A die bonder with a double-layer conveying function

Abstract

The present invention relates to the field of die bonders, and discloses a die bonder with a double-layer conveying function, comprising: a die bonder main body, a substrate stage, a double-layer conveying mechanism, a wafer tray, a fixed arm, a swing arm, a dynamic cancellation mechanism, an auxiliary stabilization mechanism and a linear motor; the substrate stage, the double-layer conveying mechanism and the linear motor are all arranged on the die bonder main body, and the wafer tray is arranged on the double-layer conveying mechanism; the linear motor slide is fixedly connected to the fixed arm through a connecting plate, the fixed arm is rotatably connected to the swing arm, and the dynamic cancellation mechanism is arranged on the swing arm; the swing arm is in transmission cooperation with a driving member, and when the driving member drives the swing arm to perform a rotational action, a working part of the dynamic cancellation mechanism moves relative to the swing arm in the opposite direction. By setting the dynamic cancellation mechanism, the present invention reduces the influence of the inertia of the swing arm. While the auxiliary stabilization mechanism restricts the position of the swing arm to improve the accuracy of crystal picking and die bonding, it uses the oil liquid in the semi-circular ring to conduct heat, reduces component loss, and ensures the reliability of operation.

Description

Technical Field

[0001] The present invention relates to the technical field of die bonder, and more specifically, it relates to a die bonder with a double-layer conveying function. Background Art

[0002] As a core device in the LED packaging production line, the die bonder undertakes the important task of accurately transferring and installing the LED chips on the wafer to the corresponding installation positions on the LED board (such as MiniLED or MicroLED display panels, etc.). The currently common structure of the die bonder mainly consists of a carrier table, a wafer tray, and a swing arm. The main function of the carrier table is to carry the substrate, that is, the LED board on which the LED chips need to be installed. The wafer tray is used to place various wafers, such as wafers containing red LED chips, wafers with green LED chips, and wafers equipped with blue LED chips, etc. The swing arm has the ability to move back and forth between the wafer tray and the carrier table. When the swing arm moves to the position of the wafer tray, it will obtain the wafers from the wafer, and these wafers can be red LED chips, green LED chips, or blue LED chips, etc.; when the swing arm moves to the position of the carrier table, it will accurately transfer and install the obtained wafers onto the substrate placed on the carrier table.

[0003] Currently, the driving method of the swing arm of the die bonder mainly adopts the shaft drive form. Specifically, a driving force is applied to the shaft connected to the end of the swing arm to achieve driving. However, this driving method only provides power at a single point. Given the relatively long length of the swing arm itself and the certain weight of the crystal picking mechanism installed at the end of the swing arm, during the high-speed swinging process, the end of the swing arm is easily affected by inertia and gravity. Conventional driving components such as hydraulic cylinders can accurately control and suppress inertia. However, as the usage time of the hydraulic cylinder increases, there is wear inside it, which easily leads to the situation of unstable hydraulic pressure, resulting in the inability to suppress the inertia of the end of the swing arm and causing unstable phenomena during the movement of the end of the swing arm. Specifically, it is manifested as small displacements of the swing arm in the vertical and horizontal directions. This instability makes it difficult for the swing arm to maintain stability during swinging, which has an adverse impact on the accuracy of crystal picking. Summary of the Invention

[0004] The present invention provides a die bonder with a double-layer conveying function, which solves the technical problem that in the related art, small displacements occur in the vertical and horizontal directions of the swing arm, resulting in difficulty in maintaining the swing arm stable during swinging and having an adverse impact on the accuracy of crystal picking.

[0005] The present invention provides a die bonder with a double-layer conveying function, including: a die bonder main body, a substrate carrier table, a double-layer conveying mechanism, a wafer tray, a fixed arm, a swing arm, a dynamic cancellation mechanism, an auxiliary stabilization mechanism, and a linear motor;

[0006] The substrate stage, the double-layer conveying mechanism and the linear motor are all arranged on the die bonder main body, and the wafer tray is arranged on the double-layer conveying mechanism;

[0007] The linear motor slide is fixedly connected to the fixed arm through a connecting plate. The fixed arm is rotatably connected to the swing arm, and the dynamic cancellation mechanism is arranged on the swing arm;

[0008] The swing arm is in driving cooperation with a driving member. When the driving member drives the swing arm to perform a rotating action, the acting part of the dynamic cancellation mechanism moves relative to the swing arm in the opposite direction to apply a dynamic inertia moment. During this process, the auxiliary stabilizing mechanism will limit the position of the swing arm in the length and vertical directions.

