Cleaning barrel for chip and assembling method of cleaning barrel

Abstract

The invention discloses a chip cleaning barrel and an assembling method thereof.The chip cleaning barrel specifically comprises an outer barrel, an inner barrel, a lifting assembly, an air blowing assembly, a dust collection assembly and a barrel cover, the inner barrel is arranged in the outer barrel through the lifting assembly, and the barrel cover is connected to the outer barrel in a covering mode; the inner cylinder is formed by vertically enclosing a plurality of groups of mounting plates, mounting grooves are formed in the mounting plates, the mounting grooves are vertically arranged, the upper end parts of the mounting grooves are opened, the chips are clamped in the mounting grooves, and sliding plates are slidably mounted on the mounting plates and are used for fixing the chips in the mounting grooves. The mounting plate is vertically arranged, the chips are placed in the mounting grooves, multiple sets of chips can be placed in one set of mounting grooves, large-scale cleaning of the chips is achieved, meanwhile, the sliding plate is arranged, the chips are fixed to the mounting plate, the probability that the chips are damaged in the cleaning process is reduced, and under the action of the lifting assembly, the chips can be conveniently cleaned. And the blowing assembly can uniformly act on each group of chips, so that the optimal cleaning effect of each group of chips is guaranteed.

Description

Technical Field

[0001] The invention relates to the technical field of chip cleaning equipment, and in particular to a chip cleaning bucket and an assembling method thereof. Background Art

[0002] During the semiconductor manufacturing process, contaminants and impurities on the chip surface can seriously affect the performance, reliability and yield of the device. Chip cleaning devices are equipment used to remove contaminants and impurities from the surface of semiconductor chips, and are widely used in electronic manufacturing, semiconductor processing and R&D laboratories. The cleaning process is carried out at multiple stages of chip production, including photolithography, etching, ion implantation and post-processing. It is suitable for various types of semiconductor materials and is intended to protect the quality and stability of semiconductor devices during transportation, storage and production.

[0003] The existing chip cleaning device is shown in the Chinese application with application number: 201711413510.1: Chip packaging material surface cleaning device, which includes a dust suction fan, a purge fan, and a purification box with multiple independent storage chambers; the dust suction fan inlet is connected to multiple dust removal pipes; the left outlet of the purge fan is connected to an air outlet pipe; the air outlet pipe is connected to multiple air inlet pipes; the left end opening of the air inlet pipe and the right end opening of the dust removal pipe respectively correspond to the independent cavities divided into by the isolation plate in the storage chamber, a pivot shaft is passed through the middle of the purification box, the pivot shaft is connected to the motor, and the motor drives the purification box to rotate around the pivot shaft.

[0004] The prior art has the following defects: in the above-mentioned chip cleaning device, in order to meet the cleaning needs of large quantities of chips, a plurality of independent purification boxes are arranged on the cleaning device, and the chip cleaning is achieved by the combined action of a purge fan and a dust suction fan on the purification box. At the same time, the purification box rotates during the cleaning process to enhance the cleaning force of the chip. During the rotation of the purification box, the chip shakes in the purification box, which can easily cause damage to the chip structure. At the same time, the purge fan cannot act evenly on the chip surface, resulting in poor effect of large-scale cleaning of the chip, so there is room for improvement. Summary of the invention

[0005] The object of the present invention is to provide a chip cleaning bucket and an assembly method thereof, so as to solve the technical problems that the chip structure is easily damaged and the cleaning effect is poor in the existing large-scale chip cleaning process.

[0006] To achieve this object, the present invention adopts the following technical solutions: A clean barrel for chips and an assembly method thereof, comprising an outer barrel, an inner barrel, a lifting assembly, a blowing assembly, a dust collecting assembly and a barrel cover, wherein the inner barrel is arranged in the outer barrel through the lifting assembly, and the barrel cover is connected to the outer barrel; the inner barrel is formed by vertically enclosing a plurality of groups of mounting plates, a mounting groove is arranged on the mounting plate, the mounting groove is vertically arranged and has an open upper end, a chip is clamped in the mounting groove, a sliding plate is slidably installed on the mounting plate, and the sliding plate is used to fix the chip in the mounting groove; the blowing assembly and the dust collecting assembly are arranged on the outer barrel, the blowing assembly acts on the chip, and the dust collecting assembly is used to absorb impurities on the outer barrel.

