Printed circuit board and manufacturing method thereof

Abstract

The invention relates to the technical field of printed circuit boards, and discloses a printed circuit board and a manufacturing method thereof, and the manufacturing method of the printed circuit board comprises the steps: providing a substrate, the substrate is provided with a processing surface, the processing surface comprises a first region and a second region which are adjacent to each other, and the substrate corresponding to the first region is a rigid part; the substrate with the first preset depth corresponding to the second area is removed, the remaining substrate corresponding to the second area is a bending connection area, and the thickness of the bending connection area is smaller than that of the rigid part. According to the printed circuit board and the manufacturing method thereof, the problem that an existing flexible printed circuit board and an existing rigid-flexible printed circuit board are complex in processing flow can be solved.

Description

Technical Field

[0001] This application relates to the technical field of printed circuit boards, and particularly relates to a printed circuit board and a manufacturing method thereof. Background Art

[0002] With the popularization of new energy vehicle products, more and more electronic products are used in automobiles. Among them, at positions such as in-vehicle cameras and circuit connection points of various electronic products, a large number of zero insertion force electrical connectors (ZIF, Zero Insertion Force) are designed.

[0003] At present, printed circuit boards that can be used for zero insertion force electrical connectors generally include flexible printed circuit boards using polyimide materials and rigid-flex (Rigid-Flex) printed circuit boards, etc. However, the processing processes of existing flexible printed circuit boards and rigid-flex printed circuit boards are complex. Summary of the Invention

[0004] This application provides a printed circuit board and a manufacturing method thereof, which can improve the problem of complex processing processes of existing flexible printed circuit boards and rigid-flex printed circuit boards.

[0005] In a first aspect, an embodiment of this application provides a manufacturing method of a printed circuit board, including:

[0006] Providing a substrate, the substrate having a processing surface, the processing surface including a first region and a second region arranged adjacent to each other, and the substrate corresponding to the first region being a rigid part;

[0007] Removing a first preset depth of the substrate corresponding to the second region, and the remaining substrate corresponding to the second region being a bending connection region, the thickness of the bending connection region being less than the thickness of the rigid part.

[0008] In some embodiments, the second region includes a flexible region and a connection region arranged adjacent to each other, the flexible region being located between the first region and the connection region, the flexible region being adjacent to the first region, and the bending connection region corresponding to the connection region being a plug-in connection part; after removing the first preset depth of the substrate corresponding to the second region, removing a second preset depth of the bending connection region corresponding to the flexible region, and the remaining bending connection region corresponding to the flexible region being a flexible part, the thickness of the flexible part being less than the thickness of the plug-in connection part.

[0009] In some embodiments, the substrate has a fixing surface opposite to the processing surface, and the fixing surface has a fixing region opposite to the second region; before removing the second preset depth of the bending connection region corresponding to the flexible region, fixing the fixing region.

[0010] In some of these embodiments, fixing the fixed area includes:

[0011] Attach a peelable layer to the fixing surface, and the peelable layer covers at least the fixed area;

[0012] Place the substrate on a vacuum tabletop, and the vacuum tabletop is attached to the peelable layer;

[0013] Use the vacuum tabletop to adsorb and fix the peelable layer.

[0014] In some of these embodiments, the processing surface further includes a third area, the third area is located on one side of the second area, and both the flexible area and the connection area are adjacent to the third area.

[0015] In some of these embodiments, two third areas are provided, and the arrangement direction of the two third areas forms an angle with the arrangement direction of the first area and the second area.

[0016] In some of these embodiments, the processing surface further includes a fourth area, the fourth area is located on the side of the second area away from the first area, and the connection area is adjacent to the fourth area; when removing the substrate at the first preset depth corresponding to the second area, a part of the substrate corresponding to the fourth area is removed.

