Substrate processing apparatus and substrate processing method

Abstract

The present invention relates to a substrate processing apparatus and a substrate processing method for suppressing cracks and notches in a laminated substrate manufactured by bonding a plurality of substrates, and more particularly, to a technique for applying a filler to gaps at edge portions of the plurality of substrates constituting the laminated substrate. A substrate processing apparatus (1) is provided with: a coating device (3) that coats a filler (F) in a gap (G) between an edge (E1) of a first substrate (W1) and an edge (E2) of a second substrate (W2); a thermal imaging camera (5) that generates a thermal image (40) on the basis of infrared rays emitted from the filler (F) applied to the gap (G); and an image processing unit (30) that determines the state of the filler (F) applied to the gap (G) on the basis of the thermal image (40).

Description

Technical Field

[0001] The present invention relates to a substrate processing apparatus and a substrate processing method for suppressing breakage and chipping of a stacked substrate manufactured by bonding a plurality of substrates, and particularly relates to a technique for coating a filler in a gap at an edge portion of a plurality of substrates constituting the stacked substrate. Background Art

[0002] In recent years, in order to achieve further high density and high functionality of semiconductor devices, three-dimensional packaging technologies that stack a plurality of substrates and integrate them three-dimensionally have been continuously developed. In three-dimensional packaging technologies, for example, the device surface of a first substrate on which an integrated circuit and electrical wiring are formed is bonded to the device surface of a second substrate on which an integrated circuit and electrical wiring are formed. Further, after the first substrate is bonded to the second substrate, the second substrate is thinned by a grinding device or a cutting device. As described above, integrated circuits can be stacked in a direction perpendicular to the device surfaces of the first substrate and the second substrate.

[0003] In three-dimensional packaging technologies, three or more substrates can also be bonded. For example, after the second substrate bonded to the first substrate is thinned, a third substrate can be bonded to the second substrate and the third substrate can be thinned. In the present specification, there are cases where a method of a plurality of substrates bonded to each other is referred to as a "stacked substrate".

[0004] In order to prevent breakage (cracks) or chipping (burrs), the edge portion of the substrate is usually ground in advance into a rounded shape or a chamfered shape. If the second substrate having the above-described shape is cut (thinned), as a result, a sharp end portion is formed on the second substrate. The sharp end portion (hereinafter referred to as a blade portion) is formed by the back surface of the second substrate after cutting and the outer peripheral surface of the second substrate. The blade portion as described above is likely to cause chipping due to physical contact, and there are cases where the stacked substrate is damaged during conveyance of the stacked substrate. Further, if the bonding between the first substrate and the second substrate is insufficient, there are also cases where the second substrate breaks during cutting.

[0005] Therefore, in order to prevent breakage (cracks) or chipping (burrs) of the blade portion, a filler is coated on the edge portion of the stacked substrate before cutting the second substrate. The filler is coated in the gap between the edge portion of the first substrate and the edge portion of the second substrate. The filler supports the blade portion formed after cutting the second substrate, and can prevent breakage or chipping of the blade portion.

[0006] Prior Art Documents

[0007] Patent Documents

[0008] Patent Document 1: Japanese Unexamined Patent Application Publication No. 2022-38834

[0009] Problems to be Solved by the Invention

[0010] When applying a filler to the gap between the edge portion of the first substrate and the edge portion of the second substrate, there may be cases of poor filling such as insufficient filler or overcoating under preset coating conditions. If the laminated substrate is processed in subsequent processes while maintaining the state of poor filling, there is a concern that damage may occur to the laminated substrate, etc., which may have an adverse effect on the laminated substrate or the process performance. Therefore, it is necessary to correctly monitor the filling state of the filler applied to the gap of the laminated substrate.

[0011] Furthermore, when the applied filler is heated to cure the filler, there may be cases of insufficient curing of the filler or overheating of the filler under preset heating conditions. If the filler is not sufficiently cured, due to poor adhesion or insufficient mechanical strength of the filler, the edge portion formed on the laminated substrate cannot be sufficiently protected. In addition, if the filler is heated beyond necessity, the overall throughput of the process will be reduced. Therefore, it is necessary to correctly monitor the curing state of the filler applied to the gap of the laminated substrate. Summary of the Invention

[0012] Therefore, the present invention provides a substrate processing apparatus and a substrate processing method capable of correctly determining the filling state of a filler applied to the gap between the edge portion of the first substrate and the edge portion of the second substrate. In addition, the present invention provides a substrate processing apparatus and a substrate processing method capable of correctly determining the curing state of a filler applied to the gap between the edge portion of the first substrate and the edge portion of the second substrate.

[0013] (Technical Means for Solving the Problem)

[0014] The inventors studied the following: Based on the images of the edge portion of the laminated substrate and the filler obtained by an imaging device such as a CCD camera, the filling state of the filler applied to the gap between the edge portion of the first substrate and the edge portion of the second substrate is determined. However, especially in the case of a transparent filler, it is difficult to observe the filler in the captured image, and the filling state of the filler cannot be determined. In addition, in order to determine the curing state of the filler, it is necessary to correctly monitor the temperature of the filler.

[0015] Therefore, in one aspect, there is provided a substrate processing apparatus that applies a filler to a laminated substrate formed by bonding a first substrate and a second substrate, comprising: a coating device that applies the filler to the gap between the edge portion of the first substrate and the edge portion of the second substrate; a thermal imaging camera that generates a thermal image based on infrared rays emitted from the filler applied to the gap; and an image processing unit that determines the state of the filler applied to the gap based on the thermal image.

[0016] In one mode, the image processing unit is configured to determine the filling state of the filler applied to the gap based on the width of the filler on the thermal image.

[0017] In one mode, the substrate processing apparatus further includes an operation control unit that controls the operation of the coating apparatus. The operation control unit is configured to issue an instruction to the coating apparatus to end the coating of the filler based on the determination result of the filling state of the filler.

[0018] In one mode, the substrate processing apparatus further includes a curing apparatus that heats the filler applied to the gap to cure the filler. The image processing unit is configured to obtain temperature information of the filler applied to the gap based on the thermal image, and determine the curing state of the filler applied to the gap based on the temperature information.