[0007] Optionally, the lifting assembly includes a central shaft and a movable block, the central shaft is rotatably mounted at the center of the inner bottom surface of the outer cylinder, the central shaft is driven to rotate by a driving assembly, the movable block is threadedly mounted on the central shaft, and a connecting shaft is provided between the movable block and the mounting plate.

[0008] Optionally, a flip assembly is provided between the connecting shaft and the sliding plate, the flip assembly includes a cylinder and a rotating block, the cylinder is provided on the connecting shaft, the telescopic end of the cylinder moves along the axial direction of the connecting shaft, the telescopic end of the cylinder is provided with a rack, the rotating block is fixed to the mounting plate and rotatably installed on the end of the connecting shaft, a toothed disc is provided on the circumferential surface of the rotating block, and the toothed disc is meshed with the rack.

[0009] Optionally, a limiting assembly is provided between the sliding plate and the mounting plate, and the limiting assembly includes a clamp, a spring and a limiting ball. The clamp is arranged on the top of the mounting plate through the spring, and the spring makes the clamp be in a clamping state. The limiting ball is arranged on the sliding plate, and the limiting ball is slidably arranged in the clamp.

[0010] Optionally, a through slot is provided on the mounting plate, and a rib plate is provided on the through slot for tension.

[0011] Optionally, a limiting plate is provided at the bottom of the sliding plate, and the limiting plate is used to remove the chip from the mounting groove.

[0012] Optionally, the blowing assembly includes a fan, a pipe and a nozzle, the pipe is used to connect the fan and the nozzle, a slot is provided on the outer cylinder, the nozzle is rotatably installed in the slot, a first nozzle is provided on the nozzle, and the jet direction of the first nozzle is perpendicular to the chip.

[0013] Optionally, the nozzle is further provided with a second nozzle, and the second nozzle is used to clean the back side of the chip.

[0014] Optionally, the bottom of the limiting plate is magnetically connected to the bottom of the mounting plate.

[0015] An assembly method for a clean barrel comprises the following steps in sequence: S1: Check to ensure the integrity of the outer cylinder, inner cylinder, lifting assembly, blowing assembly, dust collection assembly, barrel cover and other components; S2: Install the outer cylinder, place the outer cylinder on a flat workbench; S3: Install the blowing assembly and the dust collecting assembly on the outer cylinder; S4: Inner cylinder installation: install the central axis on the inner bottom surface of the outer cylinder, connect it with the driving assembly, and install the movable block on the central axis; S5: Adjust the cylinder parameters to make the mounting plate at a suitable angle; S6: Install the barrel cover and ensure that the barrel cover and the outer barrel are airtight.

[0016] Compared with the prior art, the present invention has the following beneficial effects: The present invention arranges the mounting plate vertically and places the chips in the mounting grooves. Multiple groups of chips can be placed in one group of mounting grooves, thereby realizing large-scale cleaning of chips. At the same time, a sliding plate is provided to fix the chips on the mounting plate, thereby preventing the blowing component from shaking the chips during operation and reducing the probability of chip damage during the cleaning process. In addition, the chips are vertically fixed on the mounting plate, and under the action of the lifting component, the blowing component can act evenly on each group of chips, thereby ensuring the best cleaning effect of each group of chips. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0018] The structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification so as to facilitate understanding and reading by persons familiar with this technology. They are not used to limit the conditions under which the present invention can be implemented, and therefore have no substantive technical significance. Any structural modification, change in proportion or adjustment of size, without affecting the effects and purposes that can be achieved by the present invention, should still fall within the scope of the technical contents disclosed by the present invention.

[0019] Figure 1 A schematic diagram of the overall structure of a clean barrel provided in an embodiment of the present invention; Figure 2 for Figure 1The enlarged view of point A in the middle; Figure 3 A schematic diagram of the overall structure of the inner cylinder of the clean barrel provided in an embodiment of the present invention; Figure 4 for Figure 3 The enlarged view of point B in the middle; Figure 5 A schematic diagram of the overall structure of the outer cylinder of the clean barrel provided by an embodiment of the present invention; Figure 6 for Figure 5 Enlarged view of point C in the middle.

