Tungsten skeleton copper infiltrated blank, preparation method and application of tungsten skeleton copper infiltrated blank

Abstract

The invention discloses a tungsten skeleton copper infiltrated blank preparation method which comprises the following steps: grading, mixing and sieving tungsten powder with different particle sizes to obtain mixed tungsten powder; based on the mixed tungsten powder, a tungsten framework is obtained through laser printing; performing density judgment on the tungsten skeleton; and the tungsten skeleton with the qualified density is subjected to copper infiltration treatment, and a tungsten skeleton copper infiltration blank is obtained. According to the method, the physical and mechanical properties of the tungsten skeleton copper infiltrated blank can be optimized while the good electric conductivity is kept.

Description

Technical Field

[0001] This application belongs to the technical field of materials science and engineering, and specifically relates to a tungsten skeleton copper-infiltrated blank, a preparation method thereof, and an application thereof. Background Art

[0002] As an important functional material, tungsten skeleton copper-infiltrated blanks have wide application requirements in multiple fields. However, the traditional preparation process of tungsten skeleton copper-infiltrated blanks has limitations in improving the mechanical properties (such as bending strength and hardness) of alloys, and it is difficult to achieve precise manufacturing of complex structures while ensuring electrical properties. To address these problems, this application proposes an innovative preparation method for tungsten skeleton copper-infiltrated blanks. This method prepares a tungsten skeleton by using laser printing technology and then performs copper infiltration treatment, achieving the improvement of the mechanical properties of tungsten skeleton copper-infiltrated blanks while maintaining their good electrical properties, and is suitable for the manufacturing of high-performance application scenarios, such as optical module heat sink components. This method can not only optimize the physical and mechanical properties of tungsten skeleton copper-infiltrated blanks, but also reduce defects in the production process to a certain extent, improving the quality and consistency of products. Summary of the Invention

[0003] The main purpose of this application is to provide a tungsten skeleton copper-infiltrated blank, a preparation method thereof, and an application thereof. This application can improve the mechanical properties of tungsten skeleton copper-infiltrated blanks while maintaining their good electrical properties.

[0004] To achieve the above object, this application provides the following technical solutions:

[0005] A tungsten skeleton copper-infiltrated blank, the components of the tungsten skeleton copper-infiltrated blank and the mass percentage of each component are as follows: mixed tungsten powder: 70wt% to 90wt%; copper: 10wt% to 30wt%; wherein, the mixed tungsten powder includes: fine powder: 5wt% to 30wt%; medium powder: 5wt% to 20wt%; coarse powder: 60wt% to 90wt%.

[0006] This application also provides a preparation method for a tungsten skeleton copper-infiltrated blank. The preparation method includes: performing gradation mixing and sieving on tungsten powders with different particle sizes to obtain mixed tungsten powder; obtaining a tungsten skeleton by laser printing based on the mixed tungsten powder; determining the density of the tungsten skeleton; and performing copper infiltration treatment on the tungsten skeleton with qualified density determination to obtain a tungsten skeleton copper-infiltrated blank.

[0007] Optionally, printing is performed in an environment with an oxygen content lower than 0.04% ppm.

[0008] Optionally, the density of the tungsten skeleton is determined, including: determining the volume of the tungsten skeleton; weighing the printed tungsten skeleton to obtain the actual mass; calculating the actual density of the tungsten skeleton based on the volume and the actual mass, and comparing it with the standard density of the tungsten skeleton. Among them, if the actual density is close to or equal to the standard density, the density determination is qualified; otherwise, it is unqualified.

[0009] Optionally, the tungsten skeleton with qualified density determination is subjected to copper infiltration treatment by the infiltration method or the suction infiltration method.

[0010] Optionally, the tungsten fixture is preheated before the copper infiltration treatment.

[0011] Optionally, the copper infiltration treatment is carried out in a temperature environment of 1200°C to 1450°C.

