Organic silicon inorganic modified resin as well as preparation method and application thereof

Abstract

The invention discloses organic silicon inorganic modified resin as well as a preparation method and application thereof, and the organic silicon inorganic modified resin is prepared from the following raw materials in parts by weight: 35-75 parts of water-based hybrid siloxane resin, 0.1-0.5 part of a wetting agent, 0.5-2 parts of a flatting agent, 0.5-1 part of a defoaming agent, 0.5-2 parts of a coupling agent, 2-13 parts of inorganic filler, 0.2-1 part of a viscosity modifier, 2-8 parts of water-based color ink and 35-50 parts of water, the inorganic filler comprises nano aluminum oxide and nano silicon dioxide; on the basis of the water-based hybrid siloxane resin, the inorganic filler is introduced for modification, and the inorganic filler is dispersed in the water-based hybrid siloxane resin, so that the water-based hybrid siloxane resin is endowed with excellent high-temperature resistance, mechanical property and thermal stability. The organic silicon part provides good flexibility, weather resistance and other properties, the inorganic component can enhance the hardness, wear resistance, high temperature resistance and other properties of the resin, and the combination of the organic silicon part and the inorganic component enables the comprehensive performance of the modified organic silicon resin to be improved.

Description

Technical Field

[0001] The present invention relates to the field of polymer materials, and in particular to a high temperature resistant organic silicon inorganic modified epoxy resin and a preparation method and application thereof. Background Art

[0002] Although traditional silicone resins have excellent heat resistance and electrical insulation, and are therefore often used as high-temperature resistant coatings, with the development of industrialization, people have increasingly higher requirements for the comprehensive performance of high-temperature resistant coatings. High-temperature resistant coatings still have problems with insufficient performance in certain extreme environments. For example, the coating is prone to discoloration, cracking, and falling off at higher temperatures. The coating has low adhesion and low mechanical strength at high temperatures, which limits its widespread application.

[0003] In order to improve the heat resistance and mechanical properties of silicone resin, many inventors have tried to modify it by adding various substances: for example, the Chinese invention patent with publication number CN118460104B discloses a boron-modified silicone resin high temperature resistant coating and its preparation method, which is to prepare a boron-containing epoxy resin by combining epichlorohydrin with polymerizable boric acid, and to obtain a boron-containing epoxy silicone monomer by combining the boron-containing epoxy resin with tri(dimethylsiloxy)phenylsilane; the boron-containing epoxy silicone monomer is modified by a silane coupling agent and nanoparticles to obtain a modified silicone monomer, and then the silicone resin is modified by a rigid aromatic compound and a modified silicone monomer to obtain a boron-modified silicone resin, which enhances the high temperature resistance and mechanical properties of the silicone resin; finally, a boron-modified silicone resin high temperature resistant coating is obtained. This preparation method needs to be modified by a variety of organic substances, and the preparation process is complicated and not environmentally friendly.

[0004] Therefore, it is of great significance to develop an environmentally friendly, simple process and stable high temperature resistant organosilicon inorganic modified resin and its preparation method. Summary of the invention

[0005] The main purpose of the present invention is to provide an inorganic modified organosilicon resin and a preparation method thereof, aiming to solve the technical problem that the existing organosilicon resin has complex modification methods in order to meet the high temperature resistance requirement.

[0006] In order to achieve the above-mentioned purpose, the present invention provides an inorganic modified silicone resin, comprising the following raw materials in parts by weight: 35 to 75 parts of water-based hybrid silicone resin, 0.1 to 0.5 parts of wetting agent, 0.5 to 2 parts of leveling agent, 0.5 to 1 parts of defoaming agent, 0.5 to 2 parts of coupling agent, 2 to 13 parts of inorganic filler, 0.2 to 1 parts of viscosity modifier, 2 to 8 parts of water-based ink and 35 to 50 parts of water, wherein the inorganic filler comprises nano-alumina and nano-silicon dioxide.

[0007] Furthermore, the content of the nano-alumina is 3% to 5%, and the content of the nano-silicon dioxide is 0.3% to 0.5%.

[0008] Furthermore, the water-based hybrid silicone resin includes 20 to 45 parts of epoxy-modified silicone resin and 15 to 30 parts of polyester-modified silicone resin.

[0009] Furthermore, the coupling agent is a titanate coupling agent.

