Optical module

Abstract

The invention provides an optical module, and relates to the technical field of optical communication. The optical module comprises a radio frequency board and a control board; the radio frequency board comprises a first control signal interface, a first radio frequency interface, a digital processing module and a first control module; the control panel comprises a second control signal interface, a second radio frequency interface, an electro-optical conversion module and a second control module; the first radio frequency interface is detachably connected with the second radio frequency interface; the first control signal interface is detachably connected with the second control signal interface; the digital processing module converts the mainboard digital signal into a radio frequency signal and sends the radio frequency signal to the electro-optical conversion module, and the electro-optical conversion module converts the radio frequency signal into an optical signal; the first control module converts the working condition signal of the digital processing module into a first working condition signal in a preset format and then sends the first working condition signal to the mainboard interface; the second control module converts the working condition signal of the electro-optical conversion module into a second working condition signal in a preset format and then sends the second working condition signal to the mainboard interface. According to the invention, the flexibility of the optical module and the adaptation capability of the optical module to different types of chips are improved.

Description

Technical Field

[0001] The embodiments of the present invention relate to the field of optical communication technologies, and particularly to an optical module. Background Art

[0002] As a core component of next-generation high-speed optical communication, the optical module plays a key role in the iterative upgrade of the global digital infrastructure. Its application scenarios mainly cover areas such as ultra-large-scale data center interconnection, 5G mobile fronthaul network, optical interconnection of intelligent computing centers, space-air-ground integrated network, and deterministic network of industrial Internet. With the continuous improvement of the optical module rate, the required capacity of the optical module has gradually transitioned from 100G in the early stage to 800G and the next-generation 1.6T.

[0003] In the prior art, the design of the optical module usually adopts a traditional integrated solution, whose main feature is that all functions of the optical module are carried by a high-density interconnect (HDI) radio frequency board. This design integrates all functions of signal processing, transmitting, receiving, and managing of the optical module on a single HDI radio frequency board.

[0004] However, the traditional integrated solution has significant technical defects. Since all functions are integrated on a single HDI radio frequency board, when it is necessary to support different types of chips, such as different types of digital signal processing chips or electro-optic conversion chips, the entire HDI radio frequency board needs to be redesigned, resulting in a long design cycle and being unable to meet the requirements of rapid verification. At the same time, to verify different solutions, multiple design teams need to work simultaneously, significantly increasing the labor cost, thereby limiting the adaptability of the optical module under rapid iteration and diverse requirements. Summary of the Invention

[0005] The present invention provides an optical module to improve the flexibility of the optical module and its adaptability to different types of chips, thereby shortening the design cycle of the optical module.

[0006] In a first aspect of the present invention, an optical module is provided, and the optical module includes: a mutually independent radio frequency board and a control board;

[0007] The radio frequency board includes a first control signal interface, a first radio frequency interface, a main board interface, a digital processing module, and a first control module; the control board includes a second control signal interface, a second radio frequency interface, an electro-optic conversion module, and a second control module; the first radio frequency interface and the second radio frequency interface are detachably connected; the first control signal interface and the second control signal interface are detachably connected; the main board interface is used to connect to an external main board;

[0008] The digital processing module is used to convert the main board digital signal received by the main board interface into a radio frequency signal, and sequentially send it to the electro-optical conversion module through the first radio frequency interface and the second radio frequency interface;

[0009] The electro-optical conversion module is used to convert the radio frequency signal into an optical signal;

[0010] The first control module is used to obtain the working condition signal of the digital processing module, and convert the working condition signal of the digital processing module into a first working condition signal in a preset format and then send it to the main board interface;

[0011] The second control module is used to obtain the working condition signal of the electro-optical conversion module, and convert the working condition signal of the electro-optical conversion module into a second working condition signal in the preset format and then sequentially send it to the main board interface through the second control signal interface, the first control signal interface and the first control module.

[0012] Optionally, the first control module is further used to receive a digital processing control signal through the main board interface, and convert the digital processing control signal into a first control signal adapted to the digital processing module and then send it to the digital processing module to control the working state of the digital processing module;

[0013] The first control module is further used to receive the electro-optical conversion control signal through the main board interface, and sequentially send it to the second control module through the first control signal interface and the second control signal interface;

[0014] The second control module is further used to convert the electro-optical conversion control signal into a second control signal adapted to the electro-optical conversion module and then send it to the electro-optical conversion module to control the working state of the electro-optical conversion module.

[0015] Optionally, the control board further includes at least one optoelectronic conversion module;

[0016] The optoelectronic conversion module is used to convert the optical signal received by the control board into a radio frequency signal, and sequentially send it to the digital processing module through the second radio frequency interface and the first radio frequency interface;

[0017] The digital processing module is further used to convert the radio frequency signal received by the first radio frequency interface into a digital signal, and output the digital signal through the main board interface.

[0018] Optionally, the second radio frequency interface includes a first sub-radio frequency interface and at least one second sub-radio frequency interface;

[0019] The first sub-radio frequency interface is integrated in the electro-optical conversion module;

[0020] The second sub-radio frequency interface is provided in one-to-one correspondence with the optoelectronic conversion module, and the second sub-radio frequency interface is integrated in the optoelectronic conversion module.

[0021] Optionally, the control board further includes an optical fiber interface; the optical fiber interface is used for transmitting or receiving optical signals;

[0022] The optical fiber interface is provided at one side edge of the control board.

[0023] Optionally, the electro-optical conversion module and each of the optoelectronic conversion modules are located on one side of the second control module close to the radio frequency board.

[0024] Optionally, the first radio frequency interface includes a third sub-radio frequency interface and at least one fourth sub-radio frequency interface;

[0025] The third sub-radio frequency interface is correspondingly connected to the first sub-radio frequency interface;

[0026] The fourth sub-radio frequency interfaces are connected to the second sub-radio frequency interfaces in one-to-one correspondence.

[0027] Optionally, the main board interface and the first radio frequency interface are located on opposite sides of the digital processing module.

[0028] Optionally, the electro-optical conversion module includes a laser and a silicon optical modulator;

[0029] The control signal output end of the silicon optical modulator is connected to the control signal input end of the laser; the input end of the silicon optical modulator is connected to the second radio frequency interface.

[0030] Optionally, the radio frequency board further includes a first power supply interface and a first power conversion module; the control board further includes a second power supply interface and a second power conversion module; the first power supply interface and the second power supply interface are detachably connected; the main board interface is connected to the first power supply interface through the first power conversion module;

[0031] The first power conversion module is used for converting the power supply signal into the power supply voltage required by the digital processing module and then providing it to the digital processing module, and sending the power supply signal to the first power supply interface;

[0032] The second power conversion module is used for receiving the power supply signal sequentially through the first power supply interface and the second power supply interface, and converting the power supply signal into the power supply voltage required by the electro-optical conversion module and then providing it to the electro-optical conversion module.