[0020] Illustrations: 1. Outer cylinder; 2. Inner cylinder; 3. Lifting assembly; 31. Central axis; 32. Movable block; 4. Blowing assembly; 5. Dust collection assembly; 6. Barrel cover; 7. Mounting slot; 8. Mounting plate; 9. Connecting shaft; 10. Flipping assembly; 101. Cylinder; 102. Rotating block; 103. Rack; 104. Toothed disc; 11. Limiting assembly; 111. Hoop; 112. Spring; 113. Limiting ball; 12. Through slot; 13. Rib plate; 14. Limiting plate; 15. Nozzle; 151. First nozzle; 152. Second nozzle; 16. Chip; 17. Notch; 18. Sliding plate. DETAILED DESCRIPTION

[0021] In order to make the purpose, features and advantages of the present invention more obvious and easy to understand, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described below are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0022] In the description of the present invention, it should be understood that the terms "upper", "lower", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. It should be noted that when a component is considered to be "connected" to another component, it may be directly connected to the other component or there may be a centrally arranged component at the same time.

[0023] The technical solution of the present invention is further described below with reference to the accompanying drawings and through specific implementation methods.

[0024] Figure 1 A schematic diagram of the overall structure of a clean barrel provided in an embodiment of the present invention; Figure 2 for Figure 1The enlarged view of point A in the middle; Figure 3 A schematic diagram of the overall structure of the inner cylinder of the clean barrel provided in an embodiment of the present invention; Figure 4 for Figure 3 The enlarged view of point B in the middle; Figure 5 A schematic diagram of the overall structure of the outer cylinder of the clean barrel provided by an embodiment of the present invention; Figure 6 for Figure 5 Enlarged view of point C in the middle.

[0025] The chip cleaning bucket provided in this embodiment is used in the scenario of cleaning chips in large quantities. In this embodiment, the structure of the clean bucket is improved to improve the cleaning effect of the chips while cleaning in large quantities, and reduce chip damage caused during the cleaning process.

[0026] See also Figure 1-Figure 6 A clean barrel for a chip 16 provided in this embodiment includes an outer barrel 1, an inner barrel 2, a lifting assembly 3, a blowing assembly 4, a dust collecting assembly 5 and a barrel cover 6. The inner barrel 2 is arranged in the outer barrel 1 through the lifting assembly 3, and the barrel cover 6 is connected to the outer barrel 1; the inner barrel 2 is formed by vertically enclosing a plurality of groups of mounting plates 8, and a mounting groove 7 is arranged on the mounting plate 8. The mounting groove 7 is vertically arranged and has an open upper end. The chip 16 is clamped in the mounting groove 7, and a sliding plate 18 is slidably installed on the mounting plate 8. The sliding plate 18 is used to fix the chip 16 in the mounting groove 7; the blowing assembly 4 and the dust collecting assembly 5 are arranged on the outer barrel 1, the blowing assembly 4 acts on the chip 16, and the dust collecting assembly 5 is used to absorb impurities on the outer barrel 1.

[0027] Specifically, the barrel cover 6 is opened, the sliding plate 18 is placed in the mounting groove 7, and the chip 16 to be cleaned is placed in the mounting groove 7. After placement, the sliding plate 18 is clamped and fixed to the mounting plate 8; the driving component, the blowing component 4 and the dust collecting component 5 are started, and the mounting plate 8 rotates and slowly rises under the action of the lifting component 3. At this time, the blowing component 4 blows the chip 16 in the mounting groove 7, and the dust collecting component 5 absorbs the impurities on the chip 16 to achieve cleaning of the chip 16; by vertically arranging the mounting plate 8, the chip 16 is placed in the mounting groove 7, and a group of mounting grooves 7 are Multiple groups of chips 16 can be placed, and the inner cylinder 2 includes multiple groups of mounting plates 8, which realizes large-scale cleaning of the chips 16. At the same time, by providing a sliding plate 18, the chips 16 are fixed on the mounting plate 8, which prevents the blowing component 4 from causing the chips 16 to shake during operation. Compared with the prior art, the purification box is rotated for cleaning, which reduces the probability of damage to the chips 16 during the cleaning process; in addition, the chips 16 are vertically fixed on the mounting plate 8. Under the action of the lifting component 3, the blowing component 4 can act evenly on each group of chips 16, ensuring the best cleaning effect of each group of chips 16.

