Display panel, display device and repair method of display panel

Abstract

The invention discloses a display panel, a display device and a repair method of the display panel, and relates to the technical field of display devices.The display panel comprises a display area and a non-display area; the non-display area is arranged around the periphery of the display area, and a driving chip, a first driving line, a second driving line and a connecting line are arranged in the non-display area; wherein the first driving line and the second driving line are located on the two sides of the driving chip respectively and electrically connected with the driving chip, at least part of the connecting line, the first driving line and the second driving line are located on different layers in the non-display area, and at least part of the projection of the connecting line on the surface of the non-display area coincides with the first driving line and the second driving line. According to the display panel provided by the invention, by arranging the connecting lines, when the pins on one side of the driving chip fail, the connecting lines can be electrically conducted with the areas where the projections of the first driving lines and the second driving lines coincide on the surface of the non-display area through a laser or counter bore process, so that normal display of the display area is ensured, and the yield of products is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of display devices, and in particular to a display panel, a display device and a method for repairing a display panel. Background Art

[0002] With the rapid development of display technology, the market has put forward higher requirements for the display effect of display panels. In order to meet these requirements, the circuit design inside the display panel has become more and more complicated, especially the number of output pins of the driver chip has continued to increase. In order to achieve high-density electrical connection, multiple bumps are usually set on one side of the driver chip in the prior art, and the pads on the substrate are connected through these bumps, and then the driving circuits are connected. For example, in a head-to-head type display panel using a GDL (Gate Driver Less) driving architecture, the output signals on the left and right sides of the driver chip are consistent, and the gate driver circuit (Gate Driver) is integrated in the non-display area of ​​the display panel, and the output pins of the driver chip are connected through lines.

[0003] However, although this IC Bump-to-substrate pad structure can achieve high-density electrical connection, in actual applications, damage is prone to occur between the Bump and the pad. These damages may be caused by factors such as foreign matter and electrostatic discharge (ESD), leading to problems such as damage to the conductive metal of the substrate, corrosion of vias, and failure of ACF (anisotropic conductive adhesive) particles. These problems will eventually cause the IC output signal to be unable to be normally and effectively transmitted to the signal required by the GDL, which in turn causes poor display in the display area of ​​the display panel, seriously affecting the product yield. Summary of the invention

[0004] The main purpose of the present invention is to provide a display panel, a display device and a display panel repair method, aiming to solve the problem that damage is easily caused between the driving chip and the pad of the existing display panel, resulting in poor display of the display panel.

[0005] In order to achieve the above-mentioned object, the present invention provides a display panel, wherein the display panel comprises:

[0006] display area; and

[0007] A non-display area, the non-display area is arranged around the periphery of the display area, and a driving chip, a first driving line, a second driving line and a connecting line are arranged in the non-display area;

[0008] The first driving line and the second driving line are respectively located on both sides of the driving chip and are electrically connected to the driving chip. At least a portion of the connecting line is located at a different layer from the first driving line and the second driving line in the non-display area, and their projections on the surface of the non-display area at least partially overlap.

[0009] In one embodiment of the present invention, the connecting line includes a first connecting line, the first connecting line and the first driving line and the second driving line are located in different layers within the display area, and two ends of the first connecting line respectively coincide with projections of the first driving line and the second driving line on the surface of the non-display area.

[0010] In one embodiment of the present invention, the connecting line includes a second connecting line and two first connecting lines, the second connecting line and the first driving line and the second driving line are located in the same layer in the display area and are arranged at intervals, the two first connecting lines and the second connecting member are located in different layers in the display area, one end of the first connecting line coincides with the projection of the first driving line or the second driving line on the surface of the non-display area, and the other end coincides with the projection of the second connecting line on the surface of the non-display area.

[0011] In one embodiment of the present invention, the connecting line includes a first connecting line and two second connecting lines, the two second connecting lines are respectively connected to the first driving line and the second driving line, the two second connecting lines are arranged at intervals, the first connecting line and the second connecting line are located in different layers in the non-display area, and the two ends of the first connecting line coincide with the projections of the two second connecting lines on the surface of the non-display area.

