A bonding device for multiple cylindrical semiconductor wafers

Abstract

The present invention discloses a bonding device for multiple cylindrical semiconductor wafers, which relates to the technical field of wafer bonding processing, including a bonding device, including a placement plate, a lifting motor and a wafer body, and also including a fixing device and a cleaning device; wherein the fixing device includes a pressure plate and a fixing assembly, the pressure plate is fixedly installed at the output end of the lifting motor, the fixing assembly includes a fixing frame, a sliding plate, a pressure rod, a pushing plate, a connecting rod, a clamping plate, a clamping piece, a fixing rod and a tray, the fixing frame is fixedly installed above the placement plate, the sliding plate is slidably installed inside the fixing frame, the pressure rod is fixedly installed above the sliding plate, and the pushing plate is slidably installed at the bottom of the inner wall of the fixing frame. The present invention has the characteristics of avoiding wafer offset, causing mismatch or misalignment between wafers during processing, affecting the improvement of bonding quality and device performance, and reducing the processing cost of wafers.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer bonding processing, in particular to a bonding device for multiple cylindrical semiconductor wafers. Background Art

[0002] Multi-wafer tubular devices are constructed by stacking multiple thin wafers in a cylindrical or tubular shape. Each wafer can be made of a different material or have different functional layers, and they are assembled together through a bonding process to form a monolithic structure.

[0003] Patent publication number CN216528822U relates to a wafer stage, comprising a plate body, a placement area for wafers disposed in the middle of the plate body, the placement area being provided with a plurality of concentric annular grooves, the groove edges between the annular grooves being used to support the bottom of the wafer, at least one suction port being provided in each annular groove of the plate body, a suction port being provided on the sidewall of the body, the suction port being connected to each suction port via a suction channel, and positioning devices for positioning the wafer disposed around the placement area of ​​the plate body. This patent can better support the wafer, more evenly apply force to the wafer, and reduce the difficulty of wafer stage processing.

[0004] In the above patent, the suction port is connected to each suction port through a suction channel, and positioning devices for positioning the wafer are provided around the placement area on the plate. This patent can better support the wafer, make the force on the wafer more uniform, reduce the processing difficulty of the wafer stage and facilitate the processing of the wafer body. However, when operating and processing the wafer, the wafer is prone to offset, which will cause mismatch or misalignment between the wafers during the processing process, affecting the final bonding quality and device performance, and reducing the processing cost of the wafer.

[0005] Therefore, it is necessary to design a bonding device for multiple cylindrical semiconductor wafers that can prevent the wafers from shifting and fix the wafers. Summary of the Invention

[0006] The object of the present invention is to provide a bonding device for multiple cylindrical semiconductor wafers to solve the problems raised in the above background technology.

[0007] In order to solve the above technical problems, the present invention provides the following technical solutions: a bonding device for multiple cylindrical semiconductor wafers, comprising a placing plate, a lifting motor and a wafer body, and also comprising a fixing device, a cleaning device, a collecting device and a knocking device; wherein the fixing device comprises a pressure plate and a fixing assembly, the pressure plate is fixedly mounted on the output end of the lifting motor, the fixing assembly comprises a fixing frame, a sliding plate, a pressure rod, a pushing plate, a connecting rod, a clamping plate, a clamping piece, a fixing rod and a tray, the fixing frame is fixedly mounted above the placing plate, the sliding plate is slidably mounted inside the fixing frame, the pressure rod is fixedly mounted above the sliding plate, the pushing plate is slidably mounted on the bottom of the inner wall of the fixing frame, the connecting rod is fixedly mounted on the side of the pushing plate away from the sliding plate, and the clamping plate is fixedly mounted on the side of the connecting rod away from the pushing plate At one end of the pressure plate, the clamp is fixedly mounted on a side of the clamp away from the connecting rod, the fixed rod is fixedly mounted on the surface of the sliding plate, and the tray is fixedly mounted on an end of the fixed rod away from the sliding plate; wherein, the cleaning device includes a connecting plate and a cleaning assembly, the connecting plate is fixedly mounted on the surface of the lifting motor, the cleaning assembly is arranged above the connecting plate, the collecting device includes an air frame and a collecting assembly, the collecting assembly is arranged above the placement plate, the knocking device includes a processing frame and a knocking assembly, the knocking assembly is arranged above the placement plate, the clamp moves to contact the wafer body and fix it, which can effectively avoid the wafer body from being offset, resulting in mismatch or misalignment between the wafer bodies during processing, affecting the final bonding quality and device performance, and reducing the processing cost of the wafer body.