[0009] As a further optimized solution of the present invention, the double-layer conveying mechanism includes an X module, a support plate, a servo motor, a bidirectional threaded rod and a loading table. The X module is assembled on the die bonder main body. The support plate is installed at the conveying end of the X module. The servo motor is installed on the support plate, and the driving shaft of the servo motor is axially connected to the bidirectional threaded rod. The loading table is slidably arranged on the support plate and is threadedly sleeved with the bidirectional threaded rod. The wafer tray is placed on the loading table.

[0010] As a further optimized solution of the present invention, a guide rail is installed on the support plate, and the slide of the guide rail is fixedly connected to the loading table.

[0011] As a further optimized solution of the present invention, the dynamic cancellation mechanism includes a mounting plate, a driven bevel gear, a ball screw, a counterweight and a guide plate. The mounting plate is installed on the swing arm and is fixedly connected to the guide plate. The ball screw is rotatably arranged on the mounting plate and is axially connected to the driven bevel gear. The counterweight is fixedly sleeved on the moving table of the ball screw and is in rolling connection with the guide plate.

[0012] As a further optimized solution of the present invention, a rolling member is arranged at the bottom of the counterweight, and the rolling member is in rolling connection with the top of the guide plate.

[0013] As a further optimized solution of the present invention, the driving member includes a driving motor, a driving gear, a transmission gear, a transmission bevel gear, a rotating rod, a bottom gear and a synchronous gear. The driving motor is fixedly installed on the connecting plate. The driving shaft of the driving motor extends into the inside of the fixed arm and is fixedly sleeved with the driving gear. The transmission gear is rotatably arranged in the fixed arm and is in mutual transmission. One of the transmission gears is in driving cooperation with the driving gear and is axially connected to the synchronous gear through a linkage shaft. The other transmission gear is axially connected to the swing arm. The transmission bevel gear and the bottom gear are both fixedly sleeved on the rotating rod. One end of the rotating rod rotatably extends into the swing arm. The bottom gear is in driving cooperation with the synchronous gear, and the transmission bevel gear is in driving cooperation with the driven bevel gear.

[0014] As a further optimization solution of the present invention, the auxiliary stabilizing mechanism includes a limit frame, a rolling ball and a semi-circular ring. The semi-circular ring is fixedly connected to the linear motor slide. The limit frame forms an opening on one side and is installed on the swing arm. The rolling ball is rotatably sleeved on the side of the limit frame close to the swing arm and is in rolling connection with the inner peripheral wall of the semi-circular ring.

[0015] As a further optimization solution of the present invention, there is a gap between the inner top wall and the bottom wall of the limit frame and the semi-circular ring. A first magnetic block is embedded in the inner top wall of the limit frame, and a second magnetic block is embedded at the inner bottom of the limit frame. The interior of the semi-circular ring is provided in the middle and is slidably provided with a follower magnetic block. The follower magnetic block has the opposite magnetic polarity to the first magnetic block and the same magnetic polarity as the second magnetic block.

[0016] As a further optimization solution of the present invention, the interior of the semi-circular ring is filled with oil, and the oil submerges the follower magnetic block.

[0017] As a further optimization solution of the present invention, both the top and bottom of the semi-circular ring are made of non-metallic materials, and the inner circumference of the semi-circular ring is a metal inner circumference.

[0018] The beneficial effects of the present invention are as follows:

[0019] 1. For the die bonder with a double-layer conveying function of the present invention, by setting a dynamic cancellation mechanism, the inertial force generated during the rotation of the swing arm is reduced, thereby reducing its inertial influence. At the same time, the auxiliary stabilizing mechanism restricts the position of the swing arm in the length and vertical directions, inhibits the swaying and offset of the end of the swing arm, makes the swing arm more stable when performing crystal picking and die bonding operations, greatly improves the operation accuracy, and ensures the quality stability of the die bonding process.