[0019] In one mode, the substrate processing apparatus further includes an operation control unit that controls the operation of the curing apparatus. The operation control unit is configured to issue an instruction to the curing apparatus to end the heating of the filler based on the determination result of the curing state of the filler.

[0020] In one mode, the image processing unit is configured to generate a plurality of thermal images at a plurality of measurement points in the circumferential direction along the edge portion of the stacked substrate, and determine the state of the filler applied to the gap based on the plurality of thermal images.

[0021] In one mode, the thermal imaging camera is configured to generate the thermal image according to far-infrared rays emitted from the filler applied to the gap.

[0022] In one mode, a substrate processing method is provided. A filler is applied to a stacked substrate formed by bonding a first substrate and a second substrate. The filler is applied to a gap between an edge portion of the first substrate and an edge portion of the second substrate. A thermal image is generated by a thermal imaging camera according to infrared rays emitted from the filler applied to the gap, and the state of the filler applied to the gap is determined based on the thermal image.

[0023] In one mode, the step of determining the state of the filler is a step of determining the filling state of the filler applied to the gap based on the width of the filler on the thermal image.

[0024] In one mode, the substrate processing method ends the coating of the filler based on the determination result of the filling state of the filler.

[0025] In one mode, the substrate processing method further includes a step of heating the filler coated in the gap to cure the filler, and the step of determining the state of the filler is as follows: based on the thermal image, obtaining the temperature information of the filler coated in the gap, and based on the temperature information, determining the curing state of the filler coated in the gap.

[0026] In one mode, the substrate processing method ends the heating of the filler based on the determination result of the curing state of the filler.

[0027] In one mode, the substrate processing method generates a plurality of thermal images at a plurality of measurement points in the circumferential direction along the edge portion of the stacked substrate, and determines the state of the filler coated in the gap based on the plurality of thermal images.

[0028] In one mode, the thermal image is generated by the thermal imaging camera according to the far-infrared rays radiated from the filler coated in the gap.

[0029] (Advantages of the Invention)

[0030] According to the present invention, based on the thermal image generated by the thermal imaging camera, the filling state of the filler in the gap between the edge portion of the first substrate and the edge portion of the second substrate can be correctly determined. In addition, based on the thermal image generated by the thermal imaging camera, the temperature information of the filler can be obtained, and based on the obtained temperature information, the curing state of the filler in the gap between the edge portion of the first substrate and the edge portion of the second substrate can be correctly determined. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1A It is a cross-sectional view showing an example of the edge portion of the stacked substrate to be processed.

[0032] Figure 1B It is a cross-sectional view showing an example of the edge portion of the stacked substrate coated with the filler.

[0033] Figure 1C It is a cross-sectional view showing an example of the edge portion of the stacked substrate thinned after coating the filler.

[0034] Figure 2 It is a side view showing an embodiment of the substrate processing apparatus.

[0035] Figure 3 is Figure 2 a front view of the substrate processing apparatus shown.

[0036] Figure 4 It is a schematic diagram showing an embodiment of the coating apparatus.

[0037] Figure 5 It is a schematic diagram showing how a thermal image is generated by a thermal imaging camera.

[0038] Figure 6 It is a schematic diagram showing an example of a thermal image generated by a thermal imaging camera.

[0039] Figure 7 It is a schematic diagram showing another example of a thermal image generated by a thermal imaging camera.

[0040] Figure 8 It is a diagram showing an embodiment of a plurality of measurement points provided on a stacked substrate.

[0041] Figure 9A It is a schematic diagram showing yet another example of a thermal image generated by a thermal imaging camera.

[0042] Figure 9B It is a schematic diagram showing yet another example of a thermal image generated by a thermal imaging camera.

[0043] Figure 10 It is a top view showing another embodiment of a substrate processing apparatus.

[0044] Figure 11 It is Figure 10 a side view of the substrate processing apparatus shown.

[0045] Figure 12 It is a schematic diagram showing how a thermal image is generated by a thermal imaging camera.

[0046] Figure 13 It is a schematic diagram showing an example of a thermal image generated by a thermal imaging camera.

[0047] Figure 14 It is a schematic diagram showing another example of a thermal image generated by a thermal imaging camera 5. Detailed Embodiment

[0048] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0049] Figure 1A It is a cross-sectional view showing an example of an edge portion of a stacked substrate to be processed. As Figure 1A shown, the stacked substrate Ws has a structure in which a first substrate W1 and a second substrate W2 are joined. The first substrate W1 and the second substrate W2 used in this embodiment are circular.

[0050] The edge portion E1 of the first substrate W1 is the outermost side surface that is inclined with respect to the bonding surface (e.g., the device surface) S1 of the first substrate W1. More specifically, the edge portion E1 of the first substrate W1 has a rounded shape or a chamfered shape. Similarly, the edge portion E2 of the second substrate W2 is the outermost side surface that is inclined with respect to the bonding surface (e.g., the device surface) S2 of the second substrate W2. More specifically, the edge portion E2 of the second substrate W2 has a rounded shape or a chamfered shape. The edge portions E1 and E2 are also referred to as beveled surfaces. A gap G is formed between the edge portion E1 of the first substrate W1 and the edge portion E2 of the second substrate W2. The edge portion of the stacked substrate Ws includes the edge portion E1 of the first substrate W1 and the edge portion E2 of the second substrate W2.

[0051] Figure 1B It is a cross-sectional view showing an example of the edge portion of the stacked substrate Ws coated with the filler F. The filler F is coated in the gap G between the edge portion E1 of the first substrate W1 and the edge portion E2 of the second substrate W2. The gap G is formed throughout the entire circumference of the stacked substrate Ws and has a substantially triangular cross-section. The filler F is coated so as to fill the gap G.

[0052] Figure 1C It is a cross-sectional view showing an example of the edge portion of the stacked substrate Ws thinned after coating the filler F. As a result of this thinning process, a blade portion Ek is formed at the edge portion E2 of the second substrate W2. The blade portion Ek is held (supported) by the filler F, thereby preventing breakage (cracks) or notches (chipping) of the blade portion Ek.

