Depth-controlled hole etching device of circuit board and preparation method of circuit board

Abstract

The invention relates to the technical field of circuit boards, in particular to a depth-control hole etching device of a circuit board and a preparation method of the circuit board, the device comprises a processing table, a fixed cylinder is arranged on the processing table through an adjusting assembly, a fixed block is arranged below the fixed cylinder through a rotating assembly, and the bottom of the fixed block is fixedly communicated with an injection pipe. A liquid inlet groove is formed in the fixing block, two sets of sliding plates are arranged on the outer wall of the injection pipe, a piston assembly is arranged in the liquid inlet groove, a pushing assembly is arranged above the piston assembly, the piston assembly is connected with the sliding plates through two sets of hydraulic assemblies, and the preparation method of the circuit board comprises the steps of positioning, preparing, cleaning, etching, injecting and the like. Through the movement of the sliding plate and the linkage of the hydraulic system, the injection amount of the wax liquid can be automatically adjusted according to the hole diameter, and the liquid level heights of the wax liquid in holes with different hole diameters are ensured to be the same, so that the adhesion heights of copper ions are ensured to be consistent, and the precision of a copper deposition process is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit boards, and particularly to a device for controlling deep etching holes of a circuit board and a method for manufacturing a circuit board. Background Art

[0002] During the manufacturing process of circuit boards, the treatment of holes is a key step. Especially in the production of high-density interconnect (HDI) boards and multi-layer boards, the quality of the holes directly affects the accuracy and reliability of subsequent processes (such as electroless copper plating, electroplating, etc.).

[0003] Currently, in the prior art when manufacturing circuit boards, in the process of controlling deep etching holes, the injection amount of wax liquid needs to be adjusted according to the diameter of the holes to ensure that the liquid level height of the wax liquid in the holes is consistent. However, the traditional hole treatment process usually relies on manual operation, with low efficiency and poor consistency, and it is difficult to meet the requirements of modern high-precision circuit board production. In addition, the traditional wax liquid injection method is difficult to accurately control the injection amount, resulting in inconsistent liquid level heights of the wax liquid in holes with different diameters, thus affecting the accuracy of the subsequent electroless copper plating process and resulting in poor practicality of the equipment. Summary of the Invention

[0004] The purpose of the present invention is to solve the problem that the poor treatment effect of holes in the prior art leads to a decrease in the accuracy of the electroless copper plating process, and to propose a device for controlling deep etching holes of a circuit board and a method for manufacturing a circuit board.

[0005] To achieve the above purpose, the present invention adopts the following technical solution: A device for controlling deep etching holes of a circuit board, including a processing table, a fixed cylinder is arranged on the processing table through an adjustment component, a fixed block is arranged below the fixed cylinder through a rotation component, an injection pipe is fixedly communicated with the bottom of the fixed block, a liquid inlet groove is arranged inside the fixed block, the liquid inlet groove is communicated with the injection pipe, two groups of sliding plates are arranged on the outer wall of the injection pipe, the two groups of sliding plates are combined to form a cylindrical shape, two groups of sliding components for driving the two groups of sliding plates to move are arranged inside the fixed block, a piston component is arranged in the liquid inlet groove, and a pushing component is arranged above the piston component, and the piston component is connected with the sliding plates through two groups of hydraulic components.

[0006] Preferably, the adjustment component includes a movable frame arranged on the processing table, a connecting frame is arranged on the movable frame, a connecting block is slidably connected to the connecting frame, and the connecting block is fixedly connected with the fixed cylinder.

[0007] Preferably, the rotation component includes a movable column rotatably connected to the lower end of the fixed cylinder, a motor is fixedly installed on the top of the fixed cylinder, an output end of the motor is fixedly connected with a rotating shaft, a bottom of the rotating shaft is fixedly connected with a top of the movable column, and the fixed block is fixedly installed at the bottom of the movable column.

