Sensor chip and film pasting processing method thereof

Abstract

The invention discloses a film pasting processing method for a sensor chip. The film pasting processing method comprises the following steps: uniformly coating polystyrene foam on a substrate to form a high-temperature pyrolysis film; bonding a to-be-cut chip to the surface layer of the high-temperature pyrolysis film; a surface layer film is attached to the upper layer of the chip to be cut, and the surface layer film is bonded to the surface layers of the chip to be cut and the high-temperature pyrolysis film; cutting the multi-layer assembly obtained by combination, and heating at a preset temperature, so that the high-temperature pyrolysis film is heated and expanded to form a foamy substance and loses viscosity; and taking down the cut chip from the foamed substance. According to the film pasting processing method, the multi-layer assembly containing the sensor chip is heated in a heating mode so that the high-temperature pyrolysis film can lose efficacy, due to the fact that the temperature has high conduction capacity, the high-temperature pyrolysis film can be evenly heated and completely lose viscosity, the high-temperature pyrolysis film is heated and completely lose efficacy, and the processing efficiency of the sensor chip is improved.

Description

Technical Field

[0001] The present invention relates to the field of sensor technology, and in particular to a sensor chip and a film-attaching processing method thereof. Background Art

[0002] During the processing of high-precision sensor chips, it is necessary to apply films on both sides of the chip and perform precise cutting. After cutting, the substrate on the back of the chip needs to be removed; therefore, the substrate needs to be pasted to the back of the chip before cutting. The traditional technical method usually uses a UV film composed of UV glue for bonding. After the chip is cut, the UV film is irradiated with UV light to make it lose its stickiness. However, in the prior art, UV glue needs to be irradiated with UV light, but for flat sensor chips, some areas may not be able to receive UV light or some areas of UV light may be weak, which makes it impossible to completely lose the stickiness of the UV film, reducing the processing efficiency of the sensor chip. Therefore, the problem of the inability to efficiently invalidate the adhesive of the sensor chip in the prior art is solved. Summary of the invention

[0003] The present invention provides a film processing method for a sensor chip, aiming to solve the problem in the prior art that the adhesive glue of the sensor chip cannot be effectively invalidated.

[0004] In a first aspect, the present invention discloses a film processing method for a sensor chip, wherein the film processing method comprises:

[0005] Uniformly coating the foaming adhesive on the substrate to form a high-temperature pyrolysis film;

[0006] Bonding the chip to be cut to the surface layer of the high-temperature pyrolysis film;

[0007] Attaching the surface film to the upper layer of the chip to be cut, and bonding the surface film to the chip to be cut and the surface layer of the high-temperature pyrolysis film;

[0008] After cutting the assembled multilayer assembly, heat it at a preset temperature so that the high-temperature pyrolysis film expands due to the heat to form a foam-like substance and loses its viscosity;

[0009] The cut chips were removed from the foam.

[0010] In a second aspect, the present invention discloses a sensor chip, wherein the sensor chip is prepared by the film pasting processing method as described in the first aspect.

[0011] The present invention discloses a film processing method for sensor chips, which includes: uniformly coating a foam glue on a substrate to form a high-temperature pyrolysis film; bonding the chip to be cut to the surface of the high-temperature pyrolysis film; attaching the surface film to the upper layer of the chip to be cut, and bonding the surface film to the surface of the chip to be cut and the high-temperature pyrolysis film; cutting the combined multi-layer assembly and heating it at a preset temperature, so that the high-temperature pyrolysis film expands due to heat to form a foam-like substance and loses its viscosity; removing the cut chip from the foam-like substance. The above-mentioned film processing method heats the multi-layer assembly containing the sensor chip by heating to render the high-temperature pyrolysis film ineffective. Since the temperature has a strong conductivity, the high-temperature pyrolysis film can be evenly heated and completely lose its viscosity, so that the high-temperature pyrolysis film is heated and completely ineffective, thereby improving the processing efficiency of the sensor chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying any creative work.

[0013] Figure 1 A method flow chart of a film-mounting method for a sensor chip provided by an embodiment of the present invention;

[0014] Figure 2 A top view of a multi-layer assembly provided by an embodiment of the present invention;

[0015] Figure 3 A cross-sectional structural diagram of a multi-layer assembly provided in accordance with an embodiment of the present invention.

[0016] Figure numbers: 1. substrate; 2. high-temperature pyrolysis film; 3. chip; 4. surface film. DETAILED DESCRIPTION

[0017] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0018] It should be understood that when used in this specification and the appended claims, the terms "include" and "comprises" indicate the presence of described features, integers, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or combinations thereof.

