Temperature control device

Abstract

The invention provides a temperature control device, which can accurately indicate the temperature of a temperature adjusting module by setting a temperature measuring part and a wiring to be equal to the temperature of the temperature adjusting module, and can realize high-precision temperature control. A temperature control device (1) provided with a temperature control module (2) capable of accommodating a sample and / or a reagent, and a temperature control unit (3) for controlling the temperature of the temperature control module (2), the temperature control device (1) comprising: a first opening (8) formed in the temperature control module (2); and a pressing part (7) for inserting a temperature sensor (4) having a temperature measurement part (4a) and a wiring (4b) into the first opening (8) such that the temperature measurement part (4a) abuts against the temperature adjustment module (2), and pressing the temperature measurement part (4a) and the wiring (4b) against the inner wall surface of the first opening (8) by means of the pressing part (7).

Description

Technical Field

[0001] The present invention relates to a temperature control device for a gene inspection device, an automatic analysis device, and the like. Background Art

[0002] In a gene inspection device, DNA (Deoxyribonucleic acid) contained in a sample is amplified and detected. Here, as a method for amplifying DNA, the PCR (Polymerase Chain Reaction) method is widely used. In the PCR method, a sample solution containing DNA and a solution containing a reagent for amplifying DNA are mixed, and for example, denatured into single strands at 94°C and complementary strands are synthesized at 60°C. By repeating these temperature changes, DNA can be amplified exponentially. On the other hand, in such a temperature cycle, time is required for temperature changes such as cooling from 94°C to 60°C and heating from 60°C to 94°C, so there is a problem that the temperature cycle takes time, and in order to shorten the inspection time, high-speed temperature change is required.

[0003] In order to make the temperature adjustment high-speed, by increasing the heat absorption and heat dissipation in the temperature control device, or by miniaturizing the temperature adjustment module to be the temperature control object and reducing the heat capacity, the temperature change can be made high-speed. In either method, high-precision temperature control is required, but especially in the case of miniaturizing the temperature adjustment module, the temperature sensor also needs to be miniaturized at the same time. Moreover, in the case of miniaturizing the temperature adjustment module and the temperature sensor, it is difficult to closely contact and fix the temperature sensor to the temperature adjustment module. If a gap is generated between the temperature sensor and the temperature adjustment module and the contact thermal resistance increases, the indicated temperature of the temperature sensor is lower than the actual temperature of the temperature adjustment module, so there is a problem that it is difficult to perform high-precision temperature control.

[0004] Regarding these problems, a structure for fixing a temperature sensor to a control object has been studied. For example, in Patent Document 1, a thermistor mounting structure is disclosed, which is characterized in that the front end of a pressing portion abuts against the side surface of a thermistor inserted into the inside of a temperature sensing cylinder, and the angle formed by the side surface on the cylinder insertion end side of the thermistor and the pressing portion is an acute angle.

[0005] In addition, as a structure having a dedicated fixing member, Patent Document 2 describes the following: a sensor holding portion that is in substantial overall contact with a detection portion of a temperature sensor is formed, and a mounting portion that is integrally formed with the sensor holding portion and is detachable from a tube is formed, and the mounting portion has a double structure with a gap.

[0006] Prior Art Documents

[0007] Patent Documents

[0008] Patent Document 1: Japanese Patent Application Laid-Open No. 2015-152298

[0009] Patent Document 2: Japanese Patent Application Laid-Open No. 2003-75031 SUMMARY OF THE INVENTION

[0010] Problems to be Solved by the Invention

[0011] In Patent Document 1, the temperature measuring portion of the thermistor is inserted into the opening portion, and further, the thermistor mounting structure for fixing the temperature measuring portion is inserted into the opening portion.

[0012] However, a structure is formed in which only the temperature measuring portion of the thermistor is pressed against the inner wall surface, and the wiring connected to the temperature measuring portion does not come into contact with the temperature measurement object. Therefore, the wiring is not the temperature of the measurement object but is equal to the temperature of the surrounding air. As a result, the temperature of the temperature measuring portion changes due to the temperature difference between the temperature measuring portion and the wiring, and a problem occurs in that the temperature of the temperature measuring portion is different from the actual temperature of the measurement object.