[0012] In one embodiment of the present invention, the connecting line includes a first connecting line and a second connecting line, the first connecting line and the second connecting line are located at different layers in the display area relative to the first driving line and the second driving line, one end of the first connecting line coincides with a projection of the first driving line on the surface of the non-display area, and the other end coincides with a projection of the second connecting line on the surface of the non-display area, and one end of the second connecting line relative to the first connecting line coincides with a projection of the second driving line on the surface of the non-display area.

[0013] In an embodiment of the present invention, the connecting wires and the driving chip are respectively located on two opposite sides of the display area.

[0014] In an embodiment of the present invention, the connecting wires and the driving chip are respectively located on the same side of the display area.

[0015] In one embodiment of the present invention, the non-display area includes a plurality of the first driving lines, a plurality of the second driving lines, and a plurality of the connecting lines. The plurality of the first driving lines and the plurality of the second driving lines are symmetrically arranged on both sides of the display area, and each of the connecting lines at least partially overlaps with the projections of a first driving line and a second driving line on the surface of the non-display area.

[0016] The present invention further provides a display device, comprising a backlight module and any one of the display panels described above; the backlight module is arranged opposite to the display panel, and the backlight module provides a display light source to the display panel.

[0017] The present invention further provides a method for repairing the display panel, the method comprising the steps of:

[0018] Lighting up the display panel, determining the position of the failed solder joint of the driver chip, and the first driving line or the second driving line connected to the failed solder joint;

[0019] The connecting line is penetrated and fused with the overlapping portions of the projections of the first driving line and the second driving line on the surface of the non-display area by laser, so as to electrically connect the connecting line to the first driving line and the second driving line.

[0020] The display panel proposed by the present invention includes a display area and a non-display area, wherein the non-display area is arranged around the periphery of the display area, and a driving chip, a first driving line, a second driving line and a connecting line are arranged in the non-display area, and the first driving line and the second driving line are respectively located on both sides of the driving chip, and are both electrically connected to the driving chip. The signals output by the pins on both sides of the driving chip are respectively transmitted to the light-emitting structure of the display area through the first driving line and the second driving line to control the display of the display area. At least part of the connecting line is located in a different layer from the first driving line and the second driving line, so that when the display panel is working normally, the first driving line cannot be connected to the second driving line through the connecting line. At the same time, the projections of the connecting line and the first driving line and the second driving line on the surface of the non-display area at least partially overlap, so when the pins on one side of the driving chip fail, the area where the connecting line overlaps with the projections of the first driving line and the second driving line on the surface of the non-display area can be electrically connected by laser laser or countersinking process, thereby realizing that the signal on the other side of the driving chip is transmitted to the second driving line through the first driving line and the connecting line, or transmitted to the first driving line through the second driving line and the connecting line, so as to ensure the normal display of the display area and improve the yield of the product.

[0021] At the same time, when the output pin on one side of the driver chip fails, resulting in an abnormal output signal, the normal signal on the other side of the driver chip needs to be connected to the driver circuit on the failed side through an external test circuit to verify the failure mechanism. Since the pin solder joints of the driver chip are small, other circuits of the panel and the driver chip are often damaged when the external test circuit is connected, making it impossible to conduct effective verification.

[0022] The present application transmits the output signal of one side of the driver chip to the other side through the connecting wire, so that the first driving wire and the second driving wire on both sides of the driver chip can normally drive the light-emitting structure of the display area to work, and analyze the failure mechanism. Therefore, there is no need to connect the external test circuit to the driving line on the failed side of the driver chip, which improves the convenience of failure analysis and avoids damage to the display panel during failure analysis. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0024] Figure 1 A schematic structural diagram of a display panel provided by the present invention in a first embodiment;

[0025] Figure 2 for Figure 1 Section view along AA;

[0026] Figure 3 A schematic structural diagram of a display panel provided by the present invention in a second embodiment;

[0027] Figure 4 for Figure 3 Sectional view along BB;

[0028] Figure 5 A schematic structural diagram of a display panel provided by the present invention in a third embodiment;

[0029] Figure 6 A schematic structural diagram of a display panel provided by the present invention in a sixth embodiment;

[0030] Figure 7 The present invention is a flowchart of an embodiment of a method for repairing a display panel provided by the present invention.