[0012] Optionally, the time for the copper infiltration treatment is 10h to 45h.

[0013] Optionally, during the copper infiltration treatment, ultrasonic vibration is applied to the copper liquid.

[0014] The present application also provides a heat sink component for an optical module, and the heat sink component for the optical module is prepared from a tungsten skeleton copper infiltration blank, and the tungsten skeleton copper infiltration blank is prepared by the preparation method of a tungsten skeleton copper infiltration blank as described in any one of the foregoing.

[0015] The present application can bring the following beneficial effects:

[0016] By innovatively using laser printing to prepare the tungsten skeleton and performing copper infiltration treatment, the present application can optimize the physical and mechanical properties of the tungsten skeleton copper infiltration blank while maintaining good conductivity, so that the prepared tungsten skeleton copper infiltration blank can be applied to high-performance application scenarios. Description of the Drawings

[0017] Figure 1 is a schematic flow chart of a preparation method of a tungsten skeleton copper infiltration blank provided by an embodiment of the present application;

[0018] Figure 2 is a metallographic diagram of CuW80 magnified 50 times prepared by the present application;

[0019] Figure 3 is a metallographic diagram of CuW80 magnified 100 times prepared by the present application;

[0020] Figure 4 is a metallographic diagram of tungsten skeleton copper infiltration magnified 100 times prepared based on the traditional process. Detailed Embodiments

[0021] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without making creative efforts belong to the scope of protection of the present invention.

[0022] It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of the present invention are only used to explain the relative positional relationship and movement conditions between components in a specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indications will also change accordingly.

[0023] In the present invention, unless otherwise clearly defined and limited, terms such as "connection" and "fixation" should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components or the interaction relationship between two components, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0024] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In addition, the meaning of "and / or" appearing throughout the text includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or a solution where A and B are satisfied simultaneously. In addition, the technical solutions between various embodiments can be combined with each other, but it must be based on the ability of those of ordinary skill in the art to implement. When the combination of technical solutions results in contradictions or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0025] In an exemplary embodiment, the present application provides a tungsten skeleton copper infiltrated blank, and the tungsten skeleton copper infiltrated blank includes: mixed tungsten powder: 70 wt% to 90 wt%; copper: 10 wt% to 30 wt%, wherein the mixed tungsten powder includes: fine powder: 5 wt% to 30 wt%; medium powder: 5 wt% to 20 wt%; coarse powder: 60 wt% to 90 wt%.

[0026] In this embodiment, the optimal ratio of the tungsten skeleton copper infiltrated blank is: mixed tungsten powder: 90 wt%; copper 10 wt%. Among them, the optimal ratio of tungsten powders with different particle sizes in the mixed tungsten powder is: fine powder: 5 wt%; medium powder: 5 wt%; coarse powder: 90 wt%.

[0027] It should be noted that tungsten is a metal with a high melting point, good corrosion resistance and high strength, but its electrical conductivity is poor. On the contrary, although the strength and melting point of copper are not as good as those of tungsten, it has excellent electrical and thermal conductivity. By combining the two, the mechanical strength and electrical conductivity of the material can be balanced to a certain extent. By using a higher proportion of tungsten (70 wt% to 90 wt%), it can ensure that the tungsten skeleton copper infiltrated blank has sufficient hardness and wear resistance. At the same time, adding an appropriate amount of copper (10 wt% to 30 wt%) can improve its electrical conductivity and processing performance. In addition, if the content of tungsten is too large (exceeding 90 wt%), the content of copper will correspondingly decrease, so the overall electrical conductivity of the tungsten skeleton copper infiltrated blank will be reduced. In addition, a high content of tungsten will make the tungsten skeleton copper infiltrated blank harder and more brittle, increasing the difficulty of subsequent product processing and forming, and may cause cracks or other defects in the finished product. On the contrary, if the content of tungsten is too small (less than 70 wt%), the content of copper will increase correspondingly. Although copper has good electrical and thermal conductivity, its hardness and strength are far less than those of tungsten. When the proportion of tungsten is too low, the tungsten skeleton copper infiltrated blank cannot provide sufficient mechanical strength to meet the requirements of specific applications, such as in occasions where high pressure is applied or wear resistance is required. In addition, tungsten has a high melting point, while the melting point of copper is relatively low. Too much copper will cause the high temperature resistance of the tungsten skeleton copper infiltrated blank to decline, and deformation or damage may occur in a high temperature environment.

