Grinding pad finishing disc and grinding equipment

Abstract

A polishing pad finishing disc and polishing equipment, the polishing pad finishing disc is suitable for finishing a polishing pad, the polishing pad finishing disc comprises: a disc body, the disc body comprises a polishing area and a detection area; the grinding part is fixed to the grinding area, and the grinding part is suitable for finishing a grinding pad; and the reflecting part is fixed in the detection area, and the reflecting part is suitable for reflecting incident light from a grinding pad. The light intensity of the reflected light reflected by the reflecting part is monitored, the relative size relation between the light intensity of the reflected light and the preset light intensity is compared, and the use condition of the grinding pad finishing disc is judged, so that whether the grinding pad finishing disc reaches the service life or not is judged, and then whether the grinding pad needs to be replaced or not is judged. According to the grinding pad finishing disc provided with the reflecting part, the use condition of the grinding pad finishing disc can be monitored, the situation of abnormal production caused by abrasion of the grinding pad finishing disc is reduced, and the product quality is improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing, and particularly to a polishing pad dressing disk and a polishing device. Background Art

[0002] Chemical mechanical planarization is a technology for smoothing a silicon wafer or other substrate during processing by chemical etching and mechanical force, and is one of the most important links in the semiconductor manufacturing process.

[0003] During the chemical mechanical planarization process, the removal of the wafer material is achieved by relying on the relative movement between the polishing pad and the wafer and the chemical erosion of the polishing liquid. The polishing pad has functions such as storing and transporting the polishing liquid, removing processing residues, transmitting mechanical loads, and maintaining the polishing environment. As the chemical mechanical planarization process continues, the physical and chemical properties of the polishing pad will change, manifested as the generation of residues on the surface of the polishing pad, the reduction in the volume and number of micropores, the decrease in surface roughness, the molecular recombination phenomenon on the surface, and the formation of a glazed layer with a certain thickness, resulting in a decrease in polishing efficiency and polishing quality. Therefore, in the chemical mechanical planarization process, a dressing disk is required to appropriately dress the polishing pad, remove the glazed layer on the surface of the polishing pad, and increase the surface roughness of the polishing pad to repair the processing performance of the polishing pad and ensure the stability and repeatability of the polishing process.

[0004] With the development of the semiconductor industry and the electronics industry, in recent years, the rapid growth in the demand for integrated circuit chips has led to a rapid increase in the demand for dressing disks for chemical mechanical planarization. However, there are still many problems with the current polishing pad dressing disks. Summary of the Invention

[0005] The problem solved by the present invention is how to improve the polishing pad dressing disk, so as to be able to monitor the usage of the polishing pad dressing disk in real time, and further be able to determine in a timely manner whether the polishing pad dressing disk has reached the service life.

[0006] To solve the above problems, the technical solution of the present invention provides a polishing pad dressing disk, including: a disk body, the disk body includes a grinding area and a detection area; a grinding member, the grinding member is fixed to the grinding area, and the grinding member is adapted to dress the polishing pad; a reflecting member, the reflecting member is fixed to the detection area, and the reflecting member is adapted to reflect the incident light from the polishing pad.

[0007] Optionally, the shape of the disk body includes a circle.

[0008] Optionally, the reflecting member extends along the radial direction of the disk body.

[0009] Optionally, the polishing pad dressing disk has a self-rotation axis passing through the center of the disk body and perpendicular to the surface of the disk body.

[0010] Optionally, the material of the reflector is a light-transmissive material.

[0011] Optionally, the Mohs hardness of the material of the reflector is greater than 7.

[0012] Optionally, the disk body includes: a substrate layer and a bonding layer located on the substrate layer; the reflector is embedded in the bonding layer.

[0013] Optionally, the thickness range of the reflector is: 1 mm to 10 mm.

[0014] Optionally, the disk body includes a first surface and a second surface, the grinding member protrudes from the first surface of the disk body, and the second surface is adapted to be connected to a driving mechanism.

[0015] Optionally, the grinding member includes a mounting portion and a cutting portion, wherein the mounting portion is embedded in the grinding area, and the cutting portion protrudes from the surface of the grinding area.

