Circuit board pressing equipment and multi-chip pressing method

Abstract

The invention discloses circuit board pressing equipment and a multi-chip pressing method.The circuit board pressing equipment comprises an object placing table and a pressing head used for moving towards the object placing table in the y-axis direction, a first chip, a second chip and a third chip can be sequentially stacked on the object placing table, clamping blocks are arranged on the two sides of the pressing head respectively, and the clamping blocks are used for clamping the first chip, the second chip and the third chip. The clamping block can move towards the object placing table in the x-axis direction, and the clamping block can slide relative to the pressing head in the y-axis direction. The clamping block is used for clamping the second chip when the third chip is stacked on the second chip; and after the pressing head extrudes and presses the third chip, the pressing head presses downwards along the y-axis direction relative to the pressing block. According to the circuit board pressing equipment and the multi-chip pressing method, the second chip is clamped through the clamping block, in the multi-chip pressing process, pressure and stress concentration borne by the second chip and the first chip are reduced, deformation and damage of the second chip and the first chip are avoided, the stability of the whole pressing process is improved, and the production efficiency is improved. And each chip is protected.

Description

Technical Field

[0001] The present invention relates to the field of circuit board preparation, and particularly to a circuit board pressing device and a multi-chip pressing method. Background Art

[0002] With the development of electronic devices towards miniaturization and high integration, the technology of pressing multiple chips on a circuit board has gradually become an important manufacturing process. The application of this technology not only improves the space utilization rate of the circuit board, but also significantly enhances the functional density of the electronic device, meeting the high demands of modern consumers for portability and multi-functionality. In this process, multiple chips can be pressed on the same circuit board, adopting different packaging forms and layout designs to optimize performance and reduce power consumption.

[0003] Currently, pressing multiple chips on a circuit board usually requires stacking and pressing multiple chips together. Due to the different materials of each chip, there are significant differences in their physical properties and mechanical performances. During the pressing process of a new chip, the pressure during the pressing of the new chip easily causes the already pressed chips to bear unnecessary stress, resulting in problems such as deformation, cracking, or poor contact, and even leading to the failure of the circuit board function.

[0004] Therefore, a circuit board pressing device and a multi-chip pressing method are proposed to solve the problem that the already pressed chips are easily damaged during the pressing of the new chip. Summary of the Invention

[0005] The purpose of the present invention is to provide a circuit board pressing device and a multi-chip pressing method to solve the problem that the already pressed chips are easily damaged during the pressing of the new chip.

[0006] To achieve this purpose, the present invention adopts the following technical solutions: A circuit board pressing device includes a placement table and a pressing head for moving towards the placement table along the y-axis direction. The first chip, the second chip, and the third chip can be stacked in sequence on the placement table. Clamping blocks are respectively arranged on both sides of the pressing head. The clamping blocks can move towards the placement table along the x-axis direction, and the clamping blocks can slide relative to the pressing head along the y-axis direction; The clamping blocks are used to clamp the second chip when the third chip is stacked on the second chip; after the pressing head presses and combines the third chip, the pressing head presses down along the y-axis direction relative to the pressing block.

[0007] Preferably, a driving component is arranged at the position of the pressing head corresponding to the clamping blocks. The driving component can slide relative to the pressing head between a first position and a second position along the y-axis direction; when the third chip is stacked on the second chip, the driving component is located at the first position; when the pressing head contacts and presses the third chip, the driving component is located at the second position; The driving assembly is connected to the pressing head through an elastic unit, and the elastic unit is used to reset the driving assembly from the second position to the first position; The elastic unit extends along the y-axis direction. The driving assembly includes a motor and a transmission part. The motor is used to drive the clamping block to move towards the placing table along the x-axis direction through the transmission part, and the projection of the motor overlaps with the elastic unit along the z-axis direction.

[0008] Preferably, when the driving assembly is located at the first position and the second position, the horizontal height of the bottom surface of the clamping block is lower than the horizontal height of the bottom surface of the pressing head.

[0009] Preferably, the elastic unit includes a spring and a slider connected in sequence. A chute is formed on the pressing head corresponding to the spring along the y-axis direction, and the spring is arranged in the chute. A connecting rod is arranged in the chute, and the spring is movably sleeved outside the connecting rod. The slider is slidably connected to the chute and sleeved on the connecting rod. After the driving assembly moves, the slider slides on the connecting rod.