[0008] According to the above technical solution, the side of the push plate close to the sliding plate is opened as a bevel surface 1, the tray and the bottom of the inner wall of the fixed frame are fixedly connected by an elastic telescopic rod, the clip is elastic, and the elastic telescopic rod can drive the tray to reset, and the clip is elastic and can better clamp the wafer body and prevent the wafer body from being damaged.

[0009] According to the above technical solution, the connecting plate is fixedly mounted on the surface of the lifting motor, and the cleaning assembly includes a lower supporting rod, a plastic rod, a brush, a sliding rod and an upper supporting rod, the lower supporting rod is fixedly mounted above the connecting plate, the plastic rod is fixedly mounted above the connecting plate, the brush is slidably mounted above the lower supporting rod, the sliding rod is slidably mounted above the lower supporting rod, the brush is hinged to the sliding rod, the upper supporting rod is fixedly mounted on the surface of the pressure plate, the end of the upper supporting rod away from the pressure plate is hinged to the end of the sliding rod away from the brush, the brush moves and contacts the plastic rod to generate static electricity, and the static electricity can effectively absorb dust splashed during the cleaning process, thereby preventing dust from causing poor contact during the bonding process of the wafer body, and reducing the processing cost and maintenance cost of the wafer body.

[0010] According to the above technical solution, one end of the brush close to the lower supporting rod contacts the plastic rod, and a clockwork spring is provided at the junction of the sliding rod and the lower supporting rod. The brush moves and contacts the plastic rod to generate static electricity, and the static electricity can effectively absorb the dust splashed during the cleaning process. The clockwork spring can drive the sliding rod to reset.

[0011] According to the above technical solution, the air frame is fixedly installed above the placing plate, and the collecting device includes a collecting frame, a baffle, a collecting box, an electrostatic absorption plate, a connecting rod and an extrusion plate. The collecting frame is fixedly installed on the surface of the air frame, and a slide groove 1 is opened on the surface of the collecting frame. The baffle is hinged above the inner wall of the slide groove 1, and the collecting box is fixedly installed on the bottom of the inner wall of the collecting frame. The electrostatic absorption plate is slidably installed above the inner wall of the collecting frame. The connecting rod slides through the inner and outer walls of the collection frame and the air frame. The electrostatic absorption plate is fixedly installed on the end of the connecting rod away from the air frame, and the extrusion plate is fixedly installed on the end of the connecting rod away from the collection frame. The collection box can absorb scattered dust to prevent dust from escaping to the outside and falling on the surface of the wafer body again, thereby improving the cleaning effect and effectively reducing maintenance costs.

[0012] According to the above technical solution, a second clockwork spring is provided at the junction of the baffle and the first slide groove, and the air frame is connected to the collection box through a conduit. The negative pressure generated inside the air frame will introduce the gas inside the collection box into the air frame through the conduit.

[0013] According to the above technical solution, a one-way valve 1 is provided inside the conduit, a collection tube is provided above the collection box, a one-way valve 2 is provided inside the collection tube, the clockwork spring 2 can drive the baffle to reset, the one-way valve 1 can prevent the air inside the air frame from entering the collection box, and the one-way valve 2 can prevent the air inside the collection box from entering the collection frame.

[0014] According to the above technical solution, the processing frame is fixedly installed above the placing plate, and the knocking assembly includes a tilting rod, a rocker, a protrusion and a knocking rod, and a slide groove 2 is opened on the surface of the processing frame, and the tilting rod is fixedly installed on the surface of the pressure rod, and the end of the tilting rod away from the pressure rod is slidably installed on the inner wall of the slide groove 2, and the rocker is fixedly installed on the end of the tilting rod away from the pressure rod, and the protrusion is fixedly installed on the side of the rocker close to the pressure rod, and the knocking rod is hinged on the inner wall of the slide groove 2, and the knocking rod moves and resets under the action of the clockwork spring 3, thereby knocking the sliding plate and generating vibration, and the sliding plate vibrates and drives the fixed rod to vibrate, and the fixed rod vibrates and drives the tray to vibrate, and the tray vibrates and drives the wafer body to vibrate. The vibration can effectively remove bubbles in the adhesive during the bonding process, avoid loose bonding between the wafer bodies due to bubbles, thereby affecting the final bonding quality and device performance, and reducing the processing cost of the wafer body.

