Mask and method of manufacturing mask

Abstract

The invention relates to a mask and a method of manufacturing the mask. The mask includes: a frame in which at least one first opening defined in a central portion of the frame and at least one second opening defined in an edge portion of the frame are defined; a first mask sheet disposed on the frame and in which a plurality of deposition openings each overlapping a corresponding one of the at least one first opening are defined; and a second mask sheet surrounding at least a portion of the first mask sheet on the frame, and including a material different from a material of the first mask sheet.

Description

Technical Field

[0001] The embodiments relate to a mask and a method of manufacturing a mask. More specifically, the embodiments relate to a mask used in a deposition process and a method of manufacturing a mask. Background Art

[0002] A display device displays an image to provide visual information to a user. The display device includes a liquid crystal display, a light emitting diode display, an organic light emitting diode display, and a quantum dot display.

[0003] A mask may be used to manufacture a display device. The mask may be fixed to a desired position on a substrate included in the display device. A deposition material is sprayed toward the fixed mask and the substrate and passes through deposition openings defined in the mask to form a component (e.g., a light emitting layer) of the display device. Summary of the Invention

[0004] The embodiments provide a mask that controls deformation of a frame.

[0005] The embodiments provide a method of manufacturing a mask.

[0006] The mask in the embodiments of the present disclosure includes: a frame in which at least one first opening and at least one second opening are defined, at least one first opening being defined in a central portion of the frame and at least one second opening being defined in an edge portion of the frame; a first mask sheet disposed on the frame and having a plurality of deposition openings defined therein that respectively overlap corresponding first openings among the at least one first opening; and a second mask sheet surrounding at least a portion of the first mask sheet on the frame, and the second mask sheet includes a material different from that of the first mask sheet.

[0007] In an embodiment, the second mask sheet may directly contact the edge portion of the frame.

[0008] In an embodiment, the first mask sheet may include a magnetic material.

[0009] In an embodiment, the first mask sheet may include a first conductive layer and a second conductive layer disposed on the first conductive layer.

[0010] In an embodiment, the first conductive layer may include at least one of titanium (Ti) and titanium nitride (TiN), and the second conductive layer may include at least one of cobalt (Co) and nickel (Ni).

[0011] In an embodiment, the mask may further include: an alignment portion disposed on the frame, adjacent to the second mask sheet, and having an alignment mark defined therein, and the alignment portion may include a material the same as that of the first conductive layer.

[0012] In an embodiment, the alignment mark may overlap with the second opening.

[0013] In an embodiment, the alignment portion may include a first layer corresponding to the first conductive layer and a second layer disposed on the first layer and corresponding to the second conductive layer, and the first layer may include a material the same as that of the first conductive layer, and the second layer may include a material the same as that of the second conductive layer.

[0014] In an embodiment, the alignment portion may be spaced apart from the first mask sheet.

[0015] In an embodiment, a portion of the first mask sheet disposed between two adjacent deposition openings among the plurality of deposition openings may have an inverse tapered shape in a cross-sectional view.

[0016] In an embodiment, a plurality of dummy openings penetrating the second mask sheet in a thickness direction may be defined in the second mask sheet.

[0017] In an embodiment, a portion of the second mask sheet disposed between two adjacent dummy openings among the plurality of dummy openings may have a tapered shape in a cross-sectional view.

[0018] A method of manufacturing a mask in an embodiment of the present disclosure includes: forming a preliminary mask sheet on a preliminary frame including a central region and an edge region adjacent to the central region; forming a first preliminary conductive layer on the preliminary mask sheet; forming a second preliminary conductive layer on at least a portion of the first preliminary conductive layer; forming a frame, in which at least one first opening and at least one second opening are defined by removing a portion of the preliminary frame, at least one first opening is defined in the central region, and at least one second opening is defined in the edge region; forming a first mask sheet, in which a plurality of deposition opening regions are defined by removing a portion of each of the first preliminary conductive layer and the second preliminary conductive layer in the central region; and forming a second mask sheet, in which a plurality of dummy openings are defined by removing a portion of the first preliminary conductive layer in the edge region.

[0019] In an embodiment, the method may further include forming an alignment portion by removing a portion of the first preliminary conductive layer in the edge region, and an alignment mark is defined in the alignment portion.

[0020] In an embodiment, forming the alignment portion and forming the second mask sheet may be performed by the same process.

[0021] In an embodiment, the method may further include forming an alignment pattern in the edge region of the preliminary frame and covering the alignment pattern with the preliminary mask sheet, and forming the alignment pattern and covering the alignment pattern may be performed before forming the preliminary mask sheet.

[0022] In an embodiment, the second preliminary conductive layer may overlap with the alignment pattern in a plan view.

[0023] In an embodiment, the method may further include removing the alignment pattern and forming an alignment portion in a region corresponding to the alignment pattern by removing each of the first preliminary conductive layer and the second preliminary conductive layer, and alignment marks are defined in the alignment portion.

[0024] In an embodiment, removing the alignment pattern and forming the frame may be performed simultaneously.