[0008] Preferably, a storage tank is fixedly installed on the side wall of the movable column. The storage tank and the fixed block are fixedly connected by a liquid outlet pipe, the liquid outlet pipe communicates with the liquid inlet groove, and a check valve I is arranged on the side wall of the liquid outlet pipe.

[0009] Preferably, the sliding assembly includes a slide rail fixedly installed on the inner wall of the fixed block. Two electric sliders are slidably connected to the slide rail, and the two electric sliders are respectively fixedly connected to two slide plates.

[0010] Preferably, rotating grooves are respectively arranged on the sides of the two slide plates away from each other. A friction block is rotatably connected to the rotating groove through a rotating column. Springs are fixedly connected to the inner walls of the rotating groove on both sides of the friction block. Etching blocks and brushes are respectively arranged on both sides of the friction block, and grooves are alternately formed on the etching blocks.

[0011] Preferably, the two hydraulic assemblies correspond to the two slide plates respectively. The hydraulic assembly includes a communication groove arranged inside the fixed block, and the communication groove is filled with hydraulic oil. A push column is slidably connected to the upper end of the communication groove, and a communication block is slidably connected to one end of the communication groove away from the push column. The communication block is fixedly connected to the corresponding slide plate.

[0012] Preferably, the piston assembly includes a piston plate slidably connected to the inner wall of the liquid inlet groove. A connecting plate is slidably connected to the inner wall of the fixed block. The connecting plate is located above the piston plate and is fixedly connected to the piston plate by a piston column. The bottom of the connecting plate is fixedly connected to the top of the push column.

[0013] Preferably, the pushing assembly includes a hydraulic cylinder fixedly installed on the top of the inner wall of the movable column. An extrusion plate is slidably connected to the bottom of the inner wall of the movable column. The extrusion plate and the connecting plate are fixedly connected by an extrusion rod, and the extrusion rod is slidably connected to both the movable column and the fixed block.

[0014] A method for manufacturing a circuit board, applying the above-mentioned depth-controlled etching hole device for a circuit board, includes the following steps:

[0015] S1. Positioning: Fix the circuit board on the processing table, start the movable frame to adjust the position of the injection pipe, move it above the hole center of the circuit board, and then start the connecting frame to make the injection pipe move downward and enter the hole of the circuit board until the lower end of the slide plate completely enters the hole.

[0016] S2. Preparation: Start the electric slider, causing the two groups of electric sliders to slide outward along the slide rail, driving the two groups of slide plates to separate from each other. When the outer wall of the slide plate is completely attached to the inner wall of the hole of the circuit board, the electric slider stops sliding. At the same time, the connecting block moves synchronously with the slide plate and slides along the inner wall of the connecting groove, increasing the pressure inside the connecting groove. The hydraulic oil generates a thrust on the push column, pushing the push column to slide upward along the inner wall of the connecting groove. The push column drives the connecting plate and the piston plate to move synchronously, generating a negative pressure inside the liquid inlet groove, and sucking the wax liquid in the storage tank into the liquid inlet groove through the liquid outlet pipe.

[0017] S3. Cleaning: Start the motor, and the rotating shaft drives the movable column to rotate clockwise. The movable column drives the two groups of slide plates to rotate coaxially through the fixed block. When the slide plate rotates, the friction block generates an offset in the opposite direction of the rotation direction of the slide plate under the action of friction, causing the brush to contact the inner wall of the hole and cleaning the inner wall of the hole.

[0018] S4. Etching: After cleaning, control the motor to change the rotation direction of the output end, causing the slide plate to rotate counterclockwise. The friction block offsets in the opposite direction of the previous offset direction, causing the etching block to contact the inner wall of the hole. The etching block rotates with the slide plate to etch the inner wall of the hole.

[0019] S5. Injection: After etching, start the hydraulic cylinder. The hydraulic cylinder applies pressure to the extrusion plate. The extrusion plate drives the piston plate to slide downward along the inner wall of the liquid inlet groove through the connecting plate, extruding the wax liquid in the liquid inlet groove through the injection pipe and injecting it into the hole.