[0053] Figure 2 It is a side view showing an embodiment of the substrate processing apparatus 1, Figure 3 is Figure 2 The front view of the substrate processing apparatus 1 shown. The substrate processing apparatus 1 is an apparatus for coating the filler F on the stacked substrate Ws in which the first substrate W1 and the second substrate W2 are joined. The substrate processing apparatus 1 has: a substrate holding device 2 that holds the stacked substrate Ws in a vertical posture and rotates the held stacked substrate Ws; a coating device 3 for coating the filler F; a curing device 4 for heating and curing the coated filler F; and a thermal imaging camera 5 for generating a thermal image of the filler F coated on the stacked substrate Ws.

[0054] The substrate holding device 2 has: a holding plate 12 that holds the back surface of the stacked substrate Ws; a rotating shaft 13 connected to the central portion of the holding plate 12; and a rotating mechanism 15 that rotates the holding plate 12 and the rotating shaft 13. The holding plate 12 is configured to hold the back surface of the stacked substrate Ws by vacuum adsorption. As Figure 3As shown, the holding plate 12 has a holding surface 12a perpendicular to the horizontal plane. The stacked substrate Ws is held by the holding plate 12 such that the flat portion of the stacked substrate Ws is perpendicular to the horizontal plane. Thus, the stacked substrate Ws is held in a vertical posture by the substrate holding device 2.

[0055] The stacked substrate Ws is held on the holding plate 12 such that the center of the stacked substrate Ws coincides with the axis of the rotating shaft 13. The rotating mechanism 15 has a motor (not shown). As Figure 2 shown, the rotating mechanism 15 is configured to integrally rotate the holding plate 12 and the stacked substrate Ws about the central axis Cr of the stacked substrate Ws in the direction indicated by the arrow.

[0056] In one embodiment, the substrate holding device 2 may include a plurality (e.g., four) of rollers (not shown) that can contact the peripheral portion of the stacked substrate Ws instead of the holding plate 12. The stacked substrate Ws is held by these rollers such that the flat portion of the stacked substrate Ws is perpendicular to the horizontal plane. At this time, the substrate holding device 2 includes a roller rotating mechanism (not shown) that rotates each roller about its axis in the same direction at the same speed instead of the rotating shaft 13 and the rotating mechanism 15. The stacked substrate Ws is rotated about the central axis Cr of the stacked substrate Ws by the roller rotating mechanism rotating the plurality of rollers.

[0057] The coating device 3 is located outside the radius of the stacked substrate Ws held by the substrate holding device 2 and is disposed opposite to the gap G above the stacked substrate Ws. The coating device 3 is configured to coat the filler F in the gap G between the edge portion E1 of the first substrate W1 and the edge portion E2 of the second substrate W2 of the stacked substrate Ws. The coating of the filler F by the coating device 3 is performed while rotating the stacked substrate Ws by the substrate holding device 2.

[0058] Figure 4 is a schematic diagram showing an embodiment of the coating device 3. The coating device 3 has: a syringe 21 for ejecting the filler F; a piston 22 that can reciprocate within the syringe 21; and a syringe moving mechanism (not shown) that moves the syringe 21 closer to or away from the stacked substrate Ws. By this syringe moving mechanism, the coating device 3 can adjust the distance between the stacked substrate Ws and the filler ejection port 21a of the coating device 3. In one embodiment, the coating device 3 may omit the syringe moving mechanism. At this time, the distance between the stacked substrate Ws and the filler ejection port 21a is predetermined such that the filler F is appropriately injected into the gap G of the stacked substrate Ws.

[0059] The syringe 21 has a hollow structure and is configured to be filled with a filler F therein. A piston 22 is disposed within the syringe 21. The syringe 21 has a filler ejection port 21a at its front end for ejecting the filler F. The front end of the syringe 21 including the filler ejection port 21a may also be configured to be attachable and detachable. The shape of the filler ejection port 21a is appropriately selected according to the physical properties (such as viscosity, etc.) of the filler F to be coated. The filler ejection port 21a is arranged to face the gap G between the edge portion E1 of the first substrate W1 and the edge portion E2 of the second substrate W2.

[0060] The coating device 3 is connected to a gas supply source via a gas supply line 25. When gas (such as dry air or nitrogen) is supplied from the gas supply source to the syringe 21, the piston 22 advances within the syringe 21. By the advancement of the piston 22, the filler F within the syringe 21 is ejected from the filler ejection port 21a. A pressure adjusting device 26 is arranged in the gas supply line 25. By adjusting the pressure of the gas supplied from the gas supply source to the coating device 3, the amount of the filler F ejected from the filler ejection port 21a per unit time on average can be adjusted. When the coating device 3 ejects the filler F, the filler F falls toward the gap G of the stacked substrate Ws. As a result, the filler F can be coated on the gap G of the stacked substrate Ws.

[0061] In one embodiment, the coating device 3 may also be provided with a spiral feeder to replace the combination of the syringe 21 and the piston 22.

[0062] As Figure 2 shown, the curing device 4 is located outside the radius direction of the stacked substrate Ws held by the substrate holding device 2 and is arranged to face the gap G of the stacked substrate Ws. The curing device 4 is arranged on the downstream side of the coating device 3 in the rotation direction of the stacked substrate Ws. The curing device 4 is configured to heat the filler F coated on the stacked substrate Ws by the coating device 3 to cure it. The curing of the filler F by the curing device 4 is performed while rotating the stacked substrate Ws by the substrate holding device 2. In the present embodiment, the filler F is a filler having thermosetting properties. Taking the example of the filler as shown above, a thermosetting resin is cited.

[0063] In the present embodiment, the filler F is a filler having thermosetting properties, but in one embodiment, the filler F may also be a filler having ultraviolet curability. At this time, the curing device 4 may also be a UV irradiation device that irradiates ultraviolet rays to cure the filler F. If the filler F contains a solvent, an air heater or the like may also be used to heat the filler F and volatilize the solvent.

