restricted from tilting, ensuring the stability of the upward movement of the pushing member 12.

[0060] The knocking member 807 includes a mounting sleeve 8071 fixedly installed at the lower output end of the glue injection motor 806. An elastic strip 8072 is fixedly connected to the mounting sleeve 8071. The elastic strip 8072 is alternately provided with notches for swinging. One end of the elastic strip 8072 away from the mounting sleeve 8071 is fixedly connected to a knocking head 8073, and a counterweight ball 8074 is fixedly connected to the knocking head 8073;

[0061] Reference Figure 10 , Figure 14 , The glue injection motor 806 has upper and lower output ends. During the glue injection operation, the lower output end will drive the mounting sleeve 8071 to rotate. The mounting sleeve 8071 drives the elastic strip 8072, the knocking head 8073, and the counterweight ball 8074 to move synchronously. The rotation trajectory of the knocking head 8073 will contact the vibration tube 802. The notches on the elastic strip 8072 are compressed by the force and restored under the action of its own elastic material. Therefore, the vibration tube 802 will be periodically knocked, causing the vibration tube 802 to be vibrated and squeezed. The counterweight ball 8074 is used to increase the knocking force to ensure a greater vibration force.

[0062] The drying assembly 2 is provided on the glue injection frame 301. The drying assembly 2 is used to dry the product after glue injection;

[0063] The drying assembly 2 includes a blower shell 201 and a heat-insulating shell 202 fixed together. A fan 205 is installed on the blower shell 201. An electric heating pipe 204 is fixedly installed in the heat-insulating shell 202. An erasing member 203 for erasing excess glue is fixedly connected to the outer side of the heat-insulating shell 202.

[0064] refer to Figure 5 , Figure 6 During the drying operation, the fan 205 is powered on, and the generated airflow passes through the blowing shell 201 and the insulation shell 202. Under the heating of the electric heating tube 204, a hot airflow is formed that blows out from top to bottom, so that the glue liquid is heated and solidified, thereby accelerating the curing of the glue liquid.

[0065] The erasing member 203 comprises an erasing frame 2031, an erasing tip 2032 is provided on one side of the erasing frame 2031 close to the glue-injected product box 504, a rotatable erasing belt 2033 is provided at the lower part of the erasing frame 2031, and a rotatable adhesive member 9 is provided at the upper part of the erasing frame 2031, and the adhesive member 9 is used to adhere the glue on the erasing belt 2033, and the lower surface of the erasing belt 2033 is flush with the upper surface of the product box 504; the adhesive member 9 comprises an adhesive roller 901, and an adhesive sleeve 902 is adhesively connected to the outer surface of the adhesive roller 901, and self-rotating clamps 903 are fixedly connected to both ends of the adhesive roller 901, and the self-rotating clamps 903 cooperate with the upper part of the erasing frame 2031;

[0066] refer to Figure 7 , Figure 8 When wiping off excess glue or dust, the erasing tip 2032 increases the erasing area of the erasing tape 2033. The erasing tape 2033 is in full contact with the upper surface of the product box 504. Therefore, it will be driven to move by friction, and the glue adhered to the erasing tape 2033 will gradually rotate to the upper part, and then be adhered to the adhesive sleeve 902. The erasing tape 2033 is made of elastic material to ensure that the product box 504 moves smoothly and will not be affected by the erasing tape 2033. When there are many impurities of glue adhered to the adhesive sleeve 902, the adhesive attachment 9 can be taken out, the adhesive sleeve 902 can be removed, and a new adhesive sleeve 902 can be re-adhered. The self-rotating card 903 is used to ensure that the adhesive attachment 9 as a whole can be driven to rotate by the erasing tape 2033, thereby playing the role of replacing the surface of the adhesive sleeve 902.

[0067] A driving assembly, which is disposed on the frame 1 and is used to drive the rotating assembly 5 to rotate;

[0068] The driving assembly includes a driving motor 401 fixedly mounted on the lower part of the frame 1, the output end of the driving motor 401 is fixedly connected to a driving gear 402, the upper part of the driving gear 402 is detachably connected to a cleaning brush plate 403, the driving gear 402 is meshed with a matching gear 502, and the bristles on the lower surface of the cleaning brush plate 403 are in contact with the upper surface of the matching gear 502;

[0069] Reference Figure 1 、 Figure 4 、 Figure 3 When driving the operation, the driving motor 401 is powered on to work, driving the driving gear 402 to rotate. The driving gear 402 drives the mating gear 502 to rotate, thereby driving the rotating disk 501 to rotate, achieving the purpose of driving the product box 504 to move. At the same time, the driving gear 402 drives the cleaning brush disk 403 to rotate, and the bristles on the lower surface of the cleaning brush disk 403 can clean the surface of the mating gear 502, reducing the frequency of later maintenance.