[0016] Optionally, the surface of the reflector is flush with the top surface of the grinding member.

[0017] Correspondingly, the technical solution of the present invention further provides a grinding device, the grinding device includes a grinding pad dressing disk as described in any one of the above; a grinding pad, the grinding pad dressing disk is located on the surface of the grinding pad, the grinding pad includes a window and a transparent member located in the window; a laser detection module, the laser detection module is suitable for generating detection light, and the detection light forms reflected light after acting on the transparent member and the reflector in sequence; the laser detection module also receives the reflected light.

[0018] Optionally, the grinding pad rotates self - clockwise with the center of the grinding pad as the rotation center.

[0019] Optionally, it further includes: a control module, the control module is suitable for controlling the grinding pad dressing disk and the grinding pad so that the transparent member and the reflector overlap at least once within a preset cycle time.

[0020] Optionally, the cycle time is less than or equal to 0.5 seconds.

[0021] Optionally, the laser detection module includes: a laser, the laser is suitable for generating detection light; a detector, the detector is suitable for receiving reflected light.

[0022] Optionally, the laser detection module further includes: a reflector, the reflector reflects the detection light generated by the laser towards the transparent member.

[0023] Optionally, the laser detection module further includes: a processing element, the processing element is suitable for judging whether the grinding pad dressing disk reaches the service life according to the received reflected light.

[0024] Optionally, the processing element is adapted to determine whether the lapping pad dressing disk has reached the end of its service life according to the light intensity of the received reflected light.

[0025] Compared with the prior art, the technical solution of the present invention has the following advantages:

[0026] In the lapping pad dressing disk of the technical solution of the present invention, the reflector is adapted to reflect the incident light from the lapping pad to form reflected light; by monitoring the reflected light, the usage condition of the lapping pad dressing disk can be judged, so as to judge whether the lapping pad dressing disk has reached the end of its service life, and determine whether it is necessary to replace the lapping pad. The use of the lapping pad dressing disk can monitor the usage condition of the lapping pad dressing disk, so as to realize the timely replacement of the lapping pad dressing disk, which is beneficial to reducing the occurrence of production anomalies and improving the product quality.

[0027] In an alternative embodiment of the present invention, the reflector extends along the radial direction of the disk body. The reflector extending along the radial direction of the disk body means that the reflector covers a part of the disk body along the direction from the center of the disk body to the circumference of the disk body. The size of the reflector is not too small, and the reflector has a suitable-sized reflecting surface to reflect the incident light from the lapping pad.

[0028] In an alternative embodiment of the present invention, the material of the reflector is a light-transmitting material. The change in the thickness of the light-transmitting material can cause a change in the formed reflected light. Therefore, by monitoring the reflected light, the usage condition of the lapping pad dressing disk can be judged. Based on the monitoring result of the reflected light, it can be judged whether the lapping pad dressing disk needs to be replaced. Setting the material of the reflector as a light-transmitting material makes use of the characteristic that the reflected light of the light-transmitting material changes significantly with the change in the thickness of the light-transmitting material, which can reduce the occurrence of production anomalies caused by the wear of the lapping pad dressing disk and improve the product quality.

[0029] In an alternative embodiment of the present invention, the Mohs hardness of the material of the reflector is greater than 7. The hardness of the material of the reflector is equivalent to the hardness of the material of the grinding element. When using the lapping pad dressing disk configured with the reflector to dress the lapping pad, the loss difference between the grinding area and the detection area of the lapping pad dressing disk is small. The change in the thickness of the reflector can more accurately reflect the loss condition of the lapping pad dressing disk. Therefore, by monitoring the reflected light from the reflector, the usage condition of the lapping pad dressing disk can be judged, so as to judge whether the lapping pad dressing disk has reached the end of its service life and determine whether it is necessary to replace the lapping pad.

