Cooling assembly, cooling system and method of using a cooling system

Abstract

The invention relates to a cooling assembly, a cooling system and a method of using the cooling system. The cooling assembly is used to transfer heat away from the device. The cooling assembly includes a heat sink and a heat pipe connected to and extending outwardly from the heat sink. The heat pipe includes a first portion extending outwardly from the heat sink and shaped to be inserted into the device and a second portion embedded in the heat sink. The actuation mechanism is configured to move the heat sink and the heat pipe in a first direction to bring the heat pipe into contact with the device, and to move the heat pipe in an opposite second direction to remove the heat pipe from contact with the device. The cooling system includes one or more devices, a heat sink, and a heat pipe.

Description

Technical Field

[0001] The present disclosure relates generally to the field of thermal management of devices, and more particularly to cooling assemblies and cooling systems having one or more heat sinks and heat pipes configured to move into contact with a device for rapid cooling. Background Art

[0002] Different equipment, such as manufacturing equipment, tools (e.g., heating tools), etc., need to be cooled during use. One way to cool equipment is through a heat sink. A heat sink is a passive device that transfers heat from the equipment to a fluid medium (e.g., a fluid coolant or air). Heat sinks that transfer heat to the air typically use fins with a large surface area to facilitate the transfer of heat to the air. Heat sinks that use fluid coolants may include complex piping structures to move the fluid in a manner that facilitates cooling.

[0003] In use, the heat sink contacts the device to remove heat from the device. In a manufacturing environment, it may be difficult to position the heat sink in contact with the device. For example, the device may be located in a small space without additional room for a heat sink. A heat sink configured to contact the device may be too small or ineffective in removing heat. In addition, the device often moves during use. For example, when forming a composite stringer, the forming blocks of the stamping assembly move between open and closed positions. It may be difficult to effectively position the heat sink relative to the device while also allowing the movement required for its operation.

[0004] Uncooled equipment can reach high temperatures above normal operating conditions. Excessive heat can cause equipment to fail during use. Additionally, excessive heat can damage equipment and reduce life expectancy. Excessive heat may require additional maintenance and more frequent replacement, which can reduce the efficiency of the manufacturing process and / or increase manufacturing costs. Summary of the invention

[0005] One aspect relates to a cooling assembly for transferring heat away from a device. The cooling assembly includes a heat sink and a heat pipe connected to and extending outward from the heat sink. The heat pipe includes a first portion extending outward from the heat sink and shaped to be inserted into the device, and a second portion embedded within the heat sink. An actuation mechanism is configured to move the heat sink and the heat pipe in a first direction to bring the heat pipe into contact with the device, and to move the heat sink and the heat pipe in an opposite second direction to remove the heat pipe from contact with the device.

[0006] In another aspect, the heat pipes are arranged in a straight row along the heat sink, wherein each heat pipe is mounted at a common vertical height within the heat sink.

[0007] In another aspect, the heat pipe includes a first end in the first portion and a second end in the second portion, wherein the first end is vertically positioned below the second end when the heat pipe is inserted into the device.

[0008] In another aspect, a thermal contact member is mounted to the first portion of the heat pipe, wherein the thermal contact member is comprised of a thermally conductive material.

[0009] In another aspect, the thermal contact member is positioned on an exterior of the heat pipe to prevent the heat pipe from directly contacting the device when the heat pipe moves in the first direction.

[0010] On the other hand, a thermal contact member is mounted to the end of the heat pipe at the first portion, wherein the thermal contact member includes: an inner member that contacts the heat pipe; and an outer member that is movably connected to the inner member and positioned outside the inner member, and wherein the outer member is biased outward from the inner member.

[0011] On the other hand, each heat pipe has the same shape and size.

[0012] In another aspect, the actuation mechanism is configured to move the heat sink and the heat pipe in a first plane to bring the heat pipe into contact with the device and remove the heat pipe from contact with the device, and to move the heat sink and the heat pipe in a second plane to index the heat sink and the heat pipe along the length of the device.

[0013] In another aspect, the actuation mechanism moves the heat sink and the heat pipe along a first linear path in the first plane and along a second linear path in the second plane.

