Mini LED sorting method

Abstract

The invention discloses a Mini LED (light-emitting diode) sorting method, which comprises the following steps of: setting more than three comparison patterns on a mask plate, and setting preset coordinate values of the comparison patterns; setting the mask plate and the wafer based on a sorting device for comparative analysis, and outputting matching coordinate values of the mask plate and the wafer; performing difference calculation on the preset coordinate value and the matched coordinate value in the MES system, and outputting a difference calculation result; and based on whether the difference value operation result is equal to 0, carrying out sorting operation if the difference value operation result is equal to 0, and pausing the sorting operation of the sorting equipment if the difference value operation result is not equal to 0. The comparison pattern is arranged on the corresponding mask according to the wafer specification, the preset coordinates are arranged according to the comparison pattern, the matching coordinates are obtained in combination with wafer sorting and matching, then comparison detection is carried out, the matching accuracy of the wafer for chip sorting and the mask is improved, and therefore the sorting efficiency and the sorting quality of Mini LED chips are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of chip sorting, and in particular to a Mini LED sorting method. Background Art

[0002] Since the size of Mini LED chips is smaller than that of conventional LED chips, and there are many Mini LED chips carried on substrates of the same specifications, the current Mini LED chip sorting is mainly carried out by sorting equipment to automatically align the mask and wafer, and automatically sort them after detecting that the two are wafers of the same specifications and sizes.

[0003] The existing sorting method mainly relies on the coordinate alignment or image alignment of the sorting equipment to confirm the specifications of the wafer and mask. Since there are a large number of Mini LED chips on the wafer, the mask and wafer alignment operation is cumbersome, and it is easy to have alignment operation errors or human operation errors leading to sorting errors, affecting the sorting efficiency and sorting quality of the Mini LED chips. Summary of the invention

[0004] The purpose of the present invention is to overcome the shortcomings of the prior art. The present invention provides a Mini LED sorting method, which sets a contrast pattern on the corresponding mask according to the wafer specifications, and sets preset coordinates according to the contrast pattern. After obtaining the matching coordinates in combination with wafer sorting matching, a contrast detection is performed to improve the accuracy of matching between the chip sorting wafer and the mask, thereby improving the sorting efficiency and sorting quality of the Mini LED chip.

[0005] The present invention provides a Mini LED sorting method, the Mini LED sorting method comprising:

[0006] More than three contrast patterns are arranged on the mask plate, and preset coordinate values ​​of the contrast images are set;

[0007] Setting the mask and wafer for comparative analysis based on the sorting equipment, and outputting matching coordinate values ​​of the mask and wafer;

[0008] In the MES system, the preset coordinate value and the matching coordinate value are calculated and the difference calculation result is output;

[0009] Based on whether the difference operation result is equal to 0, if yes, the sorting operation is performed, if not, the sorting operation of the sorting device is suspended.

[0010] Furthermore, the step of setting more than three contrast patterns on the mask and setting preset coordinate values ​​of the contrast images includes:

[0011] Setting three or more contrast patterns on the mask;

[0012] Obtain the coordinates of each chip on the wafer and obtain an initial coordinate image;

[0013] Combine the images based on the mask and the initial coordinate image and set the preset coordinate values ​​of the comparison image.

[0014] Furthermore, the step of setting more than three contrast patterns on the mask plate includes:

[0015] A mask of corresponding shape and size is set according to the specifications of the wafer, and an origin comparison image is set at the geometric center of the mask;

[0016] Setting a coordinate axis based on the geometric center position of the mask, and setting at least one negative axis contrast image in the negative axis direction of the mask corresponding to the coordinate axis;

[0017] At least one positive axis contrast image is set in the positive axis direction of the mask corresponding to the coordinate axis.

[0018] Furthermore, the step of acquiring the coordinates of each chip on the wafer to obtain an initial coordinate image includes:

[0019] Taking the chip at the geometric center of the wafer as the coordinate origin, electrical tests are performed on each chip on the wafer in turn;

[0020] The coordinates of the chips that have completed the electrical test are registered. After the coordinates of each chip on the wafer are marked, the initial coordinate images of several chips on the wafer are obtained.