[0013] In addition, in Patent Document 2, a sensor holding portion that comes into contact with the detection portion of the temperature sensor is provided and fixed to the temperature measuring portion that is the measurement object. Thus, the temperature sensor can be detachably fixed to the temperature measuring portion. On the other hand, since the temperature of the measurement surface is measured, a temperature difference from the temperature inside the control object is generated. For example, when measuring the temperature of a control object higher than room temperature, there is a problem that the sensor indication value indicates a value lower than the temperature inside the control object. In addition, as in Patent Document 1, since the wiring of the temperature sensor is not fixed to the measurement object, there is a problem that the temperature measuring portion cannot correctly output the temperature of the measurement object due to the temperature difference between the temperature measuring portion and the wiring.

[0014] Therefore, the present invention provides a temperature control device that can accurately indicate the temperature of the temperature control module by setting the temperature measuring portion and the wiring to the same temperature as the temperature control module, and can achieve high-precision temperature control.

[0015] Means for Solving the Problems

[0016] To solve the above problems, a temperature control device of the present invention includes: a temperature control module that can accommodate a sample and / or a reagent; and a temperature control unit that controls the temperature of the temperature control module. The temperature control device is characterized in that it has: a first opening portion formed in the temperature control module; and a pressing portion that inserts a temperature sensor having a temperature measuring portion and a wiring into the first opening portion in such a manner that the temperature measuring portion abuts against the temperature control module, and presses the temperature measuring portion and the wiring against the inner wall surface of the first opening portion by the pressing portion.

[0017] Advantages of the Invention

[0018] According to the present invention, a temperature control device can be provided, which can accurately indicate the temperature of the temperature adjustment module by setting the temperature measurement part and the wiring to the same temperature as the temperature adjustment module, and can achieve high-precision temperature control.

[0019] Problems, structures, and effects other than those described above will be clarified by the following description of the embodiments. Description of the Drawings

[0020] Figure 1 It is a schematic perspective view of the temperature control device according to Embodiment 1 of the present invention.

[0021] Figure 2 It is a component of Figure 1 A schematic cross-sectional view taken along line A-A' of the temperature adjustment module of the temperature control device shown.

[0022] Figure 3 It is a component of Figure 1 A schematic cross-sectional view taken along line B-B' of the temperature adjustment module of the temperature control device shown.

[0023] Figure 4 It is Figure 1 A schematic cross-sectional view taken along line B-B' of the temperature adjustment module shown, which is a view showing a case where one surface of the pressing part constituting the temperature control device is a plane.

[0024] Figure 5 It is Figure 1 A schematic cross-sectional view taken along line B-B' of the temperature adjustment module shown, which is a view showing a case where the cross-section of the pressing part constituting the temperature control device is a polygon.

[0025] Figure 6 It is a schematic cross-sectional view of the temperature adjustment module of the temperature control device according to Embodiment 2 of the present invention.

[0026] Figure 7 It is a schematic cross-sectional view of the temperature adjustment module of the temperature control device according to Embodiment 3 of the present invention.

[0027] Figure 8 It is a schematic cross-sectional view of the temperature adjustment module of the temperature control device according to Embodiment 4 of the present invention.

[0028] Figure 9 It is a schematic cross-sectional view of the temperature adjustment module of the temperature control device according to Embodiment 5 of the present invention.

[0029] Figure 10 It is a schematic cross-sectional view of the temperature adjustment module of the temperature control device according to Embodiment 6 of the present invention, which is a view corresponding to Figure 1 The cross-section taken along line B-B'.

[0030] Figure 11It is a schematic cross-sectional view of the temperature adjustment module of the temperature control device according to Embodiment 6 of the present invention, corresponding to Figure 1 the cross-sectional view taken along line A-A' of Detailed Description of the Invention