[0010] Preferably, the transmission part includes a support frame, a gear, a rack, a rotating shaft and a moving plate. The moving plate abuts against the pressing head and is connected to the slider. The motor, the support frame and the moving plate are connected in sequence along the z-axis direction. The rotating shaft is rotatably connected between the support frame and the moving plate. The gear is arranged outside the rotating shaft. The rack is arranged along the x-axis direction and meshes with the outside of the gear and moves along the x-axis direction. The clamping block is connected to the rack, and the rack is used to drive the clamping block to move towards the placing table along the x-axis direction.

[0011] Preferably, the support frame is a U-shaped seat, and both the gear and the rotating shaft are located inside the support frame. Gaps are respectively formed between the gear and the side surfaces of the moving plate and the support frame. The width of the rack is adapted to the width of the inner cavity of the support frame.

[0012] Preferably, the clamping block is a cuboid with a hollow interior and a missing bottom surface. A cold air delivery pipe is connected to the clamping block, and the cold air delivery pipe is communicated with the inner space of the clamping block. The cold air delivery pipe is used to deliver cold air into the clamping block for clamping the second chip, and the cold air flows towards the placing table.

[0013] Preferably, a clamping area is formed at the part of the clamping block for clamping the side surface of the second chip. After the clamping area abuts against the side surface of the second chip, the clamping block abuts against the second chip. An exhaust hole facing the placing table is formed at the part of the clamping block corresponding to the clamping area. A gas guiding groove is formed along the x-axis direction corresponding to the exhaust hole at the part of the clamping block corresponding to the clamping area. The gas guiding groove is communicated with the inner space of the clamping block through the exhaust hole. When the clamping block clamps the second chip, the cold air is discharged in sequence through the cold air delivery pipe, the inner space of the clamping block, the exhaust hole and the gas guiding groove and flows along the side surface of the second chip.

[0014] A multi-chip pressing method is applied to the circuit board pressing device as described above. The pressing method includes the following steps: Step S1: Input the geometric parameters and material parameters of the first chip, the second chip, and the third chip into the control module. Step S2: After placing the circuit board on the placement table, place the first chip on the circuit board, and the control module commands the air cylinder and the pressing head to press the first chip onto the circuit board. Step S3: Place the second chip on the first chip, and the control module commands the air cylinder and the pressing head to press the second chip onto the first chip. Step S4: Place the third chip on the second chip. The control module commands the clamping block to clamp the second chip through the distance measuring sensor, and commands the air cylinder and the pressing head to press the third chip onto the second chip.

[0015] Compared with the prior art, the present invention has the following beneficial effects: 1. For the circuit board pressing device and the multi-chip pressing method of the present invention, by clamping the second chip with the clamping block, during the multi-chip pressing process, the pressure and stress concentration borne by the second chip and the first chip can be effectively reduced, thereby avoiding the deformation and damage of the second chip and the first chip, improving the stability of the entire pressing process, and effectively protecting the physical integrity of each chip.

[0016] 2. For the circuit board pressing device and the multi-chip pressing method of the present invention, by tightly integrating the clamping block and the driving component on the pressing head, the structure is more compact. Through the cooperation of the air cylinder and the control module, the device realizes efficient motion control, reduces space occupancy, improves the working efficiency of the production line, and simplifies the maintenance and adjustment process.

[0017] 3. For the circuit board pressing device and the multi-chip pressing method of the present invention, through the clamping block, the cold air delivery pipe, the exhaust hole, and the air guiding groove, the chip can be cooled after the pressing process, reducing the chip performance attenuation or failure caused by thermal stress. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0019] The structures, proportions, sizes, etc. shown in the accompanying drawings of this specification are only used to cooperate with the content disclosed in the specification for those skilled in this technology to understand and read, and are not used to limit the conditions for the implementation of the present invention. Therefore, they do not have substantial technical significance. Any modification of the structure, change in the proportional relationship, or adjustment of the size, without affecting the effects that the present invention can produce and the purposes that can be achieved, should still fall within the scope covered by the technical content disclosed in the present invention.