[0014] One aspect relates to a cooling system including an apparatus, the apparatus including a body and a pit extending into the body. A radiator includes one or more conduits to move a first fluid within the interior of the radiator. A heat pipe is connected to the radiator and extends outward from the radiator, wherein the heat pipe includes a first end extending outward from the radiator and a second end located inside the radiator and vertically above the first end, and the heat pipe also includes a closed internal space for accommodating a working fluid. The radiator and the heat pipe are configured to move between an engaged position and a disengaged position. The engaged position includes: the heat pipe is inserted into the pit, thereby causing the working fluid at the first end to evaporate and move toward the second end to cool the apparatus. The disengaged position includes: the heat pipe is spaced apart from the pit, thereby causing the working fluid to condense and move toward the first end.

[0015] In another aspect, the heat pipe includes a wick disposed within the interior space to facilitate movement of the working fluid from the second end toward the first end.

[0016] In another aspect, the heat pipe includes a thermal contact member mounted at the first end, wherein the thermal contact member includes an adjustable outer member configured to contact the device when the first end is inserted into the well.

[0017] In another aspect, the thermal contact member is mounted on an exterior of the heat pipe to prevent the heat pipe from directly contacting the device at the engagement location.

[0018] On the other hand, the actuation mechanism moves the heat sink and the heat pipe relative to the device, wherein the actuation mechanism moves the heat sink and the heat pipe as a unit relative to the device between an engaged position and a disengaged position, wherein the first end is positioned in the device and the heat pipe is spaced apart from the device.

[0019] On the other hand, each heat pipe has the same shape and size.

[0020] One aspect relates to a method of using a cooling system. The method includes: moving a heat sink and a heat pipe in a first direction and inserting the heat pipes spaced along the heat sink into a pit in a device; transferring heat from the device to the heat sink through the heat pipes when the heat pipes are inserted into the pit; and moving the heat sink and the heat pipes in an opposite second direction and removing the heat pipes from the pit.

[0021] In another aspect, the method further includes compressing the thermal contact member mounted on the heat pipe when inserting the heat pipe into the pit.

[0022] In another aspect, the method further includes positioning the second end of the heat pipe vertically above the first end of the heat pipe when inserting the first end of the heat pipe into the pit.

[0023] In another aspect, the method further includes causing the fluid in the heat sink to directly contact the exterior of the heat pipe installed in the heat sink when inserting the heat pipe into the pit.

[0024] On the other hand, the method also includes: translating the heat sink and the heat pipe a distance along the length of the device; moving the heat sink and the heat pipe in the first direction and inserting the heat pipe into a plurality of additional pits in the device that are spaced apart from the pits along the device; and transferring heat from the device to the heat sink when the heat pipe is inserted into the additional pits.

[0025] The features, functions, and advantages that have been discussed can be achieved independently in various aspects or may be combined in yet other aspects, further details of which can be seen with reference to the following description and drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 is a schematic diagram of a cooling assembly including a heat sink, heat pipes, and an actuation mechanism.

[0027] Figure 2A is a perspective view of the end of a heat pipe extending outward from a heat sink and inserted into a device.

[0028] Figure 2B yes Figure 2A Side perspective view of the heat pipe and heat sink.

[0029] Figure 3 is a schematic diagram of a heat pipe extending into the interior space of a heat sink.

[0030] Figure 4 is a schematic diagram of a heat pipe.

[0031] Figure 5 is a schematic diagram of a thermal contact member mounted to the end of a heat pipe.

[0032] Figure 6 is a rear view of the heat pipe inserted into the pit of the device.

[0033] Figure 7 is a perspective view of a cooling system having a pair of cooling assemblies.

[0034] Figure 8 is a schematic diagram of a cooling assembly including a heat sink, a heat pipe, and an actuation mechanism configured to move in lateral and longitudinal directions.

[0035] Fig. 9 is a flow chart of a method of using a cooling system. DETAILED DESCRIPTION

[0036] Figure 1 A cooling assembly 10 configured to rapidly cool a device 100 is schematically shown. The cooling assembly 10 includes a heat sink 20 having one or more heat pipes 30 extending outwardly. The heat pipes 30 are configured to be inserted into corresponding wells 101 in the device 100. The actuating mechanism 50 is configured to move the heat sink 20 between an engaged position and a disengaged position along a path indicated by arrow A. In the engaged position, the heat pipes 30 are inserted into corresponding wells 101 and contact the device 100 to enable rapid cooling. In the disengaged position, the heat pipes 30 are moved away from the device 100.