[0025] In an embodiment, forming the second preliminary conductive layer may include planarizing the second preliminary conductive layer such that an upper surface of the second preliminary conductive layer may be substantially flat and aligned with an upper surface of the first preliminary conductive layer.

[0026] In a mask in an embodiment, the mask may include: a frame in which a first opening and a second opening are defined, the first opening being defined in a central portion of the mask and the second opening being defined in an edge portion of the mask; a first mask sheet disposed on the frame and having a plurality of deposition openings defined therein; and a second mask sheet surrounding at least a portion of the first mask sheet. Further, the second mask sheet may contact an edge portion of the frame. Thus, in a deposition process using the mask, the second mask sheet may distribute a bonding force applied to a central portion of the frame to an edge portion of the frame where the second mask sheet is disposed. Thus, it is possible to prevent a central portion of the frame from bending toward a substrate during the deposition process, and the accuracy and consistency of the deposition process can be improved.

[0027] In a method of manufacturing a mask in an embodiment of the present disclosure, in a central region of a preliminary mask sheet, a first mask sheet may be formed by removing a first preliminary conductive layer and a second preliminary conductive layer that fill openings defined in the preliminary mask sheet. Further, in an edge region of the preliminary mask sheet, a second mask sheet may be formed since a portion of the preliminary mask sheet is not removed in an etching process. Thus, the process time and cost of a manufacturing process of the mask can be reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Exemplary, non-limiting embodiments will be understood more clearly from the following detailed description in conjunction with the accompanying drawings.

[0029] Figure 1 is a perspective view showing an embodiment of a mask according to the present disclosure.

[0030] Figure 2 is a disassembled Figure 1 exploded perspective view of the mask.

[0031] Figure 3 is a view showing the use ofFigure 1 Cross-sectional view of the deposition process of the mask.

[0032] Figure 4 It shows Figure 1 Planar view of the mask.

[0033] Figure 5 It shows Figure 4 Enlarged plan view of region A.

[0034] Figure 6 It shows Figure 1 Cross-sectional view of an embodiment of the cross-section taken along line I-I' of.

[0035] Figure 7 , Figure 8 , Figure 9 , Figure 10 , Figure 11 , Figure 12 , Figure 13 , Figure 14 , Figure 15 , Figure 16 and Figure 17 It shows an embodiment of the method of manufacturing the mask of Figure 1 Cross-sectional view.

[0036] Figure 18 It shows Figure 1 Cross-sectional view of another embodiment of the cross-section taken along line I-I' of.

[0037] Figure 19 It shows Figure 18 Enlarged plan view of region B.

[0038] Figure 20 , Figure 21 , Figure 22 , Figure 23 , Figure 24 , Figure 25 and Figure 26 It shows another embodiment of the method of manufacturing the mask of Figure 1 Cross-sectional view. DETAILED DESCRIPTION

[0039] Hereinafter, the display device in the embodiments will be described in more detail with reference to the accompanying drawings. The same reference numerals are used for the same components in the drawings, and redundant descriptions of the same components will be omitted.

[0040] It will be understood that when an element is referred to as being "on" another element, the element can be directly on the other element, or there can be an intervening element between the element and the other element. In contrast, when an element is referred to as being "directly on" another element, there is no intervening element.

[0041] It will be understood that although the terms “first,” “second,” “third,” etc. may be used herein to describe various elements, components, regions, layers, and / or sections, these elements, components, regions, layers, and / or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer, or section from another. Thus, a “first element,” “first component,” “first region,” “first layer,” or “first section” discussed below could be termed a “second element,” “second component,” “second region,” “second layer,” or “second section” without departing from the teachings herein.

[0042] The terms used herein are for the purpose of describing particular embodiments only and are not intended to be limiting. As used herein, unless the context clearly dictates otherwise, the singular forms “a,” “an,” and “the” are intended to include the plural forms including “at least one.” “Or” means “and / or.” As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items. It will also be understood that when used in this specification, the terms “comprises” and / or “comprising,” “includes” and / or “including” specify the presence of the stated features, regions, wholes, steps, operations, elements, components, and / or groups thereof, but do not preclude the presence or addition of one or more other features, regions, wholes, steps, operations, elements, components, and / or groups thereof.

[0043] In addition, spatially relative terms such as “beneath” or “bottom” and “above” or “top” may be used herein to describe the relationship of one element to another as shown in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in addition to the orientation depicted in the figures. For example, if the device is flipped in one figure, an element described as “beneath” other elements will then be oriented “above” the other elements. Thus, the exemplary term “beneath” can encompass both an orientation of “beneath” and “above” depending on the specific orientation of the figure. Similarly, if the device is flipped in one figure, an element described as “below” or “under” other elements will then be oriented “above” the other elements. Thus, the exemplary terms “below” or “under” can encompass both above and below orientations.

[0044] Taking into account the measurements under discussion and the errors associated with the measurement of a particular quantity (i.e., the limitations of the measurement system), as used herein, "about" or "approximately" includes the stated value and means within the acceptable deviation for the particular value determined by a person of ordinary skill in the art. Terms such as "about" can mean within one or more standard deviations, or within ±30%, ±20%, ±10%, or ±5% of the stated value.