[0020] Compared with the existing technology, the advantages of the present invention are as follows:

[0021] 1. By using the movement of the slide plate to trigger the thrust of the hydraulic oil on the push column, and then driving devices such as the connecting plate and the piston plate to work together, the present invention realizes the suction and extrusion of the wax liquid, automatically adjusts the injection amount of the wax liquid according to the hole diameter, makes the water level of the wax liquid in holes of different diameters the same, ensures that the height of copper ions attached to the inner wall of the hole is consistent in the subsequent copper deposition process, effectively improves the precision of the copper deposition process, and thus helps to improve the stability and consistency of product quality.

[0022] 2. In the present invention, an electric slider is provided to separate the sliding plate and make it fit against the inner wall of the hole. The motor drives the sliding plate to rotate, causing the friction block to shift under the action of friction, enabling the brush to contact the inner wall of the hole, which can effectively remove impurities in the holes of the circuit board, ensure the cleanliness of the holes, provide good conditions for the subsequent copper deposition step, reduce the influence of impurities on the quality of copper deposition, improve the success rate and quality of copper deposition. After cleaning, the motor rotates counterclockwise to make the sliding plate rotate in the reverse direction, and the friction block shifts in the reverse direction, allowing the etching block to contact the inner wall of the hole and perform etching, creating an uneven shape inside the hole. This uneven surface increases the surface area of the inner wall of the hole, increases the sites for copper ion attachment, is conducive to better attachment of copper ions during the subsequent copper deposition step, improves the effect and stability of copper deposition, thereby enhancing the quality and performance of the circuit board. The two steps of cleaning and etching are integrated in one device and operation process, simplifying the process of treating the holes of the circuit board and improving the convenience of production. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 FIG. is a schematic diagram of the overall structure of a device for controlling the depth of etched holes in a circuit board and a method for manufacturing a circuit board proposed by the present invention;

[0024] Figure 2 FIG. is a schematic diagram of the structure of the connecting frame and the fixed cylinder part of a device for controlling the depth of etched holes in a circuit board and a method for manufacturing a circuit board proposed by the present invention;

[0025] Figure 3 FIG. is a half-sectional axonometric structure diagram of the fixed cylinder of a device for controlling the depth of etched holes in a circuit board and a method for manufacturing a circuit board proposed by the present invention;

[0026] Figure 4 FIG. is a half-sectional axonometric structure diagram of the movable column of a device for controlling the depth of etched holes in a circuit board and a method for manufacturing a circuit board proposed by the present invention;

[0027] Figure 5 FIG. is a half-sectional axonometric structure diagram of the fixed block of a device for controlling the depth of etched holes in a circuit board and a method for manufacturing a circuit board proposed by the present invention;

[0028] Figure 6 FIG. is a side-sectional axonometric structure diagram of the fixed block of a device for controlling the depth of etched holes in a circuit board and a method for manufacturing a circuit board proposed by the present invention;

[0029] Figure 7 FIG. is a half-sectional axonometric structure diagram of the communication groove of a device for controlling the depth of etched holes in a circuit board and a method for manufacturing a circuit board proposed by the present invention;

[0030] Figure 8 FIG. is a side-sectional axonometric structure diagram of the fixed block and the fixed column of a device for controlling the depth of etched holes in a circuit board and a method for manufacturing a circuit board proposed by the present invention;

[0031] Figure 9 Schematic diagram of the semi-sectional axonometric structure of the slider of a device for controlling the depth of etched holes on a circuit board and a method for manufacturing a circuit board according to the present invention;

[0032] Figure 10 Schematic diagram of the sectional axonometric structure of the slider and the friction block of a device for controlling the depth of etched holes on a circuit board and a method for manufacturing a circuit board according to the present invention;

[0033] Figure 11 Schematic diagram of the side-sectional axonometric structure of the friction block and the etching block of a device for controlling the depth of etched holes on a circuit board and a method for manufacturing a circuit board according to the present invention;