[0033] The technical solution of the present invention is to provide an independent radio frequency board and a control board in the optical module, and set a first control signal interface and a first radio frequency interface on the radio frequency board, and set a second control signal interface and a second radio frequency interface on the control board. The first radio frequency interface and the second radio frequency interface are detachably connected, and the first control signal interface and the second control signal interface are detachably connected, so that the radio frequency board can be connected to the control boards with different optical designs, and the control board can be connected to different types of radio frequency boards, enabling the optical module to meet the requirements of different application scenarios and improving the flexibility of the optical module. By setting a main board interface, a digital processing module and a first control module on the radio frequency board, and an electro-optic conversion module and a second control module on the control board, the radio frequency board can receive the main board digital signal transmitted by the external main board through the main board interface. The digital processing module can convert the main board digital signal received by the main board interface into a radio frequency signal and send the modulated radio frequency signal to the electro-optic conversion module. At the same time, the electro-optic conversion module can convert the radio frequency signal into an optical signal, enabling the optical module to achieve long-distance and low-loss data transmission applicable to optical communication networks. In addition, the first control module converts the working condition signal of the digital processing module into a first working condition signal in a preset format and then sends it to the main board interface, and the second control module converts the working condition signal of the electro-optic conversion module into a second working condition signal in a preset format and then sends it to the main board interface. The first working condition signal and the second working condition signal in the preset format match the interface format of the main board interface, ensuring that the external main board can monitor the working conditions of the digital processing module and the electro-optic conversion module with different interface formats in real time, thereby ensuring that the optical module can adapt to the digital processing module and the electro-optic conversion module with different interface formats, improving the compatibility and flexibility of the optical module, significantly shortening the design and verification cycle, and reducing the design and manufacturing costs and labor costs of the optical module.

[0034] It should be understood that the content described in this part is not intended to identify the key or important features of the embodiments of the present invention, nor is it used to limit the scope of the present invention. Other features of the present invention will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0036] Figure 1 is a schematic structural diagram of an optical module provided by an embodiment of the present invention;

[0037] Figure 2It is a schematic structural diagram of another optical module provided by an embodiment of the present invention;

[0038] Figure 3 It is a schematic structural diagram of another optical module provided by an embodiment of the present invention. Detailed implementation manners

[0039] In order to enable those skilled in the art to better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0040] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and do not necessarily need to describe a specific order or sequence. It should be understood that such data can be interchanged under appropriate circumstances so that the embodiments of the present invention described herein can be implemented in an order different from those illustrated or described herein. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device that includes a series of steps or units does not necessarily need to be limited to those steps or units clearly listed, but may include other steps or units not clearly listed or inherent to these processes, methods, products or devices.

[0041] Figure 1 It is a schematic structural diagram of an optical module provided by an embodiment of the present invention, as Figure 1As shown in the figure, the optical module includes an independent radio frequency board 1 and a control board 2; the radio frequency board 1 includes a first control signal interface 11, a first radio frequency interface 12, a main board interface 13, a digital processing module 14 and a first control module 15; the control board 2 includes a second control signal interface 21, a second radio frequency interface 22, an electro-optical conversion module 23 and a second control module 24; the first radio frequency interface 12 and the second radio frequency interface 22 are detachably connected; the first control signal interface 11 and the second control signal interface 21 are detachably connected; the main board interface 13 is used to connect to an external main board; the digital processing module 14 is used to convert the main board digital signal received by the main board interface 13 into a radio frequency signal, and sequentially send it to the electro-optical conversion module 23 through the first radio frequency interface 12 and the second radio frequency interface 22; the electro-optical conversion module 23 is used to convert the radio frequency signal into an optical signal; the first control module 15 is used to obtain the operating condition signal of the digital processing module 14, and convert the operating condition signal of the digital processing module 14 into a first operating condition signal in a preset format and then send it to the main board interface 13; the second control module 24 is used to obtain the operating condition signal of the electro-optical conversion module 23, and convert the operating condition signal of the electro-optical conversion module 23 into a second operating condition signal in a preset format and then sequentially send it to the main board interface 13 through the second control signal interface 21, the first control signal interface 11 and the first control module 15.

[0042] Among them, the radio frequency board 1 can be specifically understood as a module in the optical module for processing high-speed electrical signals and generating radio frequency signals, and the control board 2 can be specifically understood as a module in the optical module for converting radio frequency signals and generating optical signals. The radio frequency board 1 includes a first control signal interface 11 and a first radio frequency interface 12, and the control board 2 includes a second control signal interface 21 and a second radio frequency interface 22. The first radio frequency interface 12 and the second radio frequency interface 22 can be understood as standardized signal transmission interfaces to achieve the efficient transmission of the radio frequency signal generated by the radio frequency board 1 to the control board 2. Exemplarily, the first radio frequency interface 12 and the second radio frequency interface 22 can achieve signal transmission through multiple differential pairs. The differential pair can be composed of a pair of positive and negative signal lines, which can effectively reduce electromagnetic interference and crosstalk during the transmission of radio frequency signals and ensure the integrity of radio frequency signals. The first control signal interface 11 and the second control signal interface 21 can be understood as communication channels for transmitting low-speed control signals between the radio frequency board 1 and the control board 2, so that the radio frequency board 1 and the control board 2 can realize the interaction of the operating condition information of the digital processing module 14 and the electro-optical conversion module 23 through the first control signal interface 11 and the second control signal interface 21.

[0043] It can also be understood that the first radio frequency interface 12 and the second radio frequency interface 22 are detachably connected, and the first control signal interface 11 and the second control signal interface 21 are detachably connected, so that the radio frequency board 1 can be connected to the control board 2 with different optical designs. At the same time, the control board 2 can be connected to different types of radio frequency boards 1, enabling the optical module to meet the requirements of different application scenarios and improving the flexibility of the optical module. Exemplarily, the signals between the first radio frequency interface 12 and the second radio frequency interface 22, and the signals between the first control signal interface 11 and the second control signal interface 21 can be physically interconnected by wire bonding. That is, the pads on the radio frequency board 1 and the control board 2 can be directly connected by thin metal wires to form an electrical path between the first radio frequency interface 12 and the second radio frequency interface 22, and an electrical path between the first control signal interface 11 and the second control signal interface 21. Compared with traditional physical connectors, the wire bonding method has higher flexibility. Wire bonding can directly connect the pads of the radio frequency board 1 and the control board 2, thus optimizing the transmission paths of radio frequency signals and operating condition signals, and reducing the loss and delay of radio frequency signals and operating condition signals. In addition, the wire bonding method does not require additional physical connector components, reducing the manufacturing cost, while reducing the risk of poor contact of physical connectors and improving the reliability of radio frequency signal and operating condition signal transmission.

