Wafer bearing mechanism and wafer testing equipment

Abstract

The invention discloses a wafer bearing mechanism and wafer test equipment, and relates to the technical field of wafer test equipment, the wafer bearing mechanism comprises an objective table, a chuck and a plurality of adjusting assemblies; a mounting groove with an upward notch is formed in the objective table; the chuck is installed in the installation groove, a through hole is formed in the chuck, a plurality of supporting protrusions are arranged on the hole wall of the through hole at intervals in the circumferential direction of the through hole, the supporting protrusions are used for supporting wafers placed at the position of the through hole, and sliding plates are slidably connected to the positions, corresponding to the supporting protrusions, of the top of the chuck; the plurality of adjusting assemblies are arranged on the objective table at intervals around the mounting groove; the multiple adjusting assemblies are used for driving the corresponding sliding plates to slide relative to the chuck in the radial direction of the through hole until the sliding plates abut against or break away from the outer edge of the wafer, so that the multiple sliding plates are correspondingly matched to clamp or loosen the wafer. According to the wafer bearing mechanism, each PAD point on the bottom surface of the wafer can be exposed to facilitate detection, the detection integrity is improved, and the test effect is better.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer testing equipment, and in particular to a wafer carrying mechanism and wafer testing equipment. Background Art

[0002] The traditional structure of fixing the wafer generally adopts vacuum adsorption or end face pressure ring fixation, but because the double-sided wafer has PAD (pin pad) points on both sides, the structure needs to be hollowed out to facilitate the needle testing of the PAD points, so the wafer cannot be fixed by vacuum adsorption. The end face pressure ring fixation method requires the use of the end face of the pressure ring to press the wafer tightly. The thickness of the pressure ring will limit the needle penetration depth of the probe. At the same time, the area of ​​the pressure ring will block part of the effective use area of ​​the wafer. Therefore, the PAD points close to the edge of the wafer cannot be tested, which can easily lead to incomplete testing and poor test results. Summary of the invention

[0003] The main purpose of the present invention is to provide a wafer supporting mechanism and a wafer testing device, aiming to solve the technical problem that the traditional structure of fixing the wafer easily leads to poor testing effect.

[0004] To achieve the above object, the present invention provides a wafer carrying mechanism, comprising: A loading platform, wherein the loading platform is provided with a mounting slot with a notch facing upward; A chuck, the chuck is installed in the installation groove, the chuck is provided with a through hole, a hole wall of the through hole is provided with a plurality of support protrusions at intervals along its circumference, the plurality of support protrusions are used to support the wafer placed at the through hole, and a slide plate is slidably connected to the top of the chuck corresponding to the position of each support protrusion; A plurality of adjustment components are arranged on the worktable at intervals around the mounting groove, and are arranged in a one-to-one correspondence with the number of the slides; the plurality of adjustment components are used to drive the corresponding slides to slide relative to the chuck along the radial direction of the through hole until they abut against or disengage from the outer edge of the wafer, so that the plurality of slides cooperate to clamp or loosen the wafer.

[0005] In one embodiment, the top of the chuck is recessed downward to form a slide groove corresponding to the position of each slide plate, and the slide groove extends inward from the outer edge of the chuck along the radial direction of the through hole, and the bottom of each slide plate is provided with a slider that extends into the slide groove and slides with the slide groove; the adjustment component abuts or is connected to the slider of the corresponding slide plate to drive the corresponding slide plate to slide relative to the chuck along the radial direction.

[0006] In one embodiment, each of the slide grooves is provided with limiting blocks on opposite sides along the circumferential direction, and two first limiting surfaces are formed on the opposite sides of the two limiting blocks respectively, and the top of each limiting block extends toward the direction of the other limiting block to form a limiting arm, and the bottom of the limiting arm forms a second limiting surface, and the two first limiting surfaces are respectively slidably matched with the opposite sides of the slider along the circumferential direction, and the second limiting surface is slidably matched with the top of the slider.

[0007] In one embodiment, each of the slide plates is stacked with the corresponding slider, and each of the sliders is recessed downward along two opposite sides of the circumferential direction to form two limit steps, each of the limit arms extends into the corresponding limit step, and each of the second limit surfaces is slidably matched with the step surface of the corresponding limit step; The top surface of each of the limit arms and the top surface of each of the slide blocks are flush with the top surface of the chuck.

