Device and method for testing waterproof performance of heat-conducting pouring sealant

Abstract

The invention relates to the technical field of pouring sealants, in particular to a device and a method for testing the waterproof performance of a heat-conducting pouring sealant. The upper end of the leakage cylinder is open, a pressing plate assembly is arranged in the leakage cylinder, the outer wall face of the pressing plate assembly abuts against the inner wall face of the leakage cylinder, damp-proof beads are arranged between the pressing plate assembly and the leakage cylinder, a cover plate is arranged at the upper end of the leakage cylinder, the leakage cylinder is sleeved with an installation cylinder, and the outer wall face of the cover plate abuts against the inner wall face of the installation cylinder. The inner wall face of the cover plate abuts against the outer wall face of the leakage cylinder, the cover plate is matched with the leakage cylinder and the installation cylinder in a sealed mode, a plurality of glue leakage holes are formed in the leakage cylinder, the pressing plate assembly and the cover plate, and the diameter of the glue leakage holes is smaller than that of the damp-proof beads. According to the technical scheme, the problem of how to test the moisture-proof and waterproof performance of the pouring sealant is solved.

Description

Technical Field

[0001] The invention relates to the technical field of potting glue, in particular to a device and method for testing the waterproof performance of a thermally conductive potting glue. Background Art

[0002] In the field of power electronic equipment, due to the changing application environment, potting glue is widely used because of its insulation, heat dissipation, waterproof and other properties. However, due to the differences in the process levels of various potting glue manufacturers, the prepared potting glue also has different waterproof and moisture-proof properties during the potting period. In harsh environments, when power equipment manufacturers select potting glue with poor waterproof and moisture-proof properties to fill the potted equipment, the equipment will be at risk of failure.

[0003] Therefore, how to design a testing device and a testing method for the moisture-proof and waterproof performance of a potting compound to evaluate the moisture-proof and waterproof performance of the potting compound is a problem that needs to be solved urgently by those skilled in the art. Summary of the invention

[0004] In order to solve the problems in the related art, the present invention provides a device and method for testing the waterproof performance of a thermally conductive potting glue, which solves the problem of how to test the moisture-proof and waterproof performance of the potting glue.

[0005] In order to solve the above problems, the following technical solutions are provided:

[0006] A device for testing the waterproof performance of thermally conductive potting glue of the present invention comprises a leaking tube, the upper end portion of the leaking tube is open, a pressure plate assembly is arranged inside the leaking tube, the outer wall surface of the pressure plate assembly abuts against the inner wall surface of the leaking tube, and moisture-proof beads are arranged between the pressure plate assembly and the leaking tube; a cover plate is arranged at the upper end portion of the leaking tube, an installation tube is connected to the outer sleeve of the leaking tube, the outer wall surface of the cover plate abuts against the inner wall surface of the installation tube, the inner wall surface of the cover plate abuts against the outer wall surface of the leaking tube, and the cover plate is in sealing cooperation with the leaking tube and the installation tube; a plurality of glue leakage holes are opened on the leaking tube, the pressure plate assembly and the cover plate, and the diameter of the glue leakage holes is smaller than the diameter of the moisture-proof beads.

[0007] In the above scheme, by setting the moisture-proof beads and utilizing the principle that the moisture-proof beads change color when exposed to water, it is convenient to intuitively judge whether the potting glue has moisture-proof and waterproof properties. The potting glue is filled in the inner cavity of the entire device, and after curing, it is placed in water and left to stand for a period of time. The moisture-proof beads are taken out and observed to see whether the moisture-proof beads change color, and then the judgment can be made.

[0008] The cover plate includes a central circular plate and an annular plate. The inner wall surface of the annular plate abuts against the outer wall surface of the central circular plate, and the upper end surface of the annular plate is higher than the upper end surface of the central circular plate. The annular plate is fixedly connected to the central circular plate. A vertical rod is arranged in the middle of the central circular plate, and the glue leakage hole is located on the central circular plate.

[0009] In the above scheme, by setting the cover plate, the upper end surface of the annular plate is higher than the upper end surface of the central circular plate, forming a concave groove for controlling the amount of potting glue, which is beneficial to prevent the potting glue from overflowing.

[0010] The upper end of the outer wall of the leakage tube is provided with a first external thread, and the inner wall of the annular plate is provided with a first internal thread adapted to the first external thread; the upper end of the inner wall of the mounting tube is provided with a second internal thread, and the outer wall of the annular plate is provided with a second external thread adapted to the second internal thread.