[0034] Figure 12 is Figure 11 Schematic diagram of the enlarged structure at position A in

[0035] In the figure: 1 processing table, 11 movable frame, 12 connecting frame, 2 fixed cylinder, 21 motor, 22 rotating shaft, 23 movable column, 24 hydraulic cylinder, 25 pressing plate, 26 storage tank, 27 liquid outlet pipe, 28 one-way valve 1, 3 fixed block, 31 liquid inlet groove, 32 injection pipe, 33 electric slider, 34 slide rail, 35 slide plate, 36 communication groove, 37 push column, 38 connecting plate, 39 piston plate, 4 friction block, 41 rotating column, 42 brush, 43 etching block, 44 spring. Detailed implementation manners

[0036] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments.

[0037] Refer to Figures 1 to 12, A device for controlling the depth etching of a circuit board, including a processing table 1. An activity frame 11 is arranged on the processing table 1. A connecting frame 12 is arranged on the activity frame 11. A connecting block is slidably connected to the connecting frame 12. A fixed cylinder 2 is fixedly installed on the side wall of the connecting block. A movable column 23 is rotatably connected to the lower end of the fixed cylinder 2. A motor 21 is fixedly installed on the top of the fixed cylinder 2. The output end of the motor 21 is fixedly connected to a rotating shaft 22. The bottom of the rotating shaft 22 is fixedly connected to the top of the movable column 23. A fixed block 3 is fixedly installed at the bottom of the movable column 23. An injection pipe 32 is fixedly communicated with the bottom of the fixed block 3. Two groups of sliding plates 35 are arranged on the outer wall of the injection pipe 32. The two groups of sliding plates 35 are combined to form a cylindrical shape. Two groups of sliding components are arranged inside the fixed block 3. The sliding component includes a slide rail 34 fixedly installed on the inner wall of the fixed block 3. Two electric sliders 33 are slidably connected to the slide rail 34. The two electric sliders 33 are respectively fixedly connected to the two groups of sliding plates 35. Rotating grooves are respectively arranged on the sides of the two groups of sliding plates 35 away from each other. A friction block 4 is rotatably connected to the rotating groove through a rotating column 41. Springs 44 are fixedly connected between the two sides of the friction block 4 and the inner wall of the rotating groove. Etching blocks 43 and brushes 42 are respectively arranged on the two sides of the friction block 4. Grooves are alternately arranged on the etching block 43, which is convenient for the etching block 43 to etch the inner wall of the hole of the circuit board, generating an uneven shape.

[0038] Fix the circuit board on the processing table 1. Start the activity frame 11 so that the injection pipe 32 reaches above the center of the hole of the circuit board. Then start the connecting frame 12 so that the injection pipe 32 moves downward into the hole until the lower end of the sliding plate 35 enters the hole. The connecting frame 12 stops working. At this time, start the electric slider 33 so that the two electric sliders 33 slide from the inside to the outside along the slide rail 34, making the two groups of sliding plates 35 separate from each other and fit the inner wall of the hole of the circuit board. Start the motor 21 so that the rotating shaft 22 drives the movable column 23 to rotate clockwise. The movable column 23 drives the two groups of sliding plates 35 to rotate through the fixed block 3. The friction block 4 deflects in the opposite direction to the rotation direction of the sliding plate 35 under the action of friction, making the brush 42 contact the inner wall of the hole of the circuit board. During the rotation of the brush 42 following the sliding plate 35, the inner wall of the hole of the circuit board is cleaned, effectively removing the impurities on the inner wall of the hole of the circuit board, avoiding the influence of impurities on the subsequent copper deposition step, ensuring the etching effect and the quality of the subsequent process. After the cleaning is completed, control the motor 21 to change the rotation direction so that the sliding plate 35 rotates counterclockwise, and the friction block 4 deflects again, making the etching block 43 contact the inner wall of the hole of the circuit board. During the rotation of the etching block 43 following the sliding plate 35, the inner wall of the hole is etched.