[0028] For the mixed tungsten powder, the proportion of coarse powder is the highest, while the proportions of fine powder and medium powder are relatively low because:

[0029] The coarse powder provides the main support framework or skeleton structure. Due to the large particle size of the coarse powder, it can form a solid basic network. In addition, although the coarse powder constitutes the main skeleton of the tungsten skeleton copper infiltrated blank, there may be relatively large voids between them. By adding an appropriate amount of fine powder and medium powder, these voids can be effectively filled, increasing the density of the tungsten skeleton copper infiltrated blank, and thus improving the overall performance of the tungsten skeleton copper infiltrated blank. In addition, during the laser printing process, if too much fine powder is used, the fluidity of the powder after melting will become poor, and adhesion is likely to occur, affecting the forming accuracy. On the contrary, an appropriate proportion of coarse powder helps to maintain good fluidity and flatness, ensure the smooth progress of the printing process, and obtain high-quality products.

[0030] In summary, the above ratio is the result obtained by the applicant after strict experiments. The particle size distribution given above can maximize the mechanical properties of the tungsten skeleton copper infiltrated blank, and at the same time can also improve its electrical conductivity and thermal conductivity.

[0031] Figure 1 FIG. is a schematic flow chart of a method for preparing a tungsten skeleton copper infiltrated blank according to an embodiment of the present application, as Figure 1 shown, the method includes the following steps:

[0032] S1: Gradationally mix and screen tungsten powders of different particle sizes according to a preset ratio to obtain mixed tungsten powder, specifically including:

[0033] First, tungsten powders of different particle sizes (for example, using fine powders with a particle size of 1.5 μm to 5 μm, medium powders with a particle size of 5 μm to 20 μm, and coarse powders with a particle size of 20 μm to 50 μm) are gradationally mixed according to a preset ratio using a three-dimensional powder mixer at a ball-to-material ratio of 1 to 4:6 to 9 (preferably 2:7) to obtain mixed tungsten powder; wherein, the rotation speed of the three-dimensional powder mixer is set to 40 to 100 Hz (preferably 80 Hz), and the single powder mixing time is set to 5 to 8 h (preferably 6.5 h);

[0034] Secondly, the mixed tungsten powder is screened using a 30-mesh sieve to obtain the mixed tungsten powder that can be used for printing.

[0035] The mixed tungsten powder obtained through gradational mixing and screening can ensure the formation of a uniform micro-spot welded tungsten skeleton blank during the subsequent laser printing process, thereby improving the performance of the tungsten skeleton copper infiltrated blank. In addition, the above processing method can also avoid the problem of tungsten powder melting and agglomerating, thereby ensuring the aesthetics and product performance during the subsequent processing process.

[0036] S2: Obtain a tungsten skeleton by laser printing based on the mixed tungsten powder;

