Infrared receiving head test system and method, computer equipment and program product
Through the infrared receiver head testing system with dual-channel design and custom encoding format, the problems of low single test efficiency and limited multi-test flexibility in the existing technology are solved, and efficient and flexible infrared receiver head testing is achieved.
Patent Information
- Application Number
- CN202510243948.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-03
- Publication Date
- 2025-06-03
AI Technical Summary
The existing infrared receiver test system has low efficiency in single tests and cannot meet the rapid detection requirements in large-scale production. At the same time, due to the fixed encoding, multiple tests cannot flexibly adapt to different test scenarios, and the test accuracy and flexibility are limited.
It provides an infrared receiver head testing system, adopts a dual-channel design, supports custom encoding format, and can complete the transmission and detection of signals of different intensity within a test cycle, realizing automated testing.
It significantly improves testing efficiency, can adapt to diverse testing needs, enhances the applicability and flexibility of the system, and meets the rapid testing needs of large-scale production.
Smart Images
Figure CN120090728A_ABST
Abstract
Description
Technical Field
[0001] The present application belongs to the technical field of infrared component testing equipment, and in particular, relates to an infrared receiving head testing system, method, computer equipment and program product. Background Art
[0002] Existing infrared receiver head test systems are mainly divided into two types: single-chip test and multi-chip test.
[0003] In single chip test, the test system can select different infrared codes built into the instrument for testing within a test cycle. The selected infrared code is loaded through the infrared transmitting tube of a transmitting channel to transmit the signal, and the output signal is identified and judged at the output end of the receiving head to be tested. This test method can only test one receiving head device at a time, but it can be connected to an external testing organization through the communication port to realize single chip automatic testing.
[0004] The multiple-piece test is a batch test of the receiving head joint material. The infrared transmitting tube of a transmitting channel is loaded with a fixed code to transmit the signal, and the signal is judged at the output end of multiple receiving heads to be tested. This test method can test multiple receiving head components at a time, and can also realize automatic testing by connecting the mechanical structure through the communication port.
[0005] However, the existing technology has the following problems: the efficiency of single-chip testing is low and cannot meet the rapid detection needs in large-scale production; although multi-chip testing improves test efficiency, it cannot flexibly adapt to different test scenarios due to the use of fixed coding, and the test accuracy and flexibility are limited. Summary of the invention
[0006] The embodiments of the present application provide an infrared receiving head testing system, method, computer equipment and program product, which can realize dual-channel, custom-coded automated testing.
[0007] In a first aspect, an embodiment of the present application provides an infrared receiving head test system, comprising: a control host, a function detection sampling module, a first infrared signal transmission module and a second infrared signal transmission module; wherein:
[0008] A control host, used to control the output of infrared emission signals of the first and second infrared emission signal modules through the function detection sampling module according to the set multiple test parameters, and used to obtain sampling information of the output signal of the infrared receiving head component to be detected through the function detection sampling module, and to calculate and judge the sampling information with the preset parameter range to obtain the test result of the infrared receiving head component to be detected; the multiple test parameters at least include a coding format, and the coding format supports at least one existing coding format and a custom coding format;
[0009] The first and second infrared emission signal modules are used to emit infrared emission signals to the infrared receiving head component to be detected, and the two can emit infrared emission signals of different intensities in sequence.
[0010] The function detection and sampling module is connected to the control host, the first infrared emission signal module, the second infrared emission signal module, and the infrared receiving head component to be detected.
[0011] In a possible implementation manner of the first aspect, the system further includes:
[0012] An information display terminal, connected to the control host, for displaying the test results obtained by the control host.
[0013] In a possible implementation manner of the first aspect, the system further includes:
[0014] A mechanical transmission control module, connected to the control host, for classifying and packaging the infrared receiving head components that have completed the test according to the test results obtained by the control host.
[0015] Exemplarily, when multiple infrared receiving heads in the infrared receiving head component to be detected receive infrared emission signals simultaneously, the function detection and sampling module respectively samples the output signals of each infrared receiving head in parallel.
[0016] Exemplarily, the first infrared emission signal module and the second infrared emission signal module are respectively used to simulate near-field testing and far-field testing.