[0011] By adopting the above scheme, the moisture-proof beads are placed in the leakage tube, and the first external thread of the leakage tube cooperates with the first internal thread of the annular plate to realize the connection between the leakage tube and the cover plate, and the second internal thread of the installation tube cooperates with the second external thread of the annular plate to realize the connection between the installation tube and the cover plate.

[0012] The shape of the vertical rod is a hexagonal prism, and a cross groove is provided on the upper end surface of the vertical rod.

[0013] In the above scheme, by setting the vertical pole, a cross groove is opened on the top of the vertical pole to facilitate the removal of the cover plate.

[0014] The pressure plate assembly is provided with a vertically arranged support rod, the support rod is located in the middle of the pressure plate assembly, and the support rod is fixedly connected to the pressure plate assembly. The upper end of the support rod is provided with a third external thread, the vertical rod is hollow, and the inner wall surface of the vertical rod is provided with a third internal thread that matches the third external thread.

[0015] In the above scheme, by setting the support rod, the third external thread of the support rod cooperates with the third internal thread of the vertical rod, so as to complete the connection between the pressure plate assembly and the cover plate.

[0016] The materials of the drain cylinder, the pressing plate assembly, the cover plate and the mounting cylinder are all plastic.

[0017] The materials of the drain cylinder, the pressure plate assembly, the cover plate and the installation cylinder are all metal materials.

[0018] A method for testing a device for testing the waterproof performance of a thermally conductive potting adhesive comprises the following steps:

[0019] S1: The potting glue to be tested enters from the glue leakage hole of the cover plate, and then passes through the pressure plate assembly and the glue leakage hole of the leakage tube into the inner cavity of the installation tube in sequence, until the potting glue fills the entire inner cavity and submerges the cover plate. After the potting glue is cured, the assembly of the test device is completed;

[0020] S2: Place the filled test assembly in water and let it stand for 30 minutes, then take out the test assembly and dry it;

[0021] S3: Unscrew the cover, disassemble the test device, and observe whether the moisture-proof beads change color;

[0022] S4: If the moisture-proof beads change color, it is determined that the potting glue has failed the moisture-proof and waterproof tests; if the moisture-proof beads do not change color, it is determined that the potting glue has passed the moisture-proof and waterproof tests.

[0023] By adopting the above scheme, the operation steps are simple, the waterproof performance of the potting glue can be accurately measured, and the method is convenient and quick. Moreover, the cost of testing by this method is low.

[0024] The above solution has the following advantages:

[0025] 1. A thermal conductive potting glue waterproof performance testing device according to the present invention comprises a leaking cylinder, the upper end of the leaking cylinder is open, a pressure plate assembly is arranged in the leaking cylinder, the outer wall surface of the pressure plate assembly abuts against the inner wall surface of the leaking cylinder, and moisture-proof beads are arranged between the pressure plate assembly and the leaking cylinder; a cover plate is arranged at the upper end of the leaking cylinder, and an installation cylinder is connected to the outer sleeve of the leaking cylinder, the outer wall surface of the cover plate abuts against the inner wall surface of the installation cylinder, and the inner wall surface of the cover plate abuts against the outer wall surface of the leaking cylinder, and the cover plate is sealed with the leaking cylinder and the installation cylinder; a plurality of glue leakage holes are provided on the leaking cylinder, the pressure plate assembly and the cover plate, and the diameter of the glue leakage holes is smaller than the diameter of the moisture-proof beads. Through the arrangement of the moisture-proof beads and the principle that the moisture-proof beads change color when encountering water, it is convenient to intuitively judge whether the potting glue has moisture-proof and waterproof performance. The judgment can be made by filling the inner cavity of the entire device with the potting glue, curing it, putting it in water and letting it stand for a period of time, taking out the moisture-proof beads and observing whether the moisture-proof beads change color.