[0020] 2. For the die bonder with a double-layer conveying function of the present invention, by setting an auxiliary stabilizing mechanism, heat dissipation during repeated use is realized. The interior of the semi-circular ring in the auxiliary stabilizing mechanism is filled with oil, and the oil submerges the follower magnetic block. When the swing arm moves, heat is generated when the rolling ball rolls on the inner peripheral wall of the semi-circular ring and the follower magnetic block slides in the semi-circular ring. At this time, the oil can stably conduct these heats, evenly disperse the heats, avoid local overheating, thereby reducing the performance loss and wear of related components caused by high temperature, effectively increasing the stability of the auxiliary stabilizing mechanism itself during use, and further ensuring the reliability of the overall operation of the die bonder. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic structural diagram of a die bonder with a double-layer conveying function proposed by the present invention.

[0022] Figure 2 It is a schematic structural diagram of the double-layer conveying mechanism in a die bonder with a double-layer conveying function proposed by the present invention.

[0023] Figure 3 Schematic diagram of the internal structure of the fixed arm in a die bonder with a double-layer conveying function proposed by the present invention.

[0024] Figure 4 Schematic diagram of the side cross-sectional structure of the fixed arm in a die bonder with a double-layer conveying function proposed by the present invention.

[0025] Figure 5 Schematic diagram of the cross-sectional structure of the semi-circular ring in a die bonder with a double-layer conveying function proposed by the present invention.

[0026] Figure 6 Schematic diagram of the structure of the limit frame in a die bonder with a double-layer conveying function proposed by the present invention.

[0027] In the figure:

[0028] 1. Die bonder main body;

[0029] 2. Substrate stage;

[0030] 3. Double-layer conveying mechanism; 31. X module; 32. Support plate; 33. Servo motor; 34. Bidirectional threaded rod; 35. Loading table; 36. Guide rail;

[0031] 4. Wafer tray;

[0032] 5. Fixed arm;

[0033] 6. Swing arm;

[0034] 7. Dynamic cancellation mechanism; 71. Mounting plate; 72. Driven bevel gear; 73. Ball screw; 74. Counterweight; 75. Guide plate;

[0035] 8. Auxiliary stability mechanism; 81. Limit frame; 82. Ball; 83. Semi-circular ring; 84. Magnet 1; 85. Magnet 2; 86. Follow-up magnet;

[0036] 9. Linear motor;

[0037] 10. Connecting plate;

[0038] 11. Driving motor;

[0039] 12. Driving gear;

[0040] 13. Transmission gear;

[0041] 14. Transmission bevel gear;

[0042] 15. Rotating rod;

[0043] 16. Bottom gear;

[0044] 17. Synchronous gear. Detailed implementation mode

[0045] The subject matter described herein will now be discussed with reference to exemplary implementation modes. It should be understood that discussing these implementation modes is only to enable those skilled in the art to better understand and thus implement the subject matter described herein. Without departing from the scope of protection of the content of this specification, changes can be made to the functions and arrangements of the elements discussed. Each example can omit, substitute, or add various processes or components as needed. In addition, the features described in some examples can also be combined in other examples.

[0046] As Figures 1 to 3 shown, a die bonder with a double-layer conveying function according to an embodiment of the present invention includes: a die bonder main body 1, a substrate stage 2, a double-layer conveying mechanism 3, a wafer cassette 4, a fixed arm 5, a swing arm 6, a dynamic cancellation mechanism 7, an auxiliary stabilization mechanism 8, and a linear motor 9;

[0047] The substrate stage 2, the double-layer conveying mechanism 3, and the linear motor 9 are all provided on the die bonder main body 1, and the wafer cassette 4 is provided on the double-layer conveying mechanism 3;

[0048] The slide of the linear motor 9 is fixedly connected to the fixed arm 5 through a connecting plate 10. The fixed arm 5 is rotatably connected to the swing arm 6, and the dynamic cancellation mechanism 7 is provided on the swing arm 6;

[0049] The swing arm 6 is in transmission cooperation with a driving member. When the driving member drives the swing arm 6 to perform a rotational movement, the acting part of the dynamic cancellation mechanism 7 moves relative to the swing arm 6 in the opposite direction to apply a dynamic inertia moment. During this process, the auxiliary stabilization mechanism 8 will limit the position of the swing arm 6 in the length and vertical directions.

[0050] Due to the combined use of the fixed arm 5 and the swing arm 6, the length of the swing arm 6 is shortened compared with the past, reducing the length of the swing arm for picking up wafers in the past, reducing the length of the swing arm, and reducing the deformation during high-speed swinging.