[0017] In a second aspect, an embodiment of the present application provides an infrared receiving head testing method, including:
[0018] According to a variety of set test parameters, perform output control of infrared emission signals on the first and second infrared emission signal modules; the first and second infrared emission signal modules are used to emit infrared emission signals to the infrared receiving head component to be detected, and the two can emit infrared emission signals of different intensities in sequence.
[0019] Obtain the sampling information of the output signal of the infrared receiving head component to be detected, perform arithmetic judgment on the sampling information and the preset parameter range to obtain the test results of the infrared receiving head component to be detected; the variety of test parameters at least includes the coding format, and the coding format supports at least one existing coding format and a custom coding format.
[0020] In a possible implementation manner of the second aspect, the method further includes:
[0021] Display the test results through the information display terminal.
[0022] In a possible implementation manner of the second aspect, the method further includes:
[0023] Classify and pack the infrared receiver components that have completed the test according to the test results.
[0024] In a third aspect, an embodiment of the present application provides a computer device, including a memory, a processor, and a computer program stored in the memory and executable on the processor. When the processor executes the computer program, the method described in any item of the second aspect above is implemented.
[0025] In a fourth aspect, an embodiment of the present application provides a computer-readable storage medium. The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the method described in any item of the second aspect above can be implemented.
[0026] In a fifth aspect, an embodiment of the present application provides a computer program product. When the computer program product runs on a computer device, the computer device is enabled to execute the method described in any item of the second aspect above.
[0027] It can be understood that the beneficial effects of the second to fifth aspects above can refer to the relevant descriptions in the first aspect above, and will not be elaborated here.
[0028] The beneficial effect of the embodiment of the present application compared with the prior art is that the infrared receiver test system provided by the embodiment of the present application adopts a dual-channel design (the first and second infrared emission signal modules), and can complete the emission and detection of signals with different intensities (such as simulating different distances: near field and far field, and can also customize parameters according to user needs) within one test cycle, thereby significantly improving the test efficiency. Moreover, the system supports flexible setting of a variety of test parameters, including but not limited to the coding format. The coding format not only supports existing common codings, but also supports user-defined coding formats. This design enables the system to adapt to diverse test requirements and enhances the applicability and flexibility of the system. Description of the Drawings
[0029] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.
[0030] Figure 1 It is a schematic structural diagram of an infrared receiver test system provided by an embodiment of the present application;
[0031] Figure 2 It is a schematic structural diagram of an infrared receiver test system provided by another embodiment of the present application;
[0032] Figure 3 It is a schematic diagram of test parameter and parameter range settings provided by an embodiment of the present application;
[0033] Figure 4 It is a schematic flowchart of an infrared receiver head test method provided by an embodiment of the present application;
[0034] Figure 5 It is a schematic diagram of the structure of a computer device provided by an embodiment of the present application. Detailed implementation manners
[0035] In the following description, specific details such as specific system architectures and technologies are presented for the purpose of illustration rather than limitation, so as to thoroughly understand the embodiments of the present application. However, those skilled in the art should clearly understand that the present application can also be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted to avoid unnecessary details from interfering with the description of the present application.
[0036] It should be understood that when used in the specification and appended claims of the present application, the term "comprising" indicates the presence of the described features, wholes, steps, operations, elements, and / or components, but does not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components, and / or their combinations.
[0037] It should also be understood that the term "and / or" as used in the specification and appended claims of the present application refers to any combination and all possible combinations of one or more of the associated listed items, and includes these combinations.
[0038] As used in the specification and appended claims of the present application, the term "if" can be interpreted as "when", "once", "in response to determining", or "in response to detecting" according to the context. Similarly, the phrase "if determined" or "if detecting [the described condition or event]" can be interpreted as meaning "once determined", "in response to determining", "once detecting [the described condition or event]", or "in response to detecting [the described condition or event]" according to the context.
[0039] In addition, in the description of the specification and appended claims of the present application, the terms "first", "second", "third", etc. are only used for differentiating descriptions and cannot be understood as indicating or implying relative importance.
[0040] References to "one embodiment" or "some embodiments" etc. described in the specification of this application mean that specific features, structures, or characteristics described in connection with that embodiment are included in one or more embodiments of this application. Thus, statements such as "in one embodiment", "in some embodiments", "in other some embodiments", "in still other embodiments", etc. that appear in different places in this specification do not necessarily all refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized. The terms "comprising", "including", "having" and their variants all mean "including but not limited to", unless otherwise specifically emphasized.