[0039] At the top of the inner wall of the movable column 23, a hydraulic cylinder 24 is fixedly installed. At the bottom of the inner wall of the movable column 23, an extrusion plate 25 is slidably connected. Inside the fixed block 3, a connecting plate 38 is slidably connected. The extrusion plate 25 and the connecting plate 38 are fixedly connected with an extrusion rod, and the extrusion rod is slidably connected with both the movable column 23 and the fixed block 3. Inside the fixed block 3, two communicating grooves 36 are provided. On the mutually remote sides of the two groups of sliding plates 35, communicating blocks are respectively fixedly installed, and the two communicating blocks are respectively slidably connected with the two communicating grooves 36. The inside of the communicating groove 36 is filled with hydraulic oil. At the upper ends of the two communicating grooves 36, push columns 37 are respectively slidably connected. The bottom of the connecting plate 38 is fixedly connected with the tops of the two push columns 37. Inside the fixed block 3, a liquid inlet groove 31 is provided, and the liquid inlet groove 31 communicates with the injection pipe 32. The liquid inlet groove 31 is located below the connecting plate 38. Inside the inner wall of the liquid inlet groove 31, a piston plate 39 is slidably connected. The piston plate 39 and the connecting plate 38 are fixedly connected with a piston rod. On the side wall of the movable column 23, a storage tank 26 is fixedly installed. The storage tank 26 and the fixed block 3 are fixedly connected with a liquid outlet pipe 27, and the liquid outlet pipe 27 communicates with the liquid inlet groove 31. On the side wall of the liquid outlet pipe 27, a check valve I 28 is provided. When the sliding plate 35 moves along with the electric slider 33, it will cause the communicating block to slide into the inside of the communicating groove 36 and squeeze the hydraulic oil inside the communicating groove 36, increasing the internal pressure of the communicating groove 36. Furthermore, it causes the push column 37 to drive the connecting plate 38 and the piston plate 39 to move upward simultaneously, generating negative pressure inside the liquid inlet groove 31, sucking the wax liquid inside the storage tank 26 into the liquid inlet groove 31 through the liquid outlet pipe 27. The connecting plate 38 simultaneously drives the extrusion plate 25 to move synchronously. After the etching work is completed, the hydraulic cylinder 24 is started. The hydraulic cylinder 24 exerts extrusion on the extrusion plate 25, causing the connecting plate 38 to drive the piston plate 39 to slide downward along the inner wall of the liquid inlet groove 31, squeezing the wax liquid inside the liquid inlet groove 31 into the holes through the injection pipe 32. Inside the injection pipe 32, a check valve II is provided to prevent air from entering the liquid inlet groove 31 and the injection pipe 32, ensuring the purity of the wax liquid and the stability of the injection process, and avoiding the influence of air bubbles on the depth control effect. The movement of the sliding plate 35 is linked with the hydraulic system of the communicating groove 36. The suction and extrusion amounts of the wax liquid will be automatically adjusted according to the movement distance of the sliding plate 35, so that the filling amount of the wax liquid inside the liquid inlet groove 31 varies according to the aperture size, ensuring that different diameter holes can obtain corresponding injection amounts when the wax liquid is injected, so that the wax liquid reaches the same horizontal position inside each hole, ensuring that in the subsequent copper deposition process, copper ions can evenly adhere to the inner wall of the holes to the same height, thereby improving the accuracy of the copper deposition process.

[0040] A method for preparing a circuit board, applying the above-mentioned depth-controlled etching hole device for a circuit board, includes the following steps:

[0041] S1. Positioning: Fix the circuit board on the processing table 1. Start the movable frame 11 to adjust the position of the injection tube 32 so that it moves above the hole center of the circuit board. Then start the connecting frame 12 to move the injection tube 32 downward and into the hole of the circuit board until the lower end of the slide plate 35 completely enters the hole interior;