[0051] The substrate stage 2 is used to carry the substrate on which the chips need to be installed. The double-layer conveying mechanism 3 can accurately convey the wafer trays 4 to different positions. A total of two wafer trays 4 are conveyed from both sides at one time, facilitating the swing arm 6 to pick up the wafers in time to achieve double-layer conveying. The linear motor 9 drives the fixed arm 5 to move through the connecting plate 10. The fixed arm 5 is rotatably connected to the swing arm 6. The dynamic cancellation mechanism 7 is installed on the swing arm 6. When the swing arm 6 rotates under the action of the driving member, the acting part of the dynamic cancellation mechanism 7 moves relative to the swing arm 6 in the opposite direction. This is because when the swing arm 6 rotates, inertial force and gravity will affect its stability. The dynamic cancellation mechanism 7 applies a dynamic inertial moment through this relative movement. Using the principle of moment balance, part of the inertial force generated when the swing arm 6 rotates is cancelled, thereby reducing the sway at the end of the swing arm 6. The auxiliary stabilizing mechanism 8 restricts the position of the swing arm 6 from the length and vertical direction of the swing arm 6, further enhancing the stability of the swing arm 6 during movement.

[0052] As Figure 2 shown, the double-layer conveying mechanism 3 includes an X module 31, a support plate 32, a servo motor 33, a bidirectional threaded rod 34 and a wafer loading table 35. The X module 31 is assembled on the die bonder main body 1. The support plate 32 is installed at the conveying end of the X module 31. The servo motor 33 is installed on the support plate 32, and the drive shaft of the servo motor 33 is axially connected to the bidirectional threaded rod 34. The wafer loading table 35 is slidably arranged on the support plate 32 and is threadedly sleeved on the bidirectional threaded rod 34. The wafer tray 4 is placed on the wafer loading table 35.

[0053] It should be noted that the X module 31 is assembled on the die bonder main body 1, which can provide linear motion in the horizontal direction. The support plate 32 is installed at the conveying end of the X module 31 and moves along with the movement of the X module 31. The servo motor 33 is installed on the support plate 32, and its drive shaft is axially connected to the bidirectional threaded rod 34. When the servo motor 33 is started, it will drive the bidirectional threaded rod 34 to rotate. The threads on the bidirectional threaded rod 34 are divided into two sections, and the two sections of threads are symmetrically arranged to be threadedly connected to the two wafer loading tables 35 respectively. Since the wafer loading table 35 is threadedly sleeved on the bidirectional threaded rod 34 and is slidably arranged on the support plate 32, according to the principle of screw drive, the rotation of the bidirectional threaded rod 34 will be converted into the linear movement of the wafer loading table 35 on the support plate 32. In this way, by controlling the forward and reverse rotation and speed of the servo motor 33, the two wafer loading tables 35 can be made to approach or move away from each other, thereby realizing the one-time double-layer conveying of the wafers on the wafer tray 4.

[0054] Furthermore, in order to increase the smoothness of the movement of the wafer loading table 35, a guide rail 36 is installed on the support plate 32, and the sliding table of the guide rail 36 is fixedly connected to the wafer loading table 35.

[0055] As Figure 3As shown in the figure, the dynamic cancellation mechanism 7 includes a mounting plate 71, a driven bevel gear 72, a ball screw 73, a counterweight 74 and a guide plate 75. The mounting plate 71 is mounted on the swing arm 6 and fixedly connected to the guide plate 75. The ball screw 73 is rotatably arranged on the mounting plate 71 and axially connected to the driven bevel gear 72. The counterweight 74 is fixedly sleeved on the moving table of the ball screw 73 and is in rolling connection with the guide plate 75.