[0031] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0032] Embodiment 1

[0033] Figure 1 It is a schematic perspective view of the temperature control device according to Embodiment 1 of the present invention. As Figure 1 shown, the temperature control device 1 is composed of a temperature adjustment module 2, a temperature control unit 3, a temperature sensor 4, a heat dissipation unit 6, a first opening 8 formed in the temperature adjustment module 2 for inserting the temperature sensor 4, and a pressing unit 7 for inserting the temperature sensor 4 into the aforementioned first opening 8 to be described later. The temperature adjustment module 2 is composed of, for example, a cylindrical part (hollow part) and a flat plate part, and can accommodate samples and / or reagents. In addition, the shape of the temperature adjustment module 2 is not limited to this, as long as it can accommodate samples and / or reagents and can be temperature-controlled by the temperature control unit 3. Further, the temperature sensor 4 is composed of a temperature measurement part 4a and a wiring 4b. One end of the wiring 4b is connected to the temperature measurement part 4a, and the other end is connected to a data recorder or a data acquisition device (not shown).

[0034] Figure 2 It is a schematic cross-sectional view taken along line A-A' of the temperature adjustment module that constitutes Figure 1 the temperature control device 1 shown in Figure 3 It is a schematic cross-sectional view taken along line B-B' of the temperature adjustment module that constitutes Figure 1 the temperature control device shown in Figure 4 It is Figure 1 a schematic cross-sectional view taken along line B-B' of the temperature adjustment module shown in, showing the case where one surface of the pressing unit that constitutes the temperature control device 1 is a flat surface, Figure 5 It is Figure 1 a schematic cross-sectional view taken along line B-B' of the temperature adjustment module shown in, showing the case where the cross-section of the pressing unit 7 that constitutes the temperature control device is a polygon. As Figures 2 to 5 shown, a first opening 8 is provided in the temperature adjustment module 2, and the temperature sensor 4 is inserted into the inside of the first opening 8. At this time, the temperature measurement part 4a that constitutes the temperature sensor 4 is pressed by the pressing unit 7 against the inner wall surface of the first opening 8, and the front end of the temperature measurement part 4a abuts against the temperature adjustment module 2. Further, the wiring 4b that constitutes the temperature sensor 4 is Figure 2 pressed by the side surface of the pressing unit 7 shown in against the inner wall surface of the first opening 8. Here, the temperature adjustment module 2 is formed of a material having a high thermal conductivity, such as aluminum or copper.

[0035] According to this embodiment, the temperature measurement part 4a that constitutes the temperature sensor 4 is pressed against the inner wall surface of the first opening 8 and contacts the temperature adjustment module 2. As a result, the contact thermal resistance between the temperature adjustment module 2 and the temperature measurement part 4a is reduced, and the temperature of the temperature adjustment module 2 can be detected with high precision. Furthermore, the wiring 4b that constitutes the temperature sensor 4 is pressed against the inner wall surface of the first opening 8 by the pressing part 7 and contacts the temperature adjustment module 2. Thus, the temperature of the wiring 4b is also equal to that of the temperature adjustment module 2. The temperatures of both the temperature measurement part 4a and the wiring 4b are equal to that of the temperature adjustment module 2. The temperature of the wiring 4b is affected by the ambient temperature, and the influence of heat dissipation from the temperature measurement part 4a to the surrounding air via the wiring 4b can be ignored. The temperature of the temperature adjustment module 2 can be detected with high precision by the temperature sensor 4. This is because if the length of the wiring 4b is within the range of 3 to 5 times the length in the length direction of the temperature measurement part 4a within the first opening 8, the influence of heat dissipation from the temperature measurement part 4a to the surrounding air via the wiring 4b can be ignored.

[0036] Furthermore, when the temperature control device 1 is moved by fixing the wiring 4b to the temperature adjustment module 2 using the pressing part 7, even if a force is applied to the wiring 4b, the positional relationship between the temperature measurement part 4a and the temperature adjustment module 2 does not change, enabling highly reproducible and reliable temperature measurement and highly reliable temperature control.