[0028] See also Figure 1-Figure 3Further, the lifting assembly 3 includes a central shaft 31 and a movable block 32. The central shaft 31 is rotatably mounted at the center of the inner bottom surface of the outer cylinder 1. The central shaft 31 is driven to rotate by the driving assembly. The movable block 32 is threadedly mounted on the central shaft 31. A connecting shaft 9 is provided between the movable block 32 and the mounting plate 8. Specifically, the central shaft 31 is fixed at the center of the bottom surface of the outer cylinder 1. The central shaft is driven by a driving assembly, such as an electric motor, to realize the central shaft. The movable block 32 is threadedly connected to the central shaft 31. The movable block 32 is driven to move up and down along the central shaft 31 by the rotation of the central shaft 31. The connecting shaft 9 links the movable block 32 and the mounting plate 8 to ensure that when the movable block 32 moves up and down, the mounting plate 8 can also be lifted and lowered accordingly. When the central shaft 31 rotates, the movable block 32 moves in the up and down direction, driving the mounting plate 8 and the chip 16 fixed on the mounting plate 8 to lift and lower, so that the gas blown out by the blowing assembly can evenly cover the surface of the chip 16, and evenly clean the surface of the chip 16, thereby ensuring the cleaning strength of the chips 16 at different positions.

[0029] See also Figure 1 and Figure 2 Furthermore, a flip assembly 10 is arranged between the connecting shaft 9 and the sliding plate 18, and the flip assembly 10 includes a cylinder 101 and a rotating block 102. The cylinder 101 is arranged on the connecting shaft 9, and the telescopic end of the cylinder 101 moves along the axial direction of the connecting shaft 9. The telescopic end of the cylinder 101 is provided with a rack 103. The rotating block 102 is fixed on the mounting plate 8 and rotatably installed on the end of the connecting shaft 9. A toothed disc 104 is arranged on the circumferential surface of the rotating block 102, and the toothed disc 104 is meshed with the rack 103. Specifically, after starting the driving assembly, the blowing assembly 4 and the dust collecting assembly 5, the cylinder 101 is in a compressed state. At this time, the plane where the mounting plate 8 is located is perpendicular to the connecting shaft 9, and the blowing direction of the blowing assembly is perpendicular to the plane where the mounting plate 8 is located. The gas acts evenly on the surface of the chip 16. At this time, the surface of the chip 16 to be cleaned is the first surface. After the first surface is cleaned, the cylinder 101 becomes a stretched state. The movement of the cylinder 101 drives the rack 103 to move forward. Since the toothed disc 104 is engaged with the rack 103, the rack 103 drives the toothed disc 104 to rotate. The toothed disc 104 is arranged on the rotating block 102 and the rotating block 102 is fixed to the mounting plate 8, thereby driving the mounting plate 8 to rotate. The mounting plate 8 rotates until its plane is parallel to the connecting shaft 9. At this time, the second surface of the chip 16 is exposed, and the blowing assembly 4 acts on the second surface of the chip 16. The second surface is the surface of the chip 16 arranged parallel to the first surface.

[0030] Among them, in the whole cleaning process, the first surface of the chip 16 is cleaned first. After the first surface is cleaned, the rack 103 drives the toothed disc 104 to rotate by adjusting the parameters of the cylinder 101, so that the mounting plate 8 is flipped to be parallel to the connecting shaft 9, so that the second surface of the chip 16 is exposed, ensuring that both sides of the chip 16 can be cleaned; by realizing the flipping of the chip 16, the cleaning of multiple surfaces can be completed in the same cleaning process, effectively reducing the potential contamination risk caused by uncleaned areas, and at the same time, reducing the complexity and time consumption of multiple manual operations.