[0017] In some of these embodiments, providing the substrate includes:

[0018] Provide a panel, the panel includes a plurality of the substrates, and the fourth area of the processing surface of one of the substrates is adjacent to the first area of the processing surface of another substrate adjacent to the current substrate;

[0019] After removing the substrate at the second preset depth corresponding to the flexible area, all the substrates corresponding to the fourth area are removed.

[0020] In a second aspect, an embodiment of the present application provides a printed circuit board, which is processed by the method for manufacturing a printed circuit board as described in the first aspect. The printed circuit board includes a connected rigid part and a bent connection area, and the thickness of the bent connection area is less than the thickness of the rigid part.

[0021] In some of these embodiments, the bent connection area includes a connected flexible part and a pluggable connection part, the flexible part is located between the pluggable connection part and the rigid part, and the thickness of the flexible part is less than the thickness of the pluggable connection part.

[0022] The manufacturing method of the printed circuit board provided by the embodiment of the present application has the beneficial effect that: since the substrate has a processing surface, the processing surface includes a first region and a second region arranged adjacent to each other, and when processing, by removing the substrate with a first preset depth corresponding to the second region, the remaining substrate corresponding to the second region becomes a bending connection region, and the thickness of the bending connection region is smaller than that of the rigid part. Therefore, not only can the end of the bending connection region be easily connected to the zero insertion force electrical connector, but also the bending connection region between the substrate corresponding to the first region and the zero insertion force electrical connector has good flexibility and is convenient for bending. The manufacturing method of the printed circuit board provided by the embodiment of the present application is simple to manufacture and has a low cost, and can improve the problem of the complex processing flow of the existing flexible printed circuit board and rigid-flex printed circuit board.

[0023] For the beneficial effects of the printed circuit board provided by the present application compared with the prior art, reference can be made to the beneficial effects of the manufacturing method of the printed circuit board provided by the present application compared with the prior art, which will not be elaborated here. Description of the Drawings

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for use in the embodiments or the description of the prior art. Obviously, the following drawings are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0025] Figure 1 is a flowchart of the manufacturing method of the printed circuit board in one embodiment of the present application;

[0026] Figure 2 is a top view of the substrate in one embodiment of the present application;

[0027] Figure 3 is a peelable layer and Figure 2 a side view of the substrate shown;

[0028] Figure 4 is to remove Figure 2 a schematic diagram of the substrate with a first preset depth corresponding to the second region shown;

[0029] Figure 5 is to remove Figure 4 a schematic diagram of the bending connection region with a second preset depth corresponding to the flexible region shown;

[0030] Figure 6 is a top view of the substrate in another embodiment of the present application;

[0031] Figure 7 is to remove Figure 6Schematic diagram of a substrate with a first preset depth corresponding to the second region shown and a bending connection region with a second preset depth corresponding to the flexible region;

[0032] Figure 8 is Figure 7 Side view of the substrate shown;

[0033] Figure 9 is to remove Figure 7 Schematic diagram of the substrate corresponding to the third region shown;

[0034] Figure 10 Side view of the substrate in another embodiment of the present application;

[0035] Figure 11 is to remove Figure 10 Schematic diagram of the substrate with a first preset depth corresponding to the second region shown and a partial substrate corresponding to the fourth region;

[0036] Figure 12 is to remove Figure 11 Schematic diagram of the bending connection region with a second preset depth corresponding to the flexible region shown;

[0037] Figure 13 is to remove Figure 12 Schematic diagram of all the substrates corresponding to the fourth region shown.

[0038] The meanings of the marks in the figure are:

[0039] 10. Substrate;

[0040] 101. Processing surface; 102. Fixed surface; 11. First region; 12. Second region; 121. Flexible region; 122. Connection region; 13. Third region; 14. Fourth region;

[0041] 110. Rigid part; 120. Flexible part; 130. Plug - in connection part;

[0042] 20. Peelable layer;

[0043] 30. Vacuum table surface. Detailed implementation manners

[0044] In order to make the objectives, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0045] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0046] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of this application, "a plurality of" means two or more unless otherwise specifically defined.