[0008] In one embodiment, each of the adjustment components includes an adjustment bolt, and a first screw hole connected to the mounting groove is opened on the side wall of the worktable corresponding to each of the adjustment bolts, and the adjustment bolt is threadedly connected to the corresponding first screw hole; by rotating the adjustment bolt, one end of the adjustment bolt can be extended into the mounting groove and abut against the corresponding slider, so as to drive the corresponding slider to slide relative to the chuck toward the through hole.

[0009] In one embodiment, each of the adjustment components further includes an elastic member, and one end of the elastic member abuts against a groove wall of the slide groove close to the through hole, and the other end of the elastic member abuts against the corresponding sliding block.

[0010] In one embodiment, the slide plate forms an arcuate abutting surface on one side facing the through hole, each of the arcuate abutting surfaces is recessed in a direction away from the through hole, and each of the arcuate abutting surfaces is inclined from top to bottom in a direction away from the through hole.

[0011] In one embodiment, a leveling position is formed on the chuck between any two adjacent slides, and a second screw hole is provided at each leveling position on the chuck, and a leveling member is threadedly connected to the second screw hole, and the leveling member is rotated to make the corresponding leveling position rise and fall relative to the stage, so as to cooperate with the leveling of the chuck; The leveling member is provided with connecting holes for the installation bolts to pass through, and the bottom of the installation groove is also provided with third screw holes corresponding to the positions of each of the connecting holes. The installation bolts can pass through the connecting holes and be threadedly connected with the third screw holes to fasten the chuck in the installation groove.

[0012] In one embodiment, at least two avoidance gaps are provided on the hole wall of the through hole at intervals along the circumferential direction, and the avoidance gaps avoid the supporting protrusions.

[0013] The present invention also provides a wafer testing device, comprising: frame; A motion mechanism, the motion mechanism is disposed on the frame and can move relative to the frame; The wafer carrying mechanism adopts the wafer carrying mechanism as described above, the stage is connected to the motion mechanism, and the motion mechanism can drive the wafer carrying mechanism to move relative to the frame; A testing mechanism is arranged on the frame and is used to test the wafer carried at the through hole.

[0014] The wafer supporting mechanism of the present invention has a through hole opened on the chuck and a plurality of supporting protrusions arranged on the hole wall of the through hole. The wafer is supported above the first through hole by the plurality of supporting protrusions. The plurality of supporting protrusions are arranged at intervals, which can not only realize balanced placement of the wafer, but also each supporting protrusion only contacts the edge of the bottom surface of the wafer, reducing the contact area, thereby making more exposed area of ​​the bottom surface of the wafer, ensuring that each PAD point on the bottom surface of the wafer can be exposed for easy detection, thereby improving detection efficiency and integrity, and achieving better test results.

[0015] In addition, by providing an installation groove on the stage and installing the chuck in the installation groove, it is beneficial to improve the stability of the chuck, and a slider is provided on the chuck at the position corresponding to each slide plate, and an adjustment component is provided on the stage, through which the slider can be driven to move in the direction of the through hole on the chuck, so that each slider abuts against the outer edge of the wafer, so that multiple sliders cooperate with each other to clamp the wafer from the edge, so that the wafer remains relatively stable during detection, improves the accuracy of detection, and does not block the PAD point on the wafer; the slider can also be driven by the adjustment component to move in the direction away from the through hole on the chuck, so that each slider is disengaged from the abutment with the outer edge of the wafer, so as to loosen the wafer and facilitate the removal of the wafer from the chuck after the detection is completed; and since the sliding distance of each slider is individually realized by the corresponding adjustment component 3, it can clamp wafers of different sizes, and has better adaptability and flexibility. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0017] Figure 1 A schematic structural diagram of a wafer carrying mechanism provided by an embodiment of the present invention; Figure 2 A schematic diagram of the structure of a stage in a wafer carrying mechanism provided by an embodiment of the present invention; Figure 3 A schematic front view of a chuck in a wafer carrying mechanism provided by an embodiment of the present invention; Figure 4 A schematic front view of a portion of the mechanism of a chuck in a wafer carrying mechanism provided by an embodiment of the present invention; Figure 5 A schematic diagram of the structure of a slide plate and a slider in a wafer carrying mechanism provided by an embodiment of the present invention; Figure 6 for Figure 5 A partial enlarged view of the middle A; Figure 7 A schematic cross-sectional view of a portion of the structure of a chuck in a wafer supporting mechanism provided in one embodiment of the present invention.