[0031] See also Figure 3 and Figure 4 Furthermore, a limiting assembly 11 is arranged between the sliding plate 18 and the mounting plate 8. The limiting assembly 11 includes a clamp 111, a spring 112 and a limiting ball 113. The clamp 111 is arranged on the top of the mounting plate 8 through the spring 112. The spring 112 makes the clamp 111 in a clamping state. The limiting ball 113 is arranged on the sliding plate 18, and the limiting ball 113 is slidably arranged in the clamp 111. Specifically, after the chip 16 is placed, the sliding plate 18 is crimped onto the mounting plate 8. At this time, the spring 112 is compressed, and the clamp 111 opens under the action of the limiting ball 113. After the limiting ball 113 slides into the clamp 111, the spring 112 is reset, and the clamp 111 clamps the limiting ball 113 tightly to fix the sliding plate 18 to the upper end of the mounting plate 8; after the chip 16 is cleaned, the top of the sliding plate 18 is pulled out forcefully to separate the limiting ball 113 from the clamp 111. At this time, the sliding plate 18 can slide independently along the mounting plate 8, which is convenient for taking out the cleaned chip 16.

[0032] Among them, when the sliding plate 18 is crimped with the mounting plate 8, the spring 112 is compressed, and the clamp 111 opens under the guidance of the limiting ball 113, so that the limiting ball 113 slides into the clamp 111, the spring 112 resets, and the clamp 111 fixes the limiting ball 113, so that the sliding plate 18 is fixed on the mounting plate 8, ensuring that during the cleaning operation, the chip 16 is always in a fixed position and will not slide or shift due to rotation or other external factors; the stable clamping state can effectively prevent the chip 16 from shaking or moving during the cleaning process, thereby reducing the risk of damaging, scratching or contaminating the chip 16, and ensuring the cleaning quality and the integrity of the chip 16.

[0033] See also Figure 3 and Figure 4Furthermore, a through slot 12 is provided on the mounting plate 8, and a rib plate 13 is provided on the through slot 12. Specifically, the through slot 12 is provided to be connected with the mounting slot 7, and the chip 16 is placed in the mounting slot 7, wherein the second surface is in contact with the rib plate 13. Under the action of the flip assembly 10, the mounting plate 8 is flipped to expose the second surface of the chip 16, and the blowing assembly acts on the second surface of the chip 16 through the through slot 12, so that both the first surface and the second surface of the chip 16 are effectively cleaned. The setting of the through slot 12 provides a sufficiently unobstructed channel for the blowing assembly, so that the cleaning airflow can act on the second surface of the chip 16 smoothly and evenly. The airflow directly acts on the second surface of the chip 16 through the through slot 12, effectively removing pollutants and dust on the second surface, and achieving effective cleaning of the second surface.

[0034] See also Figure 3 , further, a limit plate 14 is provided at the bottom of the sliding plate 18, and the limit plate 14 is used to remove the chip 16 from the mounting groove 7. Specifically, the limit plate 14 is vertically arranged with the sliding plate 18, and when the chip 16 is placed, the chip 16 slides along the mounting groove 7 to the upper surface of the limit plate 14; after the chip 16 is placed, the bottom of the limit plate 14 abuts against the bottom of the mounting groove 7, ensuring that the chip 16 will not accidentally fall out during the cleaning process; after the cleaning is completed, the top of the sliding plate 18 is dragged, and at this time, the limit plate 14 drives the chip 16 to lift upward, which is convenient for removing the chip 16 after cleaning. At the same time, the use of the limit plate 14 can avoid direct contact between the hand and the surface of the chip 16 during the removal process, reducing the risk of secondary contamination and friction damage caused by improper operation, and ensuring the integrity and cleaning effect of the chip 16 after cleaning; more specifically, a limit block is provided at the bottom of the mounting groove 7, and the limit block abuts against the limit plate 14. The setting of the limit block prevents the limit plate 14 from sliding off the mounting groove 7.

[0035] See also Figure 5 and Figure 6 , further, the blowing assembly 4 includes a fan, a pipe and a nozzle 15, the pipe is used to connect the fan and the nozzle 15, a slot 17 is provided on the outer cylinder 1, the nozzle 15 is rotatably installed in the slot 17, and a first nozzle 151 is provided on the nozzle 15, and the jet direction of the first nozzle 151 is perpendicular to the chip 16. Specifically, when cleaning the first surface of the chip 16, the first nozzle 151 is perpendicular to the plane where the chip 16 is located, and the first nozzle 151 acts evenly on the first surface of the chip 16, so that the chips 16 at different positions receive the same amount of cleaning airflow, effectively removing dust and dirt on the first surface of the chip 16, improving the overall cleaning effect of the first surface, and reducing the potential pollution risk caused by local uncleaning. Among them, the rotation of the nozzle 15 in the slot 17 is controlled by an electric motor or a pneumatic component to ensure that the airflow is always applied to the optimal cleaning angle of the chip 16.