[0064] The filler F contains a binder, a solvent, particles, etc. The particles are dispersed in the binder dissolved in the solvent. For example, the composition of the filler F is the type of binder, the amount of solvent, the amount of particles, and the particle size. As an example of the binder, an inorganic binder containing an alkali metal silicate, an organic binder composed of a silicone resin or an epoxy resin, and an inorganic / organic hybrid binder are listed. The particles are, for example, particles such as silica or alumina. Particles are mixed into the binder to increase the volume of the filler F and to adjust the viscosity of the filler F. In order to reduce the viscosity of the filler F, there are also cases where the filler F does not contain particles.

[0065] The curing device 4 of the present embodiment is an air heater, configured to blow hot air toward the filler F coated on the laminated substrate Ws. The filler F heated by the hot air is cured by a crosslinking reaction. If the filler F contains a solvent, the solvent volatilizes by heating. The curing device 4 is not limited to an air heater as long as it can heat the filler F to cure it, and it can also be a lamp heater or other configurations.

[0066] The substrate processing device 1 further has an operation control unit 10 that controls the operations of the substrate holding device 2, the coating device 3, the curing device 4, and the pressure adjustment device 26. The substrate holding device 2, the coating device 3, the curing device 4, and the pressure adjustment device 26 are electrically connected to the operation control unit 10.

[0067] The operation control unit 10 is composed of at least one computer. The operation control unit 10 has: a storage device 10a storing a program; and a processing device 10b that executes operations according to the commands included in the program. The storage device 10a has: a main storage device such as a random access memory (RAM), and auxiliary storage devices such as a hard disk drive (HDD) and a solid state drive (SSD). As an example of the processing device 10b, a CPU (central processing unit) and a GPU (graphics processing unit) are listed. However, the specific configuration of the operation control unit 10 is not limited to these examples.

[0068] The thermal imaging camera 5 is located outside the laminated substrate Ws held by the substrate holding device 2 in the radial direction, and is disposed opposite to the gap G of the laminated substrate Ws. The thermal imaging camera 5 is disposed on the downstream side of the curing device 4 in the rotational direction of the laminated substrate Ws. The thermal imaging camera 5 is configured to detect infrared rays radiated from the edge portion of the laminated substrate Ws and the filler F of the laminated substrate Ws, and generate a thermal image based on the detected infrared rays. Generation of the thermal image by the thermal imaging camera 5 can also be performed while rotating the laminated substrate Ws by the substrate holding device 2.

[0069] Figure 5It is a schematic diagram showing the appearance of generating a thermal image by the thermal imaging camera 5. The thermal imaging camera 5 is disposed substantially perpendicular to the gap G between the edge portion E1 of the first substrate W1 and the edge portion E2 of the second substrate W2 of the stacked substrate Ws.

[0070] The thermal imaging camera 5 of the present embodiment is configured to detect infrared rays having wavelengths in the range of 0.9 μm to 14 μm. In one embodiment, the thermal imaging camera 5 may also be configured to detect far-infrared rays having wavelengths in the range of 3 μm to 14 μm. In other embodiments, the thermal imaging camera 5 may also be configured to detect far-infrared rays having wavelengths in the range of 7 μm to 14 μm.

[0071] The intensity of the infrared rays radiated from the object depends on the temperature of the object and the emissivity inherent to the substance. If the edge portions (i.e., the edge portion E1 of the first substrate W1 and the edge portion E2 of the second substrate W2) of the stacked substrate Ws and the filler F of the stacked substrate Ws are at the same temperature, the intensity of the infrared rays radiated by the filler F is greater than the intensity of the infrared rays radiated by the edge portions E1 and E2. This is because silicon constituting the first substrate W1 and the second substrate W2 transmits infrared rays, and because the emissivity of the material constituting the filler F (a thermosetting resin in the present embodiment) is higher than the emissivity of silicon constituting the first substrate W1 and the second substrate W2.

[0072] Figure 6 It is a schematic diagram showing an example of the thermal image generated by the thermal imaging camera 5. Figure 6 The thermal image 40 shown is as described with reference to Figure 5 As described, it is a thermal image generated by detecting the infrared rays radiated from the edge portions of the stacked substrate Ws coated thereon and the filler F of the stacked substrate Ws by the thermal imaging camera 5. The thermal image of the present embodiment is an image showing the distribution of the intensity of the infrared rays radiated from the object, and is not limited to an image showing the temperature distribution of the object.

[0073] The thermal image 40 of the present embodiment is presented in monochrome (grayscale) by the setting of the thermal imaging camera 5, and the intensity of the infrared rays detected from the object is reflected as the contrast between black and white. As Figure 6 shown, the regions 41 and 42 on the thermal image 40 of the edge portion E1 of the first substrate W1 and the edge portion E2 of the second substrate W2, which represent small intensities of the radiated infrared rays, appear in a color close to black. On the other hand, the region 43 on the thermal image 40 of the filler F, which represents a large intensity of the radiated infrared rays, appears in a color close to white.

[0074] As Figure 2As shown, the substrate processing apparatus 1 further includes an image processing unit 30 connected to the thermal imaging camera 5. The image processing unit 30 is configured to determine the state of the filler F coated in the gap G of the stacked substrate Ws based on the thermal image 40 generated by the thermal imaging camera 5. In the present embodiment, the image processing unit 30 is configured to determine the filling state of the filler F coated in the gap G of the stacked substrate Ws based on the width X of the region 43 representing the filler F on the thermal image 40. Figure 6 The thermal image 40 shown is a thermal image generated in a state where the filling of the gap G of the stacked substrate Ws with the filler F by the coating device 3 has been completed.

[0075] Figure 7 It is a schematic diagram showing another example of the thermal image 40 generated by the thermal imaging camera 5. Figure 7 The thermal image 40 shown is a thermal image generated in a state where the filling of the gap G of the stacked substrate Ws with the filler F by the coating device 3 has not been completed. Figure 7 The width X of the region 43 representing the filler F on the thermal image 40 shown is less than Figure 6 The width X of the region 43 representing the filler F on the thermal image 40 shown. The width X of the filler F coated in the gap G of the stacked substrate Ws increases as the amount of the coated filler F increases. Therefore, the image processing unit 30 can determine the filling state of the filler F based on the width X of the filler F on the thermal image 40.

