A power semiconductor device protection circuit device

Abstract

The present invention discloses a power semiconductor device protection circuit device, which relates to the technical field of circuit protection. It includes a housing. As the wire advances, the wire core smoothly enters the inside of the connection sleeve and pushes the sliding block connected thereto to move in the sliding groove. The movement of the sliding block drives the connection push rod and the connection block around the connection column to move synchronously. When the connection block contacts the fixed plate and continues to rise, its inclined surface contacts the inclined surfaces of the wiring pipe and the connection pipe, indicating that the electrical connection between the wire and the power semiconductor device is completed. To prevent the wire core from detaching from the connection sleeve, the connection sleeve moves under the push of the wire core, driving the connection plate on its outer periphery and the limit rod in the moving groove to move. The limit rod moves from a high point to a low point, driving the lifting rod to slide on the outer periphery of the connecting rod, and further driving the clamping block to squeeze and deform the connection sleeve, increasing the friction force, effectively preventing detachment, and further enhancing the connection stability as the moving distance increases.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit protection, and particularly to a power semiconductor device protection circuit device. Background Art

[0002] Power semiconductor devices play a crucial role in power conversion and power control circuits. They are the core components in these systems. Such devices have the ability to process high-power electronic signals and can efficiently achieve power conversion or control functions. Power semiconductor devices, also widely known as power electronic devices or power electronics devices, are directly applied to the main circuit for processing electrical energy and play a vital role.

[0003] Specifically, the functions of power semiconductor devices are mainly reflected in the following aspects: power conversion, which can convert electrical energy from one form to another to meet the needs of different devices or systems; power amplification, which can enhance the intensity of electrical signals to ensure that the signals do not attenuate during transmission; power switching, which can precisely control the on and off of the circuit to achieve the on-demand distribution of electrical energy; circuit protection, which can quickly respond when abnormal conditions such as overcurrent and overvoltage occur in the circuit to protect the safety of the circuit and devices; and rectification, which can convert alternating current into direct current to provide a stable power supply for various DC devices.

[0004] However, despite the important role played by power semiconductor devices in the power system, there are some problems that cannot be ignored in their connection with external wires during actual application. Among them, unstable connection is a major problem, which may be caused by loose or poor contact of the connecting wires. When the connecting wires are loose or have poor contact, it will lead to the interruption or distortion of signal transmission, bringing great troubles to the testing work and the normal operation of the devices. More seriously, this unstable connection may also affect the stability and reliability of the entire system and even cause safety accidents. Summary of the Invention

[0005] The purpose of the present invention is to propose a solution to solve the problems that there are some problems that cannot be ignored in their connection with external wires during actual application. Among them, unstable connection is a major problem, which may be caused by loose or poor contact of the connecting wires. When the connecting wires are loose or have poor contact, it will lead to the interruption or distortion of signal transmission, bringing great troubles to the testing work and the normal operation of the devices. More seriously, this unstable connection may also affect the stability and reliability of the entire system and even cause safety accidents.

[0006] To achieve the above object, the present invention adopts the following technical solution: a power semiconductor device protection circuit device, comprising a housing, further comprising: a connection component and a clamping component assembled inside the housing;

[0007] The connection component includes a mounting plate connected inside the housing. One side of the mounting plate is fixedly connected with a fixing column, and a plurality of sliding grooves are formed on the outer periphery of the fixing column. A sliding block in contact with the sliding grooves is slidably connected inside the mounting plate. One side of the sliding block is connected with a connecting sleeve. A plurality of connecting columns are fixedly connected to both sides of the sliding block. The connecting columns are connected with a connecting block through a connecting push rod, and the connecting push rod is rotatably connected with both the connecting column and the connecting block;

[0008] The wire core is inserted into the connecting sleeve, and the connecting sleeve is pushed to drive the sliding block to slide in the sliding groove. Along with the continuous movement of the sliding block, the connecting block contacts the housing. Furthermore, under the restriction of the housing, the connecting push rod pushes the connecting block to rise and contact the housing, and during the continuous movement, the clamping component clamps the wire core.

