Semiconductor laser module leveling device and use method thereof

Abstract

The invention relates to the technical field of laser adjustment, in particular to a semiconductor laser module leveling device and a use method thereof, and the device comprises a laser offset detection module, an offset calculation module, an interference measurement analysis module, a driving compensation execution module and an error compensation optimization module. According to the invention, the light spot center position of the semiconductor laser module is precisely monitored and compared with the target position, and the position deviation between the light spot and the target is recorded and calculated in real time, so that the laser alignment precision can be improved, the position of the laser module is adjusted by utilizing the precise movement of the micropositioner, and the transmission effect of the laser beam is further optimized; according to the method and the device, errors caused by tiny movement or external changes of the device are reduced, the cooperative work efficiency among a plurality of laser modules is remarkably improved by comprehensively analyzing adjusted data and optimizing an error compensation strategy, high-quality laser output and application effects are ensured, and the yield and the research precision can be remarkably improved.

Description

Technical Field

[0001] The present invention relates to the technical field of laser adjustment, and particularly to a leveling device for a semiconductor laser module and a method for using the same. Background Art

[0002] The technical field of laser adjustment includes a variety of laser devices and their application devices, which are widely used in industries, medical treatment, communications and other fields. The core content of laser technology involves aspects such as the generation, modulation, transmission and detection of laser. Laser technology mainly includes types such as solid-state lasers, gas lasers and semiconductor lasers. Based on different working media and excitation conditions, various lasers exhibit different performance characteristics and application fields. When introducing laser technology in terms of devices, technical details such as the wavelength selection, output power, laser beam quality and device integration of the laser also need to be considered.

[0003] Among them, a leveling device for a semiconductor laser module refers to a device used to adjust the flatness and alignment accuracy of a semiconductor laser module during the assembly process. The technical matters targeted by this patent theme cover the precise installation and adjustment of the semiconductor laser module, specifically achieved through a mechanical adjustment mechanism and a fine adjustment device. The mechanism and device can adjust the position and angle of the laser module in multiple directions to ensure the stability and accuracy of laser output. The device includes components such as a bracket, adjustment screws and positioning pins, and the components work together to achieve the precise leveling and fixation of the laser module.

[0004] Although the existing laser adjustment technologies are widely used in various fields, in actual operation, they have obvious deficiencies in terms of sensitivity to environmental changes and adjustment accuracy. After the laser operates for a long time or the external environment changes (such as temperature fluctuations, mechanical vibrations, etc.), the position of its light beam will shift, affecting the effect and accuracy of the laser. The resulting deviation requires manual intervention for adjustment, which not only consumes time and effort, but also affects the efficiency of continuous production and research. For example, in precision machining, even a tiny light beam deviation will cause product quality problems and increase the scrap rate. In high-precision medical applications such as laser surgery, a tiny deviation in the position of the light beam poses a major risk to patient safety. The existing technologies lack the ability to quickly and automatically monitor the deviation in real time and make immediate adjustments, so they face challenges in ensuring the high precision and stability of laser applications. Summary of the Invention

[0005] The purpose of the present invention is to solve the drawbacks existing in the prior art, and to propose a leveling device for a semiconductor laser module and a method for using the same.

[0006] To achieve the above purpose, the present invention adopts the following technical solutions. A leveling device for a semiconductor laser module includes: The laser offset detection module obtains the spot center coordinates of the semiconductor laser module, refers to the position of the reference target, records the absolute coordinates of the spot on the horizontal, vertical, and longitudinal axes, calculates the offset between the spot center and the reference target coordinates, analyzes the morphological characteristics of the beam intensity distribution, evaluates the influence of environmental changes on the beam position, and generates beam offset information; The offset calculation module extracts the spot coordinates of the semiconductor laser module based on the beam offset information, analyzes the displacement of adjacent spots, compares the spot center offset, screens the semiconductor laser modules that need to be adjusted first, identifies the adjustment requirements, and obtains the laser module adjustment reference data; The interference measurement and analysis module uses the laser module adjustment reference data to analyze the micro-displacements of the laser module on the horizontal, vertical, and longitudinal axes, identifies the changes in the beam propagation angle, and generates the module displacement correction parameters; The drive compensation execution module uses the module displacement correction parameters to calculate the displacement compensation amount required for the semiconductor laser module, calls the real-time position information of the semiconductor laser module, detects the adjusted spot position, analyzes the change in the spot center before and after adjustment, evaluates the error correction degree after adjustment, and generates the displacement compensation adjustment result.

[0007] As a further solution of the present invention, the beam offset information includes the absolute coordinates of the beam position, the morphological characteristics of the beam, the environmental sensitivity, and the offset trend. The laser module adjustment reference data includes the module adjustment priority, the displacement difference between adjacent spots, and the module adjustment requirements. The module displacement correction parameters include the axial micro-displacement, the angle deviation value, and the displacement error amount. The displacement compensation adjustment result includes the displacement compensation amount, the change value of the spot position, and the error correction degree.

[0008] As a further solution of the present invention, the laser offset detection module includes: The spot center positioning sub-module obtains the spot emitted by the semiconductor laser module, detects the edge information, brightness distribution, and morphological characteristics of the spot, records the horizontal, vertical, and longitudinal coordinates of the spot center, and obtains the absolute coordinates of the spot center; The spot offset calculation sub-module, based on the absolute coordinates of the spot center, calls the absolute coordinates of the reference target, and uses the formula: ; Calculates the spot center offset; wherein, represents the spot center offset, represents the horizontal, vertical, and longitudinal coordinates of the spot center absolute coordinates, represents the reference target the horizontal, vertical, and longitudinal coordinates of the absolute coordinates; The beam feature analysis sub-module uses the spot center offset to detect the energy density distribution of the beam in the differential region, calculate the change gradient of the beam intensity, and analyze the influence of environmental changes on the beam stability to obtain the beam offset information.

