Digital-analog intelligent device and method for detecting electrical safety

Abstract

The invention discloses a digital-analog intelligent device for detecting electrical safety and a method thereof, and belongs to the technical field of safety detection, an intelligent central processing module of the intelligent device is connected with a physical deformation algorithm unit, and the intelligent central processing module is also connected with a data storage module, an intelligent alarm module and an intelligent display module; the input end of the thermal imaging processing module is connected with a thermal imaging scanning module, and the input end of the 3D imaging processing module is connected with a 3D laser scanning module. The device and the method can accurately monitor the operating temperature state and the physical space structure form of the electrical system in real time, effectively prevent electrical faults, accurately judge electrical potential safety hazards and improve the safety and the reliability of electrical equipment. The device can efficiently and accurately detect the safety performance of the electrical system through light wave and digital-to-analog conversion technologies in combination with an intelligent algorithm, and sends the operation safety state information of the electrical system to a user in real time through remote communication, so that the operation safety of electrical equipment is improved.

Description

Technical Field

[0001] The invention belongs to the technical field of safety detection, and in particular is a digital-analog intelligent device and method for detecting electrical safety. Background Art

[0002] With the improvement of the degree of industrial automation in my country, electrical equipment is being used more and more widely in various fields, and its safe operation is receiving increasing attention. However, various faults may occur in electrical equipment during operation, such as line aging and short circuit caused by overtemperature, loose cable line wiring and leakage, etc. These faults may cause serious consequences such as equipment damage, casualties and even fire. Therefore, it is necessary to accurately monitor the operating status of the electrical system in real time and accurately judge electrical safety hazards. However, traditional electrical safety detection methods often rely on manual detection, which cannot accurately monitor the operating temperature status of the electrical system in real time, and the physical space structure changes. Once electrical equipment fails and has safety problems during operation, it will not only affect production efficiency, but may also cause serious property losses and personal injuries. Therefore, it is particularly important to study a digital-analog intelligent device and method for detecting electrical safety, and to predict potential faults in the electrical system in advance. The detection device has become an important link in ensuring the normal operation of electrical equipment. Summary of the invention

[0003] In order to solve the shortcomings and deficiencies in the prior art, this application proposes a digital-analog intelligent device and method for detecting electrical safety.

[0004] In order to solve the above technical problems, this application provides the following technical solutions:

[0005] A digital-analog intelligent device for detecting electrical safety comprises a thermal imaging scanning module, a thermal imaging processing module, a 3D laser scanning module, a 3D imaging processing module, an intelligent central processing module, a physical deformation algorithm unit, a data storage module, an intelligent alarm module and an intelligent display module. The intelligent central processing module is connected to a signal output end of the thermal imaging processing module and a signal output end of the 3D imaging processing module, the intelligent central processing module is connected to the physical deformation algorithm unit, and the intelligent central processing module is also connected to the data storage module, the intelligent alarm module and the intelligent display module; the input end of the thermal imaging processing module is connected to the thermal imaging scanning module, and the input end of the 3D imaging processing module is connected to the 3D laser scanning module.

[0006] Moreover, an infrared thermal imaging optical system is arranged between the thermal imaging scanning module and the product under test, and the thermal imaging scanning module absorbs infrared thermal radiation from the product under test and the environment through the infrared thermal imaging optical system, and the infrared thermal radiation is converted into a digital signal through the thermal imaging scanning; the thermal imaging processing module is connected to the thermal imaging scanning module, receives the digital signal obtained by the thermal imaging scanning module, and the thermal imaging processing module processes the infrared band in the blind spot of human vision into visible light, and further forms a visual image and a large amount of structural data based on a mathematical model, and maps the processed image and data according to the thermal contrast generated by the different emissivity between various wavelengths, thereby retaining the temperature field distribution image and structural data with infrared radiation.

[0007] Moreover, the optical system of the infrared thermal imaging includes a lens, a grating and a detector, and the lens, the grating and the detector are arranged in sequence along the direction of the product to be tested toward the thermal imaging scanning module.

[0008] Moreover, the 3D laser scanning module uses a laser wavelength outside the infrared wavelength range as the wavelength of the electromagnetic wave carried by the 3D laser scanning, which is emitted to the surface of the product to be measured, and then the deformed light pattern on the surface of the product to be measured is captured; the 3D imaging processing module calculates the X, Y, and Z three-dimensional coordinate information of the object surface by analyzing the deformed light pattern, and determines the three-dimensional shape of the object surface by projecting a sinusoidal laser onto the surface of the object and detecting the phase change of the reflected light. The laser pulse or light wave is emitted to the surface of the product to be measured, and its return time is measured at the same time. The distance from the object to the scanner is determined by measuring the flight time of the light, and the geometric size and shape of the object are calculated. The measurement is fast and has high accuracy. The 3D imaging processing module performs 3D imaging processing and data storage on the calculated three-dimensional coordinate data.