[0031] Description of Figure Numbers:

[0032] 10. Display area; 20. Non-display area; 21. Driver chip; 22. First driver line; 23. Second driver line; 24. Connecting line; 241. First connecting line; 242. Second connecting line; 25. Substrate; 26. Insulating layer; 27. Test pad.

[0033] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0034] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0035] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indication will also change accordingly.

[0036] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of the features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or solutions that satisfy both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0037] The invention provides a display panel.

[0038] Combination Figures 1 to 6 As shown, in one embodiment of the present invention, the display panel includes a display area 10 and a non-display area 20; the non-display area 20 is arranged around the periphery of the display area 10, and a driving chip 21, a first driving line 22, a second driving line 23 and a connecting line 24 are arranged in the non-display area 20;

[0039] The first driving line 22 and the second driving line 23 are respectively located on both sides of the driving chip 21 and are electrically connected to the driving chip 21. At least a portion of the connecting line 24 is located at a different layer from the first driving line 22 and the second driving line 23 in the non-display area 20, and their projections on the surface of the non-display area 20 at least partially overlap.

[0040] In this embodiment, the driver chip 21 of the non-display area 20 adopts a highly integrated design, and its output pin transmits the driving signal to the left and right sides of the display area 10 respectively through the first driving line 22 and the second driving line 23. The driver chip 21 adopts FC (Flip Chip) or BGA (Ball Grid Array) packaging technology, and is directly connected to the substrate 25 of the non-display area 20 through the Bump. This packaging method can reduce the connection length between the chip and the substrate 25, improve the signal transmission speed, and reduce the electromagnetic interference during the signal transmission process, which is particularly suitable for the design of display panels with high resolution and high refresh rate.

[0041] The design of the connecting line 24 provides an additional electrical connection for the display area 10. When a break or short circuit occurs at the solder joint where the driver chip 21 is connected to the first driver line 22 or the second driver line 23, the connecting line 24 can be used as a backup path to ensure normal transmission of signals on both sides of the display area 10.

[0042] The shape of the connection line 24 can be a single-segment straight line, a multi-segment straight line or a curved line, and its width and length are designed according to the size of the non-display area 20 and the distance between the first driving line 22 and the second driving line 23. The connection line 24 is arranged in the non-display area 20, and while ensuring the signal transmission efficiency, it can avoid the connection line 24 occupying the light emitting area of ​​the display area 10. The material of the connection line 24 is copper, silver, ITO (indium tin oxide) or other metals or alloys, which have good electrical conductivity, high mechanical strength and corrosion resistance, can effectively reduce the resistance loss in the signal transmission process, and at the same time improve the service life of the connection line 24.

[0043] At least part of the connecting line 24 is located in a different layer from the first driving line 22 and the second driving line 23. In the non-display area 20, the first driving line 22 and the second driving line 23 are located in the same metal layer and are formed on the surface of the substrate 25 by a deposition process. The connecting line 24 is arranged on the side of the first driving line 22 and the second driving line 23 away from the substrate 25, or part of the line segment is arranged on the side of the first driving line 22 and the second driving line 23 away from the substrate 25, and in this interlayer structure design, the insulating layer 26 is used to isolate the lines of each layer to prevent signal interference and short circuit, so that in normal state, the signal of the first driving line 22 cannot be transmitted to the second driving line 23 through the connecting line 24, so as to keep the driving signals on both sides of the display area 10 isolated. The material of the insulating layer 26 is an organic or inorganic insulating material such as polyimide (PI) and silicon oxide (SiO2), which has good insulating properties.

[0044] At the same time, since the connecting line 24 at least partially overlaps with the projection of the first driving line 22 and the second driving line 23 on the surface of the non-display area 20, when the pin on one side of the driving chip 21 fails, the connecting line 24 can be electrically connected to the area where the projection of the first driving line 22 and the second driving line 23 on the surface of the non-display area 20 overlaps through laser laser or countersinking technology, thereby realizing the transmission of the signal on the other side of the driving chip 21 to the second driving line 23 through the first driving line 22 and the connecting line 24, or the transmission to the first driving line 22 through the second driving line 23 and the connecting line 24, so as to ensure the normal display of the display area 10 and improve the yield of the product.