[0045] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by a person of ordinary skill in the art to which this disclosure pertains. It will also be understood that terms (such as those defined in a general dictionary) should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and this disclosure, and will not be interpreted in an idealized or overly formal sense.

[0046] Figure 1 is a perspective view showing an embodiment of a mask according to the present disclosure. Figure 2 is a disassembled Figure 1 exploded perspective view of the mask. Figure 3 is a cross-sectional view showing a deposition process using Figure 1 the mask. Figure 4 is a plan view showing Figure 1 the mask. For example, Figure 3 is a cross-sectional view taken along line X-Y showing Figure 1 the mask MK and other components (e.g., substrate SUB and deposition apparatus DA).

[0047] Referring to Figure 1 , Figure 2 , Figure 3 and Figure 4 , the mask MK in the embodiments of the present disclosure may include a frame 100, a first mask sheet 200, a second mask sheet 300, and an alignment portion 400. The mask MK may be used in the process of manufacturing a display device. In an embodiment, for example, the mask MK may be a deposition mask for depositing a deposition material DM on a substrate SUB. The deposition material DM may be a material for forming a light-emitting layer that emits light in a display device (e.g., an organic light-emitting material).

[0048] In this specification, a plane may be defined by a first direction DR1 and a second direction DR2 that intersects the first direction DR1. In an embodiment, for example, the first direction DR1 and the second direction DR2 may be perpendicular to each other. In addition, a third direction (also referred to as the thickness direction) DR3 may be perpendicular to the plane.

[0049] The frame 100 may be parallel to the plane defined by the first direction DR1 and the second direction DR2. In a plan view, the frame 100 may have a circular shape. However, the present disclosure is not limited thereto, and in a plan view, the frame 100 may have a polygonal shape. In an embodiment, the frame 100 may include a silicon wafer.

[0050] At least one first opening 120 and at least one second opening 140 may be defined in the frame 100. The first opening 120 and the second opening 140 may penetrate the frame 100 in the third direction DR3.

[0051] The first opening 120 may be defined in the central portion of the frame 100. A plurality of first openings 120 may be arranged along the first direction DR1 and the second direction DR2. In a plan view, the shape of the first opening 120 may be quadrilateral (e.g., square). However, the present disclosure is not limited thereto, and in a plan view, the first opening 120 may have various shapes.

[0052] The second opening 140 may be provided in the edge portion of the frame 100. The size of the second opening 140 may be different from the size of the first opening 120. However, the present disclosure is not limited thereto.

[0053] The first mask sheet 200 may be disposed on the first frame 100. The first mask sheet 200 may be disposed to correspond to the first opening 120. The first mask sheet 200 may overlap the first opening 120. In addition, the first mask sheet 200 may contact the portion of the frame 100 adjacent to the first opening 120. Accordingly, the first mask sheet 200 may completely overlap the first opening 120 defined in the frame 100 and be fixed to the frame 100.

[0054] The first mask sheet 200 may include a first conductive layer 202 and a second conductive layer 204. The second conductive layer 204 may be disposed on the first conductive layer 202. In an embodiment, for example, the second conductive layer 204 may cover the rear surface and the side surfaces of the first conductive layer 202.

[0055] In an embodiment, each of the first conductive layer 202 and the second conductive layer 204 may include a metal material. In an embodiment, the first conductive layer 202 and the second conductive layer 204 may include different materials from each other. In an embodiment, for example, the first conductive layer 202 may include titanium (Ti) and / or titanium nitride (TiN), etc. These may be used alone or in combination with each other. In addition, the second conductive layer 204 may include cobalt (Co) and / or nickel (Ni), etc. These may be used alone or in any combination with each other.

[0056] In an embodiment, the first mask sheet 200 may include a magnetic material. In the case where the first mask sheet 200 includes a magnetic material, the mask MK may be coupled to the substrate SUB by magnetic force generated between the mask MK and the substrate SUB. In an embodiment, for example, the mask MK and the substrate SUB may be coupled to an electrostatic chuck (“ESC”). Specifically, a platen including the electrostatic chuck may be disposed on the other side of the substrate SUB opposite to the side facing the mask MK. Accordingly, when the mask MK is coupled to the substrate SUB, the accuracy of coupling the mask MK may be improved, and a display device having a relatively high resolution may be manufactured.

[0057] A plurality of deposition openings 220 penetrating the first mask sheet 200 in the third direction DR3 may be defined in the first mask sheet 200. The deposition openings 220 may be arranged along the first direction DR1 and the second direction DR2. The deposition openings 220 may overlap with the first openings 120. In an embodiment, the size of each of the deposition openings 220 may be smaller than the size of each of the first openings 120.

[0058] In an embodiment, a portion of the first mask sheet 200 disposed between two adjacent deposition openings 220 among the plurality of deposition openings 220 may have an inversely tapered shape in a cross-sectional view. Specifically, the first conductive layer 202 and the second conductive layer 204 disposed between two adjacent deposition openings 220 may together have an inversely tapered shape in a cross-sectional view. However, the present disclosure is not limited thereto.