[0037] Here, in order to reduce the contact thermal resistance at the interface between the temperature measurement part 4a that constitutes the temperature sensor 4 and the inner wall surface of the first opening 8, heat conduction grease or an adhesive can also be filled in the first opening 8. In addition, the length of the wiring 4b that constitutes the temperature sensor 4 in contact and fixed with the inner wall surface of the first opening 8 is preferably the same length as or greater than that of the temperature measurement part 4a. That is, the first opening 8 preferably opens with a depth of more than twice the length of the temperature measurement part 4a from the end face of the temperature adjustment module 2. In addition, the pressing part 7 is preferably made of a flexible material and is composed of resin components such as polypropylene, polyethylene, and polyester. The pressing part 7 is pressed into the first opening 8 while being flattened, so that the temperature measurement part 4a and the wiring 4b are pressed against the inner wall surface of the first opening 8, and the contact thermal resistance becomes smaller. In addition, by configuring the diameter of the first opening 8 to be smaller than the sum of the diameters of the pressing part 7 and the wiring 4b, the wiring 4b can be pressed against the first opening 8 by the pressing part 7. However, the pressing part 7 is not limited to a cylinder and can also be, for example, Figure 4 a pressing part 7a whose cross-sectional shape of the cylinder as shown is partially flat, or Figure 5 a pressing part 7b whose cross-section is polygonal as shown. In the case of Figure 4 the pressing part 7a with a partially flat cylinder as shown, the wiring 4b that constitutes the temperature sensor 4 is pressed against the inner wall surface of the first opening 8 by the flat surface of the pressing part 7a. In addition, in the case of Figure 5In the case of the pressing portion 7b of the polygon shown, the wiring 4b constituting the temperature sensor 4 is pressed by one side (plane) of the pressing portion 7b against the inner wall surface of the first opening 8. The temperature control unit 3 may also be constituted by, for example, a heater, a Peltier element, a heat pump, or the like.

[0038] As described above, according to the present embodiment, it is possible to provide a temperature control device that can accurately indicate the temperature of the temperature control module by setting the temperature measurement unit and the wiring to the same temperature as the temperature control module, and can achieve high-precision temperature control.

[0039] In addition, the temperature measurement unit constituting the temperature sensor is pressed against the inner wall surface of the first opening provided in the temperature control module by the pressing portion, and the wiring constituting the temperature sensor is pressed against the inner wall surface of the first opening. Thus, not only the temperature measurement unit of the temperature measurement sensor but also the wiring is in close contact with the temperature control module, so that the temperature of the temperature measurement unit and the wiring is the same as that of the temperature control module, and the temperature of the temperature control module can be accurately measured.

[0040] Embodiment 2

[0041] Figure 6 It is a schematic cross-sectional view of the temperature control module 2 constituting the temperature control device 1a of Embodiment 2 of the present invention. In the present embodiment, the difference from Embodiment 1 is that there is a second opening 9 communicating with the first opening 8 provided in the temperature control module 2. The same reference numerals are given to the same components as in Embodiment 1, and the repeated description will be omitted below.

[0042] As Figure 6 shown, in the first opening 8 provided in the temperature control module 2, a second opening 9 is provided in the direction (+Z direction) toward the center of the temperature control module 2. At this time, the second opening 9 communicates with the first opening 8 and has a structure penetrating in the direction of the bottom surface of the temperature control module 2 (-Y direction). Here, the second opening 9 is preferably provided at least at a position including the region of the first opening 8 where the temperature measurement unit 4a constituting the temperature sensor 4 abuts against the temperature control module 2. However, it is not limited thereto, and it may also be provided at a position including the region of the first opening 8 where the temperature measurement unit 4a is located.

[0043] In this embodiment, there is a second opening 9, so that it is possible to visually confirm that the temperature measuring part 4a of the temperature sensor 4 is in close contact with the first opening 8, the deviation during assembly can be suppressed, and the temperature of the temperature control module 2 can be measured with high precision by the temperature sensor 4. In addition, a heat conduction grease and an adhesive are filled in the first opening 8. When the temperature sensor 4 is inserted, there is the second opening 9, so that the heat conduction grease pressed in by the temperature sensor 4 and the pressing part 7 is extruded from the second opening 9 communicating with the first opening 8. Thus, the first opening 8 and the temperature sensor 4 can be filled with the heat conduction grease, the contact thermal resistance is reduced, and the temperature of the temperature control module 2 can be measured with high precision. In addition, by confirming the heat conduction grease from the second opening 9, it can be confirmed that the temperature measuring part 4a is inserted into the first opening 8 and pressed against the inner wall surface. Here, if the opening area of the second opening 9 is large, the heat transfer area from the temperature control part 3 to the temperature control module 2 becomes smaller, and the temperature change becomes smaller. Therefore, the opening area of the second opening 9 is preferably equal to or smaller than the opening area of the first opening 8.