[0015] According to the above technical solution, the end of the knocking rod away from the processing frame contacts the sliding plate, and the end of the knocking rod away from the sliding plate is opened into a beveled surface 2. The knocking rod moves up and down to knock the sliding plate to generate vibration. The vibration can effectively remove bubbles in the adhesive during the bonding process, thereby avoiding loose bonding between the wafer bodies due to bubbles.

[0016] According to the above technical solution, the second beveled surface contacts the protrusion, and a clockwork spring three is provided at the intersection of the knock rod and the second slide groove. The clockwork spring three can drive the knock rod to reset, and the protrusion moves downward to contact the second beveled surface and drive the knock rod to knock on the sliding plate to generate vibration.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] (1) The bonding device drives the pressure plate to contact and squeeze the pressure rod downward by moving the lifting motor downward, and then squeezes the sliding plate downward. The sliding plate moves downward to squeeze the push plate and drive the clamp to tighten, so that the clamp clamps the wafer body and fixes it. It can effectively avoid the wafer from being offset, causing mismatch or misalignment between wafers during processing, affecting the final bonding quality and device performance, and reducing the processing cost of the wafer.

[0019] (2) In the bonding equipment, when the pressure plate moves downward, it also drives the upper supporting rod to move downward, and then squeezes the sliding rod to move to both sides of the lifting motor. The movement of the sliding rod drives the brush to clean the surface of the wafer. At the same time, the friction between the brush and the plastic rod generates static electricity, which can effectively absorb dust during the cleaning process, avoid dust causing poor contact during the wafer bonding process, and reduce the processing cost and maintenance cost of the wafer.

[0020] (3) In the bonding equipment, the brush moves to both sides and enters the collection frame. The brush contacts the electrostatic absorption plate to release the static electricity, so that the dust is separated from the brush surface, avoiding the dust on the brush from rubbing against the subsequent wafer output and causing damage to the wafer. At the same time, the movement of the electrostatic absorption plate drives the connecting rod to squeeze the extrusion plate inside the air frame. The movement of the extrusion plate generates negative pressure through the conduit to generate negative pressure inside the collection box. The negative pressure generated by the collection box collects the dust scattered on the brush surface through the collection hole, preventing the dust from escaping to the outside and falling on the wafer surface again, thereby improving the cleaning effect and effectively reducing maintenance costs.

[0021] (4) In the bonding device, the pressure rod moves downward to drive the tilting rod to move downward, the movement of the tilting rod drives the rocker to move, the movement of the rocker drives the bump to move and contact the knocking rod, and the knocking rod is reset under the action of the spring three while moving downward, and then moves repeatedly, so that the knocking rod knocks the sliding plate, and the sliding plate is vibrated by the knocking, which drives the fixed rod and the tray to vibrate, and the vibration of the tray drives the wafer to vibrate. The vibration of the wafer can effectively remove bubbles in the adhesive during the bonding process, avoid the wafer from being loosely bonded due to bubbles, and thus affect the final bonding quality and device performance, thereby reducing the processing cost of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0023] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0024] Figure 2 It is a schematic structural diagram of the fixing device of the present invention;

[0025] Figure 3 It is a schematic diagram of the push plate and clamping plate structure of the present invention;

[0026] Figure 4 It is a schematic structural diagram of the cleaning device of the present invention;

[0027] Figure 5 This is a schematic diagram of the brush and plastic rod structure of the present invention;

[0028] Figure 6 It is a schematic structural diagram of the collecting device of the present invention;

[0029] Figure 7 It is a structural schematic diagram of the knocking device of the present invention.

