Earphone and earphone design method

Abstract

The invention provides an earphone and an earphone design method, and relates to the technical field of audio equipment. The earphone comprises a shell which comprises a front shell and a rear shell; the loudspeaker is arranged between the front shell and the rear shell, and a rear cavity of the earphone is defined by the loudspeaker and the rear shell; and the sound guide tube is arranged in the rear cavity and is used for communicating the interior of the rear cavity with the exterior of the earphone. The interior of the rear cavity is communicated with the exterior of the earphone through the sound guide tube, and the passive sound insulation performance of the earphone can be improved by increasing sound link delay. Meanwhile, the resonance frequency point of the earphone can be adjusted by adding the sound guide tube, so that the tuning performance of the earphone can be improved, and the earphone has better sound quality performance.

Description

Technical Field

[0001] The present disclosure relates to the technical field of audio devices, and particularly to a headset and a headset design method. Background Art

[0002] In recent years, users' demands for headset performance have been increasing. For example, there is a need for headsets to be portable, while also expecting high sound quality and sound insulation effects, and at the same time not willing to spend a high cost to purchase.

[0003] In related technologies, under the limitations of a specific speaker size, limited cost, volume, and weight, the sound performance and sound insulation performance of headsets have significant limitations and cannot meet the needs of users. Summary of the Invention

[0004] To overcome the problems existing in related technologies, the present disclosure provides a headset and a headset design method.

[0005] According to a first aspect of an embodiment of the present disclosure, there is provided a headset, including:

[0006] A housing, including a front shell and a rear shell;

[0007] A speaker, disposed between the front shell and the rear shell, and the speaker and the rear shell together enclose a rear cavity of the headset;

[0008] A sound guide tube, disposed inside the rear cavity, for communicating the inside of the rear cavity with the outside of the headset.

[0009] In some embodiments, there is a gap between the sound guide tube and the speaker.

[0010] In some embodiments, the headset further includes a sound guide tube bracket;

[0011] The sound guide tube bracket is fixedly connected to the inner side of the rear shell and is used for fixing the sound guide tube inside the rear cavity.

[0012] In some embodiments, the headset further includes a rear vent hole;

[0013] The rear vent hole is disposed on the rear shell;

[0014] One end of the sound guide tube is docked with the rear vent hole, and the other end is connected to the inside of the rear cavity.

[0015] In some embodiments, the sound guide tube starts from the rear vent hole and extends along the inner wall of the rear shell inside the rear cavity.

[0016] In some embodiments, the sound guide tube is sealingly connected to the rear vent hole.

[0017] In some embodiments, there is a gap between the sound guide tube and the rear vent hole.

[0018] In some embodiments, the inner wall of the sound guide tube is smooth.

[0019] According to the first aspect of the embodiments of the present disclosure, a method for designing an earphone is provided. The method is used to design the earphone of the first aspect above, and includes:

[0020] Determine the shape of the earphone housing and the volume of the rear cavity;

[0021] Determine the position of the sound guiding tube according to the shape of the housing;

[0022] Adjust the length of the sound guiding tube according to the resonance frequency of the sound guiding tube, wherein the resonance frequency of the sound guiding tube is jointly determined by the volume of the rear cavity and the geometric parameters of the sound guiding tube.

[0023] In some embodiments, adjusting the length of the sound guiding tube according to the resonance frequency of the sound guiding tube includes:

[0024] Adjust the length of the sound guiding tube so that the length of the sound guiding tube is maximized when the resonance frequency of the sound guiding tube meets a preset condition.

[0025] The technical solutions provided by the embodiments of the present disclosure may include the following beneficial effects:

[0026] The earphone provided by the embodiments of the present disclosure includes a sound guiding tube provided inside the rear cavity. Among them, the sound guiding tube can connect the inside of the rear cavity with the outside of the earphone, so that the passive sound insulation performance of the earphone can be improved by increasing the sound link delay. At the same time, since the addition of the sound guiding tube can adjust the resonance frequency point of the earphone, the tuning performance of the earphone can also be improved, making the earphone have better sound quality performance.

[0027] It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and cannot limit the present disclosure. Brief Description of the Drawings

[0028] Figure 1 Show a schematic structural diagram of an earphone in the embodiments of the present disclosure.

[0029] Figure 2 Show a schematic flow diagram of a method for designing an earphone in the embodiments of the present disclosure.