[0018] Description of Figure Numbers: 100, wafer bearing mechanism; 1, stage; 11, carrier plate; 111, mounting groove; 12, support plate; 2, chuck; 21, through hole; 22, support protrusion; 23, slide plate; 231, arc-shaped abutting surface; 24, slider; 241, limiting step; 242, guide hole; 25, slide groove; 251, limiting block; 252, first limiting surface; 253, limiting arm; 254, second limiting surface; 26, leveling member; 27, avoidance gap; 3, adjustment assembly; 31, adjustment bolt; 32, elastic member; 200. Wafer.

[0019] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0021] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indication will also change accordingly.

[0022] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of the features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or solutions that satisfy both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0023] The present invention provides a wafer carrying mechanism 100 .

[0024] See also Figure 1-Figure 3 In one embodiment of the present invention, the wafer carrying mechanism 100 includes a stage 1, a chuck 2 and a plurality of adjustment components 3; the stage 1 is provided with a mounting groove 111 with a notch facing upward; the chuck 2 is installed in the mounting groove 111, the chuck 2 is provided with a through hole 21, and the hole wall of the through hole 21 is provided with a plurality of support protrusions 22 at intervals along its circumference, the plurality of support protrusions 22 are used to support a wafer 200 placed at the through hole 21, and a slide plate 23 is slidably connected to the top of the chuck 2 corresponding to the position of each support protrusion 22; the plurality of adjustment components 3 are arranged at intervals on the stage 1 around the mounting groove 111, and are consistent with the number of the slide plates 23 and are arranged one by one; the plurality of adjustment components 3 are used to drive the corresponding slide plates 23 to slide relative to the chuck 2 along the radial direction of the through hole 21 until they abut against or disengage from the outer edge of the wafer 200, so that the plurality of slide plates 23 cooperate to clamp or loosen the wafer 200.

[0025] The wafer supporting mechanism 100 of the present invention has a through hole 21 opened on the chuck 2 and a plurality of supporting protrusions 22 arranged on the hole wall of the through hole 21. The wafer 200 is supported above the first through hole 21 by the plurality of supporting protrusions 22. The plurality of supporting protrusions 22 are arranged at intervals, which can not only realize the balanced placement of the wafer 200, but also each supporting protrusion 22 only contacts with the edge of the bottom surface of the wafer 200, reducing the contact area, thereby making the bottom surface of the wafer 200 more exposed, ensuring that each PAD point on the bottom surface of the wafer 200 can be exposed for detection, thereby improving the detection efficiency and integrity, and achieving better test results.

[0026] In addition, by providing an installation groove on the stage 1 and installing the chuck 2 in the installation groove, it is beneficial to improve the stability of the chuck 2, and a slider 24 is provided on the chuck 2 at the position corresponding to each slide plate 23, and an adjustment component 3 is provided on the stage 1, through which the slider 24 can be driven to move toward the through hole 21 on the chuck 2, so that each slider 24 abuts against the outer edge of the wafer 200, so that the multiple sliders 24 cooperate with each other to clamp the wafer 200, so that the wafer 200 remains relatively stable during detection, thereby improving the accuracy of the detection; through the adjustment component 3, the slider 24 can also be driven to move on the chuck 2 in a direction away from the through hole 21, so that each slider 24 is out of abutment with the outer edge of the wafer 200, so as to loosen the wafer 200 for the convenience of removing the wafer 200 from the chuck 2 after the detection is completed.

[0027] Furthermore, since the sliding distance of each slider 24 is independently realized by the corresponding adjustment component 3 , it is able to clamp wafers 200 of different sizes, and has better adaptability and flexibility.

[0028] Furthermore, since the wafer 200 is circular, the through hole 21 in this embodiment is also a circular through hole 21 .

[0029] In a specific embodiment, the supporting protrusion 22 and the chuck 2 are integrally formed.

[0030] Furthermore, in the present embodiment, four slide plates 23 and four supporting protrusions 22 are provided. The four supporting protrusions 22 are evenly spaced to form a stable supporting structure. The four slide plates 23 are evenly spaced to clamp the wafer more stably.

