High-efficiency precise grinding fluid for silicon wafer

Abstract

The invention belongs to the technical field of grinding fluids, and particularly relates to a silicon wafer high-efficiency precise grinding fluid, which comprises the following components in percentage by weight: 5.0-20.0% of grinding material, 10-20% of pH value regulator, 3-5% of penetrating agent, 10-20% of lubricant, 0.5-1.5% of surfactant, 0.5-1.5% of chelating agent and the balance of deionized water. The invention relates to a water-soluble antirust cutting fluid which comprises the following components in percentage by weight: 1-3% of lubricant, 0.1-1.0% of surfactant, 0.1-1.0% of chelating agent and the balance of deionized water, the water-soluble antirust cutting fluid has certain lubricating, cooling and antirust effects, the used chelating agent is water-soluble and does not contain metal ions, the metal ion chelating ability is strong, and the antirust cutting fluid has the advantages that the metal ion chelating ability is strong; the grinding agent is good in grinding performance, easy to clean, stable in performance, convenient to store for a long time, excellent in economic performance and free of secondary pollution.

Description

Technical Field

[0001] The present invention belongs to the technical field of grinding fluids, and particularly relates to a high-efficiency and precision grinding fluid for silicon wafers. Background Art

[0002] In the process of silicon wafer processing, grinding plays a very important role. Because during the slicing process, it is almost impossible to make the silicon wafer have the required degree of curvature, warpage, and flatness. And during the silicon wafer polishing process, since the removal amount is relatively small, it is also impossible to significantly improve the surface quality of the silicon wafer. Therefore, the grinding process plays a role in improving the surface quality of the silicon wafer before polishing.

[0003] Polyamine 19-C is the grinding fluid with the largest sales volume in the world in suspension form. However, polyamine-19C is expensive, has a high viscosity, a serious surface adsorption ratio, and is not easy to clean, resulting in easy appearance of mottles on the surface of the grinding disc after cleaning, which directly affects the yield of the grinding disc and also causes harm to the processing of the next process. Therefore, how to improve the performance of the grinding fluid, how to store it for a long time, have excellent economic performance, and be easy to clean is one of the problems to be solved in current grinding. Summary of the Invention

[0004] To solve the problems raised in the above background art, the present invention provides a high-efficiency and precision grinding fluid for silicon wafers, which has the characteristics of being easy to clean, stable in performance, and convenient for long-term storage.

[0005] To achieve the above object, the present invention provides the following technical solution: A high-efficiency and precision grinding fluid for silicon wafers, comprising an abrasive, a pH regulator, a penetrant, a lubricant, a surfactant, a chelating agent, and deionized water. The weight percentage of the abrasive is 5.0% - 20.0%, the weight percentage of the pH regulator is 10% - 20%, the weight percentage of the penetrant is 3% - 5%, the weight percentage of the lubricant is 1% - 3%, the weight percentage of the surfactant is 0.1% - 1.0%, the weight percentage of the chelating agent is 0.1% - 1.0%, and the balance is deionized water.

[0006] Preferably, the abrasive can be silicon dioxide, cerium dioxide, titanium dioxide, or boron carbide.

[0007] Preferably, the pH regulator can be an organic amine base solution or a diethanolamine solution.

[0008] Preferably, the penetrant can be fatty alcohol polyoxyethylene ether AEO-9 or AEO-15.

[0009] Preferably, the lubricant can be glycerol.

[0010] Preferably, the surfactant can be fatty alcohol polyoxyethylene ether or alkylolamide.

[0011] Preferably, the chelating agent does not contain metal ions and can be EDTA, disodium EDTA, hydroxylamine or amine salt.

[0012] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0013] 1. The present invention has certain lubricating, cooling and rust-proof functions. The chelating agent used is water-soluble and does not contain metal ions. It has strong metal ion chelating ability, good grinding performance, easy to clean, stable performance, convenient for long-term storage, excellent economic performance and no secondary pollution. Specific embodiments

[0014] The technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0015] Example 1