[0047] Reference to "one embodiment", "some embodiments" or "an embodiment" in the description of this application means that a particular feature, structure or characteristic described in connection with the embodiment is included in one or more embodiments of this application. Thus, statements such as "in one embodiment", "in some embodiments", "in other some embodiments", "in still other embodiments" etc. that appear in different places in this specification are not necessarily all referring to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in another way. In addition, in one or more embodiments, specific features, structures or characteristics can be combined in any suitable manner.

[0048] In order to illustrate the technical solutions of this application, the following will be described in conjunction with specific drawings and embodiments.

[0049] With the popularization of new energy vehicle products, more and more electronic products are used in automobiles, and there are a very large number of zero-insertion-force electrical connectors designed at positions such as in-vehicle cameras and circuit connection points of various electronic products.

[0050] At present, printed circuit boards that can be used for zero-insertion-force electrical connectors generally include flexible printed circuit boards using polyimide materials and rigid-flex printed circuit boards, etc., but the processing processes of existing flexible printed circuit boards and rigid-flex printed circuit boards are complex.

[0051] In view of this, the present application provides a printed circuit board and a manufacturing method thereof. Since the substrate has a processing surface, the processing surface includes a first region and a second region arranged adjacent to each other, and when processing, the substrate corresponding to the second region is removed by a first preset depth, so that the remaining substrate corresponding to the second region is a bent connection region, and the thickness of the bent connection region is less than the thickness of the rigid portion. Therefore, not only can the end of the bent connection region be easily connected to a zero insertion force electrical connector, but also the bent connection region between the substrate corresponding to the first region and the zero insertion force electrical connector has good flexibility and is easy to bend. The manufacturing method of the printed circuit board provided by the embodiments of the present application is simple in manufacturing and low in cost, and can improve the problem of complex processing flows of existing flexible printed circuit boards and rigid-flex printed circuit boards.

[0052] Please refer to Figures 1 to 5 , in a first aspect, an embodiment of the present application provides a manufacturing method of a printed circuit board, including:

[0053] S100: Provide a substrate 10, the substrate 10 has a processing surface 101, the processing surface 101 includes a first region 11 and a second region 12 arranged adjacent to each other, and the substrate 10 corresponding to the first region 11 is a rigid portion 110.

[0054] Specifically, the substrate 10 may be a rigid substrate 10 formed by alternately combining at least one metal layer and at least one insulating dielectric layer. The metal layer is usually a copper foil, and a circuit pattern disposed on the substrate 10 can be formed by processes such as etching. The insulating dielectric layer includes resin and glass fiber cloth, and the resin may be epoxy resin, polyimide resin, polytetrafluoroethylene, BT (Bismaleimide Triazine) resin, polyphenylene ether resin, etc. When there are two or more metal layers, an insulating dielectric layer is provided between adjacent two metal layers. Among them, a part of the second region 12 may be located at the edge of the processing surface 101.

[0055] S200: Remove the substrate 10 corresponding to the second region 12 by a first preset depth D1, so that the remaining substrate 10 corresponding to the second region 12 is a bent connection region, and the thickness T1 of the bent connection region is less than the thickness T of the rigid portion 110.

[0056] Specifically, a milling cutter can be used to remove the substrate 10 corresponding to the second region 12 by a controlled-depth milling method. Since the thickness T1 of the bent connection region is less than the thickness T of the rigid portion 110, the end of the bent connection region can be easily connected to an external socket such as a zero insertion force electrical connector, the bent connection region is easy to be connected to the zero insertion force electrical connector, and the rigid material can also have a certain bending performance and has good flexibility.

[0057] It can be understood that when removing the substrate 10 with the first preset depth D1 corresponding to the second region 12, part of the insulating dielectric layer and / or metal layer is removed.