[0045] At the same time, when performing failure analysis, when the output pin on one side of the driver chip 21 fails, causing the output signal to be abnormal, it is necessary to connect the normal signal on the other side of the driver chip 21 to the drive circuit on the failed side through an external test circuit to verify the failure mechanism. Since the pin solder joints of the driver chip 21 are small, other circuits of the panel and the driver chip 21 are often damaged when the external test circuit is connected, resulting in the inability to perform effective verification. The present application transmits the output signal on one side of the driver chip 21 to the other side through the connecting wire 24, so that the first driving wire 22 and the second driving wire 23 on both sides of the driver chip 21 can normally drive the light-emitting structure of the display area 10 to work, and analyze the failure mechanism. Therefore, there is no need to connect the external test circuit to the drive circuit on the failed side of the driver chip 21, which improves the convenience of failure analysis and avoids damage to the display panel during failure analysis.

[0046] In addition, test pads 27 are respectively provided on the first driving line 22 and the second driving line 23. When performing solder joint repair and solder joint failure analysis verification, after connecting the connecting line 24 to the first driving line 22 and the second driving line 23, a test device can be used to use the test pads 27 as a point position to test whether the signal transmission of the first driving line 22 and the second driving line 23 is normal.

[0047] In summary, this embodiment improves the interlayer structure and connection method of the connecting line 24, the first driving line 22 and the second driving line 23, which facilitates repair when the solder joint of the driving chip 21 fails, improves the product yield of the display panel, and also improves the convenience of failure analysis.

[0048] The display panel can be a liquid crystal display panel (LCD), an organic light emitting diode panel (OLED) or other types of panels. It can be understood that the present application proposes an inventive concept for solving the display abnormality of the display area 10 caused by the failure of the solder joint of the driver chip 21, which can be applied to any of the above-mentioned display panel structures. In the Head-to-Head type display panel using the GDL (Gate Driver Less) driving architecture, the output signals on the left and right sides of the driver chip 21 are consistent. Therefore, the technical solution of the present application is applied to the Head-to-Head type display panel. Since the output signals on both sides of the driver chip 21 are consistent, after the first drive line 22 and the second drive line 23 are connected by the connecting line 24, the drive signals transmitted to both sides of the display area 10 remain consistent, which can effectively repair the display effect of the display area 10.

[0049] In order to better illustrate the inventive concept of the present application, the present application further provides the following six embodiments to facilitate a better understanding of the connection structure between the connecting wire 24 and the first driving wire 22 and the second driving wire 23 .

[0050] First embodiment:

[0051] Combination Figure 1 and Figure 2 As shown, in one embodiment of the present invention, the connecting line 24 includes a first connecting line 241, and the first connecting line 241 and the first driving line 22 and the second driving line 23 are located in different layers in the display area 10, and the two ends of the first connecting line 241 coincide with the projections of the first driving line 22 and the second driving line 23 on the surface of the non-display area 20 respectively.

[0052] In this embodiment, the first driving line 22 and the second driving line 23 are respectively located on opposite sides of the display area 10, and the driving chip 21 is located on the other side of the display and between the first driving line 22 and the second driving line 23, so as to be connected to the first driving line 22 and the second driving line 23. The first connecting line 241 and the driving chip 21 can be arranged on the same side of the display area 10, or they can be arranged on opposite sides of the display area 10. The shape of the first connecting line 241 can be straight or curved. Figure 1 As shown, in this embodiment, the first connection line 241 is a straight line, and both ends extend to the first driving line 22 and the second driving line 23 away from the driving chip 21 .