[0026] 2. The upper end surface of the annular plate is higher than the upper end surface of the central circular plate, forming a concave groove, which is used to control the amount of potting glue, which is beneficial to prevent the potting glue from overflowing; through the setting of the vertical pole, a cross groove is opened at the top of the vertical pole to facilitate the disassembly of the cover plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to make the content of the present invention more clearly understood, the present invention is further described in detail below according to specific embodiments of the present invention in conjunction with the accompanying drawings, wherein:

[0028] Figure 1 It is a structural schematic diagram of a thermal conductive potting glue waterproof performance testing device;

[0029] Figure 2 A cross-sectional view of a device for testing the waterproof performance of a thermally conductive potting adhesive;

[0030] Figure 3 This is an exploded view of a thermal conductive potting glue waterproof performance test device;

[0031] Figure 4 An exploded view of a thermal conductive potting adhesive waterproof performance test device from another perspective;

[0032] Figure 5 It is a flow chart of a method for testing the waterproof performance of thermal conductive potting glue;

[0033] Explanation of the reference numerals in the accompanying drawings: 1. leakage cylinder; 2. pressure plate assembly; 3. moisture-proof beads; 4. cover plate; 41. center circular plate; 42. annular plate; 43. vertical pole; 5. mounting cylinder; 6. glue leakage hole; 7. first external thread; 8. first internal thread; 9. second internal thread; 10. second external thread; 11. cross groove; 12. support rod; 13. third external thread; 14. third internal thread. DETAILED DESCRIPTION

[0034] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0035] In specific embodiment 1, Figures 1 to 4 As shown, a thermal conductive potting glue waterproof performance testing device of the present invention comprises a drain tube 1, the upper end of the drain tube 1 is open, a pressure plate assembly 2 is arranged in the drain tube 1, the outer wall surface of the pressure plate assembly 2 is against the inner wall surface of the drain tube 1, and a moisture-proof bead 3 is arranged between the pressure plate assembly 2 and the drain tube 1; a cover plate 4 is arranged at the upper end of the drain tube 1, a mounting tube 5 is connected to the outer sleeve of the drain tube 1, a gap is arranged between the drain tube 1 and the mounting tube 5, the outer wall surface of the cover plate 4 is against the inner wall surface of the mounting tube 5, the inner wall surface of the cover plate 4 is against the outer wall surface of the drain tube 1, and the cover plate 4 is in contact with the drain tube 1 and the mounting tube 5 are all in a sealed fit; a plurality of glue leakage holes 6 are opened on the leakage cylinder 1, the pressure plate assembly 2 and the cover plate 4, the diameter of the glue leakage hole 6 is smaller than the diameter of the moisture-proof bead 3, and the moisture-proof bead 3 changes color when it comes into contact with water. By filling the inner cavity of the entire device with potting glue, and after curing, putting it in water and letting it stand for a period of time, and observing whether the moisture-proof bead 3 changes color, it can be intuitively judged whether the potting glue has moisture-proof and waterproof properties. The operation steps of the present invention are simple, and the waterproof performance of the potting glue can be accurately measured. It is convenient and quick, and the cost of testing by this method is low.

[0036] like Figure 3As shown, a vertically arranged support rod 12 is provided on the pressure plate assembly 2, the support rod 12 is located in the middle of the pressure plate assembly 2, and the support rod 12 is fixedly connected to the pressure plate assembly 2; the cover plate 4 contains a central circular plate 41 and an annular plate 42, the inner wall surface of the annular plate 42 is against the outer wall surface of the central circular plate 41, and the upper end surface of the annular plate 42 is higher than the upper end surface of the central circular plate 41, forming a concave groove for controlling the amount of potting glue, which is beneficial to prevent the potting glue from overflowing, the annular plate 42 is fixedly connected to the central circular plate 41, a vertical rod 43 is fixed in the middle of the central circular plate 41, and the glue leakage hole 6 is located on the central circular plate 41.

[0037] like Figure 4 As shown, the upper end of the support rod 12 is provided with a third external thread 13, the vertical rod 43 is hollow, and the inner wall surface of the vertical rod 43 is provided with a third internal thread 14 matched with the third external thread 13. The third external thread 13 of the support rod 12 cooperates with the third internal thread 14 of the vertical rod 43 to complete the connection between the pressure plate assembly 2 and the cover plate 4; the upper end of the outer wall surface of the drain tube 1 is provided with a first external thread 7, and the inner wall surface of the annular plate 42 is provided with a first internal thread 8 matched with the first external thread 7; the upper end of the inner wall surface of the mounting tube 5 is provided with a second internal thread 9, and the outer wall surface of the annular plate 42 is provided with a second external thread 10 matched with the second internal thread 9. The connection between the drain tube 1 and the cover plate 4 is realized by the cooperation of the first external thread 7 of the drain tube 1 and the first internal thread 8 of the annular plate 42, and the connection between the mounting tube 5 and the cover plate 4 is realized by the cooperation of the second internal thread 9 of the mounting tube 5 and the second external thread 10 of the annular plate 42.