[0058] As can be seen from the above, in the manufacturing method of the printed circuit board provided by the embodiment of the present application, since the substrate 10 has a processing surface 101, the processing surface 101 includes an adjacent first region 11 and a second region 12, and when processing, by removing the substrate 10 with the first preset depth corresponding to the second region 12, the remaining substrate 10 corresponding to the second region 12 becomes a bent connection area, and the thickness T1 of the bent connection area is less than the thickness T of the rigid part 110. Therefore, not only can the end of the bent connection area be easily connected to the zero insertion force electrical connector, but also the bent connection area between the substrate 10 corresponding to the first region 11 and the zero insertion force electrical connector has good flexibility and is easy to bend. The manufacturing method of the printed circuit board provided by the embodiment of the present application is simple to manufacture, has a low cost, and can improve the problem of the complex processing flow of the existing flexible printed circuit board and rigid-flex printed circuit board.

[0059] The manufacturing method of the printed circuit board provided by the embodiment of the present application does not require the use of rigid-flex printed circuit board manufacturing technology, does not need to add reinforcing materials, and uses a new design to utilize the controlled-depth routing and semi-rigid-flex printed circuit board manufacturing technology to manufacture a semi-rigid-flex printed circuit board that can be bent during the assembly process and can be inserted into a zero insertion force electrical connector. The manufacturing method is simple to manufacture and has a low cost.

[0060] Optionally, the substrate 10 can be manufactured in the following manner:

[0061] Cutting: Cut a large-sized copper clad laminate into the required working board according to the design requirements.

[0062] Core board inner layer pattern transfer: Use a 4CCD (Charge Coupled Device) alignment lens semi-automatic exposure machine to manufacture the inner layer circuit required for the master board. The circuit should include the pattern within the unit, copper plating in the gaps between units, copper plating in the gaps between panels, and copper plating in the gaps between the unit and the board edge;

[0063] Development: Develop the unpolymerized resist film, and the polymerized resist film will not react with the developing solution. Expose the conductors that do not need to be retained for the next process of etching.

[0064] Acid etching: Use an acid etching solution to etch away the copper conductors without resist film protection, and retain the copper conductors with film protection. This process manufactures the inner layer circuit.

[0065] Stripping: Remove the film protecting the copper conductors through a stripping solution. At this time, the inner layer circuit and the inner layer pads are manufactured.

[0066] Optical inspection: Conduct optical inspection on the completed inner-layer circuit board to confirm the quality.

[0067] Punching: Use an OPE (Outside Piercing) punching machine to punch out 8 holes, including 4 fusion positioning holes and 4 riveting positioning holes.

[0068] Brownification: Brownify the surface of the completed circuit board through a brownification solution to roughen the surface of the copper conductor.

[0069] Lamination: Stack PP (Prepreg) sheets on the brownified inner-layer core board according to the customer's stack structure, use 8 positioning holes for riveting. Before lamination, use an x-ray inspection machine to fully irradiate the interlayer alignment rings. Pre-stack the board up and down according to the stack structure after riveting, and then perform lamination in a high-temperature environment.

[0070] After lamination, fabricate according to the conventional process: brownification, laser drilling, plasma treatment, copper electroplating on the board, board electroplating thickening, outer-layer circuit, pattern electroplating, outer-layer etching, solder mask, characters, immersion gold, testing.

[0071] Routing: Use a CNC (Computerized Numerical Control) router to complete the outer shape fabrication of the substrate 10 in the horizontal direction.

[0072] In this embodiment, the second region 12 includes a flexural region 121 and a connection region 122 arranged adjacent to each other. The flexural region 121 is located between the first region 11 and the connection region 122. The flexural region 121 is adjacent to the first region 11. The bending connection region corresponding to the connection region 122 is the plug-in connection portion 130. After removing the substrate 10 with a first preset depth D1 corresponding to the second region 12, remove the bending connection region with a second preset depth D2 corresponding to the flexural region 121. The remaining bending connection region corresponding to the flexural region 121 is the flexural portion 120. The thickness T2 of the flexural portion 120 is less than the thickness T1 of the plug-in connection portion 130.