[0020] Figure 1 is a schematic diagram of the overall structure of the present invention; Figure 2 is a schematic diagram of the internal structure of the body in the present invention; Figure 3 is a top view structural schematic diagram of the pressing head in the present invention; Figure 4 is a connection structural schematic diagram of the pressing head and the moving plate in the present invention; Figure 5 is a disassembled structural schematic diagram of the pressing head and the moving plate in the present invention; Figure 6 is a disassembled structural schematic diagram of the support frame and the moving plate in the present invention; Figure 7 is a sectional structural schematic diagram of the support frame in the present invention; Figure 8 is a connection structural schematic diagram of the clamping block and the cold air delivery pipe in the present invention; Figure 9 is a connection structural schematic diagram of the clamping block and the exhaust hole in the present invention.

[0021] Illustration: 1. Frame; 11. Cylinder; 12. Control module; 2. Placing table; 3. Pressing head; 31. Distance measuring sensor; 32. Driving assembly; 321. Support frame; 322. Motor; 323. Rotating shaft; 324. Gear; 325. Rack; 326. Groove; 327. Moving plate; 33. Clamping block; 331. Cold air delivery pipe; 332. Exhaust hole; 333. Air guiding groove; 334. Clamping area; 34. Spring; 35. Sliding groove; 36. Slider; 37. Connecting rod. Detailed implementation manners

[0022] To make the invention purposes, features, and advantages of the present invention more obvious and understandable, the following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the following described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present invention.

[0023] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the present invention. It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be intermediate components present.

[0024] Embodiment 1: Please refer to Figures 1-9 , a circuit board pressing device in this embodiment includes a placement table 2 and a pressing head 3 for moving towards the placement table 2 along the y-axis direction. The first chip, the second chip, and the third chip can be stacked in sequence on the placement table 2. Clamping blocks 33 are respectively arranged on both sides of the pressing head 3. The clamping blocks 33 can move towards the placement table 2 along the x-axis direction, and the clamping blocks 33 can slide relative to the pressing head 3 along the y-axis direction; The clamping block 33 is used to clamp the second chip when the third chip is stacked on the second chip; after the pressing head 3 presses and clamps the third chip, the pressing head 3 presses down along the y-axis direction relative to the pressing block.

[0025] During application, after placing the circuit board on the placement table 2, then place the first chip on the circuit board. At this time, the pressing head 3 can be moved to drive it towards the circuit board to press and bond the first chip on the circuit board. After the first chip is pressed and bonded, reset the pressing head 3, place the second chip on the first chip, and press and bond the second chip on the first chip according to the steps of pressing and bonding the first chip on the circuit board. Subsequently, place the third chip on the second chip, and make the pressing head 3 move towards the circuit board again. After the pressing head 3 moves to the horizontal height of the bottom surface of the clamping block 33 being flush with the horizontal height of the bottom surface of the second chip, the clamping block 33 then moves towards the second chip on the placement table 2 along the x-axis direction to clamp the second chip. When the second chip is clamped, the pressing head 3 continues to move. When the third chip is pressed and bonded on the second chip, the clamping block 33 will also move relative to the pressing head 3 along the y-axis direction; when the pressing head 3 presses and bonds the third chip, the second chip is clamped laterally by the clamping block 33, which can disperse the pressure exerted by the pressing head 3 on the second chip, reduce the concentrated stress borne by the second chip, avoid excessive bending or deformation of the second chip during pressing, and further reduce the stress borne by the first chip and the risk of its damage.

[0026] It should be noted that by laminating and pressing multiple chips in the above manner, the first chip and the second chip can be effectively protected. During the pressing process, the second chip is laterally clamped by the clamping block 33, providing additional mechanical support for the second chip to reduce local deformation or stress concentration generated during the pressing process, and dispersing the pressure acting on the second chip, thus avoiding damage to the first chip and the second chip caused by the pressure for adapting to the third chip.

[0027] It can be known that due to the different material parameters of the chips to be laminated and pressed, parameters such as the thermal expansion coefficient, conductivity, and mechanical strength of different chips may not be the same. When pressing the third chip on the second chip, it is necessary to avoid damage to the first chip and the second chip caused by the pressure during the pressing of the third chip.

[0028] In addition, the first chip, the second chip, and the third chip to be laminated and pressed have the same size, and the first chip, the second chip, and the third chip are pressed in sequence from bottom to top. After the second chip is clamped by the clamping block 33, it will not affect the normal pressing operation of the third chip.