[0009] As a further solution of the present invention, the offset calculation module includes: The spot offset analysis sub-module extracts the spot coordinates of the semiconductor laser module based on the beam offset information, analyzes the displacement of adjacent spots, compares the offset of the spot center, calculates the displacement value of the spot center, and uses the formula: ; Calculate the displacement parameter between spots, and combine it with the spot center offset to obtain the spot offset comparison result; Wherein, represents the displacement parameter between spot and spot , represents the center coordinate of spot , represents the center coordinate of spot , , represents the light intensity values of spot and , represents the total light intensity of the spot, represents the light intensity value of spot ; The laser module screening sub-module calls the spot offset comparison result, identifies the modules that need to be adjusted preferentially, and combines the spot center offset and the displacement parameter between spots to obtain the laser module adjustment reference data.

[0010] As a further solution of the present invention, the interference measurement analysis module includes: The beam propagation analysis sub-module detects the propagation path of the beam in the horizontal, vertical, and longitudinal axis directions based on the laser module adjustment reference data, analyzes the changes in the incident angle and refraction angle of the beam in the differential axis, and obtains the beam offset angle; The micro-displacement calculation sub-module uses the beam offset angle and combines it with the propagation path of the beam, and uses the formula: ; Calculate the displacement amounts of the semiconductor laser module in the horizontal, vertical, and longitudinal axes to obtain the module displacement amount; Wherein, represents the module displacement amount, respectively represent the initial and real-time coordinates of the laser module, represents the th measured beam offset angle, represents the initial beam angle, represents the conversion coefficient of the angle change, represents the number of measurements; The displacement adjustment sub-module calls the displacement of the module, analyzes the displacement distribution characteristics of different axial directions, screens the displacement peak interval, calculates the axial displacement correction amount, and obtains the module displacement correction parameter.

[0011] As a further solution of the present invention, the drive compensation execution module includes: The displacement correction calculation sub-module uses the module displacement correction parameter, calls the real-time position information of the semiconductor laser module, calculates the deviation between the theoretical compensation displacement amount and the real-time position information, and uses the formula: ; Calculate the compensation adjustment amount , and obtain the theoretical compensation displacement correction value; Among them, represents the compensation adjustment amount, represents the theoretical position information, represents the real-time position information, represents the unit compensation ratio, represents the target position coordinate, represents the real-time position coordinate; The compensation adjustment sub-module calls the theoretical compensation displacement correction value, combines with the piezoelectric micro-stage, adjusts the real-time position of the semiconductor laser module, analyzes the real-time position information of the module after adjustment, calculates the spot center offset amount, analyzes the error correction degree of the compensation adjustment, and obtains the displacement compensation adjustment result.

[0012] As a further solution of the present invention, the device further includes an error compensation optimization module: The error compensation optimization module calls the recent spot offset data according to the displacement compensation adjustment result, calculates the error change range, calls the beam offset data before and after adjustment, identifies the stability of the error correction, evaluates the alignment state of the multi-module spots, and generates a beam deviation correction result; The beam deviation correction result includes the error fluctuation range, error stability, and multi-module alignment degree.

[0013] As a further solution of the present invention, the error compensation optimization module includes: The error change calculation sub-module calls the recent spot offset data according to the displacement compensation adjustment result, extracts the beam offset values at multiple time points, compares the offset trends in different time periods, determines the amplitude and direction of the error change, and uses the formula: ; Calculate the error change range of the beam offset to obtain the beam offset error interval; Among them, represents the error change range, represents the beam offset value at the th time point, represents the beam offset value at the th time point, represents the total number of data points, Calculate the offset change between adjacent time points;

[0014] The method for using the semiconductor laser module is executed based on the above semiconductor laser module leveling device, and includes the following steps: S1: Obtain the spot center coordinates of the semiconductor laser module, compare with the reference target position, calculate the horizontal, vertical and vertical offsets, analyze the beam intensity distribution, and generate beam offset information; S2: Based on the beam offset information, analyze the beam drift amplitude, screen the laser modules with offsets exceeding the threshold, sort the offset amplitudes, identify the adjustment requirements, and obtain the laser module adjustment reference data; S3: Call the laser module adjustment reference data, analyze the micro-displacements of the horizontal, vertical and vertical axes of the laser module, calculate the change in the beam propagation angle, compare with the adjustment reference value, and generate the module displacement correction parameter; S4: Use the module displacement correction parameter to calculate the displacement compensation amount of the piezoelectric micro-stage, perform the adjustment operation, re-detect the spot center, calculate the corrected offset error, and generate the displacement compensation adjustment result; S5: Use the displacement compensation adjustment result to calculate the error correction range, compare with the beam offset data, analyze the spot alignment state, screen the semiconductor laser modules that do not meet the standards, and generate the beam deviation correction result.