[0041] The technical solutions in the embodiments of this application will be described in detail below.
[0042] Figure 1 It is a schematic structural diagram of an infrared receiver head test system provided by an embodiment of this application. As Figure 1 shown, the system includes a control host, a function detection and sampling module, a first infrared emission signal module, and a second infrared signal emission module; where:
[0043] The control host is used to control the output of infrared emission signals of the first and second infrared emission signal modules through the function detection and sampling module according to a variety of set test parameters, and is used to obtain sampling information of the output signals of the infrared receiver head components to be detected through the function detection and sampling module, and perform arithmetic judgment on the sampling information and a preset parameter range to obtain the test results of the infrared receiver head components to be detected; the variety of test parameters at least include an encoding format, and the encoding format supports at least one existing encoding format and a custom encoding format;
[0044] The first and second infrared emission signal modules are used to emit infrared emission signals to the infrared receiver head components to be detected, and the two can emit infrared emission signals of different intensities in sequence;
[0045] The function detection and sampling module is connected to the control host, the first infrared emission signal module, the second infrared emission signal module, and the infrared receiver head components to be detected.
[0046] Specifically, the form of the function detection and sampling module can be a circuit board, and the circuit board is respectively connected to the control host, the first infrared emission signal module, the second infrared emission signal module, and the infrared receiver head components to be detected. The function detection and sampling module can control the first and second infrared emission signal modules to emit different encoded signals through instructions, and the encoded signals are transmitted to the infrared receiver head components to be detected through infrared light, so that the function detection and sampling module can perform data sampling on the output signals of the infrared receiver head components to be detected, and then feedback the sampling data to the control host.
[0047] In some embodiments, when multiple infrared receiving headers in the infrared receiving header component to be detected receive the infrared emission signal simultaneously, the functional detection sampling module can perform parallel sampling on the output signals of each infrared receiving header respectively, achieving the effect of detecting multiple infrared receiving headers at the same time point.
[0048] In some embodiments, the first infrared emission signal module and the second infrared emission signal module are respectively used to simulate near-field testing and far-field testing, so that near-field and far-field signal testing can be completed within one test cycle, and the testing efficiency is improved.
[0049] It should also be noted that Figure 1 The structure of the infrared receiving header testing system shown is only an example. In specific applications, the system can be expanded according to actual needs. Figure 2 is a schematic diagram of the structure of the infrared receiving header testing system provided by another embodiment of the present application. As Figure 2 shown, the infrared receiving header testing system may further include an information display terminal, which is connected to the control host and is used to display the test results obtained by the control host and other required information. In some embodiments, the information display terminal may also provide an interactive interface for setting test parameters, and the user can set the test parameters and parameter ranges based on this interactive interface. More specifically, this interactive interface can be developed based on the Android system, making version upgrade and iteration more convenient.
[0050] As Figure 2 shown, the infrared receiving header testing system further includes a mechanical transmission control module, which is connected to the control host and is used to classify and pack the infrared receiving header components that have completed the test according to the test results obtained by the control host. Specifically, the test results generated by the control host may include the classification results of the infrared receiving header components that have completed the test. By transmitting this classification result to the mechanical transmission control module, the mechanical transmission control module classifies and packs the infrared receiving header components that have completed the test according to this classification result. More specifically, the control host can judge the items with poor detection results by performing arithmetic operations on the sampling information and the preset parameter ranges, and mark these items, and generate the classification results of the infrared receiving header components that have completed the test based on this mark.
[0051] The infrared receiver head test system provided by the embodiment of the present application adopts a dual-channel design (the first and second infrared emission signal modules), which can complete the emission and detection of signals with different intensities (such as near-field and far-field) within one test cycle, thus significantly improving the test efficiency. Moreover, the system separates the infrared coding into a single document. According to the actual test requirements, different infrared coding files can be called to test different infrared codings. In addition, the infrared coding file can "customize" the coding format. That is to say, if a new coding format is developed, the coding can be written into the coding file according to the coding format to form a "customized coding format" file, so that the test system can call the "customized coding format" for testing.