[0059] In an embodiment, the average width of each of the deposition openings 220 in the first direction DR1 or the second direction DR2 may decrease toward the third direction DR3. In another embodiment, the average width of each of the deposition openings 220 may increase toward the third direction DR3. In another embodiment, the average width of each of the deposition openings 220 may be substantially the same toward the third direction DR3.

[0060] The deposition material DM may penetrate the first mask sheet 200 through the deposition openings 220. Specifically, the deposition material DM ejected from the deposition device DA onto the mask MK may penetrate the first openings 120 and the deposition openings 220 and may be deposited on the substrate SUB. Depending on the position of the substrate SUB on which the deposition material DM is deposited, each of the deposition openings 220 may have various shapes and structures.

[0061] The second mask sheet 300 may be disposed on the frame 100. A dummy opening 320 penetrating the second mask sheet 300 in the third direction DR3 may be defined in the second mask sheet 300. The dummy opening 320 may be disposed along the first direction DR1 and the second direction DR2. In an embodiment, in a cross-sectional view, the second mask sheet 300 may have a tapered shape. However, the present disclosure is not limited thereto.

[0062] In an embodiment, an average width of the dummy opening 320 in the first direction DR1 or the second direction DR2 may increase toward the third direction DR3. In another embodiment, the average width of the dummy opening 320 may decrease toward the third direction DR3. In another embodiment, the average width of the dummy opening 320 may be substantially the same toward the third direction DR3.

[0063] In an embodiment, the second mask sheet 300 may contact an edge portion of the frame 100. In addition, the second mask sheet 300 may surround at least a portion of the first mask sheet 200. Accordingly, the second mask sheet 300 may distribute a bonding force applied to a central portion of the frame 100 to an edge portion of the frame 100 on which the second mask sheet 300 is disposed. Accordingly, it is possible to prevent a phenomenon in which the central portion of the frame 100 is bent toward the substrate SUB during a deposition process, and the accuracy and consistency of the deposition process may be improved.

[0064] In an embodiment, the second mask sheet 300 may include a material different from that of the first mask sheet 200. The second mask sheet 300 may include an inorganic material. In an embodiment, for example, the inorganic material may include silicon (Si), silicon nitride (SiN x ), silicon oxide (SiO x ), or silicon oxynitride (SiN x O y ) and the like. These may be used alone or in any combination with each other.

[0065] The alignment portion 400 may be disposed on the frame 100. The alignment portion 400 may overlap with the second opening 140. In addition, the alignment portion 400 may be disposed adjacent to the second mask sheet 300.

[0066] At least one alignment portion 400 may be provided. In an embodiment, for example, a plurality of alignment portions 400 may be provided (for example, the number of alignment portions 400 is two or more). Specifically, a part of the plurality of alignment portions 400 may be spaced apart from the first mask sheet 200 and adjacent to the second mask sheet 300. In addition, another part of the plurality of alignment portions 400 may be adjacent to each of the first mask sheet 200 and the second mask sheet 300. However, the position of the alignment portion 400 is not limited thereto, and the alignment portion 400 may have various arrangements and numbers.

[0067] An alignment mark 420 penetrating the alignment portion 400 in the third direction DR3 may be defined in the alignment portion 400. In a plan view, the alignment mark 420 may be a hole having a predetermined shape.

[0068] The alignment portion 400 may adjust the first mask sheet 200 to be disposed at a predetermined position on the substrate SUB. Specifically, the alignment mark 420 may be combined with an alignment pattern provided in a predetermined position of the substrate SUB such that the position of the deposition opening 220 defined in the first mask sheet 200 may correspond to the predetermined position of the substrate SUB.

[0069] Figure 5 is a magnified plan view of Figure 4 region A shown. Figure 6 is a cross-sectional view of an embodiment of a cross-section taken along Figure 1 line I-I'. In an embodiment, for example, Figure 5 is a magnified view of the second mask sheet 300 included in the mask MK (see Figure 1 ).

[0070] Referring to Figure 5 and Figure 6 , the alignment portion 400 may include a material the same as that of the first conductive layer 202. The alignment portion 400 may be formed by the same process as the first conductive layer 202. In an embodiment, for example, the alignment portion 400 may include titanium (Ti) and / or titanium nitride (TiN), etc. These may be used alone or in any combination with each other.

[0071] The alignment mark 420 may overlap with the second opening 140. In an embodiment, for example, the width of the alignment mark 420 in the first direction DR1 may be smaller than the width of the second opening 140 in the first direction DR1. The alignment mark 420 is defined as a hole exposing the second opening 140 and may be connected to the second opening 140.

[0072] Figure 7 , Figure 8 , Figure 9 ,Figure 10 , Figure 11 , Figure 12 , Figure 13 , Figure 14 , Figure 15 , Figure 16 and Figure 17 are cross-sectional views showing embodiments of a method of manufacturing a Figure 1 mask.

