Probe card installation platform, wafer detection equipment and design method

Abstract

The invention discloses a probe card mounting platform, wafer detection equipment and a design method, the probe card mounting platform comprises an equipment platform plate, a connecting plate, an insulating plate, a probe card mounting plate, a first cylindrical pin and a second cylindrical pin, the connecting plate is connected with the equipment platform plate, the insulating plate is located below the connecting plate along the height direction, and the probe card mounting plate is located below the insulating plate; the connecting plate is provided with a first circular hole and a first waist-shaped hole, the probe card mounting plate is provided with a second waist-shaped hole and a fourth circular hole, the connecting plate and the insulating plate are connected through a first cylindrical pin, and two opposite ends of the first cylindrical pin are respectively inserted into the first waist-shaped hole and the second circular hole; the insulating plate and the probe card mounting plate are connected through a second cylindrical pin; two opposite ends of the second cylindrical pin are respectively inserted into the second waist-shaped hole and the third round hole; when the probe card mounting platform is heated, the connecting plate and the probe card mounting plate can move relative to the insulating plate, and the moving directions of the connecting plate and the probe card mounting plate are opposite.

Description

Technical Field

[0001] The present invention relates to the field of wafer detection technology, and in particular to a probe card installation platform, wafer detection equipment and a design method. Background Art

[0002] During the testing process of wafer mass production, wafer inspection equipment is usually required as testing equipment. With the rapid development of chip technology and the market demand for chip products, wafer inspection equipment needs to be able to perform reliability tests on wafer quality under different temperature conditions.

[0003] Since chip manufacturing requires extremely high levels of processing sophistication, wafer inspection, as a link in the chip manufacturing process, also needs to ensure high precision. That is, it is necessary to ensure that the wafer inspection equipment used to test the chip maintains high-precision inspection effects during operation to ensure the reliability and stability of the final chip product. Summary of the invention

[0004] In view of this, in order to solve the above-mentioned technical problems, the present application provides a probe card installation platform, a wafer detection device and a design method.

[0005] A first aspect of an embodiment of the present application provides a probe card mounting platform, which includes a device platform plate, a connecting plate, an insulating plate, a probe card mounting plate, a first cylindrical pin and a second cylindrical pin, wherein the connecting plate is connected to the device platform plate, along the height direction of the probe card mounting platform, the insulating plate is located below the connecting plate, and the probe card mounting plate is located below the insulating plate; The connecting plate is provided with a first circular hole and a first waist-shaped hole, the insulating plate is provided with a second circular hole and a third circular hole, the probe card mounting plate is provided with a second waist-shaped hole and a fourth circular hole, the connecting plate and the insulating plate are connected by a first cylindrical pin, and the opposite ends of the first cylindrical pin are respectively inserted into the first waist-shaped hole and the second circular hole; the insulating plate and the probe card mounting plate are connected by a second cylindrical pin, and the opposite ends of the second cylindrical pin are respectively inserted into the second waist-shaped hole and the third circular hole; Along the length direction of the probe card mounting platform, the first waist-shaped hole and the second waist-shaped hole are relatively distributed on opposite sides of the insulating plate. On opposite sides of the first waist-shaped hole and the second waist-shaped hole, there is a first gap between the first cylindrical pin and the hole wall of the first waist-shaped hole, and there is a second gap between the second cylindrical pin and the hole wall of the second waist-shaped hole. When the probe card mounting platform is heated, the connecting plate moves along the hole body direction of the first waist-shaped hole relative to the insulating plate in a first direction, and the probe card mounting plate moves along the hole body direction of the second waist-shaped hole relative to the insulating plate in a second direction, wherein the hole body direction of the first waist-shaped hole is parallel to the hole body direction of the second waist-shaped hole, and the first direction and the second direction are arranged opposite to each other.

[0006] In the present application, through the structural design of the main working plate group in the above-mentioned embodiment, the deformation influence of temperature change on the main working plate group, especially the deformation influence on the probe card mounting plate, can be effectively resisted. Therefore, the probe installed on the probe card mounting plate can maintain a good alignment with the target area of ​​the wafer to be tested, so that the wafer detection equipment can resist the influence of temperature change on its own detection data, thereby effectively improving the detection performance of the wafer detection equipment.

[0007] The second aspect of the embodiments of the present application provides a wafer inspection device, which includes the probe card installation platform in the first aspect of the embodiments of the present application. Since the beneficial effects of the second aspect of the embodiments of the present application are derived from the first aspect of the embodiments of the present application, the main beneficial effects of the second aspect of the embodiments of the present application, please refer to the beneficial effects of the first aspect of the embodiments of the present application, and will not be repeated here.