[0073] By adopting the above solution, the flexibility of the flexural portion 120 can be made better, which is more convenient for bending. And after connecting the plug-in connection portion 130 to an external socket such as a zero-insertion-force electrical connector, it can ensure that the plug-in connection portion 130 has good strength.

[0074] It can be understood that the substrate 10 corresponding to the first region 11 is the rigid portion 110, which is the region where the printed circuit board is connected to modules such as components and fixed molds. This region is the same as the traditional printed circuit board manufacturing method.

[0075] In addition to the connection function, the flexible part 120 also has the function of being bendable during assembly. The bending connection area corresponding to the connection area 122 is the plug-in connection part 130, which is required to be able to be plugged and unplugged using a zero-insertion-force electrical connector. The flexible part 120 and the plug-in connection part 130 have at least one metal layer (circuit layer) and an insulating dielectric layer. The plug-in connection part 130 is used for electrical connection with an external socket such as a zero-insertion-force electrical connector. The design of the plug-in connection part 130 conforms to the plugging and unplugging requirement dimensions of the used zero-insertion-force electrical connector, including thickness, width, length, and requirements for the finger circuit, etc.

[0076] In one embodiment, on the side of the substrate 10 where the controlled-depth milling groove is performed, the outermost layer of the corresponding plug-in connection part 130 is an insulating dielectric layer, and on the other side of the plug-in connection part 130, there are fingers, which are used for electrical connection with an external socket such as a zero-insertion-force electrical connector.

[0077] In one embodiment, the stacking design of the flexible part 120 can be designed with stacking structures such as 1 layer, 2 layers, 3 layers, and 4 layers. Its width can be arbitrarily changed according to the wiring requirements and assembly requirements. The length L should be determined by the radius of the arc formed by the bending of the printed circuit board during assembly and the bending angle, and it is required to satisfy L≥πR*α / 180° (the radius of the arc R formed by the bending, the bending angle α).

[0078] Among them, the thickness of the flexible part 120 is 0.10 mm - 0.40 mm, such as 0.10 mm, 0.20 mm, 0.30 mm, or 0.40 mm.

[0079] With such a setting, the flexibility of the flexible part 120 can be better, making it more convenient to bend, and ensuring that the flexible part 120 has sufficient strength.

[0080] In the related art, when forming the flexible part 120 and the plug-in connection part 130 with different thicknesses on the substrate 10, during the manufacturing process, it is difficult to fix them due to the thinning of the flexible part 120 and the plug-in connection part 130, resulting in vibration of the substrate 10, and the relative position relationship between the height of the controlled-depth router and the substrate 10 changes, thereby affecting the thickness tolerance of the flexible part 120 and the plug-in connection part 130, and even possibly causing damage to the printed circuit board.

[0081] In view of this, please refer to Figures 1 to 5 , in this embodiment, the substrate 10 has a fixed surface 102 opposite to the processing surface 101, and the fixed surface 102 has a fixed area opposite to the second area 12; before removing the bending connection area with the second preset depth corresponding to the flexible area 121, the fixed area is fixed.

[0082] By adopting the above solution, it is possible to avoid the situation where, due to the relatively thin thickness of the bent connection area, when removing the bent connection area with the second preset depth corresponding to the flexible area 121, the vibration of the bent connection area causes the remaining thickness tolerance of the flexible part 120 to be uncontrollable precisely, resulting in an uneven surface of the flexible part 120 after removing the bent connection area with the second preset depth corresponding to the flexible area 121, thereby affecting its bending performance.

[0083] The manufacturing method of the printed circuit board provided by the embodiment of the present application can make the thickness tolerances of the flexible part 120 and the plug-in connection part 130 be ±0.03 mm.

[0084] Optionally, the fixing area can be fixed by means of clamping or adsorption.