[0030] In the figure: 1. Placement plate; 2. Lifting motor; 3. Wafer body; 4. Fixing assembly; 41. Pressing plate; 42. Fixing frame; 43. Sliding plate; 431. Pressing rod; 44. Pushing plate; 45. Connecting rod; 46. Clamping plate; 461. Clamping piece; 47. Fixing rod; 48. Tray; 5. Cleaning assembly; 51. Connecting plate; 52. Lower supporting rod; 53. Plastic rod; 54. Brush; 55. Sliding rod; 56. Upper supporting rod; 6. Collecting assembly; 61. Air frame; 62. Collecting frame; 621. Baffle; 63. Collecting box; 64. Electrostatic absorption plate; 65. Connecting rod; 66. Extrusion plate; 7. Knocking assembly; 71. Processing frame; 72. Tilt rod; 73. Tilt plate; 74. Bump; 75. Knocking rod. DETAILED DESCRIPTION

[0031] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention. Example

[0032] See also Figure 1-5 , this embodiment provides: a bonding device for multiple cylindrical semiconductor wafers, including a placement plate 1, a lifting motor 2 and a wafer body 3, and also includes a fixing device and a cleaning device; wherein the fixing device includes a pressing plate 41 and a fixing assembly 4, the pressing plate 41 is fixedly installed at the output end of the lifting motor 2, the fixing assembly 4 includes a fixing frame 42, a sliding plate 43, a pressing rod 431, a pushing plate 44, a connecting rod 45, a clamping plate 46, a clamping piece 461, a fixing rod 47 and a tray 48, the fixing frame 42 is fixedly installed above the placement plate 1, the sliding plate 43 is slidably installed inside the fixing frame 42, the pressing rod 431 is fixedly installed above the sliding plate 43, the pushing plate 44 is slidably installed at the bottom of the inner wall of the fixing frame 42, and the connecting rod 45 is fixedly installed at the far end of the pushing plate 44 On one side of the sliding plate 43, the clamp 46 is fixedly mounted on the end of the connecting rod 45 away from the pushing plate 44, the clamp 461 is fixedly mounted on the side of the clamp 46 away from the connecting rod 45, the fixing rod 47 is fixedly mounted on the surface of the sliding plate 43, and the tray 48 is fixedly mounted on the end of the fixing rod 47 away from the sliding plate 43; wherein, the cleaning device includes a connecting plate 51 and a cleaning assembly 5, the connecting plate 51 is fixedly mounted on the surface of the lifting motor 2, the cleaning assembly 5 is arranged above the connecting plate 51, the clamp 461 moves to contact the wafer body 3 and fix it, which can effectively avoid the wafer body 3 from being offset, causing mismatch or misalignment between the wafer bodies 3 during processing, affecting the final bonding quality and device performance, and reducing the processing cost of the wafer body 3.

[0033] The side of the push plate 44 close to the sliding plate 43 is opened as a bevel surface 1, and the tray 48 is fixedly connected to the bottom of the inner wall of the fixed frame 42 by an elastic telescopic rod. The clip 461 is elastic, and the elastic telescopic rod can drive the tray 48 to reset. The clip 461 is elastic and can better clamp the wafer body 3 and prevent the wafer body 3 from being damaged.

[0034] The connecting plate 51 is fixedly mounted on the surface of the lifting motor 2, and the cleaning assembly 5 includes a lower supporting rod 52, a plastic rod 53, a brush 54, a sliding rod 55 and an upper supporting rod 56. The lower supporting rod 52 is fixedly mounted above the connecting plate 51, the plastic rod 53 is fixedly mounted above the connecting plate 51, the brush 54 is slidably mounted above the lower supporting rod 52, and the sliding rod 55 is slidably mounted above the lower supporting rod 52. The brush 54 is hinged to the sliding rod 55, and the upper supporting rod 56 is fixedly mounted on the surface of the pressure plate 41. The end of the upper supporting rod 56 away from the pressure plate 41 is hinged to the end of the sliding rod 55 away from the brush 54. The brush 54 moves and contacts the plastic rod 53 to generate static electricity. The static electricity can effectively absorb dust splashed during the cleaning process, avoid dust causing poor contact during the bonding process of the wafer body 3, and reduce the processing cost and maintenance cost of the wafer body 3.

[0035] One end of the brush 54 close to the lower supporting rod 52 contacts the plastic rod 53, and a spring 1 is provided at the intersection of the sliding rod 55 and the lower supporting rod 52. The brush 54 moves and contacts the plastic rod 53 to generate static electricity, which can effectively absorb dust splashed during the cleaning process. The spring 1 can drive the sliding rod 55 to reset.

