Liquid cooling plate assembly with both active heat dissipation and passive heat dissipation of high-heat-flux chip

Abstract

The invention discloses a liquid cooling plate assembly with both active heat dissipation and passive heat dissipation of a high-heat-flux chip. The method comprises the following steps: firstly, connecting a high-heat-flux chip with a boss through a spring screw, and filling heat-conducting silicone grease between the boss and the high-heat-flux chip; a flexible heat pipe is embedded in the boss, and the flexible heat pipe and the liquid cooling plate are embedded and interconnected; the boss is in heat conduction connection with the liquid cooling plate through a heat conduction pad; heat is conducted to the boss from the high-heat-flux chip through heat conduction silicone grease, the boss is conducted to the liquid cooling plate through the flexible heat pipe, the liquid cooling plate achieves export of the heat to the heat exchanger or the heat sink through an internal low-temperature working medium and the VC vapor chamber, and flexible low-heat-resistance high-heat-conduction mechanical connection of the high-heat-flux chip and the liquid cooling plate is achieved. Therefore, the impact and vibration damage of the boss to the high-heat-flux chip in a mechanical environment, especially the mechanical environment faced by satellite-borne computing equipment in the rocket ignition and carrying process, can be solved.

Description

Technical Field

[0001] The present invention relates to the technical field of high heat flux density chips, and particularly to a liquid cooling plate assembly with both active and passive heat dissipation for a high heat flux density chip. Background Art

[0002] In the current technical field of high heat flux density chips, if a large amount of heat generated during the operation of a high heat flux density chip cannot be dissipated in time, it will cause problems such as a decline in chip performance, a shortened lifespan, and even malfunctions.

[0003] Existing cold plate heat dissipation cannot solve the problem of near-zero clearance rigid connection between the boss and the high heat flux density chip in a mechanical environment. It is necessary to fill the gap with a thermal conductive pad with a thickness of more than 0.5 mm for mechanical vibration and shock resistance, and achieve heat conduction while avoiding vibration and shock damage to the high heat flux density chip. However, the thermal resistance of a thermal conductive pad with a thickness of more than 0.5 mm is much larger than that of a rigid connection filled with near-zero clearance thermal conductive silicone grease, which leads to the problem that heat cannot be effectively dissipated, thus causing the chip to overheat. Summary of the Invention

[0004] Aiming at the deficiencies of the prior art, the present invention provides a liquid cooling plate assembly with both active and passive heat dissipation for a high heat flux density chip. This liquid cooling plate assembly can achieve a flexible, low thermal resistance, and high thermal conductivity mechanical connection between the high heat flux density chip and the liquid cooling plate, and solve the problems of impact, vibration damage to the high heat flux density chip by the boss in a mechanical environment, and chip heating.

[0005] The present invention is realized through the following technical solutions: A liquid cooling plate assembly with both active and passive heat dissipation for a high heat flux density chip, comprising: a liquid cooling plate, a boss, a thermal conductive pad, thermal conductive silicone grease, a PCB with a high heat flux density chip, a flexible heat pipe, and a spring screw; the high heat flux density chip is connected to the boss by a spring screw, and thermal conductive silicone grease is filled between the boss and the high heat flux density chip; the flexible heat pipe is embedded in the boss, the flexible heat pipe is interconnected with the liquid cooling plate in an embedded manner, and the boss and the liquid cooling plate are thermally connected through the thermal conductive pad.

[0006] Specifically, the liquid cooling plate includes a liquid cooling plate working medium inlet, a liquid cooling plate working medium outlet, a liquid cooling flow channel, a vapor chamber VC, an integrated boss of the liquid cooling plate, PCB mounting stud holes, a liquid cooling plate heat sink mounting surface, liquid cooling plate heat sink mounting holes, liquid cooling plate stacking through holes, and a flexible heat pipe fitting area of the liquid cooling plate; when heat is conducted from the high heat flux density chip to the boss, the boss conducts the heat to the liquid cooling plate through the flexible heat pipe and the thermal conductive pad. The liquid cooling plate first realizes the uniform temperature diffusion of the high heat flux density chip through the VC uniform temperature chamber, and then exports the heat through the low-temperature liquid cooling working medium in the liquid cooling channel. At the same time, heat can be exported through the installed heat dissipation surface.

[0007] Specifically, the liquid cooling plate is provided with liquid cooling plate stacking through holes at the four corners for realizing the multi-module stacking of the liquid cooling plates.

[0008] Further, a flexible heat pipe fitting area is arranged inside the boss for embedding a flexible heat pipe.

[0009] Further, the flexible heat pipe includes a flexible heat pipe boss fitting section, a flexible heat pipe liquid cooling plate boss connection section, and a flexible heat pipe liquid cooling plate fitting section; the flexible heat pipe liquid cooling plate boss connection section is used for realizing the high-efficiency heat conduction flexible connection between the boss and the liquid cooling plate.