[0021] Further, the setting of the mask and the wafer for comparative analysis based on the sorting equipment and outputting the matching coordinate values ​​of the comparative image of the mask within the wafer includes:

[0022] The mask and the wafer are superimposed and compared in the sorting equipment, and the matching coordinate values ​​of the comparison images of the mask in the wafer are output based on the orthographic projection positions of several comparison images set on the mask on the wafer.

[0023] Furthermore, the mask and the wafer are superimposed and compared in the sorting equipment, and the orthographic projection positions of the wafer based on a plurality of comparison images set on the mask include:

[0024] Place the wafer in the sorting work area of ​​the sorting equipment, and perform alignment inspection on the wafer and the mask based on the visual shooting component of the sorting equipment;

[0025] A plurality of alignment points are set on the wafer, and the posture state of the sorting equipment is adjusted so that a plurality of points on the mask plate are located at the alignment points of the wafer and overlap with each other.

[0026] Furthermore, performing difference calculation between the preset coordinate value and the matching coordinate value in the MES system and outputting the difference calculation result includes:

[0027] The matching coordinate value of the contrast pattern of the mask is sent to the MES system based on the sorting equipment, and the MES system calculates the difference between the preset coordinate value and the matching coordinate value, and outputs the difference calculation result;

[0028] The mask and wafer are matched based on the difference calculation results.

[0029] Furthermore, performing difference calculation between the preset coordinate value and the matching coordinate value in the MES system and outputting the difference calculation result also includes:

[0030] The difference calculation formula is:

[0031] (|X|-|X ′ |,|Y|-|Y ′ |);

[0032] Among them, X is the horizontal coordinate of the preset coordinate, Y is the vertical coordinate of the preset coordinate, and X ′ is the horizontal coordinate of the matching coordinate, Y ′ The ordinate of the matching coordinate.

[0033] Furthermore, the Mini LED sorting method further includes:

[0034] Based on the MES system, an error analysis is performed on the difference operation result to detect whether the difference operation result is within the error range. If so, the difference operation result is adjusted to 0; if not, the difference result is directly output.

[0035] Furthermore, the error range detection formula of the difference calculation result is:

[0036] -10μm≤0-X 0 ≤10μm;

[0037] -10μm≤0-Y 0 ≤10μm;

[0038] Among them, X 0 Calculate the difference of the horizontal coordinate of the difference operation result, Y 0 Calculate the difference for the ordinate of the difference operation result.

[0039] The present invention provides a Mini LED sorting method, wherein multiple contrast patterns are arranged on a mask plate, and preset coordinate values ​​of the contrast patterns are set according to the chip distribution positions of a wafer, so that after the wafer and the mask plate are matched, contrast detection can be performed based on the preset coordinate values ​​and the matching coordinate values, thereby improving the accuracy of matching between the wafer and the mask plate. By combining contrast patterns and coordinate analysis, automatic detection and comparison are performed based on the system, thereby reducing the impact of human operational errors, and effectively improving the Mini LED chip sorting efficiency and sorting quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0041] Figure 1 is a flow chart of a Mini LED sorting method in an embodiment of the present invention;

[0042] Figure 2 It is a schematic diagram of the operation flow of the Mini LED sorting method in an embodiment of the present invention. DETAILED DESCRIPTION

[0043] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0044] Figure 1 A flow chart of a Mini LED sorting method in an embodiment of the present invention is shown, and the Mini LED sorting method includes:

[0045] S11: three or more contrast patterns are arranged on the mask plate, and preset coordinate values ​​of the contrast images are set.