[0030] In an alternative embodiment of the present invention, the surface of the reflector is flush with the top surface of the abrasive member. The surface of the reflector being flush with the top surface of the abrasive member ensures that when the polishing pad dressing disk equipped with the reflector is used to dress the polishing pad, the forces on the polishing area and the detection area of the polishing pad dressing disk are similar, and the wear of the polishing area and the detection area of the polishing pad dressing disk is similar. The change in the thickness of the reflector can accurately reflect the wear condition of the polishing pad dressing disk. By monitoring the reflected light from the reflector, it is possible to determine whether the polishing pad dressing disk has reached the end of its service life.

[0031] In the polishing equipment according to the technical solution of the present invention, the laser detection module is adapted to determine whether the polishing pad dressing disk has reached the end of its service life by comparing the intensity of the received reflected light with a preset light intensity, and further determine whether it is necessary to replace the polishing pad. The polishing equipment equipped with the reflector can monitor the usage condition of the polishing pad dressing disk in real time, and determine whether it is necessary to immediately replace the polishing pad dressing disk according to the monitoring results, reducing the occurrence of production abnormalities caused by the wear of the polishing pad dressing disk and improving the product quality.

[0032] In an alternative embodiment of the present invention, the cycle time is less than or equal to 0.5 seconds. When the cycle is less than or equal to 0.5 seconds, the reflector and the transparent member can overlap at least once within 0.5 seconds. The laser detection module can achieve real-time monitoring of the polishing pad dressing disk, and determine whether it is necessary to immediately replace the polishing pad dressing disk according to the monitoring results, reducing the occurrence of production abnormalities caused by the wear of the polishing pad dressing disk and improving the product quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 is a top view schematic diagram of a polishing pad dressing disk;

[0034] Figure 2 is a schematic diagram of the microscopic cross-sectional structure of a polishing pad dressing disk;

[0035] Figure 3 is a top view schematic diagram of the polishing pad dressing disk according to an embodiment of the present invention;

[0036] Figure 4 is a schematic diagram of the microscopic cross-sectional structure of the polishing pad dressing disk according to some embodiments of the present invention;

[0037] Figure 5 is a schematic diagram of the microscopic cross-sectional structure of the polishing pad dressing disk according to other embodiments of the present invention;

[0038] Figure 6 is a schematic diagram of the cross-sectional structure of the polishing equipment according to an embodiment of the present invention;

[0039] Figure 7It is a top view schematic diagram of the polishing pad conditioning disk according to an embodiment of the present invention. Detailed implementation manners

[0040] As can be seen from the background art, there are still problems with the current polishing pad conditioning disk. Now analyze the reasons for these problems:

[0041] Please refer to Figure 1 and Figure 2 , where Figure 2 is Figure 1 a microscopically magnified cross-sectional view of a partial area in

[0042] a disk body 100;

[0043] a grinding member 103, the grinding member 103 is fixed in the disk body 100 and the grinding member 103 protrudes from the surface of the disk body 100, and the grinding member 103 is suitable for conditioning the polishing pad.

[0044] The disk body 100 includes a base layer 101 and a bonding layer 102 located on the base layer 101.

[0045] The material of the base layer 101 includes metal; specifically, the material of the base layer 101 is stainless steel.

[0046] In the CMP (chemical mechanical polishing) process, the polishing pad conditioner is a key tool for maintaining and conditioning the surface of the polishing pad. However, as the usage time increases, the surface of the polishing pad conditioner will also wear, and the wear of the polishing pad conditioner is not easy to be detected, which will lead to production abnormalities and product losses.

[0047] To solve the above technical problems, the present invention provides a polishing pad conditioner, which is suitable for conditioning the polishing pad. The polishing pad conditioner includes: a disk body, the disk body includes a grinding area and a detection area; a grinding member, the grinding member is fixed in the grinding area, and the grinding member is suitable for conditioning the polishing pad; a reflecting member, the reflecting member is fixed in the detection area, and the reflecting member is suitable for reflecting the incident light from the polishing pad.

[0048] In the polishing pad conditioner of the technical solution of the present invention, the reflecting member is suitable for reflecting the incident light from the polishing pad to form reflected light; by monitoring the reflected light, the usage condition of the polishing pad conditioner can be judged, so as to judge whether the polishing pad conditioner reaches the service life and determine whether it is necessary to replace the polishing pad. The use of the polishing pad conditioner can monitor the usage condition of the polishing pad conditioner, so as to realize the timely replacement of the polishing pad conditioner, which is beneficial to reducing the occurrence of production abnormalities and improving the product quality.