[0056] When the driving member operates to drive the driven bevel gear 72 to rotate, the ball screw 73 rotates accordingly. Since the counterweight 74 is fixedly sleeved on the moving table of the ball screw 73 and is in rolling connection with the guide plate 75, according to the transmission principle of the ball screw 73, the rotation of the ball screw 73 will drive the counterweight 74 to move linearly along the guide plate 75. In this way, when the swing arm 6 rotates, the counterweight 74 will move relative to the swing arm 6 in the opposite direction, thereby generating a dynamic inertial moment to cancel the inertial force when the swing arm 6 rotates. While the driving member drives the swing arm 6 to rotate, the counterweight 74 moves on the guide plate 75. During the entire rotation process of the swing arm 6, the counterweight 74 continuously generates a dynamic moment to cancel the inertial force of the swing arm 6 in real time, effectively enhancing the cancellation effect of the dynamic cancellation mechanism 7 on the inertial force of the swing arm 6, significantly improving the stability of the swing arm 6 during high-speed rotation, greatly reducing the swaying at the end of the swing arm 6, and thus improving the accuracy of crystal picking and crystal bonding of the die bonder.

[0057] Furthermore, a rolling member (the rolling member is not shown in the figure, and the rolling member is a ball or a roller. When a ball is selected, the ball is rotatably sleeved inside the counterweight 74) is provided at the bottom of the counterweight 74, and the rolling member is in rolling connection with the top of the guide plate 75, thereby increasing the smoothness of the movement of the counterweight 74.

[0058] As Figure 3 and Figure 4 shown in the figure, the driving member includes a driving motor 11, a driving gear 12, a transmission gear 13, a transmission bevel gear 14, a rotating rod 15, a bottom gear 16 and a synchronous gear 17. The driving motor 11 is fixedly installed on the connecting plate 10. The driving shaft of the driving motor 11 extends into the inside of the fixed arm 5 and is fixedly sleeved with the driving gear 12. The transmission gear 13 is rotatably arranged inside the fixed arm 5 and transmits power to each other. One transmission gear 13 is in transmission cooperation with the driving gear 12 and is axially connected to the synchronous gear 17 through a linkage shaft. The other transmission gear 13 is axially connected to the swing arm 6. The transmission bevel gear 14 and the bottom gear 16 are both fixedly sleeved on the rotating rod 15. One end of the rotating rod 15 rotatably extends into the swing arm 6. The bottom gear 16 is in transmission cooperation with the synchronous gear 17, and the transmission bevel gear 14 is in transmission cooperation with the driven bevel gear 72.

[0059] The driving motor 11 is fixedly mounted on the connecting plate 10. After starting, its driving shaft drives the driving gear 12 to rotate. The driving gear 12 and the transmission gear 13 inside the fixed arm 5 transmit to each other. One of the transmission gears 13 cooperates with the driving gear 12 and is axially connected to the synchronous gear 17 through a linkage shaft to transmit power to the synchronous gear 17. The other transmission gear 13 is axially connected to the swing arm 6 to drive the swing arm 6 to rotate. A transmission bevel gear 14 and a bottom gear 16 are fixedly mounted on the rotating rod 15. The bottom gear 16 cooperates with the synchronous gear 17 to transmit the power of the synchronous gear 17 to the rotating rod 15 to rotate the rotating rod 15. When the rotating rod 15 rotates, the transmission bevel gear 14 at its end cooperates with the driven bevel gear 72 to drive the driven bevel gear 72 to rotate, thereby driving the dynamic compensation mechanism 7 to work, thereby realizing the rotation of the swing arm 6 by the driving motor 11 and the operation of the dynamic compensation mechanism 7.

[0060] like Figure 3 and Figure 5 As shown, the auxiliary stabilization mechanism 8 includes a limit frame 81, a rolling ball 82 and a semicircular ring 83. The semicircular ring 83 is fixedly connected to the slide of the linear motor 9. The limit frame 81 forms an opening on one side and is installed on the swing arm 6. The rolling ball 82 is rotatably sleeved on one side of the limit frame 81 close to the swing arm 6 and is rollingly connected to the inner wall of the semicircular ring 83.