[0029] It should also be noted that the clamping block 33 for clamping is arranged on the pressing head 3, enabling the clamping block 33 to run synchronously with the pressing head 3, making the structure of the pressing device more compact.

[0030] In a specific embodiment, please refer to Figures 2-3 , in this embodiment, a frame 1 is provided corresponding to the pressing head 3, and the placing tray is arranged on the frame 1. A cylinder 11 is arranged on the frame 1, the output shaft of the cylinder 11 is connected to the pressing head 3, a distance measuring sensor 31 is arranged on the pressing head 3, and a control module 12 is arranged on the frame 1. The control module 12 is respectively in signal connection with the cylinder 11, the driving component 32, and the distance measuring sensor 31.

[0031] It can be known that the cylinder 11, as a driving component, can drive the pressing head 3 to move along the Y-axis direction in the frame 1 to press the chip, and the cylinder 11 is controlled by the control module 12 to operate; in the specific operation process, the control module 12 controls the operation of the cylinder 11, and the pressing head 3 and the clamping block 33 move accordingly. When the distance measuring sensor 31 detects that the distance between the pressing head 3 and the third chip satisfies the condition for the clamping block 33 to clamp the second chip, the clamping block 33 can clamp the second chip to realize the side clamping of the second chip. After the side clamping is completed, the pressing head 3 continues to move to start pressing the third chip; the working principles and operation methods of the pressing head 3, the control module 12, and the distance measuring sensor 31 are well known to those skilled in the art, and will not be described in this embodiment. When the horizontal height of the bottom surface of the clamping block 33 is flush with the horizontal height of the bottom surface of the second chip, the distance between the pressing head 3 and the third chip can be obtained in advance according to the sizes of the first chip, the second chip, and the third chip. The sizes of the first chip, the second chip, and the third chip can be measured by a measuring instrument before the pressing operation, and will not be described in this embodiment either.

[0032] Specifically, please refer to Figure 4 , the number of the clamping blocks 33 is four. The four clamping blocks 33 are distributed in a rectangle. The four clamping blocks 33 are divided into two groups, and the two groups of clamping blocks 33 are respectively distributed on the two side surfaces of the pressing head 3 in the Z-axis direction.

[0033] It should be noted that the four clamping blocks 33 are divided into two groups to clamp the side surface of the second chip, which can effectively provide additional mechanical support for the second chip, and each clamping block 33 operates independently. In the actual application process, the clamping block 33 can easily adapt to the size of the chip to be pressed; in addition, since the size of the third chip to be pressed is the same as that of the second chip, after the clamping block 33 clamps the second chip, because the third chip is located on the second chip, the clamping block 33 can also limit the position of the third chip to avoid the displacement of the third chip during pressing, thereby improving the pressing effect.

[0034] Furthermore, please refer to Figures 4-7 , a driving component 32 is arranged at the position of the pressing head 3 corresponding to the clamping block 33. The driving component 32 can slide relative to the pressing head 3 between a first position and a second position along the y-axis direction; when the third chip is stacked on the second chip, the driving component 32 is located at the first position; when the pressing head 3 contacts and presses the third chip, the driving component 32 is located at the second position; The driving component 32 is connected to the pressing head 3 through an elastic unit, and the elastic unit is used to reset the driving component 32 from the second position to the first position; The elastic unit extends along the y-axis direction. The driving component 32 includes a motor 322 and a transmission part. The motor 322 is used to drive the clamping block 33 to move along the x-axis direction towards the placing table 2 through the transmission part. The projection of the motor 322 overlaps with the elastic unit along the z-axis direction.

[0035] During application, after the clamping block 33 moves to a position where it can clamp the second chip, the control module 12 controls the motor 322 in the driving component 32 to operate, and drives the transmission part through the motor 322 to make the clamping block 33 move along the x-axis direction towards the second chip. After the clamping block 33 moves to abut against the second chip, the clamping block 33 can clamp the second chip. After completing the clamping of the second chip, the pressing head 3 continues to move towards the third chip under the push of the air cylinder 11. At this time, when the pressing head 3 moves, the driving component 32 will move relative to the pressing head 3 along the y-axis direction through the elastic unit and move from the first position to the second position. When the pressing head 3 completes the pressing of the third chip, the air cylinder 11 makes the pressing head 3 reset, and the driving component 32 will also reset synchronously under the action of the elastic unit and move from the second position to the first position.