[0073] Figure 7 is a cross-sectional view showing each part of the preliminary frame 100a and the preliminary mask sheet 300a of the setting corresponding to the Figure 1 cross-section corresponding to the line I-I' of

[0074] Referring to Figure 7 , the preliminary frame 100a may include a central region CA and an edge region EA. The central region CA may correspond to the region on the frame (e.g., the Figure 1 frame 100) where the first mask sheet (e.g., the Figure 1 first mask sheet 200) of

[0075] is formed. The edge region EA may be a region adjacent to the central region CA. The edge region EA may be a region adjacent to the side of the preliminary frame 100a that is disposed outside the preliminary frame 100a.

[0076] The preliminary mask sheet 300a may be formed on the preliminary frame 100a. In an embodiment, for example, the preliminary mask sheet 300a may overlap the central region CA and the edge region EA of the preliminary frame 100a. x ) and silicon oxide (SiO x ) or silicon oxynitride (SiN x O y ), etc. For example, these may be used alone or in any combination with each other.

[0077] Referring to Figure 8 and Figure 9 , the photoresist PR1 may be formed on the preliminary mask sheet 300a. Specifically, the photoresist PR1 may be formed to correspond to a predetermined position on the preliminary mask sheet 300a. The photoresist PR1 may be formed at a predetermined position in each of the central region CA and the edge region EA on the preliminary mask sheet 300a. In an embodiment, the predetermined position may be the position of the preliminary mask sheet 300b where the Figure 9 is formed. In an alternative embodiment, the predetermined position may be the position that defines a plurality of openings OP1.

[0078] After the photoresist PR1 is formed, light can be irradiated onto the preliminary mask sheet 300a and the photoresist PR1. When the light is irradiated, a part of the preliminary mask sheet 300a can be removed.

[0079] In an embodiment, the photoresist PR1 can include a positive photoresist. In the case where the photoresist PR1 includes a positive photoresist, the part of the preliminary mask sheet 300a that does not overlap with the photoresist PR1 can be removed. In an alternative embodiment, the photoresist PR1 can include a negative photoresist. In the case where the photoresist PR1 can include a negative photoresist, the part of the preliminary mask sheet 300a that overlaps with the photoresist PR1 can be removed.

[0080] A part of the preliminary mask sheet 300a can be removed to form a preliminary mask sheet 300b having a plurality of openings OP1 defined therein. Figure 9 The preliminary mask sheet 300b can be a mask sheet in which a part of the preliminary mask sheet 300a has been removed. Figure 8 part of the preliminary mask sheet 300a

[0081] The openings OP1 can penetrate the preliminary mask sheet 300b in the third direction DR3. A part of the upper surface of the preliminary frame 100a can be exposed through the openings OP1. In an embodiment, the width of each of the openings OP1 in the first direction DR1 can be different. However, the present disclosure is not limited thereto.

[0082] Referring to Figure 10 , a first preliminary conductive layer CL1 can be formed on the preliminary mask sheet 300b. Specifically, the first preliminary conductive layer CL1 can fill the openings OP1 (see Figure 9 ) and cover the upper surface and side surfaces of the preliminary mask sheet 300b. In an embodiment, the first preliminary conductive layer CL1 can include titanium (Ti) and / or titanium nitride (TiN), etc. These can be used alone or in any combination with each other.

[0083] Openings OP2 corresponding to the openings OP1 can be defined in the first preliminary conductive layer CL1. Each of the openings OP2 can be defined to correspond to each of the openings OP1. Since the openings OP1 are filled with the first preliminary conductive layer CL1, the width of the openings OP2 in the first direction DR1 becomes smaller than the width of the openings OP1 in the first direction DR1.

[0084] Referring to Figure 11, a photoresist PR2 can be formed on the first preliminary conductive layer CL1. The photoresist PR2 can be set at a predetermined position corresponding to the first preliminary conductive layer CL1. After the photoresist PR2 is formed, light can be irradiated onto the first preliminary conductive layer CL1. When irradiating light, a part of the first preliminary conductive layer CL1 can be removed.

[0085] In an embodiment, the photoresist PR2 can include a positive photoresist. In the case where the photoresist PR2 includes a positive photoresist, a part of the first preliminary conductive layer CL1 that does not overlap with the photoresist PR2 can be removed. In an alternative embodiment, the photoresist PR2 can include a negative photoresist. In the case where the photoresist PR2 includes a negative photoresist, a part of the first preliminary conductive layer CL1 that overlaps with the photoresist PR2 can be removed.

[0086] Referring to Figure 12 , a part of the first preliminary conductive layer CL1 can be removed to form a second mask sheet 300 in which a dummy opening 320 is defined. The first preliminary conductive layer CL1 can be completely removed on the second mask sheet 300. The dummy opening 320 can correspond to the first opening (e.g., Figure 9 the opening OP1). That is to say, the dummy opening 320 and the first opening OP1 can be substantially the same.

[0087] The non-removed part of the first preliminary conductive layer CL1 can form an alignment part 400. The alignment part 400 can be formed between the second mask sheet 300 and the preliminary mask sheet 300b where the first preliminary conductive layer CL1 is not removed. A part of the first preliminary conductive layer CL1 forming the alignment part 400 can be removed to define an alignment mark 420 that exposes the upper surface of the preliminary frame 100a. In an embodiment, the alignment part 400 and the second mask sheet 300 can be formed by the same process.