[0036] See also Figure 5 and Figure 6 Furthermore, the nozzle 15 is also provided with a second nozzle 152, which is used to clean the back of the chip 16. Specifically, after the first surface is cleaned, the flip assembly 10 drives the mounting plate 8 to rotate, so that the second surface of the chip 16 is exposed. At this time, the electric motor or pneumatic assembly controls the nozzle 15 to rotate in the slot 17. When the first nozzle 151 is completely rotated into the slot 17, the first nozzle 151 is closed in the slot 17, and the cleaning airflow is ejected from the second nozzle 152, and the second nozzle 152 uniformly sprays the cleaning airflow to the second surface of the chip 16; at the same time, the angle of the nozzle 15 can be adjusted, and the first nozzle 151 and the second nozzle 152 can be flexibly adjusted to different angles, thereby ensuring that even in the complex shape or design of the chip 16, all areas can be fully cleaned, further preventing dead corner pollution.

[0037] Furthermore, the bottom of the limiting plate 14 is magnetically connected to the bottom of the mounting plate 8. After the chip 16 is placed, the sliding plate 18 is pressed down along the mounting groove 7, and the bottom of the limiting plate 14 is magnetically connected to the bottom of the mounting plate 8, which ensures the installation stability of the limiting plate 14 and the mounting plate 8, ensures that the limiting plate 14 will not be separated from the mounting plate 8 due to rotation during the cleaning process, ensures the position stability of the chip 16 during the cleaning process, and at the same time, ensures that the chip 16 is always in the correct cleaning position during cleaning, ensuring that each part of the chip 16 can evenly receive the required cleaning airflow.

[0038] An assembly method for a clean barrel comprises the following steps in sequence: S1: Check to ensure the integrity of the outer cylinder 1, inner cylinder 2, lifting assembly 3, blowing assembly 4, dust collection assembly 5, barrel cover 6 and other components; check whether the surface of the outer cylinder 1 is intact and ensure that there are no scratches, cracks or other defects; confirm that the shape and size of the inner cylinder 2 match the outer cylinder 1, and check whether its surface is smooth and has no defects; check the smooth operation of the lifting assembly and whether there is any jamming, and ensure that the motor and cylinder 101 are not damaged; check whether the fan, pipeline and nozzle 15 are intact and ensure that the direction adjustment function of the nozzle 15 is normal; check whether the vacuum cleaner and its pipeline are intact and whether the connection interfaces are tight; ensure that the barrel cover 6 and the sealing ring are well assembled and there is no leakage or deformation.

[0039] S2: Install the outer cylinder 1 and place the outer cylinder 1 on a flat workbench; Place the outer cylinder 1 on a clean, flat workbench and ensure that the working environment is free of dust and debris to avoid affecting the assembly quality.

[0040] S3: Install the blowing assembly 4 and the dust collecting assembly 5 on the outer tube 1; confirm the specific positions of the blowing assembly 4 and the dust collecting assembly 5 according to the mounting holes and marks designed on the outer tube 1; S4: The inner cylinder 2 is installed, the central shaft 31 is installed on the inner bottom surface of the outer cylinder 1, and connected with the driving assembly, and the movable block 32 is installed on the central shaft 31; the central shaft 31 is installed on the bottom surface of the outer cylinder 1 to ensure the correct positioning of the shaft; according to the design requirements, the central shaft 31 is connected with the driving assembly using appropriate tools and accessories to ensure a firm connection; the driving assembly can be a motor, and the movable block 32 is installed on the central shaft 31 to ensure that it can rotate or move freely; S5: Adjust the parameters of the cylinder 101 so that the mounting plate 8 is at a suitable angle; ensure that the cylinder 101 is accurately connected to the mounting plate 8; S6: Install the barrel cover 6 to ensure that the barrel cover 6 and the outer tube 1 are airtight; after cleaning, align the barrel cover 6 with the top of the outer tube 1 to ensure that the sealing ring evenly covers the opening of the outer tube 1.