[0049] To make the above objects, features, and advantages of the present invention more apparent and understandable, the following provides a detailed description of specific embodiments of the present invention with reference to the accompanying drawings.

[0050] An embodiment of the present invention provides a polishing pad conditioner, which is suitable for conditioning a polishing pad to ensure the flatness and porosity of the polishing pad, thereby improving the efficiency and quality of the chemical mechanical polishing process.

[0051] Please refer to Figure 3 and Figure 4 , wherein, Figure 4 is Figure 3 a microscopically magnified cross-sectional view of a partial area in , and the polishing pad conditioner includes: a disk body 200, and the disk body 200 includes a polishing area I and a detection area II.

[0052] Specifically, in some embodiments of the present invention, the shape of the disk body 200 is circular.

[0053] The sizes of the pad conditioner in a chemical mechanical polishing equipment include two specifications of 8 inches and 12 inches, that is, the diameter sizes of the polishing pad conditioner include two specifications of 8 inches and 12 inches, and the diameter of the disk body 200 includes two specifications of 8 inches and 12 inches.

[0054] The disk body 200 includes: a substrate layer 201 and a bonding layer 202 located on the substrate layer 201.

[0055] The material of the substrate layer 201 includes metal. Specifically, in some embodiments of the present invention, the material of the substrate layer 201 is stainless steel.

[0056] The material of the bonding layer 202 includes: a transparent adhesive.

[0057] The polishing pad conditioner has a self-rotation axis passing through the center of the disk body 200 and perpendicular to the surface of the disk body 200. The polishing pad conditioner rotates around the self-rotation axis for effective conditioning of the polishing pad.

[0058] Please continue to refer to Figure 4 , the polishing pad conditioner includes: a polishing member 203, and the polishing member 203 is fixed in the polishing area I and is suitable for conditioning the polishing pad.

[0059] The substrate layer 201 provides support for the polishing pad conditioner, and the bonding layer 202 is used to fix the polishing member 203.

[0060] The grinding member 203 includes a mounting portion 2031 and a cutting portion 2032. Among them, the mounting portion 2031 is embedded in the grinding area I, and the cutting portion 2032 protrudes from the surface of the grinding area I. The cutting portion 2032 is adapted to trim the polishing pad dresser.

[0061] Specifically, in some embodiments of the present invention, the material of the grinding member 203 includes diamond. Selecting diamond as the material of the grinding member 203, by virtue of the high hardness and good wear resistance of diamond, the polishing pad has a flat surface during the chemical mechanical polishing process. Specifically, the Mohs hardness of diamond is 10.

[0062] Please refer to Figure 3 and Figure 4 , the polishing pad dresser includes: a reflector 204, the reflector 204 is fixed in the detection area II, and the reflector 204 is adapted to reflect the incident light from the polishing pad.

[0063] The bonding layer 202 is also used to fix the reflector 204. Specifically, in some embodiments of the present invention, the reflector 204 is embedded in the bonding layer 202.

[0064] Specifically, in some embodiments of the present invention, as Figure 4 shown, the distance h from the bottom of the reflector 204 to the bottom surface of the bonding layer 202 1 is greater than 0, that is, h 1 > 0, so that the contact area between the reflector 204 and the bonding layer 202 is larger, and the reflector 204 can be more firmly fixed in the detection area II. Specifically, in some embodiments of the present invention, the thickness h 2 of the reflector 204 ranges from 1 mm to 10 mm.

[0065] Please refer to Figure 3 and Figure 4 , the reflector 204 extends along the radial direction of the disk body 200. The radial direction of the disk body 200 is the direction from the center of the disk body 200 to the circumference of the disk body 200. The reflector 204 extends along the radial direction of the disk body 200, and the size of the reflector 204 in the radial direction of the disk body 200 accounts for a relatively large proportion, and the reflector 204 has a large enough reflecting surface to reflect the incident light from the polishing pad.