[0046] More than three contrast patterns are set on the mask of the sorting equipment, wherein one contrast pattern is set at the geometric center of the mask, and the contrast pattern located at the geometric center is set as the origin contrast pattern, a coordinate axis is set on the mask based on the origin contrast image, and a negative axis contrast pattern and a positive axis contrast pattern are set on the mask based on the coordinate axis. By setting a plurality of contrast patterns, the accuracy of matching detection between the mask and the wafer can be improved, thereby improving the accuracy of sorting chips on the wafer.

[0047] Furthermore, the three or more contrast patterns may be set to different pattern shapes, and different pattern shapes may satisfy coordinate matching marks at different positions, thereby improving the accuracy and reliability of matching between the mask and the wafer.

[0048] Furthermore, more than three contrast patterns may be set to have the same pattern shape, and the contrast patterns at different positions may be marked and their coordinates may be registered based on the MES system.

[0049] The Manufacturing Execution System (MES) is a management system for automated production lines. It adjusts the production rhythm and production instructions of each process according to the operational requirements of the production line to achieve precise control of the production line processing.

[0050] Specifically, a mask of corresponding shape and size is set according to the specifications of the wafer, and an origin comparison image is set at the geometric center position of the mask;

[0051] Setting a coordinate axis based on the geometric center position of the mask, and setting at least one negative axis contrast image in the negative axis direction of the mask corresponding to the coordinate axis;

[0052] At least one positive axis contrast image is set in the positive axis direction of the mask corresponding to the coordinate axis. By setting more than three contrast images, the matching accuracy between the mask and the wafer can be improved.

[0053] Specifically, the plurality of contrast patterns are set corresponding to the center position of the chip on the wafer, the position coordinates of the origin contrast pattern are set to (0,0), and the coordinate values ​​of the negative axis contrast pattern are marked on the coordinate axis, as well as the coordinate values ​​of the positive axis contrast pattern are marked on the coordinate axis. By marking the coordinates of more than three contrast patterns on the mask, the coordinate analysis and verification of the point positions of the mask and the wafer can be performed based on the MES system, thereby improving the accuracy of the alignment and matching between the mask and the wafer of the sorting equipment.

[0054] S12: performing comparative analysis on the mask and wafer based on the setting of the sorting equipment, and outputting matching coordinate values ​​of the mask and wafer.

[0055] Specifically, the wafer is placed in the sorting working area of ​​the sorting equipment, and the wafer and the mask are automatically aligned based on the sorting equipment so that the wafer and the mask can be arranged in an overlapping manner, that is, the wafer is completely contained in the sorting range of the mask, thereby satisfying the sorting equipment to sort the wafer based on the mask.

[0056] Furthermore, when automatic alignment is performed based on the sorting equipment, multiple alignment points can be set by the sorting equipment, the wafer and the mask are visually identified by a CCD camera, multiple alignment points are set on the wafer and the mask, and accurate alignment between the wafer and the mask is achieved based on the multiple alignment points.

[0057] A charge coupled device (CCD) camera uses the photoelectric effect to generate electric charges on the surface of the element to achieve the effect of forming a digital image.

[0058] Furthermore, the mask is photographed by the visual shooting component of the sorting equipment to obtain a mask image with a contrasting pattern, and the mask image is used as a standard image for alignment operations to achieve accurate alignment of the mask and the wafer.

[0059] Specifically, the wafer is placed in the sorting work area of ​​the sorting equipment, and based on the operator's manual point-to-point operation, the visual shooting component of the sorting equipment takes real-time images of the wafer and the mask, so that the operator can adjust the working position of the sorting equipment according to the image displayed on the display screen, so that the wafer and the mask can be overlapped and arranged to meet the sorting requirements of the sorting equipment.

[0060] Specifically, the mask and the wafer are aligned and superimposed so that the chip on the wafer can be located within the sorting working area of ​​the mask. After the mask and the wafer are aligned using a visual shooting component of the sorting equipment, the contrast pattern of the mask corresponds to the coordinate information of the chip position on the wafer, thereby obtaining the matching coordinate values ​​of the mask and the wafer.