[0036] Specifically, when the driving component 32 is located at the first position and the second position, the horizontal height of the bottom surface of the clamping block 33 is lower than the horizontal height of the bottom surface of the pressing head 3, and the distance between the bottom surface of the clamping block 33 and the bottom surface of the pressing head 3 when the driving component 32 is located at the first position is greater than the distance between the bottom surface of the clamping block 33 and the bottom surface of the pressing head 3 when the driving component 32 is located at the second position.

[0037] It can be known that after the clamping block 33 clamps the second chip, when the pressing head 3 continues to move, it will exert an extrusion force on the elastic unit, causing the elastic unit to deform. After the pressing head 3 resets, the extrusion force exerted by the pressing head 3 on the elastic unit disappears, and the elastic unit resets under the action of its elastic force, which can drive the driving component 32 and the clamping block 33 to reset.

[0038] In addition, one driving component 32 corresponds to one clamping block 33, and each driving component 32 is independently controlled by the control module 12 to realize the synchronous or independent actions of multiple clamping blocks 33, improving flexibility and enabling precise adjustment of the actions of each clamping block 33 when pressing multiple chips, ensuring that each chip can be properly clamped during the pressing process.

[0039] Furthermore, please refer to Figure 5 , the elastic unit includes a spring 34 and a slider 36 connected in sequence. A chute 35 is opened on the pressing head 3 along the y-axis direction corresponding to the spring 34, and the spring 34 is arranged in the chute 35. A connecting rod 37 is arranged in the chute 35, and the spring 34 is movably sleeved outside the connecting rod 37. The slider 36 is slidably connected to the chute 35 and sleeved on the connecting rod 37. After the driving component 32 moves, the slider 36 slides on the connecting rod 37.

[0040] During application, after the driving component 32 moves relative to the pressing head 3, the driving component 32 causes the slider 36 to move on the connecting rod 37 within the sliding groove 35. After the slider 36 moves, it also squeezes the spring 34 to deform the spring 34. After the pressing head 3 resets, the squeezing force applied to the spring 34 by the pressing head 3 through the driving component 32 and the slider 36 disappears, and the spring 34 deforms and resets. Under the action of the elastic force of the spring 34, the slider 36 can quickly reset the driving component 32 and the clamping block 33. Moreover, when the slider 36 moves, under the action of the connecting rod 37, its stability during movement can be further ensured, thereby further improving the stability of the driving component 32 and the clamping block 33 during movement.

[0041] It can be known that the size of the slider 36 is adapted to the size of the inner cavity of the sliding groove 35, and a through hole is correspondingly provided on the slider 36 for the connecting rod 37, and the slider 36 is connected to the connecting rod 37 through the through hole.

[0042] It should be noted that the spring 34 can reduce the impact force received by the slider 36 during reset, thereby weakening the influence of the impact force on the driving component 32 to ensure the stability of each structure of the driving component 32 and make the driving component 32 more accurate when driving the clamping block 33 to move.

[0043] Furthermore, please refer to Figures 6-7 , the transmission part includes a support frame 321, a gear 324, a rack 325, a rotating shaft 323 and a moving plate 327. The moving plate 327 abuts against the pressing head 3 and is connected to the slider 36. The motor 322, the support frame 321 and the moving plate 327 are sequentially connected along the z-axis direction. The rotating shaft 323 is rotatably connected between the support frame 321 and the moving plate 327. The gear 324 is arranged outside the rotating shaft 323. The rack 325 is arranged along the x-axis direction and meshes with the outside of the gear 324 and moves along the x-axis direction. The clamping block 33 is connected to the rack 325, and the rack 325 is used to drive the clamping block 33 to move along the x-axis direction towards the placement table 2.

[0044] During application, when the clamping block 33 needs to clamp the second chip, the control module 12 makes the motor 322 operate. After the motor 322 operates, it causes the gear 324 to rotate through the rotating shaft 323. When the gear 324 rotates, it drives the engaged rack 325 to move within the support frame 321, so that the moving rack 325 drives the clamping block 33 to move towards the second chip, and the clamping block 33 clamps the second chip. After the clamping block 33 completes the clamping of the second chip, the pressing head 3 continues to move, and the moving plate 327 moves relative to it on the side of the pressing head 3 and squeezes the spring 34 through the slider 36 during the movement.

