Processing method suitable for small-spacing LED circuit board

Abstract

The invention belongs to the technical field of circuit board manufacturing, and provides a processing method suitable for a small-spacing LED circuit board, and the method comprises the steps: collecting first exposure data of primary imaging, and collecting first high-resolution image data after primary imaging and first environment data of circuit board processing through a high-resolution camera; processing the first exposure data, the first high-resolution image data and the first environment data to obtain a first microspur processing feature of the circuit board, and constructing a microspur circuit board processing method generation model according to the first microspur processing feature and a correspondingly set first laser processing method at the moment; and inputting the second microspur processing characteristics obtained by processing the related characteristics of the to-be-processed circuit board to obtain a second laser processing method, and controlling the working parameters of the laser equipment and the developing, etching and electroplating processing parameters in a high-precision manner according to the second laser processing method to realize high-precision processing, so that the yield of circuit board processing production is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board manufacturing, and particularly to a processing method applicable to a circuit board for mini-LED with a small pitch. Background Art

[0002] With the rapid development of display technology, mini-LED and Macro-LED have gradually become the focus of the market due to their excellent display performance. However, there are severe challenges in the production process of their circuit boards. Currently, conventional LDI (Laser Direct Imaging) imaging equipment exposes many deficiencies when dealing with the micro range of pad pitches between 20um and 70um. Due to this extremely small pitch, when performing graphic exposure on the dry film, limited by the accuracy and imaging principle of the LDI equipment, it is difficult to accurately present a clear graphic that meets the requirements, easily leading to problems such as graphic deviation and line blurring, and further causing defects such as short circuits and open circuits in subsequent processes such as etching and electroplating, greatly reducing the yield rate of the circuit board and severely restricting the efficient development of the mini-LED and Macro-LED industries.

[0003] Therefore, the existing technology has the following problems:

[0004] Firstly, how to design an advanced image recognition and alignment system to accurately align the laser equipment with the preliminarily exposed graphic on the circuit board, control the alignment accuracy within a certain value, and ensure the accuracy of subsequent processing positions. How to control the laser equipment to perform fine reprocessing on the graphics after dry film and wet film development, burn out a fine pad pitch graphic with a pitch of 20 - 70um through accurate alignment and control of laser energy and pulse frequency, and monitor the burning process in real time and dynamically adjust parameters to ensure graphic quality. Summary of the Invention

[0005] The purpose of the present invention is to overcome the defects of the existing technology and provide a brand-new processing method that can accurately meet the process requirements of the entire board with small pitches for mini-LED and Macro-LED circuit boards, and significantly improve the yield rate.

[0006] In the first aspect of the present invention, a processing method applicable to a circuit board for mini-LED with a small pitch is provided, and the method includes:

[0007] Collect the first exposure data of the initial imaging, and use a high-resolution camera to collect the first high-resolution image data after the initial imaging and the first environmental data of the circuit board processing, and then process the first exposure data, the first high-resolution image data, and the first environmental data to obtain the first micro-processing feature of the circuit board;

[0008] Obtain the first laser processing method corresponding to the first micro-processing feature;

[0009] Construct a model for the micro-pitch circuit board processing method based on the first micro-machining feature and the correspondingly set first laser processing method; a processing method applicable to the micro-pitch LED circuit board

[0010] Obtain the second micro-machining feature by processing the first exposure data of the initial imaging of the circuit board to be processed, and using a high-resolution camera to collect the second high-resolution image data after the initial imaging and the second environmental data of the circuit board to be processed

[0011] Input the second micro-machining feature into the micro-pitch circuit board processing method generation model to obtain the second laser processing method, and control the working parameters of the laser device and the developing, etching, and electroplating processing parameters according to the second laser processing method

[0012] Furthermore, the first exposure data is calculated from the first light intensity of the exposure device, the first exposure time, and the first reflectivity and first absorptivity of the circuit board material

[0013] The second exposure data is calculated from the second light intensity of the exposure device, the second exposure time, and the second reflectivity and second absorptivity of the circuit board material

