Microfluidic device

Abstract

The microfluidic device comprises a refrigeration module, a temperature measurement module, a photocuring module and a communication serial port module, and the refrigeration module and the temperature measurement module are electrically connected with a PC terminal through the communication serial port module; the refrigeration module is in contact with the micro-fluidic chip and transfers heat; the temperature measuring module is used for detecting the temperature in the channel of the micro-fluidic chip; and the photocuring module is used for photocuring the hydrogel. The device has the beneficial effects that the temperature in the micro-channel is monitored in real time through the temperature measuring module, a temperature signal is transmitted to the PC terminal through the communication serial port module, and the PC terminal accurately regulates and controls the reaction temperature of the refrigeration module according to the signal so as to meet the temperature requirement, so that the porous structure forming process of the microspheres is accurately regulated and controlled; and the injected gel forming phase and pore forming phase can better maintain the interface stability, so that the preparation uniformity and stability are improved.

Description

Technical Field

[0001] The invention relates to the technical field of biomaterials, in particular to a microfluidic device. Background Art

[0002] GelMA hydrogel is a high molecular cross-linked hydrophilic polymer network with high water content, high biocompatibility and good extracellular matrix (ECM) simulation ability. It is a candidate biomaterial that has attracted much attention in the field of tissue engineering. At the same time, porous hydrogel microspheres (HMPs) can not only effectively carry cells due to their high surface area to volume ratio, but also significantly support cell adhesion, extension, growth and cell-to-cell interaction, thereby more accurately simulating ECM. In addition, HMPs also have the potential to construct multi-level, multi-material hierarchical structures with ideal chemical, mechanical and biological gradients, which can promote tissue regeneration in lesions and are excellent materials in tissue regeneration engineering applications such as cartilage repair and fat filling.

[0003] The mixed system based on GelMA hydrogel (gel phase) and PEO (pore-forming phase) can prepare micron-scale porous structures, which are conducive to cell adhesion and proliferation. However, due to the thermosensitive properties of GelMA hydrogel, its fluidity decreases, viscosity increases and tends to solidify under low temperature conditions. This property helps to form and maintain a more uniform and dispersed pore structure and avoid fusion between pore-forming phases. However, the existing room temperature preparation method is difficult to achieve porous microspheres with uniform size and stable structure. Therefore, the existing technology has the limitations of insufficient preparation process stability and poor structural controllability. Summary of the invention

[0004] The purpose of the present invention is to overcome the shortcomings of the prior art and provide a microfluidic device.

[0005] The object of the present invention is achieved by the following technical scheme: a microfluidic device, comprising a refrigeration module, a temperature measurement module, a light curing module and a communication serial port module, wherein the refrigeration module and the temperature measurement module are both electrically connected to a PC terminal through the communication serial port module;

[0006] The cooling module contacts the microfluidic chip and transfers heat;

[0007] The temperature measurement module is used to detect the temperature in the microfluidic chip channel;

[0008] The light curing module is used for light curing of hydrogels.

[0009] Preferably, the refrigeration module includes a cooling block, a boss is provided on the upper surface of the cooling block, the microfluidic chip is placed on the boss, and a temperature measuring hole is opened on the boss, an NTC temperature sensor is provided on the temperature measuring hole, the lower surface of the cooling block is connected to the TEC semiconductor refrigeration plate, a water cooling block is provided inside the TEC semiconductor refrigeration plate, the water cooling block is used to cool the heating surface of the TEC semiconductor refrigeration plate, and the NTC temperature sensor and the TEC semiconductor refrigeration plate are both electrically connected to the single-chip computer a.

[0010] Preferably, the cross section of the boss is T-shaped.

[0011] Preferably, the temperature measurement module includes a K-type thermocouple, which is used to monitor the temperature in the channel of the microfluidic chip, and the K-type thermocouple is electrically connected to the single-chip computer b.