[0009] Moreover, the 3D laser scanning module includes a seed frequency synthesis laser beam, laser modulation drive hardware, a laser emission module, a laser receiving module, temperature compensation and signal receiving processing, and a transimpedance frequency selective filter amplifier. The laser emission module and the laser receiving module are arranged at corresponding positions outside the measured product at intervals. The laser beam emitted by the laser emission module is reflected by the measured product and then acquired by the laser receiving module. The laser emission module is sequentially connected to the laser modulation drive hardware, the seed frequency synthesis laser beam, and the 3D imaging processing module, and the laser receiving module is sequentially connected to the temperature compensation and signal receiving processing, the transimpedance frequency selective filter amplifier, and the 3D imaging processing module.

[0010] Moreover, the intelligent central processing module fits the data processed by the 3D imaging processing module and the thermal imaging processing module, performs noise reduction processing, and further forms a 3D distribution image of the actual measured product in the temperature field with infrared radiation, and performs real-time data monitoring of the actual operating physical form of the measured product; the physical deformation algorithm unit compares and analyzes the 3D actual measured product physical form data of the temperature field with infrared radiation in real time, on the one hand, compares and analyzes it with the initial value, and on the other hand, compares and analyzes it with various pre-stored warning values. Once the change value and warning value are exceeded for multiple consecutive times, the intelligent central processing module will store this part of the data separately, give alarm processing, and give a warning level and expected development trend according to the size of the data change rate.

[0011] Moreover, the physical form data include the minimum warning value of the electrical clearance at each key part, the minimum warning value of the creepage distance, the spatial structure design warning value, and the change value of the electrical clearance and creepage distance per unit time.

[0012] Moreover, the alarm processing includes the intelligent alarm module in close proximity to the tested product sending out an alarm signal, and sending out an alarm signal to a remote intelligent alarm module through a wireless data transmission module.

[0013] A digital-analog intelligent method for detecting electrical safety, the specific steps comprising:

[0014] After S1 is initialized, the thermal imaging function is enabled. The infrared thermal imaging scanning module absorbs the infrared thermal radiation of the product under test and the environment through the optical system of the infrared thermal imaging and converts it into a digital signal. After the infrared thermal imaging scanning module and thermal intelligence processing, the infrared light wave is converted into visible light and the digital image processing is started to obtain the thermal imaging data of the product under test.

[0015] S2 determines the infrared wave band range and the different light wave band ranges in the external space according to the infrared thermal imaging scanning module, which is used to enable 3D laser imaging; the 3D laser scanning module performs laser scanning on the product under test, and then captures the deformed light pattern on the surface of the product under test, and the 3D imaging processing module performs 3D data imaging processing by analyzing the deformed light pattern, and stores the calculated 3D data imaging processing data;

[0016] The S3 intelligent central processing module fits the data processed by the 3D imaging processing module and the thermal imaging processing module, and performs noise reduction at the same time, so that the fitting results can be displayed, presenting a 3D high-definition image of the actual temperature field of the tested product, and monitoring the operating status of the tested electrical product in real time;

[0017] The S4 intelligent central processing unit will compare and analyze the physical form data of the actual tested product in the 3D temperature field with infrared radiation in real time. On the one hand, it will compare and analyze it with the initial value, and on the other hand, it will compare and analyze it with various pre-stored warning values. Once the change value and warning value are exceeded for three consecutive times, the intelligent central processing module will store this part of the data separately and give nearby alarm processing. At the same time, it will send a warning signal to the wireless data transmission module, and give a warning level and expected development trend according to the size of the data change rate.

[0018] Moreover, the 3D laser scanning module in step S2 selects lasers of different wavelengths except for the wavelength range of 0.78 to 1000 um, selects light mode stripes or grids to be transmitted to the surface of the product under test through the seed frequency synthesis laser, laser modulation drive hardware and laser transmission module, and then uses the laser receiving module, temperature compensation and signal receiving processing and transimpedance frequency selective filter amplifier hardware channel to capture the deformation of the light mode on the surface of the product under test;

[0019] The ranging observation value S is obtained by the pulse ranging method, and the precision clock controls the encoder to synchronously measure the horizontal scanning angle observation value α and the vertical scanning angle observation value θ of each laser pulse; the laser scanning measurement uses the internal coordinate system Pi, the X-axis is in the horizontal scanning plane, the Y-axis is perpendicular to the X-axis in the horizontal scanning plane, and the Z-axis is perpendicular to the horizontal scanning plane;