[0014] Furthermore, the first high-resolution image data is corrected through the first exposure data and the circuit board design drawing parameters

[0015] The second high-resolution image data is corrected through the second exposure data and the circuit board design drawing parameters

[0016] Furthermore, the first environmental data includes the temperature of the first production workshop, the humidity of the first production workshop, and the air cleanliness of the first production workshop

[0017] The second environmental data includes the temperature of the second production workshop, the humidity of the second production workshop, and the air cleanliness of the second production workshop

[0018] Furthermore, the process of processing the first exposure data, the first high-resolution image data, and the first environmental data to obtain the first micro-machining feature of the circuit board is to perform feature processing by the method of feature vector splicing of the first exposure data, the first high-resolution image data, and the first environmental data

[0019] The process of processing the second exposure data, the second high-resolution image data, and the second environmental data to obtain the second micro-machining feature of the circuit board is to perform feature processing by the method of feature vector splicing of the second exposure data, the second high-resolution image data, and the second environmental data

[0020] Further, the generation model of the micro-pitch circuit board processing method adopts a Fisher criterion classification model improved based on high-resolution image data.

[0021] Further, the generation model of the micro-pitch circuit board processing method adopts a Fisher criterion classification model improved based on high-resolution image data.

[0022] There is also provided a processing system applicable to a micro-pitch LED circuit board, including a circuit board pretreatment module, a circuit board primary imaging processing module, a macro processing feature generation module, a generation model construction module of the micro-pitch circuit board processing method, and a laser device parameter control module, characterized in that:

[0023] The circuit board pretreatment module: is used for performing conventional preliminary processes on the circuit board substrate, including grinding, cleaning, and drying treatments, ensuring that the substrate surface is clean and free of impurities, and then uniformly coating a dry film or a wet film on the substrate surface;

[0024] The circuit board primary imaging processing module: is used for collecting first high-resolution image data obtained by shooting and processing with a high-resolution camera after exposure by an existing conventional LDI imaging device, and is also used for collecting second high-resolution image data of the circuit board to be processed;

[0025] The macro processing feature generation module: collects the first exposure data that causes the primary imaging, is also used for collecting the second exposure data of the circuit board to be processed, collects the first environmental data and the second environmental data of the workshop for processing the circuit board, and processes the first high-resolution image data, the first exposure data, and the first environmental data to obtain a first macro processing feature;

[0026] It also obtains a second macro processing feature by processing the second high-resolution image data, the second exposure data, and the second environmental data;

[0027] The generation model construction module of the micro-pitch circuit board processing method: constructs a generation model of the micro-pitch circuit board processing method according to the first macro processing feature and the corresponding set first laser processing method; and receives the second macro processing feature, and the generation model of the micro-pitch circuit board processing method processes to obtain a second laser processing method;

[0028] The laser device parameter control module: receives the second laser processing method, and controls the working parameters of the laser device and the developing, etching, and electroplating processing parameters according to the second laser processing method.

[0029] Further, the first exposure data is calculated from the first light intensity of the exposure device, the first exposure time, and the first reflectivity and first absorptivity of the circuit board material;

[0030] The second exposure data is calculated from the second light intensity of the exposure device, the second exposure time, and the second reflectivity and second absorptivity of the circuit board material.

[0031] Furthermore, the model adopted by the micro-pitch circuit board processing method is a Fisher criterion classification model improved based on high-resolution image data.

[0032] The present invention breaks through equipment limitations: It cleverly uses a laser device to perform secondary processing on the pattern after LDI imaging, making up for the lack of precision in micro-pitch processing of conventional LDI equipment and greatly broadening the possibilities for process implementation. It improves the yield rate: Through precise alignment, fine control of laser parameters, and strict process flow control, defects such as short circuits and open circuits caused by pattern precision problems are effectively reduced, increasing the circuit board yield rate by more than 30%, providing strong guarantee for large-scale industrial production. It has strong process compatibility: The present invention is improved based on the existing circuit board production process, without the need for large-scale transformation of the overall production line, being easily integrated with the existing process, and reducing the equipment update cost and technical transformation difficulty of enterprises.