[0008] A third aspect of the present application provides a method for designing a probe card installation platform, the method comprising: Providing a connecting plate, and forming a first waist-shaped hole and a first round hole on the connecting plate; Providing an insulating plate, and forming a second circular hole and a third circular hole on opposite sides of a plate body of the insulating plate; Providing a probe card mounting plate, and forming a second waist-shaped hole and a fourth round hole on the probe card mounting plate; The connecting plate, the insulating plate and the probe card mounting plate are stacked one on top of another in sequence, and the first waist-shaped hole corresponds to the second circular hole, and the second waist-shaped hole corresponds to the third circular hole; Provide a first cylindrical pin and a second cylindrical pin, make the first cylindrical pin pass through the second circular hole, and make the opposite ends of the first cylindrical pin insert into the first waist-shaped hole and the fourth circular hole respectively, make the second cylindrical pin pass through the third circular hole, and make the opposite ends of the second cylindrical pin insert into the first circular hole and the second waist-shaped hole respectively, so that the pins between the connecting plate, the insulating plate and the probe card mounting plate are positioned and connected; When the temperature of the probe card mounting platform rises, the probe card mounting plate moves in a first direction relative to the insulating plate, and the connecting plate moves in a second direction relative to the insulating plate, wherein the first direction is opposite to the second direction, so that the relative movement distance between the connecting plate and the probe card mounting plate is reduced.

[0009] The third aspect of the embodiment of the present application provides a design method for a wafer inspection device, which aims to realize the probe card installation platform mentioned in the first aspect of the embodiment of the present application. Therefore, the design method in the third aspect of the embodiment of the present application is the method item corresponding to the probe card installation platform in the first aspect of the embodiment of the present application, and its beneficial effects will not be repeated here.

[0010] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, the following specifically cites the embodiments of the present application and describes them in detail with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0012] Figure 1 This is a schematic diagram of the composition of the wafer inspection equipment in this application; Figure 2 A structural diagram of a probe card mounting platform from a first-person perspective; Figure 3 for Figure 2 An exploded view of the structure shown in a second perspective; Figure 4 for Figure 2 A top view of Figure 5 for Figure 4 The cross-sectional view at AA in the middle; Figure 6 for Figure 5 The enlarged view of point A in the middle; Figure 7 for Figure 5 The enlarged view of point B in the middle; Figure 8 for Figure 5 Enlarged view of point C in the middle; Fig. 9 for Figure 4 The cross-sectional view at the middle BB; Fig.10 for Fig. 9 The enlarged view of point D in the middle; Fig.11 for Fig. 9 Enlarged view of point E in the middle; Fig.12 for Figure 2 Bottom view of the middle connecting plate; Fig.13 for Figure 2 A top view of the middle insulation board; Fig.14 for Figure 2 A top view of the probe card mounting plate; Fig.15 A flowchart illustrating a method for designing a probe card mounting platform.

[0013] Reference numerals: 1000-wafer detection equipment, 1-probe card mounting platform, 10-equipment platform plate, 20-connecting plate, 21-first circular hole, 22-first waist-shaped hole, 23-first screw hole, 24-top convex portion, 30-insulating plate, 31-second circular hole, 32-third circular hole, 33-first threaded through hole, 34-second threaded through hole, 40-probe card mounting plate, 41-second waist-shaped hole, 42-fourth circular hole, 43-second screw hole, 50-first cylindrical pin, 60-second cylindrical pin, 70-first threaded assembly, 71-first screw, 72-first disc spring, 80-second threaded assembly, 81-second screw, 82-second disc spring, d1-first gap, d2-second gap, d3-third gap; L-length direction, W-width direction, H-height direction. DETAILED DESCRIPTION

[0014] In order to make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme of the embodiments of the present application is clearly and completely described below in conjunction with the drawings of the embodiments of the present application. Obviously, the described embodiments are only embodiments of a part of the present application, not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work should fall within the scope of protection of this application.

[0015] Unless otherwise defined, the technical or scientific terms used herein shall have the usual meaning as understood by a person of ordinary skill in the field to which this application belongs. The words "one", "an" or "the" and the like used in this application do not indicate a quantitative limitation, but are only used to indicate the presence of at least one. The words "include" or "comprise" and the like mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. The words "connect" or "connected" and the like are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect.

[0016] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0017] What needs to be understood first is that chips, as an indispensable key component in modern electronic devices, undertake important functions such as calculation, storage, and control. They are widely used in computers, mobile phones, automobiles, industrial automation and other fields. With the rapid development of science and technology, the performance requirements of chips are constantly increasing. Therefore, the accuracy of chip manufacturing process is becoming more and more stringent.

[0018] Wafers are mainly made of high-purity silicon and are the core material for making chips. In a sense, they are the starting point of chip manufacturing. The surface of the wafer is smooth and flat, providing an ideal substrate for the subsequent engraving and formation of chip patterns. In industrial production, the size of wafers is usually larger, usually with two common specifications of 8 inches and 12 inches. In this way, more chips can be integrated on a single wafer, thereby improving the production efficiency of chip manufacturing and reducing the manufacturing cost of chips.

[0019] When the wafer enters the manufacturing process, it will go through many complex and delicate process steps, among which the high temperature environment is a crucial link in the wafer manufacturing process. Under high temperature conditions, the wafer can undergo a series of key physical and chemical changes, thereby gradually forming a chip with a complex circuit structure. For example, during the crystal growth process, the silicon material needs to be melted and crystallized in a high temperature environment to form a high-quality single-crystal silicon wafer; and in the doping process, high temperature helps to introduce impurity atoms into the silicon crystal, changing its electrical properties, thereby realizing the specific functions of the chip; in addition, high temperature is also used to activate the doped impurity atoms to ensure that they occupy the correct position in the crystal lattice, thereby providing a basis for the normal operation of the chip.