[0020] The calculation formula for the three-dimensional laser foot point P coordinates (XS, YS, ZS) is as follows:

[0021]

[0022] The 3D imaging processing module calculates the X, Y, and Z three-dimensional coordinate information of the object surface by analyzing the deformed light pattern. After obtaining the three-dimensional coordinate information, 3D data imaging processing is performed. The three-dimensional shape of the object surface is determined by projecting a sinusoidal laser onto the object surface and detecting the phase change of the reflected light. The laser pulse or light wave is emitted to the surface of the product being measured, and its return time is measured at the same time. The distance from the object to the scanner is determined by measuring the flight time of the light, and the geometric size and shape of the object are calculated.

[0023] The advantages and positive effects of the present invention are:

[0024] The device and method of the present invention can accurately monitor the operating temperature state and physical space structure of the electrical system in real time, effectively prevent electrical faults, accurately judge electrical safety hazards, and improve the safety and reliability of electrical equipment. The device uses light wave and digital-to-analog conversion technology, combined with intelligent algorithms, to efficiently and accurately detect the safety performance of the electrical system, and send the electrical system operating safety status information to the user in real time through remote communication, thereby improving the operating safety of electrical equipment. It helps to improve the safety and reliability of electrical equipment, reduce the failure rate, and provide a strong guarantee for the safe development of my country's electrical industry. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solution of the present invention, the accompanying drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative work.

[0026] Figure 1 It is a functional block diagram of a digital-analog intelligent device and method for detecting electrical safety in an embodiment of the present invention.

[0027] Figure 2 It is a hardware structure diagram of a digital-analog intelligent device and method for detecting electrical safety in an embodiment of the present invention.

[0028] Figure 3 It is a flow chart of the intelligent algorithm of the digital-analog intelligent device and method for detecting electrical safety in the embodiment of the present invention. Figure 4 Schematic diagram of calculation of three-dimensional laser foot point P coordinates (XS, YS, ZS) in the embodiment. DETAILED DESCRIPTION

[0029] In order to make the structure and advantages of the present invention more clear, the structure of the present invention will be further described below in conjunction with the accompanying drawings.

[0030] A digital analog intelligent device for detecting electrical safety, see attached Figure 1 As shown, it includes an intelligent central processing module, a thermal imaging scanning module, a thermal imaging processing module, a 3D laser scanning module, a 3D imaging processing module, a data storage module, an intelligent alarm module, an intelligent display module, a wireless data transmission module and a power supply module.

[0031] The intelligent central processing module is connected to the signal output end of the thermal imaging processing module and the signal output end of the 3D imaging processing module. The intelligent central processing module is connected to the physical deformation algorithm unit. The intelligent central processing module is also connected to a data storage module, an intelligent alarm module, an intelligent display module and a wireless data transmission module; the input end of the thermal imaging processing module is connected to the thermal imaging scanning module, and the input end of the 3D imaging processing module is connected to the 3D laser scanning module.

[0032] The above-mentioned intelligent central processing module, thermal imaging scanning module, thermal imaging processing module, 3D laser scanning module, 3D imaging processing module, data storage module, intelligent alarm module, intelligent display module and wireless data transmission module are respectively connected to the power module and powered by the power module.

[0033] For detailed settings of each module, please refer to the attached Figure 2 As shown, thermal imaging scanning and thermal imaging processing modules:

[0034] An infrared thermal imaging optical system is arranged between the thermal imaging scanner and the product under test, such as the lens, grating and detector shown in this embodiment. The thermal imaging processing module absorbs the infrared thermal radiation of the product under test and the environment through the infrared thermal imaging optical system to obtain an electrical signal, and the electrical signal is used to transmit it to the thermal imaging processing module.

[0035] Thermal imaging scanning module: The thermal imaging scanning module absorbs infrared heat radiation from the product under test and the environment through infrared thermal imaging optical systems such as lenses, gratings and detectors. When the temperature is higher than the absolute temperature of -273°C, there is irregular movement of molecules and atoms between the product under test and the environment, and its surface continuously radiates infrared rays. Infrared rays are a kind of electromagnetic wave with a wavelength range of 0.78 to 1000um. This electromagnetic wave reflects the infrared radiation field, i.e., the temperature field, on the surface of the product under test. The infrared lens focuses the infrared heat radiation onto the infrared detector, which is converted into an electrical signal by the infrared detector. The electrical signal is converted into a digital signal by a high-speed A / D.