[0033] More embodiments and improvement effects of the present invention will be further introduced in combination with the drawings and specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 It is a schematic flow chart of the processing method of the present invention;

[0035] Figure 2 It is a schematic diagram of the processing principle of the laser device;

[0036] Figure 3 It is a comparison diagram of the pattern around a certain pad of the circuit board before and after using the method of the present invention;

[0037] Figure 4 It is the schematic diagram of the model principle of the Fisher criterion improved based on high-resolution image data in the present invention;

[0038] Figure 5 It is the schematic structural diagram of the electronic device in the embodiment of the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0039] Next, in combination with the drawings and specific embodiments, a further description of the invention will be made. Generally, the processing steps of the circuit board are as follows:

[0040] Step 1: Pretreatment of the circuit board

[0041] Prepare the LED circuit board substrate to be processed, and perform conventional preliminary processes on it, including grinding, brushing, cleaning, and drying to ensure that the substrate surface is clean and free of impurities. Subsequently, a dry film or a wet film is evenly coated on the substrate surface. The thickness of the dry film or wet film is precisely controlled according to the subsequent process requirements, and the coating method adopts a high-precision roll coating process. For the dry film, a laminator is used to ensure flatness and uniformity.

[0042] Step 2: Initial imaging

[0043] Use existing conventional LD I imaging equipment to perform preliminary graphic exposure on the circuit board coated with the dry film. Although this step is limited by the equipment accuracy and cannot directly meet the requirements of small pitch, it can initially construct a rough graphic framework and complete the exposure of graphics larger than 70 microns. The exposure parameters are optimized and adjusted according to the characteristics of the dry film and the circuit board design, and the graphics are developed as close to the target shape as possible to complete the exposure and development process of the circuit pattern.

[0044] Step 3: Laser fine processing

[0045] (1) Adopt a high-precision laser device, which has an ultra-fine spot focusing ability, and the spot diameter can be accurately adjusted to less than 10um to ensure processing accuracy.

[0046] (2) Through an advanced image recognition and alignment system, accurately align the laser device with the preliminary graphics exposed on the circuit board, and control the alignment accuracy within ±3um to ensure the accuracy of the subsequent processing position.

[0047] (3) According to the preset small pitch parameters, the laser device performs fine reprocessing on the graphics after the dry film and wet film are developed. By accurately aligning and controlling the laser energy, pulse frequency, and scanning path, a fine pad pitch pattern with a pitch of 20 - 70um is burned. The burning process is monitored in real time, and the parameters are dynamically adjusted to ensure the graphic quality.

[0048] Step 4: Subsequent processing

[0049] (1) Clean the circuit board after laser fine processing.

[0050] (2) Then perform the etching process. Use a suitable etching solution to etch the exposed metal layer into the required circuit pattern. The etching parameters are optimized according to the circuit board material and graphic fineness to ensure smooth circuit edges and no side etching.

[0051] (3) Finally, perform surface treatment processes such as electroplating to enhance the conductivity and stability of the circuit board and complete the production of the entire mini LED and Macro LED circuit boards.

[0052] In the first aspect of the present invention, a processing method applicable to a micro-pitch LED circuit board is provided, and the method includes:

[0053] Collect the first exposure data of the initial imaging, and use a high-resolution camera to collect the first high-resolution image data after the initial imaging and the first environmental data of the circuit board processing, and then process the first exposure data, the first high-resolution image data, and the first environmental data to obtain the first micro-machining feature of the circuit board;

[0054] Obtain the first laser processing method corresponding to the first micro-machining feature;

[0055] Construct a micro-pitch circuit board processing method generation model according to the first micro-machining feature and the corresponding first laser processing method set; A processing method applicable to a micro-pitch LED circuit board

[0056] Process the first exposure data of the initial imaging of the circuit board to be processed, and use a high-resolution camera to collect the second high-resolution image data after the initial imaging and the second environmental data of the circuit board to be processed to obtain the second micro-machining feature;

[0057] Input the second micro-machining feature into the micro-pitch circuit board processing method generation model to obtain the second laser processing method, and control the working parameters of the laser device and the developing, etching, and electroplating processing parameters according to the second laser processing method.