[0044] As described above, according to this embodiment, on the basis of the effects of the above-mentioned embodiment 1, there is a second opening 9, so that it is possible to visually confirm that the temperature measuring part 4a is in close contact with the first opening 8, the deviation during assembly can be suppressed, and the temperature of the temperature control module 2 can be measured with high precision by the temperature sensor 4.

[0045] In addition, a heat conduction grease and an adhesive are filled in the first opening 8. When the temperature sensor 4 is inserted, there is the second opening 9, so that the heat conduction grease pressed in by the temperature sensor 4 and the pressing part 7 is extruded from the second opening 9 communicating with the first opening 8. Thus, the first opening 8 and the temperature sensor 4 can be filled with the heat conduction grease, the contact thermal resistance is reduced, and the temperature of the temperature control module 2 can be measured with high precision.

[0046] Embodiment 3

[0047] Figure 7 It is a schematic cross-sectional view of the temperature control module 2 constituting the temperature control device 1b of Embodiment 3 of the present invention. In this embodiment, the difference from Embodiment 1 is that the cross-section of the first opening 8 provided in the temperature control module 2 has a shape that becomes narrower as it goes from the outer peripheral side (-Z direction) of the temperature control module 2 toward the central part (+Z direction). The same reference numerals are given to the same components as in Embodiment 1, and the repeated description is omitted below.

[0048] As Figure 7 shown, when the direction toward the center of the temperature control module 2 in the first opening 8 (+Z direction), that is, the diameter of the temperature measuring part 4a in contact with the temperature control module 2 is set as r1, and the outer peripheral side of the temperature control module 2 ( Figure 7In the case where the diameter in the -Z direction is set to r2, a structure of r1 < r2 is formed. At the same time, the pressing portion 7 also has a diameter substantially the same as r1 in the direction (+Z direction) toward the center of the temperature control module 2, and a shape having a diameter substantially the same as r2 on the outer peripheral side of the temperature control module 2 (in the -Z direction). Figure 7 In the case where the diameter in the -Z direction is set to r2, a structure of r1 < r2 is formed. At the same time, the pressing portion 7 also has a diameter substantially the same as r1 in the direction (+Z direction) toward the center of the temperature control module 2, and a shape having a diameter substantially the same as r2 on the outer peripheral side of the temperature control module 2 (in the -Z direction).

[0049] In the present embodiment, the pressing portion 7 is formed in a structure that becomes narrower as it approaches the center of the temperature control module 2 in the +Z direction. Thus, by inserting the pressing portion 7 in the +Z direction, the side surface of the pressing portion 7 and the inner wall surface of the first opening 8 are pressed, and the wiring 4b constituting the temperature sensor 4 is in close contact with the first opening 8, reducing the contact thermal resistance. As a result, the temperature of the temperature control module 2 can be detected with higher accuracy by the temperature measuring portion 4 of the temperature sensor 4.

[0050] Here, the shapes of the first opening 8 and the pressing portion 7 are not limited to a conical shape, and any shape that becomes narrower in the +Z direction is acceptable, such as a polygon, a shape formed by combining two or more diameters, or a shape that narrows in a stepped manner.

[0051] As described above, according to the present embodiment, in addition to the effects of the above-described Embodiment 1, by improving the close contact between the wiring 4b constituting the temperature sensor 4 and the first opening 8, it is easier to further reduce the contact thermal resistance.

[0052] Embodiment 4

[0053] Figure 8 FIG. is a schematic cross-sectional view of the temperature control module 2 constituting the temperature control device 1c of Embodiment 4 of the present invention. In the present embodiment, the difference from Embodiment 1 is that the pressing portion 7 has two-stage diameters. The same reference numerals are given to the same components as in Embodiment 1, and the repeated description will be omitted below.

[0054] As Figure 8 shown, the pressing portion 7 has a shape with two-stage diameters of r3 and r4. In the pressing portion 7, the diameter of the region where the temperature measuring portion 4a of the temperature sensor 4 is pressed against the inner wall surface of the first opening 8 is set to r3, and the diameter of the region where the wiring 4b of the temperature sensor 4 is pressed is set to r4.