[0045] It should also be noted that the motor 322, as the driving source for the movement of the clamping block 33, can quickly respond to the instructions of the control module 12. The motor 322 drives the clamping block 33 through the gear 324 and the rack 325, which can make the structure of the driving component 32 more compact in the z-axis direction. The setting of the gear 324 can also increase the output torque, enabling the clamping block 33 to withstand a greater clamping force. At the same time, by setting gears 324 of different sizes, the motor 322 can still generate sufficient clamping force at a lower rotational speed.

[0046] For more details, please refer to Figure 6 , the support frame 321 is a U-shaped seat, and both the gear 324 and the rotating shaft 323 are located inside the support frame 321. There are gaps formed between the gear 324 and the side surfaces of the moving plate 327 and the support frame 321 respectively. The width of the rack 325 is adapted to the width of the inner cavity of the support frame 321.

[0047] It can be known that the support frame 321, as the support for the gear 324 and the rack 325, can provide a stable operating environment for the two. Under the action of the gap, the rotating gear 324 can avoid generating unnecessary frictional force, thereby reducing the unnecessary power drive generated by the motor 322, and the gear 324 rotates more smoothly. At the same time, the width of the inner cavity of the support frame 321 matches the width of the rack 325, which can effectively limit the movement trajectory of the rack 325, making the clamping block 33 move more stably and smoothly.

[0048] In a specific embodiment, please refer to Figure 7 , in this embodiment, the rack 325 is located below the gear 324, and a groove 326 is formed on the inner bottom wall of the support frame 321, and the rack 325 slides in the groove 326.

[0049] It should be known that through the sliding mode of the rack 325 in the groove 326, the stability of the clamping block 33 during the movement process is enhanced, effectively reducing the lateral shaking of the clamping block 33, enabling the clamping block 33 to be more stable during the movement and clamping processes, thereby improving the reliability of the entire pressing process.

[0050] Furthermore, please refer to Figures 8-9 , the clamping block 33 is a cuboid with a hollow interior and a missing bottom surface. A cold air delivery pipe 331 is connected to the clamping block 33, and the cold air delivery pipe 331 is connected to the internal space of the clamping block 33. The cold air delivery pipe 331 is used to deliver cold air into the clamping block 33 for clamping the second chip, and the cold air flows towards the placing table 2.

[0051] During application, when the clamping block 33 clamps the second chip, after the third chip completes hot pressing, cold air can be input into the clamping block 33 through the cold air delivery pipe 331. After the cold air enters the clamping block 33, the cold air will discharge along the inner wall of the clamping block 33. After the cold air contacts the second chip and the third chip, it will cool down the second chip and the third chip, thereby reducing the thermal stress generated during the pressing process of the second chip and the third chip and preventing performance attenuation or failure caused by overheating.

[0052] It should be noted that after the cold air is discharged from the cold air delivery pipe 331 and the clamping block 33, the cold air flowing in the direction of the placement tray along the y-axis direction can not only cool down through air circulation and heat absorption, but also cool down the second chip and the third chip by reducing the temperature of the clamping block 33, effectively improving the cooling rate.

[0053] Furthermore, a clamping area 334 is formed at the position of the clamping block 33 for clamping the side of the second chip. After the clamping area 334 abuts against the side of the second chip, the clamping block 33 abuts against the second chip. An exhaust hole 332 facing the placement table 2 is opened at the position of the clamping block 33 corresponding to the clamping area 334. A gas guide groove 333 is opened along the x-axis direction corresponding to the exhaust hole 332 at the position of the clamping block 33 corresponding to the clamping area 334. The gas guide groove 333 is communicated with the internal space of the clamping block 33 through the exhaust hole 332. When the clamping block 33 clamps the second chip, the cold air is discharged in sequence through the cold air delivery pipe 331, the internal space of the clamping block 33, the exhaust hole 332 and the gas guide groove 333, and flows along the side of the second chip.

