High-frequency transmission line and transmission equipment

Abstract

The invention provides a high-frequency transmission line, which is applied to the technical field of semiconductors, and comprises a substrate comprising an upper surface and a lower surface opposite to each other along a depth direction; the signal electrode is arranged in the middle of the upper surface of the substrate; the grounding electrodes are arranged on the lower surface of the substrate and the two sides of the signal electrode on the upper surface of the substrate, at least one through hole penetrating through the grounding electrodes on the upper surface and the lower surface and the substrate in the depth direction is formed in the grounding electrodes on the two sides of the upper surface of the substrate, and each through hole comprises a first part and second parts located on the two opposite sides of the first part; the first part is in a cuboid shape, and the second part is in a cylinder shape with an arch-shaped or semicircular cross section. The signal shielding effect can be effectively improved.

Description

Technical Field

[0001] The present disclosure relates to the field of semiconductor technology, and more particularly to a high-frequency transmission line and a transmission device. Background Art

[0002] The development of high-speed optical transmission systems has been promoted by technologies such as 5G communication, artificial intelligence, and cloud computing. In the context of increasing signal transmission rates, especially for long-distance electrical connections during packaging, high-frequency transmission lines have advantages such as low reflection, low loss, and high reliability compared to gold wires. At the same time, in order to increase the transmission rate, the method of using multi-channel high-frequency transmission lines will cause crosstalk problems, affecting the signal transmission quality. Summary of the Invention

[0003] In view of the above problems, the present disclosure provides a high-frequency transmission line and a transmission device.

[0004] According to a first aspect of the present disclosure, there is provided a high-frequency transmission line, comprising:

[0005] A substrate including an upper surface and a lower surface opposite to each other in the depth direction;

[0006] A signal electrode disposed in the middle of the upper surface of the substrate;

[0007] A ground electrode disposed on the lower surface of the substrate and on both sides of the signal electrode on the upper surface of the substrate. At least one through hole penetrating the ground electrode and the substrate in the depth direction is formed on the ground electrodes on both sides of the upper surface of the substrate. The through hole includes a first part and second parts located on opposite sides of the first part. The shape of the first part is a cuboid, and the shape of the second part is a cylinder with a cross section in the shape of a bow or a semicircle.

[0008] According to an embodiment of the present disclosure, the radii of the cross-sectional shapes of the two second parts are the same.

[0009] According to an embodiment of the present disclosure, a conductive layer is provided on the surface of the through hole.

[0010] According to an embodiment of the present disclosure, the number of through holes formed on the ground electrodes on both sides of the upper surface of the substrate is the same.

[0011] According to an embodiment of the present disclosure, the substrate material is aluminum nitride, silicon dioxide, PCB, or glass.

[0012] According to an embodiment of the present disclosure, the materials of the signal electrode, the ground electrode, and the conductive layer are gold or copper.

[0013] According to an embodiment of the present disclosure, the through holes formed on the ground electrodes on both sides of the upper surface of the substrate are symmetrically distributed along the signal electrode.

[0014] According to an embodiment of the present disclosure, the through holes formed in the grounding electrodes on both sides of the upper surface of the substrate are evenly distributed.

[0015] According to a second aspect of the present disclosure, there is also provided a transmission device, including a radio frequency port and an antenna, and the radio frequency port and the antenna are connected by the high-frequency transmission line according to the first aspect.

[0016] According to the high-frequency transmission line and the transmission device provided by the embodiments of the present disclosure, the high-frequency transmission line includes a substrate, a signal electrode, and a grounding electrode. The substrate includes an upper surface and a lower surface opposite to each other in the depth direction. The signal electrode is disposed in the middle of the upper surface of the substrate. The grounding electrode is disposed on the lower surface of the substrate and on both sides of the upper surface of the substrate. At least one through hole penetrating the grounding electrode and the substrate in the depth direction is formed in the grounding electrodes on both sides of the upper surface of the substrate. The through hole includes a first portion and second portions located on opposite sides of the first portion. The shape of the first portion is a cuboid, and the shape of the second portion is a cylinder with a cross-section in the shape of a bow or a semi-circle. This high-frequency transmission line can effectively improve the signal shielding effect, reduce the crosstalk between signals, and improve the signal transmission quality of the high-frequency transmission line. Description of the Drawings

[0017] Through the following description of the embodiments of the present disclosure with reference to the drawings, the above content and other objects, features, and advantages of the present disclosure will become clearer. In the drawings:

[0018] Figure 1 Schematically shows the structural diagram of the high-frequency transmission line;

[0019] Figure 2 Schematically shows the structural diagram of the through hole in the high-frequency transmission line. Detailed Embodiments

[0020] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. However, it should be understood that these descriptions are merely exemplary and are not intended to limit the scope of the present disclosure. In the following detailed description, for the sake of explanation, many specific details are set forth to provide a comprehensive understanding of the embodiments of the present disclosure. However, obviously, one or more embodiments can also be implemented without these specific details. In addition, in the following description, descriptions of well-known structures and technologies are omitted to avoid unnecessarily confusing the concepts of the present disclosure.

[0021] The terms used herein are merely for describing specific embodiments and are not intended to limit the present disclosure. The terms "including", "comprising", etc. used herein indicate the presence of the described features, steps, operations, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, or components.

[0022] All terms used herein (including technical and scientific terms) have the meanings commonly understood by those skilled in the art, unless otherwise defined. It should be noted that the terms used herein should be interpreted as having a meaning consistent with the context of this specification, and should not be interpreted in an idealized or overly rigid manner.

[0023] Figure 1 The structural diagram of a high-frequency transmission line is schematically shown.

[0024] As Figure 1 shown, the high-frequency transmission line of this embodiment includes a substrate 1, a signal electrode 3, and a ground electrode 4. The substrate 1 includes an upper surface and a lower surface opposite to each other in the depth direction. The signal electrode 3 is disposed in the middle of the upper surface of the substrate 1. The ground electrode 4 is disposed on the lower surface of the substrate 1 and on both sides of the signal electrode 3 on the upper surface of the substrate 1. At least one through hole 2 penetrating the ground electrode 4 and the substrate 1 in the depth direction is formed on the ground electrode 4. The through hole 2 includes a first portion 21 and second portions 22 located on opposite sides of the first portion. The shape of the first portion 21 is a cuboid, and the shape of the second portion 22 is a cylinder with a bow-shaped or semi-circular cross section. This high-frequency transmission line can effectively improve the signal shielding effect, reduce the crosstalk between signals, and improve the signal transmission quality of the high-frequency transmission line.

[0025] It can be understood that the height of the through hole 2 is equal to the height of the first portion 21 and is equal to the height of the second portion 22. The height of the through hole 2 is equal to the sum of the thicknesses of the substrate 1, the ground electrode 4 on the upper surface of the substrate, and the ground electrode 4 on the lower surface of the substrate.

[0026] In some embodiments, the number of through holes 2 formed on the ground electrodes 4 on both sides of the upper surface of the substrate 1 is the same. For example, 3 through holes, 4 through holes, 6 through holes, etc. are respectively formed on both sides.

[0027] In some embodiments, the through holes 2 formed on the ground electrodes 4 on both sides of the upper surface of the substrate 1 are symmetrically distributed along the signal electrode 3. Symmetrical distribution can reduce the reflection and interference of high-frequency signals during transmission, thereby maintaining the integrity of high-frequency signals.

[0028] In some embodiments, the through holes 2 formed on the ground electrodes 4 on both sides of the upper surface of the substrate 1 are evenly distributed. The evenly distributed through holes 2 can reduce the impedance change and reflection of high-frequency signals during interlayer switching, thereby helping to maintain the integrity of high-frequency signals

[0029] Figure 2 The structural diagram of the through hole in the high-frequency transmission line is schematically shown.

[0030] As Figure 1As shown, the through-hole of this embodiment includes a first part 21 and second parts 22 located on opposite sides of the first part. The shape of the first part 21 is a cuboid, and the shape of the second part 22 is a cylinder with a bow-shaped or semi-circular cross-section. The radii of the two second parts 22 are the same, that is, the radii of the two bows are the same or the radii of the two semi-circles are the same.

[0031] In some embodiments, a conductive layer is provided on the surface of the through-hole 2. The conductive layer can be provided on the surface of the through-hole 2 by electroplating or coating. The material of the conductive layer can be a conductive material such as gold or copper.

[0032] In one embodiment, the radius of the second part 22 is 0.109 mm. The length of the cuboid is 0.149 mm. The height of the through-hole 2 is 0.202 mm. A gold-plated conductive layer is attached to the inner wall of the through-hole 2. The structure of this embodiment can achieve simulation results of S21@-3dB 83.09 GHz and S11@-10dB 81.05 GHz, which are better than the simulation results of S21@-3dB 76.42 GHz and S11@-10dB 78.23 GHz of a cylindrical through-hole structure with the same radius.