[0066] Specifically, in some embodiments of the present invention, the area S 2 of the reflector 204 and the area S 1 of the disk body 200 have the following size relationship: 5%S 1 ≤S 2 ≤10%S 1The area of the reflector 204 should not be too large to avoid affecting the dressing effect of the dressing disk of the grinding member on the grinding pad; the area of the reflector 204 should not be too small so that the reflector 204 has a reflecting surface of sufficient size to reflect the incident light from the grinding pad 206.

[0067] Specifically, in some embodiments of the present invention, the surface of the reflector 204 is flush with the top surface of the grinding member 203. The surface of the reflector 204 is flush with the top surface of the grinding member 203, so that when the grinding pad dressing disk configured with the reflector 204 is used to dress the grinding pad, the force conditions in the grinding area I and the detection area II of the grinding pad dressing disk are similar, and the wear of the grinding area I and the detection area II of the grinding pad dressing disk is similar. The thickness change of the reflector 204 can more accurately reflect the wear condition of the grinding pad dressing disk. By monitoring the reflected light from the reflector 204, it can be determined whether the grinding pad dressing disk has reached its service life.

[0068] The Mohs hardness of the material of the reflector 204 is greater than 7. The hardness of the material of the reflector 204 is equivalent to the hardness of the material of the grinding member 203. When the grinding pad dressing disk configured with the reflector 204 is used to dress the grinding pad 206, the wear difference between the grinding area I and the detection area II of the grinding pad dressing disk is small. The thickness change of the reflector 204 can more accurately reflect the wear condition of the grinding pad dressing disk. By monitoring the reflected light from the reflector 204, the usage condition of the grinding pad dressing disk can be judged, so as to judge whether the grinding pad dressing disk has reached its service life and determine whether it is necessary to replace the grinding pad.

[0069] The material of the reflector 204 is a light-transmitting material. The change in the thickness of the light-transmitting material can cause a change in the formed reflected light. Therefore, the usage condition of the grinding pad dressing disk can be judged by monitoring the reflected light. Based on the monitoring result of the reflected light, it can be judged whether the grinding pad dressing disk needs to be replaced. Setting the material of the reflector 204 as a light-transmitting material makes use of the characteristic that the reflected light of the light-transmitting material changes significantly with the change in the thickness of the light-transmitting material, which can reduce the occurrence of production abnormalities caused by the wear of the grinding pad dressing disk and improve the product quality. Specifically, in some embodiments of the present invention, the material of the reflector 204 includes transparent resin and glass.

[0070] Specifically, in some embodiments of the present invention, please continue to refer to Figure 3 , the grinding pad dressing disk has a plurality of flow guiding grooves 205, and the flow guiding grooves 205 are adapted to guide the debris and particles generated during the dressing process to be discharged along a specific path, thereby reducing the accumulation of debris on the surface of the dressing disk and improving the dressing efficiency.

[0071] Please continue to refer toFigure 4 The disk body 200 includes a first surface 201a and a second surface 201b. The grinding member 203 protrudes from the first surface 201a of the disk body 200, and the second surface 201b is adapted to be connected to a driving mechanism.

[0072] The first surface 201a is adapted to face the polishing pad, and the second surface 201b is adapted to be connected to a driving mechanism to move the polishing pad dressing disk under the drive of the driving mechanism.

[0073] Specifically, in some embodiments of the present invention, please continue to refer to Figure 3 The reflector 204 extends along the radial direction of the disk body 200 and the reflector 204 is located between two adjacent flow guide grooves 205. Parallel to the surface of the disk body 200, the reflector 204 is a closed figure composed of four curves.

[0074] In other embodiments of the present invention, as Figure 5 shown, parallel to the surface of the disk body, the reflector 304 is a sector.

[0075] Correspondingly, the present invention further provides a grinding device. Please refer to Figure 6 including: the polishing pad dressing disk as described in any one of the above; a polishing pad, the polishing pad dressing disk is located on the surface of the polishing pad, the polishing pad includes a window and a transparent member located in the window; a laser detection module, the laser detection module is adapted to generate detection light, and the detection light forms reflected light after passing through the transparent member and the reflector in sequence; the laser detection module also receives the reflected light.