[0044] Specifically, the radio frequency board 1 includes a main board interface 13, a digital processing module 14, and a first control module 15. The radio frequency board 1 is connected to an external main board through the main board interface 13, so that the radio frequency board 1 can receive the main board digital signal transmitted by the external main board through the main board interface 13. Exemplarily, the external main board can be a switch or a server in a data center for transmitting high-speed digital signals. The digital processing module 14 can be a digital signal processing chip. The first radio frequency interface 12 and the second radio frequency interface 22 are detachably connected, and the first control signal interface 11 and the second control signal interface 21 are detachably connected, so that the optical module can support digital signal processing chips with different interface formats to process the main board digital signal. The digital processing module 14 is used to convert the main board digital signal received by the main board interface 13 into a radio frequency signal. Exemplarily, the digital processing module 14 can modulate the main board digital signal to modulate the non-return-to-zero (NRZ) signal transmitted by the main board into a four-level pulse amplitude modulation (PAM4) signal, thereby generating a radio frequency signal suitable for high-speed transmission, and can output the modulated radio frequency signal through a differential pair, and sequentially send it to the electro-optic conversion module 23 through the first radio frequency interface 12 and the second radio frequency interface 22 for the electro-optic conversion module 23 to perform the conversion from an electrical signal to an optical signal.

[0045] The control board 2 includes an electro-optical conversion module 23 and a second control module 24. Optionally, the electro-optical conversion module 23 may include a laser and a silicon optical modulator. The first radio frequency interface 12 and the second radio frequency interface 22 are detachably connected, and the first control signal interface 11 and the second control signal interface 21 are detachably connected, so that the optical module can support lasers and silicon optical modulators with different interface formats to process the radio frequency signals received by the second radio frequency interface 22. The electro-optical conversion module 23 is used to convert the radio frequency signals received by the second radio frequency interface 22 into optical signals. Specifically, the control signal output end of the silicon optical modulator is connected to the control signal input end of the laser, and the input end of the silicon optical modulator is connected to the second radio frequency interface, so that the laser can generate a continuous optical carrier to be used as the carrier for radio frequency signal data transmission. The silicon optical modulator is based on silicon photonics technology and is used to modulate the radio frequency signals received by the second radio frequency interface onto the optical carrier generated by the laser to generate optical signals carrying data information of the radio frequency signals. Exemplarily, the silicon optical modulator may adopt a Mach-Zehnder Modulator (MZM) structure, which drives the radio frequency signals to change the phase difference of the optical carrier, and further can modulate the optical intensity of the optical carrier, thereby generating optical signals carrying data information of the radio frequency signals. The silicon optical modulator is based on silicon photonics technology and is compatible with the Complementary Metal-Oxide-Semiconductor (CMOS) process, with low manufacturing cost, suitable for mass production, and reducing the design and manufacturing costs of the optical module. At the same time, the electro-optical conversion module 23 can output the optical signals to an external network, so that the optical module can achieve long-distance and low-loss data transmission applicable to optical communication networks.

[0046] In addition, the first control module 15 is configured to obtain the operating condition signals of the digital processing module 14, convert the operating condition signals of the digital processing module 14 into first operating condition signals in a preset format, and then send them to the main board interface 13, so that the first control module 15 can adjust the operating condition signals of the digital processing module 14 with different interface formats, so that the operating condition signals of the digital processing module 14 with different interface formats can be sent to the main board interface 13 in a unified interface format. The first operating condition signals in the preset format match the interface format of the main board interface 13, ensuring that the external main board can monitor the operating conditions of the digital processing module 14 with different interface formats in real time. Exemplarily, the operating conditions of the digital processing module 14 may include the power supply voltage, operating current, chip temperature, and bit error rate of the digital signal processing chip, etc. The second control module 24 is configured to obtain the operating condition signals of the electro-optical conversion module 23, convert the operating condition signals of the electro-optical conversion module 23 into second operating condition signals in a preset format, and then sequentially send them to the main board interface 13 through the second control signal interface 21, the first control signal interface 11, and the first control module 15, so that the second control module 24 can adjust the operating condition signals of the electro-optical conversion module 23 with different interface formats, so that the operating condition signals of the electro-optical conversion module 23 with different interface formats can be sent to the main board interface 13 in a unified interface format. Among them, the second operating condition signals in the preset format match the interface format of the main board interface 13, ensuring that the external main board can monitor the operating conditions of the electro-optical conversion module 23 with different interface formats in real time. Exemplarily, the operating conditions of the electro-optical conversion module 23 may include the bias current of the laser, the drive voltage of the silicon optical modulator, and the temperature of the silicon optical modulator, etc. Thus, it is ensured that the optical module can be adapted to the digital processing module 14 with different interface formats and the electro-optical conversion module 23 with different interface formats, improving the compatibility and flexibility of the optical module. Among them, the first control module 15 and the second control module 24 may include a micro-control chip, and the specific model of the micro-control chip can be selected according to actual application requirements, and the present invention does not make specific limitations thereon.

[0047] Specifically, the first radio frequency interface 12 and the second radio frequency interface 22 are detachably connected, and the first control signal interface 11 and the second control signal interface 21 are detachably connected, so that the radio frequency board 1 can be connected to the control board 2 with different optical designs, and the control board 2 can be connected to different types of radio frequency boards 1. There are differences in the output formats of the condition signals of the digital signal processing chips in different types of radio frequency boards 1. The first control module 15 can convert the condition signals of different types of digital signal processing chips into the first condition signals in a preset format through the internal signal routing function and send them to the main board interface 13. Exemplarily, the condition signal of the digital signal processing chip A is output in a 16-bit format through the register address 0x01, while the condition signal of the digital signal processing chip B may be output in an 8-bit format through the register address 0x02. The first control module 15 normalizes these condition signals with different output formats through programmable logic, such as a Field Programmable Gate Array (FPGA) or an Application-Specific Integrated Circuit (ASIC), and unifies them into the first condition signals in a preset format, such as the first condition signal output in a 16-bit format through the register address 0x10, and sends the first condition signal to the main board interface 13. At the same time, there are differences in the output formats of the condition signals of the lasers and silicon optical modulators in the control board 2 with different optical designs. The second control unit 22 can convert the condition signals of the lasers and silicon optical modulators with different optical designs into the second condition signals in a preset format through the internal signal routing function and send them to the main board interface 13. Exemplarily, the condition signal of the silicon optical modulator A is output in a 10-bit format through the register address 0x03, while the condition signal of the silicon optical modulator B may be output in a 12-bit format through 0x04. The second control unit 22 can normalize these condition signals with different output formats through programmable logic and unify them into the second condition signals in a preset format, such as the second condition signal output in a 16-bit format through the register address 0x10, and send the second condition signal to the main board interface 13 through the second control signal interface 21, the first control signal interface 11, and the first control module 15 in sequence.