[0031] Furthermore, the stage 1 includes a support plate 12 and a carrier plate 11, and a through hole 21 is also opened at a position corresponding to the through hole 21 on the carrier plate 11; the carrier plate 11 is supported at a certain height by the support plate 12 to ensure that the carrier plate 11 is suspended, and a through hole 21 is also opened at a position corresponding to the through hole 21 on the carrier plate 11 to ensure that the bottom surface of the wafer 200 is exposed for easy testing.

[0032] Specifically, two support plates 12 are provided to support two opposite sides of the object carrier plate 11 respectively.

[0033] See also Figure 4 and Figure 5 In one embodiment, the top of the chuck 2 is recessed downward to form a slide groove 25 corresponding to the position of each slide plate 23. The slide groove 25 extends radially inward from the outer edge of the chuck 2 along the through hole 21. The bottom of each slide plate 23 is provided with a slider 24 that extends into the slide groove 25 and slidably cooperates with the slide groove 25; the adjustment component 3 abuts or is connected to the slider 24 of the corresponding slide plate 23 to drive the corresponding slide plate 23 to slide radially relative to the chuck 2.

[0034] It can be understood that by providing a slide groove 25 on the chuck 2, a slider 24 that slides with the slide groove 25 is provided at the bottom of the slide plate 23. The slider 24 can slide in the slide groove 25 to avoid position deviation of the slide plate 23, thereby achieving precise clamping of the wafer 200 with better reliability.

[0035] The adjusting component 3 abuts against the slider 24 to drive the slide plate 23 to move by pushing, and the adjusting component 3 is connected to the slider 24 so that the adjusting component 3 can also pull the slide plate 23 to move.

[0036] See also Figure 5 and Figure 6 In one embodiment, each slide groove 25 is provided with a limit block 251 on two opposite sides along the circumferential direction, and two first limit surfaces 252 are formed on the opposite sides of the two limit blocks 251, and the top of each limit block 251 extends toward the direction of the other limit block 251 to form a limit arm 253, and the bottom of the limit arm 253 forms a second limit surface 254. The two first limit surfaces 252 are respectively slidably matched with the opposite sides of the slider 24 along the circumferential direction, and the second limit surface 254 is slidably matched with the top of the slider 24.

[0037] In this embodiment, by setting limit blocks 251 on the opposite sides of the slide groove 25, the first limit surface 252 is formed on the opposite side of the limit block 251, and the opposite sides of the slider 24 are respectively slidably matched with the two first limit surfaces 252, so as to limit the slider 24 in the circumferential direction and prevent the slider 24 from deviating in the circumferential direction; in addition, a limit arm 253 is formed at the top of the limit block 251, and a second limit surface 254 is formed at the bottom of the limit arm 253, and the top of the slider 24 is slidably matched with the second limit surface 254, so as to limit the slider 24 in the vertical direction and prevent the slider 24 from falling out of the slide groove 25, thereby further improving the sliding accuracy and reliability of the slider 24.

[0038] In another embodiment, a slide rail may be provided at the bottom of the slide groove 25 , and the slider 24 is slidably connected to the corresponding slide rail.

[0039] In another embodiment, the limiting block 251 and the chuck 2 are integrally formed.

[0040] In one embodiment, each slide plate 23 is stacked with the corresponding slider 24, and each slider 24 is recessed downward on two opposite sides along the circumferential direction to form two limit steps 241, respectively. Each limit arm 253 extends into the corresponding limit step 241, and each second limit surface 254 is slidably matched with the step surface of the corresponding limit step 241.

[0041] In this embodiment, the slider 24 and the slide plate 23 are stacked, the contact area between the two is larger, and the structure is more stable. By setting two limit steps 241 on the slider 24, the limit arm 253 slides with the limit step 241 to accurately control the sliding direction of the slider 24.

[0042] Furthermore, the slide plate 23 and the slide block 24 are fastened and connected by bolts.

[0043] Furthermore, the top surface of each limiting arm 253 and the top surface of each slider 24 are flush with the top surface of the chuck 2. By setting the limiting arm 253, the slider 24 and the top surface of the chuck 2 flush with each other, the limiting block 251 slides on the top of the chuck 2, which can prevent the limiting block 251 from shaking, and it is also easy for the limiting block 251 to abut against the outer edge of the wafer 200.