[0015] Compared with the prior art, the advantages and positive effects of the present invention are as follows: In the present invention, by precisely monitoring the spot center position of the semiconductor laser module and comparing it with the target position, recording and calculating the position deviation between the spot and the target in real time, the alignment accuracy of the laser can be improved. By continuously monitoring the position change of the light beam, the influence of environmental factors on the laser stability can be effectively evaluated, and real-time adjustment can be made based on the data to ensure the consistency and accuracy of the laser output. The position of the laser module is adjusted by the precise movement of the micro-stage to further optimize the transmission effect of the laser beam and reduce the error caused by the micro-movement of the device or external changes. By comprehensively analyzing the adjusted data and optimizing the error compensation strategy, the collaborative working efficiency among multiple laser modules can be significantly improved, ensuring high-quality laser output and application effects. This precise real-time adjustment and the error compensation ability of the device enable the laser equipment to perform more excellently in applications with high-precision requirements. For example, in precision manufacturing or high-end scientific research, the yield and research accuracy can be significantly improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is the device flowchart of the present invention; Figure 2 is the flowchart of the laser offset detection module of the present invention; Figure 3 is the flowchart of the offset calculation module of the present invention; Figure 4 is the flowchart of the interference measurement analysis module of the present invention; Figure 5 is the flowchart of the drive compensation execution module of the present invention; Figure 6 is the flowchart of the error compensation optimization module of the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0017] In order to make the objectives, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0018] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention. In addition, in the description of the present invention, "a plurality of" means two or more unless otherwise specifically defined.

[0019] Please refer to Figure 1, the present invention provides a technical solution, a semiconductor laser module leveling device includes.

[0020] The laser offset detection module obtains the spot center coordinates of the semiconductor laser module, refers to the position of the reference target, records the absolute coordinates of the spot on the horizontal, vertical and vertical axes, calculates the offset between the spot center and the reference target coordinates, analyzes the morphological characteristics of the beam intensity distribution, evaluates the influence of environmental changes on the beam position, and generates beam offset information; The offset calculation module extracts the spot coordinates of the semiconductor laser module based on the beam offset information, analyzes the displacement of adjacent spots, compares the spot center offset, screens the semiconductor laser modules to be adjusted preferentially, identifies the adjustment requirements, and obtains the laser module adjustment reference data; The interference measurement and analysis module uses the laser module adjustment reference data to analyze the micro-displacements of the laser module on the horizontal, vertical and vertical axes, identifies the changes in the beam propagation angle, analyzes the displacement information of the semiconductor laser module, and generates module displacement correction parameters; The drive compensation execution module uses the module displacement correction parameters, combines with the piezoelectric micro-stage, calculates the displacement compensation amount required for the semiconductor laser module, calls the real-time position information of the semiconductor laser module, adjusts the moving distance of the piezoelectric micro-stage, detects the spot position after adjustment, analyzes the change in the spot center before and after adjustment, evaluates the error correction degree after adjustment, and generates a displacement compensation adjustment result; The error compensation and optimization module calculates the error change range according to the displacement compensation adjustment result, calls the recent spot offset data, calls the beam offset data before and after adjustment, identifies the stability of error correction, evaluates the alignment state of multi-module spots, and generates a beam deviation correction result; The beam offset information includes the absolute coordinates of the beam position, the beam morphological characteristics, the environmental sensitivity, and the offset trend. The laser module adjustment reference data includes the module adjustment priority, the displacement difference between adjacent spots, and the module adjustment requirements. The module displacement correction parameters include the axial micro-displacement, the angle deviation value, and the displacement error amount. The displacement compensation adjustment result includes the displacement compensation amount, the spot position change value, and the error correction degree. The beam deviation correction result includes the error fluctuation range, the error stability, and the multi-module alignment degree.

[0021] Please refer to Figure 2 , the laser offset detection module includes: The spot center positioning sub-module obtains the spot emitted by the semiconductor laser module, detects the edge information, brightness distribution and morphological characteristics of the spot, records the horizontal, vertical and vertical coordinates of the spot center, and obtains the absolute coordinates of the spot center; Obtain the light spot emitted by the semiconductor laser module, detect the edge information, brightness distribution and morphological characteristics of the light spot, collect the light spot image using a high-resolution optical sensor, convert the image into a grayscale matrix, calculate the pixel grayscale change rate using the Sobel gradient operator, set the grayscale threshold, screen out the light spot edge pixel points, form a preliminary light spot contour, perform least squares ellipse fitting on the edge points to obtain the geometric parameters of the light spot, including the major axis, minor axis, and tilt angle, calculate the light spot center coordinates, and use the integral light intensity method for the light spot brightness distribution to calculate the total light intensity value of the pixel points in the light spot area and perform regional normalization to calculate the light spot center offset. The formula is as follows: and ; where, ( ) are the horizontal and vertical coordinates of the light spot center respectively, is the light intensity value of the pixel point, are the coordinates of the pixel point; Taking the measurement data of a certain frame of image as an example, set the light intensity values of five pixel points to be respectively, and the corresponding coordinate values are , , , , respectively, and calculate the light spot center coordinates: ; ; ; Obtain the absolute coordinates of the light spot center .

[0022] Based on the absolute coordinates of the light spot center, the light spot offset calculation sub-module calls the absolute coordinates of the reference target target and uses the formula: ; Calculate the light spot center offset; where, represents the light spot center offset, represents the horizontal, vertical, and vertical coordinates of the absolute coordinates of the light spot center , represents the horizontal, vertical, and vertical coordinates of the absolute coordinates of the reference target target ; Parameter meaning and calculation process: represents the absolute coordinates of the light spot center, Represent the absolute coordinates of the reference target. All coordinates are obtained by a high-precision image sensor and a target calibration device. The image sensor provides the position of the center of the light spot, while the target calibration device provides the fixed coordinate data of the reference target. The multi-frame measurement method is used to measure the center coordinates of the light spot. 10 frames of light spot images are obtained, and the center coordinates of the light spot calculated for each frame are: (12.3, 8.5, 3.1), (12.4, 8.6, 3.2), (12.2, 8.7, 3.0), (12.5, 8.5, 3.1), (12.3, 8.6, 3.2), (12.4, 8.5, 3.1), (12.2, 8.7, 3.1), (12.5, 8.6, 3.2), (12.3, 8.5, 3.1), (12.4, 8.6, 3.2); Take the mean value as the center coordinates of the light spot: ; ; ; The coordinates of the reference target are measured by a precision positioning instrument. The data is stable and fixed at (10.0, 7.2, 3.0). Substitute it into the formula: ; ; ; The result shows that the center of the light spot is offset by 2.74 mm compared to the target, exceeding the set allowable offset range (2.5 mm). Therefore, it is necessary to further analyze the beam stability and the influence of the external environment.