[0012] Preferably, the photocuring module includes an ultraviolet light source, a control module and a voltage regulating module, the input end of the voltage regulating module is electrically connected to the external power supply module, the output end of the voltage regulating module is electrically connected to the ultraviolet light source, the control module is connected in series with the ultraviolet light source, and the ultraviolet light source is used for hydrogel photocuring.

[0013] The present invention has the following advantages: the present invention monitors the temperature in the microchannel in real time through a temperature measurement module, and transmits the temperature signal to a PC through a communication serial port module. The PC accurately adjusts the reaction temperature of the refrigeration module according to the signal to meet the temperature requirement, thereby accurately adjusting the porous structure formation process of the microspheres, so that the injected gel-forming phase and the pore-forming phase can better maintain the interface stability, thereby improving the uniformity and stability of the preparation. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a structural schematic diagram of the system architecture of the microfluidic device;

[0015] Figure 2 It is a schematic diagram of the structure of the control area of ​​the microfluidic chip;

[0016] Figure 3 It is a structural schematic diagram of the refrigeration module;

[0017] Figure 4 It is a schematic diagram of the structure of a TEC semiconductor refrigeration chip;

[0018] Figure 5 It is a structural schematic diagram of the cooling block;

[0019] Figure 6 It is a structural schematic diagram of the position distribution of the temperature measurement lines in the microfluidic channel under an optical microscope;

[0020] Figure 7 It is a schematic diagram of the rheological properties of the hydrogel precursor at different temperatures;

[0021] Figure 8The schematic diagram of the structure of the microsphere pore-forming effect at different temperatures;

[0022] In the figure, 1-refrigeration module, 2-temperature measurement module, 3-light curing module, 4-communication serial port module, 5-PC terminal, 6-cooling block, 7-TEC semiconductor refrigeration plate, 8-water cooling block, 9-boss, 10-temperature measurement hole, 11-control module. DETAILED DESCRIPTION

[0023] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0024] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0025] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features of the embodiments may be combined with each other.

[0026] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0027] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or the positions or positional relationships in which the product of the invention is usually placed when in use, or the positions or positional relationships commonly understood by those skilled in the art, which are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0028] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0029] In this embodiment, if Figure 1 , Figure 7 and Figure 8 As shown, a microfluidic device includes a refrigeration module 1, a temperature measurement module 2, a light curing module 3 and a communication serial port module 4, and the refrigeration module 1 and the temperature measurement module 2 are both electrically connected to a PC terminal 5 through the communication serial port module 4;

[0030] The cooling module 1 contacts the microfluidic chip and transfers heat;

[0031] The temperature measurement module 2 is used to detect the temperature in the microfluidic chip channel;

[0032] The photocuring module 3 is used for photocuring of hydrogels. The temperature in the microchannel is monitored in real time by the temperature measuring module 2, and the temperature signal is transmitted to the PC terminal 5 through the communication serial port module 4. The PC terminal 5 accurately adjusts the reaction temperature of the refrigeration module 1 according to the signal to meet the temperature requirements, thereby accurately adjusting the porous structure formation process of the microspheres, so that the injected gel-forming phase and the pore-forming phase can better maintain the interface stability, thereby improving the uniformity and stability of the preparation. In this embodiment, Figure 2 and Figure 6 Point A is the temperature control area, point B is the temperature measurement point, and point C is the curing area. The communication serial port module 4 used in this embodiment is an existing product, which is not improved here and can be purchased commercially. Its main function is to transmit signals between the device and the PC terminal 5, so it will not be described in detail.