[0052] Those skilled in the art can clearly understand that, for the convenience and conciseness of description, only the above-mentioned division of each functional unit and module is used as an example for illustration. In actual applications, the above-mentioned functions can be allocated to different functional units and modules according to needs, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above. Each functional unit and module in the embodiment can be integrated in a processing unit, or each unit can exist physically alone, or two or more units can be integrated in one unit. The above-mentioned integrated unit can be implemented in the form of hardware or in the form of a software functional unit. In addition, the specific names of each functional unit and module are only for the convenience of mutual distinction and do not limit the protection scope of the present application. The specific working processes of the units and modules in the above system can refer to the corresponding processes in the foregoing method embodiments and will not be elaborated here.
[0053] The test parameters of the infrared receiver head test system provided by the embodiment of the present application will be further illustrated by examples below.
[0054] Figure 3 It is a schematic diagram of the test parameter and parameter range setting provided by an embodiment of the present application. As Figure 3 shown, the test parameters of the infrared receiver head test system provided by the embodiment of the present application are as follows:
[0055] 1) Carrier frequency: Set the carrier frequency of the transmitting tube to match the center frequency category of the receiving head device to be tested.
[0056] 2) Current of emission channel 1: Set the drive current value of emission channel 1 (such as 0.01 mA to 100 mA, used to simulate weak signals in far-field tests).
[0057] 3) Current of emission channel 2: Set the drive current value of emission channel 2 (such as 100 mA to 800 mA, used to simulate strong signals in far-field tests).
[0058] 4) Output voltage of the receiving head: Set the test voltage range (such as 1 V to 6 V).
[0059] 5) Duty cycle: Set the duty cycle of the driving of the transmitted signal (e.g., 10% - 90%).
[0060] 6) External resistor: Select the pull-up resistor value between the VCC and VOUT of the receiver to be tested (e.g., 1 kΩ, 4.7 kΩ, 10 kΩ).
[0061] 7) Pulse time: Set the transmitted pulse time.
[0062] 8) Interval time: Set the interval time between transmitted pulses.
[0063] 9) Test interval: Set the interval time between test signals.
[0064] 10) Clutter time: Set the time range for detecting clutter (e.g., 0 - 1000 ms).
[0065] 11) Output coding format 1: Set the coding format to be tested (e.g., NEC code, RCMM code), or import a custom coding file for testing. After entering this coding call interface, the determination ranges of the coding pulse time and interval time can be set, and a specific item can also be modified individually.
[0066] 12) Static current: Set the determination range for detecting the static current of the device under test.
[0067] 13) Operating current: Set the determination range for detecting the current of the device under test during operation.
[0068] 14) Low-level voltage: Set the determination range for detecting the low-level voltage output by the device under test.
[0069] 15) High-level voltage: Set the determination range for detecting the high-level voltage output by the device under test.
[0070] 16) Chip internal resistance: Test the equivalent resistance between the VCC and VOUT of the chip.
[0071] 17) Minimum pulse of transmission channel 1: Set the determination range of the minimum pulse time of the device under test (when the signal of transmission channel 1 is transmitted).
[0072] 18) Maximum pulse of transmission channel 1: Set the determination range of the maximum pulse time of the device under test (when the signal of transmission channel 1 is transmitted).
[0073] 19) Reception delay of transmission channel 1: Set the determination range of the delay time of the output signal of the device under test (when the signal of transmission channel 1 is transmitted).
[0074] 20) Number of clutters in emission channel 1: Set the determination range of the number of clutters of the device under test during the test time (when the signal of emission channel 1 is emitted).
[0075] 21) Minimum pulse of emission channel 2: Set the determination range of the minimum pulse time of the device under test (when the signal of emission channel 2 is emitted).
[0076] 22) Maximum pulse of emission channel 2: Set the determination range of the maximum pulse time of the device under test (when the signal of emission channel 2 is emitted).
[0077] 23) Reception delay of emission channel 2: Set the determination range of the delay time of the output signal of the device under test (when the signal of emission channel 2 is emitted).
[0078] 24) Number of clutters in emission channel 2: Set the determination range of the number of clutters of the device under test during the test time (when the signal of emission channel 2 is emitted).
[0079] 25) Group number setting: Set the number of component channels for a single test.
[0080] 26) Alarm number setting: Set the limit of the number of NG channels (when the number of NGs exceeds the set value, stop and alarm).
[0081] 27) PLC ACK: Communication switch with the PLC operation mechanism, and the communication port can be selected to be opened or closed.