[0036] Thermal imaging processing module: The thermal imaging processing module is connected to the thermal imaging scanning module via a data line, and receives the signal detected by the thermal imaging scanning module. The thermal imaging processing module processes the infrared band in the blind spot of human vision into visible light, and further forms a visual image and a large amount of structural data based on a mathematical model. According to the different thermal contrasts generated by the different emissivities between various wavelengths, the processed images and data are mapped according to the thermal contrast, thereby retaining the temperature field distribution image and structural data with infrared radiation.

[0037] See attached Figure 2 As shown, 3D laser scanning and 3D imaging processing modules:

[0038] The 3D laser scanning module includes a seed frequency synthesis laser beam, laser modulation drive hardware, a laser emission module, a laser receiving module, temperature compensation and signal receiving processing, and a transimpedance frequency selective filter amplifier. The laser emission module and the laser receiving module are arranged at corresponding positions outside the measured product at intervals. The laser beam emitted by the laser emission module is reflected by the measured product and then acquired by the laser receiving module. The laser emission module is sequentially connected to the laser modulation drive hardware, the seed frequency synthesis laser beam, and the 3D imaging processing module, and the laser receiving module is sequentially connected to the temperature compensation and signal receiving processing, the transimpedance frequency selective filter amplifier, and the 3D imaging processing module.

[0039] The 3D laser scanning module uses a laser wavelength outside the infrared wavelength range as the wavelength of the electromagnetic wave carried by the 3D laser scanning. As monochromatic light, the wavelength is very pure and has only one clear frequency. The factors such as the amplification medium and excitation method used in the laser emission module can limit the photons to vibrate only at a certain wavelength. For the products under test with different media and reflection performance, lasers with different wavelengths other than the wavelength range of 0.78 to 1000um can be selected. The light mode stripes or grids can be selected to be emitted to the surface of the product under test through the seed frequency synthesis laser, laser modulation drive hardware and laser emission module, and then the laser receiving module, temperature compensation and signal receiving processing and transimpedance frequency selective filter amplifier hardware channels are used to capture the deformation of the light mode on the surface of the product under test.

[0040] The 3D imaging processing module calculates the X, Y, and Z three-dimensional coordinate information of the object surface by analyzing the deformed light pattern. The three-dimensional shape of the object surface is determined by projecting a sinusoidal laser onto the object surface and detecting the phase change of the reflected light. The laser pulse or light wave is emitted to the surface of the product being measured and its return time is measured at the same time. The distance from the object to the scanner is determined by measuring the flight time of the light, and the geometric size and shape of the object are calculated. The measurement is fast and has high accuracy. The 3D imaging processing module performs 3D imaging processing and data storage on the calculated 3D coordinate data.

[0041] The thermal imaging scanning and processing module and the 3D imaging processing module are both connected to the intelligent central processing module. The data processed by the thermal imaging scanning and processing module and the 3D imaging processing module are sent to the intelligent central processing module. The intelligent central processing module is connected to the physical deformation algorithm unit.

[0042] Intelligent central processing module: The intelligent central processing module fits the data processed by the 3D imaging processing module and the thermal imaging processing module, and performs noise reduction processing at the same time, so that the deviation between the fitting result and the actual tested product is much smaller than the range noise, and further forms a 3D distribution image of the actual tested product with infrared radiation temperature field, which can reach one thousandth of an accuracy level. The temperature field data of the tested product can be clearly displayed in the 3D actual tested product imaging model, and the actual operation physical form data of the tested product is monitored in real time. The intelligent central processing unit focuses on analyzing and monitoring the temperature data and physical form data above the 95% probability maximum value of the temperature field data, and stores the data every 1ms operation cycle, and accurately records the stored data according to the absolute time. The physical form data recorded in the first 10ms is used as the benchmark data, and the temperature data recorded in the first 10ms is used as the initial data. The intelligent central processing unit pre-stores the maximum temperature warning value of each key part of the tested product and the temperature change value per unit time. The physical form data includes the minimum warning value of the electrical clearance at each key part, the minimum warning value of the creepage distance, the warning value of the spatial structure design, the change value of the electrical clearance and creepage distance per unit time, and other data.

[0043] Physical deformation algorithm unit: The physical deformation algorithm unit will compare and analyze the physical form data of the actual measured product in the 3D temperature field with infrared radiation in real time. On the one hand, it will compare and analyze it with the initial value, and on the other hand, it will compare and analyze it with various pre-stored warning values. Once the change value and warning value are exceeded for three consecutive times, the intelligent central processing module will store this part of the data separately and give local alarm processing. At the same time, it will send a warning signal to the wireless data transmission module, and give a warning level and expected development trend according to the size of the data change rate.