[0061] It should be noted that a suction mechanism (not shown) is provided at the bottom of the limit frame 81, and the semicircular ring 83 is fixedly connected to the slide of the linear motor 9 so that the suction mechanism can move in the vertical direction to suck the wafer. When the linear motor 9 drives the fixed arm 5 to move, the semicircular ring 83 moves accordingly. The limit frame 81 installed on the swing arm 6 and opening to one side has a rotating sleeve on the side close to the swing arm 6. The ball 82 is rollingly connected to the inner circumferential wall of the semicircular ring 83. During the operation of the crystal bonding machine, when the swing arm 6 rotates and moves with the fixed arm 5, the ball 82 is rotatingly connected to the inner circumferential wall of the semicircular ring 83. 2 is always in contact with and rolls with the inner wall of the semicircular ring 83. Through the cooperation of the rolling ball 82 and the semicircular ring 83, the position of the swing arm 6 in the length direction is limited to prevent it from being over-extended. At the same time, the displacement of the swing arm 6 in the vertical direction is limited to a certain extent, providing stable support and position limiting for the swing arm 6, ensuring that the swing arm 6 moves within the specified range, playing a role in stabilizing the swing arm 6, enhancing the restriction and stabilization of the position of the swing arm 6, reducing the shaking and deviation of the swing arm 6 during the movement, improving the accuracy of the crystal pick-up and crystal bonding of the crystal bonding machine, and ensuring the stable operation of the equipment.

[0062] like Figure 6As shown, there is a gap between the inner top wall and the bottom wall of the limit frame 81 and the semi-circular ring 83. A first magnetic block 84 is embedded in the inner top wall of the limit frame 81, and a second magnetic block 85 is embedded at the inner bottom of the limit frame 81. The inside of the semi-circular ring 83 is arranged in the middle, and a follower magnetic block 86 is slidably arranged. The follower magnetic block 86 has the opposite magnetic property to the first magnetic block 84 and the same magnetic property as the second magnetic block 85.

[0063] It should be noted that a first magnetic block 84 is embedded in the inner top wall of the limit frame 81, and a second magnetic block 85 is embedded at the bottom. A follower magnetic block 86 with the opposite magnetic property to the first magnetic block 84 and the same magnetic property as the second magnetic block 85 is slidably arranged inside the semi-circular ring 83. During the movement of the swing arm 6, as long as there is a displacement trend in the vertical direction, the follower magnetic block 86 will move accordingly under the action of the magnetic force. For example, when the swing arm 6 deflects upward, the attraction force of the first magnetic block 84 on the follower magnetic block 86 increases, causing the follower magnetic block 86 to move upward, generating a downward restoring force to pull the swing arm 6 back to its original position. On the contrary, when the swing arm 6 deflects downward, the repulsive force of the second magnetic block 85 on the follower magnetic block 86 will make the follower magnetic block 86 move upward, generating an upward restoring force to correct the displacement of the swing arm 6. Through this magnetic interaction, the stabilizing effect of the auxiliary stabilizing mechanism 8 on the swing arm 6 in the vertical direction is further enhanced, continuously ensuring the stability of the swing arm 6, effectively reducing the vertical displacement of the swing arm 6 during movement, and thus improving the accuracy of crystal picking and crystal bonding of the die bonder and enhancing the working stability of the equipment.

[0064] Furthermore, the inside of the semi-circular ring 83 is filled with oil, and the oil submerges the follower magnetic block 86.

[0065] The oil plays a role in cooling the semi-circular ring 83, conducting the heat generated by the reciprocating rolling of the rolling parts at the inner circumference of the semi-circular ring 83, reducing the temperature, and increasing the stability of the use of the rolling parts and the semi-circular ring 83. The inside of the semi-circular ring 83 is filled with oil and submerges the follower magnetic block 86. When the follower magnetic block 86 slides inside the semi-circular ring 83 under the limitation of the limit frame 81, due to the magnetic action of the first magnetic block 84 and the second magnetic block 85 on the follower magnetic block 86, the follower magnetic block 86 moves inside the semi-circular ring 83, which can stir the oil and increase the uniformity of the oil temperature, facilitating heat conduction.

[0066] Both the top and bottom of the semi-circular ring 83 are made of non-metallic materials, and the inner circumference of the semi-circular ring 83 is made of a metal inner circumference.

[0067] During the working process of the die bonder, different material parts of the semi-circular ring 83 perform their respective functions. The non-metallic top and bottom ensure a stable magnetic field environment, and the metal inner circumference provides a good environment for the rolling ball 82 and the follower magnetic block 86, jointly ensuring the stabilizing effect of the auxiliary stabilizing mechanism 8 on the swing arm 6.