[0038] like Figure 5 As shown, a method for testing a thermally conductive potting adhesive waterproof performance testing device comprises the following steps:

[0039] S1: The potting glue to be tested enters from the glue leakage hole 6 of the cover plate 4, and then passes through the pressure plate assembly 2 and the glue leakage hole 6 of the leakage tube 1 into the inner cavity of the installation tube 5, until the potting glue fills the entire inner cavity and submerges the cover plate 4. After the potting glue is solidified, the assembly of the test device is completed;

[0040] S2: Place the filled test assembly in water and let it stand for 30 minutes, then take out the test assembly and dry it;

[0041] S3: Unscrew the cover plate 4, disassemble the test device, and observe whether the moisture-proof beads 3 change color;

[0042] S4: If the moisture-proof beads 3 change color, it is determined that the potting glue has failed the moisture-proof and waterproof tests; if the moisture-proof beads 3 do not change color, it is determined that the potting glue has passed the moisture-proof and waterproof tests.

[0043] In specific embodiment 2, Figure 1 , Figure 3As shown, the difference between this embodiment and embodiment 1 is that the shape of the vertical rod 43 in this embodiment is a hexagonal prism, and a cross groove 11 is formed on the upper end surface of the vertical rod 43 to facilitate the disassembly of the cover plate 4.

[0044] In the specific embodiment 3, the difference between this embodiment and embodiments 1 and 2 is that the material of the drain tube 1, the pressure plate assembly 2, the cover plate 4 and the installation tube 5 in this embodiment can be either plastic or metal.

[0045] In the specific embodiment 4, the difference between this embodiment and embodiment 1 is that the moisture-proof beads 3 in this embodiment can be replaced by color-changing silica gel or color-changing test paper.

[0046] In the specific embodiment 5, the difference between this embodiment and embodiment 1 is that the moisture-proof beads 3 in this embodiment can be replaced by a humidity sensor or an LED light that is extinguished when it comes into contact with water. The moisture-proof and waterproof performance of the potting glue can be judged by performing humidity detection through the humidity sensor or using the characteristic that the LED light is extinguished when it comes into contact with water.

[0047] The assembly process of the test device is as follows: first, put the moisture-proof beads 3 into the drain tube 1, and complete the connection between the pressure plate assembly 2 and the cover plate 4 by matching the third external thread 13 of the support rod 12 with the third internal thread 14 of the vertical rod 43, and then match the first external thread 7 of the drain tube 1 with the first internal thread 8 of the annular plate 42 to achieve the connection between the drain tube 1 and the cover plate 4, and match the second internal thread 9 of the installation tube 5 with the second external thread 10 of the annular plate 42 to achieve the connection between the installation tube 5 and the cover plate 4; finally, let the potting glue to be tested enter from the glue leakage hole 6 of the cover plate 4, and the potting glue enters the inner cavity of the installation tube 5 through the pressure plate assembly 2 and the glue leakage hole 6 of the drain tube 1 in turn, until the potting glue fills the entire inner cavity and submerges the cover plate 4, and after the potting glue is cured, the assembly of the test device can be completed;

[0048] The test method is to place the filled test component in water and let it stand, take out the test device for drying, unscrew the cover plate 4 after drying, disassemble the test device, and observe whether the moisture-proof beads 3 change color. If the moisture-proof beads 3 change color, it is determined that the potting glue moisture-proof and waterproof tests have failed; if the moisture-proof beads 3 do not change color, it is determined that the potting glue moisture-proof and waterproof tests have passed.

[0049] In the description of the present invention, it should be understood that the terms "longitudinal", "lateral", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In the description of the present invention, unless otherwise specified and limited, it should be noted that the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it can be a mechanical connection or an electrical connection, or it can be the internal communication of two elements, it can be a direct connection, or it can be an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.

[0050] Obviously, the above embodiments are merely examples for clear explanation and are not limitations on the implementation methods. For ordinary technicians in the relevant field, other different forms of changes or modifications can be made on the basis of the above description. It is not necessary and impossible to list all the implementation methods here, and the obvious changes or modifications derived therefrom are still within the protection scope of the invention.