[0044] The intelligent central processing module can monitor the operating status of the tested electrical products in real time, accurately analyze the operating data of electrical equipment, and promptly discover potential safety hazards. The intelligent central processing module uses advanced digital-to-analog conversion technology and intelligent analysis algorithms, with a detection accuracy of up to one thousandth, which can quickly detect the safety performance of electrical equipment and improve detection efficiency. The intelligent central processing module can automatically adjust the detection prediction strategy based on historical data and real-time data to achieve intelligent detection.

[0045] The intelligent central processing module is also connected to an intelligent display module, a wireless communication and an intelligent alarm module to display and alarm the data processed by the intelligent central processing module.

[0046] The intelligent display module presents a 3D high-definition image of the actual temperature field of the product under test. It not only displays the original 3D image of the monitored position of the product under test, but also displays the temperature field data of the monitored position of the product under test on the original 3D image, and truly and accurately displays the temperature field and temperature data value of each precise position of the product under test. The intelligent display and alarm module are integrated. After the alarm signal appears, the intelligent display is divided into local display and remote display.

[0047] The intelligent alarm module is used to send out an alarm signal when abnormal data is generated, and it may be remotely displayed through the wireless communication module.

[0048] A digital-analog intelligent method for detecting electrical safety, see Appendix Figure 3 As shown, the specific steps include:

[0049] S1 turns on the thermal imaging function to obtain thermal imaging data of the product under test;

[0050] During the operation of electrical products in the electrical system, place the digital-analog intelligent device for electrical safety detection on the live parts of the product to be tested, keep an appropriate spatial distance from the live parts, connect the power supply to the digital-analog intelligent device for electrical safety detection, and after initialization, enable the thermal imaging function. The infrared thermal imaging scanning module absorbs the infrared thermal radiation of the product to be tested and the environment through the optical system of infrared thermal imaging, such as lens, grating and detector. The wavelength range is 0.78~1000um, that is, the temperature field is focused by the infrared lens on the infrared detector, which is converted into an electrical signal by the infrared detector. The signal is converted into a digital signal by high-speed A / D.

[0051] The infrared thermal radiation data of different wavelengths are converted into the radiation emittance of the resonator electromagnetic wave spectrum with wavelength as a variable through the following formula.

[0052]

[0053] Where ε λ is the spectral radiation emittance, unit: W·cm -2 μm -1 ;

[0054] λ is the wavelength of spectral radiation, unit: μm;

[0055] T is the absolute temperature of the electromagnetic wave of the resonator, unit: K;

[0056] K B is the Boltzmann constant, unit: J / K;

[0057] h=6.6262×10 -34 , is Planck's constant;

[0058] c=2.9979×10 -8m / s, is the speed of light in vacuum;

[0059] According to the above formula, it can be concluded that the absolute temperature of the resonator electromagnetic wave is at any wavelength, and the spectral emission corresponding to the higher temperature is also larger, and vice versa. Under different wavelengths, the spectral radiation emission increases rapidly with the increase of temperature.

[0060] The radiation energy actually received by the infrared detector includes three parts: the target's own radiation energy, the radiation energy reflected from surrounding objects, and the radiation energy of the atmosphere. The first two types of radiation must be attenuated by the atmosphere before reaching the detector.

[0061] The infrared radiation brightness of the target object is:

[0062] L λ =ε λ L bλ (T 0 )+ρ λ L bλ (T M )=ε λ L bλ (T 0 )+(1-α λ )L bλ (T M )

[0063] The first part is the spectral radiation of the object target surface, and the second part is the spectral radiation of the object target reflecting the environment. T0 is the surface temperature of the object being measured, TM is the ambient temperature, ε λ is the target surface emissivity, ρ λ is the target surface reflectivity, α λ is the absorption rate of the target surface to the environment, L bλ It is the maximum value of infrared radiation brightness of the target object.

[0064] The radiation acting on the infrared thermal imaging scanning module is:

[0065] M λ =A 0 d -2 [τ αλ ε λ L bλ (T 0 )+ε αλ (1-α λ )L bλ (T M )+ε α λL bλ (T α )]

[0066] In the formula, A 0is the visible area of ​​the target corresponding to the minimum spatial angle of the thermal imager, d is the distance between the target and the measuring instrument, T a is the atmospheric temperature. Usually under certain conditions, A 0 d -2 is a constant value, τ αλ is the spectral transmittance of the atmosphere, ε αλ is the atmospheric emissivity.