[0023] The beam feature analysis sub-module uses the offset of the center of the light spot to detect the energy density distribution of the beam in different regions, calculate the change gradient of the beam intensity, and analyze the influence of environmental changes on the beam stability to obtain the beam offset information; Detect the energy density distribution of the detection beam. Use a high-precision light intensity sensor to arrange multiple measurement points in the target area, collect light intensity data at uniform intervals, measure the light intensity values of the beam at different positions, and measure the light intensity distribution in a grid pattern within the detection area to comprehensively evaluate the change trend of the beam intensity. During data collection, each measurement point is measured multiple times to reduce the influence of environmental interference on the measurement data. At the same time, calculate the mean and standard deviation of the light intensity at each measurement point to evaluate the stability of the beam. Set the light intensity threshold based on the mean light intensity in the central area of the light intensity distribution in the core area of the beam. The calculation method is 85% of the mean light intensity in the core area. This value is set based on the beam energy distribution law to ensure a clear distinction between the core area and the boundary area. If the light intensity values of the five measurement points in the core area are 32, 35, 40, 38, and 34 respectively, the mean value is calculated as follows: ; Set the threshold for the core area of the beam: ; This threshold determines that some areas belong to the core area of the light spot. If the light intensity value of a measurement point is less than 30.43, it is determined to be the edge area of the beam. Mark the areas with light intensity higher than this threshold and compare the light intensity change trend with that of the edge area. To analyze the overall uniformity of the beam, calculate the change gradient of the beam energy distribution and mark the areas where the change rate exceeds the set light intensity change rate reference value to determine whether the beam stability is affected by environmental factors. The setting of this reference value is based on the data measured in the experiment. This value is the ratio of the standard deviation to the mean value in the core area of the beam, representing the fluctuation range of the light intensity in the core area. Taking the measured data as an example, set the light intensity measured in the core area , calculate the standard deviation: ; Calculate the reference value of the light intensity change rate: ; This reference value is used to determine the stability of the beam. If the light intensity change rate of a measurement point exceeds 7.82%, it is considered that there is an obvious light intensity fluctuation in this area and it is affected by external environmental factors. For the areas with a large light intensity change rate, further analyze the probability of being affected by external environmental factors, including temperature change, air flow or external vibration. Obtain environmental data and compare the beam change trend to evaluate the impact of the environment on the beam stability. Compare the current beam distribution situation, calculate the direction and amplitude of the beam offset, and analyze the change trend of the beam stability based on long-term data analysis to obtain the beam offset information.

[0024] Please refer to Figure 3 , the offset calculation module includes: Based on the beam offset information, the spot offset analysis sub-module extracts the spot coordinates of the semiconductor laser module, analyzes the displacement of adjacent spots, compares the offset of the spot center, calculates the displacement value of the spot center, and uses the formula: ; Calculate the displacement parameter between spots, and combine it with the spot center offset to obtain the spot offset comparison result; Among them, represents the displacement parameter between spot and spot , ([[]] ) represents the center coordinate of spot , , ) represents the center coordinate of spot , , represent the light intensity values of spot and , represents the total light intensity of the spots, represents the light intensity value of spot ; Parameter meaning and calculation process: The Euclidean distance calculation term of the spot center coordinate, which calculates the geometric distance between spot and spot , and the calculation method is as follows: The monitoring device uses a high-precision CCD camera (resolution 640×480 pixels, pixel size 5.6μm×5.6μm) to collect images of the spots. After gray threshold segmentation and centroid method calculation, the spot center coordinates are obtained; Let the coordinate of spot be , and the coordinate of spot be , then its Euclidean distance is calculated as follows: ; Light intensity difference term: This term measures the relative change degree of the light intensity between spots, and its calculation method is as follows: Use a power meter to measure the light intensity of spot W / m2, and the light intensity of spot ; The total light intensity in the entire laser module is calculated by accumulating the light intensities of all spots and is measured to be 1000; Calculate the light intensity difference term: ; Substitute the above calculation results into the formula: ; The result shows that the comprehensive displacement parameter between the light spot and the light spot is 10.02. This value can be used to determine whether there is a large offset of the light spot. If it exceeds the offset threshold (set to 5.0μm), it indicates that the light spot needs further adjustment.

[0025] The laser module screening sub-module calls the light spot offset comparison result, identifies the modules that need to be adjusted first, combines the light spot center offset and the displacement parameter between light spots, and obtains the laser module adjustment reference data; Screen the semiconductor laser modules with large offsets. Set an offset threshold of 10.0μm. Compare the relative displacement parameter in the light spot offset comparison result with this threshold. If the displacement parameter is greater than the threshold, it is determined that the corresponding laser module needs to be adjusted. Set the displacement parameter of a certain laser module to 12.0μm, which is greater than the threshold of 10.0μm, so this module needs to be adjusted. Identify the modules that need to be adjusted first. If there are multiple modules that need to be adjusted, sort them in descending order of the displacement parameter, and adjust the module with the largest displacement parameter first. Suppose there are three modules with displacement parameters of 12.0μm, 15.0μm, and 11.0μm respectively, then the adjustment order is the second module, the first module, and the third module. Combine the light spot center offset and the relative displacement parameter between light spots to identify the module adjustment priority, including the relative displacement parameter of each module and the corresponding adjustment priority. Set the adjustment priority as follows: Module B: Relative displacement parameter 15.0μm, priority 1; Module A: Relative displacement parameter 12.0μm, priority 2; Module C: Relative displacement parameter 11.0μm, priority 3; Obtain the laser module adjustment reference data.