[0030] Reference Signs:

[0031] 110 - housing; 111 - front shell; 112 - rear shell; 120 - speaker; 130 - sound guiding tube; 140 - sound guiding tube bracket. Detailed Description of the Embodiments

[0032] Exemplary embodiments will be described in detail herein, and examples thereof are shown in the accompanying drawings. When the following description refers to the accompanying drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present disclosure. On the contrary, they are merely examples of devices and methods consistent with some aspects of the present disclosure as detailed in the appended claims.

[0033] The terms used in the present disclosure are for the purpose of describing particular embodiments only and are not intended to limit the present disclosure. The singular forms "a", "the", and "said" used in the present disclosure and the appended claims are also intended to include the plural forms unless the context clearly dictates otherwise. It should also be understood that the term "and / or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.

[0034] In addition, terms such as "first", "second", etc. are used only for descriptive distinction and should not be construed as indicating or implying relative importance.

[0035] Sound quality and noise reduction performance are important performance manifestations of headphones. However, limited by conditions such as the physical characteristics, volume, cost, and headphone chip performance of headphones, there is a certain upper limit to the performance of headphones.

[0036] For example, considering the size, wearing comfort, and portability of headphones, the size of the dynamic coil speaker unit of headphones is usually about 11 - 14 mm. At this diameter, the sensitivity of the speaker is limited, so the sound it can emit (especially low-frequency sound) is also limited.

[0037] Another example is that there is a certain system link delay in active noise reduction. Due to the relatively small size of headphones, the delay of the acoustic link is extremely short, which makes the active effect have great limitations.

[0038] At the same time, due to the poor sealing of headphones with a relatively small size and the extremely short delay of the acoustic link, the passive sound insulation effect of headphones is usually also poor.

[0039] In view of this, in the embodiments of the present disclosure, the interior of the rear cavity of the headphone is connected to the outside of the headphone through a sound guide tube, which can increase the sound link delay, thereby improving the passive sound insulation performance of the headphone. At the same time, since the addition of the sound guide tube can adjust the resonance frequency point of the headphone, it can also improve the tuning performance of the headphone, making the headphone have better sound quality performance.

[0040] Next, the exemplary embodiments of the present disclosure will be described in detail.

[0041] Figure 1 The structural schematic diagram of a headphone in the embodiments of the present disclosure is shown, asFigure 1 As shown, the earphone includes a housing 110, a speaker 120, and a sound guide tube 130.

[0042] It should be noted that the housing 110 includes a front shell 111 and a rear shell 112, and the front shell 111 and the rear shell 112 together enclose the internal cavity of the earphone. Exemplarily, a front vent hole (not shown in the figure) is provided on the front shell 111, and a rear vent hole (not shown in the figure) is provided on the rear shell 112. The front vent hole and the rear vent hole can be used to balance the air pressure inside the earphone cavity and the outside world. At the same time, by changing the position and size of the front vent hole and / or the rear vent hole, the frequency response curve of the earphone can be adjusted.

[0043] It should be noted that the speaker 120 is the sound - generating component in the earphone and is arranged between the front shell 111 and the rear shell 112. Exemplarily, the speaker 120 can together with the front shell 111 enclose the front cavity of the earphone and together with the rear shell 112 enclose the rear cavity of the earphone. The front cavity can provide a forward vibration space for the diaphragm of the speaker 120, and the rear cavity can provide a backward vibration space for the diaphragm of the speaker 120. By changing the shape and volume of the front cavity and / or the rear cavity, the frequency response curve of the earphone can be adjusted.

[0044] In addition, an sound outlet (not shown in the figure) is also provided on the front shell 111 of the earphone, and the sound emitted by the speaker 120 is transmitted to the inside of the human ear through the sound outlet.

[0045] It should be noted that the sound guide tube 130 can be arranged inside the rear cavity and is used to connect the inside of the rear cavity with the outside of the earphone, so that the acoustic path for the outside sound to reach the human ear is increased by the path of the sound guide tube 130, thereby increasing the acoustic resistance of the sound transmitted to the human ear and improving the passive sound insulation effect of the earphone.

[0046] In some embodiments, the sound guide tube 130 has a hollow tubular structure. One end of the sound guide tube 130 can be docked with the rear vent hole, and the other end can be connected to the inside of the rear cavity, so that the sound guide tube 130 can connect the inside of the rear cavity with the outside of the earphone through the rear vent hole.

[0047] Exemplarily, the sound guide tube 130 and the rear vent hole can be hermetically connected, thereby further improving the passive sound insulation effect of the earphone. Of course, there can also be a certain gap between the sound guide tube 130 and the rear vent hole to reduce the wind noise of the earphone.