[0076] In the grinding device of the technical solution of the present invention, the laser detection module is adapted to judge whether the polishing pad dressing disk reaches the service life by comparing the light intensity of the received reflected light with a preset light intensity, and further judge whether it is necessary to replace the polishing pad. The grinding device configured with a reflector can monitor the usage of the polishing pad dressing disk in real time, and judge whether it is necessary to immediately replace the polishing pad dressing disk according to the monitoring result, reducing the occurrence of production anomalies caused by the wear of the polishing pad dressing disk and improving the product quality.

[0077] Please refer to Figure 6 The grinding device includes: a polishing pad 206, the polishing pad dressing disk is located on the surface of the polishing pad 206, and the polishing pad 206 includes a window and a transparent member 207 located in the window.

[0078] The lapping pad dressing disk is located on the surface of the lapping pad 206, that is, the lapping pad dressing disk is in direct contact with the lapping pad 206, and the lapping pad dressing disk is adapted to dress the surface of the lapping pad 206. The lapping pad dressing disk is used to dress and polish the surface of the lapping pad 206 to ensure the flatness and porosity of the lapping pad 206, thereby improving the efficiency and quality of the chemical mechanical polishing process.

[0079] Specifically, in some embodiments of the present invention, the lapping pad 206 rotates about its center as the rotation center. The rotation of the lapping pad 206 about its center helps to achieve uniform wear on the surface of the lapping pad 206, prevent local excessive wear or deformation of the lapping pad 206, and moreover, the rotational movement can increase the contact area between the lapping pad 206 and the wafer, thereby improving the polishing efficiency of the wafer.

[0080] The transparent member 207 is used to transmit the detection light from the laser detection module to the reflecting member 204.

[0081] Please refer to Figure 6 , the lapping device includes: a laser detection module, the laser detection module is adapted to generate detection light, and the detection light forms reflected light after passing through the transparent member 207 and the reflecting member 204 in sequence; the laser detection module also receives the reflected light.

[0082] The lapping pad dressing disk will be worn after use, so the thickness of each position of the reflecting member 204 will change. The loss of the reflecting member 204 will cause the travel of light in the reflecting member 204 to change, so that the light intensity of the reflected light formed after reflection by the reflecting member 204 will change. Therefore, by comparing the magnitude relationship between the received light intensity of the reflected light and the preset light intensity, it can be judged whether the lapping pad dressing disk has reached the service life, and further judge whether it is necessary to replace the lapping pad 206. The lapping device configured with the reflecting member 204 can monitor the usage of the lapping pad dressing disk, and judge whether it is necessary to replace the lapping pad dressing disk in time according to the monitoring result, thereby reducing the occurrence of production abnormalities caused by the wear of the lapping pad dressing disk and improving the product quality.

[0083] Please refer to Figure 6 , the laser detection module includes: a laser, the laser is adapted to generate detection light; a detector 208, the detector 208 is adapted to receive the reflected light.

[0084] The laser detection module is adapted to use optical detection technology to obtain the intensity of the light reflected from the surface of the wafer, and determine the end point of the chemical mechanical polishing process by judging the magnitude relationship between the intensity of the light reflected from the surface of the wafer and the preset light intensity. In this solution, the laser detection module is used to monitor the usage of the polishing pad dressing disk, and real-time monitoring of the polishing pad dressing disk can be achieved without major modifications to the polishing equipment, and the process cost is relatively low.

[0085] Please refer to Figure 6 , the laser detection module further includes: a reflecting mirror 209, and the reflecting mirror 209 reflects the detection light generated by the laser towards the transparent member 207.

[0086] The reflecting mirror 209 is adapted to adjust the propagation path of the detection light so that the detection light is reflected towards the transparent member 207.

[0087] Please refer to Figure 6 , the propagation path of the detection light generated by the laser includes: the detection light from the laser is incident light, the incident light is incident on the surface of the reflecting mirror 209, and after a single reflection, a preliminary reflected light is formed. The preliminary reflected light propagates through the transparent member 207 to the reflecting member 204, and after another reflection on the surface of the reflecting member 204, the reflected light is formed, and the detector 208 receives the reflected light.