[0026] Please refer to Figure 4 , the interference measurement analysis module includes: Based on the laser module adjustment reference data, the beam propagation analysis sub-module detects the propagation paths of the beam in the horizontal, vertical, and longitudinal axis directions, analyzes the changes in the incident angle and refraction angle of the beam in different axial directions, and obtains the beam offset angle; Detect the propagation paths of the beam in the horizontal, vertical, and longitudinal axis directions, obtain the initial beam position of the laser module, collect the spatial coordinates of the beam at multiple time points, calculate the motion trajectory of the beam for the coordinate positions of the beam at different time points to determine the propagation direction of the beam, use the coordinate difference method to calculate the propagation path of the beam, and select the time interval to be 0.1s. At moment, the beam position is (10.5, 20.2, 5.8)mm. At At this moment, the position of the light beam changes to (10.8, 20.6, 5.9) mm, then the displacement of the light beam is calculated as: ; ; According to the displacement of the light beam, the propagation speed is calculated: ; By calculating the change in the propagation path angle of the light beam in different axes, invoking the Euler angle calculation method in the three-axis coordinate system, transforming the coordinates to the reference system relative to the reference axis, and calculating the incident angle and the refraction angle , at and moments, the propagation direction vector of the light beam is (0.3, 0.4, 0.1), then its unit direction vector is (0.514, 0.686, 0.171). Relative to the reference axis axis, calculate the angle between the propagation direction of the light beam and the axis: ; Calculate the change in the propagation angle at different time points, screen out the change in the propagation angle of the light beam, and determine whether its angle change exceeds the set threshold of 5°, and calculate the offset angle of the light beam.

[0027] The micro-displacement calculation sub-module uses the offset angle of the light beam, combines the propagation path of the light beam, and uses the formula: ; Calculate the displacement of the semiconductor laser module in the horizontal, vertical and vertical axes, and obtain the module displacement; wherein, represents the module displacement, respectively represent the initial and real-time coordinates of the laser module, represents the th measured beam offset angle, represents the initial beam angle, represents the conversion coefficient of the angle change, represents the number of measurements; Parameter meaning and calculation process: Parameter represents the coordinate position of the laser module at different time points, which is detected by a high-precision displacement sensor. The data acquisition interval is 0.1 second. The coordinate data is measured and obtained by a three-axis ranging device, with the unit of millimeter. The initial coordinate of the laser module mm, mm, after 0.1 second, the coordinate changes to mm, mm; The parameter represents the offset angle of the laser module at different measurement time points, which is obtained by using a high-precision beam detection device. An angle sensor is used to calculate the change amount of the beam relative to the reference axis. The three measured angle offset values are , , , and the initial beam angle ; The parameter represents the number of measurements. During a measurement cycle, the data acquisition device makes three measurements. Therefore ; The parameter represents the conversion coefficient of the angle change. This value is affected by the beam propagation characteristics and is determined through experiments. A conversion coefficient of 0.02 is selected. This numerical value is determined by the optical laboratory measuring the relationship between different angle changes and displacement amounts. Its calculation method is: ; Among them, represents the unit displacement change caused by the angle change, represents the change amount of the beam angle, and the average value of 0.02 is obtained by measuring multiple groups of data; Calculate the first part of the displacement amount: ; ; Calculate the second part of the angle correction term: ; ; ; Calculate the total displacement amount: ; This result shows that the total displacement amount of the laser module during the measurement cycle is 0.93 mm, of which 0.92 mm is caused by coordinate changes and 0.0067 mm is affected by the beam propagation angle change. This numerical value is used for subsequent analysis of the micro-displacement trend of the module and serves as an input parameter for subsequent offset correction.

[0028] The displacement adjustment sub-module calls the module displacement amount, analyzes the displacement distribution characteristics of different axial directions, screens the displacement peak interval, calculates the axial displacement correction amount, and obtains the module displacement correction parameter; Analyze the displacement distribution characteristics of different axial directions, obtain the displacement data of multiple measurement points, and calculate the displacement increment at different time points , assuming at , , At three time points, the displacement amounts are respectively mm, mm, mm. Calculate the displacement increment: ; ; Screen the maximum change amount in the displacement increment , and compare it with the set threshold of 0.05 mm. If it exceeds the threshold range, calculate the axial displacement correction amount . Let the correction coefficient be , and calculate: ; Obtain the module displacement correction parameter.