[0061] Furthermore, after the electrical test, the wafer enters the sorting equipment for sorting operations, and the coordinates of each chip on the wafer are positioned based on the electrical test, so that the coordinate information of each chip on the wafer can be obtained. After the mask plate and the wafer are aligned and superimposed, according to the corresponding chip positions covered by the several contrast patterns on the mask plate and the wafer, the coordinate information of the chip positions corresponding to the several contrast patterns on the wafer after the mask plate is matched with the wafer is obtained as the matching coordinate value.

[0062] S13: performing difference calculation between the preset coordinate value and the matching coordinate value, and outputting the difference calculation result.

[0063] The matching coordinate value between the mask and the wafer is obtained by the sorting device, and the difference between the matching coordinate value and the preset coordinate value is calculated, so as to detect the accuracy of the matching state of the mask and the wafer.

[0064] Specifically, the preset coordinate values ​​of the contrast patterns of masks of different specifications are recorded in the MES system, and according to the mask specifications set by the sorting equipment and the wafer placed in the sorting area of ​​the sorting equipment, the matching coordinate values ​​of the mask and the wafer after matching are obtained, and combined with the preset coordinate values ​​of the mask of the corresponding model and specification in the MES system, detection is performed to improve the accuracy of mask and wafer matching.

[0065] Specifically, the Mini LED sorting method further includes:

[0066] Based on the MES system, an error analysis is performed on the difference operation result to detect whether the difference operation result is within the error range. If so, the difference operation result is adjusted to 0; if not, the difference result is directly output.

[0067] The error range detection formula of the difference operation result is:

[0068] -10μm≤0-X 0 ≤10μm;

[0069] -10μm≤0-Y 0 ≤10μm;

[0070] Among them, X 0 Calculate the difference of the horizontal coordinate of the difference operation result, Y 0 Calculate the difference for the ordinate of the difference operation result.

[0071] Specifically, based on the process errors of wafers and masks in the production process, there is a position offset error after the wafers and masks of corresponding specifications are matched. The difference operation result is detected by setting an error range to determine whether the difference operation result is within the error range. If the difference operation result is within the error range, the MES system can correct the difference operation result so that the difference operation result is output as (0,0). By performing error range detection and correction processing on the difference operation results of each contrast pattern on the mask, the accuracy and reliability of the mask and wafer matching and sorting operations can be improved.

[0072] S14: Based on whether the difference operation result is equal to 0, if yes, a sorting operation is performed; if no, the sorting operation of the sorting device is suspended.

[0073] Specifically, a difference operation is performed on the preset coordinate values ​​and the matching coordinate values ​​of the plurality of contrast patterns on the mask. If the difference operation results output by the MES system for the plurality of contrast patterns are all (0, 0), the sorting equipment can perform a sorting operation on the wafer through the sorting software, and the MES system determines that it is normal.

[0074] If any of the difference calculation results output by MES for several comparison patterns is not (0,0), the sorting device triggers an alarm through the sorting software, and MES suspends the sorting operation of the sorting device. At the same time, the operator cannot click to start the sorting operation, and MES determines that the current sorting operation is abnormal.

[0075] Furthermore, when the MES system determines that the current sorting operation is abnormal, the relevant operators and managers are required to enter the permission password before restarting the sorting equipment for sorting operation.

[0076] Furthermore, when MES determines that the current sorting operation is abnormal, the MES system will notify the foreman, production supervisor, equipment engineer, process engineer, and technician of the station of the relevant information through email, text message, etc. At the same time, the MES system will detain the wafers, masks and sorting equipment involved in the current sorting operation and suspend the sorting operation. After the relevant personnel confirm that there is no abnormality, they will restart the sorting operation by entering the permission password. The MES system will release the sorting equipment and wafers only after unlocking them.