[0033] Further, such as Figure 3 to Figure 5As shown, the refrigeration module 1 includes a cooling block 6, a boss 9 is provided on the upper surface of the cooling block 6, a microfluidic chip is placed on the boss 9, and a temperature measuring hole 10 is provided on the boss 9, an NTC temperature sensor is provided on the temperature measuring hole 10, and the NTC temperature sensor is electrically connected to the single-chip computer a, and the lower surface of the cooling block 6 is connected to the TEC semiconductor cooling plate 7, and a water cooling block 8 is provided inside the TEC semiconductor cooling plate 7, and the water cooling block 8 is used to cool the heating surface of the TEC semiconductor cooling plate 7. Specifically, a water pipe is provided on the water cooling block 8, and the water pipe is connected to a water pump. The water pump pumps external cooling water into the water pipe, so that the water cooling block 8 cools the heating surface of the TEC semiconductor cooling plate 7. The single-chip computer a receives the signal transmitted by the PC terminal 5 and starts cooling. The single-chip computer a controls the TEC semiconductor cooling plate 7 to reach the corresponding temperature through the PID control algorithm, and the NTC temperature sensor monitors the temperature of the cooling plate in real time. The single-chip computer a reads and converts the signal of the NTC temperature sensor, and transmits the converted signal to the PC terminal 5. In this embodiment, the NTC temperature sensor, the TEC semiconductor cooling sheet 7 and the single chip computer a are all existing products, which are not improved here and can be purchased from the market.

[0034] Furthermore, the cross section of the boss 9 is T-shaped. Specifically, the main function of the T-shaped cross section of the boss 9 is to concentrate the temperature control area on the upper surface of the T-shape.

[0035] In this embodiment, the temperature measurement module 2 includes a K-type thermocouple, which is used to monitor the temperature in the microfluidic chip channel, and the K-type thermocouple is electrically connected to the single-chip microcomputer b. Specifically, the main function of the single-chip microcomputer b is to read and convert the signal of the K-type thermocouple, and transmit the converted signal to the PC terminal 5. In this embodiment, the K-type thermocouple and the single-chip microcomputer b are both existing products, which are not improved here and can be obtained commercially.

[0036] Furthermore, the photocuring module 3 includes an ultraviolet light source, a control module 11 and a voltage regulating module, the input end of the voltage regulating module is electrically connected to the external power supply module, the output end of the voltage regulating module is electrically connected to the ultraviolet light source, the control module 11 is connected in series with the ultraviolet light source, and the ultraviolet light source is used for photocuring of the hydrogel. In this embodiment, the ultraviolet light source, the control module 11 and the voltage regulating module are all existing products, which are not improved here and can be obtained commercially.

[0037] Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A microfluidic device, characterized in that: It comprises a refrigeration module (1), a temperature measurement module (2), a light curing module (3) and a communication serial port module (4), wherein the refrigeration module (1) and the temperature measurement module (2) are both electrically connected to a PC terminal (5) via the communication serial port module (4); The refrigeration module (1) contacts the microfluidic chip and transfers heat; The temperature measurement module (2) is used to detect the temperature in the channel of the microfluidic chip; The photocuring module (3) is used for photocuring of hydrogel.

2. The microfluidic device according to claim 1, characterized in that: The refrigeration module (1) comprises a cooling block (6), the upper surface of which is provided with a boss (9), the microfluidic chip is placed on the boss (9), and the boss (9) is provided with a temperature measuring hole (10), the temperature measuring hole (10) is provided with an NTC temperature sensor, the lower surface of the cooling block (6) is connected to a TEC semiconductor refrigeration sheet (7), a water cooling block (8) is provided inside the TEC semiconductor refrigeration sheet (7), the water cooling block (8) is used to cool the heating surface of the TEC semiconductor refrigeration sheet (7), and the NTC temperature sensor and the TEC semiconductor refrigeration sheet (7) are both electrically connected to a single-chip computer a.

3. The microfluidic device according to claim 2, characterized in that: The cross section of the boss (9) is T-shaped.

4. The microfluidic device according to claim 3, characterized in that: The temperature measurement module (2) comprises a K-type thermocouple, which is used to monitor the temperature in the channel of the microfluidic chip, and is electrically connected to the single-chip computer b.

5. The microfluidic device according to claim 4, characterized in that: The photocuring module (3) comprises an ultraviolet light source, a control module (11) and a voltage regulating module, the input end of the voltage regulating module is electrically connected to an external power supply module, the output end of the voltage regulating module is electrically connected to the ultraviolet light source, the control module (11) is connected in series with the ultraviolet light source, and the ultraviolet light source is used for photocuring of hydrogels.

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