[0041] In one embodiment, each group of nozzles 15 is provided with a corresponding sensor assembly, and the sensor assembly is used to detect the position of the circuit device on the chip 16. The cleaning method of the chip 16 using a clean bucket includes the following steps: S001: Cleaning the first surface of the chip 16, the driving assembly is started, the driving assembly drives the mounting plate 8 to move in a small range in the vertical direction, and the first nozzle 151 cleans the first surface of the chip 16; Specifically, at the beginning of cleaning, the driving assembly is started to make the mounting plate 8 move in a small range in the vertical direction. The first nozzle 151 cleans the area where the circuit components are not detected, so that the nozzle 15 can perform a more comprehensive cleaning on the surface of the chip 16 to ensure the cleaning intensity of the chip 16. At the same time, the small range movement of the chip 16 avoids excessive cleaning of a certain position by the first nozzle 151.

[0042] S110: The sensor detects the circuit components on the first surface, and the first nozzle 151 and the second nozzle 152 clean the first surface alternately for the part where the circuit components are arranged; Specifically, the sensor detects the circuit device on the first surface. When the circuit device reaches the area where the first nozzle 151 and the second nozzle 152 are located, the first nozzle 151 and the second nozzle 152 are used to clean the area where the circuit device is provided alternately. The sensor includes but is not limited to a visual sensor, a laser sensor, and an infrared sensor, which is used to detect whether the circuit device reaches the area where the first nozzle 151 and the second nozzle 152 are located. The focus of this embodiment is on detecting the position of the circuit device. The detection means are known to those skilled in the art and are not limited in this embodiment.

[0043] More specifically, the sensor assembly is used to detect the position of the circuit device on the chip 16. For the part where the circuit device is provided, the first nozzle 151 and the second nozzle 152 are used for alternating cleaning to reduce direct airflow interference with the circuit device, thereby avoiding possible damage to the chip 16; using the alternating working mode of the two nozzles, the distance between the nozzle and the surface of the circuit device during cleaning can be effectively adjusted to reduce the risk of damage caused by concentrated airflow from the nozzle, and ensure that the nozzle will not continue to spray when approaching the surface of the circuit device, thereby protecting its sensitive structure and ensuring the yield of the chip 16 after cleaning; the direction of the second nozzle 152 is at a certain angle to the surface of the chip 16, which can allow the airflow to effectively blow away the connection between the circuit device and the chip 16, ensuring that the cleaning agent can penetrate into the gap between the circuit device and the chip 16 to completely remove potential contaminants.

[0044] Exemplarily, when the plane where the mounting plate 8 is located is perpendicular to the connecting axis 9, the mounting plate 8 moves in the vertical direction. At the first position, the sensor assembly does not detect that the circuit device on the chip 16 reaches the position of the nozzle 15, and the first nozzle 151 is started to clean the chip 16; At the second position, the sensor assembly detects that the circuit device on the chip 16 reaches the position of the nozzle 15, and the first nozzle 151 and the second nozzle 152 operate alternately to clean the portion of the chip 16 where the circuit device is disposed; Among them, the first position is the position where the sensor component does not detect that the circuit device has reached the nozzle 15, and the second position is the position where the sensor component detects that the circuit device has reached the nozzle 15. By partitioning the cleaning of areas where circuit devices are provided and areas where circuit devices are not provided, the cleaning intensity of the chip 16 is ensured while reducing the damage to the chip 16 during the cleaning process, thereby improving the yield rate of the cleaning of the chip 16.

[0045] S002: Cleaning the surface where the chip 16 and the sliding plate 18 are in contact, the flip assembly 10 is started to rotate the mounting plate 8 within a range of 0-30 degrees, and the second nozzle 152 cleans the surface where the chip 16 and the sliding plate 18 are in contact; Specifically, by rotating the mounting plate 8 by 0-30 degrees, the surface of the chip 16 abutting against the sliding plate 18 is exposed to the second nozzle 152, so that the nozzle can directly apply airflow to the surface, effectively removing the hard-to-reach dirt and improving the cleaning effect.