[0070] On the frame body 1 and at the position of the driving assembly, there is a dust discharge inclined surface 101. The bottom of the dust discharge inclined surface 101 is fixedly connected with a dust discharge frame 102, and a bag for collecting dust can be adhered to the dust discharge frame 102.

[0071] Reference Figure 3 The impurities cleaned out by the cleaning brush disk 403 can fall on the dust discharge inclined surface 101. Under the action of gravity, they gradually enter the dust discharge frame 102 and are then collected by the bag, with reliable use.

[0072] This embodiment also provides a method for packaging a chip without a substrate, using a chip packaging device without a substrate as described above, including the following steps:

[0073] Step 1: Use the material taking assembly to place the product to be packaged into the product box 504. Specifically, the feeding motor 604 works under the control of the peripheral controller, driving the feeding arm 601 to rotate. When the feeding cylinder 602 is above the product, the feeding cylinder 602 drives the feeding suction cup 603 to move downward under the action of the peripheral air source. The feeding suction cup 603 can adsorb the product by inhaling air and release the product by stopping inhaling air, and the automatic feeding and discharging actions can be completed.

[0074] Step 2: Use the driving assembly to drive the rotating assembly 5 to rotate the product box 504 to directly below the injection assembly 3, and use the position sensor 503 to ensure the accurate position of the product box 504. Specifically: The driving motor 401 is powered on to work, driving the driving gear 402 to rotate. The driving gear 402 drives the mating gear 502 to rotate, thereby driving the rotating disk 501 to rotate, and rotating the product box 504 to directly below the injection assembly 3.

[0075] Step 3: Use the glue injection component 3 to inject glue into the product in the product box 504 and perform knocking vibration to remove air bubbles and make the glue liquid uniform. Specifically: Under the action of an external air source, the output end of the glue injection cylinder 302 can drive the glue injection part 8 to move. The bottom of the accommodation frame 801 can directly cover the product box 504. The anti-adhesive film 809 is used to prevent the glue liquid from adhering to the lower surface of the accommodation frame 801. During the glue injection operation, the output end of the lower part will drive the mounting sleeve 8071 to rotate. The mounting sleeve 8071 drives the elastic strip 8072, the knocking head 8073, and the counterweight ball 8074 to move synchronously. The rotation trajectory of the knocking head 8073 will contact the vibration tube 802. The notch on the elastic strip 8072 is compressed by the force and then restored under the action of its own elastic material. Therefore, the vibration tube 802 will be knocked periodically, causing the vibration tube 802 to be vibrated and squeezed. The conduction pad 803 and the vibration tube 802 are used to transmit vibration, so that the glue liquid in the accommodation part 804 is synchronously vibrated. The vibration force is used to make the glue liquid evenly distributed and eliminate the air bubbles existing in the glue liquid, making the glue liquid uniform, improving the product appearance. At the same time, after being squeezed, the inner convex ring 11 will undergo an inner convex deformation, thereby driving the driving inclined block 1201 to move upward, and then driving the pushing frame 1202 and the pushing ring 1203 to move upward, pushing the glue liquid upward. The driving force of the glue liquid is used to accelerate the upward movement of the air bubbles and improve the speed of exhausting air bubbles;

[0076] Step 4: Use the driving component to drive the rotating component 5 to rotate the product box 504 after glue injection to the position below the material taking place. Specifically: The driving motor 401 is powered on to work, driving the driving gear 402 to rotate. The driving gear 402 drives the mating gear 502 to rotate, thereby driving the rotating disk 501 to rotate, and rotating the product box 504 to the material taking position;