[0037] In this step, first, load the mixed tungsten powder into the material bin of the SLM infrared laser printer, and use a rigid scraper to ensure that the blank accuracy reaches within ±0.05. Then, import the tungsten skeleton pattern to be printed. Next, perform tungsten skeleton printing in an environment with an oxygen content lower than 0.04% ppm (tungsten is a metal that easily reacts with oxygen at high temperatures to form oxides. During the laser printing process, since it is necessary to melt the powder material through a high-energy laser beam to form a specific structure, this process will generate a local high-temperature environment. If the environment contains a high concentration of oxygen, then tungsten may undergo an oxidation reaction to generate tungsten oxide, which will not only affect the chemical composition of the final product but also reduce its physical properties such as conductivity and mechanical strength. Therefore, through experiments, printing in an environment with an oxygen content lower than 0.04% ppm can effectively avoid the oxidation problem of tungsten). Among them, the printing parameters include: the printing layer thickness is controlled at 0.02 mm to 0.04 mm, the printing power is controlled at 60 W to 180 W, the laser scanning speed is controlled at 800 mm / s to 1600 mm / s, the spot pitch is controlled at 0.06 mm to 0.15 mm, the spot diameter is set at 60 μm to 100 μm, and the printing efficiency is set at 90 g / h to 150 g / h. After printing, gently tap and remove the tungsten skeleton with a wooden hairpin and a small steel hammer.

[0038] S3: Determine the density of the tungsten skeleton. If the determination is qualified, execute step S4; otherwise, return to step S1 to re-perform grading and mixing of the tungsten powder or return to step S2 to adjust the printing parameters and re-print until the density of the tungsten skeleton is determined to be qualified.

[0039] In this step, the density of the printed tungsten skeleton can be determined by direct weighing, and a prefabricated copper blank can be added to the qualified tungsten skeleton.

[0040] It should be noted that the density of the printed tungsten skeleton can be determined to be qualified through the following steps:

[0041] Step 1: Determine its volume (V) according to the design drawing of the tungsten skeleton;

[0042] Step 2: Weigh the printed tungsten skeleton to obtain the actual mass (m 实际 );

[0043] Step 3: Calculate the actual density of the tungsten skeleton based on the actual mass and the determined volume, and compare it with the standard density (about 19.3 g / cm 3 ). Among them, the actual density can be obtained through the following formula:

[0044]

[0045] If the actual density is close (for example, the actual density of the tungsten skeleton is within ±2% of the standard density, that is, the actual density is between about 18.9 g / cm 3 and 19.7 g / cm 3 ), or equal to the standard density, the density of the tungsten skeleton is considered qualified; otherwise, it is unqualified.

[0046] S4: Perform copper infiltration on the tungsten skeleton with qualified density determination, specifically including:

[0047] Step 1: First place graphite paper in a cleaned small graphite crucible. The purpose is to prevent the copper from adhering to the crucible wall after melting and affecting the workpiece removal.

[0048] Step 2: Place the tungsten skeleton with qualified density determination on the graphite paper, and use fine sand with a mesh size of more than 200 (such as quartz sand) to landfill the periphery of the tungsten skeleton (the fine sand can fill smaller spaces to ensure no obstruction during the copper infiltration process), ensuring that the tungsten skeleton does not move during the copper infiltration process, thereby ensuring the copper infiltration effect.

[0049] Step 3: Place the prefabricated copper blank on the tungsten skeleton after peripheral landfilling, and then completely cover and fix the tungsten skeleton with the copper blank with quartz sand. On the one hand, it is to prevent the tungsten skeleton from moving, and on the other hand, it is to ensure that the copper liquid can smoothly penetrate into all the gaps of the tungsten skeleton at high temperature, while avoiding non-uniformity or defects caused by the movement of the tungsten skeleton.

[0050] Step 4: Place the graphite crucible containing the tungsten skeleton, copper blank, and buried sand into a continuously heated molybdenum wire furnace for heating, and then gradually increase the temperature according to a predetermined program until the optimal temperature range required for copper infiltration (1200 °C to 1450 °C) is reached. This temperature is sufficient to melt the copper but will not damage the tungsten skeleton structure. The copper infiltration time is generally controlled within 10 h to 45 h to ensure that the copper liquid can fully penetrate into the pores of the tungsten skeleton.