[0076] More specifically, when the width X of the region 43 representing the filler F on the thermal image 40 is less than a specified threshold value, the image processing unit 30 determines the filling state of the filler F as "filling not completed". When the width X of the region 43 representing the filler F on the thermal image 40 is equal to or greater than the specified threshold value, the image processing unit 30 determines the filling state of the filler F as "filling completed". In the present embodiment, the specified threshold value is set to the width of the filler F when the filling of the gap G of the stacked substrate Ws with the filler F has been completed.

[0077] According to the present embodiment, the image processing unit 30 can correctly determine the filling state of the filler F coated in the gap G of the stacked substrate Ws based on the thermal image 40 generated by the thermal imaging camera 5. In particular, even for a transparent filler F, the difference in contrast between the edge portion E1 of the first substrate W1 and the edge portion E2 of the second substrate W2 and the filler F on the thermal image 40 is clear, so the image processing unit 30 can correctly identify the width X of the filler F.

[0078] As Figure 2As shown, the image processing unit 30 is connected to the motion control unit 10. The image processing unit 30 is configured to send the determination result of the filling state of the filler F to the motion control unit 10. Based on the determination result of the filling state of the filler F coated on the gap G of the stacked substrate Ws sent from the image processing unit 30, the motion control unit 10 issues an instruction to the coating device 3 to continue or end the coating of the filler F. More specifically, when the determination result of the filling state of the filler F is "filling not completed", the motion control unit 10 issues an instruction to the coating device 3 to continue the coating of the filler F. When the determination result of the filling state of the filler F is "filling completed", the motion control unit 10 issues an instruction to the coating device 3 to end the coating of the filler F.

[0079] According to the present embodiment, it is possible to end the coating of the filler F by the coating device 3 at the moment when the filler F is coated on the gap G of the stacked substrate Ws in an appropriate coating amount.

[0080] The thermal imaging camera 5 generates an image of the edge portion of the stacked substrate Ws at a preset measurement point during one rotation of the stacked substrate Ws. The number of measurement points may be one or two or more. Figure 8 It is a diagram showing an embodiment of a plurality of measurement points set on the stacked substrate Ws. In the present embodiment, the number of measurement points is four.

[0081] As Figure 8 shown, the four measurement points M1 to M4 are located at equal intervals along the circumferential direction of the edge portion of the stacked substrate Ws around the central axis Cr of the stacked substrate Ws. The motion control unit 10 has the position information (such as angle information) of the coating start point of the filler F and the measurement points M1 to M4. The stacked substrate Ws rotates Figure 8 in the direction indicated by the arrow. When the coating start point of the filler F coincides with the measurement point M1, the coating device 3 starts coating from the measurement point M1, and then continuously coats the filler F on the edge portion of the stacked substrate Ws. The filler F may also be coated during multiple rotations of the stacked substrate Ws depending on its total coating amount.

[0082] The thermal imaging camera 5 generates thermal images of the filler F in the gaps G between the edge portions of the laminated substrate Ws and the laminated substrate Ws in the order of measurement points M1, M2, M3, and M4 at each measurement point. The image processing unit 30 determines the filling state of the filler F at the plurality of measurement points M1 to M4 in the gap G between the edge portion E1 of the first substrate W1 and the edge portion E2 of the second substrate W2 based on the plurality of thermal images at the plurality of measurement points M1 to M4 generated by the thermal imaging camera 5. The image processing unit 30 is configured to send the determination result of the filling state of the filler F at the plurality of measurement points M1 to M4 to the motion control unit 10. The motion control unit 10 issues an instruction to the coating device 3 based on the determination result of the filling state of the filler F at the plurality of measurement points M1 to M4 sent from the image processing unit 30 to continue or end the coating of the filler F.

[0083] In one embodiment, the motion control unit 10 may also perform additional coating of the filler F on a part of the edge portion of the laminated substrate Ws through the coating device 3 based on the determination result of the filling state of the filler F at the plurality of measurement points M1 to M4 and the position information of the plurality of measurement points M1 to M4. For example, when the image processing unit 30 determines that the filling state is "not filled" at the measurement point M1 and the filling state is "filled" at the measurement points M2 to M4, the motion control unit 10 may issue an instruction to the coating device 3 to perform additional coating of the filler F only at the measurement point M1.

[0084] Next, another embodiment of the image processing unit 30 will be described. The image processing unit 30 of this embodiment is configured to determine the curing state of the filler F in the gap G of the laminated substrate Ws based on the thermal image 40 generated by the thermal imaging camera 5. The filler F in this embodiment is a filler having thermosetting properties. As described above, the curing device 4 heats the filler F coated in the gap G of the edge portion of the laminated substrate Ws by the coating device 3 to cure it. The filler F is composed of a thermosetting resin that cures when heated to a specified temperature.

[0085] Figure 9A and Figure 9B is a schematic diagram showing another example of the thermal image generated by the thermal imaging camera 5. The thermal image 40 of this embodiment is represented in monochrome (gray scale) by the setting of the thermal imaging camera 5, and the intensity of the infrared rays detected from the object is reflected as black and white contrast. In one embodiment, the thermal image 40 may also be represented in color by the setting of the thermal imaging camera 5, and the intensity of the infrared rays detected from the object is reflected as hue.

[0086] Figure 9A is the thermal image generated by the thermal imaging camera 5 after the heating of the filler F just coated in the gap G of the edge portion of the laminated substrate Ws by the curing device 4.Figure 9B It is a thermal image generated by the thermal imaging camera 5 when the filler F coated on the gap G at the edge of the stacked substrate Ws is heated to a specified temperature by the curing device 4. Figure 9A and Figure 9B The temperature index 45 shown is preset by inputting information on the emissivity of the material constituting the filler F into the thermal imaging camera 5 to display the temperature index of the filler F.