[0044] Please continue reading Figure 1 In one embodiment, each adjustment component 3 includes an adjustment bolt 31, and a first screw hole connected to the mounting groove 111 is opened on the side wall of the worktable 1 corresponding to each adjustment bolt 31. The adjustment bolt 31 is threadedly connected to the corresponding first screw hole. By rotating the adjustment bolt 31, one end of the adjustment bolt 31 can be extended into the mounting groove 111 and abut against the corresponding slider 24, so as to drive the corresponding slide plate 23 to slide relative to the chuck 2 toward the through hole 21.

[0045] In this embodiment, the adjustment component 3 includes an adjusting bolt 31, and a first screw hole connected to the mounting groove 111 is opened on the stage 1. The adjusting bolt 31 is threadedly connected to the first screw hole. By rotating the adjusting bolt 31, the adjusting bolt 31 can be moved radially relative to the first screw hole, so that one end of the adjusting bolt 31 can extend into the mounting groove 111, thereby abutting against the corresponding slider 24, and when the adjusting bolt 31 continues to move toward the through hole 21, the corresponding slider 24 is pushed to slide toward the through hole 21 to abut against the outer edge of the wafer 200; and the slider 23 is pushed to move by the adjusting bolt 31, and the adjusting bolt 31 is rotated to achieve fine-tuning of the position of the slider 23, thereby preventing the slider 24 from damaging the wafer 200, and improving reliability.

[0046] In other embodiments, one end of the adjusting bolt 31 extending into the mounting groove 111 is connected to the slider 24. By rotating the adjusting bolt 31 to move away from the through hole 21, the slider 23 can be pulled to slide away from the through hole 21 to disengage from the contact with the wafer 200, thereby facilitating the removal of the wafer 200 from the chuck 2.

[0047] Please continue reading Figure 4 In one embodiment, each adjustment component 3 further includes an elastic member 32 , and one end of the elastic member 32 abuts against a side wall of the slide slot 25 close to the through hole 21 , and the other end of the elastic member 32 abuts against the corresponding slider 24 .

[0048] It can be understood that by setting the elastic member 32, the two ends of the elastic member 32 are respectively in contact with the groove wall and the slider 24. When the adjusting bolt 31 moves away from the through hole 21, the elastic restoring force of the elastic member 32 can drive the slider 24 to move away from the through hole 21, thereby realizing automatic resetting of the slider 24 to quickly release the wafer 200.

[0049] Furthermore, the elastic member 32 is a spring, and a guide column is provided on the side wall of each slide groove 25 close to the through hole 21. A guide hole 242 for the guide column to extend into is opened on the side of the slider 24 corresponding to the guide column. The spring is sleeved outside the guide column, and the opposite ends of the spring respectively abut the side wall of the slide groove 25 and the slider 24.

[0050] In this embodiment, a guide column is provided and a spring is sleeved outside the guide column. The guide column has a guiding function when the spring is compressed or elastically reset to prevent the spring from twisting and deflecting. The adjusting bolt 31 drives the clamp plate to slide toward the through hole 21 and presses the reset spring. When the adjusting bolt 31 moves away from the through hole 21, the elastic restoring force of the spring can drive the clamp plate to slide away from the through hole 21.

[0051] Please continue reading Figure 5 and Figure 7 In one embodiment, the slide plate 23 forms an arcuate abutting surface 231 on one side facing the through hole 21, each arcuate abutting surface 231 is recessed in a direction away from the through hole 21, and each arcuate abutting surface 231 is inclined from top to bottom in a direction away from the through hole 21.

[0052] In this embodiment, by setting the side of the slide plate 23 facing the through hole 21 to be arc-shaped, the arc shape can match the outer edge of the wafer 200, thereby increasing the contact area with the outer support of the wafer 200 and further improving the clamping stability; in addition, the arc-shaped contact surface 231 inclined outward from top to bottom generates a downward component force on the outer edge of the wafer 200 when clamping the wafer 200, thereby pushing the wafer 200 so that its outer edge is close to the bottom support protrusion 22, thereby effectively pressing the raised edge of the wafer 200 downward to ensure that it is clamped flatly on the chuck 2.

[0053] Please continue reading Figure 3 and Figure 4 Furthermore, the top surface of the supporting protrusion 22 is flush with the top surface of the chuck 2, so that the wafer 200 is carried on the top surface of the chuck 2, which has better flexibility and can adapt to wafers 200 of different sizes, and also facilitates the slide plate 23 to abut against the outer edge of the wafer 200 to clamp the wafer 200.