[0029] Please refer to Figure 5 , the drive compensation execution module includes: The displacement correction calculation sub-module adopts the module displacement correction parameter, calls the real-time position information of the semiconductor laser module, calculates the deviation amount between the theoretical compensation displacement amount and the real-time position information, and uses the formula: ; Calculate the compensation adjustment amount , and obtain the theoretical compensation displacement correction value; Among them, represents the compensation adjustment amount, represents the theoretical position information, represents the real-time position information, represents the unit compensation ratio, represents the target position coordinate, represents the real-time position coordinate; Parameter acquisition and calculation method: (Theoretical position information): This parameter is obtained from the target trajectory data preset by the device. Based on the production process requirements and the standard position data measured during equipment calibration, combined with the trajectory data for correction calculation, the value taken in this calculation is mm; (Real-time position information): Obtain the actual position of the current module through a high-precision optical measurement device (such as a laser interferometer), measured with a micron-level accuracy, and the value taken in this calculation is mm; (Unit compensation ratio): This value is used to quantify the ratio of compensation adjustment. Its value is obtained based on empirical measurement and optimization adjustment, generally between 0.3 and 0.7, and the value taken in this calculation is ; (Target position coordinates): Determined by the set target position, depending on process requirements. The value taken in this calculation is mm, mm; (Real-time position coordinates): Measured by detecting the center position of the light spot through a high-precision CCD or a laser displacement sensor. The value taken in this calculation is mm, mm, Calculate the theoretical position deviation: ; Calculate the Euclidean distance between the target position and the real-time position: ; ; Calculate the compensation adjustment amount: ; The result represents the displacement compensation amount that the module currently needs to perform. This value is used to adjust the displacement of the piezoelectric micro-stage so that the module reaches the target theoretical position. The larger this value, the greater the deviation between the current actual position and the theoretical target position of the module, and a large adjustment is required. If the compensation adjustment amount is too high, a step-by-step adjustment strategy needs to be adopted to ensure the stability and controllability of the adjustment process.

[0030] The compensation adjustment sub-module calls the theoretical compensation displacement correction value, combines it with the piezoelectric micro-stage, adjusts the real-time position of the semiconductor laser module, analyzes the real-time position information of the module after adjustment, calculates the offset of the light spot center, analyzes the error correction degree of the compensation adjustment, and obtains the displacement compensation adjustment result; Combine the piezoelectric micro-stage to adjust the actual position of the semiconductor laser module, and use the calculated compensation adjustment amount as a control parameter and input it into the drive control of the piezoelectric micro-stage. According to the compensation adjustment amount, calculate the precise displacement amount of the micro-stage. Set the drive sensitivity of the piezoelectric micro-stage to 0.2μm / V, then the voltage that needs to be applied can be expressed as: ; In actual operation, the voltage will exceed the available range. Therefore, a segmented adjustment strategy is adopted, that is, the total compensation amount is decomposed into several small steps, and the adjustment amount of each step does not exceed the maximum driving voltage. If the maximum voltage output of the device is 1000V, the adjustment process can be divided into 8 steps, and each step is adjusted by 0.18mm. After each adjustment, the new position of the module is monitored in real time, and the adjusted position information is calculated. The adjusted spot center position is obtained through a high-precision CCD camera or a spot detection device. The spot center position before and after adjustment is compared to calculate the spot center offset. If the spot center is located at (9.5, 19.6) mm before adjustment and at (10.0, 20.0) mm after adjustment, the offset is calculated as follows: ; To further calculate the degree of error correction, the error correction rate can be defined for: ; The calculation shows that the error correction rate is about 55.6%. If the error correction rate is less than the set threshold (for example, 90%), further adjustment is required. After the adjustment is completed, the error correction situation is recorded to obtain the displacement compensation adjustment result.

[0031] See also Figure 6 , the error compensation optimization module includes: The error change calculation submodule calls the recent spot offset data according to the displacement compensation adjustment result, extracts the beam offset values ​​at multiple time points, compares the offset trends of differentiated time periods, and determines the magnitude and direction of the error change using the formula: ; Calculate the error variation range of the beam offset to obtain the beam offset error interval; in, Represents the error range, Representative The beam offset value at each time point, Representative The beam offset value at each time point, represents the total number of data points, Calculate the offset change between adjacent time points; Parameter meaning and formula calculation derivation process: Represents the error variation range and is a key parameter for measuring the amplitude of beam offset error. A larger value indicates a more drastic fluctuation in beam offset, and a smaller value indicates that the beam tends to be stable. Representative The beam offset value at each time point, which is collected by a high-precision photodetector or a CCD camera. The offset value at each time point is in micrometers (μm). Represents the total number of data points, which is the number of time samples within the entire measurement period and is determined according to the sampling rate of the optical device and the monitoring time. If the sampling rate of the device is 1000 Hz and the monitoring time is 0.1 second, then ; Table 1 Beam Offset Measurement Data ; As shown in Table 1, the beam offset data is obtained through measurements at consecutive time points, and the offset value is in μm. Calculate the offset change amount between adjacent time points: ; ; ; ; Calculate the error change range: ; This result indicates that within the measurement period, the average amplitude of the beam offset error change is 0.0875, indicating a small fluctuation range of the beam position. If this value exceeds the set error threshold (e.g., 0.1 μm), compensation and correction are required. In subsequent calculations, this value can be used as a reference parameter for beam offset to evaluate beam stability or adjust the beam path optimization strategy.

[0032] The correction stability evaluation sub-module, based on the beam offset error interval, calls the beam offset data before and after adjustment to evaluate the offset stability after adjustment, analyzes the offset fluctuation amplitude at different time points, judges the stability degree of the correction error, and obtains the beam offset correction stability. It is necessary to call the beam offset data before and after adjustment to analyze the fluctuation characteristics of the beam offset before and after adjustment. The beam offset data before adjustment is from the measurement record. During the operation of the laser, the offset value of the light spot changes due to temperature changes, equipment vibrations, or optical path errors. The data can be recorded by a high-precision position sensor or a photodetection device, calculated based on the measured offset value, and the adjusted compensation parameters, such as the compensated beam offset value, are output. To evaluate the stability of the adjustment, it is necessary to calculate the standard deviation of the data before and after adjustment to measure the fluctuation amplitude. The standard deviation can be calculated by the following formula: ; Among them, represents the offset value at the th time point, represents The average offset value at a time point; set the measured data before adjustment as 3.5μm, 3.7μm, 3.8μm, and the data after adjustment as 3.2μm, 3.3μm, 3.3μm. Then the standard deviation before adjustment is calculated as , and the standard deviation after adjustment is calculated as . It can be seen that the fluctuation range after adjustment is smaller. By comparing the changes in the standard deviation before and after adjustment, the stability of the correction error can be judged. If the standard deviation after adjustment is lower than a preset stability threshold, it indicates that the beam compensation has tended to be stable, and the beam offset correction stability is obtained.