[0088] Referring to Figure 13 , a second preliminary conductive layer CL2 can be formed on the first preliminary conductive layer CL1. In an embodiment, for example, the material for forming the second preliminary conductive layer CL2 can be deposited on the first preliminary conductive layer CL1 provided in the central region CA. The second preliminary conductive layer CL2 can fill the opening OP2 (see Figure 12 ).

[0089] In an embodiment, the second preliminary conductive layer CL2 can be formed on the first preliminary conductive layer CL1 by electroplating. The material for forming the second preliminary conductive layer CL2 can be different from the material for forming the first preliminary conductive layer CL1. In an embodiment, for example, the second preliminary conductive layer CL2 can include cobalt (Co) and / or nickel (Ni), etc.

[0090] Referring toFigure 14 Part of the second preliminary conductive layer CL2 formed on the first preliminary conductive layer CL1 can be removed. In an embodiment, for example, the upper portion of the second preliminary conductive layer CL2 can be removed by a planarization process. The planarization process can be a chemical mechanical polishing (“CMP”) process. In an embodiment, by planarizing the second preliminary conductive layer CL2, a substantially flat upper surface can be formed together with the first preliminary conductive layer CL1. For example, the upper surface of the second preliminary conductive layer CL2 can be aligned with the upper surface of the first preliminary conductive layer CL1.

[0091] Referring to Figure 15 , a photoresist PR3 can be formed on the rear surface of the preliminary frame 100a. The photoresist PR3 can be disposed to correspond to a predetermined position of the preliminary frame 100a. After the photoresist PR3 is formed, light can be irradiated onto the rear surface of the preliminary frame 100a. When the light is irradiated, a part of the preliminary frame 100a can be removed.

[0092] In an embodiment, the photoresist PR3 can include a positive photoresist. In the case where the photoresist PR3 includes a positive photoresist, the portion of the preliminary frame 100a that does not overlap with the photoresist PR3 can be removed. In an alternative embodiment, the photoresist PR3 can include a negative photoresist. In the case where the photoresist PR3 includes a negative photoresist, the portion of the preliminary frame 100a that overlaps with the photoresist PR3 can be removed.

[0093] Referring to Figure 16 and Figure 17 , a part of the preliminary frame 100a (see Figure 15 ) can be removed to form a frame 100 in which at least one first opening 120 and at least one second opening 140 are defined. The first opening 120 and the second opening 140 can penetrate the frame 100 in a third direction DR3. The second opening 140 can overlap with the alignment mark 420. Therefore, the second opening 140 and the alignment mark 420 can be connected to each other to form a single hole that penetrates both the frame 100 and the alignment portion 400.

[0094] After the frame 100 is formed, a photoresist PR4 can be formed on the second preliminary conductive layer CL2. After the photoresist PR4 is formed, light can be irradiated to remove the portions of each of the first preliminary conductive layer CL1 and the preliminary mask sheet 300b that overlap with the first opening 120.

[0095] In an embodiment, the photoresist PR4 may include a positive photoresist. When the photoresist PR4 includes a positive photoresist, the photoresist PR4 may cover the upper surface of the second preliminary conductive layer CL2. Then, light is irradiated, and the portions of the second preliminary conductive layer CL2 that do not overlap with the photoresist PR4 may be removed.

[0096] In an alternative embodiment, the photoresist PR4 may include a negative photoresist. When the photoresist PR4 includes a negative photoresist, the photoresist PR4 may cover the upper surfaces of all components except the second preliminary conductive layer CL2. Then, by irradiating light, the portions of the second preliminary conductive layer CL2 that overlap with the photoresist PR4 may be removed.

[0097] After irradiating light, by removing the portions of each of the first preliminary conductive layer CL1 and the preliminary mask sheet 300b that overlap with the first opening 120, a first mask sheet 200 in which a deposition opening 220 is defined may be formed. The deposition opening 220 may correspond to the portion where the preliminary mask sheet 300b has been removed.

[0098] The first mask sheet 200 may include a first conductive layer 202 and a second conductive layer 204. The first conductive layer 202 may correspond to the portion remaining after removing a part of the first preliminary conductive layer CL1. The second conductive layer 204 may correspond to the second preliminary conductive layer CL2.

[0099] After removing the photoresist PR4 formed on the second conductive layer 204, a Figure 6 mask MK may be manufactured.

[0100] As described above with reference to Figures 7 to 17 In the central region CA of the preliminary mask sheet 300b, since each of the first preliminary conductive layer CL1 and the second preliminary conductive layer CL2 that fills the opening OP2 defined in the preliminary mask sheet 300b has been removed, the first mask sheet 200 may be formed. In addition, in the edge region EA of the preliminary mask sheet 300b, a part of the preliminary mask sheet 300b has not been removed during the etching process, so that the second mask sheet 300 may be formed. Therefore, the time and cost of the manufacturing process of the mask MK can be reduced.