[0048] The operating condition signals are converted by the first control module 15 and the second control module 24, without the need to adjust the welding method of the radio frequency board 1 and the control board 2, which can be achieved only through the software configuration or hardware routing of the first control module 15 and the second control module 24. The first control module 15 and the second control module 24 convert the operating condition signals of the digital processing module 14 with different interface formats and the electro-optic conversion unit 23, enabling the optical module to flexibly adapt to various digital signal processing chips of different types, as well as lasers and silicon optical modulators with different optical designs, improving the flexibility of the optical module and its compatibility with different types of chips, and enabling the optical module to meet the diverse requirements in different application scenarios. In the traditional integrated radio frequency board design, if the type of the digital signal processing chip or the optical design of the laser and the silicon optical modulator is changed, the entire radio frequency board 1 or the control board 2 needs to be redesigned, and the design cycle is usually 4 - 6 months. However, through the adjustment function of the first control module 15 and the second control module 24, there is no need to redesign the radio frequency board 1 and the control board 2 or adjust the welding method. Only through the software configuration or hardware routing of the first control module 15 and the second control module 24 can it adapt to different types of digital signal processing chips, as well as lasers and silicon optical modulators with different optical designs, significantly shortening the design and verification cycle, thereby reducing the design and manufacturing costs and labor costs of the optical module.

[0049] It can also be understood that in the traditional integrated radio frequency board design, the radio frequency board 1 needs to meet high-speed design requirements, such as strict impedance control, high-order high-density interconnect (HDI) process, or modified semi-additive process (mSAP), and may even involve bare chip design, which poses high requirements on the board material and printed circuit board manufacturing process. While the control board 2 only needs to support the control of low-speed signals, and the requirements on the board material and printed circuit board manufacturing process are relatively broad. By modularizing the radio frequency board 1 and the control board 2 in the optical module, a high-order printed circuit board manufacturing process can be adopted for the radio frequency board 1, enabling the radio frequency board 1 to focus on high-speed signal processing, while the control board 2 only needs to use an ordinary printed circuit board manufacturing process to support the control of low-speed signals, thereby reducing the optical module's demand for demanding printed circuit board designs, lowering the manufacturing difficulty and cost of the optical module, and at the same time improving the flexibility and maintainability of the optical module.

[0050] In this embodiment, by providing an independent radio frequency (RF) board and a control board in the optical module, a first control signal interface and a first RF interface are provided on the RF board, and a second control signal interface and a second RF interface are provided on the control board. The first RF interface and the second RF interface are detachably connected, and the first control signal interface and the second control signal interface are detachably connected, so that the RF board can be connected to control boards with different optical designs, and the control board can be connected to different types of RF boards, enabling the optical module to meet the requirements of different application scenarios and improving the flexibility of the optical module. By providing a main board interface, a digital processing module, and a first control module on the RF board, and an electro-optical conversion module and a second control module on the control board, the RF board can receive the main board digital signal transmitted from the external main board through the main board interface. The digital processing module can convert the main board digital signal received by the main board interface into an RF signal and send the modulated RF signal to the electro-optical conversion module. At the same time, the electro-optical conversion module can convert the RF signal into an optical signal, enabling the optical module to achieve long-distance and low-loss data transmission suitable for optical communication networks. In addition, the first control module converts the operating condition signal of the digital processing module into a first operating condition signal in a preset format and then sends it to the main board interface, and the second control module converts the operating condition signal of the electro-optical conversion module into a second operating condition signal in a preset format and then sends it to the main board interface. The first operating condition signal and the second operating condition signal in the preset format match the interface format of the main board interface, ensuring that the external main board can monitor the operating conditions of the digital processing module and the electro-optical conversion module with different interface formats in real time, thus ensuring that the optical module can adapt to the digital processing module and the electro-optical conversion module with different interface formats, improving the compatibility and flexibility of the optical module, significantly shortening the design and verification cycle, and reducing the design and manufacturing costs and labor costs of the optical module.

[0051] Optionally, the first control module 15 is further configured to receive a digital processing control signal through the main board interface 13, convert the digital processing control signal into a first control signal adapted to the digital processing module 14, and then send it to the digital processing module 14 to control the operating state of the digital processing module 14; the first control module 15 is further configured to receive an electro-optical conversion control signal through the main board interface 13 and sequentially send it to the second control module 24 through the first control signal interface 11 and the second control signal interface 21; the second control module 24 is further configured to convert the electro-optical conversion control signal into a second control signal adapted to the electro-optical conversion module 23 and then send it to the electro-optical conversion module 23 to control the operating state of the electro-optical conversion module 23.

[0052] Specifically, after the external main board receives the first operating condition signal from the digital processing module 14 through the main board interface 13, it can generate a digital processing control signal based on the first operating condition signal, and can output the digital processing control signal to the first control module 15 through the main board interface 13, so that the first control module 15 can receive the digital processing control signal through the main board interface 13, and convert the digital processing control signal into a first control signal adapted to the digital processing module 14 and then send it to the digital processing module 14 to control the working state of the digital processing module 14. Exemplarily, if the external main board determines that the temperature of the digital signal processing chip is too high according to the first operating condition signal, the external main board can generate a digital processing control signal to control the first control module 15 to reduce the working frequency of the digital signal processing chip or increase the power supply voltage of the digital signal processing chip, so as to reduce the power consumption and temperature of the digital signal processing chip.