[0077] Step 5: During the process of Step 4, use the drying component 2 to wipe off the excess glue liquid on the surface of the product box 504 and then perform drying and solidification. Specifically: The fan 205 is powered on to work, and the generated air flow passes through the blowing shell 201 and the heat insulation shell 202. Under the heating of the electric heating tube 204, a hot air flow blowing from top to bottom is formed, causing the glue liquid to be heated and solidified, accelerating the curing of the glue liquid. The wiping belt 2033 is in full contact with the upper surface of the product box 504. Therefore, it will be driven to move by the frictional force, and the glue liquid adhered to the wiping belt 2033 will be gradually rotated to the upper part and then be taken away by the adhesion sleeve 902. The wiping belt 2033 is made of an elastic material to ensure the smooth movement of the product box 504;

[0078] Step Six: Use the air pump 7 to discharge air from the air outlet hole 505 to preliminarily separate the product from the product box 504, and then use the material taking assembly to take out the encapsulated product. Specifically: When the air pump 7 is powered on and operates, it can generate an air flow. The air flow enters the air outlet hole 505 through the ventilation box 701 and is blown out from the air outlet hole 505. Due to the obstruction of the product, the air flow will be fully dispersed. The air pressure will not only push the product to preliminarily separate the product from the product box 504, but also cool the product to improve the quality of the curing of the glue. Then, use the material taking assembly to take the material.

[0079] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A substrate-free chip packaging device, comprising a frame (1), characterized in that: A material taking component for taking materials is provided on the frame body (1); further included are: A rotating component (5), the rotating component (5) is arranged on the upper part of the frame body (1), the rotating component (5) includes a rotating disk (501) rotatably installed on the frame body (1), product boxes (504) are evenly arranged on the circumference of the rotating disk (501), air outlet holes (505) penetrating through the rotating disk (501) are arranged in the product boxes (504), a mating gear (502) is fixedly connected to the lower part of the rotating disk (501), a position sensor (503) is arranged at a position corresponding to the product box (504) on the rotating disk (501), a through hole corresponding to the position of the air outlet hole (505) is arranged at the material taking position of the frame body (1), an air pump (7) is fixedly installed at the lower part of the frame body (1), and an air vent box (701) is fixedly connected to the air outlet end of the air pump (7), and the air vent box (701) is communicated with the through hole; A glue injection component (3), the glue injection component (3) is arranged on the side part of the frame body (1), the glue injection component (3) includes a glue injection frame (301), a glue injection cylinder (302) is fixedly installed on the glue injection frame (301), and a glue injection part (8) is fixedly connected to the output end of the glue injection cylinder (302), and the glue injection part (8) is used for glue injection; The glue injection part (8) includes a receiving frame (801) fixedly installed at the output end of the glue injection cylinder (302), the lower part of the receiving frame (801) is adapted to the product box (504), an anti-adhesive film (809) is fixedly connected to a surface of the receiving frame (801) in contact with the upper surface of the product box (504), a conduction pad (803) is fixedly connected in the receiving frame (801), a vibration tube (802) is fixedly connected to the lower part of the conduction pad (803), an injection hole (808) is arranged at the lower part of the vibration tube (802), a receiving part (804) is arranged on the conduction pad (803), a glue injection motor (806) is fixedly installed in the middle of the receiving frame (801), and the upper output end of the glue injection motor (806) drives the receiving part (804) to perform glue injection operation through a gear transmission part (805), and the lower output end of the glue injection motor (806) is fixedly connected to a knocking part (807) for periodically knocking the vibration tube (802); The knocking part (807) includes a mounting sleeve (8071) fixedly installed at the lower output end of the glue injection motor (806), an elastic strip (8072) is fixedly connected to the mounting sleeve (8071), notches for swinging are alternately arranged on the elastic strip (8072), a knocking head (8073) is fixedly connected to the end of the elastic strip (8072) away from the mounting sleeve (8071), and a counterweight ball (8074) is fixedly connected to the knocking head (8073); A drying component (2), the drying component (2) is arranged on the glue injection frame (301), and the drying component (2) is used for drying the product after glue injection; A driving component, the driving component is arranged on the frame body (1) and is used for driving the rotating component (5) to rotate; A dust-removing inclined plane (101) is provided on the frame body (1) and at the position of the driving component. A dust-removing frame (102) is fixedly connected to the lower part of the dust-removing inclined plane (101), and a bag for collecting dust can be adhered to the dust-removing frame (102).