[0077] The embodiment of the present invention provides a Mini LED sorting method, wherein multiple contrast patterns are arranged on a mask plate, and preset coordinate values ​​of the contrast patterns are set according to the chip distribution positions of the wafer, so that after the wafer and the mask plate are matched, contrast detection can be performed based on the preset coordinate values ​​and the matching coordinate values, thereby improving the accuracy of matching between the wafer and the mask plate. By combining contrast patterns and coordinate analysis, automatic detection and comparison are performed based on the system, thereby reducing the impact of human operational errors and effectively improving the Mini LED chip sorting efficiency and sorting quality.

[0078] Embodiment 2:

[0079] Figure 2 The schematic diagram of the operation flow of the Mini LED sorting method in the embodiment of the present invention is shown, and the operation flow of the Mini LED sorting method includes:

[0080] S101: Setting the mask.

[0081] According to the wafer specifications involved in the production line, the corresponding mask is set in the sorting equipment. When the sorting operation is performed on the production line, the sorting area corresponding to the mask on the sorting equipment is set based on the distribution position of each chip on the wafer, so that the mask can meet the sorting requirements of the LED chips.

[0082] S102: Setting a contrast pattern on the mask.

[0083] More than three contrast patterns are set on the mask of the sorting equipment, wherein one contrast pattern is set at the geometric center of the mask, and the contrast pattern located at the geometric center is set as the origin contrast pattern, a coordinate axis is set on the mask based on the origin contrast image, and a negative axis contrast pattern and a positive axis contrast pattern are set on the mask based on the coordinate axis. By setting a plurality of contrast patterns, the accuracy of matching detection between the mask and the wafer can be improved, thereby improving the accuracy of sorting chips on the wafer.

[0084] Furthermore, the three or more contrast patterns may be set to different pattern shapes, and different pattern shapes may satisfy coordinate matching marks at different positions, thereby improving the accuracy and reliability of matching between the mask and the wafer.

[0085] Furthermore, more than three contrast patterns may be set to have the same pattern shape, and the contrast patterns at different positions may be marked and their coordinates may be registered based on the MES system.

[0086] S103: Obtain preset coordinate values.

[0087] Specifically, the coordinates of each chip on the wafer are obtained to obtain an initial coordinate image, and the wafer of corresponding specifications is queried in the MES system according to the size specifications of the mask, and the coordinates of each chip on the wafer are obtained to obtain an initial coordinate image.

[0088] Furthermore, the MES system records standard data of wafers of various specifications in the production line, and the initial coordinate images of wafers corresponding to masks of different sizes can be obtained in the MES system.

[0089] Furthermore, the initial coordinate image of the wafer is obtained after the electrical test, and the chip at the geometric center of the wafer is used as the coordinate origin, and the electrical test is performed on each chip on the wafer in turn;

[0090] The coordinates of the chips that have completed the electrical test are registered. After the coordinate marking of each chip on the wafer is completed, the initial coordinate images of several chips on the wafer are obtained, and the initial coordinate images of wafers of different specifications after the electrical test are input into the MES system, so that the MES system can assign preset coordinate values ​​of comparison patterns to masks of different specifications.

[0091] Specifically. Mark the combined image based on the mask and the initial coordinate image, and set the preset coordinate value of the comparison image. Set the mask of the corresponding shape and size according to the specifications of the wafer, and set the origin comparison image at the geometric center position of the mask;

[0092] Setting a coordinate axis based on the geometric center position of the mask, and setting at least one negative axis contrast image in the negative axis direction of the mask corresponding to the coordinate axis;

[0093] At least one positive axis contrast image is set in the positive axis direction of the mask corresponding to the coordinate axis. By setting more than three contrast images, the matching accuracy between the mask and the wafer can be improved.

[0094] Specifically, the plurality of contrast patterns are set corresponding to the center position of the chip on the wafer, the position coordinates of the origin contrast pattern are set to (0,0), and the coordinate values ​​of the negative axis contrast pattern are marked on the coordinate axis, as well as the coordinate values ​​of the positive axis contrast pattern are marked on the coordinate axis. By marking the coordinates of more than three contrast patterns on the mask, the coordinate analysis and verification of the point positions of the mask and the wafer can be performed based on the MES system, thereby improving the accuracy of the alignment and matching between the mask and the wafer of the sorting equipment.