[0009] As a further description of the above technical solution:

[0010] The clamping component includes a lifting member and a limiting member connected to one side of the mounting plate.

[0011] As a further description of the above technical solution:

[0012] The lifting member includes a plurality of fixing blocks fixedly connected to one side of the mounting plate. A connecting rod is fixedly connected between every two fixing blocks, and a lifting rod is slidably connected to the outer periphery of the connecting rod. The bottom of the lifting rod is fixedly connected with a clamping block in contact with the connecting sleeve.

[0013] As a further description of the above technical solution:

[0014] The limiting member includes a plurality of connecting plates fixedly connected to the outer periphery of the connecting sleeve. A moving groove is formed inside each connecting plate, and limiting rods in contact with the moving grooves are fixedly connected to both sides of the lifting rod.

[0015] As a further description of the above technical solution:

[0016] A plurality of wiring pipes are connected inside the housing. A connecting plate is fixedly connected inside the housing. One side of the connecting plate is connected with a connecting pipe, and a fixing plate is fixedly connected inside the connecting pipe.

[0017] As a further description of the above technical solution:

[0018] Bevels are provided inside both the wiring pipe and the connecting pipe.

[0019] As a further description of the above technical solution:

[0020] A disconnecting component is installed inside the wiring pipe. The disconnecting component includes a slot opened inside the wiring pipe. A plurality of push rods are fixedly connected to the inner wall of the slot. The push rods are connected to the mounting plate through push slots. A plurality of electric push rods are connected between the mounting plate and the slot.

[0021] As a further description of the above technical solution:

[0022] A current sensor is installed inside the connecting pipe.

[0023] In summary, due to the adoption of the above technical solution, the beneficial effects of the present invention are:

[0024] As the wire is pushed forward, the wire core smoothly enters the inside of the connecting sleeve and pushes the sliding block connected thereto to move in the sliding groove. The movement of the sliding block drives the connecting push rod and the connecting block around the connecting column to move synchronously. When the connecting block contacts the fixing plate and continues to rise, its inclined surface contacts the inclined surfaces of the wiring pipe and the connecting pipe, indicating that the electrical connection between the wire and the power semiconductor device is completed;

[0025] To prevent the wire core from detaching from the connecting sleeve, the connecting sleeve moves under the push of the wire core, driving the connecting plate on its outer periphery and the limiting rod in the moving groove to move. The limiting rod moves from a high point to a low point, driving the lifting rod to slide on the outer periphery of the connecting rod, and further driving the clamping block to squeeze and deform the connecting sleeve, increasing the friction force, effectively preventing detachment, and further enhancing the connection stability as the moving distance increases;

[0026] In addition, the device is equipped with a current sensor to monitor the wire current-carrying capacity. Once the current is abnormally large, the current sensor will activate the electric push rod to contract, pulling the mounting plate to displace, causing the connecting block to gradually detach from the connection position of the wiring pipe and the connecting pipe and separating from the fixing plate, thereby safely cutting off the connection between the wire and the power semiconductor device and preventing potential safety hazards. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 Shows a schematic diagram of the overall structure according to the present invention;

[0028] Figure 2 Shows a schematic diagram of the internal structure of the housing according to the present invention;

[0029] Figure 3 Shows a schematic diagram of the internal structure of the wiring pipe according to the present invention;

[0030] Figure 4 Shows according to the present invention Figure 3 Local enlarged view at A;

[0031] Figure 5 Shows a schematic diagram of the connection component structure according to the present invention;

[0032] Figure 6 Shows a schematic diagram of the slider structure according to the present invention;

[0033] Figure 7 Shows a schematic diagram of the clamping assembly structure according to the present invention.