[0051] In this step, the present application introduces an innovative copper infiltration process, and the specific process is as follows:

[0052] Before starting the copper infiltration treatment, first slowly heat the graphite crucible containing the tungsten skeleton and copper blank to a lower preheating temperature (such as 500 °C to 600 °C). Through preheating, it helps to remove the moisture and other volatile substances adsorbed inside and on the surface of the material, reducing the bubbles or defects that may obstruct the copper liquid penetration path during the subsequent high-temperature treatment process.

[0053] Secondly, gradually increase the temperature from the preheating temperature to the target copper infiltration temperature (1200 °C to 1450 °C). This process should adopt a segmented heating method, and after rising a certain temperature, hold for a period of time to allow the entire heating system to have enough time to reach thermal equilibrium. For example, it can stay for 30 minutes to 1 hour every 100 °C.

[0054] Next, when the predetermined copper infiltration temperature is reached, maintain this temperature for a period of time, which is called the "holding time", usually 10h to 45h. Through this period of holding, it can ensure that all the copper liquid has enough time to penetrate into all the gaps of the tungsten skeleton.

[0055] It should be noted that during the above copper infiltration process, ultrasonic vibration can be further introduced to help break the flow resistance of the copper liquid and promote its more uniform distribution throughout the tungsten skeleton. In addition, during the copper infiltration process, an inert gas environment needs to be maintained to prevent oxidation reactions from occurring and also to facilitate the improvement of the fluidity of the copper liquid.

[0056] By introducing the above copper infiltration process, this application can effectively regulate the fluidity of the copper liquid and its infiltration behavior in the tungsten skeleton, ensure that the copper liquid can uniformly fill all the gaps of the tungsten skeleton, and thus prepare a high-quality copper-infiltrated tungsten skeleton blank.

[0057] Step 5: After the copper infiltration is completed, slowly cool down to room temperature (for example, at a rate of 50°C / h) to prevent stress concentration caused by rapid cooling, which may lead to cracking or deformation of the copper-infiltrated tungsten skeleton material, and thus maintain the structural integrity of the tungsten skeleton and the stability after the copper liquid infiltration.

[0058] Step 6: When the temperature drops to room temperature, take out the graphite crucible from the molybdenum wire furnace and clean the excess buried sand on the surface.

[0059] After completing the above steps, a copper-infiltrated tungsten skeleton blank can be obtained. It is directly loaded into a machining center and processed according to a pre-established program. After processing, the required product can be obtained.

[0060] In another exemplary embodiment, this application also provides a method for preparing a copper-infiltrated tungsten skeleton blank. Compared with the previous embodiment, the improvement of this embodiment lies in introducing an innovative tungsten powder grading and mixing method, which specifically includes the following steps:

[0061] Step 1: Use a vibrated fluidized bed device to pre-treat tungsten powders with different particle sizes. The vibrated fluidized bed device can make the tungsten powders in a flowing state through the combined action of bottom air injection and upper mechanical vibration.

[0062] Step 2: The tungsten powder treated by the vibrated fluidized bed is initially screened through a series of sieves with different pore sizes (for example, a coarse sieve with a pore size of 500 microns, a medium sieve with a pore size of 50 microns, and a fine sieve with a pore size of 15 microns) to separate large, medium, and small particle components that roughly meet the target grading; then, for each component, the vibrated fluidized bed equipment is used again for more meticulous mixing, and an appropriate amount of binder or dispersant can be added to enhance the mixing uniformity; then, after the components are re - combined, they are passed through a multi - stage screening process again, and this step can be repeated multiple times as needed, adjusting the sieve combination each time to ensure that the particle size ratios at all levels reach the optimum.

[0063] Step 3: All the tungsten powder components treated through the above steps are put into a high - efficiency mixer for mixing treatment to obtain mixed tungsten powder;

[0064] Step 4: The mixed tungsten powder is subjected to a stabilization treatment, that is, the mixed tungsten powder is subjected to low - temperature sintering or surface modification treatment to enhance the interaction force between particles, thereby improving the forming stability during subsequent laser printing.