[0010] Another aspect of the present invention provides a method for preparing an inorganic modified silicone resin, comprising the following steps:

[0011] S1: pretreatment: surface treatment of the inorganic filler;

[0012] S2: mixing: mixing the pretreated inorganic filler with the waterborne hybrid silicone resin, coupling agent, catalyst and water to obtain a mixture;

[0013] S3: paint mixing: adding water-based color ink to adjust the color, adding viscosity modifier to adjust the viscosity, and obtaining the organic silicon inorganic modified resin.

[0014] Furthermore, the step S1: pretreatment process includes: loading the inorganic filler into a high-speed mixer, and adding the coupling agent and stirring evenly.

[0015] Furthermore, the step S2: after mixing, further comprises: transferring the mixture into a high-speed disperser, with a dispersion speed of 1000 to 1500 rpm, a dispersion time of 10 to 30 min, and degassing.

[0016] Furthermore, before the step of S3: paint mixing, the step further includes: sending the deaerated mixture into a horizontal sand mill, circulating for multiple times until the fineness reaches less than 20 μm and then discharging the material.

[0017] Furthermore, the viscosity in S3 is 100-300 Pa. · s.

[0018] The invention also provides an application of the inorganic modified organosilicon resin in coatings.

[0019] Beneficial effects:

[0020] The present invention discloses an inorganic modified silicone resin and a preparation method and application thereof. The inorganic modified silicone resin is based on a water-based hybrid silicone resin and is modified by introducing an inorganic filler. The inorganic filler is dispersed in the water-based hybrid silicone resin to give it excellent high temperature resistance, mechanical properties and thermal stability. Among them, epoxy-modified silicone resin and polyester-modified silicone resin are selected in the water-based hybrid silicone resin to further react epoxy groups and ester bonds with active groups in the silicone resin, so that the resin properties are integrated and the advantages are concentrated.

[0021] The inorganic modified organic silicon resin of the present invention contains high temperature resistant inorganic components such as nano-alumina or nano-silicon dioxide. If in a high temperature environment, the nano-alumina or nano-silicon dioxide can form a stable skeleton structure to prevent the rapid decomposition of the resin, and the thermal stability is better. The present invention combines the advantages of organic silicon resin and inorganic materials. The organic silicon part provides good flexibility and weather resistance, while the inorganic component can enhance the hardness, wear resistance, high temperature resistance and other properties of the resin. The combination of the two improves the comprehensive performance of the modified organic silicon resin.

[0022] The nano silicon dioxide in the present invention has a large surface area and more adsorbable active sites, and can interact with the organic functional groups in the epoxy-modified silicone resin and the polyester-modified silicone resin, so that the silicone resin and the inorganic silicon dioxide not only physically fill and enhance the hardness thereof, but also have the effect of chemical bonds, and the nano silicon dioxide can bring a certain catalytic effect, catalyze the epoxy ring-opening reaction and promote the polyesterification reaction; and the nano particles have a small particle size and are easy to bend, have better flexibility, and are easier to be evenly distributed between the silicone resins, thereby improving thermal stability.

[0023] The preparation method of the inorganic modified organosilicon resin of the present invention is simple, does not require modification by multiple organic substances, can also achieve stable high temperature resistance, and is easy for industrial production.

[0024] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with the embodiments. DETAILED DESCRIPTION

[0025] The experimental methods in the following examples of the present invention, where no specific conditions are specified, are usually carried out under conventional conditions or under conditions recommended by the manufacturers. The various commonly used chemical reagents used in the examples are all commercially available products.

[0026] Unless otherwise defined, all technical and scientific terms used in the present invention have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention.

[0027] The terms "including" and "having" and any variations thereof of the present invention are intended to cover non-exclusive inclusions. For example, a process, method, device, product or equipment comprising a series of steps is not limited to the listed steps or modules, but may optionally include steps not listed, or may optionally include other steps inherent to these processes, methods, products or equipment.

[0028] In order to make the purpose, technical solutions and advantages of the present invention clearer, the present invention is further described in detail below in conjunction with specific embodiments. It should be understood that these descriptions are exemplary only and are not intended to limit the scope of the present invention. In addition, in the following description, the description of known structures and technologies is omitted to avoid unnecessary confusion of the concept of the present invention.

[0029] The present invention is further described in the following examples, but the examples are not intended to limit the scope of protection of the present invention.