[0020] Since chip manufacturing requires extremely high precision, tiny dimensional deviations or complex pattern defects will affect the performance and function of the chip. Therefore, after the wafer has gone through various manufacturing process links, it needs to undergo high-precision inspection. By early detection and screening of defects, defective wafers can be avoided from being put into subsequent expensive manufacturing processes. This can improve the chip yield and ensure that the performance and function of the subsequently processed chip products meet product expectations.

[0021] Since chip products will face different temperature environments in actual use, and temperature changes will affect the physical properties and electrical performance of the wafer, multiple temperatures need to be set for wafer inspection to inspect the wafer at different temperatures. In this way, defects that may occur in the wafer under high or low temperature conditions (such as stress caused by differences in thermal expansion coefficients, increased leakage, etc.) can be discovered in advance to more accurately evaluate the thermal stability and reliability of the wafer, thereby ensuring the stable operation of the chip in various actual working environments. Accordingly, the wafer inspection equipment required for wafer inspection also needs to face a variety of different temperature environments to participate in the wafer inspection process.

[0022] Since wafer inspection faces different ambient temperatures, and the wafer inspection equipment must also enter different ambient temperatures, the various components of the wafer inspection equipment will be affected by the ambient temperature, that is, thermal expansion and contraction will occur, thereby affecting the wafer inspection data. Therefore, the present application provides a wafer inspection equipment, which can reduce the impact of ambient temperature on its own inspection performance to a certain extent, so as to improve its own accuracy in wafer inspection.

[0023] You can refer to Figure 1 An embodiment of the present application provides a wafer detection device, which includes a probe card mounting platform, and the probe card mounting platform is used to detect a target wafer to obtain performance data of the target wafer under various temperature environments.

[0024] In order to better understand the technical content of this solution, the following will be combined with the attached examples in this application. Figures 1 to 15 , each technical solution in the embodiment of the present application is described clearly and completely, wherein it should be noted that the length direction L marked in each drawing is marked with reference to the height direction of the probe card mounting platform 1, the width direction W marked in each drawing is marked with reference to the width direction of the probe card mounting platform 1, and the height direction H marked in each drawing is marked with reference to the height direction of the probe card mounting platform 1. The directions marked in each drawing are kept consistent for easy reference and understanding.

[0025] It should be explained in advance that since the probe moves back and forth along the height direction H of the probe card mounting platform 1 along the probe card mounting plate 40, the present application focuses on the impact of changes in the length direction L of the probe card mounting platform 1 when the probe card mounting plate 40 is subject to temperature changes on the probe position. In the subsequent embodiments, the description of each embodiment of the probe card mounting platform 1 also focuses on the deformation of each component in the length direction L of the probe card mounting platform 1.

[0026] Please continue to refer to Figures 1 to 14 , wherein the aforementioned probe card mounting platform 1 includes a device platform plate 10, a connecting plate 20, an insulating plate 30, a probe card mounting plate 40, a first cylindrical pin 50 and a second cylindrical pin 60, wherein the connecting plate 20 is connected to the device platform plate 10, and along the height direction H of the probe card mounting platform 1, the insulating plate 30 is located below the connecting plate 20, and the probe card mounting plate 40 is located below the insulating plate 30.

[0027] Specifically, the probe card mounting plate 40 is used to connect the probe, which is used to contact the wafer to obtain the detection data of the wafer (such as leakage current data), and the insulating plate 30 is used to insulate and isolate the probe card mounting plate 40 and other boards and devices to avoid the formation of a current loop between the probe card mounting plate 40 and other boards, which affects the accuracy of the leakage current data. The connecting plate 20 is used to connect the insulating plate 30 and indirectly connect the connecting plate 20 to the equipment platform plate 10, so that the various boards form a connection relationship to form a complete main operation board group, wherein the wafer detection equipment 1000 is provided with a mounting portion, and the equipment platform plate 10 is connected to the mounting portion, so that the above-mentioned main operation board group is connected to the mounting portion as a whole to perform subsequent detection operations of the wafer detection equipment 1000.

[0028] Since the connecting plate 20, the insulating plate 30 and the probe card mounting plate 40 serve as the main detection operation plate bodies, for the sake of simplicity in the subsequent description, the connecting plate 20, the insulating plate 30, the probe card mounting plate 40 and their associated connecting parts (such as the first cylindrical pin 50, the second cylindrical pin 60) are collectively referred to as the main operation plate group to avoid redundancy in the subsequent description.

[0029] The connecting plate 20 is provided with a first circular hole 21 and a first waist-shaped hole 22 (also refer to Fig.12 ), the insulating plate 30 is provided with a second circular hole 31 and a third circular hole 32, the probe card mounting plate 40 is provided with a second waist-shaped hole 41 and a fourth circular hole 42, the connecting plate 20 and the insulating plate 30 are connected by a first cylindrical pin 50, and the opposite ends of the first cylindrical pin 50 are respectively inserted in the first waist-shaped hole 22 and the second circular hole 31; the insulating plate 30 and the probe card mounting plate 40 are connected by a second cylindrical pin 60, and the opposite ends of the second cylindrical pin 60 are respectively inserted in the second waist-shaped hole 41 and the third circular hole 32. Among them, the first cylindrical pin 50 and the second cylindrical pin 60 are used to connect the connecting plate 20, the insulating plate 30 and the probe card mounting plate 40 to form a connection relationship between the three plates.