[0065] In this step, the low - temperature sintering of the mixed tungsten powder can be specifically carried out in the following way:

[0066] First, the mixed tungsten powder is vibrated by ultrasonic waves to prevent particle agglomeration;

[0067] Second, the mixed tungsten powder is placed in a low - pressure environment (for example, 1 Pa to 0.1 Pa), and by introducing an inert gas (such as argon) and applying a radio - frequency power supply to generate plasma, an active layer is formed on the surface of the mixed tungsten powder, which helps to reduce the sintering temperature and promote the bonding between particles;

[0068] Finally, in a hydrogen or nitrogen atmosphere environment, the mixed tungsten powder treated by plasma is heated to a range lower than the conventional sintering temperature (for example, 600 °C to 900 °C) and kept warm for 1 h to 3 h, so that the tungsten powder particles can achieve good bonding.

[0069] In addition, the surface modification treatment of the mixed tungsten powder can be specifically carried out in the following way:

[0070] First, a suitable nanomaterial (such as nano - alumina, carbon nanotubes, or graphene, etc.) is selected as the coating;

[0071] Second, a solution or suspension containing the above - selected nanomaterial is prepared, and then the mixed tungsten powder is immersed in this solution. At the same time, ultrasonic assistance is used for the impregnation process to ensure that each tungsten powder particle can be uniformly coated with the nanomaterial;

[0072] Next, after the tungsten powder is taken out of the solution, it is preliminarily dried under vacuum conditions to remove the solvent, and then subjected to a short-time curing treatment at an appropriate temperature (such as 200°C to 400°C) to make the nano-coating adhere more firmly to the surface of the tungsten powder.

[0073] Both of the above two methods can enhance the interaction force between tungsten powder particles through physical and chemical means without significantly changing the basic properties of the tungsten powder, thereby improving the quality and consistency of the final product.

[0074] In another exemplary embodiment, the present application also provides a method for preparing a tungsten skeleton copper-infiltrated blank. Compared with the previous embodiment, the improvement in this embodiment is that before the stabilization treatment of the mixed tungsten powder, atomic layer deposition is also performed on the mixed tungsten powder, that is, before low-temperature sintering or surface modification treatment, a layer of active substance is deposited on the surface of the mixed tungsten powder particles through atomic layer deposition (ALD, by alternately using gas-phase precursors to undergo self-limiting reactions with the substrate surface to deposit thin films layer by layer) to form a nano-scale protective film, such as alumina, titanium nitride, etc., to improve the dispersibility and binding force between particles, and then solution impregnation and curing treatment are carried out, so as to enhance the interaction force between the mixed tungsten powder particles, and further improve the stability of the forming of the tungsten skeleton copper-infiltrated blank.

[0075] In another exemplary embodiment, the present application also provides a method for preparing a tungsten skeleton copper-infiltrated blank. Compared with the previous embodiment, the improvement in this embodiment is that the suction infiltration method (the infiltration method used in the previous embodiment) is adopted, that is, the prefabricated copper blank is first placed in a graphite crucible, and then the qualified tungsten skeleton is placed on the copper blank.

[0076] In this embodiment, compared with the infiltration method, the suction infiltration method usually requires a lower temperature. The suction infiltration method mainly relies on capillary action to make the molten copper penetrate into the tungsten skeleton, rather than completely melting the copper blank to achieve filling. The lower processing temperature can reduce the impact on the material structure, thereby reducing the risk of thermal stress and deformation. In addition, during the suction infiltration process, the copper gradually penetrates into the pores of the tungsten skeleton in a liquid state. Compared with the infiltration method, it can ensure more uniform distribution of copper, which helps to form a more dense and defect-free composite material structure, thus being beneficial to improving the mechanical strength and electrical conductivity of the final product.

