Printed circuit board

Abstract

The printed circuit board comprises a first surface and a second surface which are opposite. The printed circuit board further includes at least one sub-circuit board component mounted on a first side of the plurality of sides defined by the first surface and the second surface. The printed circuit board also includes at least one surface mount device component mounted to one of a first side or another side of the plurality of sides.

Description

[0001] Cross - reference to related applications

[0002] This patent application claims the benefit of Indian Provisional Patent Application No. 202321080585, titled "A Printed Circuit Board", filed on November 28, 2023, the entire disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] The present invention relates to the field of printed circuit boards. Background Art

[0004] Printed circuit boards are important components of electronic devices. A printed circuit board (commonly referred to as a PCB) consists of at least a pair of sub - circuit boards, SMD components, and other components, all of which are mounted on the top and bottom surfaces of the PCB.

[0005] Over time, it has been determined that there is a need to reduce the size of the PCB so that the space on the PCB is utilized effectively and, in turn, the manufacturing cost and time are reduced. However, reducing the size has an adverse effect on the power density of the PCB. In addition, arranging all the components of the PCB on the PCB to reduce its size reduces its reliability during EMC / EMI testing. Summary of the Invention

[0006] One aspect of the disclosed embodiments includes an apparatus. The apparatus includes a printed circuit board (PCB). The PCB includes: opposite first and second surfaces; at least one sub - circuit board component mounted on a first side edge among a plurality of side edges defined by the first and second surfaces; and at least one surface - mount device (SMD) component mounted on one of the first side edge or another side edge among the plurality of side edges. Brief Description of the Drawings

[0007] The printed circuit board of the present disclosure will now be described with the aid of the drawings, in which:

[0008] Figure 1 An isometric view of a conventional printed circuit board is shown;

[0009] Figure 2 An isometric view of a printed circuit board according to the principles of the present disclosure is shown;

[0010] Figure 3 Shows Figure 1 An isometric view of a printed circuit board with SMD components mounted thereon;

[0011] Figure 4A And Figure 4B ShowsFigure 1 An isometric view of a printed circuit board having SMD elastic components mounted thereon; and

[0012] Figure 5 shows an isometric view of elastic components that can be mounted on the Figure 1 PCB. DETAILED DESCRIPTION

[0013] Embodiments of the present disclosure will now be described with reference to the accompanying drawings.

[0014] Embodiments are provided to thoroughly and completely convey the scope of the present disclosure to those skilled in the art. Many details related to specific components and methods are set forth to provide a complete understanding of the embodiments of the present disclosure. It will be apparent to those skilled in the art that the details provided in the embodiments should not be construed as limiting the scope of the present disclosure. In some embodiments, well-known processes, well-known device structures, and well-known technologies are not described in detail.

[0015] The terms used in the present disclosure are for the purpose of explaining specific embodiments only, and such terms should not be regarded as limiting the scope of the present disclosure. As used in the present disclosure, the forms "a", "an", and "the" may also be intended to include the plural forms unless the context clearly indicates otherwise. The terms "comprises", "comprising", "including", "includes", and "having" are open transitional phrases and thus specify the presence of the stated features, elements, modules, units, and / or components, but do not preclude the presence or addition of one or more other features, elements, components, and / or groups thereof.

[0016] Figure 1 A conventional printed circuit board 100' is shown, which has daughter boards 115' mounted on the top surface 108' and the bottom surface 105' of the conventional printed circuit board 100'.

[0017] Now, the printed circuit board will be described in detail with reference to Figures 2 to 5 As shown, the printed circuit board (referred to herein as "main PCB 100") includes a bottom surface 105, a top surface 108, and a side surface 110 defined between the bottom surface 105 and the top surface 108. Figure 2 In some embodiments, the main PCB 100 includes daughter board components 115 configured to be mounted on a first side surface 110A of the side surface 110.

[0018]

[0019] ​In some embodiments, the main PCB 100 further includes a plurality of surface mount device (SMD) components configured to be mounted on the side surface 110A of the main PCB 100. In some embodiments, the SMD components 120 are mounted on the main PCB 100 by grooving or plating the main PCB 100. In some embodiments, gold plating or tin plating is used to facilitate the mounting of the SMD components 120 on the main PCB 100.

[0020] Figure 4A and Figure 4B illustrates the mounting of the electromechanical components on the side surface 110 of the main PCB 100. For example, the resilient member 125 of the SMD component 120 is mounted as a power contact on the side surface 110. Due to the flexibility of the resilient member 125, the tolerance between the two contact surfaces is controlled. In a similar manner, other electromechanical components (such as Figure 5 shown) are mounted on the side surface 110 of the main PCB 100 to ensure mechanical strength, flexibility, suspension, power connection, and other advantages.