[0036] When embodiment 1 is working, the lifting motor 2 is started, and the output end of the lifting motor 2 moves downward, driving the pressure plate 41 to move downward, and the pressure plate 41 moves downward to contact and squeeze the pressure rod 431 to move downward, and the pressure rod 431 moves downward to drive the sliding plate 43 to move downward, and the sliding plate 43 moves downward to drive the fixing rod 47 to move downward, and the fixing rod 47 moves downward to drive the tray 48 to move downward, and the tray 48 moves to drive the wafer body 3 to move downward, and the sliding plate 43 moves downward to contact and squeeze the pushing plate 44 to move away from the sliding plate 43, and the pushing plate 44 moves to drive the connecting rod 45 to move, and the connecting rod 45 moves to drive the clamping plate 46 to move, and the clamping plate 46 moves to drive the clamping piece 461 to move, and the clamping piece 461 moves to contact the wafer body 3 and fix it, which can effectively avoid the wafer body 3 from being offset, so that the wafer bodies 3 during the processing process are mismatched or misaligned, affecting the final bonding quality and device performance, and reducing the processing cost of the wafer body 3.

[0037] When the pressing plate 41 moves downward, it drives the upper supporting rod 56 to move downward. The upper supporting rod 56 moves downward to squeeze the sliding rod 55 to move toward both sides of the connecting plate 51. The movement of the sliding rod 55 drives the brush 54 to move. The brush 54 moves to clean the dust on the surface of the wafer body 3. At the same time, the brush 54 moves and contacts with the plastic rod 53 to generate static electricity. The static electricity can effectively absorb the dust flying during the cleaning process, avoiding the dust causing poor contact during the bonding process of the wafer body 3, thereby reducing the processing cost and maintenance cost of the wafer body 3. Example

[0038] See also Figure 1-7 On the basis of embodiment 1, this embodiment further includes a collecting device and a knocking device. The collecting device includes an air frame 61 and a collecting component 6. The collecting component is arranged above the placement plate 1. The knocking device includes a processing frame 71 and a knocking component 7. The knocking component 7 is arranged above the placement plate 1. The air frame 61 is fixedly installed above the placement plate 1. The collecting device 6 includes a collecting frame 62, a baffle 621, a collecting box 63, an electrostatic absorption plate 64, a connecting rod 65 and an extrusion plate 66. The collecting frame 62 is fixedly installed on the surface of the air frame 61. A slide groove 1 is opened on the surface of the collecting frame 62. The baffle The plate 621 is hinged on the inner wall of the slide 1, the collection box 63 is fixedly installed on the bottom of the inner wall of the collection frame 62, the electrostatic absorption plate 64 is slidably installed on the inner wall of the collection frame 62, and the connecting rod 65 slides through the inner and outer walls of the collection frame 62 and the air frame 61. The electrostatic absorption plate 64 is fixedly installed on the end of the connecting rod 65 away from the air frame 61, and the extrusion plate 66 is fixedly installed on the end of the connecting rod 65 away from the collection frame 62. The collection box 63 can absorb scattered dust to prevent dust from escaping to the outside and falling on the surface of the wafer body 3, thereby improving the cleaning effect and effectively reducing maintenance costs.

[0039] A second spring is provided at the junction of the baffle 621 and the first slide. The air frame 61 is connected to the collection box 63 through a conduit. The negative pressure generated inside the air frame 61 will guide the gas inside the collection box 63 into the air frame 61 through the conduit.

[0040] A one-way valve 1 is provided inside the conduit, a collection tube is provided above the collection box 63, a one-way valve 2 is provided inside the collection tube, and the clockwork spring 2 can drive the baffle 621 to reset. The one-way valve 1 can prevent the air inside the air frame 61 from entering the collection box 63, and the one-way valve 2 can prevent the air inside the collection box 63 from entering the collection frame 62.

[0041] The locking cam 732 is fixed on the locking cam 731 and the locking cam 733 is fixed on the top of the locking cam 731 so as to lock the locking cam 732. When the locking cam 732 is in the unlocked state, the locking cam 733 is locked and the locking cam 733 is in the unlocked state.

[0042] The end of the knocking rod 75 away from the processing frame 71 is in contact with the sliding plate 43, and the end of the knocking rod 75 away from the sliding plate 43 is opened as a bevel surface 2. The knocking rod 75 moves up and down to knock the sliding plate 43 to generate vibration. The vibration can effectively remove bubbles in the adhesive during the bonding process, thereby avoiding loose bonding between the wafer bodies 3 due to bubbles.