[0037] The cooling assembly 10 is capable of rapidly cooling a variety of different types of devices 100. In some examples, the device is a tool used in a manufacturing process. In one specific example, the device 100 is a formed block of a stamped assembly used in a manufacturing process of a composite aircraft component. In some examples, the device 100 is an object being manufactured.

[0038] Figure 2A and Figure 2B The cooling assembly 10 is shown in an engaged position, wherein the heat pipe 30 is inserted into and in contact with the device 100. The cooling assembly 10 includes a heat sink 20 and a heat pipe 30. The heat pipe 30 extends outwardly from the heat sink 20 and is configured to be inserted into the device 100. Heat from the device 100 is transferred to the heat pipe 30, which is configured to then transfer the heat to the heat sink 20.

[0039] The heat sink 20 includes a body 21 that can have various shapes and sizes. In some examples shown, the heat sink includes a substantially rectangular parallelepiped shape with substantially flat outer sides. In some examples, each heat pipe 30 extends outward from one side 22 of the heat sink 20. This facilitates the use of heat pipes 30 of the same shape and size. In other examples, the heat pipes 30 include different shapes and / or sizes and extend outward from two or more sides 22 of the heat sink 20. The interior space 23 within the body 21 is configured to allow heat transfer from the heat pipes 30.

[0040] The interior space 23 may include a variety of different configurations. Figure 3 The interior space 23 including one or more contact members 24 and / or conduits 25 is schematically shown. The contact members 24 contact the heat pipes 30 and conduct heat away from the heat pipes 30. Examples of the contact members 24 include, but are not limited to, plates, tubes, and fins. The conduits 25 are configured to move a fluid through the interior space 23. In some examples, the conduits 25 are formed between the contact members 24, wherein the fluid directly contacts the heat pipes 30. Figure 3 Other examples shown include conduit 25, which is a tube with an outer wall that holds fluid. Conduit 25 can be arranged to move fluid through inner space 23 in various ways (e.g., one-way, two-way, etc.). In some examples, pump 26 is configured to move fluid through conduit 25. In other examples, fluid moves, for example, by gravity, without a pump. In some examples, conduit 25 is fully contained in inner space 23. In other examples, fluid is stored in external reservoir 27 and then pumped through inner space 23. Various different fluids can be used, including but not limited to water, deionized water, ethylene glycol and various dielectric fluids.

[0041] The heat pipe 30 is connected to the heat sink 20 and extends outwardly from the heat sink 20. The heat pipe 30 is configured to transfer heat from the device 100 to the heat sink 20 in a relatively short period of time, thereby enabling rapid cooling of the device 100. The heat pipe 30 includes a contained working fluid. Heat transfer occurs by absorbing thermal energy from the device 100 when the working fluid changes state to a gas within the heat pipe 30. The heat is then released when the gas changes state back to a fluid.

[0042] Figure 4 Schematically illustrated is a heat pipe 30 having an elongated shape with a first end 31 and a second end 32. The heat pipe 30 is made of various materials with high thermal conductivity, such as but not limited to copper, aluminum and stainless steel. When mounted to the radiator 20, the first end 31 is positioned outside the radiator 20 to be inserted into the device 100. The second end 32 is installed in the radiator 20. The length of the heat pipe 30 installed in the radiator 20 can vary. In one example, about 1 / 2 of the heat pipes 30 are installed in the radiator 20. In another example, about 1 / 3 of the heat pipes 30 are installed in the radiator 20. In some examples, the heat pipes 30 are arranged in a straight row along the side 22 of the radiator 20. The heat pipes 30 are oriented in the same manner in the radiator 20 and are oriented at the same vertical height in the radiator 20. This positioning allows the heat pipe 30 to work efficiently and facilitates the insertion of the heat pipe 30 into the device 100 at the engagement position.