[0053] The first connection line 241 and the first driving line 22 and the second driving line 23 are located in different layers. Figure 2 As shown, the first driving line 22 and the second driving line 23 are located on the surface of the substrate 25, the first connecting line 241 is located on a layer of the first driving line 22 and the second driving line 23 away from the substrate 25, and an insulating layer 26 is provided between the first connecting line 241 and the first driving line 22 and the second driving line 23 to isolate the lines of each layer and prevent signal interference and short circuit. The two ends of the first connecting line 241 overlap with the projections of the first driving line 22 and the second driving line 23 on the surface of the non-display area 20, so when repairing the solder joints of the driver chip 21 and analyzing the solder joint failure, the overlapped portions of the first connecting line 241 and the projections of the first driving line 22 and the second driving line 23 on the surface of the non-display area 20 can be melted and connected together by laser processing, thereby forming a stable electrical path.

[0054] Second embodiment:

[0055] Combination Figure 3 and Figure 4 As shown, in one embodiment of the present invention, the connecting line 24 includes a second connecting line 242 and two first connecting lines 241. The second connecting line 242 and the first driving line 22 and the second driving line 23 are located in the same layer in the display area 10 and are arranged at intervals. The two first connecting lines 241 and the second connecting member are located in different layers in the display area 10. One end of the first connecting line 241 coincides with the projection of the first driving line 22 or the second driving line 23 on the surface of the non-display area 20, and the other end coincides with the projection of the second connecting line 242 on the surface of the non-display area 20.

[0056] In this embodiment, the second connection line 242 is arranged in the same layer as the first driving line 22 and the second driving line 23, so the first driving line 22, the second driving line 23 and the second connection line 242 can be formed at one time on the surface of the substrate 25 through a deposition and etching process, thereby simplifying the process and improving the processing efficiency. The second connection line 242 is arranged between the first driving line 22 and the second driving line 23 to avoid signal interference.

[0057] The connection line 24 is configured to include a second connection line 242 and two first connection lines 241. Compared with the solution of only providing the first connection line 241 in the first embodiment, the length of the first connection line 241 and the second connection line 242 can be reduced in this embodiment to prevent the larger impedance generated by the longer metal line from affecting the signal transmission of the driving line. At the same time, the longer metal line will increase the risk of charge accumulation, so by providing the first connection line 241 and the second connection line 242, the risk of easily inducing ESD (Electrostatic Discharge) by using a single-segment connection line 24 can be reduced.

[0058] Further, such as Figure 3 As shown, the length of the second connecting line 242 on the same layer as the first driving line 22 and the second driving line 23 is designed to be longer, while the length of the first connecting line 241 on a different layer is designed to be shorter, so as to reduce the processing time of the first connecting line 241 on a different layer, thereby improving the overall processing efficiency of the display panel, and also avoiding the generation of a large electric field between two metal layers on different layers, thereby reducing the influence of the connecting line 24 on the driving signal as much as possible.

[0059] One end of the first connecting line 241 overlaps with the projection of the first driving line 22 or the second driving line 23 on the surface of the non-display area 20, and the other end overlaps with the projection of the second connecting line 242 on the surface of the non-display area 20. Therefore, when repairing the solder joints of the driving chip 21 and analyzing solder joint failures, the overlapped portion of the first connecting line 241 and the first driving line 22 or the second driving line 23 on the surface of the non-display area 20, and the overlapped portion of the first connecting line 241 and the second connecting line 242 on the surface of the non-display area 20 can be melted and connected together by a laser process, thereby forming a stable electrical path.

[0060] Third embodiment:

[0061] Combination Figure 5As shown, in one embodiment of the present invention, the connecting line 24 includes a first connecting line 241 and two second connecting lines 242, the two second connecting lines 242 are respectively connected to the first driving line 22 and the second driving line 23, the two second connecting lines 242 are arranged at intervals, the first connecting line 241 and the second connecting line 242 are located in different layers in the non-display area 20, and the two ends of the first connecting line 241 coincide with the projections of the two second connecting lines 242 on the surface of the non-display area 20.

[0062] In this embodiment, the connecting line 24 includes a first connecting line 241 and two second connecting lines 242. Compared with a single-segment line, this multi-segment line structural design can reduce the risk of ESD and the influence of metal routing on the driving signal. Please refer to the introduction of the above embodiment for details, and no further elaboration will be made here.