[0054] It should be noted that during the discharge of the cold air, the cold air can also be discharged from the exhaust hole 332, and under the guidance of the gas guide groove 333, the cold air flow is directed to the sides of the second chip and the third chip, so that each part of the second chip and the third chip can be cooled synchronously, reducing the thermal stress caused by temperature difference and further weakening the influence of thermal stress on the second chip and the third chip.

[0055] It can be understood that when the cold air flows along the sides of the second chip and the third chip, the cold air can flow along the z-axis direction. At this time, the flowing cold air can contact different parts of the second chip and the third chip, enabling these parts to be cooled in the first time, realizing uniform cooling of the second chip and the third chip to avoid the situation of temperature difference caused by uneven cooling.

[0056] Embodiment 2: A multi-chip pressing method in this embodiment is applied to the circuit board pressing equipment as in Embodiment 1. The pressing method includes the following steps: Step S1: Input the geometric parameters and material parameters of the first chip, the second chip, and the third chip into the control module 12; Step S1 specifically includes: Step S11: The control module 12 establishes a finite element model of the geometric and material parameters of the first chip, the second chip, and the third chip, and simulates parameters such as the pressure required when the chips are laminated and pressed together. Step S12: Obtain the distance d between the pressing head 3 and the second chip when the second chip contacts the clamping block 33 during the simulation process.

[0057] It should be noted that the finite element model is established by simulating according to the geometric and material parameters of each first chip, second chip, and third chip, as well as the environmental parameters. The establishment process and operating principle of the finite element are well-known to those skilled in the art, and will not be described in this embodiment.

[0058] Step S2: After placing the circuit board on the placement table 2, place the first chip on the circuit board, and the control module 12 commands the air cylinder 11 and the pressing head 3 to press the first chip onto the circuit board. Step S3: Place the second chip on the first chip, and the control module 12 commands the air cylinder 11 and the pressing head 3 to press the second chip onto the first chip. Step S4: Place the third chip on the second chip. The control module 12 commands the clamping block 33 to clamp the second chip through the distance measuring sensor 31, and commands the air cylinder 11 and the pressing head 3 to press the third chip onto the second chip.

[0059] Step S4 specifically includes: Step 41: The air cylinder operates to move the pressing head 3 towards the third chip, and during the movement, the distance measuring sensor 31 continuously measures the distance between the pressing head 3 and the third chip. Step 42: After the distance measuring sensor 31 measures that the distance between the pressing head 3 and the third chip is equal to the distance d, the distance measuring sensor 31 sends a signal to the control module 12. Step 43: After the control module 12 receives the signal sent by the distance measuring sensor 31, it commands the driving component 32 to drive the clamping block 33 to move, so that the clamping block 33 clamps the second chip. Step 44: The air cylinder 11 commands the pressing head 3 to continue moving, so that the pressing head 3 contacts the third chip, and presses the third chip onto the second chip with the pressure simulated by the finite element model.

[0060] It should also be noted that according to the finite element model, when the distance between the pressing head 3 and the third chip is d, the bottom surface of the clamping block 33 is flush with the second chip.

[0061] As described above, the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the various embodiments of the present invention.

Claims

1. A circuit board pressing device, characterized in that: It comprises a storage platform (2) and a pressing head (3) for moving toward the storage platform (2) along the y-axis direction, wherein a first chip, a second chip and a third chip can be stacked in sequence on the storage platform (2), and clamping blocks (33) are respectively arranged on both sides of the pressing head (3), wherein the clamping blocks (33) can move toward the storage platform (2) along the x-axis direction, and the clamping blocks (33) can slide relative to the pressing head (3) along the y-axis direction; The clamping block (33) is used to clamp the second chip when the third chip is stacked on the second chip; after the pressing head (3) presses and presses the third chip, the pressing head (3) is pressed downward along the y-axis direction relative to the pressing block.

2. The circuit board pressing device according to claim 1, characterized in that: A driving component (32) is provided at a position on the pressing head (3) corresponding to the clamping block (33), and the driving component (32) can slide relative to the pressing head (3) along the y-axis direction between a first position and a second position; when the third chip is stacked with the second chip, the driving component (32) is located at the first position; when the pressing head (3) contacts and presses the third chip, the driving component (32) is located at the second position; The driving component (32) is connected to the pressing head (3) via an elastic unit, and the elastic unit is used to reset the driving component (32) from the second position to the first position; The elastic unit is extended along the y-axis direction, the driving assembly (32) comprises a motor (322) and a transmission part, the motor (322) is used to drive the clamping block (33) to move along the x-axis direction toward the storage platform (2) through the transmission part, and the projection of the motor (322) overlaps with the elastic unit along the z-axis direction.