[0030] On the one hand, the present invention provides an inorganic modified silicone resin, comprising the following raw materials in parts by weight: 35-75 parts of water-based hybrid silicone resin, 0.1-0.5 parts of wetting agent, 0.5-2 parts of leveling agent, 0.5-1 parts of defoaming agent, 0.5-2 parts of coupling agent, 2-13 parts of inorganic filler, 0.2-1 parts of viscosity modifier, 2-8 parts of water-based ink and 35-50 parts of water, wherein the inorganic filler comprises nano-alumina and nano-silicon dioxide.

[0031] The present invention discloses an inorganic modified silicone resin and a preparation method and application thereof. The inorganic modified silicone resin is based on a water-based hybrid silicone resin and is modified by introducing an inorganic filler. The inorganic filler is dispersed in the water-based hybrid silicone resin to give it excellent high temperature resistance, mechanical properties and thermal stability. Among them, epoxy-modified silicone resin and polyester-modified silicone resin are selected in the water-based hybrid silicone resin to further react epoxy groups and ester bonds with active groups in the silicone resin, so that the resin properties are integrated and the advantages are concentrated.

[0032] The inorganic modified organic silicon resin of the present invention contains high temperature resistant inorganic components such as nano-alumina or nano-silicon dioxide. If in a high temperature environment, the nano-alumina or nano-silicon dioxide can form a stable skeleton structure to prevent the rapid decomposition of the resin, and the thermal stability is better. The present invention combines the advantages of organic silicon resin and inorganic materials. The organic silicon part provides good flexibility and weather resistance, while the inorganic component can enhance the hardness, wear resistance, high temperature resistance and other properties of the resin. The combination of the two improves the comprehensive performance of the modified organic silicon resin.

[0033] The nano silicon dioxide in the present invention has a large surface area and more adsorbable active sites, and can interact with the organic functional groups in the epoxy-modified silicone resin and the polyester-modified silicone resin, so that the silicone resin and the inorganic silicon dioxide not only physically fill and enhance the hardness thereof, but also have the effect of chemical bonds, and the nano silicon dioxide can bring a certain catalytic effect, catalyze the epoxy ring-opening reaction and promote the polyesterification reaction; and the nano particles have a small particle size and are easy to bend, have better flexibility, and are easier to be evenly distributed between the silicone resins, thereby improving thermal stability.

[0034] The preparation method of the inorganic modified organosilicon resin of the present invention is simple, does not require modification by multiple organic substances, can also achieve stable high temperature resistance, and is easy for industrial production.

[0035] In the above embodiment, the main component of the wetting agent is polyether siloxane, preferably produced by Evonik Digo Chemical Co., Ltd.; the main component of the leveling agent is polydimethylsiloxane, the main component of the defoaming agent is polysiloxane and its derivatives; the main component of the viscosity modifier is polyurethane. All kinds of additives are commercially available.

[0036] In one embodiment, the content of the nano-alumina is 3% to 5%, and the content of the nano-silicon dioxide is 0.3% to 0.5%. Nano-alumina itself is not easy to oxidize at high temperatures. After filling with nano-alumina and nano-silicon dioxide, the physical properties including heat resistance and hardness are improved, but the amount of nano-alumina should not be too much, which is easy to cause cracking.

[0037] In one embodiment, the water-based hybrid silicone resin includes 20 to 45 parts of epoxy-modified silicone resin and 15 to 30 parts of polyester-modified silicone resin.

[0038] In one embodiment, the coupling agent is a titanate coupling agent.

[0039] Another aspect of the present invention provides a method for preparing an inorganic modified silicone resin, comprising the following steps:

[0040] S1: pretreatment: surface treatment of the inorganic filler;

[0041] S2: mixing: mixing the pretreated inorganic filler with the water-based hybrid silicone resin, the wetting agent, the leveling agent, the defoaming agent and water to obtain a mixture;

[0042] S3: paint mixing: adding water-based color ink to adjust the color, adding viscosity modifier to adjust the viscosity, and obtaining the organic silicon inorganic modified resin.

[0043] In this embodiment, the inorganic filler is surface treated to improve its compatibility with the water-based hybrid silicone resin, laying the foundation for the subsequent mixing step; the pretreated inorganic filler is evenly mixed with the water-based hybrid silicone resin, wetting agent, leveling agent, defoaming agent and other additives and water to obtain a mixture.