[0033] In another embodiment, the radius of the second part 22 is 0.08 mm. The length of the cuboid is 0.14 mm. The height of the through-hole 2 is 0.202 mm. A gold-plated conductive layer is attached to the inner wall of the through-hole 2. The structure of this embodiment can achieve simulation results of S21@-3dB 76.77 GHz and S11@-10dB 78.36 GHz, which are better than the simulation results of S21@-3dB 66.65 GHz and S11@-10dB 64.84 GHz of a cylindrical through-hole structure with the same radius.

[0034] In yet another embodiment, the radius of the second part 22 is 0.109 mm. The length of the cuboid is 0.149 mm. The height of the through-hole 2 is 0.15 mm. A gold-plated conductive layer is attached to the inner wall of the through-hole 2. The structure of this embodiment can achieve simulation results of S21@-3dB 90.93 GHz and S11@-10dB 85.07 GHz, which are better than the simulation results of S21@-3dB 81.98 GHz and S11@-10dB 81.97 GHz of a cylindrical through-hole structure with the same radius.

[0035] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and not to limit them. Since various changes can be made in the above products and methods without departing from the scope of the present invention, it is intended that all the gists contained in the above description be understood as exemplary rather than restrictive. The above description of the embodiments is only intended to enable other technicians in the art to understand the present invention, its principles and its practical applications, so that other technicians in the art can adjust and apply the present invention in various forms, so as to make it best suit the requirements of specific applications.

[0036] Those skilled in the art can understand that the features recited in the various embodiments and / or claims of the present disclosure can be combined or combined in various ways, even if such combinations or combinations are not explicitly recited in the present disclosure. In particular, without departing from the spirit and teachings of the present disclosure, the features recited in the various embodiments and / or claims of the present disclosure can be combined and combined in various ways. All such combinations and / or combinations fall within the scope of the present disclosure.

[0037] The above embodiments of the present disclosure have been described. However, these embodiments are only for illustrative purposes and not for limiting the scope of the present disclosure. Although the embodiments have been described separately above, this does not mean that the measures in the respective embodiments cannot be used advantageously in combination. The scope of the present disclosure is defined by the appended claims and their equivalents. Without departing from the scope of the present disclosure, those skilled in the art can make various substitutions and modifications, and all such substitutions and modifications should fall within the scope of the present disclosure.

Claims

1. A high frequency transmission line, characterized in that: include: A substrate including an upper surface and a lower surface opposite to each other in a depth direction; A signal electrode is arranged in the middle of the upper surface of the substrate; The grounding electrodes are arranged on both sides of the signal electrode on the lower surface of the substrate and the upper surface of the substrate. At least one through hole is opened on the grounding electrodes on both sides of the upper surface of the substrate, penetrating the grounding electrode and the substrate along the depth direction. The through hole includes a first part and a second part located on two opposite sides of the first part. The first part is in the shape of a rectangular parallelepiped, and the second part is in the shape of a column with an arcuate or semicircular cross-section.

2. The high-frequency transmission line according to claim 1, characterized in that: The radii of the cross-sectional shapes of the two second portions are the same.

3. The high-frequency transmission line according to claim 1, characterized in that: The ground electrodes on both sides of the upper surface of the substrate have the same number of through holes.

4. The high-frequency transmission line according to claim 1, characterized in that: The through holes formed in the grounding electrodes on both sides of the upper surface of the substrate are symmetrically distributed along the signal electrodes.

5. The high-frequency transmission line according to claim 1, characterized in that: The through holes formed on the grounding electrodes on both sides of the upper surface of the substrate are evenly distributed.

6. The high-frequency transmission line according to claim 1, characterized in that: A conductive layer is arranged on the surface of the through hole.

7. The high-frequency transmission line according to claim 1, characterized in that: The substrate material is aluminum nitride, silicon dioxide, PCB or glass.

8. The high-frequency transmission line according to claim 1, characterized in that: The signal electrode, the ground electrode and the conductive layer are made of gold or copper.

9. A transmission device, characterized in that: The transmission device includes a radio frequency port and an antenna, and the radio frequency port and the antenna are connected via a high-frequency transmission line as described in any one of claims 1-8.

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