[0095] S104: Align and overlap the mask and wafer.

[0096] Specifically, the wafer is placed in the sorting working area of ​​the sorting equipment, and the wafer and the mask are automatically aligned based on the sorting equipment so that the wafer and the mask can be arranged in an overlapping manner, that is, the wafer is completely contained in the sorting range of the mask, thereby satisfying the sorting equipment to sort the wafer based on the mask.

[0097] Furthermore, when automatic alignment is performed based on the sorting equipment, multiple alignment points can be set by the sorting equipment, the wafer and the mask are visually identified by a CCD camera, multiple alignment points are set on the wafer and the mask, and accurate alignment between the wafer and the mask is achieved based on the multiple alignment points.

[0098] A charge coupled device (CCD) camera uses the photoelectric effect to generate electric charges on the surface of the element to achieve the effect of forming a digital image.

[0099] Furthermore, the mask is photographed by the visual shooting component of the sorting equipment to obtain a mask image with a contrasting pattern, and the mask image is used as a standard image for alignment operations to achieve accurate alignment of the mask and the wafer.

[0100] Specifically, the wafer is placed in the sorting work area of ​​the sorting equipment, and based on the operator's manual point-to-point operation, the visual shooting component of the sorting equipment takes real-time images of the wafer and the mask, so that the operator can adjust the working position of the sorting equipment according to the image displayed on the display screen, so that the wafer and the mask can be overlapped and arranged to meet the sorting requirements of the sorting equipment.

[0101] S105: Obtain matching coordinate values.

[0102] Specifically, the mask and the wafer are aligned and superimposed so that the chip on the wafer can be located within the sorting working area of ​​the mask. After the mask and the wafer are aligned using a visual shooting component of the sorting equipment, the contrast pattern of the mask corresponds to the coordinate information of the chip position on the wafer, thereby obtaining the matching coordinate values ​​of the mask and the wafer.

[0103] Furthermore, after the electrical test, the wafer enters the sorting equipment for sorting operations, and the coordinates of each chip on the wafer are positioned based on the electrical test, so that the coordinate information of each chip on the wafer can be obtained. After the mask plate and the wafer are aligned and superimposed, according to the corresponding chip positions covered by the several contrast patterns on the mask plate and the wafer, the coordinate information of the chip positions corresponding to the several contrast patterns on the wafer after the mask plate is matched with the wafer is obtained as the matching coordinate value.

[0104] S106: Calculate the difference operation result.

[0105] The matching coordinate value between the mask and the wafer is obtained by the sorting device, and the difference between the matching coordinate value and the preset coordinate value is calculated, so as to detect the accuracy of the matching state of the mask and the wafer.

[0106] Specifically, the preset coordinate values ​​of the contrast patterns of masks of different specifications are recorded in the MES system, and according to the mask specifications set by the sorting equipment and the wafer placed in the sorting area of ​​the sorting equipment, the matching coordinate values ​​of the mask and the wafer after matching are obtained, and combined with the preset coordinate values ​​of the mask of the corresponding model and specification in the MES system, detection is performed to improve the accuracy of mask and wafer matching.

[0107] The difference calculation formula is:

[0108] (|X|-|X ′ |,|Y|-|Y ′ |);

[0109] Among them, X is the horizontal coordinate of the preset coordinate, Y is the vertical coordinate of the preset coordinate, and X ′ is the horizontal coordinate of the matching coordinate, Y ′ The ordinate of the matching coordinate.

[0110] S107: Error detection.

[0111] Based on the MES system, an error analysis is performed on the difference calculation result to detect whether the difference calculation result is within the error range. If so, the difference calculation result is adjusted to 0; if not, the difference result is directly output. That is, if the difference calculation result is outside the error range, the MES system directly outputs the difference calculation result without adjusting the difference calculation result.