[0044] In one embodiment, the step S1: pretreatment process includes: loading the inorganic filler into a high-speed mixer, adding the coupling agent and stirring evenly. The surface of inorganic fillers such as nano-silicon dioxide and nano-alumina usually has a high surface energy and is easy to agglomerate in the resin system. The coupling agent builds a bridge between the inorganic filler and the silicone resin, promoting the dispersion of the inorganic filler in the silicone resin.

[0045] In one embodiment, after the step S2: mixing, the mixture is further moved into a high-speed disperser, with a dispersion speed of 1000-1500 rpm and a dispersion time of 10-30 min, and degassing. In order to further reduce agglomeration, the mixture is subjected to high-speed shear dispersion, with a sufficiently fast dispersion speed and a sufficiently long dispersion time to evenly disperse the materials, and finally vacuum degassing or standing degassing to ensure the quality of the product.

[0046] In the above embodiment, before the step of S3: paint mixing, the step further includes: feeding the deaerated mixture into a horizontal sand mill, and circulating for multiple times until the fineness reaches less than 20 μm. Sand grinding can grind the mixture finer, so that the paint forms a flatter and smoother surface during the coating process.

[0047] In one embodiment, the viscosity in S3 is 100-300 Pa. · s.

[0048] The specific embodiments are as follows:

[0049] In the following examples, all the raw materials used in the experiments are commercially available.

[0050] Example 1

[0051] S1: Pretreatment: Place nano-alumina and nano-silicon dioxide into a high-speed mixer, add 10g of titanate coupling agent and stir evenly for surface treatment;

[0052] S2: Mixing: Mix 500g of pretreated nano-alumina and 50g of nano-silicon dioxide with 750g of epoxy-modified silicone resin and 250g of polyester-modified silicone resin, 5g of wetting agent, 26g of leveling agent, 18g of defoaming agent and 1000g of water to obtain a mixture; transfer the mixture into a high-speed disperser at a dispersion speed of 1250rpm for 20min, degas, and send the degassed mixture into a horizontal sand mill for 3 cycles until the fineness reaches 20μm and the material is discharged.

[0053] S3: paint mixing: adding 45 g of water-based ink to adjust the color, adding 10 g of viscosity modifier to adjust the viscosity to 200 Pa·s, filtering and packaging to obtain the organic silicon inorganic modified resin.

[0054] Example 2

[0055] S1: Pretreatment: Place nano-silicon dioxide and nano-alumina into a high-speed mixer, add 8g of titanate coupling agent and stir evenly for surface treatment;

[0056] S2: Mixing: Mix the pretreated 500g of nano-alumina and 50g of nano-silicon dioxide with 1250g of the epoxy-modified silicone resin and 1000g of the polyester-modified silicone resin, 8g of a wetting agent, 26g of a leveling agent, 13g of a defoaming agent and 1500g of water to obtain a mixture; transfer the mixture into a high-speed disperser at a dispersion speed of 1000rpm for 10min for degassing, and send the degassed mixture into a horizontal sand mill for 3 cycles until the fineness reaches 20μm for discharging.

[0057] S3: paint mixing: adding water-based color ink to adjust the color, adding viscosity modifier to adjust the viscosity to 100 Pa·s, filtering and packaging to obtain the organic silicon inorganic modified resin.

[0058] The difference between the formulation of this embodiment and that of embodiment 1 is that the weight ratio of the inorganic filler to the water-based hybrid silicone resin is 55:225.

[0059] Example 3

[0060] S1: Pretreatment: Place nano-alumina and nano-silicon dioxide into a high-speed mixer, add 10g of titanate coupling agent and stir evenly for surface treatment;

[0061] S2: Mixing: Mix the pretreated 600g of nano-alumina and 100g of nano-silicon dioxide with 1250g of the epoxy-modified silicone resin and 1000g of the polyester-modified silicone resin, 5g of a wetting agent, 26g of a leveling agent, 18g of a defoaming agent and 1500g of water to obtain a mixture; transfer the mixture into a high-speed disperser at a dispersion speed of 1000rpm for 10min, degas, and send the degassed mixture into a horizontal sand mill for 3 cycles until the fineness reaches 20μm and the material is discharged.

[0062] S3: paint mixing: adding water-based color ink to adjust the color, adding viscosity modifier to adjust the viscosity to 100 Pa·s, filtering and packaging to obtain the organic silicon inorganic modified resin.