[0019] It should also be understood that the terms used in the present specification are only for the purpose of describing specific embodiments and are not intended to limit the present invention. As used in the present specification and the appended claims, unless the context clearly indicates otherwise, the singular forms "a", "an" and "the" are intended to include plural forms.

[0020] It should be further understood that the terms "and, or" used in the present description and the appended claims refer to and include any and all possible combinations of one or more of the associated listed items.

[0021] The above are only specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed by the present invention, and these modifications or replacements should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention shall be based on the protection scope of the claims.

[0022] The present invention discloses a film processing method for a sensor chip, wherein: Figure 1 As shown, the film pasting method includes the following steps S110 to S150.

[0023] S110, uniformly coating the foaming adhesive on the substrate to form a high-temperature pyrolysis film.

[0024] The foam glue is evenly coated on the substrate 1 to form a high-temperature pyrolysis film 2. First, the foam glue can be evenly coated on the surface of the substrate 1, and the foam glue coated on the surface of the substrate 1 also forms a layer of high-temperature pyrolysis film 2. Among them, the thickness of the formed high-temperature pyrolysis film 2 is 40 to 65um (micrometers). The high-temperature pyrolysis film 2 of this thickness can have good viscosity and will not affect the cutting process of the chip 3. In a preferred embodiment, a high-temperature pyrolysis film 2 with a thickness of 50um can be applied. Specifically, the substrate 1 can be set to a PET board, and the thickness of the substrate 1 can be set to 130 to 180um. In a more preferred embodiment, the thickness of the substrate 1 can be set to 150um.

[0025] In a more specific embodiment, the components of the foaming glue include polyurethane prepolymer, foaming agent, organic solvent and auxiliary agent. Specifically, the volume fraction of the foaming agent in the foaming glue is 8% to 30%. Further, the foaming agent is azodicarbonamide. Among them, the polyurethane prepolymer is the main component that produces viscosity, the foaming agent is the component that expands when heated, the organic solvent is the solvent that dissolves each component to form a viscous glue, and the auxiliary agent is the component used to assist the foaming glue to improve its physical properties.

[0026] The foaming agent may be azodicarbonamide, which has a thermal decomposition temperature of about 220° C. Therefore, azodicarbonamide will not be thermally decomposed during the heating process, and bubbles can be generated to expand the high-temperature pyrolysis film 2 to form a foamy substance.

[0027] Furthermore, the volume fraction of the foaming agent in the foaming gel can be set to 8% to 30%. In a preferred embodiment, the volume fraction of the foaming agent in the foaming gel can be set to 15% to 20%, thereby achieving the best foaming effect.

[0028] Specifically, the organic solvent is composed of 35-50% acetone and 55-70% cyclohexane by mass percentage. The auxiliary agent is composed of an active agent and a lubricant by volume in a ratio of 3:6.

[0029] The organic solvent may be composed of acetone and cyclohexane, and the mass percentages of acetone and cyclohexane in the organic solvent are 35-50% and 55-70% respectively. Further, the auxiliary agent may be composed of an active agent and a lubricant in a volume ratio of 3:6. The active agent may be IPDI (isophorone diisocyanate), and the lubricant may be composed of 25-80% erucamide and 20-75% ethanol in mass percentage; wherein the volume percentage of the auxiliary agent in the foaming glue is 1.5% to 3%.

[0030] S120, bonding the chips to be cut to the surface layer of the high-temperature pyrolysis film.

[0031] Furthermore, the chip 3 to be cut can be bonded and fixed to the surface of the high-temperature pyrolysis film 2, such as by Figure 2 The chips 3 to be cut are neatly arranged on the surface of the high-temperature pyrolysis film 2 and bonded and fixed to the high-temperature pyrolysis film 2.

[0032] S130, attaching the surface film to the upper layer of the chip to be cut, and bonding the surface film to the chip to be cut and the surface layer of the high-temperature pyrolysis film.

[0033] Furthermore, the surface film 4 is attached to the upper layer of the chip 3 to be cut, thereby forming a multi-layer assembly. The specific structure of the multi-layer assembly is as follows: Figure 3 As shown, the surface film 4 in the multilayer assembly is bonded to the surface of the chip 3 to be cut and the high-temperature pyrolysis film 2. In the actual processing process, the outer dimensions of the surface film 4 can also be set to be larger than the outer dimensions of the substrate 1, so as to ensure that the surface film 4 can completely cover the substrate 1. The specific setting structure is as follows Figure 2 The thickness of the surface film 4 can be set to be 1.5 to 3 times the thickness of the substrate 1 .