[0067] The radiation power of a certain wavelength incident on the infrared thermal imaging scanning module detector is:

[0068] P λ =M λ +A R

[0069] In the formula, A R is the area of ​​the thermal imager lens.

[0070] Infrared thermal imaging scanning modules usually work in two bands: 2-5um or 8-13um. The incident radiation energy is integrated in the detector working band and converted into an electrical signal proportional to the energy. The conversion formula of infrared radiation power and voltage signal is:

[0071] V s =A R ∫ Δλ M λ ηdλ

[0072] Where η is the spectral responsivity of the detector

[0073] The infrared waves of different wavelengths are converted into electrical signals in the heat treatment module through the above formula.

[0074] According to the infrared thermal imaging scanning module and thermal intelligent processing, the infrared light wave is converted into visible light and the digital image processing is started.

[0075] S2 starts the 3D laser imaging function and obtains 3D imaging processing data;

[0076] Determine the infrared light wave band range. The infrared thermal imaging scanning module determines the infrared wave band range and different light wave band ranges in the external space. It is used to enable 3D laser imaging. The wavelength value of the 3D laser scanning monochromatic light band is set according to the material of the product being tested. The wavelength value is optional in the range of 200nm to 1550nm.

[0077] Laser scanning and signal acquisition of the product under test: light pattern stripes or grids can be selected to be transmitted to the surface of the product under test through the seed frequency synthesis laser, laser modulation drive hardware and laser transmission module, and then the deformation of the light pattern on the surface of the product under test is captured using the laser receiving module, temperature compensation and signal receiving processing and transimpedance frequency selective filter amplifier hardware channels. The ranging observation value S is obtained by the pulse ranging method, and the precision clock controls the encoder to synchronously measure the lateral scanning angle observation value α and the longitudinal scanning angle observation value θ of each laser pulse. The laser scanning measurement uses the internal coordinate system Pi, with the X-axis in the lateral scanning plane, the Y-axis perpendicular to the X-axis in the lateral scanning plane, and the Z-axis perpendicular to the lateral scanning plane. See Appendix Figure 4 As shown, the calculation formula of the three-dimensional laser foot point P coordinate (XS, YS, ZS) is as follows:

[0078]

[0079] The 3D imaging processing module calculates the X, Y, and Z three-dimensional coordinate information of the object surface by analyzing the deformed light pattern. After obtaining the three-dimensional coordinate information, 3D data imaging processing is performed. The three-dimensional shape of the object surface is determined by projecting a sinusoidal laser onto the surface of the object and detecting the phase change of the reflected light. The laser pulse or light wave is emitted to the surface of the product being measured, and its return time is measured at the same time. The distance from the object to the scanner is determined by measuring the flight time of the light, and the geometric size and shape of the object are calculated. The 3D imaging processing module performs 3D imaging processing and data storage on the calculated three-dimensional coordinate data.

[0080] S3 stores data to form a point cloud as basic data, which is the coordinate information, reflectivity information and texture information of the target object. The point cloud is mainly processed by color, point and line feature extraction and volume feature extraction. By converting the infrared thermal imaging electrical signal into a color visual line, the intelligent central processing module fits the data processed by the 3D imaging processing module and the thermal imaging processing module, and performs noise reduction processing at the same time, so that the deviation between the fitting result and the actual measured product is much smaller than the range noise, and further forms a 3D distribution image of the actual measured product with a temperature field of infrared radiation, which can achieve an accuracy level of one thousandth. The temperature field data of the measured product can be clearly displayed in the 3D actual measured product imaging model, and the actual operation physical morphology data of the measured product is monitored in real time.

[0081] The intelligent central processing unit focuses on analyzing and monitoring the temperature data and physical morphology data above the 95% probability maximum value of the temperature field data, and stores the data every 1ms operation cycle, and accurately records the stored data according to absolute time. The physical morphology data recorded in the first 10ms is used as the baseline data, and the temperature data recorded in the first 10ms is used as the initial data. The intelligent central processing unit pre-stores the maximum temperature warning value of each key part of the tested product, the temperature change value per unit time, the physical morphology including the minimum electrical clearance warning value of each key part, the minimum creepage distance warning value, the spatial structure design warning value, the change value of the electrical clearance and creepage distance per unit time and other data.