[0053] In addition, the first radio frequency interface 12 and the second radio frequency interface 22 are detachably connected, and the first control signal interface 11 and the second control signal interface 21 are detachably connected, so that the control board 2 can be connected to different types of radio frequency boards 1. There are differences in the input interfaces of the digital signal processing chips in different types of radio frequency boards 1. The first control module 15 can convert the digital processing control signal into a first control signal adapted to the digital signal processing chip through the internal signal routing function, and send it to the digital signal processing chip. Exemplarily, the format of the digital processing control signal is the register address 0x30 output in 16-bit format, while the input interface of the control signal of the digital signal processing chip A may be the register address 0x05 input in 10-bit format, and the input interface of the control signal of the digital signal processing chip B may be the register address 0x06 input in 12-bit format. The first control module 15 converts the digital processing control signal into a first control signal adapted to different digital signal processing chips through programmable logic, and sends it to the corresponding digital signal processing chips.

[0054] Meanwhile, after receiving the second operating condition signal of the electro-optical conversion unit 23 through the main board interface 13 on the external main board, it can generate an electro-optical conversion control signal according to the second operating condition signal, and can output the electro-optical conversion control signal to the first control module 15 through the main board interface 13, so that the first control module 15 can sequentially send the electro-optical conversion control signal to the second control module 24 through the first control signal interface 11 and the second control signal interface 21, so that the second control module 24 can convert the electro-optical conversion control signal into a second control signal suitable for the electro-optical conversion module 23 and then send it to the electro-optical conversion module 23, thereby controlling the working state of the electro-optical conversion module 23. Exemplarily, if the external main board determines that the bias current of the laser is too low according to the second operating condition signal, resulting in insufficient optical power, the external main board can generate an electro-optical conversion control signal to control the second control module 24 to increase the bias current of the laser; if the external main board determines that the drive voltage of the silicon optical modulator does not match according to the second operating condition signal, for example, the drive voltage of the silicon optical modulator is 2V at this time, while the target value of the drive voltage of the silicon optical modulator is 1.5V, the external main board can generate an electro-optical conversion control signal to control the second control module 24 to adjust the drive voltage of the silicon optical modulator to 1.5V.

[0055] In addition, the first radio frequency interface 12 and the second radio frequency interface 22 are detachably connected, and the first control signal interface 11 and the second control signal interface 21 are detachably connected, so that the radio frequency board 1 can be connected to the control board 2 with different optical designs. There are differences in the input interfaces of the lasers and silicon optical modulators in the control boards 2 with different optical designs. The second control module 24 can convert the electro-optical conversion control signal into a second control signal suitable for the lasers and silicon optical modulators through the internal signal routing function, and send it to the lasers and silicon optical modulators. Exemplarily, the format of the electro-optical conversion control signal is the register address 0x30 output in 16-bit format, while the input interface of the control signal of silicon optical modulator A may be the register address 0x05 input in 10-bit format, and the input interface of the control signal of silicon optical modulator B may be the register address 0x06 input in 12-bit format. The second control module 24 converts the electro-optical conversion control signal into a second control signal suitable for different lasers and silicon optical modulators through programmable logic, and sends it to the corresponding lasers and silicon optical modulators.

[0056] By converting the digital processing control signal and the electro-optical conversion control signal through the first control module 15 and the second control module 24 respectively, the optical module can flexibly adapt to various digital signal processing chips of different types and lasers and silicon optical modulators with different optical designs, improving the flexibility of the optical module and its compatibility with different types of chips, enabling the optical module to meet the diverse needs under different application scenarios, and significantly shortening the design and verification cycle, thereby reducing the design and manufacturing costs and labor costs of the optical module.

[0057] Optionally, the control signals transmitted by the first control signal interface 11 and the second control signal interface 21 include I2C signals and GPIO signals. Among them, the I2C signal is used to transmit status data and control instructions. Exemplarily, the second control unit 22 transmits the voltage value of the electro-optic conversion module 23 to the first control module 15 through the I2C signal, so that the first control module 15 can send the voltage value of the electro-optic conversion module 23 to the motherboard interface 13 to achieve real-time monitoring of the working state of the electro-optic conversion module 23. The GPIO signal is used to transmit digital quantity signals or interrupt signals. Exemplarily, when the external motherboard determines that the working state of the electro-optic conversion module 23 is abnormal according to the second working condition signal, for example, when the temperature of the silicon optical modulator is too high, the second control unit 22 can send a fault alarm signal of the electro-optic conversion module 23 to the first control module 15 through the GPIO signal, and the first control module 15 can send the fault alarm signal to the motherboard interface 13, so that the external motherboard can generate an electro-optic conversion control instruction according to the fault alarm signal to stop the electro-optic conversion module 23 from working by controlling the second control unit 22, so as to avoid further deterioration of the fault of the electro-optic conversion module 23, and at the same time remind the operator to timely discover the abnormal working condition in the optical module and perform maintenance in time, thereby improving the maintenance efficiency and service life of the optical module.

[0058] By providing that the radio frequency board 1 includes the first control signal interface 11 and the control board 2 includes the second control signal interface 21, the optical module can monitor the working states of the digital processing module 14 and the electro-optic conversion module 23 in real time through the first control module 15 and the second control module 24, and can dynamically adjust the working parameters of the digital processing module 14 and the electro-optic conversion module 23 through the external motherboard, so that the optical module can timely discover and solve potential problems existing in the radio frequency board 1 and the control board 2, thereby optimizing the performance of the optical module and enhancing the reliability and stability of the optical module.

[0059] Optionally, Figure 2 is a schematic structural diagram of another optical module provided by an embodiment of the present invention. As Figure 2 shown, the control board 2 further includes at least one optoelectronic conversion module 25; the optoelectronic conversion module 25 is used to convert the optical signal received by the control board 2 into a radio frequency signal, and sequentially send it to the digital processing module 14 through the second radio frequency interface 22 and the first radio frequency interface 12; the digital processing module 14 is further used to convert the radio frequency signal received by the first radio frequency interface 12 into a digital signal, and output the digital signal through the motherboard interface.

[0060] Among them, the optoelectronic conversion module 25 can be specifically understood as a functional component in the control board 2 for converting optical signals into radio frequency signals. Specifically, the optoelectronic conversion module 25 can convert the optical signals received by the control board 2 into radio frequency signals, and can sequentially send the converted radio frequency signals to the digital processing module 14 through the second radio frequency interface 22 and the first radio frequency interface 12 for further processing of the radio frequency signals by the digital processing module 14. Exemplarily, the optoelectronic conversion module 25 can include a photodetector and a transimpedance amplifier (TIA). Among them, the photodetector can be a photodiode. When the optical signal received by the control board 2 irradiates the photosensitive area of the photodiode, the photodiode can convert the intensity change of the optical signal into a photocurrent, that is, an electrical signal. However, the photocurrent is usually very weak. Therefore, the photodiode can also input the photocurrent into the transimpedance amplifier, and the transimpedance amplifier can convert the weak photocurrent into a voltage signal and amplify it to generate a radio frequency signal suitable for being sequentially sent to the digital processing module 14 through the second radio frequency interface 22 and the first radio frequency interface 12. By setting the optoelectronic conversion module 25 to include a photodetector and a transimpedance amplifier, the optical module can efficiently realize the conversion from optical signals to electrical signals, so that the optical module has the ability of bidirectional communication. The conversion function of the optoelectronic conversion module 25 from optical signals to electrical signals complements the conversion function of the electro-optical conversion module 23 from electrical signals to optical signals, so that the optical module can meet the bidirectional communication requirements of data centers or 5G mobile fronthaul networks.