[0042] S2. Preparation: Start the electric slider 33 to make the two groups of electric sliders 33 slide outward along the slide rail 34, driving the two groups of slide plates 35 to separate from each other. When the outer wall of the slide plate 35 is completely attached to the inner wall of the hole of the circuit board, the electric slider 33 stops sliding. At the same time, the connecting block moves synchronously with the slide plate 35 and slides along the inner wall of the communication groove 36, increasing the pressure inside the communication groove 36. The hydraulic oil generates a thrust on the push column 37, pushing the push column 37 to slide upward along the inner wall of the communication groove 36. The push column 37 drives the connecting plate 38 and the piston plate 39 to move synchronously, generating a negative pressure inside the liquid inlet groove 31, and sucking the wax liquid in the storage tank 26 into the liquid inlet groove 31 through the liquid outlet pipe 27;

[0043] S3. Cleaning: Start the motor 21, and the rotating shaft 22 drives the movable column 23 to rotate clockwise. The movable column 23 drives the two groups of slide plates 35 to rotate coaxially through the fixed block 3. When the slide plate 35 rotates, the friction block 4 generates an offset in the opposite direction to the rotation direction of the slide plate 35 under the action of friction, so that the brush 42 contacts the inner wall of the hole to clean the inner wall of the hole;

[0044] S4. Etching: After cleaning, control the motor 21 to change the rotation direction of the output end, so that the slide plate 35 rotates counterclockwise, and the friction block 4 offsets in the opposite direction to the previous offset direction, so that the etching block 43 contacts the inner wall of the hole. The etching block 43 rotates with the slide plate 35 to etch the inner wall of the hole;

[0045] S5. Injection: After etching, start the hydraulic cylinder 24. The hydraulic cylinder 24 applies pressure to the extrusion plate 25. The extrusion plate 25 drives the piston plate 39 to slide downward along the inner wall of the liquid inlet groove 31 through the connecting plate 38, and extrudes the wax liquid in the liquid inlet groove 31 through the injection tube 32 and injects it into the hole interior.

[0046] When the present invention processes the holes of the circuit board, first fix the circuit board on the processing table 1, then start the movable frame 11 so that the injection tube 32 reaches above the center of the hole of the circuit board, and then start the connecting frame 12 so that the injection tube 32 enters the hole of the circuit board until the lower end of the sliding plate 35 enters the inside of the hole of the circuit board. At this time, start the electric slider 33 so that the two electric sliders 33 slide from the inside to the outside along the slide rail 34, and the two sliding plates 35 change from the fitting state to the separated state. When the outer wall of the sliding plate 35 fits with the inner wall of the hole of the circuit board, stop starting the electric slider 33. Then start the motor 21, and the output end of the motor 21 rotates clockwise. The output end of the motor 21 will drive the rotating shaft 22 to move synchronously. The movement of the rotating shaft 22 will drive the movable column 23 to move synchronously. The movement of the movable column 23 will drive the two sliding plates 35 to rotate coaxially through the fixed block 3. The rotation of the sliding plate 35 will drive the friction block 4 to move synchronously through the rotating column 41. Under the action of friction, the friction block 4 will shift in the opposite direction to the rotation direction of the sliding plate 35, so that the brush 42 on the surface of the friction block 4 contacts the inner wall of the hole of the circuit board, so that the brush 42 can clean the inner wall of the hole of the circuit board, avoiding impurities in the hole of the circuit board from affecting the subsequent copper deposition step. After the cleaning is completed, start the motor 21 to rotate counterclockwise, and the sliding plate 35 starts to rotate counterclockwise. At this time, the friction block 4 will shift in the opposite direction to the previous shifting direction, so that the etching block 43 on the surface of the friction block 4 contacts the inner wall of the hole of the circuit board. When the sliding plate 35 rotates at this time, the etching block 43 will etch the inner wall of the hole of the circuit board, so that the inside of the hole of the circuit board has an uneven shape, which is convenient for the attachment of copper ions during the subsequent copper deposition step.