[0077] Next, the present application conducts a performance comparison of the tungsten skeleton copper-infiltrated blank prepared based on the above optimal embodiment with the tungsten skeleton copper-infiltrated blank prepared by the traditional process, including bending strength, electrical conductivity, hardness, etc. The specific comparison results are shown in Table 1:

[0078] Table 1

[0079]

[0080]

[0081] In Table 1, CuW70 represents a copper-impregnated tungsten skeleton blank with a tungsten content of 70% and a copper content of 30%; CuW80 represents a copper-impregnated tungsten skeleton blank with a tungsten content of 80% and a copper content of 20%; CuW90 represents a copper-impregnated tungsten skeleton blank with a tungsten content of 90% and a copper content of 10%. Table 1 shows copper-impregnated tungsten skeleton blanks with different composition ratios prepared by the method of laser printing tungsten skeleton combined with copper infiltration treatment proposed in this application. Compared with the copper-impregnated tungsten skeleton blanks prepared by traditional processes, the copper-impregnated tungsten skeleton blanks prepared based on the method described in this application have significant advantages in improving mechanical properties, especially in terms of bending strength and hardness. This indicates that this application can not only improve the physical and mechanical properties of copper-impregnated tungsten skeleton blanks prepared by traditional processes, but also maintain good electrical properties, and is suitable for the manufacture of high-performance optical module heat sink components.

[0082] Figure 2 is the metallographic image of CuW80 at 50 times magnification prepared based on the above method, Figure 3 is the metallographic image of CuW80 at 100 times magnification prepared based on the above method. Figure 2 It clearly shows that tungsten powders with different particle size ranges were used for printing, which indicates that by reasonably selecting and mixing fine powders, medium powders, and coarse powders, the physical properties of the final product can be optimized. In addition, Figure 2 in it, the particles are connected to each other in the form of point contact. This microscopic spot welding structure helps to enhance the overall strength and stability of the material while maintaining a certain flexibility, which is particularly important for application scenarios that need to withstand mechanical stress. Figure 3 in it, at a higher magnification, obvious pores can be seen between the particles. These pores provide channels for the liquid copper, enabling it to uniformly penetrate the entire tungsten skeleton, thus ensuring the consistency and quality of the copper-impregnated tungsten skeleton blank. Additionally, even at a high magnification, the uniformity of the material structure can still be observed. The connection between the particles is tight and evenly distributed, without large-scale aggregation or void phenomena, further confirming the effectiveness of this method in improving material properties.

[0083] Figure 4 is the metallographic image of copper-impregnated tungsten skeleton at 100 times magnification prepared based on traditional processes. Compared with Figure 2 and Figure 3 the spot welding effect shown in it, Figure 4 shows that the connection between the particles is not tight or uniform enough, which will result in the overall strength of the material being inferior to that of the product prepared by the method of this application. In addition, Figure 4The samples therein show an unsatisfactory pore distribution, which may affect the fluidity and uniformity of the copper solution during the infiltration process. If the pores are too large or unevenly distributed, it will lead to incomplete copper infiltration or too high or too low copper content in local areas, thus affecting the mechanical properties and electrical conductivity of the final product.

[0084] In another exemplary embodiment, the present application further provides a heat sink component for an optical module, which is prepared from a tungsten skeleton copper-infiltrated blank, and the tungsten skeleton copper-infiltrated blank is obtained by the preparation method of a tungsten skeleton copper-infiltrated blank as described in any one of the preceding claims.

[0085] In this embodiment, the heat sink component for an optical module refers to a key component for heat dissipation in an optical communication device. In an optical module, since a large amount of heat is generated during the operation of a laser (such as a laser diode) and other electronic components, if this heat is not dissipated in a timely and effective manner, it will cause the temperature of the components to be too high, thereby affecting their performance, reliability, and service life. Therefore, a heat sink (also known as a radiator or cooling plate) is designed to absorb and conduct this heat to ensure that the optical module can operate stably within an appropriate temperature range. The heat sink is usually made of a material with good thermal conductivity, such as a metal material like copper-tungsten alloy.