Claims

1. A thermal conductive potting glue waterproof performance testing device, characterized in that: The invention comprises a drain tube (1), the upper end of the drain tube (1) is open, a pressure plate assembly (2) is arranged inside the drain tube (1), the outer wall surface of the pressure plate assembly (2) abuts against the inner wall surface of the drain tube (1), and moisture-proof beads (3) are arranged between the pressure plate assembly (2) and the drain tube (1); a cover plate (4) is arranged at the upper end of the drain tube (1), the outer sleeve of the drain tube (1) is connected with a mounting tube (5), the outer wall surface of the cover plate (4) abuts against the inner wall surface of the mounting tube (5), the inner wall surface of the cover plate (4) abuts against the outer wall surface of the drain tube (1), and the cover plate (4) is in sealing cooperation with the drain tube (1) and the mounting tube (5); a plurality of glue leakage holes (6) are opened on the drain tube (1), the pressure plate assembly (2) and the cover plate (4), and the diameter of the glue leakage hole (6) is smaller than the diameter of the moisture-proof beads (3).

2. A thermal conductive potting glue waterproof performance testing device as claimed in claim 1, characterized in that: The cover plate (4) comprises a central circular plate (41) and an annular plate (42); the inner wall surface of the annular plate (42) abuts against the outer wall surface of the central circular plate (41), and the upper end surface of the annular plate (42) is higher than the upper end surface of the central circular plate (41); the annular plate (42) is fixedly connected to the central circular plate (41); a vertical rod (43) is fixed in the middle of the central circular plate (41); and the glue leakage hole (6) is located on the central circular plate (41).

3. A thermal conductive potting glue waterproof performance testing device as claimed in claim 2, characterized in that: The upper end of the outer wall surface of the leakage tube (1) is provided with a first external thread (7), and the inner wall surface of the annular plate (42) is provided with a first internal thread (8) adapted to the first external thread (7); the upper end of the inner wall surface of the installation tube (5) is provided with a second internal thread (9), and the outer wall surface of the annular plate (42) is provided with a second external thread (10) adapted to the second internal thread (9).

4. A thermal conductive potting glue waterproof performance testing device as claimed in claim 2, characterized in that: The vertical rod (43) is in the shape of a hexagonal prism, and a cross groove (11) is provided on the upper end surface of the vertical rod (43).

5. A thermal conductive potting glue waterproof performance testing device as claimed in claim 2, characterized in that: The pressure plate assembly (2) is provided with a vertically arranged support rod (12), the support rod (12) is located in the middle of the pressure plate assembly (2), and the support rod (12) is fixedly connected to the pressure plate assembly (2), the upper end of the support rod (12) is provided with a third external thread (13), the vertical rod (43) is hollow, and the inner wall surface of the vertical rod (43) is provided with a third internal thread (14) that is compatible with the third external thread (13).

6. A thermal conductive potting glue waterproof performance testing device as claimed in claim 1, characterized in that: The material of the drain cylinder (1), the pressure plate assembly (2), the cover plate (4) and the installation cylinder (5) are all plastic.

7. A thermal conductive potting glue waterproof performance testing device as claimed in claim 1, characterized in that: The drain tube (1), the pressure plate assembly (2), the cover plate (4) and the mounting tube (5) are all made of metal materials.

8. The method for testing the waterproof performance of a thermally conductive potting adhesive according to claim 1, characterized in that: The following steps are involved: S1: The potting glue to be tested enters from the glue leakage hole (6) of the cover plate (4), and then enters the inner cavity of the installation cylinder (5) through the pressure plate assembly (2) and the glue leakage hole (6) of the leakage cylinder (1) in sequence, until the potting glue fills the entire inner cavity and submerges the cover plate (4). After the potting glue is solidified, the assembly of the test device is completed; S2: Place the filled test assembly in water and let it stand for 30 minutes, then take out the test assembly and dry it; S3: Unscrew the cover plate (4), disassemble the test device, and observe whether the moisture-proof beads (3) change color; S4: If the moisture-proof bead (3) changes color, it is determined that the potting glue has failed the moisture-proof and waterproof test; if the moisture-proof bead (3) does not change color, it is determined that the potting glue has passed the moisture-proof and waterproof test.

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