[0061] In addition, the digital processing module 14 is also used to convert the radio frequency signal received by the first radio frequency interface 12 into a digital signal. Specifically, the radio frequency signal received by the first radio frequency interface 12 can be a high-speed analog signal, such as a PAM4 signal, which contains 4 levels. The digital processing module 14 internally includes an analog-to-digital converter to be able to sample and quantize the radio frequency signal into a digital signal. Exemplarily, the digital processing module 14 can map the 4 levels (0, 1, 2, 3) in PAM4 to 2-bit binary data (00, 01, 10, 11), thereby generating a digital signal, such as an NRZ signal. In addition, the digital processing module 14 can also output the converted digital signal through the main board interface, so that the external main board can further process the digital signal, such as data decoding or forwarding. By setting the digital processing module 14 to convert the radio frequency signal into a digital signal, the optical module realizes a complete conversion link from optical signals to digital signals through the optoelectronic conversion module 25 and the digital processing module 14. Combining with the conversion function of the electro-optical conversion module 23 from electrical signals to optical signals, the optical module has the ability of bidirectional communication and improves the flexibility of the optical module.

[0062] It can be understood that the control board 2 can include one or more optoelectronic conversion modules 25. Exemplarily, continue to refer toFigure 2 , the control board 2 may include two optoelectronic conversion modules 25, enabling the optical module to flexibly configure the number of optoelectronic conversion modules 25 according to actual needs. For example, the optical module can choose to use one optoelectronic conversion module 25 to reduce power consumption according to data transmission requirements, or use two optoelectronic conversion modules 25 to increase data throughput, thereby improving the flexibility and adaptability of the optical module to meet the requirements of different application scenarios. The specific number of optoelectronic conversion modules 25 can be determined according to actual needs, and the present invention does not make specific limitations in this regard. On the premise of no special limitations, the embodiments of the present invention are all exemplified by the control board 2 including two optoelectronic conversion modules 25 to illustrate the technical solutions of the present invention. It can also be understood that the electro-optical conversion module 23 and each optoelectronic conversion module 25 are arranged in sequence along the first direction, and the first direction is parallel to the plane where the control board 2 is located, so that the electro-optical conversion module 23 and each optoelectronic conversion module 25 are physically independent of each other, thereby reducing electromagnetic interference and signal crosstalk between modules and improving the signal integrity and working stability of the optical module.

[0063] Optionally, continue to refer to Figure 2 , the second radio frequency interface 22 includes a first sub-radio frequency interface 221 and at least one second sub-radio frequency interface 222; the first sub-radio frequency interface 221 is integrated in the electro-optical conversion module 23; the second sub-radio frequency interfaces 222 are arranged in one-to-one correspondence with the optoelectronic conversion modules 25, and the second sub-radio frequency interfaces 222 are integrated in the optoelectronic conversion modules 25.

[0064] Specifically, the first sub-radio frequency interface 221 is integrated in the electro-optical conversion module 23, enabling the electro-optical conversion module 23 to convert the radio frequency signal received by the first sub-radio frequency interface 221 into an optical signal. At the same time, continue to refer to Figure 2 , the second radio frequency interface 22 may include two second sub-radio frequency interfaces 222, and the second sub-radio frequency interfaces 222 are arranged in one-to-one correspondence with the optoelectronic conversion modules 25. The second sub-radio frequency interfaces 222 are integrated in the optoelectronic conversion modules 25, enabling the optoelectronic conversion modules 25 to convert the optical signal received by the control board 2 into a radio frequency signal and output it through the second sub-radio frequency interfaces 222. By independently setting the first sub-radio frequency interface 221 and at least one second sub-radio frequency interface 222 in the second radio frequency interface 22, modular transmission of radio frequency signals in the optical module is achieved, enabling the radio frequency signals to be independently transmitted and distributed, reducing the complexity of the radio frequency signal transmission path, and thus improving the efficiency and reliability of radio frequency signal transmission.

[0065] Optionally, continue to refer to Figure 2 , the control board 2 further includes an optical fiber interface 26; the optical fiber interface 26 is used to transmit or receive optical signals; the optical fiber interface 26 is provided on one side edge of the control board.

[0066] Among them, the optical fiber interface 26 can be specifically understood as the physical interface on the control board 2 for connecting the optical fiber. The optical fiber interface 26 is used to couple the optical signal converted from the radio frequency signal by the electro-optical conversion module 23 to the optical fiber. The optical fiber can be specifically understood as the medium for transmitting the optical signal, which is used to transmit the optical signal generated by the electro-optical conversion module 23 to an external network or device to achieve the external transmission of the optical signal. At the same time, the optical fiber interface 26 is also used to transmit the optical signal in the optical fiber to the opto-electronic conversion module 25, so that the opto-electronic conversion module 25 can convert the optical signal received by the optical fiber interface 26 into a radio frequency signal. In addition, the optical fiber interface 26 is arranged on one side edge of the control board to optimize the input and output paths of the optical signal, avoid the interference between the optical fiber interface 26 and the transmission paths of the radio frequency signal or the control signal, thereby reducing the electromagnetic interference and spatial conflict between the optical signal and the electrical signal, improving the signal integrity and working stability of the optical module, and at the same time facilitating the plugging and unplugging operation of the optical fiber, enhancing the use convenience of the optical module.

[0067] Optionally, continue to refer to Figure 2 , the electro-optical conversion module 23 and each opto-electronic conversion module 25 are located on the side of the second control module 24 close to the radio frequency board 1.

[0068] Specifically, continue to refer to Figure 2 , the electro-optical conversion module 23 and two opto-electronic conversion modules 25 are both located on the side of the second control module 24 close to the radio frequency board 1, so that the first sub-radio frequency interface 221 integrated in the electro-optical conversion module 23 and the second sub-radio frequency interface 222 integrated in the opto-electronic conversion module 25 are both relatively close to the first radio frequency interface 12 in the radio frequency board 1, thereby reducing the loss and delay of the radio frequency signal during transmission and improving the transmission efficiency of the radio frequency signal. At the same time, the relatively short distance facilitates the physical interconnection between the radio frequency board 1 and the control board 2 by means of wire bonding. By shortening the wire length, the parasitic inductance and capacitance are reduced, further improving the transmission performance of the radio frequency signal.