[0021] In some embodiments, the daughter board is removed because the daughter board components 115 can now be mounted on the side surface 110, while other SMD components 120 can be mounted on the first side surface 110A of the main PCB 100, thereby releasing the area on the main PCB 100 to facilitate the mounting of other components of the main PCB 100 in the available area. This is particularly advantageous for promoting the reduction of the surface area of the main PCB 100 because other components can be assembled on the available free space on the top surface 108 of the main PCB 100.

[0022] Therefore, not only can the size of the PCB 100 be reduced, but also the time and cost required for manufacturing and assembling the main PCB 100 can be saved. In addition, since the daughter board components 115 are now assembled on the side surface 110, the reliability of the PCB 100 during electromagnetic interference (EMI) / electromagnetic compatibility (EMC) testing is increased. Additionally, the daughter board components 115 can be removed if needed, thereby saving the cost of the daughter board.

[0023] In some embodiments, the surface area of the conventional PCB 100' is 3960 square millimeters, and 211 square millimeters of the surface area is used for mounting components thereon. The PCB 100' includes paired daughter boards 115', which consume approximately 363 square millimeters of the area of the top surface 108' of the PCB 100'.

[0024] The position of the daughter circuit board component 115 is changed to the side 110 of the PCB 100, thereby utilizing the 543 square millimeter area of the side. This helps save approximately 14% of the PCB area. In addition, SMD components 120 with a width less than 1.56 mm, such as resistors, capacitors, diodes, light-emitting diodes (LEDs), and integrated circuits (ICs), can be assembled on the PCB 100 with a standard thickness of 1.56 mm.

[0025] In some embodiments, the systems and methods described herein can be configured to provide a printed circuit board with a relatively reduced surface area without compromising its efficiency, which is cost-effective and reduces manufacturing and assembly time and / or resources.

[0026] In some embodiments, the systems and methods described herein can be configured to provide a printed circuit board. In some embodiments, the systems and methods described herein can be configured to provide a printed circuit board with a relatively reduced surface area without compromising its efficiency. In some embodiments, the systems and methods described herein can be configured to provide a printed circuit board that is cost-effective and consumes relatively less time in its manufacturing and assembly.

[0027] In some embodiments, the apparatus includes a printed circuit board (PCB). The PCB includes: a first surface and a second surface that are opposite; at least one daughter circuit board component mounted on a first side among a plurality of sides defined by the first surface and the second surface; and at least one surface mount device (SMD) component mounted to one of the first side or another side among the plurality of sides.

[0028] In some embodiments, at least one SMD component is mounted to one of the first side or another side among the plurality of sides by grooving one of the first side or another side among the plurality of sides. In some embodiments, at least one SMD component is mounted to one of the first side or another side among the plurality of sides by electroplating one of the first side or another side among the plurality of sides. In some embodiments, electroplating one of the first side or another side among the plurality of sides includes using a gold-plated material. In some embodiments, electroplating one of the first side or another side among the plurality of sides includes using a tin-plated material. In some embodiments, at least one SMD component includes at least one power contact. In some embodiments, at least one power contact includes at least one elastic component mounted on one of the first side or another side among the plurality of sides.

[0029] In some embodiments, the PCB further includes at least one electromechanical component mounted on one of a first side or another side among a plurality of sides. In some embodiments, the at least one electromechanical component includes at least one power contact. In some embodiments, each of the plurality of sides is disposed between a first surface and a second surface. In some embodiments, the first surface includes a first surface area.

[0030] In some embodiments, the first surface area is less than 3960 square millimeters. In some embodiments, the second surface includes a second surface area. In some embodiments, the second surface area is less than 3960 square millimeters. In some embodiments, the thickness of the PCB is 1.56 millimeters. In some embodiments, the at least one sub - circuit board component utilizes a portion of the side area associated with each of the plurality of sides.

[0031] In some embodiments, the portion of the side area is 543 square millimeters. In some embodiments, the at least one SMD component includes at least one of the following: resistor, capacitor, diode, light - emitting diode, and integrated circuit. In some embodiments, the width of the integrated circuit is equal to or less than 1.56 millimeters. In some embodiments, the PCB includes at least one component mounted on at least one of the first surface and the second surface.

[0032] The foregoing description of the embodiments has been provided for purposes of illustration, and the foregoing description of the embodiments is not intended to limit the scope of the present disclosure. Those of ordinary skill in the art will understand that certain modifications may fall within the scope of the present disclosure. Such variations are not to be regarded as a departure from the present disclosure, and all such variations are considered to be within the scope of the present disclosure.