[0082] After the above parameter settings are completed, the control host can, according to the set parameters (such as parameter 2) 3)), control the output of the infrared emission signals of the first and second infrared emission signal modules through the function detection and sampling module, and perform arithmetic judgment based on the sampling data and the preset parameter range (such as parameter 11)-24)), to obtain the test results of the infrared receiving head component to be detected. Specifically, the test results may include the item-by-item comparison results of the sampling data and each preset parameter range.
[0083] It should be noted that the above parameter and parameter range settings are only examples. Based on the same idea, those skilled in the art can make settings such as adding, deleting, and modifying the above parameters according to actual needs, and all should be regarded as within the protection scope of this application.
[0084] So far, the description of the infrared receiving head test system provided by the embodiments of this application is completed.
[0085] Corresponding to the infrared receiving head test system provided in the above embodiments, Figure 4 The schematic flowchart of the infrared receiving head test method provided by this application is shown. As an example but not a limitation, this method can be applied to a computer device. As Figure 4 shown, this process includes:
[0086] S401. Control the output of infrared emission signals for the first and second infrared emission signal modules according to various set test parameters. The first and second infrared emission signal modules are used to emit infrared emission signals to the infrared receiver component to be detected, and the two can emit infrared emission signals of different intensities in sequence.
[0087] S402. Obtain the sampling information of the output signal of the infrared receiver component to be detected, perform arithmetic judgment on the sampling information and the preset parameter range, and obtain the test result of the infrared receiver component to be detected. The above-mentioned various test parameters at least include the coding format, and this coding format supports at least one existing coding format and a custom coding format.
[0088] It should be understood that the magnitudes of the sequence numbers of the steps in the above embodiments do not mean the order of execution. The order of execution of each process should be determined by its function and internal logic, and should not constitute any limitation to the implementation process of the embodiments of the present application.
[0089] It should be noted that since it is based on the same concept as the system embodiment of the present application, for the specific functions and technical effects brought by this method embodiment, reference can be specifically made to the system embodiment part, and details are not described herein again.
[0090] The embodiment of the present application also provides a computer device, which includes: at least one processor, a memory, and a computer program stored in the memory and executable on the at least one processor. When the processor executes the computer program, it implements the steps in any of the above method embodiments.
[0091] The embodiment of the present application also provides a computer-readable storage medium. The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, it can implement the steps in the above-mentioned various method embodiments.
[0092] The embodiment of the present application provides a computer program product. When the computer program product runs on a computer device, it enables the computer device to implement the steps in any of the above method embodiments when executed.
[0093] Figure 5 It is a schematic structural diagram of a computer device provided by an embodiment of the present application. As Figure 5 shown, the computer device in this embodiment includes: at least one processor 50 ( Figure 5 only one is shown in the figure), a memory 51, and a computer program 52 stored in the memory 51 and executable on the at least one processor 50. When the processor 50 executes the computer program 52, it implements the steps in any of the above visualization programming method embodiments.
[0094] The computer device may include, but is not limited to, a processor 50 and a memory 51. Those skilled in the art can understand that Figure 5 merely examples of the computer device, which do not constitute a limitation on the computer device, may include more or fewer components than shown in the figure, or combine some components, or different components. For example, it may also include input / output devices, network access devices, etc.
[0095] The so-called processor 50 may be a central processing unit (CPU), and the processor 50 may also be other general-purpose processors, digital signal processors (DSPs), application specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. The general-purpose processor may be a microprocessor or the processor may also be any conventional processor, etc.
[0096] The memory 51 may be an internal storage unit of the computer device in some embodiments, such as the hard disk or memory of the computer device. The memory 51 may also be an external storage device of the computer device in other embodiments, such as a plug-in hard disk, a smart media card (SMC), a secure digital (SD) card, a flash card, etc. equipped on the computer device. Further, the memory 51 may also include both the internal storage unit and the external storage device of the computer device. The memory 51 is used to store an operating system, application programs, a boot loader, data, and other programs, such as the program code of the computer program, etc. The memory 51 may also be used to temporarily store data that has been output or will be output.