[0058] Further, the first exposure data is calculated from the first light intensity of the exposure device, the first exposure time, and the first reflectivity and first absorptivity of the circuit board material;

[0059] The second exposure data is calculated from the second light intensity of the exposure device, the second exposure time, and the second reflectivity and second absorptivity of the circuit board material;

[0060] The calculation formula is:

[0061]

[0062] In the formula, E x is the first exposure data or the second exposure data, A is the first absorptivity or the second absorptivity, L is the first light intensity or the second light intensity, T is the first exposure time or the second exposure time, and R is the first reflectivity or the second reflectivity.

[0063] Further, the first high-resolution image data is corrected by the first exposure data and the circuit board design drawing parameters;

[0064] The second high-resolution image data is obtained by correcting the second exposure data and the circuit board design drawing parameters;

[0065] The calculation formula is:

[0066]

[0067] In the formula, E x is the first exposure data or the second exposure data, k(x, y) is the corresponding parameter of the design element at the coordinate (x, y) in the circuit board design drawing, and g (x，y) is the image gray value at the coordinate (x, y) in the circuit board design drawing during the acquisition by the high-resolution camera, and G (x，y) is the first high-resolution image data or the second high-resolution image data after the initial imaging correction.

[0068] In this embodiment, the corresponding parameter of the design element is specifically the set value corresponding to the pad element symbol in the circuit board. The numerical value is set according to the element symbol marked on the circuit board. For example, if the element symbol is circular, it is set to 0.245. This value is the coefficient value for fine-tuning the gray value, and the value range is between 0.125 - 0.255.

[0069] In this embodiment, the values of the coordinates (x, y) are obtained from the size of the circuit board substrate and the required pad pitch. If the size of the circuit board substrate is 550mm × 600mm and the required pad pitch is 50um, then when the value of x for 50um is 1, the maximum value of x is 11000, and the value of y is the same.

[0070] Further, the first environmental data includes the temperature of the first production workshop, the humidity of the first production workshop, and the air cleanliness of the first production workshop;

[0071] The second environmental data includes the temperature of the second production workshop, the humidity of the second production workshop, and the air cleanliness of the second production workshop.

[0072] In this embodiment, the air cleanliness refers to the degree of the amount of dust (particles) in the air in a clean environment, that is, the number of particles in a cubic meter volume. The environmental data vector is expressed as (temperature, humidity, air cleanliness).

[0073] Further, the process of processing the first exposure data, the first high-resolution image data, and the first environmental data to obtain the first micro-machining feature of the circuit board is to perform feature processing by the method of splicing the feature vectors of the first exposure data, the first high-resolution image data, and the first environmental data;

[0074] In this embodiment, the feature vector of the micro-machining feature is horizontally spliced into (exposure data, high-resolution image data, environmental data).

[0075] Processing the second exposure data, the second high-resolution image data, and the second environmental data to obtain the second micro-machining feature of the circuit board is to perform feature processing by means of feature vector splicing of the second exposure data, the second high-resolution image data, and the second environmental data.

[0076] In this embodiment, generally, the method of horizontally splicing features is adopted.

[0077] Furthermore, the model generation method for the micro-pitch circuit board processing adopts a Fisher criterion classification model improved based on high-resolution image data.

[0078] Furthermore, the calculation formula of the Fisher criterion classification model improved based on high-resolution image data adopted by the model generation method for the micro-pitch circuit board processing is as follows:

[0079]

[0080] X is the first micro-machining feature or the second micro-machining feature, C(X) is the level of the output first laser processing method or the second laser processing method, and W T is the normal vector perpendicular to the hyperplane, which is obtained by training using the first micro-machining feature and the first laser processing method, and G (x，y) is the first high-resolution image data or the second high-resolution image data after the initial imaging correction, x is the abscissa value in the circuit board design drawing, y is the ordinate value in the circuit board design drawing, and x max is the maximum abscissa value in the circuit board design drawing, and y max is the maximum ordinate value in the circuit board design drawing.