[0043] The beveled surface 1 contacts the protrusion 74, and a spring 3 is provided at the intersection of the knock rod 75 and the slide groove 2. The spring 3 can drive the knock rod 75 to reset, and the protrusion 74 moves downward to contact the beveled surface 2 and drive the knock rod 75 to knock the sliding plate 43 to generate vibration.

[0044] When the second embodiment is working, the brush 54 moves to contact and squeeze the baffle 621 to open the entrance of the collection frame 62, and the brush 54 moves into the collection frame 62 to contact and squeeze the electrostatic absorption plate 64 to move away from the baffle 621. The movement of the electrostatic absorption plate 64 drives the connecting rod 65 to move, and the movement of the connecting rod 65 drives the squeezing plate 66 to move. The squeezing plate 66 moves to squeeze the air inside the air frame 61 and makes the squeezing plate 66 close to the side of the collection frame 62 to generate negative pressure. The negative pressure causes the air to enter the air frame 61 from the inside of the collection box 63 through the duct. The air inside the collection box 63 loses and generates negative pressure. The negative pressure causes the air inside the collection frame 62 to enter the inside of the collection box 63 through the collection hole, which can effectively collect the dust scattered on the surface of the brush 54 due to the elimination of static electricity, and prevent the dust from escaping to the outside and falling on the surface of the wafer body 3 again, thereby improving the cleaning effect and effectively reducing the maintenance cost.

[0045] When the pressure rod 431 moves downward, it drives the tilting rod 72 to move downward inside the processing frame 71. The tilting rod 72 moves downward, driving the rocker 73 to move downward, and the rocker 73 moves downward, driving the bump 74 to move downward. The bump 74 moves downward to contact and drive the knocking rod 75 close to the bump 74 to move downward, so that the knocking rod 75 moves upward away from the bump 74. The knocking rod 75 moves and resets under the action of the spring three, thereby knocking the sliding plate 43 and generating vibration. The vibration of the sliding plate 43 drives the fixed rod 47 to vibrate, the vibration of the fixed rod 47 drives the tray 48 to vibrate, and the vibration of the tray 48 drives the wafer body 3 to vibrate. The vibration can effectively remove bubbles in the adhesive during the bonding process, avoid loose bonding between the wafer bodies 3 due to bubbles, thereby affecting the final bonding quality and device performance, and reducing the processing cost of the wafer body 3.

[0046] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that includes a list of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus.

[0047] Finally, it should be noted that the above descriptions are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art will be able to modify the technical solutions described in the aforementioned embodiments or substitute equivalents for some of the technical features. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A bonding device for multiple cylindrical semiconductor wafers, comprising a placement plate (1), a lifting motor (2) and a wafer body (3), characterized in that: It also includes fixing devices, cleaning devices, collecting devices and knocking devices; The fixing device includes a pressure plate (41) and a fixing assembly (4), wherein the pressure plate (41) is fixedly mounted on the output end of the lifting motor (2), and the fixing assembly (4) includes a fixing frame (42), a sliding plate (43), a pressure rod (431), a push plate (44), a connecting rod (45), a clamping plate (46), a clamping piece (461), a fixing rod (47) and a tray (48), wherein the fixing frame (42) is fixedly mounted above the placement plate (1), the sliding plate (43) is slidably mounted inside the fixing frame (42), and the pressure rod (431) is fixedly mounted on the sliding plate (461). Above the movable plate (43), the push plate (44) is slidably mounted on the bottom of the inner wall of the fixed frame (42), the connecting rod (45) is fixedly mounted on a side of the push plate (44) away from the sliding plate (43), the clamping plate (46) is fixedly mounted on an end of the connecting rod (45) away from the push plate (44), the clamping piece (461) is fixedly mounted on a side of the clamping plate (46) away from the connecting rod (45), the fixed rod (47) is fixedly mounted on the surface of the sliding plate (43), and the tray (48) is fixedly mounted on an end of the fixed rod (47) away from the sliding plate (43); The cleaning device comprises a connecting plate (51) and a cleaning component (5), wherein the connecting plate (51) is fixedly mounted on the surface of the lifting motor (2), and the cleaning component (5) is arranged above the connecting plate (51). The collecting device comprises an air frame (61) and a collecting component (6), and the collecting component (6) is arranged above the placement plate (1). The knocking device comprises a processing frame (71) and a knocking component (7), and the knocking component (7) is arranged above the placement plate (1).