[0085] It should be noted that the entire fixing surface 102 can be fixed to better avoid the vibration of the bent connection area. Before removing the substrate 10 with the first preset depth D1 corresponding to the second area 12, the fixing area is fixed.

[0086] Among them, fixing the fixing area includes:

[0087] First, a peelable layer 20 is attached to the fixing surface 102, and the peelable layer 20 covers at least the fixing area.

[0088] Secondly, the substrate 10 is placed on the vacuum table 30, and the vacuum table 30 is attached to the peelable layer 20.

[0089] Finally, the vacuum table 30 is used to adsorb and fix the peelable layer 20.

[0090] With such a setting, the holes in the fixing area can be covered by the peelable layer 20, avoiding the situation where the fixing area cannot be tightly adsorbed due to the presence of holes or unevenness in the fixing area.

[0091] It can be understood that the peelable layer 20 can cover the entire fixing surface 102. When removing the substrate 10 with the first preset depth D1 corresponding to the second area 12, the vacuum table 30 is turned on, and the table vacuum will tightly adsorb the peelable layer 20, and the peelable layer 20 will bond the substrate 10 through adhesion. At this time, during the process of controlling the depth with a router, the substrate 10 is evenly adsorbed on the vacuum table 30. Even if the substrate 10 becomes locally thinner, the vacuum table 30 can still stably adsorb the bent connection area, so that the thickness tolerances of the flexible part 120 and the plug-in connection part 130 can be ±0.03 mm, meeting the usage requirements.

[0092] After removing the bent connection area with the second preset depth corresponding to the flexible area 121, the peelable layer 20 needs to be removed. The peelable layer 20 can be a PVC (Polyvinyl chloride) tape, a PTFE (Polytetrafluoroethylene) tape, a PET (Polyethylene terephthalate) tape, a PU (Polyurethane) tape, a PP (Polypropylene) tape, a TPU (Thermoplastic Urethane) tape, etc.

[0093] Please refer to Figures 6 to 9 , in another embodiment, the processing surface 101 further includes a third area 13. The third area 13 is located on one side of the second area 12, and both the flexible area 121 and the connection area 122 are adjacent to the third area 13.

[0094] By adopting the above solution, the substrate 10 corresponding to the third area 13 can ensure that the bent connection area has sufficient strength, so as to avoid the situation that due to the relatively thin thickness of the bent connection area, when removing the bent connection area with the second preset depth corresponding to the flexible area 121, the remaining thickness tolerance of the flexible part 120 cannot be accurately controlled due to the vibration of the bent connection area, resulting in an uneven surface of the flexible part 120 after removing the bent connection area with the second preset depth corresponding to the flexible area 121, and further affecting its bending performance.

[0095] It can be understood that the substrate 10 corresponding to the third area 13 can be used as a connection position, and the connection position can support the flexible part 120 and the plug-in connection part 130, so that the thickness tolerance of the flexible part 120 and the plug-in connection part 130 is ±0.03 mm, meeting the use requirements. When removing the substrate 10 with the first preset depth D1 corresponding to the second area 12, the connection position is not processed.

[0096] It should be noted that the connection position can be set in the waste area of the substrate 10. Along the distribution direction of the flexible part 120 and the plug-in connection part 130, the width of the connection position is between 1 mm and 2 mm. When forming the board by routing, the connection position is reserved and connected to the flexible part 120 and the plug-in connection part 130. After the assembly of the semi-rigid flexible board is completed, the connection position can be removed by laser cutting.

[0097] It can be understood that when the sizes of the flexible part 120 and the plug-in connection part 130 are relatively long, the number of single-sided connection positions can be increased, not limited to one.

[0098] Optionally, two third regions 13 are provided, and the arrangement directions of the two third regions 13 are arranged at an angle to the arrangement directions of the first region 11 and the second region 12.