[0063] The first connection line 241 is located between the two second connection lines 242. Since the first connection line 241 is located at a different layer than the second connection line 242, the first driving line 22, and the second driving line 23, the length of the first connection line 241 is designed to be shorter. At the same time, the second connection line 242 is set into two and is located at both ends of the first connection line 241, which further reduces the length of the second connection line 242, thereby further reducing the risk of ESD and the influence of metal wiring on the driving signal.

[0064] In addition, in the present embodiment, the ends of the two second connection lines 242 facing away from the first connection line 241 are connected to the first driving line 22 and the second driving line 23 respectively. Therefore, when repairing the solder joints of the driving chip 21 and analyzing the solder joint failure, it is only necessary to fuse and connect the overlapping portions of the first connection line 241 and the second connection line 242 on the surface of the non-display area 20, thereby improving the repair efficiency.

[0065] Fourth embodiment:

[0066] In one embodiment of the present invention, the connecting line 24 includes a first connecting line 241 and a second connecting line 242. The first connecting line 241 and the second connecting line 242 are located at different layers in the display area 10 relative to the first driving line 22 and the second driving line 23. One end of the first connecting line 241 coincides with the projection of the first driving line 22 on the surface of the non-display area 20, and the other end coincides with the projection of the second connecting line 242 on the surface of the non-display area 20. One end of the second connecting line 242 relative to the first connecting line 241 coincides with the projection of the second driving line 23 on the surface of the non-display area 20.

[0067] This embodiment is Figure 5In another implementation scheme relative to the third embodiment, in this embodiment, the second connection line 242 and the first driving line 22 and the second driving line 23 are also in different layers, that is, the first connection line 241, the second connection line 242 and the first driving line 22 are respectively located in different metal wiring layers. Since the second connection line 242 is not connected to the first driving line 22 or the second driving line 23 in the unrepaired state, the wiring lengths of the first driving line 22 and the second driving line 23 can be reduced, thereby reducing the risk of ESD and the influence of the metal wiring on the driving signal.

[0068] Fifth embodiment:

[0069] Combination Figure 1 , Figure 3 and Figure 5 As shown, in one embodiment of the present invention, the connecting wire 24 and the driving chip 21 are respectively located on two opposite sides of the display area 10 .

[0070] In this embodiment, the connecting wire 24 and the driving chip 21 are respectively arranged on opposite sides of the display area 10, that is, in the non-display area 20, and the driving chip 21, the first driving wire 22, the connecting wire 24 and the second driving wire 23 are respectively arranged on the four sides of the annular non-display area 20, and enclose the display area 10. This position design can effectively utilize the space of the non-display area 20, facilitate the routing layout of the connecting wire 24, improve the convenience of processing the connecting wire 24 and connecting the connecting wire 24 with the first driving wire 22 and the second driving wire 23, and avoid damage to other circuits or components.

[0071] Sixth embodiment:

[0072] Combination Figure 6 As shown, in one embodiment of the present invention, the connecting wire 24 and the driving chip 21 are respectively located on the same side of the display area 10 .

[0073] In this embodiment, the connecting wire 24 and the driving chip 21 are arranged on the same side of the display area 10. Figure 6 As shown, the two ends of the connecting wire 24 are respectively connected to the first driving wire 22 and the second driving wire 23 near the end of the driving chip 21, so the length of the connecting wire 24 can be effectively reduced, and the risk of ESD and the influence of the metal wiring on the driving signal can be reduced. At the same time, since the two ends of the connecting wire 24 are close to the output pins of the driving chip 21, when performing solder joint repair and failure analysis verification, after connecting the two ends of the connecting wire 24 with the first driving wire 22 and the second driving wire 23, the signal on one side of the driving chip 21 is transmitted to the other side through the connecting wire 24. Since the length of the connecting wire 24 is short, the input driving signals on both sides of the display area 10 can be kept consistent as much as possible to ensure the display effect of the display area 10.

[0074] Combination Figure 1 , Figure 3 , Figure 5 as well as Figure 6 As shown, in one embodiment of the present invention, the non-display area 20 includes a plurality of first driving lines 22, a plurality of second driving lines 23 and a plurality of connecting lines 24. The plurality of first driving lines 22 and the plurality of second driving lines 23 are symmetrically arranged on both sides of the display area 10, and each connecting line 24 at least partially overlaps with the projection of a first driving line 22 and a second driving line 23 on the surface of the non-display area 20.