[0010] Specifically, the spring screw is used for the rigid connection between the boss and the high heat flux density chip; that is, for realizing the rigid contact and pressing between the high heat flux density chip and the boss.

[0011] Specifically, the thermal pad needs to be a flexible thermal pad with compressibility and adhesiveness.

[0012] Specifically, the pump is used to provide a low-temperature liquid cooling working medium flow power source for the entire liquid cooling plate. The low-temperature liquid cooling working medium enters the liquid cooling plate through the liquid cooling pipe from the liquid cooling plate working medium inlet, flows out from the liquid cooling plate working medium outlet through the liquid cooling flow channel, and flows through the liquid cooling flow channel to the heat exchanger to realize heat exchange, while realizing the functions of active liquid cooling and passive VC cooling.

[0013] Further, the threshold signal can be set through the temperature monitoring of the high heat flux density chip. When the threshold is exceeded, the start-stop signal is fed back to the switch to realize the start of the pump; thereby realizing the automatic start and stop of the active liquid cooling. When the temperature does not exceed the threshold, the passive cooling is realized by the liquid cooling plate isothermal plate VC; when the temperature exceeds the threshold, the pump is automatically started to realize the simultaneous main and passive cooling.

[0014] Specifically, when the temperature is equal to the threshold, the pump does not start, and the passive cooling is realized by the liquid cooling plate.

[0015] The beneficial effects of the present invention are as follows: The existing cold plate cooling cannot solve the problem of the near-zero clearance rigid connection between the boss and the high heat flux density chip in the mechanical environment. It is necessary to fill the gap with a thermal pad with a thickness of more than 0.3 - 0.5 mm to realize heat conduction while avoiding mechanical damage to the high heat flux density chip structure. However, the thermal resistance of the thermal pad with a thickness of more than 0.3 - 0.5 mm is much larger than that of the rigid connection filled with near-zero clearance thermal grease, which results in the inability to efficiently export heat. The present invention can realize the flexible mechanical connection between the liquid cooling plate and the high heat flux density chip through the flexible heat pipe and the separated boss design, solve the problem of mechanical damage of the boss to the high heat flux density chip in the mechanical environment, and can realize high-efficiency heat conduction. It has good application prospects in spaceborne high heat flux density equipment. Description of the Drawings

[0016] Figure 1This is an integrated assembly diagram of a liquid cooling plate assembly with both active and passive heat dissipation functions for a high heat flux density chip of the present invention and a PCB with a high heat flux density chip; Figure 2 This is an exploded view of a liquid cooling plate assembly with both active and passive heat dissipation functions for a high heat flux density chip of the present invention and a PCB with a high heat flux density chip; Figure 3 This is a design feature diagram of the liquid cooling plate of the present invention;

[0017] Figure 4 This is a diagram of the active heat dissipation start-stop control scheme based on the temperature monitoring of a high heat flux density chip of the present invention;

[0018] Figure 5 This is a feature diagram of the boss of the present invention; Figure 6 This is a feature diagram of the flexible heat pipe of the present invention.

[0019] Reference numerals: 1-1 liquid cooling plate, 1-2 thermal pad, 1-3 boss, 1-4 thermal grease, 1-5 PCB with high heat flux density chip, 1-5-1 high heat flux density chip, 1-6 spring screw, 1-7 flexible heat pipe, 1-1-1 liquid cooling plate working fluid inlet, 1-1-2 liquid cooling plate working fluid outlet, 1-1-3 liquid cooling flow channel, 1-1-4 isothermal plate VC, 1-1-5 liquid cooling plate integrated boss, 1-1-6 PCB mounting stud hole, 1-1-7 liquid cooling plate heat sink mounting surface, 1-1-8 liquid cooling plate heat sink mounting hole, 1-1-9 liquid cooling plate stacking through-hole, 1-1-10 liquid cooling plate flexible heat pipe fitting area, 3-1 switch, 3-2 liquid cooling pipe, 3-3 start-stop signal feedback, 1-1-1 liquid cooling plate working fluid inlet, 1-1-2 liquid cooling plate working fluid outlet, 3-4 heat exchanger, 3-5 mounting surface heat sink, 3-6 pump, 3-7 temperature monitoring, 1-3-1 boss connecting PCB threaded hole, 1-3-2 high heat flux density chip heat conducting surface, 1-3-3 boss flexible heat pipe fitting area, 1-7-1 flexible heat pipe boss fitting section, 1-7-2 flexible heat pipe liquid cooling plate boss connecting section, 1-7-3 flexible heat pipe liquid cooling plate fitting section. Detailed Description of the Invention

[0020] Here, exemplary embodiments will be described in detail, and the examples are shown in the drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application.