[0088] Please refer to Figure 6 , the laser detection module further includes: a processing element, and the processing element is adapted to judge whether the polishing pad dressing disk reaches the service life according to the received reflected light.

[0089] The polishing pad dressing disk will be worn after use, so the thickness of each position of the reflecting member 204 will change. The loss of the reflecting member 204 will cause the travel of light in the reflecting member 204 to change, and thus the light intensity of the reflected light formed after the reflection of the reflecting member 204 will change according to the loss situation of the reflecting member 204. Therefore, the processing element can judge whether the polishing pad dressing disk reaches the service life by comparing the magnitude relationship between the light intensity of the received reflected light and the preset light intensity, and further judge whether it is necessary to replace the polishing pad 206. The polishing equipment reduces the probability of production anomalies and improves the product quality. Specifically, in some embodiments of the present invention, the loss of the reflecting member 204 causes the thickness of the reflecting member 204 to become thinner, so that the travel of light in the reflecting member 204 becomes shorter, and the light intensity of the reflected light formed after the reflection of the reflecting member 204 is enhanced. When the light intensity of the received reflected light is greater than the preset light intensity, it is determined that the polishing pad dressing disk reaches the service life.

[0090] The grinding device further includes: a control module, which is adapted to control the polishing pad dressing disk and the polishing pad 206 so that the transparent member 207 and the reflective member 204 overlap at least once within a preset cycle time.

[0091] The transparent member 207 and the reflective member 204 overlap, that is, the transparent member 207 contacts the reflective member 204. At this time, the projection of the transparent member 207 on the surface of the disk body 200 at least partially coincides with the reflective member 204.

[0092] Specifically, in some embodiments of the present invention, the cycle time is less than or equal to 0.5 seconds. The cycle being less than or equal to 0.5 seconds means that within 0.5 seconds, the reflective member 204 and the transparent member 207 can overlap at least once. The laser detection module can realize real-time monitoring of the polishing pad dressing disk, and judge whether it is necessary to immediately replace the polishing pad dressing disk according to the monitoring results, reducing the occurrence of production abnormalities caused by the wear of the polishing pad dressing disk, and improving the product quality.

[0093] Please refer to Figure 6 and Figure 7 , Figure 7 is a top view schematic diagram of the polishing pad dressing disk and the polishing pad when they overlap at a certain moment in an embodiment of the present invention. The polishing pad dressing disk has a self-rotation axis passing through the center of the disk body 200 and perpendicular to the surface of the disk body 200. In the figure, 1 is the rotation direction of the polishing pad dressing disk, 2 is the rotation direction of the polishing pad 206, 210 is the movement track of the overlap between the polishing pad 206 and the polishing pad dressing disk, and 211 in the figure is the overlap area between the reflective member 204 and the transparent member 207 of the polishing pad dressing disk. When the reflective member 204 and the transparent member 207 overlap, the detection light generated by the laser passes through the transparent member 207 and the reflective member 204 in sequence and then forms reflected light. The detector 208 receives the reflected light, and judges whether the polishing pad dressing disk reaches the service life by comparing the intensity of the received reflected light with the preset light intensity, and further judges whether it is necessary to replace the polishing pad 206.

[0094] In summary, in the polishing pad dressing disc of the technical solution of the present invention, the reflector 204 is fixed to the detection area II. The reflector 204 is adapted to reflect the incident light from the polishing pad 206. By monitoring the light intensity of the reflected light after being reflected by the reflector 204, comparing the relative magnitude relationship between the light intensity of the reflected light and a preset light intensity, the usage condition of the polishing pad dressing disc is judged, so as to judge whether the polishing pad dressing disc reaches the service life, and further judge whether it is necessary to replace the polishing pad 206. The polishing pad dressing disc configured with the reflector 204 can monitor the usage condition of the polishing pad dressing disc in real time, and judge whether it is necessary to immediately replace the polishing pad dressing disc according to the monitoring result, reducing the occurrence of production abnormalities caused by the wear of the polishing pad dressing disc, and improving the product quality. In the polishing equipment of the technical solution of the present invention, the laser detection module is adapted to judge whether the polishing pad dressing disc reaches the service life by comparing the magnitude relationship between the light intensity of the received reflected light and the preset light intensity, and further judge whether it is necessary to replace the polishing pad 206. The polishing equipment reduces the probability of production abnormalities and improves the product quality.