[0034] Legend description:

[0035] 10. Housing; 11. Wiring pipe; 12. Connection plate; 13. Connecting pipe; 14. Fixed plate; 15. Inclined plane;

[0036] 20. Connection assembly; 21. Mounting plate; 22. Fixed column; 221. Sliding groove; 23. Slider; 24. Connection sleeve; 25. Connecting column; 26. Connection push rod; 27. Connection block;

[0037] 30. Clamping assembly; 31. Fixed block; 32. Connecting rod; 33. Lifting rod; 34. Clamping block; 35. Connecting plate; 351. Moving groove; 36. Limiting rod;

[0038] 40. Disconnection and connection assembly; 41. Groove; 42. Electric push rod; 43. Current sensor; 44. Pushing groove; 45. Pushing rod. Detailed implementation manners

[0039] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without making creative efforts belong to the scope of protection of the present invention.

[0040] As Figures 1 - 7 shown, a power semiconductor device protection circuit device provided by the present invention includes: a housing 10, a power semiconductor device is installed inside the housing 10, a plurality of wiring pipes 11 are connected inside the housing 10, a connection plate 12 is fixedly connected inside the housing 10, one side of the connection plate 12 is electrically connected to the power semiconductor device, a connection pipe 13 is connected to one side of the connection plate 12, a fixed plate 14 is fixedly connected inside the connection pipe 13, inclined planes 15 are provided inside both the wiring pipe 11 and the connection pipe 13, and further includes: a connection assembly 20 and a clamping assembly 30 assembled inside the wiring pipe 11;

[0041] When it is necessary to connect the power semiconductor device to an external wire, first strip the skin at the front end of the wire, and then insert the wire core into the wiring pipe 11.

[0042] As Figure 1 、 Figure 2 、Figure 3 , Figure 5 , Figure 6 As shown in Figure 3 , Figure 5 , and Figure 6 , the connecting component 20 includes a mounting plate 21 connected inside the housing 10. One side of the mounting plate 21 is fixedly connected with a fixing column 22, and a plurality of sliding grooves 221 are formed on the outer periphery of the fixing column 22. A sliding block 23 in contact with the sliding grooves 221 is slidably connected inside the mounting plate 21. One side of the sliding block 23 is connected with a connecting sleeve 24. A plurality of connecting columns 25 are fixedly connected to both sides of the sliding block 23. The connecting columns 25 are connected with a connecting block 27 through a connecting push rod 26. An inclined surface is provided on the outer periphery of the connecting block 27, and the connecting push rod 26 is rotatably connected to both the connecting column 25 and the connecting block 27;

[0043] As the wire is pushed forward, its wire core is smoothly guided into the inside of the connecting sleeve 24. During this process, the wire core exerts a thrust on the connecting sleeve 24, causing the sliding block 23 connected to the connecting sleeve 24 to move correspondingly in the sliding groove 221. The movement of the sliding block 23 is not isolated. It simultaneously drives the connecting push rod 26 around the connecting column 25 to move together. The connecting push rod 26 then pushes the connecting block 27, causing the two to move synchronously;

[0044] With the continuous pushing of the sliding block 23, the connecting block 27 gradually comes into contact with the fixing plate 14. Under the continuous thrust, the connecting push rod 26 continues to push the connecting block 27 upward. At this time, the inclined surface of the connecting block 27 comes into contact with the inclined surfaces 15 of the wiring pipe 11 and the connecting pipe 13. This contact marks the completion of the electrical connection between the wire and the power semiconductor device;

[0045] It should be noted that the connecting sleeve 24, the sliding block 23, the connecting column 25, the connecting push rod 26, and the connecting block 27 are all made of metal conductive materials. Among them, the connecting sleeve 24 is made of a soft and thin metal plate. Similarly, the connecting plate 12 and the connecting pipe 13 are also made of metal conductive materials. Such material selection ensures the electrical connectivity and reliability of the entire connection structure.