[0112] The error range detection formula of the difference operation result is:

[0113] -10μm≤0-X 0 ≤10μm;

[0114] -10μm≤0-Y 0 ≤10μm;

[0115] Among them, X 0 Calculate the difference of the horizontal coordinate of the difference operation result, Y 0 Calculate the difference for the ordinate of the difference operation result.

[0116] Specifically, based on the process errors of wafers and masks in the production process, there is a position offset error after the wafers and masks of corresponding specifications are matched. The difference operation result is detected by setting an error range to determine whether the difference operation result is within the error range. If the difference operation result is within the error range, the MES system can correct the difference operation result so that the difference operation result is output as (0,0). By performing error range detection and correction processing on the difference operation results of each contrast pattern on the mask, the accuracy and reliability of the mask and wafer matching and sorting operations can be improved.

[0117] S108: Analyze and detect the difference calculation results.

[0118] Specifically, the difference calculation results of the preset coordinate values ​​and the matching coordinate values ​​of the plurality of contrast patterns on the mask are analyzed and detected. If the difference calculation results output by the MES system for the plurality of contrast patterns are all (0, 0), the sorting equipment can perform a sorting operation on the wafer through the sorting software, and the MES system determines that it is normal.

[0119] If any of the difference calculation results output by MES for several comparison patterns is not (0,0), the sorting device triggers an alarm through the sorting software, and MES suspends the sorting operation of the sorting device. At the same time, the operator cannot click to start the sorting operation, and MES determines that the current sorting operation is abnormal.

[0120] S109: Execute sorting.

[0121] When the MES system determines that the current sorting operation is normal, the MES system controls the sorting equipment to perform a sorting operation on the current wafer.

[0122] S110: Pause sorting.

[0123] When the MES system determines that the current sorting operation is abnormal, the relevant operators and managers are required to enter the permission password before restarting the sorting equipment for sorting operations.

[0124] Furthermore, when MES determines that the current sorting operation is abnormal, the MES system will notify the foreman, production supervisor, equipment engineer, process engineer, and technician of the station of the relevant information through email, text message, etc. At the same time, the MES system will detain the wafers, masks and sorting equipment involved in the current sorting operation and suspend the sorting operation. After the relevant personnel confirm that there is no abnormality, they will restart the sorting operation by entering the permission password. The MES system will release the sorting equipment and wafers only after unlocking them.

[0125] The embodiment of the present invention provides a Mini LED sorting method, wherein multiple contrast patterns are arranged on a mask plate, and preset coordinate values ​​of the contrast patterns are set according to the chip distribution positions of the wafer, so that after the wafer and the mask plate are matched, contrast detection can be performed based on the preset coordinate values ​​and the matching coordinate values, thereby improving the accuracy of matching between the wafer and the mask plate. By combining contrast patterns and coordinate analysis, automatic detection and comparison are performed based on the system, thereby reducing the impact of human operational errors and effectively improving the Mini LED chip sorting efficiency and sorting quality.

[0126] A person skilled in the art may understand that all or part of the steps in the various methods of the above embodiments may be completed by instructing related hardware through a program, and the program may be stored in a computer-readable storage medium, and the storage medium may include: a read-only memory (ROM), a random access memory (RAM), a disk or an optical disk, etc.

[0127] In addition, the above provides a detailed introduction to the embodiments of the present invention. Specific examples are used herein to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea. At the same time, for those skilled in the art, according to the idea of ​​the present invention, there will be changes in the specific implementation methods and application scopes. In summary, the content of this specification should not be understood as a limitation on the present invention.

Claims

1. A Mini LED sorting method, characterized in that: The Mini LED sorting method comprises: More than three contrast patterns are arranged on the mask plate, and preset coordinate values ​​of the contrast images are set; Setting the mask and wafer for comparative analysis based on the sorting equipment, and outputting matching coordinate values ​​of the mask and wafer; In the MES system, the preset coordinate value and the matching coordinate value are calculated and the difference calculation result is output; It is determined whether the difference operation result is equal to 0. If so, a sorting operation is performed; if not, the sorting operation of the sorting device is suspended.