[0055] In this embodiment, by pressing the portion with a diameter r3 of the pressing portion 7, not only is the temperature measuring portion 4a constituting the temperature sensor 4 pressed against the first opening portion 8 in the +Z direction (the direction toward the center of the temperature control module 2), but also it is pressed in the -Y direction at the same time. In addition, the portion with a diameter r4 of the pressing portion 7 presses the wiring 4b constituting the temperature sensor 4 against the inner wall surface of the first opening portion 8. With these configurations, the contact area between the temperature measuring portion 4a and the inner wall surface of the first opening portion 8 increases, the contact thermal resistance between the temperature measuring portion 4a and the temperature control module 2 becomes smaller, and the temperature of the temperature control module 2 can be accurately measured by the temperature sensor 4.

[0056] Here, the diameters provided in the pressing portion 7 are not limited to these two stages of r3 and r4, and may be formed of three or more stages. In addition, the pressing direction of the temperature measuring portion 4a pressed by the pressing portion 7 is not limited to the -Y direction, and may be pressing in the +Y direction or the X direction.

[0057] As described above, according to this embodiment, in addition to the effects of the above-described Embodiment 1, the contact area between the temperature measuring portion 4a and the inner wall surface of the first opening portion 8 increases, the contact thermal resistance between the temperature measuring portion 4a and the temperature control module 2 becomes smaller, and the temperature of the temperature control module 2 can be accurately measured by the temperature sensor 4.

[0058] Embodiment 5

[0059] Figure 9 FIG. is a schematic cross-sectional view of the temperature control module 2 constituting the temperature control device 1d of Embodiment 5 of the present invention. In this embodiment, the difference from Embodiment 1 is that there is a second opening portion 9 communicating with the first opening portion 8 provided in the temperature control module 2, and the second pressing portion 10 is used to press from the second opening portion 9. The same reference numerals are given to the same components as in Embodiment 1, and the repeated description will be omitted below.

[0060] As Figure 9 shown, in this embodiment, there is a second opening portion 9 communicating with the first opening portion 8 provided in the temperature control module 2, and the second pressing portion 10 is inserted from the second opening portion 9 to press the temperature measuring portion 4a constituting the temperature sensor 4 against the inner wall surface of the first opening portion 8.

[0061] In this embodiment, the temperature measuring portion 4a constituting the temperature sensor 4 can be pressed against the first opening portion 8 in the +Z direction (the direction toward the center of the temperature control module 2) by the pressing portion 7, and further the temperature measuring portion 4a can be pressed in the +Y direction (vertically upward) of the inner wall surface of the first opening portion 8 by the second pressing portion 10. Thus, the contact area between the temperature measuring portion 4a and the inner wall surface of the first opening portion 8 increases, the contact thermal resistance decreases, and the temperature of the temperature control module 2 can be measured with high precision by the temperature measuring portion 4a. Here, the shapes of the second opening portion 9 and the second pressing portion 10 are not limited to a cylindrical shape, and may be a polygonal shape.

[0062] As described above, according to this embodiment, in addition to the effects of the above-mentioned Embodiment 1, the same effects as those of the above-mentioned Embodiment 4 can also be achieved.

[0063] Embodiment 6

[0064] Figure 10 It is a schematic cross-sectional view of the temperature adjustment module 2 of the temperature control device 1e according to Embodiment 6 of the present invention, and is a view corresponding to Figure 1 the cross-section B-B' of Figure 11 It is a schematic cross-sectional view of the temperature adjustment module of the temperature control device 1e according to Embodiment 6 of the present invention, and is a view corresponding to Figure 1 the cross-section A-A' of. In this embodiment, the difference from Embodiment 1 is that a through-hole 11 is formed in the pressing portion 7, and the wiring 4b constituting the temperature sensor 4 is communicated with the inside of the through-hole 11. The same reference numerals are used for the same components as those in Embodiment 1, and the repeated descriptions are omitted below.