[0068] Working principle:

[0069] Wafer tray transportation: The X module 31 on the main body 1 of the die bonder drives the support plate 32 to move horizontally. The servo motor 33 installed on the support plate 32 drives the bidirectional threaded rod 34 to rotate. Since the two symmetric threads at both ends of the bidirectional threaded rod 34 are respectively threadedly sleeved with two wafer trays 35, the wafer trays 35 move linearly on the support plate 32 following the rotation of the bidirectional threaded rod 34 with the assistance of the guide rails 36, realizing the mutual approach or separation of the two wafer trays 35, and then accurately transporting the wafers 4 placed on the wafer trays 35 to the appropriate positions, completing a double-layer transportation, which facilitates the crystal picking by the picking mechanism at the swing arm 6.

[0070] Swing arm drive and dynamic cancellation: The drive motor 11 is installed on the connecting plate 10. After starting, the drive shaft drives the drive gear 12 to rotate. The drive gear 12 is in mutual transmission with the transmission gear 13 inside the fixed arm 5. One of the transmission gears 13 drives the synchronous gear 17, and the other transmission gear 13 drives the swing arm 6 to rotate. The synchronous gear 17 makes the rotating rod 15 rotate through the bottom gear 16. The driving bevel gear 14 on the rotating rod 15 drives the driven bevel gear 72, and then drives the ball screw 73 to rotate. The counterweight 74 is fixedly sleeved on the moving table of the ball screw 73 and is in rolling connection with the guide plate 75. The rotation of the ball screw 73 drives the counterweight 74 to move linearly along the guide plate 75, so as to generate a relative movement in the opposite direction to the swing arm 6 when the swing arm 6 rotates, generating a dynamic inertial moment to cancel the inertial force when the swing arm 6 rotates, and ensuring the stability of the swing arm 6 during high-speed rotation.

[0071] Auxiliary stability: The sliding table of the linear motor 9 drives the fixed arm 5 to move through the connecting plate 10, and the swing arm 6 rotatably connected to the fixed arm 5 moves accordingly. The semi-circular ring 83 is fixedly connected to the sliding table of the linear motor 9. The limiting frame 81 is installed on the swing arm 6. The rolling ball 82 rolls on the inner peripheral wall of the semi-circular ring 83 within the limiting frame 81, restricting the position of the swing arm 6 in the length direction and preventing over-extension. When the swing arm 6 shows a displacement trend in the vertical direction, the magnet one 84 and the magnet two 85 in the limiting frame 81 interact with the follower magnet 86 in the semi-circular ring 83. For example, when the swing arm 6 moves upward, the magnet one 84 attracts the follower magnet 86 to move upward, generating a downward restoring force to pull back the swing arm 6; vice versa. The hydraulic oil in the semi-circular ring 83 can reduce the heat generated by the rolling parts and the semi-circular ring 83, increasing the stability, and the non-metallic top and bottom ensure the stability of the magnetic field, and the metal inner circumference provides a good environment for the rolling ball 82 and the follower magnet 86.

[0072] Crystal picking and die bonding: In the above stable motion state, the swing arm 6 first moves to the position of the wafer 4, uses the picking mechanism at the bottom of the limiting frame 81 to pick up the chip, and then moves above the substrate carrier 2, and installs the chip on the substrate carried on the substrate carrier 2, completing the crystal picking and die bonding operations, and thus the die bonding work is carried out in such a cycle.

[0073] The embodiments of the present invention have been described above. However, these embodiments are not limited to the above specific implementation manners. The above specific implementation manners are merely illustrative rather than restrictive. Under the inspiration of these embodiments, those of ordinary skill in the art can also make many forms, all of which fall within the protection scope of these embodiments.

Claims

1. A die bonder with a double-layer conveying function, characterized in that, Including: Die bonder main body (1), substrate stage (2), double-layer conveying mechanism (3), wafer tray (4), fixed arm (5), swing arm (6), dynamic cancellation mechanism (7), auxiliary stabilizing mechanism (8) and linear motor (9); The substrate stage (2), double-layer conveying mechanism (3) and linear motor (9) are all arranged on the die bonder main body (1), and the wafer tray (4) is arranged on the double-layer conveying mechanism (3); The slide of the linear motor (9) is fixedly connected to the fixed arm (5) through a connecting plate (10), the fixed arm (5) is rotatably connected to the swing arm (6), and the dynamic cancellation mechanism (7) is arranged on the swing arm (6); The swing arm (6) is in transmission cooperation with a driving member. When the driving member drives the swing arm (6) to perform a rotating action, the acting part of the dynamic cancellation mechanism (7) moves relative to the swing arm (6) in the opposite direction to apply a dynamic inertia moment. During this process, the auxiliary stabilizing mechanism (8) restricts the position of the swing arm (6) in the length and vertical directions; The dynamic cancellation mechanism (7) includes a mounting plate (71), a driven bevel gear (72), a ball screw (73), a counterweight (74) and a guide plate (75). The mounting plate (71) is mounted on the swing arm (6) and fixedly connected to the guide plate (75). The ball screw (73) is rotatably arranged on the mounting plate (71) and axially connected to the driven bevel gear (72). The counterweight (74) is fixedly sleeved on the moving table of the ball screw (73) and is in rolling connection with the guide plate (75).