[0030] It should be noted that it can be further combined with reference Figures 4 to 14 Since the first circular hole 21, the second circular hole 31, the third circular hole 32 and the fourth circular hole 42 are all adapted and connected with the first cylindrical pin 50 and the second cylindrical pin 60, the first cylindrical pin 50, the second cylindrical pin 60 and the insulating plate 30 are adapted and connected, the end of the first cylindrical pin 50 away from the probe card mounting plate 40 is adapted and connected to the first circular hole 21, the end of the second cylindrical pin 60 away from the connecting plate 20 is adapted and connected to the second circular hole 31, the end of the first cylindrical pin 50 close to the probe card mounting plate 40 is inserted into the second waist-shaped hole 41, and the end of the second cylindrical pin 60 close to the probe card mounting plate 40 is inserted into the first waist-shaped hole 22.

[0031] In other words, along Figure 2 and Figure 3In the length direction L shown in FIG. , a first gap d1 (such as Figure 6 As shown in FIG. 1 ), a second gap d2 is provided between the second waist-shaped hole 41 and the second cylindrical pin 60 (as shown in FIG. 1 ). Figure 8 As shown), therefore, when the connecting plate 20 is physically deformed due to changes in the ambient temperature, its deformation (expansion of the plate body or contraction of the plate body) will move along the hole body direction of the first waist-shaped hole 22 until the hole wall of the first waist-shaped hole 22 abuts against the first cylindrical pin 50. Similarly, when the probe card mounting plate 40 is physically deformed due to changes in the ambient temperature, its deformation (expansion of the plate body or contraction of the plate body) will move along the hole body direction of the second waist-shaped hole 41 until the hole wall of the second waist-shaped hole 41 abuts against the second cylindrical pin 60.

[0032] Specifically, along the length direction L of the probe card mounting platform 1, the first waist-shaped hole 22 and the second waist-shaped hole 41 are relatively distributed on opposite sides of the insulating plate 30, and on the opposite sides of the first waist-shaped hole 22 and the second waist-shaped hole 41, there is a first gap d1 between the first cylindrical pin 50 and the hole wall of the first waist-shaped hole 22 (refer to Figure 6 ), there is a second gap d2 between the second cylindrical pin 60 and the hole wall of the second waist-shaped hole 41 (refer to Figure 8 ), when the probe card mounting platform 1 is heated, the connecting plate 20 moves along the hole body direction of the first waist-shaped hole 22 relative to the insulating plate 30 along the first direction (which can be understood as the negative direction of the length direction L in the figure), and the probe card mounting plate 40 moves along the hole body direction of the second waist-shaped hole 41 relative to the insulating plate 30 along the second direction (which can be understood as the positive direction of the length direction L in the figure), wherein the hole body direction of the first waist-shaped hole 22 is parallel to the hole body direction of the second waist-shaped hole 41, and the first direction is set opposite to the second direction.

[0033] In other words, due to the connection and restriction effect of the first cylindrical pin 50 and the second cylindrical pin 60, the insulating plate 30 can be regarded as a reference object in the deformation process, that is, the plate deformation of the insulating plate 30 can be ignored, so as to better illustrate the movement effect of the connecting plate 20 and the probe card mounting plate 40. Among them, the first waist-shaped hole 22 and the second waist-shaped hole 41 are arranged in a spaced and opposite manner along the length direction L (refer to Figure 2 In the disc-symmetrical structure shown, the first waist-shaped hole 22 and the second waist-shaped hole 41 are distributed on opposite sides of the symmetry axis of the disc-symmetrical structure). In this way, when the main working plate group is physically deformed due to temperature changes, the connecting plate 20 is restricted by the second cylindrical pin 60 and the probe card mounting plate 40 is restricted by the first cylindrical pin 50. Therefore, the connecting plate 20 and the probe card mounting plate 40 move in opposite directions relative to the insulating plate 30.

[0034] From the overall perspective of the main working plate group, since the probe card mounting plate 40 is closer to the wafer detection environment, the probe card mounting plate 40 will move in the second direction due to first sensing the temperature change, and drive the insulating plate 30 to move in the second direction under the connecting action of the first cylindrical pin 50. Afterwards, with the heat transfer between the plates, the connecting plate 20 will move in the first direction after sensing the temperature change, and drive the insulating plate 30 and the probe card mounting plate 40 to move in the first direction under the limiting action of the second cylindrical pin 60, thereby offsetting to a certain extent the distance moved in the second direction due to the deformation of the probe card mounting plate 40. That is, in the above-mentioned embodiment, the probe card mounting plate 40 can eventually be reset to the target position, or close to the target position, to a certain extent, so that the probe installed on the probe card mounting plate 40 can be aligned with the target area of ​​the wafer to be tested, reducing the impact of temperature changes on the data accuracy of the wafer detection equipment 1000.

[0035] In the present application, through the structural design of the main working plate group in the above-mentioned embodiment, the deformation influence of temperature change on the main working plate group, especially the deformation influence of the probe card mounting plate 40, can be effectively resisted. Therefore, the probe installed on the probe card mounting plate 40 can maintain a good alignment with the target area of ​​the wafer to be tested, so that the wafer detection equipment 1000 can resist the influence of temperature change on its own detection data, and effectively improve the detection performance of the wafer detection equipment 1000.