[0047] When the sliding plate 35 is driven by the electric slider 33 to move, the connecting block on the sliding plate 35 will slide along the inner wall of the communication groove 36, increasing the internal pressure of the communication groove 36. Then the hydraulic oil inside the communication groove 36 generates a thrust on the push column 37, so that the push column 37 slides upward along the inner wall of the communication groove 36. The sliding of the push column 37 will drive the connecting plate 38 to move synchronously. The upward movement of the connecting plate 38 will drive the piston plate 39 to move synchronously. The piston plate 39 will generate a negative pressure inside the liquid inlet groove 31, and the negative pressure will suck the wax liquid inside the storage tank 26 into the liquid inlet groove 31 through the liquid outlet pipe 27, so that the wax liquid enters the liquid inlet groove 31. The movement of the connecting plate 38 will also drive the extrusion plate 25 to move synchronously. When the sliding plate 35 stops moving, start the hydraulic cylinder 24, so that the hydraulic cylinder 24 squeezes the extrusion plate 25. The extrusion plate 25 will drive the piston plate 39 to slide along the inner wall of the liquid inlet groove 31 through the connecting plate 38. At this time, the piston plate 39 will extrude the wax liquid in the liquid inlet groove 31 through the injection tube 32, so that the wax liquid enters the inside of the hole until the wax liquid solidifies, completing the depth control step.

[0048] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included within the protection scope of the present invention.

Claims

1. A circuit board controlled hole etching device, characterized in that: The invention comprises a processing table (1), wherein a fixed cylinder (2) is arranged on the processing table (1) through an adjustment component, a fixed block (3) is arranged below the fixed cylinder (2) through a rotation component, an injection tube (32) is fixedly connected to the bottom of the fixed block (3), a liquid inlet groove (31) is arranged inside the fixed block (3), the liquid inlet groove (31) is connected to the injection tube (32), two groups of slide plates (35) are arranged on the outer wall of the injection tube (32), the two groups of slide plates (35) are combined to form a cylindrical shape, two groups of sliding components for driving the two groups of slide plates (35) to move are arranged inside the fixed block (3), a piston component is arranged inside the liquid inlet groove (31), and a pushing component is arranged above the piston component, and the piston component is connected to the slide plate (35) through two groups of hydraulic components.

2. A circuit board hole depth control device according to claim 1, characterized in that: The adjustment assembly comprises a movable frame (11) arranged on a processing table (1), a connecting frame (12) being arranged on the movable frame (11), a connecting block being slidably connected to the connecting frame (12), and the connecting block being fixedly connected to a fixed cylinder (2).

3. A circuit board hole depth control device according to claim 2, characterized in that: The rotating assembly comprises a movable column (23) rotatably connected to the lower end of the fixed cylinder (2); a motor (21) is fixedly mounted on the top of the fixed cylinder (2); a rotating shaft (22) is fixedly connected to the output end of the motor (21); the bottom of the rotating shaft (22) is fixedly connected to the top of the movable column (23); and the fixed block (3) is fixedly mounted on the bottom of the movable column (23).

4. The circuit board hole depth control device according to claim 3, characterized in that: A material storage tank (26) is fixedly mounted on the side wall of the movable column (23); a liquid outlet pipe (27) is fixedly connected between the material storage tank (26) and the fixed block (3); the liquid outlet pipe (27) is communicated with the liquid inlet tank (31); and a one-way valve (28) is provided on the side wall of the liquid outlet pipe (27).

5. The circuit board hole depth control device according to claim 4, characterized in that: The sliding assembly comprises a slide rail (34) fixedly mounted on the inner wall of the fixed block (3); the slide rail (34) is slidably connected to two groups of electric sliders (33); and the two groups of electric sliders (33) are respectively fixedly connected to two groups of slide plates (35).

6. The circuit board hole depth control device according to claim 5, characterized in that: A rotating groove is provided on the side away from each other of the two groups of slide plates (35), and a friction block (4) is rotatably connected in the rotating groove via a rotating column (41). Springs (44) are fixedly connected to the inner wall of the rotating groove on both sides of the friction block (4). An etching block (43) and a brush (42) are provided on both sides of the friction block (4), and grooves are alternately provided on the etching block (43).