[0081] There is also provided a processing system applicable to a micro-pitch LED circuit board, including a circuit board preprocessing module, a circuit board initial imaging processing module, a micro-machining feature generation module, a model construction module for the micro-pitch circuit board processing method, and a laser device parameter control module;

[0082] The circuit board preprocessing module: is used to perform conventional preliminary processes on the circuit board substrate, including grinding, cleaning, and drying processes, to ensure that the surface of the substrate is clean and free of impurities, and then uniformly coat a dry film or a wet film on the surface of the substrate;

[0083] The circuit board initial imaging processing module: is used to collect the first high-resolution image data obtained by shooting and processing with a high-resolution camera after exposure by an existing conventional LDI imaging device, and is also used to collect the second high-resolution image data of the circuit board to be processed;

[0084] The macro-machining feature generation module: acquires the first exposure data that causes the initial imaging, and is also used to acquire the second exposure data of the circuit board to be processed, acquires the first environmental data and the second environmental data of the workshop where the circuit board is processed, and processes the first high-resolution image data, the first exposure data, and the first environmental data to obtain the first macro-machining feature;

[0085] It also obtains the second macro-machining feature by processing the second high-resolution image data, the second exposure data, and the second environmental data;

[0086] The micro-spacing circuit board processing method generation model construction module: constructs a micro-spacing circuit board processing method generation model according to the first macro-machining feature and the corresponding first laser processing method set; and receives the second macro-machining feature, and the micro-spacing circuit board processing method generation model processes it to obtain the second laser processing method;

[0087] The laser device parameter control module: receives the second laser processing method, and controls the working parameters of the laser device and the developing, etching, and electroplating processing parameters according to the second laser processing method.

[0088] Further, the first exposure data is calculated from the first light intensity of the exposure device, the first exposure time, and the first reflectivity and first absorptivity of the circuit board material;

[0089] The second exposure data is calculated from the second light intensity of the exposure device, the second exposure time, and the second reflectivity and second absorptivity of the circuit board material;

[0090] The calculation formula is:

[0091]

[0092] In the formula, E X is the first exposure data or the second exposure data, A is the first absorptivity or the second absorptivity, L is the first light intensity or the second light intensity, T is the first exposure time or the second exposure time, and R is the first reflectivity or the second reflectivity.

[0093] Further, the micro-spacing circuit board processing method generation model adopts an improved fisher criterion classification model based on high-resolution image data, and the calculation formula is as follows:

[0094]

[0095] X is the first macro-machining feature or the second macro-machining feature, C(X) is the level of the first laser processing method or the second laser processing method output, W Tis the normal vector perpendicular to the hyperplane, obtained by training using the first micro-machining feature and the first laser processing method, G (x，y) is the first high-resolution image data or the second high-resolution image data after primary imaging correction, x is the abscissa value in the circuit board design drawing, y is the ordinate value in the circuit board design drawing, x max is the maximum abscissa value in the circuit board design drawing, y max is the maximum ordinate value in the circuit board design drawing.

[0096] In this embodiment, the value of C(X) is used to obtain the laser processing method. If the value of C(X) is less than 0, the laser energy is set to be less than or equal to 80 μJ, the pulse frequency is less than or equal to 50 kHz, the developer temperature is controlled at 28 °C to 30 °C, and the processing time is 80 s to 90 s; for etching, an acidic copper chloride etching solution is used, and the etching rate is 1.985 μm / min to 2 μm / min; for electroplating, the copper plating thickness is 9.5 μm to 10 μm. If C(X) is equal to 0 or greater than 0, the laser energy, pulse frequency, developer temperature and processing time, etching rate, and electroplating thickness are accurately set within a small range according to experience. This is set according to the needs of those skilled in the art here and will not be elaborated further.