[0063] The difference between the formulation of this embodiment and that of embodiment 1 is that the weight ratio of nano-alumina to nano-silicon dioxide in the inorganic filler is 6:1, and the weight ratio of the inorganic filler to the water-based hybrid siloxane resin is 70:225.

[0064] Comparative Example 1

[0065] S1: Pretreatment: Place nano-alumina and nano-silicon dioxide into a high-speed mixer, add 10g of titanate coupling agent and stir evenly for surface treatment;

[0066] S2: Mixing: Mix 500g of pretreated nano-alumina and 50g of nano-silicon dioxide with 1000g of epoxy-modified silicone resin, 5g of wetting agent, 26g of leveling agent, 18g of defoaming agent and 1000g of water to obtain a mixture; transfer the mixture into a high-speed disperser at a dispersion speed of 1250rpm for 20min, degas, and send the degassed mixture into a horizontal sand mill for 3 cycles until the fineness reaches 20μm and the material is discharged.

[0067] S3: paint mixing: add water-based color ink to adjust the color, add viscosity regulator to adjust the viscosity, filter and package to obtain a sample.

[0068] The difference between this comparative example and the formulation of Example 1 is that no polyester modified silicone resin is added, and the amount of epoxy modified silicone resin is increased from 750 g to 1000 g.

[0069] Comparative Example 2

[0070] S1: Pretreatment: Place nano-alumina and nano-silicon dioxide into a high-speed mixer, add 10g of titanate coupling agent and stir evenly for surface treatment;

[0071] S2: Mixing: Mix the pretreated 500g nano-alumina and 50g nano-silicon dioxide with 1000g polyester modified silicone resin, 5g wetting agent, 26g leveling agent, 18g defoaming agent and 1000g water to obtain a mixture; transfer the mixture into a high-speed disperser at a dispersion speed of 1250rpm for 20min for degassing, and send the degassed mixture into a horizontal sand mill for 3 cycles until the fineness reaches 20μm for discharging.

[0072] S3: paint mixing: add water-based color ink to adjust the color, add viscosity regulator to adjust the viscosity, filter and package to obtain a sample.

[0073] The difference between this comparative example and the formulation of Example 1 is that no epoxy-modified silicone resin is added, and the amount of polyester-modified silicone resin is increased from 25 g to 100 g.

[0074] Comparative Example 3

[0075] S1: Pretreatment: Place nano calcium carbonate into a high-speed mixer, add 10 g of titanate coupling agent and stir evenly for surface treatment;

[0076] S2: Mixing: 550g of pretreated nano-calcium carbonate is mixed evenly with 750g of epoxy-modified silicone resin and 250g of polyester-modified silicone resin, 5g of wetting agent, 26g of leveling agent, 18g of defoaming agent and 1000g of water to obtain a mixture; the mixture is transferred into a high-speed disperser at a dispersion speed of 1250rpm for a dispersion time of 20min, and degassed. The degassed mixture is sent into a horizontal sand mill and recycled 3 times until the fineness reaches 20μm and the material is discharged.

[0077] S3: paint mixing: add water-based color ink to adjust the color, add viscosity regulator to adjust the viscosity, filter and package to obtain a sample.

[0078] The difference between this comparative example and the formulation of Example 1 is that the inorganic filler is replaced with nano calcium carbonate.

[0079] Comparative Example 4

[0080] S1: Mixing: 500g of nano-alumina and 50g of nano-silicon dioxide are mixed evenly with 750g of epoxy-modified silicone resin and 250g of polyester-modified silicone resin, 5g of wetting agent, 26g of leveling agent, 18g of defoaming agent and 1000g of water to obtain a mixture; the mixture is transferred into a high-speed disperser at a dispersion speed of 1250rpm for a dispersion time of 20min, and degassed. The degassed mixture is sent into a horizontal sand mill and recycled 3 times until the fineness reaches 20μm and the material is discharged.

[0081] S2: paint mixing: add water-based color ink to adjust the color, add viscosity regulator to adjust the viscosity, filter and package to obtain a sample.

[0082] The difference between this comparative example and Example 1 is that the inorganic filler is directly mixed without being surface treated with a coupling agent.

[0083] The organosilicon inorganic modified resins prepared in Examples 1 to 3 and the samples prepared in Comparative Examples 1 to 4 were subjected to relevant performance tests. The test steps were based on the standards: the adhesion test standard was GB / T9286-1998; the heat resistance test standard was GB / T 1735-2009; the construction test standard was GB / T6753.6-86; the curing time test standard was GB / T 1728-2020. The test results are shown in the table below.