3. The circuit board pressing device according to claim 2, characterized in that: When the driving assembly (32) is located at the first position and the second position, the horizontal height of the bottom surface of the clamping block (33) is lower than the horizontal height of the bottom surface of the pressing head (3).

4. The circuit board pressing device according to claim 2, characterized in that: The elastic unit comprises a spring (34) and a slider (36) connected in sequence; a slide groove (35) is provided on the pressing head (3) corresponding to the spring (34) along the y-axis direction, and the spring (34) is arranged in the slide groove (35); a connecting rod (37) is arranged in the slide groove (35), and the spring (34) is movably sleeved on the outside of the connecting rod (37); the slider (36) is slidably connected to the slide groove (35) and sleeved on the connecting rod (37); after the driving component (32) moves, the slider (36) slides on the connecting rod (37).

5. The circuit board pressing device according to claim 2, characterized in that: The transmission part comprises a support frame (321), a gear (324), a rack (325), a rotating shaft (323) and a movable plate (327); the movable plate (327) is in contact with the pressing head (3) and is connected to the slider (36); the motor (322), the support frame (321) and the movable plate (327) are connected in sequence along the z-axis direction; the rotating shaft (323) is rotatably connected between the support frame (321) and the movable plate (327); the gear (324) is arranged on the outside of the rotating shaft (323); the rack (325) is arranged along the x-axis direction and meshes with the outside of the gear (324) and moves along the x-axis direction; the clamping block (33) is connected to the rack (325); the rack (325) is used to drive the clamping block (33) to move along the x-axis direction toward the storage table (2).

6. The circuit board pressing device according to claim 5, characterized in that: The support frame (321) is a U-shaped seat, and the gear (324) and the rotating shaft (323) are both located in the support frame (321). The gear (324) forms gaps corresponding to the sides of the movable plate (327) and the support frame (321), and the width of the rack (325) is adapted to the width of the inner cavity of the support frame (321).

7. The circuit board pressing device according to claim 1, characterized in that: The clamping block (33) is a rectangular parallelepiped with a hollow interior and a missing bottom surface. The clamping block (33) is connected to a cold air delivery pipe (331), and the cold air delivery pipe (331) is connected to the internal space of the clamping block (33). The cold air delivery pipe (331) is used to deliver cold air into the clamping block (33) that clamps the second chip, and the cold air flows toward the storage table (2).

8. The circuit board pressing device according to claim 7, characterized in that: A clamping area (334) is formed at a portion of the clamping block (33) used to clamp the side surface of the second chip. After the clamping area (334) abuts against the side surface of the second chip, the clamping block (33) abuts against the second chip. An exhaust hole (332) facing the storage platform (2) is provided at a portion of the clamping block (33) corresponding to the clamping area (334). An air guide groove (333) is provided along the x-axis direction at a portion of the clamping block (33) corresponding to the exhaust hole (332). The air guide groove (333) is connected to the internal space of the clamping block (33) through the exhaust hole (332). When the clamping block (33) clamps the second chip, cold air is discharged in sequence through the cold air delivery pipe (331), the internal space of the clamping block (33), the exhaust hole (332) and the air guide groove (333), and flows along the side surface of the second chip.

9. A multi-chip pressing method, characterized in that: Applied to the circuit board pressing device according to any one of claims 1 to 8, the pressing method comprises the following steps: Step S1, inputting geometric parameters and material parameters of the first chip, the second chip, and the third chip into a control module; Step S2, after placing the circuit board on the storage table, the first chip is placed on the circuit board, and the control module controls the cylinder and the pressing head to press the first chip onto the circuit board; Step S3, placing the second chip on the first chip, and the control module instructs the cylinder and the pressing head to press the second chip onto the first chip; Step S4, placing the third chip on the second chip, the control module controls the clamping block to clamp the second chip through the distance measuring sensor, and controls the cylinder and the pressing head to press the third chip on the second chip.

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