2. The substrate-less chip packaging device according to claim 1, wherein: The material taking component includes a feeding motor (604) fixedly installed at the lower part of the frame body (1). The output end of the feeding motor (604) is fixedly connected to a feeding arm (601). A feeding cylinder (602) is fixedly installed on the feeding arm (601), and the output end of the feeding cylinder (602) is fixedly connected to a feeding suction cup (603).

3. A substrate-less chip packaging device according to claim 1, wherein: The accommodating part (804) includes an accommodating cylinder (8041). An injection pipe (8042) extending into the vibration pipe (802) is fixedly connected to the lower part of the accommodating cylinder (8041). An inner convex ring (11) at the same height as the knocking part (807) is fixedly connected to the inner wall of the injection pipe (8042). A pushing part (12) is arranged inside the inner convex ring (11). The pushing part (12) includes a driving inclined block (1201), a pushing frame (1202), and a pushing ring (1203) fixed as a whole. A glue inlet pipe (8045) is fixedly connected to the upper part of the accommodating cylinder (8041). A spiral blade (8044) is rotatably connected inside the accommodating cylinder (8041). At least one communication cavity (8043) is arranged on the side wall of the accommodating cylinder (8041), and the communication cavity (8043) communicates the bottom cavity and the top cavity of the accommodating cylinder (8041). An exhaust hole (8046) is arranged on the top wall of the accommodating cylinder (8041); the gear transmission part (805) includes a driving gear (8052) and a driven gear (8051) meshing with each other. The driving gear (8052) is fixedly connected to the upper output end of the glue injection motor (806), and the driven gear (8051) is fixedly connected to the spiral blade (8044).

4. The substrate - less chip packaging device according to claim 1, wherein: The drying component (2) includes a blowing shell (201) and a heat insulation shell (202) fixed as a whole. A fan (205) is installed on the blowing shell (201). An electric heating pipe (204) is fixedly installed inside the heat insulation shell (202). A wiping part (203) for wiping off redundant glue is fixedly connected to the outside of the heat insulation shell (202).

5. The substrate-less chip packaging device according to claim 4, wherein: The erasing member (203) includes an erasing frame (2031). An erasing tip (2032) is provided on one side of the erasing frame (2031) close to the product box (504) after glue injection. A rotatable erasing belt (2033) is provided at the lower part of the erasing frame (2031). A rotatable adhering member (9) is provided at the upper part of the erasing frame (2031). The adhering member (9) is used for adhering the glue liquid on the erasing belt (2033). The lower surface of the erasing belt (2033) is flush with the upper surface of the product box (504). The adhering member (9) includes an adhering roller (901). An adhering sleeve (902) is adhesively connected to the outer surface of the adhering roller (901). Self-rotating clamping members (903) are fixedly connected to both ends of the adhering roller (901). The self-rotating clamping members (903) cooperate with the upper part of the erasing frame (2031).

6. The substrate - less chip packaging device according to claim 1, wherein: The driving assembly includes a driving motor (401) fixedly installed at the lower part of the frame body (1). The output end of the driving motor (401) is fixedly connected with a driving gear (402). A cleaning brush disc (403) is detachably connected to the upper part of the driving gear (402). The driving gear (402) meshes with a mating gear (502). The bristles on the lower surface of the cleaning brush disc (403) are in contact with the upper surface of the mating gear (502).

7. A method for packaging a chip without a substrate, using a chip packaging device without a substrate as described in any one of claims 1-6, characterized in that, It includes the following steps: Step 1: Use the material taking assembly to put the product to be encapsulated into the product box (504). Step 2: Use the driving assembly to drive the rotating assembly (5) to rotate the product box (504) to directly below the glue injection assembly (3), and use the position sensor (503) to ensure the accurate position of the product box (504). Step 3: Use the glue injection assembly (3) to inject glue into the product in the product box (504) and knock and vibrate to remove air bubbles and make the glue liquid uniform. Step 4: Use the driving assembly to drive the rotating assembly (5) to rotate the product box (504) after glue injection to below the material taking position. Step 5: During Step 4, use the drying assembly (2) to erase the excess glue liquid on the surface of the product box (504), and then dry and solidify it. Step 6: Use the air pump (7) to send out air from the air outlet hole (505) to initially separate the product from the product box (504), and then use the material taking assembly to take out the encapsulated product.

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