[0101] Figure 18 is a cross-sectional view of another embodiment showing a cross-section taken along line I-I' of Figure 1 is a cross-sectional view of another embodiment showing a cross-section taken along line I-I' of Figure 19 is a magnified plan view showing Figure 18 region B of

[0102] Except for the alignment portion 400', the Figure 18 mask is the same as Figure 6is substantially the same as the mask MK. Hereinafter, the content that duplicates the content described with reference to Figure 6 will be omitted or simplified.

[0103] Referring to Figure 18 and Figure 19 , the mask may include an alignment portion 400'. The alignment portion 400' may have a multi-layer structure. In an embodiment, for example, the alignment portion 400' may have two layers. Specifically, the alignment portion 400' may include a first layer 402 and a second layer 404. The first layer 402 and the second layer 404 may include different materials from each other.

[0104] The first layer 402 may include the same material as the material of the first conductive layer 202. In an embodiment, for example, the first layer may include titanium (Ti) and / or titanium nitride (TiN), etc. These may be used alone or in any combination with each other.

[0105] The second layer 404 may be disposed on the first layer 402. The second layer 404 may include the same material as the material of the second conductive layer 204. In an embodiment, for example, the second layer 404 may include cobalt (Co) and / or nickel (Ni), etc. These may be used alone or in any combination with each other.

[0106] An alignment mark 420' may be defined in the alignment portion 400'. The alignment mark 420' may be a component for aligning the mask when a substrate (e.g., Figure 3 substrate SUB) and the mask are combined with each other. The alignment mark 420' may overlap with the second opening 140. The alignment mark 420' may be a groove in which the first layer 402 is recessed in the third direction DR3. In a plan view, the alignment mark 420' may have various shapes for bonding with the substrate.

[0107] Figure 20 , Figure 21 , Figure 22 , Figure 23 , Figure 24 , Figure 25 and Figure 26 are cross-sectional views showing another embodiment of a method of manufacturing a mask for Figure 1 .

[0108] Referring to Figure 20 and Figure 21 , an alignment pattern 500 may be formed on the preliminary frame 100a. In an embodiment, for example, the alignment pattern 500 may be formed on the edge region EA of the preliminary frame 100a. In a plan view, the alignment pattern 500 may have a shape corresponding to the shape of an alignment mark (e.g., Figure 19 the alignment mark 420' in

[0109] The preliminary mask sheet 300a may be formed on the alignment pattern 500. In an embodiment, for example, the preliminary mask sheet 300a may cover each of the preliminary frame 100a and the alignment pattern 500. In an embodiment, the preliminary mask sheet 300a may have a substantially flat surface. In an alternative embodiment, the preliminary mask sheet 300a may form a step around the alignment pattern 500 and have a substantially uniform thickness along the contour of the alignment pattern 500.

[0110] A portion of the preliminary mask sheet 300a may be removed to form a preliminary mask sheet 300b in which an opening OP1 is defined. In an embodiment, for example, the opening OP1 that exposes a portion of the upper surface of the preliminary frame 100a and the alignment pattern 500 may be defined in the preliminary mask sheet 300b. The preliminary mask sheet 300a may be completely removed around the alignment pattern 500. A portion of the preliminary mask sheet 300a may be removed by an etching process.

[0111] Referring to Figure 22 , a first preliminary conductive layer CL1 may be formed on the preliminary mask sheet 300b. The first preliminary conductive layer CL1 may cover the upper surface and the side surfaces of the preliminary mask sheet 300b and the alignment pattern 500. An opening OP2 corresponding to the position of the opening OP1 (see Figure 21 ) may be defined in the first preliminary conductive layer CL1.

[0112] Referring to Figure 23 , a second preliminary conductive layer CL2 may be formed on the first preliminary conductive layer CL1. In an embodiment, for example, the second preliminary conductive layer CL2 may be formed on the first preliminary conductive layer CL1 throughout the edge region EA and the center region CA. The second preliminary conductive layer CL2 may fill the openings OP2 (see Figure 22 ) provided in the edge region EA and the center region CA.

[0113] Referring to Figure 24 , a portion of the second preliminary conductive layer CL2 may be removed. In an embodiment, for example, by a planarization process, the second preliminary conductive layer CL2 may have a substantially flat upper surface with the first preliminary conductive layer CL1. For example, the upper surface of the second preliminary conductive layer CL2 may be aligned with the upper surface of the first preliminary conductive layer CL1. The planarization process may be a CMP process.

[0114] Referring to Figure 25 and Figure 26 , a portion of the preliminary frame 100a may be removed to form a frame 100 in which at least one of a first opening 120 and a second opening 140 is defined. The alignment mark 420' may overlap with the second opening 140.

[0115] Since the portions of each of the preliminary mask sheet 300b, the first preliminary conductive layer CL1, and the second preliminary conductive layer CL2 that overlap with the first opening 120 are removed, the first mask sheet 200 can be formed. The process of removing a portion of each of the preliminary mask sheet 300b, the first preliminary conductive layer CL1, and the second preliminary conductive layer CL2 can be an etching process using a photoresist PR5.