[0048] In some embodiments, the earphone further includes a sound guide tube bracket 140. The sound guide tube bracket 140 can be fixedly connected to the inner side of the rear shell 112 and is used to fix the sound guide tube 130 inside the rear cavity.

[0049] Exemplarily, the fixing manner between the sound guiding tube bracket 140 and the sound guiding tube 130 can be snap connection, abutting connection or other fixing manners, which are not limited in the embodiments of the present disclosure. It can be understood that during the process of fixing the sound guiding tube 130, the tubular structure of the sound guiding tube 130 will not be damaged, so as to avoid affecting the performance of the sound guiding tube 130.

[0050] It should be noted that there should be a certain gap between the fixed sound guiding tube 130 and the speaker 120, so as to prevent the speaker 120 from contacting or colliding with the sound guiding tube 130 during vibration, which may affect the normal sound emission of the speaker 120. Similarly, there should also be a certain gap between the sound guiding tube bracket 140 and the speaker 120, so as to avoid the same problem.

[0051] In some embodiments, the sound guiding tube 130 can start from the rear leakage hole and extend along the inner wall of the rear shell 112 in the rear cavity, so that the length of the sound guiding tube 130 can be extended as much as possible, and further, the length of the acoustic path for external sound to reach the human ear can be increased as much as possible, making the sound insulation effect of the earphone better.

[0052] In some embodiments, the inner wall of the sound guiding tube 130 should be kept smooth without edges and corners, so as to avoid interference with the sound propagation path in the sound guiding tube 130.

[0053] It can be understood that since the sound guiding tube can bring certain resonance in the rear cavity of the earphone, by adjusting the resonance frequency point of the sound guiding tube to the low frequency band, the sound characteristics of the earphone in the low frequency band can be made more stable, the frequency response curve is easier to control, and the tuning is easier.

[0054] It should be noted that for earphones with active noise reduction function, the addition of the sound guiding tube can also improve the active noise reduction performance of the earphone.

[0055] Specifically, an active noise reduction earphone can receive environmental noise through a microphone on the earphone (the microphone for receiving voice during non - call), and then use the internal chip of the earphone to generate a reverse sound wave opposite to the noise to cancel the environmental noise. Among them, when the frequency and amplitude of the reverse sound wave are the same as those of the environmental noise and the phase is opposite to that of the environmental noise, the active noise reduction effect is the best.

[0056] However, due to a certain system link delay when the internal chip of the earphone outputs the reverse sound wave, it is impossible to ensure that the phase of the reverse sound wave is exactly opposite to that of the noise. By increasing the acoustic path for external sound to reach the human ear through the sound guiding tube, the acoustic link delay can be increased, that is, the time for environmental noise to reach the human ear is delayed, so that the phase of the reverse sound wave can be as opposite as possible to the phase of the environmental noise, thereby improving the active noise reduction effect.

[0057] In addition, the resonance in the low-frequency band caused by the sound guide tube can also increase the amplitude of the reverse sound wave near the resonance frequency point, so that the earphone can generate a reverse sound wave with a larger amplitude in the frequency band near the resonance frequency point, improving the active noise reduction effect of the earphone in the low-frequency band.

[0058] The above combination Figure 1 , has described the earphone provided by the present disclosure in detail. On this basis, the present disclosure also provides a method for designing an earphone. This method is used to design an earphone as Figure 1 shown.

[0059] Specifically, Figure 2 shows a schematic flow chart of a method for designing an earphone in an embodiment of the present disclosure. As Figure 2 shown, this method includes the following steps.

[0060] S201, determine the housing shape and the volume of the rear cavity of the earphone.

[0061] It should be noted that the housing shape of the earphone includes the shape and size of the front housing and the rear housing of the earphone, and the housing shape can be designed according to the acoustic structure of the earphone. Exemplarily, the design of the housing shape also includes the position and size of the front vent hole and the rear vent hole, whereby the sound characteristics of the earphone can be initially determined.

[0062] In addition, acoustic mesh cloth can be covered on the front vent hole and the rear vent hole to prevent dust from entering the earphone cavity and at the same time can also affect the sound characteristics of the earphone.

[0063] Exemplarily, after determining the housing shape, the volume of the rear cavity can be calculated to further determine the resonance frequency of the conduit in the rear cavity according to the volume of the rear cavity.

[0064] S202, determine the position of the sound guide tube according to the housing shape.