[0046] Such as Figure 1 , Figure 2 , Figure 3 , Figure 7As shown, the clamping assembly 30 includes a lifting member and a limiting member connected to one side of the mounting plate 21. The lifting member includes a plurality of fixing blocks 31 fixedly connected to one side of the mounting plate 21. A connecting rod 32 is fixedly connected between every two fixing blocks 31. A lifting rod 33 is slidably connected to the outer periphery of the connecting rod 32. A clamping block 34 in contact with the connecting sleeve 24 is fixedly connected to the bottom of the lifting rod 33. The shape of the clamping block 34 can be selected as arc-shaped or cylindrical. The limiting member includes a plurality of connecting plates 35 fixedly connected to the outer periphery of the connecting sleeve 24. A moving groove 351 is formed inside each connecting plate 35. Limiting rods 36 in contact with the moving groove 351 are fixedly connected to both sides of the lifting rod 33;

[0047] To prevent the wire core from detaching from the connecting sleeve 24, when the wire core presses against the connecting sleeve 24, the connecting sleeve 24 will move accordingly and drive a plurality of connecting plates 35 on its outer periphery to move together. As the connecting plates 35 move, the limiting rods 36 located inside the moving groove 351 will move along the path of the moving groove 351;

[0048] Under the continuous push of the connecting sleeve 24, the limiting rods 36 will gradually move from the high point to the low point of the moving groove 351. At the same time, the downward movement of the limiting rods 36 will drive the lifting rod 33 to slide on the outer periphery of the connecting rod 32. As the lifting rod 33 descends, it will further drive the clamping block 34 to squeeze the connecting sleeve 24, causing the connecting sleeve 24 to deform;

[0049] This deformation increases the friction between the connecting sleeve 24 and the wire core, effectively preventing the wire core from detaching from the connecting sleeve 24. In addition, as the moving distance of the connecting sleeve 24 increases, the deformation distance caused by the clamping block 34 to the connecting sleeve 24 will also increase correspondingly. This further enhances the connection stability between the wire core and the connecting sleeve 24, ensures their firm connection, and prevents the occurrence of detachment.

[0050] As Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 、 Figure 7 As shown, a disconnection and connection assembly 40 is installed inside the wiring pipe 11. The disconnection and connection assembly 40 includes a slot 41 opened inside the wiring pipe 11. A plurality of push rods 45 are fixedly connected to the inner wall of the slot 41. The push rods 45 are connected to the mounting plate 21 through a push groove 44. A plurality of electric push rods 42 are connected between the mounting plate 21 and the slot 41. A current sensor 43 is installed inside the connecting pipe 13;

[0051] Due to the inherent limitations of the current-carrying capacity of the wire, when the current flowing through the wire exceeds its carrying capacity, the wire will heat up, which may cause damage to the insulation layer and even lead to a fire in severe cases. To prevent such safety hazards, a current sensor 43 is equipped in the device. Once the current sensor 43 detects an abnormally large current, it will immediately activate the electric push rod 42 to perform a contraction operation. The contraction action of the electric push rod 42 will pull the mounting plate 21 to slide around the push rod 45. As the overall displacement of the mounting plate 21 occurs, the fixed column 22 and the connecting sleeve 24 connected thereto will also move accordingly. This series of movements causes the connecting block 27 that was originally tightly connected to the wiring pipe 11 and the connecting pipe 13 to gradually disengage from its connection position. At the same time, due to the continuous movement of the mounting plate 21, the connecting block 27 will also separate from the fixed plate 14, thus ensuring that the connection between the wire and the power semiconductor device is safely cut off.

[0052] Working principle: The wire core is pushed into the connecting sleeve 24, and at the same time, it drives the sliding block 23 to move in the sliding groove 221, thereby pushing the connecting push rod 26 and the connecting block 27 around the connecting column 25 to move synchronously. As the thrust continues, the connecting block 27 gradually contacts the fixed plate 14 and rises to contact the inclined surfaces 15 of the wiring pipe 11 and the connecting pipe 13, completing the electrical connection between the wire and the power semiconductor device;