[0099] With such an arrangement, the substrate 10 corresponding to the third region 13 can ensure that the flexible portion 120 and the plug-in connection portion 130 have higher strength, so as to better support the flexible portion 120 and the plug-in connection portion 130.

[0100] Please refer to Figures 10 to 13 , in another embodiment, the processing surface 101 further includes a fourth region 14, the fourth region 14 is located on the side of the second region 12 away from the first region 11, and the connection region 122 is adjacent to the fourth region 14; when removing the substrate 10 with the first preset depth corresponding to the second region 12, a part of the substrate 10 corresponding to the fourth region 14 is removed.

[0101] By adopting the above solution, the substrate 10 corresponding to the fourth region 14 can be connected to the substrate 10 corresponding to the connection region 122 to enhance the rigidity of the substrate 10, so as to avoid that due to the relatively thin thickness of the bending connection area, when removing the bending connection area with the second preset depth corresponding to the flexible area 121, the remaining thickness tolerance of the flexible portion 120 cannot be accurately controlled due to the vibration of the bending connection area, and the surface of the flexible portion 120 is uneven after removing the bending connection area with the second preset depth corresponding to the flexible area 121, thereby affecting its bending performance.

[0102] It can be understood that after removing the substrate 10 with the first preset depth corresponding to the fourth region 14, the remaining substrate 10 corresponding to the fourth region 14 can be a rigid auxiliary area. The rigid auxiliary area can be connected to the bending connection area through the substrate 10 corresponding to the fourth region 14 to enhance the rigidity of the substrate 10, so that the thickness tolerance of the flexible portion 120 and the plug-in connection portion 130 is ±0.03 mm, meeting the use requirements.

[0103] Among them, providing the substrate 10 includes:

[0104] First, a panel is provided, the panel includes a plurality of substrates 10, and the fourth region 14 of the processing surface 101 of one substrate 10 is adjacent to the first region 11 of the processing surface 101 of another substrate 10 adjacent to the current substrate 10.

[0105] Second, after removing the substrate 10 with the second preset depth corresponding to the flexible region 121, all the substrates 10 corresponding to the fourth region 14 are removed.

[0106] With such an arrangement, after removing all the substrates 10 corresponding to the fourth region 14, the two adjacent substrates 10 can be directly separated, thus saving processes and improving production efficiency.

[0107] It should be noted that the fourth region 14 can be arranged in the waste area of the substrate 10. All the substrates 10 corresponding to the fourth region 14 can be removed by laser cutting. Since laser cutting has no pulling force generated by mechanical controlled depth milling, removing the substrates 10 corresponding to the fourth region 14 will not affect the plug-in connection part 130.

[0108] In a second aspect, an embodiment of the present application provides a printed circuit board, which is processed by the manufacturing method of the printed circuit board as in the first aspect. The printed circuit board includes a connected rigid part 110 and a bending connection area, and the thickness T1 of the bending connection area is less than the thickness T of the rigid part 110.

[0109] For the printed circuit board provided by the embodiment of the present application, since the substrate 10 has a processing surface 101, the processing surface 101 includes an adjacent first region 11 and a second region 12, and when processing, the substrate 10 corresponding to the second region 12 is removed by a first preset depth, so that the remaining substrate 10 corresponding to the second region 12 is the bending connection area, and the thickness T1 of the bending connection area is less than the thickness T of the rigid part 110. Therefore, not only can the end of the bending connection area be easily connected to the zero insertion force electrical connector, but also the bending connection area between the substrate 10 corresponding to the first region 11 and the zero insertion force electrical connector has better flexibility and is convenient for bending. The manufacturing method of the printed circuit board provided by the embodiment of the present application is simple in production and low in cost, and can improve the problem of the complex processing flow of the existing flexible printed circuit board and rigid-flex printed circuit board.

[0110] Optionally, the bending connection area includes a connected flexible part 120 and a plug-in connection part 130. The flexible part 120 is located between the plug-in connection part 130 and the rigid part 110, and the thickness T2 of the flexible part 120 is less than the thickness T1 of the plug-in connection part 130.