[0046] S003 : Cleaning the second surface of the chip 16 , the flip assembly 10 is started to rotate the mounting plate 8 to 90 degrees, and the second nozzle 152 cleans the second surface of the chip 16 .

[0047] In summary, the cleaning bucket for chips 16 provided in this embodiment has the advantages of being able to clean chips 16 in large quantities, having a good cleaning effect on the chips 16, and having little damage to the chips 16 during the cleaning process.

[0048] As described above, the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features thereof may be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A clean barrel for chips, characterized in that: It includes an outer cylinder, an inner cylinder, a lifting assembly, a blowing assembly, a dust collecting assembly and a barrel cover, wherein the inner cylinder is arranged in the outer cylinder through the lifting assembly, and the barrel cover is connected to the outer cylinder; The inner cylinder is formed by vertically enclosing a plurality of mounting plates, wherein the mounting plates are provided with mounting grooves, which are vertically arranged and open at the upper end, and the chip is clamped in the mounting grooves, and a sliding plate is slidably installed on the mounting plates, and the sliding plate is used to fix the chip in the mounting grooves; The blowing component and the dust collecting component are arranged on the outer cylinder, the blowing component acts on the chip, and the dust collecting component is used to absorb impurities on the outer cylinder.

2. A chip cleaning barrel according to claim 1, characterized in that: The lifting assembly includes a central shaft and a movable block. The central shaft is rotatably mounted at the center of the inner bottom surface of the outer cylinder. The central shaft is driven to rotate by a driving assembly. The movable block is threadedly mounted on the central shaft. A connecting shaft is provided between the movable block and the mounting plate.

3. A chip cleaning barrel according to claim 2, characterized in that: A flip assembly is arranged between the connecting shaft and the sliding plate, and the flip assembly includes a cylinder and a rotating block. The cylinder is arranged on the connecting shaft, and the telescopic end of the cylinder moves along the axial direction of the connecting shaft. The telescopic end of the cylinder is provided with a rack. The rotating block is fixed to the mounting plate and rotatably mounted on the end of the connecting shaft. A toothed disc is arranged on the circumferential surface of the rotating block, and the toothed disc is meshed with the rack.

4. A chip cleaning barrel according to claim 1, characterized in that: A limiting assembly is arranged between the sliding plate and the mounting plate, and the limiting assembly includes a clamp, a spring and a limiting ball. The clamp is arranged on the top of the mounting plate through the spring, and the spring makes the clamp be in a clamping state. The limiting ball is arranged on the sliding plate, and the limiting ball is slidably arranged in the clamp.

5. The chip cleaning barrel according to claim 3, characterized in that: The mounting plate is provided with a through slot, and a rib plate is provided on the through slot for tension.

6. A chip cleaning barrel according to claim 4, characterized in that: A limiting plate is arranged at the bottom of the sliding plate, and the limiting plate is used to take the chip out of the mounting groove.

7. A chip cleaning barrel according to claim 3, characterized in that: The blowing assembly includes a fan, a pipe and a nozzle, the pipe is used to connect the fan and the nozzle, a slot is provided on the outer cylinder, the nozzle is rotatably installed in the slot, a first nozzle is provided on the nozzle, and the jet direction of the first nozzle is perpendicular to the chip.

8. The chip cleaning barrel according to claim 7, characterized in that: The nozzle is also provided with a second nozzle, and the second nozzle is used for cleaning the back side of the chip.

9. The chip cleaning barrel according to claim 6, characterized in that: The bottom of the limiting plate is magnetically connected to the bottom of the mounting plate.

10. An assembly method for assembling the clean bucket according to any one of claims 1 to 9, characterized in that: The steps are as follows: S1: Check to ensure the integrity of the outer cylinder, inner cylinder, lifting assembly, blowing assembly, dust collection assembly, barrel cover and other components; S2: Install the outer cylinder, place the outer cylinder on a flat workbench; S3: Install the blowing assembly and the dust collecting assembly on the outer cylinder; S4: Inner cylinder installation: install the central axis on the inner bottom surface of the outer cylinder, connect it with the driving assembly, and install the movable block on the central axis; S5: Adjust the cylinder parameters to make the mounting plate at a suitable angle; S6: Install the barrel cover and ensure that the barrel cover and the outer barrel are airtight.

Images