[0065] Exemplarily, reference can be made to the description in the Figure 1 embodiment to arrange the sound guide tube in the rear cavity, and one end of the sound guide tube is docked with the rear vent hole and the other end is connected to the rear cavity. The embodiment of the present disclosure will not elaborate on this.

[0066] S203, adjust the length of the sound guide tube according to the resonance frequency of the sound guide tube.

[0067] Among them, the resonance frequency of the sound guide tube is the aforementioned resonance frequency point of the sound guide tube, which can be jointly determined by the volume of the rear cavity and the geometric parameters of the sound guide tube.

[0068] Exemplarily, the resonance frequency of the sound guide tube can be determined by the following formula (1).

[0069]

[0070] Among them, f0 f is the resonance frequency, c is the speed of sound, S is the cross-sectional area of the sound guide tube, d is the diameter of the sound guide tube, l is the length of the sound guide tube, and V is the volume of the rear cavity.

[0071] In some embodiments, during the process of adjusting the length of the sound guide tube, the length of the sound guide tube can be maximized when its resonance frequency meets the preset conditions, so as to improve the passive sound insulation effect and the active noise reduction effect of the earphone as much as possible.

[0072] It can be understood that since the sound frequency band higher than the resonance frequency can obtain more stable sound characteristics, the lower the resonance frequency of the sound guide tube, the better the tuning performance of the earphone. However, since the resonance frequency affects the quality factor Q value of the earphone, too low a resonance frequency will also cause the sound emitted by the earphone to be distorted.

[0073] Therefore, the resonance frequency that meets the preset conditions can be as low as possible while ensuring the normal sound emission of the earphone.

[0074] The earphone design method provided by the embodiments of the present disclosure can extend the length of the sound guide tube as much as possible, so that Figure 1 the sound insulation and noise reduction effects brought by the provided earphone structure reach the best.

[0075] The preferred embodiments of the present disclosure have been described in detail above with reference to the accompanying drawings. However, the present disclosure is not limited to the specific details in the above embodiments. Within the scope of the technical concept of the present disclosure, various simple modifications can be made to the technical solutions of the present disclosure, and these simple modifications all fall within the protection scope of the present disclosure.

[0076] In addition, it should be noted that, in the case of no contradiction, the various specific technical features described in the above specific embodiments can be combined in any suitable manner. To avoid unnecessary repetition, the present disclosure will not separately describe various possible combination methods.

[0077] In addition, any combination can be made between different embodiments of the present disclosure, as long as it does not violate the idea of the present disclosure, it should also be regarded as the content disclosed by the present disclosure.

Claims

1. An earphone, characterized in that, it includes: a housing, including a front shell and a rear shell; a speaker, disposed between the front shell and the rear shell, and the speaker and the rear shell jointly enclose the rear cavity of the earphone; a sound guide tube, disposed inside the rear cavity, for communicating the inside of the rear cavity with the outside of the earphone.

2. The earphone according to claim 1, characterized in that, there is a gap between the sound guide tube and the speaker.

3. The earphone according to claim 1, characterized in that, the earphone further includes a sound guide tube bracket; the sound guide tube bracket is fixedly connected to the inner side of the rear shell, for fixing the sound guide tube inside the rear cavity.

4. The earphone according to claim 1, characterized in that, the earphone further includes a rear vent hole; the rear vent hole is provided on the rear shell; one end of the sound guide tube is docked with the rear vent hole, and the other end is connected to the inside of the rear cavity.

5. The earphone according to claim 4, characterized in that, the sound guide tube starts from the rear vent hole and extends along the inner wall of the rear shell inside the rear cavity.

6. The earphone according to claim 4, characterized in that, the sound guide tube is hermetically connected to the rear vent hole.

7. The earphone according to claim 4, characterized in that, there is a gap between the sound guide tube and the rear vent hole.

8. The earphone according to claim 1, characterized in that, the inner wall of the sound guide tube is smooth.

9. An earphone design method, characterized in that, the method is used to design the earphone according to any one of claims 1 to 8, and includes: determining the shape of the housing of the earphone and the volume of the rear cavity; determining the position of the sound guide tube according to the shape of the housing; adjusting the length of the sound guide tube according to the resonance frequency of the sound guide tube, wherein the resonance frequency of the sound guide tube is jointly determined by the volume of the rear cavity and the geometric parameters of the sound guide tube.

10. The method according to claim 9, characterized in that, the adjusting the length of the sound guide tube according to the resonance frequency of the sound guide tube includes: adjusting the length of the sound guide tube so that when the resonance frequency of the sound guide tube meets a preset condition, the length of the sound guide tube is maximized.

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