[0084] sample Adhesion Heat resistance Construction Curing time Example 1 Level 0 600℃ Barrier-free construction 2h Example 2 Level 0 510℃ Barrier-free construction 2h Example 3 Level 0 530℃ Barrier-free construction 2h Comparative Example 1 Level 0 500℃ Thick, difficult to apply 4h Comparative Example 2 Level 1 400℃ Barrier-free construction 4h Comparative Example 3 Level 1 300℃ Thick, difficult to apply 1h Comparative Example 4 Level 2 500℃ Thick, difficult to apply 2h

[0085] As can be seen from the above table, the heat-resistant temperature of the inorganic modified silicone resin provided in Examples 1 to 3 of the present invention is stable at above 500° C., and has excellent heat resistance, excellent adhesion, no obstacles in construction, and fast curing.

[0086] In Comparative Examples 1 and 2, due to the single type of modified silicone resin, they have the defects of difficult construction and reduced heat resistance, respectively. The heat resistance of nano calcium carbonate in Comparative Example 3 is weaker than that of inorganic fillers alumina and silicon dioxide, because the chemical properties of nano calcium carbonate are more active and there are many dangling bonds on the surface, so the decomposition temperature is lower. The difference between Comparative Example 4 and Example 1 is that the inorganic filler is directly mixed without surface treatment with a coupling agent, so the uniform dispersion of the inorganic filler is significantly affected, and agglomeration is likely to occur, resulting in poor construction performance and a significant impact on adhesion. The adhesion is obviously very poor where the filler agglomerates.

[0087] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention specification, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. An inorganic modified silicone resin, characterized in that: The invention comprises the following raw materials in parts by weight: 35-75 parts of water-based hybrid silicone resin, 0.1-0.5 parts of wetting agent, 0.5-2 parts of leveling agent, 0.5-1 parts of defoaming agent, 0.5-2 parts of coupling agent, 2-13 parts of inorganic filler, 0.2-1 parts of viscosity modifier, 2-8 parts of water-based ink and 35-50 parts of water, wherein the inorganic filler comprises nano-alumina and nano-silicon dioxide.

2. The inorganic modified organosilicon resin according to claim 1, characterized in that: The content of the nano-alumina is 3% to 5%, and the content of the nano-silicon dioxide is 0.3% to 0.5%.

3. The inorganic modified organosilicon resin according to claim 1, characterized in that: The water-based hybrid silicone resin comprises 20 to 45 parts of epoxy-modified silicone resin and 15 to 30 parts of polyester-modified silicone resin.

4. The inorganic modified organosilicon resin according to claim 1, characterized in that: The coupling agent is a titanate coupling agent.

5. A method for preparing an inorganic modified silicone resin according to any one of claims 1 to 4, characterized in that: The following steps are involved: S1： Pretreatment: surface treating the inorganic filler; S2: mixing: mixing the pretreated inorganic filler with the water-based hybrid silicone resin, a wetting agent, a leveling agent, a defoaming agent, and water to obtain a mixture; S3: paint mixing: adding water-based color ink to adjust the color, adding viscosity modifier to adjust the viscosity, and obtaining the organic silicon inorganic modified resin.

6. The method for preparing an inorganic modified organosilicon resin according to claim 5, characterized in that: The step S1: the pretreatment process comprises: loading the inorganic filler into a high-speed mixer, and adding the coupling agent and stirring evenly.

7. The method for preparing an inorganic modified organosilicon resin according to claim 5, characterized in that: The step S2: after mixing, further comprises: transferring the mixture into a high-speed disperser, with a dispersion speed of 1000-1500 rpm, a dispersion time of 10-30 min, and degassing.

8. The method for preparing an inorganic modified organosilicon resin according to claim 7, characterized in that: Before the step of S3: paint mixing, the process also includes: feeding the deaerated mixture into a horizontal sand mill, and circulating the mixture for multiple times until the fineness reaches less than 20 μm and the mixture is discharged.

9. The method for preparing an inorganic modified organosilicon resin according to claim 5, characterized in that: The viscosity in S3 is 100 to 300 Pa·s.

10. Use of the inorganic modified organosilicon resin according to any one of claims 1 to 4 in coatings.