[0087] In the case of an object having the same emissivity, the higher the temperature of the object, the greater the intensity of the infrared rays emitted. In the region 43 of the filler F representing the thermal image 40, the lower the temperature of the filler F, the closer it appears in a color close to black, and the higher the temperature of the filler F, the closer it appears in a color close to white. The regions 41 and 42 on the thermal image 40 representing the edge E1 of the first substrate W1 and the edge E2 of the second substrate W2 appear in a color close to black regardless of the temperature of the edges E1 and E2. This is because the infrared rays pass through the silicon constituting the first substrate W1 and the second substrate W2, and because the emissivity of the material constituting the filler F (a thermosetting resin in this embodiment) is higher than the emissivity of the silicon constituting the first substrate W1 and the second substrate W2.

[0088] Figure 9A The temperature of the filler F shown is lower than Figure 9B the temperature of the filler F shown. In this embodiment, Figure 9A the temperature of the filler F shown is 40 degrees, Figure 9B the temperature of the filler F shown is 180 degrees. Therefore, if the thermal image 40 of Figure 9A is compared with the thermal image 40 of Figure 9B , in the region 43 on the thermal image 40 representing the filler F, Figure 9A the thermal image 40 of Figure 9B appears in a color closer to black than the thermal image 40 of

[0089] The image processing unit 30 obtains temperature information of the filler F in the gap G coated on the edge portion of the stacked substrate Ws based on the thermal image 40 generated by the thermal imaging camera 5. In one embodiment, the image processing unit 30 may also obtain the temperature information of the filler F based on the intensity of the infrared rays emitted from the filler F detected by the thermal imaging camera 5. The image processing unit 30 determines the curing state of the filler F in the gap G coated on the edge portion of the stacked substrate Ws based on the obtained temperature information of the filler F. More specifically, when the temperature of the obtained filler F is less than a specified temperature, the image processing unit 30 determines the curing state of the filler F as "curing not completed". When the temperature of the obtained filler F is equal to or higher than the specified temperature, the image processing unit 30 determines the curing state of the filler F as "curing completed". In the present embodiment, the specified temperature is set to the temperature at which the curing of the filler F coated in the gap G of the stacked substrate Ws is completed.

[0090] According to the present embodiment, the image processing unit 30 can obtain the temperature information of the filler F in the gap G coated on the stacked substrate Ws based on the thermal image 40 generated by the thermal imaging camera 5, and correctly determine the curing state of the filler F based on the temperature information of the filler F.

[0091] The image processing unit 30 is configured to send the determination result of the curing state of the filler F to the motion control unit 10. The motion control unit 10 issues an instruction to the curing device 4 to continue or end the heating of the filler F based on the determination result of the curing state of the filler F in the gap G coated on the stacked substrate Ws sent from the image processing unit 30. More specifically, when the determination result of the curing state of the filler F is "curing not completed", the motion control unit 10 issues an instruction to the curing device 4 to continue the heating of the filler F. When the determination result of the curing state of the filler F is "curing completed", the motion control unit 10 issues an instruction to the curing device 4 to end the heating of the filler F.

[0092] According to the present embodiment, the filler F coated in the gap G of the stacked substrate Ws is heated to a specified temperature, and the heating of the filler F based on the curing device 4 can be ended at an appropriate curing time.

[0093] In one embodiment, the thermal imaging camera 5 may also be as Figure 8As shown, a plurality of (four in this embodiment) thermal images of the filler F filled in the gap G between the edge portion of the laminated substrate Ws and the laminated substrate Ws are generated at a plurality of measurement points M1 to M4. The image processing unit 30 acquires a plurality of temperature information of the filler F at the plurality of measurement points M1 to M4 based on the plurality of thermal images at the plurality of measurement points M1 to M4 generated by the thermal imaging camera 5, and determines the curing state of the filler F at the plurality of measurement points M1 to M4. The image processing unit 30 is configured to send the determination result of the curing state of the filler F at the plurality of measurement points M1 to M4 to the motion control unit 10. Based on the determination result of the curing state of the filler F at the plurality of measurement points M1 to M4 sent from the image processing unit 30, the motion control unit 10 issues an instruction to the curing device 4 to continue or end the heating of the filler F.

[0094] In one embodiment, the motion control unit 10 may also perform additional heating of the filler F on a part of the edge portion of the laminated substrate Ws through the curing device 4 based on the determination result of the curing state of the filler F at the plurality of measurement points M1 to M4 and the position information of the plurality of measurement points M1 to M4. For example, when the image processing unit 30 determines that the curing state at the measurement point M1 is "not fully cured" and the curing states at the measurement points M2 to M4 are "fully cured", the motion control unit 10 may issue an instruction to the curing device 4 to perform additional heating of the filler F only at the measurement point M1.

[0095] Next, other embodiments of the substrate processing apparatus 1 will be described. Figure 10 FIG. is a plan view showing another embodiment of the substrate processing apparatus 1. Figure 11 is Figure 10 a side view of the substrate processing apparatus 1 shown. The configuration of this embodiment not specifically described is the same as that of the embodiment described with reference to Figure 2 and Figure 3 and thus the repeated description thereof is omitted. The substrate processing apparatus 1 of this embodiment has a substrate holding device 50 that holds the laminated substrate Ws in a horizontal posture, replacing the substrate holding device 2 that holds the laminated substrate Ws in a vertical posture.

[0096] The substrate holding device 50 includes: a holding plate 52 that horizontally holds the back surface of the laminated substrate Ws; a rotating shaft 53 connected to the central portion of the holding plate 52; and a rotating mechanism 55 that rotates the holding plate 52 and the rotating shaft 53. The holding plate 52 is configured to hold the back surface of the laminated substrate Ws by vacuum adsorption. As Figure 11 shown, the holding plate 52 has a horizontal holding surface 52a. The laminated substrate Ws is horizontally held by the holding plate 52. Therefore, the laminated substrate Ws is held in a horizontal posture by the substrate holding device 2.

[0097] The stacked substrate Ws is placed on the holding plate 52 such that the center of the stacked substrate Ws coincides with the axis of the rotation shaft 53. The rotation mechanism 55 has a motor (not shown). As shown in Figure 10 , the rotation mechanism 55 is configured to integrally rotate the holding plate 52 and the stacked substrate Ws about the central axis Cr of the stacked substrate Ws in the direction indicated by the arrow.