2. The die bonder with a double-layer conveying function according to claim 1, wherein: The double-layer conveying mechanism (3) includes an X module (31), a support plate (32), a servo motor (33), a bidirectional threaded rod (34) and a wafer loading table (35). The X module (31) is assembled on the die bonder main body (1). The support plate (32) is installed at the conveying end of the X module (31). The servo motor (33) is installed on the support plate (32), and the driving shaft of the servo motor (33) is axially connected to the bidirectional threaded rod (34). The wafer loading table (35) is slidably arranged on the support plate (32) and is threadedly sleeved on the bidirectional threaded rod (34). The wafer tray (4) is placed on the wafer loading table (35).

3. The die bonder with a double-layer conveying function according to claim 2, characterized in that: A guide rail (36) is installed on the support plate (32), and the slide of the guide rail (36) is fixedly connected to the wafer loading table (35).

4. A die bonder with a double-layer conveying function according to claim 3, wherein: Rolling elements are provided at the bottom of the counterweight (74), and the rolling elements are in rolling connection with the top of the guide plate (75).

5. A die bonder with a double-layer conveying function according to claim 1, characterized in that: The driving member includes a driving motor (11), a driving gear (12), a transmission gear (13), a transmission bevel gear (14), a rotating rod (15), a bottom gear (16) and a synchronous gear (17). The driving motor (11) is fixedly installed on the connecting plate (10). The driving shaft of the driving motor (11) extends into the inside of the fixed arm (5) and is fixedly sleeved with the driving gear (12). The transmission gear (13) is rotatably arranged inside the fixed arm (5) and transmits power to each other. One of the transmission gears (13) is in transmission cooperation with the driving gear (12) and is axially connected to the synchronous gear (17) through a linkage shaft. The other transmission gear (13) is axially connected to the swing arm (6). The transmission bevel gear (14) and the bottom gear (16) are both fixedly sleeved on the rotating rod (15). One end of the rotating rod (15) rotatably extends into the swing arm (6). The bottom gear (16) is in transmission cooperation with the synchronous gear (17). The transmission bevel gear (14) is in transmission cooperation with the driven bevel gear (72).

6. The die bonder with a double-layer conveying function according to claim 5, wherein: The auxiliary stabilizing mechanism (8) includes a limiting frame (81), a rolling ball (82) and a semi-circular ring (83). The semi-circular ring (83) is fixedly connected to the slide of the linear motor (9). The limiting frame (81) forms an opening on one side and is installed on the swing arm (6). The rolling ball (82) is rotatably sleeved inside the limiting frame (81) on the side close to the swing arm (6) and is in rolling connection with the inner peripheral wall of the semi-circular ring (83).

7. A die bonder with a double-layer conveying function according to claim 6, characterized in that: There is a gap between the inner top wall and the bottom wall of the limiting frame (81) and the semi-circular ring (83). A first magnet (84) is embedded in the inner top wall of the limiting frame (81). A second magnet (85) is embedded at the inner bottom of the limiting frame (81). The inside of the semi-circular ring (83) is arranged in the middle and a follower magnet (86) is slidably arranged. The follower magnet (86) has the opposite magnetic polarity to the first magnet (84) and the same magnetic polarity as the second magnet (85).

8. A die bonder with a double-layer conveying function according to claim 7, characterized in that: The inside of the semi-circular ring (83) is filled with oil, and the oil submerges the follower magnet (86).

9. The die bonder with a double-layer conveying function according to claim 8, wherein: Both the top and the bottom of the semi-circular ring (83) are made of non-metallic materials, and the inner circumference of the semi-circular ring (83) is made of a metal inner circumference.

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