[0033] The multi-module alignment analysis sub-module evaluates the alignment state of the multi-module light spots according to the beam offset correction stability, compares the offset consistency of different modules, identifies the light spot alignment deviation, and obtains the beam deviation correction result; It is necessary to further evaluate the alignment state of the multi-module light spots. In a multi-module device, the central position of each beam needs to be accurately measured. In a lidar or precision machining device, multiple beams need to be aligned within the same reference coordinate system. The light spot center coordinates of each module are measured using a photodetector or a high-resolution camera. The measurement data can be represented by (x, y) coordinates. The beam center coordinates of modules A, B, and C are (0.5, 0.5), (0.8, 0.5), and (0.6, 0.7) respectively. By calculating the light spot offset between different modules, the alignment accuracy of the light spots is evaluated. The calculation of the beam center offset between module A and B is as follows: ; Substitute the data to get: ; Similarly, the offset between module A and C is: ; If the calculated beam offset exceeds the set alignment threshold, set at 0.2μm, it is necessary to further adjust the angle or position of the beam. By adjusting the optical lens or the mechanical position of the module, the beam center offset is reduced to within the threshold range to obtain the beam deviation correction result.

[0034] The usage method of the semiconductor laser module is executed based on the above semiconductor laser module leveling device, including the following steps: S1: Obtain the light spot center coordinates of the semiconductor laser module, compare with the reference target position, calculate the lateral, longitudinal, and vertical offsets, analyze the beam intensity distribution, and generate beam offset information; S2: Based on the beam offset information, analyze the beam drift amplitude, screen the laser modules with offsets exceeding the threshold, sort the offset amplitudes, identify the adjustment requirements, and obtain the laser module adjustment reference data; S3: Call the reference data for laser module adjustment, analyze the micro-displacements of the horizontal, vertical, and longitudinal axes of the laser module, calculate the change in the beam propagation angle, compare with the adjustment reference value, and generate the module displacement correction parameter; S4: Use the module displacement correction parameter to calculate the displacement compensation amount of the piezoelectric micro-stage, perform the adjustment operation, re-detect the center of the light spot, calculate the correction offset error, and generate the displacement compensation adjustment result; S5: Use the displacement compensation adjustment result to calculate the error correction range, compare with the beam offset data, analyze the light spot alignment state, screen out the semiconductor laser modules that do not meet the standards, and generate the beam deviation correction result.

[0035] The above are only the preferred embodiments of the present invention, and do not limit the present invention in other forms. Any person skilled in the art may use the technical content disclosed above to make changes or modifications into equivalent embodiments with equivalent changes and apply them to other fields. However, as long as it does not depart from the technical solution content of the present invention, any simple modification, equivalent change, and modification made to the above embodiments based on the technical essence of the present invention still fall within the protection scope of the technical solution of the present invention.

Claims

1. A semiconductor laser module leveling device, characterized in that: The device comprises: The laser offset detection module obtains the center coordinates of the light spot of the semiconductor laser module, references the position of the target, records the absolute coordinates of the light spot in the horizontal, vertical and vertical axes, calculates the offset between the center of the light spot and the reference target coordinates, analyzes the morphological characteristics of the beam intensity distribution, evaluates the impact of environmental changes on the beam position, and generates beam offset information; The offset calculation module extracts the spot coordinates of the semiconductor laser module based on the beam offset information, analyzes the displacement of adjacent spots, compares the center offset of the spots, selects the semiconductor laser module to be adjusted first, identifies the adjustment requirements, and obtains the reference data for laser module adjustment; The interferometric measurement analysis module uses the laser module to adjust the reference data, analyzes the micro-displacement of the laser module in the horizontal, longitudinal and vertical axes, identifies the change in the beam propagation angle, and generates module displacement correction parameters; The drive compensation execution module uses the module displacement correction parameters to calculate the displacement compensation required by the semiconductor laser module, calls the real-time position information of the semiconductor laser module, detects the adjusted spot position, analyzes the changes in the spot center before and after the adjustment, evaluates the error correction degree after the adjustment, and generates a displacement compensation adjustment result.

2. The semiconductor laser module leveling device according to claim 1, characterized in that: The beam offset information includes the absolute coordinates of the beam position, beam morphology characteristics, environmental sensitivity, and offset trend. The laser module adjustment reference data includes module adjustment priority, adjacent spot displacement difference, and module adjustment requirements. The module displacement correction parameters include axial micro-displacement, angular deviation value, and displacement error. The displacement compensation adjustment result includes displacement compensation amount, spot position change value, and error correction degree.

3. The semiconductor laser module leveling device according to claim 1, characterized in that: The laser deviation detection module comprises: The light spot center positioning submodule obtains the light spot emitted by the semiconductor laser module, detects the edge information, brightness distribution and morphological characteristics of the light spot, records the horizontal, vertical and vertical coordinates of the light spot center, and obtains the absolute coordinates of the light spot center; The spot offset calculation submodule calls the absolute coordinates of the reference target based on the absolute coordinates of the center of the spot, using the formula: ； The center offset of the light spot is calculated; in, Represents the center offset of the light spot, Represents the center of the light spot Absolute coordinates of horizontal, vertical and vertical coordinates, Represents the reference target The horizontal, vertical and vertical coordinates of the absolute coordinates; The beam characteristic analysis submodule uses the light spot center offset to detect the energy density distribution of the beam in the differentiated area, calculates the change gradient of the beam intensity, and analyzes the impact of environmental changes on the beam stability to obtain the beam offset information.