[0069] Optionally, continue to refer to Figure 2 , the first radio frequency interface 12 includes a third sub-radio frequency interface 121 and at least one fourth sub-radio frequency interface 122; the third sub-radio frequency interface 121 and the first sub-radio frequency interface 221 are correspondingly connected; the fourth sub-radio frequency interface 122 and the second sub-radio frequency interface 222 are connected in one-to-one correspondence.

[0070] Specifically, the third sub-radio frequency interface 121 in the first radio frequency interface 12 and the first sub-radio frequency interface 221 are correspondingly connected, so that the electro-optical conversion module 23 can convert the radio frequency signal transmitted sequentially through the third sub-radio frequency interface 121 and the first sub-radio frequency interface 221 into an optical signal. At the same time, continue to refer to Figure 2, the fourth sub-radio frequency interface 122 may include two fourth sub-radio frequency interfaces 122, and the fourth sub-radio frequency interfaces 122 are connected to the second sub-radio frequency interfaces 222 in a one-to-one correspondence, so that the optoelectronic conversion module 25 can convert the optical signal received by the control board 2 into a radio frequency signal, and output it through the second sub-radio frequency interface 222 and the fourth sub-radio frequency interface 122 in sequence. By setting the third sub-radio frequency interface 121 and the first sub-radio frequency interface 221 to be correspondingly connected, and the fourth sub-radio frequency interfaces 122 and the second sub-radio frequency interfaces 222 to be connected in a one-to-one correspondence, the optical module realizes the precise transmission and modular management of radio frequency signals, ensures the directional transmission of radio frequency signals between the radio frequency board 1 and the control board 2, avoids the confusion and interference of radio frequency signals, improves the efficiency and reliability of radio frequency signal transmission, and is convenient for the modular design and independent debugging of the optical module.

[0071] Optionally, continue to refer to Figure 2 , the main board interface 13 and the first radio frequency interface 12 are located on opposite sides of the digital processing module 14.

[0072] Specifically, the main board interface 13 and the first radio frequency interface 12 are arranged on opposite sides of the digital processing module 14 to be able to increase the physical distance between the main board interface 13 and the first radio frequency interface 12. The main board interface 13 mainly transmits low-speed digital signals and control signals, while the first radio frequency interface 12 mainly transmits high-speed radio frequency signals, and the signal characteristics of the two are quite different. Therefore, by increasing the physical distance between the main board interface 13 and the first radio frequency interface 12, the electromagnetic interference between the low-speed signal and the high-speed signal can be effectively isolated, thereby avoiding the crosstalk of the high-speed radio frequency signal to the low-speed digital signal, and improving the stability and reliability of signal transmission in the optical module.

[0073] Optionally, Figure 3 is a schematic structural diagram of another optical module provided by an embodiment of the present invention. As Figure 3 shown, the radio frequency board 1 further includes a first power supply interface 16 and a first power conversion module 17; the control board 2 further includes a second power supply interface 27 and a second power conversion module 28; the first power supply interface 16 and the second power supply interface 27 are detachably connected; the main board interface 13 is connected to the first power supply interface 16 through the first power conversion module 17; the first power conversion module 17 is used to convert the power supply signal into the power supply voltage required by the digital processing module 14 and then provide it to the digital processing module 14, and send the power supply signal to the first power supply interface 16; the second power conversion module 28 is used to receive the power supply signal through the first power supply interface 16 and the second power supply interface 27 in sequence, and convert the power supply signal into the power supply voltage required by the electro-optical conversion module 23 and then provide it to the electro-optical conversion module 23.

[0074] Among them, the first power supply interface 16 and the second power supply interface 27 can be specifically understood as the physical connection channels for transmitting power signals between the radio frequency board 1 and the control board 2, providing a path for the external main board to supply power to the control board 2 through the radio frequency board 1. The first power supply interface 16 and the second power supply interface 27 are detachably connected, enabling the radio frequency board 1 to be connected to the control board 2 with different optical designs. At the same time, the control board 2 can be connected to different types of radio frequency boards 1, enabling the optical module to meet the requirements of different application scenarios and improving the flexibility of the optical module. Exemplarily, the signals between the first power supply interface 16 and the second power supply interface 27 can be physically interconnected by wire bonding, that is, the pads on the radio frequency board 1 and the control board 2 can be directly connected by thin metal wires to form an electrical path between the first power supply interface 16 and the second power supply interface 27, thereby enabling the transmission of DC power signals. Specifically, the main board interface 13 is connected to the first power supply interface 16 through the first power conversion module 17, enabling the external main board to provide a power supply signal, such as a 3.3V voltage, to the first power conversion module 17 through the main board interface 13, so as to supply power to the digital processing module 14 and the first control module 15 in the radio frequency board 1. At the same time, the first power conversion module 17 can also send the power supply signal to the first power supply interface 16, such as transmitting a 3.3V voltage to the first power supply interface 16, enabling the second power conversion module 28 to receive the power supply signal in sequence through the first power supply interface 16 and the second power supply interface 27, so as to supply power to the electro-optical conversion module 23 and the second control unit 22 in the control board 2. By uniformly supplying power to the radio frequency board 1 and the control board 2 through the main board interface 13, the first power supply interface 16 and the second power supply interface 27, the flexibility of the modular design of the optical module is enhanced. There is no need to separately set the power input for the control board 2. The control board 2 can obtain the power signal from the radio frequency board 1 only through the first power supply interface 16 and the second power supply interface 27, thereby reducing the loss of the power signal and improving the power supply efficiency.