2. The bonding device for multiple cylindrical semiconductor wafers according to claim 1, characterized in that: A side of the push plate (44) close to the sliding plate (43) is provided with a beveled surface 1. The tray (48) is fixedly connected to the bottom of the inner wall of the fixed frame (42) via an elastic telescopic rod, and the clip (461) is elastic.

3. The bonding device for multiple cylindrical semiconductor wafers according to claim 2, characterized in that: The connecting plate (51) is fixedly mounted on the surface of the lifting motor (2); the cleaning assembly (5) comprises a lower supporting rod (52), a plastic rod (53), a brush (54), a sliding rod (55) and an upper supporting rod (56); the lower supporting rod (52) is fixedly mounted above the connecting plate (51); the plastic rod (53) is fixedly mounted above the connecting plate (51); the brush (54) is slidably mounted above the lower supporting rod (52); the sliding rod (55) is slidably mounted above the lower supporting rod (52); the brush (54) is hinged to the sliding rod (55); the upper supporting rod (56) is fixedly mounted on the surface of the pressing plate (41); an end of the upper supporting rod (56) away from the pressing plate (41) is hinged to an end of the sliding rod (55) away from the brush (54).

4. The bonding device for multiple cylindrical semiconductor wafers according to claim 3, characterized in that: One end of the brush (54) close to the lower receiving rod (52) contacts the plastic rod (53), and a spring is provided at the junction of the sliding rod (55) and the lower receiving rod (52).

5. The bonding device for multiple cylindrical semiconductor wafers according to claim 4, characterized in that: The air frame (61) is fixedly mounted above the placement plate (1); the collection assembly (6) includes a collection frame (62), a baffle (621), a collection box (63), an electrostatic absorption plate (64), a connecting rod (65) and an extrusion plate (66); the collection frame (62) is fixedly mounted on the surface of the air frame (61); a slide groove 1 is provided on the surface of the collection frame (62); the baffle (621) is hinged above the inner wall of the slide groove 1; the collection box (63) is fixedly mounted on the bottom of the inner wall of the collection frame (62); the electrostatic absorption plate (64) is slidably mounted above the inner wall of the collection frame (62); the connecting rod (65) slides through the inner and outer walls of the collection frame (62) and the air frame (61); the electrostatic absorption plate (64) is fixedly mounted on the end of the connecting rod (65) away from the air frame (61); and the extrusion plate (66) is fixedly mounted on the end of the connecting rod (65) away from the collection frame (62).

6. The bonding device for multiple cylindrical semiconductor wafers according to claim 5, characterized in that: A second spring is provided at the junction of the baffle (621) and the first slide groove, and the air frame (61) and the collection box (63) are connected via a conduit.

7. The bonding device for multiple cylindrical semiconductor wafers according to claim 6, characterized in that: A one-way valve 1 is provided inside the conduit, a collection tube is provided above the collection box (63), and a one-way valve 2 is provided inside the collection tube.

8. The bonding device for multiple cylindrical semiconductor wafers according to claim 7, characterized in that: The processing frame (71) is fixedly mounted above the placement plate (1); the knocking assembly (7) comprises a tilting rod (72), a rocker (73), a protrusion (74) and a knocking rod (75); a second slide groove is provided on the surface of the processing frame (71); the tilting rod (72) is fixedly mounted on the surface of the pressure rod (431); an end of the tilting rod (72) away from the pressure rod (431) is slidably mounted on the inner wall of the second slide groove; the rocker (73) is fixedly mounted on an end of the tilting rod (72) away from the pressure rod (431); the protrusion (74) is fixedly mounted on a side of the rocker (73) close to the pressure rod (431); and the knocking rod (75) is hinged to the inner wall of the second slide groove.

9. The bonding device for multiple cylindrical semiconductor wafers according to claim 8, characterized in that: One end of the knocking rod (75) away from the processing frame (71) contacts the sliding plate (43), and one end of the knocking rod (75) away from the sliding plate (43) is formed into a second beveled surface.

10. The bonding device for multiple cylindrical semiconductor wafers according to claim 9, characterized in that: The second beveled surface contacts the protrusion (74), and a third spring is provided at the junction of the knock rod (75) and the second slide groove.

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