7. The circuit board hole depth control device according to claim 6, characterized in that: The two groups of hydraulic components correspond to the two groups of slide plates (35) respectively. The hydraulic components include a connecting groove (36) arranged inside the fixed block (3), and the connecting groove (36) is filled with hydraulic oil. The upper end of the connecting groove (36) is slidably connected to a push column (37), and the end of the connecting groove (36) away from the push column (37) is slidably connected to a connecting block, and the connecting block is fixedly connected to the slide plate (35) on the corresponding side.

8. The circuit board hole depth control device according to claim 7, characterized in that: The piston assembly comprises a piston plate (39) slidably connected to the inner wall of the liquid inlet groove (31); the inner wall of the fixed block (3) is slidably connected to a connecting plate (38); the connecting plate (38) is located above the piston plate (39) and is fixedly connected to a piston column with the piston plate (39); the bottom of the connecting plate (38) is fixedly connected to the top of the push column (37).

9. The circuit board hole depth control device according to claim 8, characterized in that: The pushing assembly comprises a hydraulic cylinder (24) fixedly mounted on the top of the inner wall of the movable column (23); the bottom of the inner wall of the movable column (23) is slidably connected to an extrusion plate (25); the extrusion plate (25) and the connecting plate (38) are fixedly connected to an extrusion rod, and the extrusion rod is slidably connected to both the movable column (23) and the fixed block (3).

10. A method for preparing a circuit board, characterized in that: The device for controlling deep hole etching of a circuit board according to claim 9 comprises the following steps: S1, positioning, fixing the circuit board on the processing table (1), starting the movable frame (11) to adjust the position of the injection tube (32) so that it moves to the center of the hole of the circuit board, and then starting the connecting frame (12) to move the injection tube (32) downward and enter the hole of the circuit board until the lower end of the slide plate (35) completely enters the hole; S2, preparation, start the electric slider (33), make the two groups of electric sliders (33) slide from the inside to the outside along the slide rail (34), drive the two groups of slide plates (35) to separate from each other, when the outer wall of the slide plate (35) is completely in contact with the inner wall of the hole of the circuit board, the electric slider (33) stops sliding, at the same time, the connecting block moves synchronously with the slide plate (35), and slides along the inner wall of the connecting groove (36), so that the internal pressure of the connecting groove (36) increases, the hydraulic oil generates a thrust on the push column (37), and pushes the push column (37) to slide upward along the inner wall of the connecting groove (36), the push column (37) drives the connecting plate (38) and the piston plate (39) to move synchronously, and negative pressure is generated inside the liquid inlet groove (31), and the wax liquid in the storage tank (26) is sucked into the liquid inlet groove (31) through the liquid outlet pipe (27); S3, cleaning, starting the motor (21), the rotating shaft (22) drives the movable column (23) to rotate clockwise, the movable column (23) drives the two sets of slide plates (35) to rotate coaxially through the fixed block (3), when the slide plates (35) rotate, the friction block (4) is deflected in the opposite direction of the rotation direction of the slide plates (35) under the action of friction force, so that the brush (42) contacts the inner wall of the hole, and the inner wall of the hole is cleaned; S4, etching. After the cleaning is completed, the motor (21) is controlled to change the rotation direction of the output end, so that the slide plate (35) rotates counterclockwise, and the friction block (4) is offset in the opposite direction of the previous offset direction, so that the etching block (43) contacts the inner wall of the hole, and the etching block (43) rotates with the slide plate (35) to etch the inner wall of the hole; S5, injection. After the etching is completed, the hydraulic cylinder (24) is started, and the hydraulic cylinder (24) applies pressure to the extrusion plate (25). The extrusion plate (25) drives the piston plate (39) to slide downward along the inner wall of the liquid inlet groove (31) through the connecting plate (38), and the wax liquid in the liquid inlet groove (31) is squeezed out through the injection tube (32) and injected into the hole.

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