[0075] In addition, the first power conversion module 17 and the second power conversion module 28 can be specifically understood as the functional components for power conversion in the radio frequency board 1 and the control board 2 respectively. Exemplarily, the first power conversion module 17 and the second power conversion module 28 can be DC-DC power chips, and a DC-DC power chip can be specifically understood as a kind of DC-DC converter, which can convert the input DC voltage into DC output voltages of different levels. Specifically, the external main board provides a power supply signal, such as a 3.3V DC voltage, to the first power conversion module 17 through the main board interface 13. The first power conversion module 17 can step down the input 3.3V DC voltage to the voltage required by the digital processing module 14, such as 1.2V, through the switching circuit in the DC-DC power chip, and can provide the converted 1.2V voltage to the digital processing module 14, thus ensuring the normal operation of the digital processing module 14. At the same time, the first power conversion module 17 can also send the power supply signal to the first power supply interface 16, so that the second power conversion module 28 can receive the power supply signal, such as a 3.3V DC voltage, through the first power supply interface 16 and the second power supply interface 27 in sequence. The second power conversion module 28 can step down the input 3.3V DC voltage to the voltage required by the electro-optical conversion module 23, such as the 1.8V voltage required by the silicon optical modulator, through the switching circuit in the DC-DC power chip, and can provide the converted 1.8V voltage to the silicon optical modulator. If the voltage required by the laser is 3.3V, the second power conversion module 28 can directly provide the 3.3V voltage to the laser without stepping down, thus ensuring the normal operation of the silicon optical modulator and the laser in the electro-optical conversion module 23.

[0076] By converting the unified power supply signal provided by the external main board into the power supply voltages required by the digital processing module 14 and the electro-optical conversion module 23 through the first power conversion module 17 and the second power conversion module 28, it ensures that the digital processing module 14 and the electro-optical conversion module 23 can work at the optimal voltage, improving the operation efficiency of the optical module. The independent setting of the first power conversion module 17 and the second power conversion module 28 enhances the flexibility of the modular design of the optical module. If the electro-optical conversion module 23 with a different optical design is replaced, only the output voltage of the second power conversion module 28 needs to be adjusted, without modifying the power supply design of the radio frequency board 1, improving the compatibility of the optical module with different types of chips and significantly shortening the design and verification cycle. At the same time, by setting the first power conversion module 17 and the second power conversion module 28 as DC-DC power chips, the DC-DC power chips have high conversion efficiency, which can reduce the energy loss during the voltage conversion process, reduce the overall power consumption of the optical module, and the small size and high integration of the DC-DC power chips reduce the occupied space of the power management circuit in the radio frequency board 1 and the control board 2, thus reducing the design and manufacturing cost of the optical module.

[0077] It should be understood that the various forms of processes shown above can be used, with steps reordered, added, or deleted. For example, the steps described in the present invention can be executed in parallel, sequentially, or in a different order, as long as the desired results of the technical solution disclosed in the present invention can be achieved, and no limitations are imposed herein.

[0078] The above specific embodiments do not constitute a limitation on the protection scope of the present invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention shall be included within the protection scope of the present invention.

Claims

1. An optical module, characterized in that: include: Independent RF board and control board; The radio frequency board includes a first control signal interface, a first radio frequency interface, a main board interface, a digital processing module and a first control module; the control board includes a second control signal interface, a second radio frequency interface, an electro-optical conversion module and a second control module; the first radio frequency interface and the second radio frequency interface are detachably connected; the first control signal interface and the second control signal interface are detachably connected; the main board interface is used to connect to an external main board; The digital processing module is used to convert the mainboard digital signal received by the mainboard interface into a radio frequency signal, and send it to the electro-optical conversion module through the first radio frequency interface and the second radio frequency interface in sequence; The electro-optical conversion module is used to convert the radio frequency signal into an optical signal; The first control module is used to obtain the working condition signal of the digital processing module, and convert the working condition signal of the digital processing module into a first working condition signal of a preset format and then send it to the mainboard interface; The second control module is used to obtain the operating condition signal of the electro-optical conversion module, and convert the operating condition signal of the electro-optical conversion module into a second operating condition signal in the preset format, and then send it to the mainboard interface through the second control signal interface, the first control signal interface and the first control module in sequence.

2. The optical module according to claim 1, characterized in that: The first control module is further used to receive a digital processing control signal through the mainboard interface, and convert the digital processing control signal into a first control signal adapted to the digital processing module and then send it to the digital processing module to control the working state of the digital processing module; The first control module is further used to receive the electro-optical conversion control signal through the mainboard interface, and send it to the second control module through the first control signal interface and the second control signal interface in sequence; The second control module is further used for converting the electro-optical conversion control signal into a second control signal adapted to the electro-optical conversion module and then sending the second control signal to the electro-optical conversion module to control the working state of the electro-optical conversion module.

3. The optical module according to claim 1, characterized in that: The control panel also includes at least one photoelectric conversion module; The photoelectric conversion module is used to convert the optical signal received by the control board into a radio frequency signal, and send it to the digital processing module through the second radio frequency interface and the first radio frequency interface in sequence; The digital processing module is also used to convert the radio frequency signal received by the first radio frequency interface into a digital signal, and output the digital signal through the mainboard interface.

4. The optical module according to claim 3, characterized in that: The second radio frequency interface includes a first sub-radio frequency interface and at least one second sub-radio frequency interface; The first sub-RF interface is integrated into the electro-optical conversion module; The second sub-RF interface is arranged in a one-to-one correspondence with the photoelectric conversion module, and the second sub-RF interface is integrated in the photoelectric conversion module.

5. The optical module according to claim 4, characterized in that: The control panel also includes an optical fiber interface; the optical fiber interface is used to transmit or receive optical signals; The optical fiber interface is arranged on one side edge of the control board.

6. The optical module according to claim 3, characterized in that: The electro-optical conversion module and each of the photoelectric conversion modules are located on a side of the second control module close to the radio frequency board.

7. The optical module according to claim 4, characterized in that: The first radio frequency interface includes a third sub-radio frequency interface and at least one fourth sub-radio frequency interface; The third sub-RF interface is correspondingly connected to the first sub-RF interface; The fourth sub-RF interface and the second sub-RF interface are connected in a one-to-one correspondence.

8. The optical module according to claim 1, characterized in that: The mainboard interface and the first radio frequency interface are located on two opposite sides of the digital processing module.

9. The optical module according to claim 1, characterized in that: The electro-optical conversion module includes a laser and a silicon optical modulator; The control signal output end of the silicon light modulator is connected to the control signal input end of the laser; and the input end of the silicon light modulator is connected to the second radio frequency interface.

10. The optical module according to claim 1, characterized in that: The RF board also includes a first power supply interface and a first power conversion module; the control board also includes a second power supply interface and a second power conversion module; the first power supply interface and the second power supply interface are detachably connected; the mainboard interface is connected to the first power supply interface through the first power conversion module; The first power conversion module is used to convert the power supply signal into the power supply voltage required by the digital processing module and then provide it to the digital processing module, and send the power supply signal to the first power supply interface; The second power conversion module is used to receive the power supply signal through the first power supply interface and the second power supply interface in sequence, and convert the power supply signal into the power supply voltage required by the electro-optical conversion module and then provide it to the electro-optical conversion module.

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