[0016] The present invention provides the following technical solutions: A high-efficiency precision grinding fluid for silicon wafers, comprising an abrasive, a pH regulator, a penetrant, a lubricant, a surfactant, a chelating agent and deionized water. The weight percentage of the abrasive is 5.0% - 20.0%, the weight percentage of the pH regulator is 10% - 20%, the weight percentage of the penetrant is 3% - 5%, the weight percentage of the lubricant is 1% - 3%, the weight percentage of the surfactant is 0.1% - 1.0%, the weight percentage of the chelating agent is 0.1% - 1.0%, and the balance is deionized water. The abrasive can be silicon dioxide, cerium dioxide, titanium dioxide or boron carbide. The pH regulator can be an organic amine base solution or a diethanolamine solution. The penetrant can be fatty alcohol polyoxyethylene ether AEO-9 or AEO-15. The lubricant can be glycerol. The surfactant can be fatty alcohol polyoxyethylene ether or alkylolamide. The chelating agent does not contain metal ions and can be EDTA, disodium EDTA, hydroxylamine or amine salt. The weight percentages of various components are as follows: boron carbide 15%, organic amine base solution 20%, fatty alcohol polyoxyethylene ether AEO-9 5%, glycerol 1%, fatty alcohol polyoxyethylene ether 0.5%, disodium EDTA 0.9%, and the balance is deionized water.

[0017] Application effect: When in use, the above-mentioned grinding fluid is diluted with deionized water at a ratio of 1:100, ground on a grinding machine for 15 minutes, and then rinsed with water after grinding. The surface of the wafer is smooth and the flatness can reach within 2 micrometers. Moreover, it is easy to clean after grinding, and the grinding fluid can be stored for a long time without yellowing and with stable components.

[0018] Example 2

[0019] The present invention provides the following technical solution: A highly efficient and precise silicon wafer grinding fluid, comprising an abrasive, a pH regulator, a penetrant, a lubricant, a surfactant, a chelating agent and deionized water. The weight percentage of the abrasive is 5.0% - 20.0%, the weight percentage of the pH regulator is 10% - 20%, the weight percentage of the penetrant is 3% - 5%, the weight percentage of the lubricant is 1% - 3%, the weight percentage of the surfactant is 0.1% - 1.0%, the weight percentage of the chelating agent is 0.1% - 1.0%, and the balance is deionized water. The abrasive can be silicon dioxide, cerium dioxide, titanium dioxide or boron carbide. The pH regulator can be an organic amine base solution or a diethanolamine solution. The penetrant can be fatty alcohol polyoxyethylene ether AEO-9 or AEO-15. The lubricant can be glycerol. The surfactant can be fatty alcohol polyoxyethylene ether or alkylolamide. The chelating agent does not contain metal ions and can be EDTA, disodium EDTA, hydroxylamine or amine salt. The weight percentages of various components are as follows: silicon dioxide 10%, diethanolamine solution 10%, AEO-15 10%, glycerol 0.5%, alkylolamide 0.5%, amine salt 1%, and the balance is deionized water.

[0020] Application effect: When in use, the above grinding fluid is diluted with deionized water at a ratio of 1:50, ground on a grinding machine for 15 minutes, rinsed with water after grinding. The surface of the wafer is smooth and the flatness can reach within 2 micrometers. Moreover, it is easy to clean after grinding, and the grinding fluid can be stored for a long time without yellowing and with stable components.

[0021] Finally, it should be noted that the above are only the preferred embodiments of the present invention and are not used to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. An efficient and precise silicon wafer grinding fluid, comprising abrasive, pH regulator, penetrant, lubricant, surfactant, chelating agent and deionized water, Characterized in that: The weight percentage of the abrasive is 5.0% - 20.0%, the weight percentage of the pH regulator is 10% - 20%, the weight percentage of the penetrant is 3% - 5%, the weight percentage of the lubricant is 1% - 3%, the weight percentage of the surfactant is 0.1% - 1.0%, the weight percentage of the chelating agent is 0.1% - 1.0%, and the balance is deionized water.

2. The efficient and precise silicon wafer grinding fluid according to claim 1, Characterized in that: The abrasive can be silicon dioxide, cerium dioxide, titanium dioxide or boron carbide.

3. The efficient and precise silicon wafer grinding fluid according to claim 1, Characterized in that: The pH regulator can be an organic amine base solution or a diethanolamine solution.

4. The efficient and precise silicon wafer grinding fluid according to claim 1, Characterized in that: The penetrant can be fatty alcohol polyoxyethylene ether AEO-9 or AEO-15.

5. The efficient and precise silicon wafer grinding fluid according to claim 1, Characterized in that: The lubricant can be glycerol.

6. The efficient and precise silicon wafer grinding fluid according to claim 1, Characterized in that: The surfactant can be fatty alcohol polyoxyethylene ether or alkylolamide.

7. The efficient and precise silicon wafer grinding fluid according to claim 1, Characterized in that: The chelating agent does not contain metal ions and can be EDTA, disodium EDTA, hydroxylamine or amine salt.