[0098] In one embodiment, the substrate holding device 50 may include a plurality (e.g., four) of rollers (not shown) that can contact the peripheral portion of the stacked substrate Ws instead of the holding plate 52, and the stacked substrate Ws is horizontally held by these rollers. At this time, the substrate holding device 50 includes a roller rotation mechanism (not shown) that rotates each roller in the same direction at the same speed about its axis instead of the rotation shaft 53 and the rotation mechanism 55. By rotating the plurality of rollers through the roller rotation mechanism, the stacked substrate Ws rotates about the central axis Cr of the stacked substrate Ws.

[0099] The coating device 3 is located outside the stacked substrate Ws held by the substrate holding device 50 in the radial direction and is disposed opposite to the gap G of the stacked substrate Ws. The coating device 3 is configured to coat the filler F in the gap G between the edge portion E1 of the first substrate W1 and the edge portion E2 of the second substrate W2 of the stacked substrate Ws. The coating of the filler F by the coating device 3 is performed while rotating the stacked substrate Ws by the substrate holding device 2.

[0100] As shown in Figure 10 , the curing device 4 is located outside the stacked substrate Ws in the radial direction. The curing device 4 is configured to be disposed on the downstream side of the coating device 3 in the rotation direction of the stacked substrate Ws and cure the filler F coated on the stacked substrate Ws by the coating device 3. The curing of the filler F by the curing device 4 is performed while rotating the stacked substrate Ws.

[0101] The thermal imaging camera 5 is located outside the stacked substrate Ws held by the substrate holding device 50 in the radial direction and is disposed above the edge portion of the stacked substrate Ws. The thermal imaging camera 5 is disposed on the downstream side of the curing device 4 in the rotation direction of the stacked substrate Ws. The generation of the thermal image by the thermal imaging camera 5 may also be performed while rotating the stacked substrate Ws by the substrate holding device 2. The thermal imaging camera 5 is located above the edge portion of the stacked substrate Ws and is configured to detect the infrared rays emitted from the filler F coated on the edge portion of the stacked substrate Ws and the stacked substrate Ws and generate a thermal image based on the detected infrared rays.

[0102] In the operation control unit 10, the substrate holding device 50, the coating device 3, the curing device 4, and the pressure adjustment device 26 (refer to Figure 4) is electrically connected to the motion control unit 10. The operations of the substrate holding device 50, the coating device 3, the curing device 4, and the pressure adjustment device 26 are controlled by the motion control unit 10.

[0103] Figure 12 is a schematic diagram showing the state of generating a thermal image by the thermal imaging camera 5. The thermal imaging camera 5 is arranged substantially perpendicular to the flat surface of the stacked substrate Ws. That is, the thermal imaging camera 5 is arranged substantially perpendicular to the bonding surface S1 of the first substrate W1 and the bonding surface S2 of the second substrate W2. Since infrared rays pass through the silicon constituting the second substrate W2, infrared rays with a high intensity radiated from the filler F pass through the edge portion E2 of the second substrate W2. Therefore, the thermal imaging camera 5 can detect the infrared rays radiated from the filler F.

[0104] Figure 13 is a schematic diagram showing an example of the thermal image generated by the thermal imaging camera 5. As described with reference to Figure 12 , the thermal imaging camera 5 detects the infrared rays radiated from the filler F coated on the outer peripheral portion including the edge portion of the stacked substrate Ws and generates a thermal image 60 based on the detected infrared rays. The outer peripheral portion of the stacked substrate Ws includes the edge portion E1 of the first substrate W1, the edge portion E2 of the second substrate W2, and a part of the flat surfaces of the first substrate W1 and the second substrate W2 (the flat surface of the stacked substrate Ws). The flat surfaces of the first substrate W1 and the second substrate W2 (the flat surface of the stacked substrate Ws) are located closer to the inner side in the radial direction than the edge portions E1 and E2 of the first substrate W1 and the second substrate W2. Figure 13 The thermal image 60 shown is a thermal image generated in a state where the filling of the filler F into the gap G of the stacked substrate Ws by the coating device 3 has been completed.

[0105] The thermal image 60 of the present embodiment is displayed in monochrome (gray scale) by the setting of the thermal imaging camera 5, and the intensity of the infrared rays detected from the object is reflected as a black-and-white contrast. As Figure 13 shown, the region 61 on the thermal image 60 of the flat surfaces of the first substrate W1 and the second substrate W2 (the flat surface of the stacked substrate Ws) where the intensity of the radiated infrared rays is small appears in a color close to black. On the other hand, in the region 62 on the thermal image 60, since the infrared rays with a high intensity radiated from the filler F pass through the edge portion E2 of the second substrate W2, it appears in a color close to white. The region 62 is a region substantially representing the filler F.

[0106] The image processing unit 30 is configured to determine the state of the filler F in the gap G coated on the stacked substrate Ws based on the thermal image 60 generated by the thermal imaging camera 5. In the present embodiment, the image processing unit 30 is configured to determine the filling state of the filler F in the gap G coated on the stacked substrate Ws based on the width Y of the region 62 representing the filler F on the thermal image 60.

[0107] Figure 14 It is a schematic diagram showing another example of the thermal image 60 generated by the thermal imaging camera 5. Figure 14 The shown thermal image 60 is a thermal image generated in a state where the filling of the gap G of the stacked substrate Ws with the filler F by the coating device 3 is not completed. Figure 14 In the shown thermal image 60, the region 61 on the thermal image 60 of the flat surfaces (the flat surface of the stacked substrate Ws) of the first substrate W1 and the second substrate W2, which represents a small intensity of the radiated infrared rays, and the regions 63 representing the edge portion E1 of the first substrate W1 and the edge portion E2 of the second substrate W2 appear in a color close to black. Figure 14 The width Y of the region 62 representing the filler F on the shown thermal image 60 is less than Figure 13 The width Y of the region 62 representing the filler F on the shown thermal image 60. The width Y of the filler F coated in the gap G of the stacked substrate Ws increases as the amount of the coated filler F increases. Therefore, the image processing unit 30 can determine the filling state of the filler F based on the width Y of the filler F on the thermal image 60.