[0054] In one embodiment, a leveling position is formed between any two adjacent slides 23 on the chuck 2, and a second screw hole is opened at each leveling position on the chuck 2. A leveling member 26 is threadedly connected to the second screw hole. The corresponding leveling position is raised or lowered relative to the stage 1 by rotating the leveling member 26 to cooperate with the leveling chuck 2.

[0055] It can be understood that by setting the leveling member 26 threadedly connected in the second screw hole, since the bottom of the leveling member 26 can pass through the second screw hole and abut against the bottom of the mounting groove 111, the leveling member 26 can be vertically lifted and lowered relative to the second screw hole by rotating the leveling member 26, so that when the leveling member 26 abuts against the bottom of the mounting groove 111, the leveling position can be lifted and lowered relative to the mounting groove 111 to cooperate with the leveling of the chuck 2, and by providing multiple leveling positions, each point can be adjusted individually, which has better flexibility.

[0056] In one embodiment, the leveling member 26 is provided with connecting holes for the installation bolts to pass through, and the bottom of the installation groove 111 is also provided with third screw holes corresponding to the positions of the connecting holes. The installation bolts can pass through the connecting holes and be threadedly connected with the third screw holes to fasten the chuck 2 in the installation groove 111.

[0057] In this embodiment, a connecting hole is provided in the leveling member 26, and a third screw hole is provided at the bottom of the mounting groove 111. By installing a bolt passing through the connecting hole and being threadedly connected to the third screw hole, disassembly and installation are more convenient, and the stability of the chuck 2 is better.

[0058] In one embodiment, at least two avoidance notches 27 are provided on the hole wall of the through hole 21 at intervals along the circumferential direction, and the avoidance notches 27 avoid the supporting protrusions 22 .

[0059] In this embodiment, the avoidance gap 27 is provided to facilitate removal of the wafer 200 after the wafer 200 is inspected, for example, by clamping the wafer at the avoidance gap 27 with fingers or a clamping tool.

[0060] At least two avoidance notches 27 are arranged opposite to each other, so that the two opposite avoidance notches 27 can clamp the two opposite sides of the outer edge of the wafer 200. Specifically, four avoidance notches 27 are arranged in this embodiment.

[0061] In one embodiment, a positioning hole is formed at the bottom of the installation groove 111 , and a positioning column is provided at the bottom of the chuck 2 at a position corresponding to the positioning hole, and the positioning column can extend into the positioning hole.

[0062] In this embodiment, a positioning hole is opened at the bottom of the installation groove 111. When installing the chuck 2 into the installation groove 111, it is first pre-positioned by cooperating with the positioning column and the positioning hole to ensure the accurate and reliable position of the chuck 2 and improve the assembly efficiency.

[0063] The present invention also proposes a wafer testing device. The present invention also proposes a wafer testing device, including a frame, a motion mechanism, a testing mechanism and a wafer carrying mechanism 100. The specific structure of the wafer carrying mechanism 100 refers to the above-mentioned embodiment. Since the wafer testing device adopts all the technical solutions of all the above-mentioned embodiments, it has at least all the beneficial effects brought by the technical solutions of the above-mentioned embodiments, which will not be described one by one here.

[0064] Among them, the moving mechanism is arranged on the frame, and the moving mechanism can move relative to the frame; the stage 1 is connected to the moving mechanism, and the moving mechanism can drive the wafer carrying mechanism 100 to move relative to the frame; the testing mechanism is arranged on the frame and is used to test the wafer carried at the through hole 21.

[0065] Among them, the frame, motion mechanism and testing mechanism can all adopt existing technologies.

[0066] As described above, the carrying platform of the wafer carrying mechanism 100 includes a support plate 12 and a carrier plate 11. The support plate 12 is connected to the motion mechanism. The support plate 12 supports the carrier plate 11 at a certain height, so that the upper and lower parts of the carrier plate 11 are hollowed out, which is convenient for the testing mechanism to move to test the wafer on the carrier plate 11; the wafer carrying mechanism 100 is driven by the motion mechanism to move to the test station to test the wafer on the wafer carrying mechanism 100.