[0043] The heat pipe 30 can have a variety of shapes and sizes. Figure 4 In one example shown, the heat pipe 30 has a pair of straight sections 37, 38 separated by a central curved elbow. Figure 2A and Figure 2B In some examples shown, when the heat pipe 30 is inserted into the device 100, the curved shape enables the second end 32 installed in the heat sink 20 to be vertically positioned above the first end 31. This vertical orientation promotes the phase change of the working fluid 36 within the internal space 33 of the heat pipe 30. In other examples, the heat pipe 30 has other shapes, such as but not limited to substantially straight and having a sharp angle shape. The heat pipe 30 also includes various cross-sectional shapes. In one example, the heat pipe 30 includes a circular cross-sectional shape. In another example, the heat pipe 30 includes a flat shape (e.g., an elongated ellipse).

[0044] The heat pipe 30 includes a closed internal space 33 containing a working fluid 36. The internal space 33 also includes a vapor chamber 34 and a wick 35. A vacuum is created in the internal space 33 to seal the working fluid 36 and the corresponding vapor and promote the evaporation and condensation process. When the first end 31 is inserted into and contacts the device 100, the working fluid 36 evaporates, thereby absorbing the latent heat in the process. The vapor from the evaporated working fluid 36 moves in the vapor chamber 34 toward the second end 32 with a lower temperature. The vapor condenses at and / or near the second end 32, thereby releasing heat and returning to a fluid form. The fluid at the second end 32 returns to the first end 31 through the wick 35 through the process of capillary action. In some examples, the elevated positioning of the second end 32 further promotes the movement of the working fluid 36 from the second end 32 toward the first end 31. The working fluid 36 can be selected from a variety of different substances, including but not limited to water, ethanol and naphthalene.

[0045] In some examples, the first end 31 of the heat pipe 30 is directly inserted into the pit 101 of the device 100, and the heat pipe 30 directly contacts the device 100. In some examples, the first end 31 has a rounded shape to facilitate insertion into the pit 101 and movement along the pit 101.

[0046] In some examples, thermal contact member 60 is attached to heat pipe 30 at first end 31. Figure 5 As shown, the thermal contact member 60 includes one or more internal members 61 extending along opposite sides of the heat pipe 30. One or more brackets 65 may extend between the internal members 61 and connect the internal members 61 together to form a single integral piece. One or more external members 62 extend along the outer edge of the internal member 61. One or more biasing members 63 bias the external member 62 laterally outward away from the internal member 61. The biasing member 63 may include various structures, including but not limited to coil springs, leaf springs, and flexible materials. The biasing member 63 allows the width W measured between the external members 62 to vary depending on the size of the pit 101. The thermal contact member 60 also includes a tip 64 at the distal end, the shape of which is convenient for insertion into the pit 101 of the device 100. In one example, the tip 64 includes a circular shape. In one example, the width of the tip 64 is less than the width of the external member 62 for easy insertion.

[0047] The thermal contact member 60 is made of various materials with high thermal conductivity. Examples include, but are not limited to, copper, aluminum, and stainless steel. Figure 6 When inserted into the device 100 as shown, the outer member 62 contacts the device 100. In some examples, the well 101 has a narrow width so that the outer member 62 is biased inwardly. Heat from the device 100 is transferred to the thermal contact member 60 and then to the heat pipe 30.

[0048] The apparatus 100 is configured to receive the heat pipe 30 in an engaged position. Figure 2A and Figure 2B In some examples shown, the device 100 includes wells 101 sized to receive the heat pipes 30. In some examples, the number of wells 101 corresponds to the number of heat pipes 30. In other examples, the number of wells 101 exceeds the number of heat pipes 30. Different wells 101 can include the same or different shapes and / or sizes.

[0049] In such Figure 2A and Figure 2B In some examples shown, pits 101 extend into side 102 of device 100 and include a depth D. In some examples, depth D extends substantially across the entire width of device 100. In other examples, depth D is relatively small and extends to less than 1 / 2 the width of device 100. Depth D can be the same or different for each pit 101.

[0050] In another example, one or more heat pipes 30 contact the outer side of the device 100. These heat pipes 30 are not inserted into the pits, but are simply placed in contact with the outer side of the device 100.

[0051] like Figure 2A and Figure 2B The cooling system 150 shown includes the device 100, the heat sink 20 and the heat pipe 30. The heat sink 20 and the heat pipe 30 move between the engaged position and the disengaged position to quickly cool the device 100. In some examples, the device 100 is a tool assembly configured to form a workpiece. The rapid cooling of the device 100 allows the device 100 to operate efficiently during the forming process of the workpiece and also achieve a full working life.