[0075] In this embodiment, the number of the first driving lines 22 is the same as the number of the second driving lines 23, and they are symmetrically distributed on both sides of the display area 10, and are respectively connected to the output pins on both sides of the driving chip 21. The output signals on both sides of the driving chip 21 are symmetrical, so when the solder joint of the output pin on one side of the driving signal fails, the driving line connected to the solder joint is first determined, and the two ends of the corresponding connecting line 24 are respectively connected to the first driving line 22 and the second driving line 23, so that the solder joint can be repaired and the failure analysis verification can be performed. The connection structure of each connecting line 24 and the first driving line 22 and the second driving line 23 can refer to the introduction of the above embodiment, and no further description is made here.

[0076] The present invention also provides a display device, which includes a backlight module and a display panel. The specific structure of the display panel refers to the above embodiment. Since the display device adopts all the technical solutions of all the above display panel embodiments, it at least has all the beneficial effects brought by the technical solutions of the above embodiments, which will not be described one by one here. Among them, the backlight module is arranged opposite to the display panel, and the backlight module provides a display light source to the display panel.

[0077] In this embodiment, the display device includes but is not limited to a smart phone, a tablet computer, a laptop computer, a television, etc. By setting the connection line 24 as a backup line in the display panel, a higher redundancy is provided for the display device. Even if a solder joint or line of the driver chip 21 fails, the first drive line 22 and the second drive line 23 can be connected through the connection line 24 to ensure the normal transmission of signals on both sides of the display area 10, ensure the normal operation of the display device, and significantly improve the reliability and service life of the display device.

[0078] The present invention also provides a method for repairing a display panel. The specific structure of the display panel refers to the above embodiment. Figure 7 As shown, the repair method includes the steps of:

[0079] S100: lighting up the display panel, determining the position of the failed solder joint of the driver chip 21, and the first driving line 22 or the second driving line 23 connected to the failed solder joint;

[0080] S200 : penetrating and fusing the overlapping portions of the connection line 24 and the projections of the first driving line 22 and the second driving line 23 on the surface of the non-display area 20 by laser, so as to electrically connect the connection line 24 to the first driving line 22 and the second driving line 23 .

[0081] In this embodiment, first, the display panel is turned on, and the display effect of the test display panel is observed by the detection tool to determine the position of the failed solder joint of the driver chip 21. The failed solder joint may cause some pixels to fail to display normally, which appears as dark spots or bright spots. The detection tool can accurately locate the pin of the driver chip 21 where the failed solder joint is located, and the first drive line 22 or the second drive line 23 connected to the pin.

[0082] In the non-display area 20, according to the design of the display panel, find the first driving line 22 or the second driving line 23 connected to the failed solder joint. At the same time, check the state of the connecting line 24 to ensure that the connecting line 24 itself is not damaged. The design of the connecting line 24 (such as the first connecting line 241 and the second connecting line 242) provides a backup path for repair, and its two ends overlap with the projections of the first driving line 22 and the second driving line 23 on the surface of the non-display area 20, respectively.

[0083] Use laser welding or through-hole technology to electrically connect the two ends of the connecting line 24 to the first driving line 22 and the second driving line 23 respectively. After the connection is completed, light up the display panel again and check the display effect after repair through the detection tool. If the display anomaly caused by the failed solder joint is resolved, it means that the repair is successful. If there is still a problem, it may be necessary to further check the status of the connecting line 24 or the driving line and make adjustments.

[0084] The specific steps of electrically connecting the connecting wire 24 with the first driving wire 22 and the second driving wire 23 by laser welding are as follows:

[0085] Use high-purity alcohol or special cleaning agents to clean the welding area and remove the oxide layer and impurities on the surface. Use high-precision positioning equipment (such as a laser alignment system) to ensure that the welding points of the connecting wire 24 and the driving wire are aligned. Use a high-energy laser beam to penetrate the overlapping portion of the projection of the connecting wire 24 and the first driving wire 22 and the second driving wire 23 on the surface of the non-display area 20. The energy of the laser beam melts and connects the overlapping portions of the connecting wire 24 and the first driving wire 22 and the second driving wire 23 to form a good electrical connection. Laser welding has the characteristics of high precision and low heat-affected zone, which can effectively avoid damage to surrounding circuits. After laser welding is completed, use a microscope to check the quality of the welding point to ensure that there are no cold joints, short circuits, etc. at the welding point.