[0086] Next, the applicant compares the performance of the heat sink components for optical modules prepared from the tungsten skeleton copper-infiltrated blanks obtained by the method described in the present application and the traditional method. The comparison results are shown in Table 2:

[0087] Table 2

[0088]

[0089] As can be seen from Table 2, the heat sink components for optical modules prepared based on the tungsten skeleton copper-infiltrated blanks obtained by the method described in the present application show superiority in terms of mechanical strength, hardness, heat dissipation efficiency, and dimensional stability, and are particularly suitable for application scenarios with high performance requirements. In contrast, although the products prepared by traditional processes can meet basic application requirements, their performance in high-performance scenarios is not as good as the former.

[0090] The above are only the preferred embodiments of the present application, and do not limit the patent scope of the present application accordingly. Any equivalent structural or equivalent process transformation made by using the content of the specification and drawings of the present application, or directly or indirectly applied in other related technical fields, shall be included in the patent protection scope of the present application by the same token.

Claims

1. A tungsten skeleton copper infiltration blank, characterized in that: The components of the tungsten skeleton copper infiltration blank and the mass percentage of each component are: Mixed tungsten powder: 70wt% to 90wt%; Copper: 10wt% to 30wt%; in, The mixed tungsten powder comprises: Fine powder: 5wt% to 30wt%; Medium powder: 5wt% to 20wt%; Coarse powder: 60wt% to 90wt%.

2. A method for preparing a tungsten skeleton copper infiltrated blank, characterized in that: The preparation method comprises: Tungsten powders of different particle sizes are graded, mixed and sieved to obtain mixed tungsten powder; Obtaining a tungsten skeleton by laser printing based on the mixed tungsten powder; Determining the density of the tungsten skeleton; The tungsten skeleton that has passed the density judgment is subjected to copper infiltration treatment to obtain a tungsten skeleton copper infiltrated blank.

3. The method for preparing a tungsten skeleton copper infiltration blank according to claim 2, characterized in that: Printing is performed in an environment where the oxygen content is less than 0.04% ppm.

4. The method for preparing a tungsten skeleton copper infiltration blank according to claim 2, characterized in that: Determining the density of the tungsten skeleton includes: Determine the volume of the tungsten framework; Weigh the printed tungsten skeleton to obtain the actual mass; The actual density of the tungsten skeleton is calculated based on the volume and the actual mass, and compared with the standard density of the tungsten skeleton. If the actual density is close to or equal to the standard density, the density is judged to be qualified; otherwise, it is unqualified.

5. The method for preparing a tungsten skeleton copper infiltration blank according to claim 2, characterized in that: The tungsten skeleton having qualified density is infiltrated with copper by using a melt infiltration method or an imbibition infiltration method.

6. The method for preparing a tungsten skeleton copper infiltration blank according to claim 5, characterized in that: Before the copper infiltration treatment, the tungsten fixture is preheated.

7. The method for preparing a tungsten skeleton copper infiltration blank according to claim 5, characterized in that: The copper infiltration treatment is performed at a temperature of 1200°C to 1450°C.

8. The method for preparing a tungsten skeleton copper infiltration blank according to claim 5, characterized in that: The copper infiltration treatment time is 10h to 45h.

9. The method for preparing a tungsten skeleton copper infiltration blank according to claim 5, characterized in that: During the copper infiltration process, the copper liquid is subjected to ultrasonic vibration.

10. An optical module heat sink component, characterized in that: The optical module heat sink component is prepared from a tungsten skeleton copper infiltrated blank, and the tungsten skeleton copper infiltrated blank is prepared by the preparation method of a tungsten skeleton copper infiltrated blank according to any one of claims 2 to 9.

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