[0021] Refer to the attached Figure 2, a liquid cooling plate assembly with both active and passive heat dissipation functions for a high heat flux density chip. The liquid cooling plate assembly 1 specifically includes: a liquid cooling plate 1-1, a thermal pad 1-2, a boss 1-3, thermal grease 1-4, a PCB 1-5 with a high heat flux density chip, a high heat flux density chip 1-5-1, spring screws 1-6, and a flexible heat pipe 1-7.

[0022] For the liquid cooling plate assembly with both active and passive heat dissipation functions for a high heat flux density chip, the assembly effect of the PCB 1-5 with a high heat flux density chip is as shown in the appendix Figure 1 and Figure 6 shown. The high heat flux density chip 1-5-1 is connected to the boss connection PCB threaded hole 1-3-1 on the boss 1-3 through spring screws 1-6. And thermal grease 1-4 is filled between the high heat flux density chip 1-5-1 and the boss 1-3. The boss flexible heat pipe fitting area 1-3-3 inside the boss 1-3 is fitted with the flexible heat pipe 1-7. The liquid cooling plate flexible heat pipe fitting area 1-1-10 provided inside the liquid cooling plate 1-1 is fitted with the flexible heat pipe liquid cooling plate fitting section 1-7-3. The boss 1-3 and the liquid cooling plate 1-1 are connected by the flexible heat pipe liquid cooling plate boss connection section 1-7-2 to achieve efficient heat conduction and flexible connection. The PCB 1-5 with a high heat flux density chip is connected to the liquid cooling plate 1-1 through the PCB mounting stud holes 1-1-6. The gap between the boss 1-3 and the liquid cooling plate 1-1 is filled with the thermal pad 1-2; the thermal pad 1-2 needs to be a flexible thermal pad with a certain compression amount and adhesion.

[0023] Appendix Figure 3 shown is the design feature diagram of the liquid cooling plate, which includes a liquid cooling plate working fluid inlet 1-1-1, a liquid cooling plate working fluid outlet 1-1-2, a liquid cooling flow channel 1-1-3, a vapor chamber VC 1-1-4, a liquid cooling plate integrated boss 1-1-5, PCB mounting stud holes 1-1-6, a liquid cooling plate heat sink mounting surface 1-1-7, liquid cooling plate heat sink mounting holes 1-1-8, liquid cooling plate stacking through holes 1-1-9, and a liquid cooling plate flexible heat pipe fitting area 1-1-10. When heat is conducted from the high heat flux density chip 1-5-1 to the boss 1-3, the boss 1-3 conducts the heat to the liquid cooling plate 1-1 through the flexible heat pipe 1-7 and the thermal pad 1-2. The liquid cooling plate 1-1 first realizes efficient planar temperature uniformity through the vapor chamber VC 1-1-4 and at the same time conducts the heat to the mounting surface heat sink 3-5 through the liquid cooling plate heat sink mounting surface 1-1-7 to achieve passive heat dissipation. At the same time, the coolant enters the liquid cooling flow channel 1-1-3 from the liquid cooling plate working fluid inlet 1-1-1 and flows out from the liquid cooling plate working fluid outlet 1-1-2, taking away the heat through the low-temperature liquid cooling working fluid to achieve synchronous active heat dissipation.

[0024] As Figure 4As shown, it is a diagram of an active heat dissipation start-stop control scheme based on the temperature monitoring of a high heat flux density chip. The pump 3-6 provides a motive power source for the low-temperature liquid cooling working medium to flow in the entire liquid cooling plate 1-1. The low-temperature liquid cooling working medium enters the liquid cooling plate 1-1 from the liquid cooling plate working medium inlet 1-1-1 through the liquid cooling pipeline 3-2, flows out from the liquid cooling plate working medium outlet 1-1-2 after passing through the liquid cooling flow channel 1-1-3, and flows through the liquid cooling flow channel 1-1-3 to the heat exchanger 3-4 for heat exchange, realizing the function of active liquid cooling heat dissipation. A threshold signal can be set through the high heat flux density chip 1-5-1 and the temperature monitoring 3-7. When the threshold is exceeded, a start-stop signal is fed back through 3-3 to the switch 3-1 to start the pump 3-6. Through the above scheme, the automatic start and stop of active liquid cooling heat dissipation can be realized. When the temperature does not exceed the threshold, passive heat dissipation is mainly achieved by the liquid cooling plate 1-1 and the vapor chamber VC 1-1-4. When the temperature exceeds the threshold, the pump 3-6 is automatically started to achieve simultaneous active and passive heat dissipation. When the temperature is equal to the threshold, the pump 3-6 is not started, and passive heat dissipation is achieved by the liquid cooling plate 1-1.