[0067] The above description is only an exemplary embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the technical concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A wafer carrying mechanism, characterized in that: include: A loading platform, wherein the loading platform is provided with a mounting slot with a notch facing upward; A chuck, the chuck is installed in the installation groove, the chuck is provided with a through hole, a hole wall of the through hole is provided with a plurality of support protrusions at intervals along its circumference, the plurality of support protrusions are used to support the wafer placed at the through hole, and a slide plate is slidably connected to the top of the chuck corresponding to the position of each support protrusion; A plurality of adjustment components are arranged on the worktable at intervals around the mounting groove, and are arranged in a one-to-one correspondence with the number of the slides; the plurality of adjustment components are used to drive the corresponding slides to slide relative to the chuck along the radial direction of the through hole until they abut against or disengage from the outer edge of the wafer, so that the plurality of slides cooperate to clamp or loosen the wafer.

2. The wafer carrying mechanism according to claim 1, characterized in that: The top of the chuck is recessed downward to form a slide groove corresponding to the position of each slide plate, and the slide groove extends inward from the outer edge of the chuck along the radial direction of the through hole. The bottom of each slide plate is provided with a slider that extends into the slide groove and slidably cooperates with the slide groove; the adjustment component abuts or is connected to the slider of the corresponding slide plate to drive the corresponding slide plate to slide relative to the chuck along the radial direction.

3. The wafer carrying mechanism according to claim 2, characterized in that: Each of the slide grooves is provided with limiting blocks on the opposite sides along the circumferential direction, and two first limiting surfaces are formed on the opposite sides of the two limiting blocks respectively, and the top of each limiting block extends toward the direction of the other limiting block to form a limiting arm, and the bottom of the limiting arm forms a second limiting surface, and the two first limiting surfaces are respectively slidably matched with the opposite sides of the slider along the circumferential direction, and the second limiting surface is slidably matched with the top of the slider.

4. The wafer carrying mechanism according to claim 3, characterized in that: Each of the slide plates is stacked with the corresponding slider, and each of the sliders is recessed downward along two opposite sides of the circumferential direction to form two limit steps respectively, each of the limit arms extends into the corresponding limit step, and each of the second limit surfaces is slidably matched with the step surface of the corresponding limit step; The top surface of each of the limit arms and the top surface of each of the slide blocks are flush with the top surface of the chuck.

5. The wafer carrying mechanism according to claim 2, characterized in that: Each of the adjustment components includes an adjustment bolt, and a first screw hole connected to the mounting groove is opened on the side wall of the worktable corresponding to each of the adjustment bolts, and the adjustment bolt is threadedly connected to the corresponding first screw hole; by rotating the adjustment bolt, one end of the adjustment bolt can be extended into the mounting groove and abut against the corresponding slider, so as to drive the corresponding slider to slide relative to the chuck toward the through hole.

6. The wafer carrying mechanism according to claim 5, characterized in that: Each of the adjustment components further includes an elastic member, and one end of the elastic member abuts against a groove wall of the sliding groove close to the through hole, and the other end of the elastic member abuts against the corresponding sliding block.

7. The wafer carrying mechanism according to any one of claims 1 to 6, characterized in that: The slide plate forms an arc-shaped abutting surface on one side facing the through hole, each of the arc-shaped abutting surfaces is concave in a direction away from the through hole, and each of the arc-shaped abutting surfaces is inclined from top to bottom in a direction away from the through hole.

8. The wafer carrying mechanism according to any one of claims 1 to 6, characterized in that: A leveling position is formed on the chuck between any two adjacent slides, and a second screw hole is provided on the chuck at each leveling position, and a leveling member is threadedly connected to the second screw hole; the leveling member is rotated to make the corresponding leveling position rise and fall relative to the stage, so as to coordinate with the leveling of the chuck; The leveling member is provided with connecting holes for the installation bolts to pass through, and the bottom of the installation groove is also provided with third screw holes corresponding to the positions of each of the connecting holes. The installation bolts can pass through the connecting holes and be threadedly connected with the third screw holes to fasten the chuck in the installation groove.

9. The wafer carrying mechanism according to any one of claims 1 to 6, characterized in that: The hole wall of the through hole is provided with at least two avoidance gaps spaced apart along the circumferential direction, and the avoidance gaps avoid the supporting protrusions.

10. A wafer testing device, characterized in that: include: frame; A motion mechanism, the motion mechanism is disposed on the frame and can move relative to the frame; A wafer carrying mechanism, comprising: a wafer carrying mechanism as claimed in any one of claims 1 to 9, wherein the stage is connected to the motion mechanism, and the motion mechanism can drive the wafer carrying mechanism to move relative to the frame; A testing mechanism is arranged on the frame and is used to test the wafer carried at the through hole.

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