[0095] Although the present invention is disclosed as above, the present invention is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention should be subject to the scope defined by the claims.

Claims

1. A grinding pad dressing disc, the grinding pad dressing disc is suitable for dressing a grinding pad, characterized in that: The grinding pad conditioning disc comprises: A disc body, the disc body comprising a grinding area and a detection area; A grinding piece, the grinding piece is fixed to the grinding area, and the grinding piece is suitable for dressing the grinding pad; A reflector is fixed to the detection area and is suitable for reflecting incident light from the polishing pad.

2. The polishing pad conditioning disc according to claim 1, wherein: The shape of the disc body includes a circle.

3. The polishing pad conditioning disc according to claim 2, wherein: The reflective member extends in a radial direction of the disk body.

4. The polishing pad conditioning disc according to claim 2, wherein: The polishing pad conditioning disc has a rotation axis passing through the center of the disc body and perpendicular to the surface of the disc body.

5. The polishing pad conditioning disc according to claim 1, wherein: The reflective element is made of a light-transmitting material.

6. The polishing pad conditioning disc according to claim 1 or 5, characterized in that: The Mohs hardness of the material of the reflector is greater than 7.

7. The polishing pad conditioning disc according to claim 1, wherein: The disk body comprises: a base layer and a bonding layer located on the base layer; and the reflector is embedded in the bonding layer.

8. The polishing pad conditioning disc according to claim 7, wherein: The thickness of the reflector is in the range of 1 mm to 10 mm.

9. The polishing pad conditioning disc according to claim 1, wherein: The disc body comprises a first surface and a second surface, the grinding element protrudes from the first surface of the disc body, and the second surface is suitable for connecting with a driving mechanism.

10. The polishing pad conditioning disc according to claim 1, wherein: The grinding piece includes a mounting portion and a cutting portion, wherein the mounting portion is embedded in the grinding area, and the cutting portion protrudes from the surface of the grinding area.

11. The polishing pad conditioning disc according to claim 1 or 10, characterized in that: The surface of the reflective member is flush with the top surface of the grinding member.

12. A grinding device, characterized in that: include: The polishing pad conditioning disc according to any one of claims 1 to 11; A polishing pad, wherein the polishing pad dressing disc is located on the surface of the polishing pad, and the polishing pad comprises a window and a transparent member located in the window; A laser detection module, wherein the laser detection module is suitable for generating detection light, wherein the detection light is sequentially acted upon by the transparent component and the reflective component to form reflected light; the laser detection module also receives the reflected light.

13. The grinding device according to claim 12, characterized in that The polishing pad rotates with the center of the polishing pad as the rotation center.

14. The grinding device according to claim 12, characterized in that Also includes: A control module is provided, wherein the control module is adapted to control the polishing pad conditioning disc and the polishing pad so that the transparent member and the reflective member overlap at least once within a preset cycle time.

15. The grinding device according to claim 14, characterized in that The cycle time is less than or equal to 0.5 seconds.

16. The grinding device according to claim 12, characterized in that The laser detection module comprises: a laser, which is suitable for generating detection light; and a detector, which is suitable for receiving reflected light.

17. The grinding device according to claim 16, characterized in that The laser detection module also includes a reflector, which reflects the detection light generated by the laser toward the transparent component.

18. The grinding device according to claim 12, characterized in that The laser detection module further includes: a processing element, which is suitable for determining whether the polishing pad dressing disc has reached its service life based on the received reflected light.

19. The grinding device according to claim 18, characterized in that The processing element is adapted to determine whether the polishing pad conditioning disc has reached the end of its service life based on the intensity of the received reflected light.

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