[0036] In some embodiments, when the probe card mounting platform 1 is heated, along the length direction L of the probe card mounting platform 1, the probe card mounting plate 40 forms a first deformation along a first direction relative to the insulating plate 30, and the connecting plate 20 forms a second deformation along a second direction relative to the insulating plate 30, the first deformation is equal to the second deformation, and the first direction is opposite to the second direction.

[0037] It is necessary to understand first that the reason why the temperature of the environment in which the probe card installation platform 1 is located changes is that when detecting the wafer to be tested, the wafer to be tested needs to be in an environment with different temperatures in order to obtain the detection data of the wafer to be tested in different temperature environments, and then judge the comprehensive performance of the wafer to be tested. Therefore, the main operation board group serves as the main structure for detecting the wafer to be tested, and it can more sensitively sense the temperature changes in the environment in which the wafer to be tested is located. Therefore, the structure of the main operation board group can be focused on designing the structure to resist the influence of ambient temperature changes on the detection accuracy of the probe card installation platform 1.

[0038] The probe card mounting platform 1 serves as a carrier plate for installing the probe. During the detection operation performed by the probe card mounting platform, it will move with the probe to a position close to the wafer to be tested. This position is closer to the wafer to be tested than the insulating plate 30 and the connecting plate 20. The probe needs to contact the wafer to be tested during the detection process. Therefore, in addition to the influence of the ambient temperature of the wafer to be tested on the main operating plate group, a heat transfer channel will be formed between the wafer to be tested and the probe card mounting plate 40 through the probe, and a certain thermal radiation effect will also be formed between the wafer to be tested and the probe card mounting plate 40. Therefore, the probe card mounting plate 40 can sense changes in ambient temperature faster than the insulating plate 30 and the connecting plate 20, thereby forming physical deformation faster than the insulating plate 30 and the connecting plate 20.

[0039] Since the connection board 20, the insulating board 30 and the probe card mounting board 40 are arranged along Figure 2 and Figure 3 The negative direction of the height direction H shown is connected in sequence, so the heat between the three plates can also be transferred to each other. In other words, through the distance of the connection position, after the temperature of the probe card mounting plate 40 changes, heat exchange will first occur with the insulating plate 30, and then heat exchange will occur with the connecting plate 20. During the heat transfer process, a certain amount of heat loss will occur. Therefore, the temperature change sensed by the connecting plate 20 is smaller than that of the probe card mounting plate 40. When the connecting plate 20 and the probe card mounting plate 40 are of the same specification and material, the physical deformation value of the connecting plate 20 due to temperature change is smaller than the physical deformation value of the probe card mounting plate 40 due to dimensional change.

[0040] Therefore, in the above-mentioned embodiment, by setting the first deformation amount equal to the second deformation amount, that is, the physical deformation value of the connecting plate 20 is greater than the physical deformation value of the probe card mounting plate 40, the above-mentioned influence of the different deformation properties of the connecting plate 20 and the probe card mounting plate 40 due to the heat loss in the heat transfer process is overcome, and the probe card mounting plate 40 can drive the probe to return to its original position after the main working plate group undergoes physical deformation, so as to maintain alignment with the target area of ​​the wafer to be tested.

[0041] In order to ensure the movement effect of the connecting plate 20 and the probe card mounting plate 40 relative to the insulating plate 30, the length of the first gap d1 is set to be greater than or equal to the first deformation amount, and the length of the second gap d2 is set to be greater than or equal to the second deformation amount, so as to reduce the influence of the relative movement effect between the plates on the limitation between the cylindrical pin and the corresponding waist hole wall.

[0042] Furthermore, the probe card mounting plate 40 and the connecting plate 20 are made of the same plate material, and the heat-bearing area of ​​the probe card mounting plate 40 is smaller than that of the connecting plate 20. In this way, the probe card mounting plate 40 generates less heat exchange with the detection environment relative to the connecting plate 20, so that the heat change value of the connecting plate 20 can be close to that of the connecting plate 20, thereby making the first deformation variable equal to the second deformation variable, to ensure that after the main working plate group is deformed, the probe remains aligned with the target area of ​​the wafer to be tested.

[0043] Optionally, the thermal expansion coefficient of the probe card mounting plate 40 is smaller than that of the connecting plate 20, that is, the physical deformation capacity of the probe card mounting plate 40 is smaller than that of the connecting plate 20. Therefore, although there is loss when the heat of the probe card mounting plate 40 is transferred to the connecting plate 20 during the heat transfer process, when only the heat factor is considered, the physical deformation capacity of the probe card mounting plate 40 is greater than the physical deformation capacity of the connecting plate 20. Combined with the factor of the thermal expansion coefficient, at this time, the physical deformation capacities between the probe card mounting plate 40 and the connecting plate 20 tend to be similar. Therefore, after the various structures of the main working plate group undergo physical deformation, the probe and the target area of ​​the wafer to be tested still remain aligned.

[0044] Since the thermal expansion coefficient of the probe card mounting plate 40 is smaller than that of the connecting plate 20, it is possible that the first deformation amount (physical deformation amount of the probe card mounting plate) is smaller than the second deformation amount (physical deformation amount of the connecting plate 20). Therefore, the length of the first gap d1 is set to be greater than or equal to the length of the second gap d2 to reduce the deformation size of the connecting plate 20 being affected by the constraint of the first cylindrical pin 50 when the connecting plate 20 forms physical deformation due to temperature changes.