[0065] As Figure 10 and Figure 11 shown, it has the following structure: a through-hole 11 is formed in the pressing portion 7, and the wiring 4b constituting the temperature sensor 4 passes through the through-hole 11 and leads to the outside of the temperature adjustment module 2. In addition, the shape of the cross-section of the through-hole 11 is preferably substantially the same as the shape of the cross-section of the wiring 4b constituting the temperature sensor 4.

[0066] In this embodiment, the wiring 4b constituting the temperature sensor 4 can be in contact with the temperature adjustment module 2 via the pressing portion 7, and the contact area can be increased. Therefore, the temperature of the temperature adjustment module 2 can be measured with high precision by the temperature measurement portion 4a. Here, the pressing portion 7 is preferably formed of a material with high thermal conductivity.

[0067] As described above, according to this embodiment, the same effects as those of Embodiment 1 can be achieved.

[0068] In addition, the present invention is not limited to the above-mentioned embodiments, and includes various modification examples. For example, the above-mentioned embodiments are examples described in detail for easy understanding of the present invention, and are not necessarily limited to having all the structures described. In addition, a part of the structure of a certain embodiment can be replaced with the structure of other embodiments, and in addition, the structure of other embodiments can also be added to the structure of a certain embodiment.

[0069] Symbol Explanation

[0070] 1, 1a, 1b, 1c, 1d, 1e - temperature control device; 2 - temperature adjustment module; 3 - temperature control section; 4 - temperature sensor; 4a - temperature measurement section; 4b - wiring; 6 - heat dissipation section; 7 - pressing section; 7a - pressing section with a flat part on a cylinder; 7b - polygonal pressing section; 8 - first opening; 9 - second opening; 10 - second pressing section; 11 - through hole.

Claims

1. A temperature control device, comprising: A temperature adjustment module that can accommodate samples and / or reagents; and A temperature control unit that controls the temperature of the temperature adjustment module, The temperature control device is characterized in that it has: A first opening formed in the temperature adjustment module; and A pressing portion that inserts a temperature sensor having a temperature measurement portion and wiring into the first opening in such a manner that the temperature measurement portion abuts against the temperature adjustment module, The temperature measurement portion and the wiring are pressed against the inner wall surface of the first opening by the pressing portion.

2. The temperature control device according to claim 1, Characterized in that The pressing portion has at least any one of a cylindrical shape, a shape having a flat surface in a part of the cross-sectional shape of the cylinder, and a polygonal cross-sectional shape.

3. The temperature control device according to claim 1, Characterized in that The first opening is formed in a direction toward the center of the temperature adjustment module, A second opening is provided in the temperature adjustment module, The second opening communicates with the first opening and penetrates in the bottom surface direction of the temperature adjustment module.

4. The temperature control device according to claim 3, Characterized in that The second opening is provided at a position including the area of the first opening where the temperature measurement portion abuts against the temperature adjustment module, or at a position including the area of the first opening where the temperature measurement portion is located.

5. The temperature control device according to claim 4, Characterized in that The opening area of the second opening is equal to or smaller than the opening area of the first opening.

6. The temperature control device according to claim 1, Characterized in that The first opening has a shape that narrows toward the central portion of the temperature adjustment module.

7. The temperature control device according to claim 6, Characterized in that The pressing portion has a shape in which the diameter of the cross-section becomes smaller toward the central portion of the temperature adjustment module.

8. The temperature control device according to claim 1, Characterized in that The pressing portion has a shape with multiple diameter regions in the direction toward the central portion of the temperature adjustment module.

9. The temperature control device according to claim 8, Characterized in that The pressing portion has a shape in which the diameter of the region pressing the temperature measurement portion against the inner wall surface of the first opening is smaller than the diameter of the region pressing the wiring against the inner wall surface of the first opening.

10. The temperature control device according to claim 3, Characterized in that It has a second pressing portion that presses the temperature measurement portion upward in the vertical direction against the inner wall surface of the first opening from the second opening.

11. The temperature control device according to claim 1, Characterized in that The pressing portion has a through hole, and the cross-sectional shape of the through hole is substantially the same as the cross-sectional shape of the wiring.

12. The temperature control device according to any one of claims 2, 5, 7, 9, and 11, Characterized in that The temperature adjustment module is composed of a cylindrical portion that can accommodate samples and / or reagents and a flat plate portion in which the first opening is formed.

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