[0086] In other embodiments, the through-hole technology may be used to penetrate the overlapping portion of the connecting wire 24 and the first driving wire 22 and the second driving wire 23, and then copper or other conductive metals may be deposited on the inner wall of the through-hole to achieve electrical connection.

[0087] The above description is only an exemplary embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the technical concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A display panel, characterized in that: The display panel comprises: display area; and A non-display area, the non-display area is arranged around the periphery of the display area, and a driving chip, a first driving line, a second driving line and a connecting line are arranged in the non-display area; The first driving line and the second driving line are respectively located on both sides of the driving chip and are electrically connected to the driving chip. At least a portion of the connecting line is located at a different layer from the first driving line and the second driving line in the non-display area, and their projections on the surface of the non-display area at least partially overlap.

2. The display panel according to claim 1, wherein: The connecting line includes a first connecting line, the first connecting line and the second driving line are located in different layers in the display area, and two ends of the first connecting line respectively overlap with projections of the first driving line and the second driving line on the surface of the non-display area.

3. The display panel according to claim 1, wherein: The connecting wires include a second connecting wire and two first connecting wires, the second connecting wire and the first driving wire are located in the same layer in the display area and are arranged at intervals, the two first connecting wires and the second connecting wire are located in different layers in the display area, one end of the first connecting wire coincides with the projection of the first driving line or the second driving line on the surface of the non-display area, and the other end coincides with the projection of the second connecting wire on the surface of the non-display area.

4. The display panel according to claim 1, wherein: The connecting lines include a first connecting line and two second connecting lines, the two second connecting lines are respectively connected to the first driving line and the second driving line, the two second connecting lines are arranged at intervals, the first connecting line and the second connecting line are located in different layers in the non-display area, and two ends of the first connecting line respectively coincide with projections of the two second connecting lines on the surface of the non-display area.

5. The display panel according to claim 1, wherein: The connecting wires include a first connecting wire and a second connecting wire, the first connecting wire and the second connecting wire are located at different layers in the display area relative to the first driving wire and the second driving wire, one end of the first connecting wire coincides with a projection of the first driving wire on the surface of the non-display area, and the other end of the first connecting wire coincides with a projection of the second connecting wire on the surface of the non-display area, and one end of the second connecting wire relative to the first connecting wire coincides with a projection of the second driving line on the surface of the non-display area.

6. The display panel according to any one of claims 1 to 5, characterized in that: The connecting wires and the driving chip are respectively located on two opposite sides of the display area.

7. The display panel according to any one of claims 1 to 5, characterized in that: The connecting wires and the driving chip are respectively located on the same side of the display area.

8. The display panel according to any one of claims 1 to 5, characterized in that: A plurality of the first driving lines, a plurality of the second driving lines, and a plurality of the connecting lines are provided in the non-display area. The plurality of the first driving lines and the plurality of the second driving lines are symmetrically arranged on both sides of the display area, and each of the connecting lines at least partially overlaps with the projections of a first driving line and a second driving line on the surface of the non-display area.

9. A display device, characterized in that: The display device comprises a backlight module and a display panel as claimed in any one of claims 1 to 8; the backlight module is arranged opposite to the display panel, and the backlight module provides a display light source to the display panel.

10. A method for repairing a display panel according to any one of claims 1 to 8, characterized in that: The repair method comprises the steps of: Lighting up the display panel, determining the position of the failed solder joint of the driver chip, and the first driving line or the second driving line connected to the failed solder joint; The connecting line is penetrated and fused with the overlapping portions of the projections of the first driving line and the second driving line on the surface of the non-display area by laser, so as to electrically connect the connecting line to the first driving line and the second driving line.

Images