[0116] An alignment portion 400' can be formed by removing a portion of each of the first preliminary conductive layer CL1 and the second preliminary conductive layer CL2. The portions of each of the first preliminary conductive layer CL1 and the second preliminary conductive layer CL2 that overlap with the alignment marks 420' may not be removed. The non-removed portions of each of the first preliminary conductive layer CL1 and the second preliminary conductive layer CL2 can form the alignment portion 400'.

[0117] By removing a portion of each of the first preliminary conductive layer CL1 and the second preliminary conductive layer CL2 provided on the preliminary mask sheet 300b (provided between the alignment portion 400' and the first mask sheet 200), a second mask sheet 300 in which dummy openings 320 are defined can be formed. In this case, the removed portions of each of the first preliminary conductive layer CL1 and the second preliminary conductive layer CL2 may not overlap with each of the first opening 120 and the second opening 140. In an embodiment, the alignment portion 400' and the second mask sheet 300 can be formed by the same process.

[0118] Figure 18 The mask can be manufactured by removing the photoresist PR5 formed on the second conductive layer 204.

[0119] The mask and the method of manufacturing the mask in the embodiment can be applied to manufacturing a display device included in a computer (e.g., a notebook computer), a mobile phone, a smart phone, a smart tablet, a portable media player (“PMP”), a personal digital assistant (“PDA”), or a Moving Picture Experts Group Audio Layer III (“MP3”) player, etc.

[0120] Although the mask and the method of manufacturing the mask in the embodiment have been described with reference to the drawings, the illustrated embodiments are examples, and modifications and changes can be made by those with ordinary knowledge in the relevant technical field without departing from the technical spirit described in the appended claims.

Claims

1. A mask, wherein: The mask comprises: a frame defining at least one first opening and at least one second opening therein, the at least one first opening being defined in a central portion of the frame and the at least one second opening being defined in an edge portion of the frame; a first mask sheet disposed on the frame and defining a plurality of deposition openings therein each of which overlaps with a corresponding first opening of the at least one first opening; and A second mask sheet surrounds at least a portion of the first mask sheet on the frame, and the second mask sheet includes a material different from that of the first mask sheet.

2. The mask according to claim 1, wherein The second mask sheet directly contacts the edge portion of the frame.

3. The mask according to claim 1, wherein: The first mask sheet includes a magnetic material.

4. The mask according to claim 1, wherein: The first mask sheet comprises: a first conductive layer; and a second conductive layer, disposed on the first conductive layer, wherein the first conductive layer comprises at least one of titanium and titanium nitride, and The second conductive layer includes at least one of cobalt and nickel.

5. The mask according to claim 4, wherein: The mask also includes: an alignment portion disposed on the frame, adjacent to the second mask sheet, and defining an alignment mark in the alignment portion, wherein the alignment portion comprises the same material as that of the first conductive layer, Wherein, the alignment part comprises: A first layer, corresponding to the first conductive layer; and A second layer is disposed on the first layer and corresponds to the second conductive layer, and wherein the first layer includes the same material as the material of the first conductive layer, and the second layer includes the same material as the material of the second conductive layer.

6. The mask according to claim 1, wherein: A plurality of dummy openings penetrating the second mask sheet in a thickness direction are defined in the second mask sheet.

7. A method for manufacturing a mask, wherein: The method comprises: forming a preliminary mask sheet on a preliminary frame including a central region and an edge region adjacent to the central region; forming a first preliminary conductive layer on the preliminary mask sheet; forming a second preliminary conductive layer on at least a portion of the first preliminary conductive layer; forming a frame in which at least one first opening and at least one second opening are defined by removing a portion of the preliminary frame, the at least one first opening being defined in the central region and the at least one second opening being defined in the edge region; forming a first mask sheet in which a plurality of deposition opening regions are defined by removing a portion of each of the first preliminary conductive layer and the second preliminary conductive layer in the central region; and A second mask sheet is formed in which a plurality of dummy openings are defined by removing a portion of the first preliminary conductive layer in the edge region.

8. The method according to claim 7, wherein: The method further comprises: An alignment portion is formed by removing a portion of the first preliminary conductive layer in the edge region, an alignment mark being defined in the alignment portion, Wherein, the forming of the alignment portion and the forming of the second mask sheet are performed through the same process.

9. The method according to claim 7, wherein: The method further comprises: forming an alignment pattern in the edge region of the preliminary frame; covering the alignment pattern with the preliminary mask sheet, removing the alignment pattern; and forming an alignment portion by removing each of the first preliminary conductive layer and the second preliminary conductive layer in a region corresponding to the alignment pattern, an alignment mark being defined in the alignment portion, Wherein, the forming of the alignment pattern and the covering of the alignment pattern are performed before the forming of the preliminary mask sheet.

10. The method according to claim 7, wherein: The forming of the second preliminary conductive layer comprises: The second preliminary conductive layer is planarized so that an upper surface of the second preliminary conductive layer is planar and aligned with an upper surface of the first preliminary conductive layer.

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