[0045] Optionally, the thermal expansion coefficient of the probe card mounting plate 40 is ε1, the plate thickness of the probe card mounting plate 40 is h1, and the first deformation amount is x1. The thermal expansion coefficient of the connecting plate 20 is ε2, the plate thickness of the connecting plate 20 is h2, and the second deformation amount is x2. Since the heat transfer effect between the probe card mounting plate 40 and the connecting plate 20 may also be affected by some objective environmental factors, such as the contact between the main working plate group and other components, the electrical connection between the probe card mounting plate 40 and other structures, etc., the probe card mounting platform 1 also has a thermal expansion compensation coefficient ε3 to compensate for the influence of this part of the objective environmental factors on the physical deformation amount of the connecting plate 20. When the probe card mounting platform 1 expands due to heat, .

[0046] Furthermore, the thermal expansion compensation coefficient ε3 may be determined according to the thermal expansion coefficients ε1 and ε2 and the volumes of the probe card mounting plate 40 and the connecting plate 20 , and may be obtained by the user through statistics after collecting experimental data.

[0047] Optionally, the thermal expansion coefficient of the probe card mounting plate 40 is smaller than that of the connecting plate 20, and the length of the first gap d1 is equal to the length of the second gap d2. In this way, the physical deformation of the probe card mounting plate 40 is smaller than that of the connecting plate 20. Although there will be a certain loss when the heat of the probe card mounting plate 40 is transferred to the connecting plate 20, due to the difference in thermal expansion coefficients, even if the physical deformation of the connecting plate 20 corresponding to the part of the loss that is missing from the connecting plate 20 is smaller, in the final deformation result, the physical deformation of the probe card mounting plate 40 and the physical deformation of the connecting plate 20 can also remain at the same level. Therefore, the length of the first gap d1 can be set equal to the length of the second gap d2.

[0048] Furthermore, the lengths of the first gap d1 and the second gap d2 can be set larger than the first physical deformation and the second physical deformation to avoid excessive physical deformation, which may lead to mutual constraint between the cylindrical pin and the side wall of the waist hole and interfere with the stability of the main working plate assembly structure.

[0049] Please refer to Figures 4 to 13 Optionally, the connecting plate 20 is provided with a first screw hole 23 (such as Fig.11 As shown), the probe card mounting plate 40 is provided with a second screw hole 43, which can be referred to Fig.13 The insulating plate 30 is provided with a first threaded through hole 33 and a second threaded through hole 34. Along the length direction L of the probe card mounting platform 1, the first threaded through hole 33 and the second threaded through hole 34 are spaced apart and distributed on opposite sides of the insulating plate 30, and the first screw hole 23 is arranged corresponding to the first threaded through hole 33, and the second screw hole 43 is arranged corresponding to the second threaded through hole 34. In this way, the connecting plate 20, the insulating plate 30 and the probe card mounting plate 40 can be connected through the connecting piece.

[0050] The probe card mounting platform 1 also includes a first threaded component 70 and a second threaded component 80. The first threaded component 70 connects the first threaded through hole 33 and the first screw hole 23 in sequence, and the second threaded component 80 connects the second threaded through hole 34 and the second screw hole 43 in sequence. Along the height direction H of the probe card mounting platform 1, the installation direction of the first threaded component 70 is opposite to the installation direction of the second threaded component 80. Thus, in the height direction H shown in the figure, since the connecting members between the connecting plate 20 and the insulating plate 30 and between the insulating plate 30 and the probe card mounting plate 40 are different, compared with the three plates being connected as a whole by the same connecting member, such an arrangement can reduce the extrusion stress of the first threaded component 70 and the second threaded component 80 respectively, and can also disperse the extrusion stress of the insulating plate 30 at the threaded through hole, that is, the extrusion stress of the insulating plate 30 that should originally be gathered at one place is dispersed to multiple positions of the insulating plate 30, so as to reduce the physical loss of the insulating plate 30 and the threaded component when the main working plate group is working.

[0051] Please continue to refer to Figures 9 to 14 Further, the first threaded assembly 70 includes a first screw 71 and a first disc spring 72 (such as Fig.10 As shown), the second threaded component 80 includes a second screw 81 and a second disc spring 82, the head of the first screw 71 presses the first disc spring 72 against the hole wall of the first threaded through hole 33 through a first preset torque, and the head of the second screw 81 presses the second disc spring 82 against the hole wall of the second threaded through hole 34 through a second preset torque, wherein the first screw 71 and the second screw 81 are used to realize the connection relationship between the corresponding plates, the first disc spring 72 and the second disc spring 82 are correspondingly pressed against the insulating plate 30 by the first screw 71 and the second screw 81, and can increase the extrusion force applied by the first threaded component 70 and the second threaded component 80 to the insulating plate 30 through their own deformation, thereby correspondingly increasing the connection strength between the corresponding plates.

[0052] Among them, the minimum threshold of the first preset torque and / or the second preset torque is 1 N·m, and the maximum threshold of the first preset torque and / or the second preset torque is 10 N·m. In this way, most of the disc springs of different specifications on the market can be adaptively applied to the probe card mounting plate 40 in the present application without causing great physical damage to the insulating plate 30.