[0097] The present invention will be further described in detail below in conjunction with specific embodiments, but the present invention is not limited thereto.

[0098] Select a batch of circuit board substrates for producing the backlight of miniLED displays, with a size of 550 mm × 600 mm and a required pad pitch of 50 μm.

[0099] First, perform preprocessing according to Step 1. After cleaning the substrate, use a stamping process with a dry film having a thickness of 25 μm to ensure uniform coverage of the dry film.

[0100] Next, use a conventional LDI imaging device in the existing factory for primary imaging, with the exposure energy set to 150 mJ / cm 2 , and the scanning speed of 300 mm / s to obtain a preliminary graphic framework.

[0101] Then, introduce the high-precision laser device automatically adjusted by the present invention, adjust the spot diameter to 8 μm, accurately align with the preliminary graphic through the image recognition system, and control the error within ±2 μm. Perform engraving processing according to the design layout with a laser energy of 80 μJ and a pulse frequency of 50 kHz to obtain a fine pad graphic with a pitch of 50 μm.

[0102] The subsequent steps are development, with the developer temperature controlled at 30°C and the processing time at 90s; etching, using acidic cupric chloride etching solution, with an etching rate of 2μm / min; electroplating, with a copper plating thickness of 10μm, to obtain a pad spacing of 55 to 60um, which meets the technical requirements of the circuit board.

[0103] After testing, the batch of circuit boards produced by the method of the present invention has a yield rate of 90%, which is significantly improved compared with the 60% yield rate of the traditional process. The electrical performance of the circuit boards is stable, meeting the strict quality requirements of mini LED products.

[0104] The present invention breaks through the limitation of equipment: it cleverly uses laser equipment to perform secondary processing on the graphics after LDI imaging, which makes up for the lack of precision of conventional LDI equipment in processing small pitches and greatly broadens the possibility of process realization. Improve the yield rate: through precise alignment, fine laser parameter control and strict process flow control, it effectively reduces defects such as short circuits and open circuits caused by graphic accuracy problems, and increases the yield rate of circuit boards by more than 30%, providing strong guarantees for large-scale industrial production. Strong process compatibility: the present invention improves on the existing circuit board production process, without the need for large-scale transformation of the overall production line, and is easy to integrate with existing processes, reducing the company's equipment update costs and the difficulty of technological transformation.

[0105] Of course, it can be understood that each embodiment of the present invention can achieve one of the effects alone, and a combination of multiple embodiments of the present invention can achieve all of the above effects, but it is not required that every embodiment of the present invention achieve all of the above advantages and effects, because each embodiment of the present invention can constitute a separate technical solution and make one or more contributions to the prior art.

[0106] The present invention does not particularly specify the structure of some modules, which shall be subject to the contents recorded in the prior art. The prior art mentioned in the above background technology section and the specific embodiment section of the present invention can be used as part of the present invention to understand the meaning of some technical features or parameters. The scope of protection of the present invention shall be subject to the contents actually recorded in the claims.

Claims

1. A processing method suitable for a micro-pitch LED circuit board, characterized in that: The method comprises: Collecting first exposure data of initial imaging, and using a high-resolution camera to collect first high-resolution image data after the initial imaging and first environmental data of circuit board processing, and then processing the first exposure data, the first high-resolution image data and the first environmental data to obtain a first macro processing feature of the circuit board; Acquire a first laser processing method corresponding to the first macro processing feature; A micro-pitch circuit board processing method generation model is constructed based on the first micro-pitch processing feature and the corresponding first laser processing method; a processing method suitable for a micro-pitch LED circuit board The second macro processing feature is obtained by processing the first exposure data of the circuit board to be processed for the first time, the second high-resolution image data after the first imaging collected by the high-resolution camera, and the second environment data of the circuit board to be processed; The second micro-pitch processing feature is input into the micro-pitch circuit board processing method generation model to obtain a second laser processing method, and the working parameters of the laser equipment and the developing, etching and electroplating processing parameters are controlled according to the second laser processing method.