4. The semiconductor laser module leveling device according to claim 3, characterized in that: The offset calculation module comprises: The spot offset analysis submodule extracts the spot coordinates of the semiconductor laser module based on the beam offset information, analyzes the displacement of adjacent spots, compares the offset of the spot center, and calculates the displacement value of the spot center using the formula: ； Calculate the displacement parameters between the light spots, and combine them with the light spot center offset to obtain the light spot offset comparison results; in, Representative spot With light spot The displacement parameters between Representative spot The center coordinates of Representative spot The center coordinates of , Representative spot and The light intensity value, Represents the total light intensity of the light spot, Representative spot The light intensity value; The laser module screening submodule calls the spot offset comparison result, identifies the module that needs to be adjusted first, and obtains the laser module adjustment reference data by combining the spot center offset and the spot-to-spot displacement parameter.

5. The semiconductor laser module leveling device according to claim 4, characterized in that: The interferometry analysis module comprises: The beam propagation analysis submodule adjusts the reference data based on the laser module, detects the propagation path of the beam in the horizontal, vertical and vertical axis directions, analyzes the changes in the incident angle and refraction angle of the beam in the differentiated axial direction, and obtains the beam deviation angle; The micro-displacement calculation submodule uses the beam offset angle, combined with the beam propagation path, and adopts the formula: ； Calculate the displacement of the semiconductor laser module in the horizontal, vertical and vertical axes to obtain the module displacement; in, Represents the displacement of the module, Respectively represent the initial and real-time coordinates of the laser module, Representative The measured beam deviation angle, represents the initial beam angle, The conversion factor representing the angle change, represents the number of measurements; The displacement adjustment submodule calls the module displacement, analyzes the differential axial displacement distribution characteristics, selects the displacement peak interval, calculates the axial displacement correction amount, and obtains the module displacement correction parameter.

6. The semiconductor laser module leveling device according to claim 5, characterized in that: The drive compensation execution module comprises: The displacement correction calculation submodule uses the module displacement correction parameters, calls the real-time position information of the semiconductor laser module, and calculates the deviation between the theoretical compensation displacement and the real-time position information using the formula: ； Calculating the compensation adjustment , get the theoretical compensation displacement correction value; in, represents the compensation adjustment amount, Represents theoretical position information, Represents real-time location information, Representative unit compensation ratio, Represents the target position coordinates, Represents real-time location coordinates; The compensation adjustment submodule calls the theoretical compensation displacement correction value, combines with the piezoelectric micro-motion stage, adjusts the real-time position of the semiconductor laser module, analyzes the real-time position information of the adjusted module, calculates the center offset of the light spot, analyzes the error correction degree of the compensation adjustment, and obtains the displacement compensation adjustment result.

7. The semiconductor laser module leveling device according to claim 1, characterized in that: The device also includes an error compensation optimization module: The error compensation optimization module calls the recent spot offset data according to the displacement compensation adjustment result, calculates the error variation range, calls the beam offset data before and after the adjustment, identifies the stability of the error correction, evaluates the alignment state of the multi-mode spot, and generates the beam deviation correction result; The beam deviation correction results include error fluctuation range, error stability, and multi-module alignment degree.

8. The semiconductor laser module leveling device according to claim 7, characterized in that: The error compensation optimization module comprises: The error change calculation submodule calls the recent spot offset data according to the displacement compensation adjustment result, extracts the beam offset values ​​at multiple time points, compares the offset trends of differentiated time periods, and determines the magnitude and direction of the error change using the formula: ； Calculate the error variation range of the beam offset to obtain the beam offset error interval; in, Represents the error range, Representative The beam offset value at each time point, Representative The beam offset value at each time point, represents the total number of data points, Calculate the offset change between adjacent time points; The correction stability evaluation submodule calls the beam offset data before and after adjustment based on the beam offset error interval, evaluates the offset stability after adjustment, analyzes the offset fluctuation amplitude at the differentiated time points, determines the stability of the correction error, and obtains the beam offset correction stability; The multi-module alignment analysis submodule evaluates the alignment state of the multi-module light spot according to the beam offset correction stability, compares the offset consistency of the differentiated modules, identifies the light spot alignment deviation, and obtains the beam deviation correction result.

9. A method for using a semiconductor laser module, characterized in that: The semiconductor laser module leveling device according to any one of claims 1 to 8 comprises the following steps: S1: Obtain the center coordinates of the spot of the semiconductor laser module, compare with the reference target position, calculate the horizontal, longitudinal and vertical offsets, analyze the beam intensity distribution, and generate beam offset information; S2: Based on the beam offset information, analyze the beam drift amplitude, screen the laser modules whose offset exceeds the threshold, sort the offset amplitudes, identify the adjustment requirements, and obtain the laser module adjustment reference data; S3: calling the laser module adjustment reference data, analyzing the horizontal axis, longitudinal axis and vertical axis micro-displacement of the laser module, calculating the change of the beam propagation angle, comparing and adjusting the reference value, and generating the module displacement correction parameter; S4: using the module displacement correction parameters, calculating the displacement compensation amount of the piezoelectric micro-motion stage, performing adjustment operations, re-detecting the center of the light spot, calculating and correcting the offset error, and generating a displacement compensation adjustment result; S5: Utilizing the displacement compensation adjustment result, calculating the error correction range, comparing the beam offset data, analyzing the light spot alignment status, screening out semiconductor laser modules that do not meet the standards, and generating a beam deviation correction result.

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