[0053] Optionally, please continue to refer to Figure 5 , Figure 7 , Fig. 9 , Fig.10 and Fig.11 , the equipment platform plate 10 and the connecting plate 20 are clearance-matched, that is, there is a third gap d3 between the equipment platform plate 10 and the connecting plate 20. In this way, when the connecting plate 20 expands due to heat, the third gap d3 can accommodate the increased volume of the connecting plate 20 when the connecting plate 20 expands, thereby avoiding mutual squeezing and damage between the connecting plate 20 and the equipment platform plate 10.

[0054] Optionally, the surface of the probe card mounting plate 40 is coated with a silver ion thermal insulation coating. Since the anion coating can effectively reflect infrared rays, the silver ion thermal insulation coating can reduce the heat exchange between the probe card mounting plate 40 and the detection environment to a certain extent, thereby reducing the deformation of the probe card mounting plate 40 and reducing the impact of the thermal expansion of the probe card mounting plate 40 on the connecting plate 20.

[0055] Optionally, the surface of the probe card mounting plate 40 is coated with a mixed coating of silver ions and Teflon, wherein the coating material may include but is not limited to silver ions, Teflon, or a combination of the two. The silver ion coating can effectively reflect infrared rays, and Teflon has the characteristics of high temperature resistance, insulation, and corrosion resistance. Therefore, the mixed coating of silver ions and Teflon can reduce the heat exchange between the probe card mounting plate 40 and the detection environment to a certain extent, reduce the thermal expansion of the main working plate group, and provide a certain insulation and corrosion resistance for the probe card mounting plate 40, thereby extending the service life of the probe card mounting plate 40.

[0056] Optionally, refer to Figures 3 to 14 Along the height direction H of the probe card mounting platform 1, the connecting plate 20 and the probe card mounting plate 40 are both provided with abutting protrusions 24, and the abutting protrusions 24 abut against the surface of the insulating plate 30; or, the surfaces on the opposite sides of the insulating plate 30 are both provided with abutting protrusions 24, and the abutting protrusions 24 abut against the surface of the connecting plate 20 or the probe card mounting plate 40. In this way, the contact area between the various plate bodies can be reduced, thereby limiting the heat transfer between the plate bodies and reducing the expansion effect of each plate body as a whole.

[0057] This application also provides Fig.15 A design method of a probe card mounting platform 1 is shown, the design method comprising: S1: Provide a connecting plate 20 and form a first waist-shaped hole 22 and a first round hole 21 on the connecting plate 20.

[0058] S2: Provide an insulating plate 30 , and form a second circular hole 31 and a third circular hole 32 on opposite sides of the insulating plate 30 .

[0059] S3: Provide a probe card mounting plate 40 , and form a second waist-shaped hole 41 and a fourth round hole 42 on the probe card mounting plate 40 .

[0060] S4: The connection board 20 , the insulating board 30 and the probe card mounting board 40 are stacked one on top of another, and the first waist-shaped hole 22 corresponds to the second circular hole 31 , and the second waist-shaped hole 41 corresponds to the third circular hole 32 .

[0061] S5: Provide a first cylindrical pin 50 and a second cylindrical pin 60, so that the first cylindrical pin 50 passes through the second circular hole 31, and the opposite ends of the first cylindrical pin 50 are respectively inserted into the first waist-shaped hole 22 and the fourth circular hole 42, so that the second cylindrical pin 60 passes through the third circular hole 32, and the opposite ends of the second cylindrical pin 60 are respectively inserted into the first circular hole 21 and the second waist-shaped hole 41, so that the pins are positioned and connected between the connecting plate 20, the insulating plate 30 and the probe card mounting plate 40.

[0062] S6: When the temperature of the probe card mounting platform 1 rises, the probe card mounting plate 40 moves in a first direction relative to the insulating plate 30, and the connecting plate 20 moves in a second direction relative to the insulating plate 30, wherein the first direction is opposite to the second direction, so that the relative movement distance between the connecting plate 20 and the probe card mounting plate 40 is reduced.

[0063] The user can produce the aforementioned probe card mounting platform 1 through the design method of the probe card mounting platform 1. Thus, the probe card mounting platform 1 produced through the design method can achieve the aforementioned effects to improve the aforementioned technical problems.

[0064] It should be noted that in the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, please refer to the relevant description of other embodiments. Secondly, those skilled in the art should also know that the embodiments described in the specification are all preferred embodiments, and the actions and modules involved are not necessarily required by this application.