[0053] To prevent the wire core from detaching from the connecting sleeve 24, when the connecting sleeve 24 moves, it will drive the connecting plate 35 on its outer periphery and the limiting rod 36 in the moving groove 351 to move. The limiting rod 36 moves from the high point to the low point of the moving groove 351, driving the lifting rod 33 to slide around the connecting rod 32, and then causing the clamping block 34 to deform the connecting sleeve 24 by extrusion, increasing the friction force and enhancing the connection stability;

[0054] In addition, the device is equipped with a current sensor 43. Once an abnormally large current is detected, the electric push rod 42 is immediately activated to contract, pulling the mounting plate 21 to slide around the push rod 45, resulting in the connecting block 27 gradually disengaging from the connection positions of the wiring pipe 11 and the connecting pipe 13 and separating from the fixed plate 14, ensuring the safe disconnection between the wire and the power semiconductor device and preventing safety hazards.

[0055] The above is only a preferred specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution and inventive concept of the present invention, makes equivalent substitutions or changes, and should be covered by the protection scope of the present invention.

Claims

1. A power semiconductor device protection circuit device, comprising a housing (10), characterized in that, It further includes: A connection component (20) and a clamping component (30) assembled inside the housing (10); The connection component (20) includes a mounting plate (21) connected inside the housing (10). One side of the mounting plate (21) is fixedly connected with a fixing column (22), and a plurality of sliding grooves (221) are formed on the outer periphery of the fixing column (22). A sliding block (23) in contact with the sliding grooves (221) is slidably connected inside the mounting plate (21). One side of the sliding block (23) is connected with a connecting sleeve (24). A plurality of connecting columns (25) are fixedly connected to both sides of the sliding block (23). The connecting columns (25) are connected with a connecting block (27) through a connecting push rod (26), and the connecting push rod (26) is rotatably connected with both the connecting column (25) and the connecting block (27); The wire core is inserted into the connecting sleeve (24), and the connecting sleeve (24) is pushed to move the sliding block (23) in the sliding grooves (221). As the sliding block (23) continuously moves, the connecting block (27) contacts the housing (10). Then, under the restriction of the housing (10), the connecting push rod (26) pushes the connecting block (27) to rise and contact the housing (10), and the clamping component (30) clamps the wire core during the continuous movement; The clamping component (30) includes a lifting member and a limiting member connected to one side of the mounting plate (21); The lifting member includes a plurality of fixing blocks (31) fixedly connected to one side of the mounting plate (21). A connecting rod (32) is fixedly connected between every two fixing blocks (31). A lifting rod (33) is slidably connected to the outer periphery of the connecting rod (32). The bottom of the lifting rod (33) is fixedly connected with a clamping block (34) in contact with the connecting sleeve (24); The limiting member includes a plurality of connecting plates (35) fixedly connected to the outer periphery of the connecting sleeve (24). A moving groove (351) is formed inside each connecting plate (35). Limiting rods (36) in contact with the moving grooves (351) are fixedly connected to both sides of the lifting rod (33).

2. The protection circuit device for a power semiconductor device according to claim 1, characterized in that, A plurality of wiring pipes (11) are connected inside the housing (10). A connecting plate (12) is fixedly connected inside the housing (10). One side of the connecting plate (12) is connected with a connecting pipe (13). A fixing plate (14) is fixedly connected inside the connecting pipe (13).

3. The power semiconductor device protection circuit device according to claim 2, characterized in that Inclined surfaces (15) are provided inside both the wiring pipes (11) and the connecting pipes (13).

4. A power semiconductor device protection circuit device according to claim 2, characterized in that, A disconnection and connection component (40) is installed inside the wiring pipe (11). The disconnection and connection component (40) includes a slot (41) formed inside the wiring pipe (11). A plurality of push rods (45) are fixedly connected to the inner wall of the slot (41). The push rods (45) are connected with the mounting plate (21) through a push groove (44). A plurality of electric push rods (42) are connected between the mounting plate (21) and the slot (41).

5. A power semiconductor device protection circuit device according to claim 4, characterized in that, A current sensor (43) is installed inside the connecting pipe (13).

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