[0097] When the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, to implement all or part of the processes in the above-described embodiment methods of this application, a computer program can be used to instruct relevant hardware to complete. The computer program can be stored in a computer-readable storage medium. When the computer program is executed by a processor, the steps of the above-described method embodiments can be implemented. Among them, the computer program includes computer program code, and the computer program code can be in the form of source code, object code, executable file, or some intermediate form, etc. The computer-readable medium can at least include: any entity or device that can carry the computer program code to the device / computer equipment, recording medium, computer memory, read-only memory (ROM), random access memory (RAM), electrical carrier signal, telecommunication signal, and software distribution medium. For example, a USB flash drive, a mobile hard disk, a magnetic disk, or an optical disc, etc. In some jurisdictions, according to legislation and patent practice, the computer-readable medium cannot be an electrical carrier signal and a telecommunication signal.
[0098] In the above embodiments, the descriptions of the respective embodiments have their own focuses. For parts not detailed or recorded in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.
[0099] Those of ordinary skill in the art can realize that the units and algorithm steps of the examples described in conjunction with the embodiments disclosed herein can be implemented by electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are executed in a hardware or software manner depends on the specific application and design constraints of the technical solution. Professionals can use different methods to implement the described functions for each specific application, but such implementation should not be considered to exceed the scope of this application.
[0100] In the embodiments provided in this application, it should be understood that the disclosed device / computer equipment and method can be implemented in other ways. For example, the device / computer equipment embodiments described above are merely illustrative. For example, the division of the modules or units is only a logical function division. In actual implementation, there can be other division methods. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the displayed or discussed couplings or direct couplings or communication connections to each other can be through some interfaces. The indirect couplings or communication connections of the devices or units can be in an electrical, mechanical, or other form.
[0101] The unit described as a separation component may or may not be physically separated. The component displayed as a unit may or may not be a physical unit, that is, it may be located in one place or distributed to multiple network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of this embodiment.
[0102] The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.
Claims
1. An infrared receiving head testing system, characterized in that: It includes: a control host, a function detection sampling module, a first infrared signal transmission module and a second infrared signal transmission module; wherein: The control host is used to control the output of infrared emission signals of the first and second infrared emission signal modules through the function detection sampling module according to the set multiple test parameters, and is used to obtain sampling information of the output signal of the infrared receiving head component to be detected through the function detection sampling module, and calculate and judge the sampling information with the preset parameter range to obtain the test result of the infrared receiving head component to be detected; the multiple test parameters at least include a coding format, and the coding format supports at least one existing coding format and a custom coding format; The first and second infrared transmission signal modules are used to transmit infrared transmission signals to the infrared receiving head components to be detected, and the two modules can transmit infrared transmission signals of different intensities in sequence; The function detection sampling module is connected to the control host, the first infrared transmission signal module, the second infrared transmission signal module, and the infrared receiving head component to be detected.
2. The system according to claim 1, characterized in that The system further comprises: The information display terminal is connected to the control host and is used to display the test results obtained by the control host.
3. The system according to claim 1, characterized in that The system further comprises: The mechanical transmission control module is connected to the control host and is used to classify and pack the infrared receiving head components that have completed the test according to the test results obtained by the control host.
4. The system according to any one of claims 1 to 3, characterized in that: When there are multiple infrared receiving heads in the infrared receiving head component to be detected that receive infrared transmission signals at the same time, the function detection sampling module samples the output signal of each infrared receiving head in parallel.
5. The system according to any one of claims 1 to 3, characterized in that: The first infrared transmission signal module and the second infrared transmission signal module are used for simulating near field test and far field test respectively.
6. A method for testing an infrared receiving head, characterized in that: include: According to the set test parameters, the first and second infrared emission signal modules are controlled to output infrared emission signals; The first and second infrared transmission signal modules are used to transmit infrared transmission signals to the infrared receiving head components to be detected, and the two modules can transmit infrared transmission signals of different intensities in sequence; Acquire sampling information of the output signal of the infrared receiving head component to be detected, perform calculation and judgment on the sampling information and a preset parameter range, and obtain a test result of the infrared receiving head component to be detected; The multiple test parameters at least include a coding format, and the coding format supports at least one existing coding format and a custom coding format.
7. The method according to claim 6, characterized in that The method further comprises: The test result is displayed through the information display terminal.
8. The method according to claim 6, characterized in that The method further comprises: The infrared receiving head components that have completed the test are classified and packaged according to the test results.
9. A computer device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that: When the processor executes the computer program, the method according to any one of claims 6 to 8 is implemented.
10. A computer program product, characterized in that When the computer program product is executed on a computer device, the computer device is caused to execute the method according to any one of claims 6 to 8.