[0052] In such Figure 2A and Figure 2B In some examples shown, the cooling system 150 includes a single heat sink 20 with an attached heat pipe 30 that engages the device 100. Figure 7 In another example shown, the cooling system 150 includes two cooling assemblies 10a, 10b. The cooling assemblies 10a, 10b include heat sinks 20a, 20b, heat pipes 30a, 30b, and devices 100a, 100b, respectively. Figure 7 In some examples shown, the cooling system 150 is configured to form a composite form stringer for an aircraft. The device 100, 100b is a forming block as part of a stamping machine. The forming block includes a pit sized to receive the distal end of the heat pipe 30a, 30b. In other examples, the cooling system 150 has three or more sets of devices, heat sinks, and heat pipes.

[0053] In such Figure 1In some examples shown, the heat pipe 30 is translated laterally to engage with the device 100. In one specific example, the motion along the path of travel indicated by arrow A is substantially linear. In some examples, the number and spacing of the heat pipes 30 are substantially equal to the length of the device 100, thereby enabling engagement along the length of the device 100. The heat pipe 30 and the heat sink 20 are configured to remove heat by contacting the device 100 only without requiring a fluid connection to the device 100. This allows the device 100 to be separated from the cooling assembly 10 for transport down the production line.

[0054] In such Figure 8 In another example shown, the cooling assembly 10 is configured to move laterally between an engaged position and a disengaged position. In addition, the heat sink 20 and heat pipe 30 are also configured to translate longitudinally along the length indicated by arrow B to another portion of the device 100. Once positioned, the heat pipe 30 and heat sink 20 are again translated laterally to engage with the second portion. This process can continue to cool different portions along the length of the device 100.

[0055] Fig. 9 A method of using the cooling system 150 is shown. The method includes moving the heat sink 20 and the heat pipe 30 in a first direction and inserting the heat pipe 30 spaced along the heat sink 20 into the pit 101 in the device 100 (block 200). When the heat pipe 30 is inserted into the pit 101, heat from the device 100 is transferred to the heat sink 20 through the heat pipe 30 (block 202). The heat sink 20 and the heat pipe 30 are then moved in an opposite second direction to remove the heat pipe 30 from the pit 101 (block 204).

[0056] Of course, without departing from the essential features of the present invention, the present invention may be implemented in other ways than those specifically described herein. The present embodiment is considered in all respects to be illustrative rather than restrictive, and all changes falling within the meaning and equivalent scope of the appended claims are intended to be included therein.

Claims

1. A cooling assembly for transferring heat from a device, the cooling assembly comprising: Radiator (20); A heat pipe (30), the heat pipe being connected to the heat sink (20) and extending outward from the heat sink (20), each heat pipe (30) comprising: a first portion extending outwardly from the heat sink (20) and shaped to be inserted into the device; a second portion, the second portion being embedded in the heat sink (20); and An actuating mechanism (50) is configured to move the heat sink (20) and the heat pipe (30) in a first direction to bring the heat pipe (30) into contact with the device, and to move the heat sink (20) and the heat pipe (30) in an opposite second direction to remove the heat pipe (30) from contact with the device.

2. The cooling assembly according to claim 1, wherein: The heat pipes (30) are arranged in a straight row along the heat sink (20), wherein each heat pipe (30) is installed at a common vertical height within the heat sink (20); and / or wherein the heat pipe (30) comprises a first end (31) in the first portion and a second end (32) in the second portion, wherein when the heat pipe (30) is inserted into the device, the first end (31) is positioned vertically below the second end (32); and / or Wherein, each heat pipe (30) has the same shape and size.

3. The cooling assembly according to claim 1 or 2, further comprising a thermal contact member (60) mounted to the first portion of the heat pipe (30), the thermal contact member (60) being composed of a thermally conductive material.

4. The cooling assembly according to claim 3, wherein: The thermal contact member (60) is positioned on the exterior of the heat pipe (30) to prevent the heat pipe (30) from directly contacting the device when the heat pipe (30) moves in the first direction.

5. The cooling assembly according to claim 1 or 2, further comprising a thermal contact member (60) mounted to the end of the heat pipe (30) at the first portion, the thermal contact member (60) comprising: an internal component (61) contacting the heat pipe (30); an outer member (62) movably connected to the inner member (61) and positioned outside the inner member (61); and Wherein, the outer member (62) is offset outwardly from the inner member (61).