[0108] More specifically, when the width Y of the region 62 representing the filler F on the thermal image 60 is less than a specified threshold value, the image processing unit 30 determines the filling state of the filler F as "not filled". When the width Y of the region 62 representing the filler F on the thermal image 60 is equal to or greater than the specified threshold value, the image processing unit 30 determines the filling state of the filler F as "filled". In the present embodiment, the specified threshold value is set to the width of the filler F when the filling of the gap G of the stacked substrate Ws with the filler F is completed.

[0109] Refer to Figures 10 to 14 The described embodiment and refer to Figure 9A And Figure 9B Similarly to the described embodiment, it can also be applied to the determination of the curing state of the filler F coated in the gap G of the stacked substrate Ws.

[0110] In one embodiment, as described with reference to Figure 2 And Figure 3 Even when the stacked substrate Ws is held in a vertical posture by the substrate holding device 2, it is the same as that described with reference to Figures 10 to 14Similarly, the described embodiments can also apply the thermal images generated by the thermal imaging camera 5 disposed substantially perpendicular to the flat surface of the stacked substrate Ws.

[0111] The above-described embodiments are described for the purpose of enabling those with ordinary knowledge in the technical field to which the present invention pertains to implement the present invention. Various modifications of the above-described embodiments can be naturally made by those skilled in the art, and the technical idea of the present invention can also be applied to other embodiments. Therefore, the present invention is not limited to the described embodiments, but is to be construed as within the broadest scope defined by the technical idea through the claims.

[0112] Industrial Applicability

[0113] The present invention can be used in a substrate processing apparatus and a substrate processing method for suppressing breakage and notches in a stacked substrate manufactured by bonding a plurality of substrates, and in particular, can be used in a technique for coating a filler in a gap at the edge portion of a plurality of substrates constituting the stacked substrate.

[0114] Reference Signs

[0115] 1: Substrate processing apparatus

[0116] 2: Substrate holding device

[0117] 3: Coating device

[0118] 4: Curing device

[0119] 5: Thermal imaging camera

[0120] 10: Operation control unit

[0121] 10a: Storage device

[0122] 10b: Processing device

[0123] 12: Holding plate

[0124] 12a: Holding surface

[0125] 13: Rotation axis

[0126] 15: Rotation mechanism

[0127] 21: Syringe

[0128] 21a: Filler ejection port

[0129] 22: Piston

[0130] 25: Gas supply line

[0131] 26: Pressure adjustment device

[0132] 30: Image processing unit

[0133] 40: Thermal image

[0134] 41,42,43: Region

[0135] 45: Temperature index

[0136] 50: Substrate holding device

[0137] 52: Holding plate

[0138] 52a: Holding surface

[0139] 53: Rotation axis

[0140] 55: Rotation mechanism

[0141] 60: Thermal image

[0142] 61,62,63: Region.

Claims

1. A substrate processing apparatus that coats a filler on a stacked substrate formed by bonding a first substrate and a second substrate, characterized in that, it includes: a coating device that coats the filler in a gap between an edge portion of the first substrate and an edge portion of the second substrate; a thermal imaging camera that generates a thermal image based on infrared rays emitted from the filler coated in the gap; and an image processing unit that determines the state of the filler coated in the gap based on the thermal image.

2. The substrate processing apparatus according to claim 1, characterized in that, the image processing unit is configured to determine the filling state of the filler coated in the gap based on the width of the filler on the thermal image.

3. The substrate processing apparatus according to claim 2, characterized in that, it further includes an operation control unit that controls the operation of the coating device, the operation control unit is configured to issue an instruction to the coating device based on the determination result of the filling state of the filler to end the coating of the filler.

4. The substrate processing apparatus according to claim 1, characterized in that, it further includes a curing device that heats the filler coated in the gap to cure the filler, the image processing unit is configured to obtain temperature information of the filler coated in the gap based on the thermal image, and determine the curing state of the filler coated in the gap based on the temperature information.

5. The substrate processing apparatus according to claim 4, characterized in that, it further includes an operation control unit that controls the operation of the curing device, the operation control unit is configured to issue an instruction to the curing device based on the determination result of the curing state of the filler to end the heating of the filler.

6. The substrate processing apparatus according to claim 1, characterized in that, the image processing unit is configured to generate a plurality of thermal images at a plurality of measurement points along the circumferential direction of the edge portion of the stacked substrate, and determine the state of the filler coated in the gap based on the plurality of thermal images.

7. The substrate processing apparatus according to claim 1, characterized in that, the thermal imaging camera is configured to generate the thermal image based on far-infrared rays emitted from the filler coated in the gap.

8. A substrate processing method that coats a filler on a stacked substrate formed by bonding a first substrate and a second substrate, characterized in that, the filler is coated in a gap between an edge portion of the first substrate and an edge portion of the second substrate, a thermal image is generated by a thermal imaging camera based on infrared rays emitted from the filler coated in the gap, and the state of the filler coated in the gap is determined based on the thermal image.

9. The substrate processing method according to claim 8, characterized in that, the step of determining the state of the filler is a step of determining the filling state of the filler coated in the gap based on the width of the filler on the thermal image.

10. The substrate processing method according to claim 9, characterized in that, End the coating of the filler based on the determination result of the filling state of the filler.

11. The substrate processing method according to claim 8, wherein, it further includes a step of heating the filler coated in the gap to cure the filler, the step of determining the state of the filler is as follows: based on the thermal image, obtain the temperature information of the filler coated in the gap, and based on the temperature information, determine the curing state of the filler coated in the gap.

12. The substrate processing method according to claim 11, wherein, end the heating of the filler based on the determination result of the curing state of the filler.

13. The substrate processing method according to claim 8, wherein, generate a plurality of thermal images at a plurality of measurement points along the circumferential direction of the edge portion of the stacked substrate, and based on the plurality of thermal images, determine the state of the filler coated in the gap.

14. The substrate processing method according to claim 8, wherein, generate the thermal image by the thermal imaging camera according to the far-infrared rays radiated from the filler coated in the gap.

Images