2. A processing method for a micro-pitch LED circuit board as claimed in claim 1, characterized in that: The first exposure data is calculated by a first light intensity, a first exposure time, and a first reflectivity and a first absorptivity of a circuit board material of an exposure device; The second exposure data is calculated based on a second light intensity, a second exposure time of an exposure device, and a second reflectivity and a second absorption rate of the circuit board material.

3. A processing method for a micro-pitch LED circuit board as claimed in claim 2, characterized in that: The first high-resolution image data is obtained by correcting the first exposure data and circuit board design drawing parameters; The second high-resolution image data is obtained by correcting the second exposure data and circuit board design drawing parameters.

4. A processing method for a micro-pitch LED circuit board as claimed in claim 1, characterized in that: The first environmental data includes the temperature of the first production workshop, the humidity of the first production workshop, and the air cleanliness of the first production workshop; The second environmental data includes the temperature of the second production workshop, the humidity of the second production workshop, and the air cleanliness of the second production workshop.

5. A processing method for a micro-pitch LED circuit board as claimed in claim 3, characterized in that: The first exposure data, the first high-resolution image data and the first environment data are processed to obtain the first macro processing feature of the circuit board, by performing feature processing on the first exposure data, the first high-resolution image data and the first environment data by means of feature vector splicing; The second macro processing feature of the circuit board is obtained by processing the second exposure data, the second high-resolution image data and the second environmental data, and feature processing is performed by splicing feature vectors of the second exposure data, the second high-resolution image data and the second environmental data.

6. A processing method for a micro-pitch LED circuit board as claimed in claim 5, characterized in that: The micro-pitch circuit board processing method generation model adopts a Fisher criterion classification model improved based on high-resolution image data.

7. A processing method for a micro-pitch LED circuit board as claimed in claim 6, characterized in that: The micro-pitch circuit board processing method generation model adopts a Fisher criterion classification model improved based on high-resolution image data.

8. A processing system suitable for micro-pitch LED circuit boards, comprising a circuit board pre-processing module, a circuit board primary imaging processing module, a micro-pitch processing feature generation module, a micro-pitch circuit board processing method generation model building module and a laser equipment parameter control module, characterized in that: The circuit board pretreatment module is used to perform conventional preliminary processes on the circuit board substrate, including brushing, cleaning and drying, to ensure that the substrate surface is clean and free of impurities, and then evenly coat the substrate surface with a dry film or a wet film; The circuit board primary imaging processing module is used to collect the first high-resolution image data taken and processed by a high-resolution camera after being exposed by an existing conventional LDI imaging device, and is also used to collect the second high-resolution image data of the circuit board to be processed; The macro processing feature generation module is used to collect first exposure data that leads to initial imaging, collect second exposure data of the circuit board to be processed, collect first environment data and second environment data of the workshop for processing the circuit board, and process the first high-resolution image data, the first exposure data and the first environment data to obtain a first macro processing feature; Also obtaining a second macro processing feature by processing the second high-resolution image data, the second exposure data and the second environment data; The micro-pitch circuit board processing method generation model construction module: constructs a micro-pitch circuit board processing method generation model according to the first micro-pitch processing feature and the corresponding first laser processing method; and receives the second micro-pitch processing feature, and processes the micro-pitch circuit board processing method generation model to obtain a second laser processing method; The laser equipment parameter control module receives the second laser processing method and controls the working parameters of the laser equipment and the developing, etching and electroplating processing parameters according to the second laser processing method.

9. A processing system for a micro-pitch LED circuit board as claimed in claim 8, characterized in that: The first exposure data is calculated by a first light intensity, a first exposure time, and a first reflectivity and a first absorptivity of a circuit board material of an exposure device; The second exposure data is calculated based on a second light intensity, a second exposure time of an exposure device, and a second reflectivity and a second absorption rate of the circuit board material.

10. A processing system for a micro-pitch LED circuit board as claimed in claim 9, characterized in that: The micro-pitch circuit board processing method generation model adopts a Fisher criterion classification model improved based on high-resolution image data.

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