[0033] The foregoing disclosure has been described with reference to the accompanying embodiments, which do not limit the scope and bounds of the present disclosure. The description provided is by way of example and illustration only.

[0034] In the following description, the embodiments herein and their various features and advantageous details are explained with reference to non - restrictive embodiments. Descriptions of well - known components and processing techniques are omitted so as not to unnecessarily obscure the embodiments herein. The examples used herein are only intended to facilitate an understanding of the manner in which the embodiments herein can be practiced and also to enable those skilled in the art to practice the embodiments herein. Therefore, these examples should not be construed as limiting the scope of the embodiments herein.

[0035] The foregoing description of the specific embodiments sufficiently discloses the general nature of the embodiments herein, such that others can, without departing from the general concept, readily modify such specific embodiments and / or adapt them to various applications by applying current knowledge. Accordingly, these adaptations and modifications should be construed to be within the meaning and scope of the equivalents of the disclosed embodiments. It should be understood that the phraseology or terminology employed herein is for the purpose of description and not of limitation. Thus, although the embodiments herein have been described, those skilled in the art will recognize that modifications can be made to practice the embodiments herein within the spirit and scope of the embodiments as described herein.

[0036] Any discussion of materials, devices, articles, etc. included in this specification is for the purpose of providing background only for the present disclosure. It should not be regarded as an admission that any or all of these matters form part of the prior art base or are common general knowledge in the field relevant to the present disclosure merely because they existed prior to the priority date of this application.

[0037] The numerical values recited for various physical parameters, dimensions or quantities are approximations only, and it is contemplated that values higher / lower than the recited values assigned to a parameter, dimension or quantity fall within the scope of the present disclosure, unless the specification specifically states otherwise.

[0038] Although considerable emphasis has been placed herein on the components and component parts of the described embodiments, it will be understood that many embodiments can be achieved without departing from the principles of the present disclosure and that many changes can be made in the described embodiments. To those skilled in the art, these and other changes in the embodiments of the present disclosure will be apparent from the disclosure herein, and thus it should be clearly understood that the foregoing descriptive matter is to be construed as illustrative of the present disclosure and not as limiting.

Claims

1. A device comprising: Printed circuit board PCB, comprising: a first surface and a second surface that are opposite; at least one sub-circuit board component mounted on a first side of a plurality of sides defined by the first surface and the second surface; and At least one surface mount device (SMD) component is mounted to one of the first side surface or another side surface among the plurality of side surfaces.

2. The device according to claim 1, wherein: The at least one SMD component is mounted to the one of the first side surface or the one of the other side surfaces among the plurality of side surfaces by grooves being formed in the one of the first side surface or the one of the other side surfaces among the plurality of side surfaces.

3. The device according to claim 1, wherein: The at least one SMD component is mounted to the one of the first side surface or the one of the plurality of side surfaces by electroplating the one of the first side surface or the one of the plurality of side surfaces.

4. The device according to claim 3, wherein: Electroplating the one of the first side surface or the another side surface of the plurality of side surfaces includes using a gold plating material.

5. The device according to claim 3, wherein: Electroplating the one of the first side surface or the another side surface of the plurality of side surfaces includes using a tin plating material.

6. The device according to claim 1, wherein: The at least one SMD component comprises at least one power contact.

7. The device according to claim 6, wherein: The at least one power contact includes at least one elastic member mounted on the one of the first side surface or the other side surface among the plurality of side surfaces.

8. The device according to claim 1, wherein: The PCB further includes at least one electromechanical component mounted on the one of the first side or the other side among the plurality of side surfaces.

9. The device according to claim 8, wherein: The at least one electromechanical component includes at least one power contact.

10. The device according to claim 1, wherein: Each of the plurality of side surfaces is disposed between the first surface and the second surface.

11. The device according to claim 1, wherein: The first surface includes a first surface area.

12. The device according to claim 11, wherein The first surface area is less than 3960 square millimeters.

13. The device according to claim 1, wherein: The second surface includes a second surface area.

14. The device according to claim 13, wherein: The second surface area is less than 3960 square millimeters.

15. The device according to claim 1, wherein: The thickness of the PCB is 1.56 mm.

16. The device according to claim 1, wherein The at least one sub-circuit board component utilizes a portion of a side area associated with each of the plurality of sides.

17. The device according to claim 16, wherein: The portion of the side area is 543 square millimeters.

18. The device according to claim 1, wherein: The at least one SMD component comprises at least one of the following: a resistor, a capacitor, a diode, a light emitting diode and an integrated circuit.

19. The device according to claim 18, wherein: The integrated circuit has a width equal to or less than 1.56 mm.

20. The device according to claim 1, wherein The PCB includes at least one component mounted on at least one of the first surface and the second surface.

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