[0025] After considering the specification and the practice disclosed herein, those skilled in the art will readily conceive of other embodiments of the present application. The present application is intended to cover any variations, uses, or adaptations of the present application, which follow the general principles of the present application and include common general knowledge or conventional technical means in the technical field not disclosed in the present application.

[0026] It should be understood that the present application is not limited to the exact structures described above and shown in the drawings, and various modifications and changes can be made without departing from its scope.

Claims

1. A liquid cooling plate assembly with both active and passive heat dissipation for high heat flux density chips, characterized in that: include: A liquid cooling plate, a boss, a thermal pad, thermal grease, a PCB with a high heat flux density chip, a flexible heat pipe, and a spring screw; the high heat flux density chip is connected to the boss by a spring screw and thermal grease is filled between the boss and the high heat flux density chip; the boss is embedded with a flexible heat pipe, the flexible heat pipe is embedded and interconnected with the liquid cooling plate, and the boss and the liquid cooling plate are thermally connected by a thermal pad.

2. A liquid cooling plate assembly with both active and passive heat dissipation for high heat flux density chips according to claim 1, characterized in that: The liquid cooling plate includes a liquid cooling plate working medium inlet, a liquid cooling plate working medium outlet, a liquid cooling flow channel, a temperature equalizing plate VC, a liquid cooling plate integrated boss, a PCB mounting stud hole, a liquid cooling plate heat sink mounting surface, a liquid cooling plate heat sink mounting hole, a liquid cooling plate stacking nail hole, and a liquid cooling plate flexible heat pipe embedding area; when heat is conducted from a high heat flux density chip to the boss, the boss conducts the heat to the liquid cooling plate through the flexible heat pipe and the thermal pad, and the liquid cooling plate first realizes the uniform temperature diffusion of the high heat flux density chip through the VC temperature equalizing cavity, and then realizes the heat extraction through the low-temperature liquid cooling working medium in the liquid cooling channel, and can also realize the heat extraction by installing the cooling surface.

3. The liquid cooling plate assembly with both active and passive heat dissipation for high heat flux density chips according to claim 1, characterized in that: The liquid cooling plate is provided with liquid cooling plate stacking nail holes at four corners to realize multi-module stacking of the liquid cooling plate.

4. The liquid cooling plate assembly with both active and passive heat dissipation for high heat flux density chips according to claim 1, characterized in that: A flexible heat pipe embedding area is arranged inside the boss for embedding the flexible heat pipe.

5. The liquid cooling plate assembly with both active and passive heat dissipation for high heat flux density chips according to claim 1, characterized in that: The flexible heat pipe comprises a flexible heat pipe boss engaging section, a flexible heat pipe liquid cooling plate boss connecting section, and a flexible heat pipe liquid cooling plate engaging section; the flexible heat pipe liquid cooling plate boss connecting section is used to achieve efficient heat-conducting flexible connection between the boss and the liquid cooling plate.

6. The liquid cooling plate assembly with both active and passive heat dissipation for high heat flux density chips according to claim 1, characterized in that: The spring screw is used for rigid connection between the boss and the high heat flux density chip; that is, for realizing rigid contact and compression between the high heat flux density chip and the boss.

7. The liquid cooling plate assembly with both active and passive heat dissipation for high heat flux density chips according to claim 1, characterized in that: The thermal pad needs to be a flexible thermal pad with compressibility and adhesion.

8. The liquid cooling plate assembly with both active and passive heat dissipation for high heat flux density chips according to claim 1, characterized in that: The threshold signal can be set by monitoring the temperature of the high heat flux density chip. If the threshold is exceeded, the start-stop signal is fed back to the switch to start the pump. This can then automatically start and stop active liquid cooling. When the temperature does not exceed the threshold, passive cooling is achieved by the liquid cooling plate temperature equalizer VC. When the temperature exceeds the threshold, the pump is automatically started to achieve active and passive cooling at the same time.

9. A liquid cooling plate assembly with both active and passive heat dissipation for high heat flux density chips according to claim 8, characterized in that: The pump is used to provide a low-temperature liquid cooling medium flow power source for the entire liquid cooling plate. The low-temperature liquid cooling medium enters the liquid cooling plate from the liquid cooling plate working medium inlet through the liquid cooling pipeline, flows out from the liquid cooling plate working medium outlet through the liquid cooling flow channel, and flows to the heat exchanger through the liquid cooling flow channel to realize heat exchange, thereby realizing active liquid cooling heat dissipation and passive VC heat dissipation functions.

10. The liquid cooling plate assembly with both active and passive heat dissipation for high heat flux density chips according to claim 9, characterized in that: When the temperature is equal to the threshold, the pump does not start and passive heat dissipation is achieved by the liquid cooling plate.

Images