2. The Mini LED sorting method according to claim 1, wherein: The step of setting more than three contrast patterns on the mask and setting preset coordinate values ​​of the contrast images includes: Setting three or more contrast patterns on the mask; Obtain the coordinates of each chip on the wafer and obtain an initial coordinate image; Combine the images based on the mask and the initial coordinate image and set the preset coordinate values ​​of the comparison image.

3. The Mini LED sorting method according to claim 2, wherein: The step of providing more than three contrast patterns on the mask includes: A mask of corresponding shape and size is set according to the specifications of the wafer, and an origin comparison image is set at the geometric center of the mask; Setting a coordinate axis based on the geometric center position of the mask, and setting at least one negative axis contrast image in the negative axis direction of the mask corresponding to the coordinate axis; At least one positive axis contrast image is set in the positive axis direction of the mask corresponding to the coordinate axis.

4. The Mini LED sorting method according to claim 2, wherein: The step of obtaining the coordinates of each chip on the wafer to obtain an initial coordinate image includes: Taking the chip at the geometric center of the wafer as the coordinate origin, electrical tests are performed on each chip on the wafer in turn; The coordinates of the chips that have completed the electrical test are registered. After the coordinates of each chip on the wafer are marked, the initial coordinate images of several chips on the wafer are obtained.

5. The Mini LED sorting method according to claim 1, wherein: The step of setting the mask and the wafer for comparative analysis based on the sorting equipment and outputting the matching coordinate values ​​of the comparative image of the mask within the wafer includes: The mask and the wafer are superimposed and compared in the sorting equipment, and the matching coordinate values ​​of the comparison images of the mask in the wafer are output based on the orthographic projection positions of several comparison images set on the mask on the wafer.

6. The Mini LED sorting method according to claim 5, wherein: The mask and the wafer are superimposed and compared in the sorting equipment, and the orthographic projection positions of the wafer based on a plurality of comparison images set on the mask include: Place the wafer in the sorting work area of ​​the sorting equipment, and perform alignment inspection on the wafer and the mask based on the visual shooting component of the sorting equipment; A plurality of alignment points are set on the wafer, and the posture state of the sorting equipment is adjusted so that a plurality of points on the mask plate are located at the alignment points of the wafer and overlap with each other.

7. The Mini LED sorting method according to claim 1, wherein: The difference calculation between the preset coordinate value and the matching coordinate value is performed in the MES system, and the difference calculation result is output, including: The matching coordinate value of the contrast pattern of the mask is sent to the MES system based on the sorting equipment, and the MES system calculates the difference between the preset coordinate value and the matching coordinate value, and outputs the difference calculation result; The mask and wafer are matched based on the difference calculation results.

8. The Mini LED sorting method according to claim 7, wherein: The step of performing difference calculation between the preset coordinate value and the matching coordinate value in the MES system and outputting the difference calculation result also includes: The difference calculation formula is: (|X|-|X ′ |,|Y|-|Y ′ |); Among them, X is the horizontal coordinate of the preset coordinate, Y is the vertical coordinate of the preset coordinate, and X ′ is the horizontal coordinate of the matching coordinate, Y ′ The ordinate of the matching coordinate.

9. The Mini LED sorting method according to claim 1, wherein: The Mini LED sorting method further includes: Based on the MES system, an error analysis is performed on the difference operation result to detect whether the difference operation result is within the error range. If so, the difference operation result is adjusted to 0; if not, the difference result is directly output.

10. The Mini LED sorting method according to claim 9, wherein: The error range detection formula of the difference operation result is: -10μm≤0-X0≤10μm; -10μm≤0-Y0≤10μm; Among them, X0 is the horizontal coordinate calculation difference of the difference operation result, and Y0 is the vertical coordinate calculation difference of the difference operation result.

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