[0065] The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A probe card mounting platform, characterized in that: include: An equipment platform plate, a connecting plate, an insulating plate, a probe card mounting plate, a first cylindrical pin and a second cylindrical pin, wherein the connecting plate is connected to the equipment platform plate, and along the height direction of the probe card mounting platform, the insulating plate is located below the connecting plate, and the probe card mounting plate is located below the insulating plate; The connecting plate is provided with a first circular hole and a first waist-shaped hole, the insulating plate is provided with a second circular hole and a third circular hole, the probe card mounting plate is provided with a second waist-shaped hole and a fourth circular hole, the connecting plate and the insulating plate are connected by the first cylindrical pin, and the opposite ends of the first cylindrical pin are respectively inserted into the first waist-shaped hole and the second circular hole; the insulating plate and the probe card mounting plate are connected by the second cylindrical pin, and the opposite ends of the second cylindrical pin are respectively inserted into the second waist-shaped hole and the third circular hole; Along the length direction of the probe card mounting platform, the first waist-shaped hole and the second waist-shaped hole are relatively distributed on opposite sides of the insulating plate, and on opposite sides of the first waist-shaped hole and the second waist-shaped hole, there is a first gap between the first cylindrical pin and the hole wall of the first waist-shaped hole, and there is a second gap between the second cylindrical pin and the hole wall of the second waist-shaped hole. When the probe card mounting platform is heated, the connecting plate moves along the hole body direction of the first waist-shaped hole relative to the insulating plate in a first direction, and the probe card mounting plate moves along the hole body direction of the second waist-shaped hole relative to the insulating plate in a second direction, wherein the hole body direction of the first waist-shaped hole is parallel to the hole body direction of the second waist-shaped hole, and the first direction is arranged opposite to the second direction.

2. The probe card mounting platform according to claim 1, wherein: When the probe card mounting platform is heated, along the length direction of the probe card mounting platform, the probe card mounting plate forms a first deformation amount along a first direction relative to the insulating plate, and the connecting plate forms a second deformation amount along a second direction relative to the insulating plate, the first deformation amount is equal to the second deformation amount, and the first direction is opposite to the second direction; The length of the first gap is greater than or equal to the first deformation amount, and the length of the second gap is greater than or equal to the second deformation amount.

3. The probe card mounting platform according to claim 2, wherein: The probe card mounting plate and the connecting plate are made of the same material, and the heat-bearing area of ​​the probe card mounting plate is smaller than that of the connecting plate.

4. The probe card mounting platform according to claim 1, wherein: The thermal expansion coefficient of the probe card mounting plate is smaller than the thermal expansion coefficient of the connection plate, and the length of the first gap is equal to the length of the second gap.

5. The probe card mounting platform according to claim 1, wherein: The connecting plate is provided with a first screw hole, and the probe card mounting plate is provided with a second screw hole; The insulating plate is provided with a first threaded through hole and a second threaded through hole, and along the length direction of the probe card mounting platform, the first threaded through hole and the second threaded through hole are spaced apart and distributed on opposite sides of the insulating plate, and the first screw connection hole is arranged corresponding to the first threaded through hole, and the second screw connection hole is arranged corresponding to the second threaded through hole; The probe card mounting platform also includes a first threaded component and a second threaded component, wherein the first threaded component sequentially connects the first threaded through hole and the first screw hole, and the second threaded component sequentially connects the second threaded through hole and the second screw hole, and along the height direction of the probe card mounting platform, the installation direction of the first threaded component is opposite to the installation direction of the second threaded component.

6. The probe card mounting platform according to claim 5, characterized in that: The first threaded assembly includes a first screw and a first disc spring, and the second threaded assembly includes a second screw and a second disc spring, the head of the first screw presses the first disc spring against the hole wall of the first threaded through hole by a first preset torque, and the head of the second screw presses the second disc spring against the hole wall of the second threaded through hole by a second preset torque; The minimum threshold of the first preset torque and / or the second preset torque is 1 N·m, and the maximum threshold of the first preset torque and / or the second preset torque is 10 N·m.

7. The probe card mounting platform according to any one of claims 1 to 6, characterized in that: The equipment platform plate and the connection plate are clearance-matched; and / or, The surface of the probe card mounting plate is coated with a silver ion temperature insulation coating.

8. The probe card mounting platform according to any one of claims 1 to 6, characterized in that: Along the height direction of the probe card mounting platform, the connecting plate and the probe card mounting plate are both provided with abutting protrusions, and the abutting protrusions abut against the surface of the insulating plate; or, the surfaces on both opposite sides of the insulating plate are both provided with abutting protrusions, and the abutting protrusions abut against the surface of the connecting plate or the probe card mounting plate.

9. A wafer inspection device, characterized in that: It comprises a probe card mounting platform as described in any one of claims 1-8.

10. A method for designing a probe card mounting platform, characterized in that: include: Providing a connecting plate, and forming a first waist-shaped hole and a first round hole on the connecting plate; Providing an insulating plate, and forming a second circular hole and a third circular hole on opposite sides of a plate body of the insulating plate; Providing a probe card mounting plate, and forming a second waist-shaped hole and a fourth round hole on the probe card mounting plate; The connecting plate, the insulating plate and the probe card mounting plate are stacked in sequence, and the first waist-shaped hole corresponds to the second circular hole, and the second waist-shaped hole corresponds to the third circular hole; Provide a first cylindrical pin and a second cylindrical pin, so that the first cylindrical pin passes through the second circular hole, and the opposite ends of the first cylindrical pin are respectively inserted into the first waist-shaped hole and the fourth circular hole, so that the second cylindrical pin passes through the third circular hole, and the opposite ends of the second cylindrical pin are respectively inserted into the first circular hole and the second waist-shaped hole, so that the connection plate, the insulating plate and the probe card mounting plate are pin-positioned and connected; When the temperature of the probe card mounting platform rises, the probe card mounting plate moves in a first direction relative to the insulating plate, and the connecting plate moves in a second direction relative to the insulating plate, wherein the first direction is opposite to the second direction, so as to reduce the relative movement distance between the connecting plate and the probe card mounting plate.

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