6. The cooling assembly according to claim 1 or 2, wherein: The actuation mechanism (50) is configured to: move the heat sink (20) and the heat pipe (30) in a first plane to bring the heat pipe (30) into contact with the device and remove the heat pipe (30) from contact with the device; and move the heat sink (20) and the heat pipe (30) in a second plane to index the heat sink (20) and the heat pipe (30) along the length of the device.

7. The cooling assembly according to claim 6, wherein: The actuation mechanism (50) moves the heat sink (20) and the heat pipe (30) along a first linear path in the first plane and along a second linear path in the second plane.

8. A cooling system, comprising: A device (100) comprising a body (102) and a plurality of wells (101) extending into the body (102); a heat sink (20) comprising one or more conduits (25) for moving a first fluid within an interior of the heat sink (20); a heat pipe (30), the heat pipe being connected to the heat sink (20) and extending outward from the heat sink (20), the heat pipe (30) comprising a first end (31) extending outward from the heat sink (20) and a second end (32) positioned inside the heat sink (20) and above the first end (31) in a vertical direction, the heat pipe (30) further comprising a closed internal space (33) containing a working fluid (36); Wherein, the heat sink (20) and the heat pipe (30) are configured to move between an engaged position and a disengaged position; wherein the engagement position comprises: the heat pipe (30) is inserted into the pit (101), thereby causing the working fluid (36) at the first end (31) to evaporate and move toward the second end (32) to cool the device (100); and The disengaged position includes: the heat pipe (30) being spaced apart from the pit (101), thereby causing the working fluid (36) to condense and move toward the first end (31).

9. The cooling system according to claim 8, wherein: The heat pipe (30) includes a wick (35) disposed within the interior space (33) to facilitate movement of a working fluid (36) from the second end (32) toward the first end (31); and / or wherein each heat pipe (30) has the same shape and size; and / or The cooling system further comprises an actuating mechanism (50) for moving the radiator (20) and the heat pipe (30) relative to the device (100), wherein the actuating mechanism (50) moves the radiator (20) and the heat pipe (30) as a unit relative to the device (100) between an engaged position and a disengaged position, wherein the first end (31) is positioned in the device (100) and the heat pipe (30) is spaced apart from the device (100).

10. The cooling system according to claim 8 or 9, wherein: The heat pipe (30) includes a thermal contact member (60) mounted at the first end (31), the thermal contact member (60) including an adjustable outer member (62) configured to contact the device (100) when the first end (31) is inserted into the pit (101).

11. The cooling system according to claim 10, wherein: The thermal contact member (60) is mounted on the exterior of the heat pipe (30) to prevent the heat pipe (30) from directly contacting the device (100) at the engagement position.

12. A method of using a cooling system, the method comprising: Moving the heat sink (20) and the heat pipe (30) in a first direction and inserting the heat pipe (30) spaced apart along the heat sink (20) into a pit (101) in the device (100); When the heat pipe (30) is inserted into the pit (101), heat is transferred from the device (100) to the heat sink (20) through the heat pipe (30); and The heat sink (20) and the heat pipe (30) are moved in an opposite second direction, and the heat pipe (30) is taken out of the pit (101).

13. The method according to claim 12, further comprising: compressing a thermal contact member (60) mounted on the heat pipe (30) when the heat pipe (30) is inserted into the pit (101); and / or When the first end (31) of the heat pipe (30) is inserted into the pit (101), the second end (32) of the heat pipe (30) is positioned vertically above the first end (31) of the heat pipe (30); and / or When the heat pipe (30) is inserted into the pit (101), the fluid in the heat sink (20) is brought into direct contact with the outside of the heat pipe (30) installed in the heat sink (20).

14. The method according to claim 12 or 13, further comprising: Translating the heat sink (20) and the heat pipe (30) along the length of the device (100) for a certain distance; Moving the heat sink (20) and the heat pipe (30) in the first direction and inserting the heat pipe (30) into an additional pit (101) in the device that is spaced apart from the pit (101) along the device; and When the heat pipe (30) is inserted into the additional pit (101), heat is transferred from the device to the heat sink (20).

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