[0034] S140, cutting the assembled multilayer assembly and heating it at a preset temperature, so that the high-temperature pyrolysis film expands due to the heat to form a foam-like substance and loses its viscosity.

[0035] Furthermore, the multilayer assembly can be cut and then heated at a preset temperature. At this time, the high-temperature pyrolysis film expands due to the heat to form a foam-like substance and loses its viscosity.

[0036] In a more specific embodiment, the preset temperature is 120-130°C, and the heating time is 1-3 minutes. Specifically, the cutting of the combined multi-layer assembly and heating at the preset temperature comprises: placing the multi-layer assembly into a preheated oven for baking and heating, the preheating temperature of the oven is 120-130°C, and the final heating temperature is 130°C.

[0037] In a specific embodiment, the preset temperature can be set to 120-130°C, and the heating time at the preset temperature is 1-3 minutes. In order to make the heating temperature more balanced, so that the high-temperature pyrolysis film is heated more evenly, the cut multilayer assembly can be sent to a preheated oven for baking and heating. The preheating temperature of the oven can be set to 120-130°C, and the final temperature of the oven heating is 130°C.

[0038] S150, removing the cut chips from the foam-like substance.

[0039] Since the foam material loses its stickiness after being heated, the cut chips can be easily removed from the foam material.

[0040] The embodiment of the present invention further discloses a sensor chip, wherein the sensor chip is prepared by using the film pasting processing method as described in the above embodiment.

[0041] The present invention discloses a film processing method for sensor chips, which includes: uniformly coating a foam glue on a substrate to form a high-temperature pyrolysis film; bonding the chip to be cut to the surface of the high-temperature pyrolysis film; attaching the surface film to the upper layer of the chip to be cut, and bonding the surface film to the surface of the chip to be cut and the high-temperature pyrolysis film; cutting the combined multi-layer assembly and heating it at a preset temperature, so that the high-temperature pyrolysis film expands due to heat to form a foam-like substance and loses its viscosity; removing the cut chip from the foam-like substance. The above-mentioned film processing method heats the multi-layer assembly containing the sensor chip by heating to render the high-temperature pyrolysis film ineffective. Since the temperature has a strong conductivity, the high-temperature pyrolysis film can be evenly heated and completely lose its viscosity, so that the high-temperature pyrolysis film is heated and completely ineffective, thereby improving the processing efficiency of the sensor chip.

[0042] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed in the present application, and these modifications or replacements should be included in the protection scope of the present application. Therefore, the protection scope of the present application shall be based on the protection scope of the claims.

Claims

1. A film processing method for a sensor chip, characterized in that: The film pasting processing method comprises: Uniformly coating the foaming adhesive on the substrate to form a high-temperature pyrolysis film; Bonding the chip to be cut to the surface layer of the high-temperature pyrolysis film; Attaching the surface film to the upper layer of the chip to be cut, and bonding the surface film to the chip to be cut and the surface layer of the high-temperature pyrolysis film; After cutting the assembled multilayer assembly, heat it at a preset temperature so that the high-temperature pyrolysis film expands due to the heat to form a foam-like substance and loses its viscosity; The cut chips were removed from the foam.

2. The film processing method for sensor chip according to claim 1, characterized in that: The preset temperature is 120-130° C., and the heating time is 1-3 minutes.

3. The film processing method for sensor chip according to claim 2, characterized in that: The step of cutting the assembled multilayer assembly and heating it at a preset temperature comprises: The multilayer assembly is sent into a preheated oven for baking and heating. The preheating temperature of the oven is 120-130°C and the final heating temperature is 130°C.

4. The film-attaching processing method for a sensor chip according to claim 2 or 3, characterized in that: The foaming glue comprises polyurethane prepolymer, foaming agent, organic solvent and auxiliary agent.

5. The film-attaching processing method for a sensor chip according to claim 4, characterized in that: The volume fraction of the foaming agent in the foaming glue is 8% to 30%.

6. The film-attaching processing method for a sensor chip according to claim 5, characterized in that: The thickness of the high-temperature pyrolysis film is 40-65 um.

7. The film-attaching processing method for a sensor chip according to claim 5, characterized in that: The foaming agent is azodicarbonamide.

8. The film-attaching processing method for a sensor chip according to claim 5, characterized in that: The organic solvent consists of 35-50% of acetone and 55-70% of cyclohexane by mass percentage.

9. The film-attaching processing method for a sensor chip according to claim 5, characterized in that: The auxiliary agent is composed of an active agent and a lubricant in a volume ratio of 3:

6.

10. A sensor chip, characterized in that: The sensor chip is prepared by using the film-sticking processing method as described in any one of claims 1 to 9.

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