[0082] The intelligent central processing unit will compare and analyze the physical form data of the actual tested product in the 3D temperature field with infrared radiation in real time. On the one hand, it will compare and analyze with the initial value, and on the other hand, it will compare and analyze with various pre-stored warning values. Once the change value and warning value are exceeded for three consecutive times, the intelligent central processing module will store this part of the data separately and give the nearest alarm processing. At the same time, it will send a warning signal to the wireless data transmission module, and give the warning level and expected development trend according to the size of the data change rate. The intelligent central processing module can monitor the operating status of the tested electrical products in real time, accurately analyze the operating data of electrical equipment, and discover safety hazards in time. The intelligent central processing module adopts advanced digital-to-analog conversion technology and intelligent analysis algorithms, and the detection accuracy can reach one thousandth level. It can quickly detect the safety performance of electrical equipment and improve detection efficiency. The intelligent central processing module can automatically adjust the detection prediction strategy based on historical data and real-time data to achieve intelligent detection.

[0083] The intelligent display and alarm module displays and alarms the data processed by the intelligent central processing module. The display mainly presents a 3D high-definition image of the actual temperature field of the measured product. It not only displays the 3D imaging original image of the monitoring position of the measured product, but also displays the temperature field data of the monitoring position of the measured product on the 3D imaging original image. It truly and accurately displays the temperature field and temperature data value of each precise position of the measured product. The intelligent display and alarm modules are integrated. After the alarm signal appears, the intelligent display is divided into local display and remote display.

[0084] The above descriptions are merely embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A digital-analog intelligent device for detecting electrical safety, characterized in that: It includes a thermal imaging scanning module, a thermal imaging processing module, a 3D laser scanning module, a 3D imaging processing module, an intelligent central processing module, a physical deformation algorithm unit, a data storage module, an intelligent alarm module and an intelligent display module. The intelligent central processing module is connected to the signal output end of the thermal imaging processing module and the signal output end of the 3D imaging processing module. The intelligent central processing module is connected to the physical deformation algorithm unit. The intelligent central processing module is also connected to the data storage module, the intelligent alarm module and the intelligent display module. The input end of the thermal imaging processing module is connected to the thermal imaging scanning module, and the input end of the 3D imaging processing module is connected to the 3D laser scanning module.

2. The digital-analog intelligent device for detecting electrical safety according to claim 1, characterized in that: An infrared thermal imaging optical system is arranged between the thermal imaging scanning module and the product under test. The thermal imaging scanning module absorbs infrared thermal radiation from the product under test and the environment through the infrared thermal imaging optical system, and the infrared thermal radiation is converted into a digital signal through the thermal imaging scanning. The thermal imaging processing module is connected to the thermal imaging scanning module and receives the digital signal obtained by the thermal imaging scanning module. The thermal imaging processing module processes the infrared band in the blind spot of human vision into visible light, and further forms a visual image and a large amount of structural data based on a mathematical model. According to the different thermal contrasts generated by the different emissivities between various wavelengths, the processed images and data are mapped according to the thermal contrast, thereby retaining the temperature field distribution image and structural data with infrared radiation.

3. The digital-analog intelligent device for detecting electrical safety according to claim 2, characterized in that: The infrared thermal imaging optical system comprises a lens, a grating and a detector, which are arranged in sequence along the direction of the product to be tested toward the thermal imaging scanning module.

4. The digital-analog intelligent device for detecting electrical safety according to claim 1, characterized in that: The 3D laser scanning module uses a laser wavelength outside the infrared wavelength range as the wavelength of the electromagnetic wave carried by the 3D laser scanning, emits it to the surface of the product to be measured, and then captures the deformed light pattern on the surface of the product to be measured; the 3D imaging processing module calculates the X, Y, and Z three-dimensional coordinate information of the object surface by analyzing the deformed light pattern, and determines the three-dimensional shape of the object surface by projecting a sinusoidal laser onto the surface of the object and detecting the phase change of the reflected light. The laser pulse or light wave is emitted to the surface of the product to be measured, and its return time is measured at the same time. The distance from the object to the scanner is determined by measuring the flight time of the light, and the geometric size and shape of the object are calculated. The measurement is fast and has high accuracy. The 3D imaging processing module performs 3D imaging processing and data storage on the calculated three-dimensional coordinate data.

5. The digital-analog intelligent device for detecting electrical safety according to claim 4, characterized in that: The 3D laser scanning module includes a seed frequency synthesis laser beam, laser modulation driving hardware, a laser emitting module, a laser receiving module, temperature compensation and signal receiving processing, and a trans-impedance frequency selective filter amplifier. The laser emitting module and the laser receiving module are arranged at corresponding positions outside the measured product at intervals. The laser beam emitted by the laser emitting module is reflected by the measured product and then acquired by the laser receiving module. The laser emitting module is connected to the laser modulation driving hardware, the seed frequency synthesis laser beam and the 3D imaging processing module in sequence, and the laser receiving module is connected to the temperature compensation and signal receiving processing, the trans-impedance frequency selective filter amplifier and the 3D imaging processing module in sequence.