[0111] By adopting the above scheme, the flexibility of the flexible part 120 can be better, which is more convenient for bending, and after connecting the plug-in connection part 130 to an external socket such as a zero insertion force electrical connector, it is ensured that the plug-in connection part 130 has better strength.

[0112] The printed circuit board provided by the embodiment of the present application can be a semi-rigid-flex board, which can meet the plugging and unplugging requirements of the zero insertion force electrical connector.

[0113] The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. A method for manufacturing a printed circuit board, characterized in that: include: Providing a substrate, the substrate having a processing surface, the processing surface including a first area and a second area arranged adjacent to each other, the substrate corresponding to the first area being a rigid portion; The substrate of the first preset depth corresponding to the second area is removed, and the remaining substrate corresponding to the second area is a bending connection area, and the thickness of the bending connection area is less than the thickness of the rigid part.

2. The method for manufacturing a printed circuit board according to claim 1, characterized in that: The second area includes a flexible area and a connection area that are adjacently arranged, the flexible area is located between the first area and the connection area, the flexible area is adjacent to the first area, and the bending connection area corresponding to the connection area is a plug-in connection part; after removing the substrate of the first preset depth corresponding to the second area, the bending connection area of ​​the second preset depth corresponding to the flexible area is removed, and the remaining bending connection area corresponding to the flexible area is the flexible part, and the thickness of the flexible part is less than the thickness of the plug-in connection part.

3. The method for manufacturing a printed circuit board according to claim 2, characterized in that: The substrate has a fixing surface opposite to the processing surface, and the fixing surface has a fixing area arranged opposite to the second area; before removing the bending connection area of ​​the second preset depth corresponding to the flexible area, the fixing area is fixed.

4. The method for manufacturing a printed circuit board according to claim 3, characterized in that: The fixing of the fixed area includes: A peelable layer is attached to the fixing surface, wherein the peelable layer at least covers the fixing area; Placing the substrate on a vacuum table, wherein the vacuum table is in contact with the peelable layer; The vacuum table is used to adsorb and fix the peelable layer.

5. The method for manufacturing a printed circuit board according to claim 2, characterized in that: The processing surface also includes a third area, the third area is located on one side of the second area, and the flexible area and the connecting area are both arranged adjacent to the third area.

6. The method for manufacturing a printed circuit board according to claim 5, characterized in that: Two third regions are provided, and the arrangement direction of the two third regions forms an angle with the arrangement direction of the first region and the second region.

7. The method for manufacturing a printed circuit board according to claim 2, characterized in that: The processing surface also includes a fourth area, which is located on a side of the second area away from the first area, and the connecting area is arranged adjacent to the fourth area; when removing the substrate of the first preset depth corresponding to the second area, the part of the substrate corresponding to the fourth area is removed.

8. The method for manufacturing a printed circuit board according to claim 7, characterized in that: The providing of the substrate comprises: Providing a panel, the panel comprising a plurality of the substrates, wherein the fourth region of the processing surface of one of the substrates is arranged adjacent to the first region of the processing surface of another substrate adjacent to the current substrate; After removing the substrate at the second preset depth corresponding to the flexible area, all of the substrate corresponding to the fourth area is removed.

9. A printed circuit board, characterized in that: The printed circuit board is manufactured by the method for manufacturing a printed circuit board according to any one of claims 1 to 8, and the printed circuit board comprises the rigid portion and the bending connection area connected to each other, and the thickness of the bending connection area is smaller than the thickness of the rigid portion.

10. The printed circuit board according to claim 9, characterized in that: The bending connection area includes a flexible portion and a plug-in connection portion connected to each other, the flexible portion is located between the plug-in connection portion and the rigid portion, and the thickness of the flexible portion is smaller than the thickness of the plug-in connection portion.

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