6. The digital-analog intelligent device for detecting electrical safety according to claim 1, characterized in that: The intelligent central processing module fits the data processed by the 3D imaging processing module and the thermal imaging processing module, performs noise reduction processing, and further forms a 3D distribution image of the actual measured product in the temperature field with infrared radiation, and performs real-time data monitoring of the actual operating physical form of the measured product; the physical deformation algorithm unit compares and analyzes the 3D actual measured product physical form data of the temperature field with infrared radiation in real time, on the one hand, compares and analyzes it with the initial value, and on the other hand, compares and analyzes it with various pre-stored warning values. Once the change value and warning value are exceeded for multiple consecutive times, the intelligent central processing module will store this part of the data separately, give alarm processing, and give a warning level and expected development trend according to the size of the data change rate.

7. The digital-analog intelligent device for detecting electrical safety according to claim 6, characterized in that: The physical form data include the minimum warning value of the electrical clearance at each key part, the minimum warning value of the creepage distance, the warning value of the spatial structure design, and the change value of the electrical clearance and creepage distance per unit time.

8. The digital-analog intelligent device for detecting electrical safety according to claim 6, characterized in that: The alarm processing includes sending a warning signal by the intelligent alarm module close to the tested product, and sending a warning signal to the remote intelligent alarm module through the wireless data transmission module.

9. A digital-analog intelligent method for detecting electrical safety, characterized in that: The specific steps include: After S1 is initialized, the thermal imaging function is enabled. The infrared thermal imaging scanning module absorbs the infrared thermal radiation of the product under test and the environment through the optical system of the infrared thermal imaging and converts it into a digital signal. After the infrared thermal imaging scanning module and thermal intelligence processing, the infrared light wave is converted into visible light and the digital image processing is started to obtain the thermal imaging data of the product under test. S2 determines the infrared wave band range and the different light wave band ranges in the external space according to the infrared thermal imaging scanning module, which is used to enable 3D laser imaging; the 3D laser scanning module performs laser scanning on the product under test, and then captures the deformed light pattern on the surface of the product under test, and the 3D imaging processing module performs 3D data imaging processing by analyzing the deformed light pattern, and stores the calculated 3D data imaging processing data; The S3 intelligent central processing module fits the data processed by the 3D imaging processing module and the thermal imaging processing module, and performs noise reduction at the same time, so that the fitting results can be displayed, presenting a 3D high-definition image of the actual temperature field of the tested product, and monitoring the operating status of the tested electrical product in real time; The S4 intelligent central processing unit will compare and analyze the physical form data of the actual tested product in the 3D temperature field with infrared radiation in real time. On the one hand, it will compare and analyze it with the initial value, and on the other hand, it will compare and analyze it with various pre-stored warning values. Once the change value and warning value are exceeded three times in a row, the intelligent central processing module will store this part of the data separately and give nearby alarm processing. At the same time, it will send a warning signal to the wireless data transmission module, and give a warning level and expected development trend according to the size of the data change rate.

10. The digital-analog intelligent method for detecting electrical safety according to claim 9, characterized in that: The 3D laser scanning module in step S2 selects lasers of different wavelengths except for the wavelength range of 0.78 to 1000 um, selects light mode stripes or grids to be transmitted to the surface of the product under test through the seed frequency synthesis laser, laser modulation drive hardware and laser transmission module, and then uses the laser receiving module, temperature compensation and signal receiving processing and transimpedance frequency selective filter amplifier hardware channel to capture the deformation of the light mode on the surface of the product under test; The ranging observation value S is obtained by the pulse ranging method, and the precision clock controls the encoder to synchronously measure the horizontal scanning angle observation value α and the vertical scanning angle observation value θ of each laser pulse; the laser scanning measurement uses the internal coordinate system Pi, the X-axis is in the horizontal scanning plane, the Y-axis is perpendicular to the X-axis in the horizontal scanning plane, and the Z-axis is perpendicular to the horizontal scanning plane; The calculation formula for the three-dimensional laser foot point P coordinates (XS, YS, ZS) is as follows: The 3D imaging processing module calculates the X, Y, and Z three-dimensional coordinate information of the object surface by analyzing the deformed light pattern. After obtaining the three-dimensional coordinate information, 3D data imaging processing is performed. The three-dimensional shape of the object surface is determined by projecting a sinusoidal laser onto the object surface and detecting the phase change of the reflected light. The laser pulse or light wave is emitted to the surface of the product being measured, and its return time is measured at the same time. The distance from the object to the scanner is determined by measuring the flight time of the light, and the geometric size and shape of the object are calculated.

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