Circuit board assembly and electronic equipment

Abstract

The invention relates to a circuit board assembly and electronic equipment, and the circuit board assembly comprises a first circuit board; the second circuit board is arranged opposite to the first circuit board, a first distance is formed between the second circuit board and the first circuit board, and at least one first electric device is arranged on the surface, opposite to the first circuit board, of the second circuit board and / or the surface, opposite to the second circuit board, of the first circuit board; the third circuit board and the second circuit board are located on the same side of the first circuit board, the third circuit board and the first circuit board are oppositely arranged, a second distance is formed between the third circuit board and the first circuit board, and at least one second electric device is arranged on the surface, opposite to the first circuit board, of the third circuit board and / or the surface, opposite to the third circuit board, of the first circuit board; the second distance is greater than the first distance. By means of the design, the space utilization rate of the circuit board assembly is effectively improved, the size of the circuit board assembly is further reduced, and therefore the miniaturization and thinning design of the circuit board assembly is facilitated.

Description

Technical Field

[0001] The present disclosure relates to the technical field of circuit boards, and in particular to a circuit board assembly and an electronic device. Background Art

[0002] At present, in order to reduce the area occupied by the motherboard area as much as possible, electronic devices (such as mobile phones) usually adopt the technical solution of motherboard stacking. Motherboard stacking means arranging multiple circuit boards on top of each other. However, due to inherent technical limitations, the thickness space cannot be maximized, which is not conducive to the miniaturization and thinning design of the motherboard. Summary of the invention

[0003] In order to overcome the problems existing in the related art, the present disclosure provides a circuit board assembly and an electronic device.

[0004] According to a first aspect of an embodiment of the present disclosure, a circuit board assembly is provided, which includes: a first circuit board; a second circuit board, which is arranged opposite to the first circuit board and has a first distance between the second circuit board and the first circuit board, and at least one first electrical component is arranged on a surface of the second circuit board opposite to the first circuit board and / or a surface of the first circuit board opposite to the second circuit board; a third circuit board, which is located on the same side of the first circuit board as the second circuit board and is arranged opposite to the first circuit board, and has a second distance between the third circuit board and the first circuit board, and at least one second electrical component is arranged on a surface of the third circuit board opposite to the first circuit board and / or a surface of the first circuit board opposite to the third circuit board, and the second distance is greater than the first distance.

[0005] In some embodiments of the present disclosure, the projections of the second circuit board and the third circuit board on the first circuit board are staggered; or, the projections of the second circuit board and the third circuit board on the first circuit board have an overlapping area.

[0006] In some embodiments of the present disclosure, the second circuit board is connected to the first circuit board through a first adapter structure, the second circuit board, the first adapter structure and the first circuit board form a first cavity, the at least one first electrical component is located in the first cavity, and the first adapter structure and the second circuit board are an integral structure or a separate structure.

[0007] In some embodiments of the present disclosure, the first adapter structure and the second circuit board are an integral structure, and the second circuit board and the first adapter structure are configured to shield the at least one first electrical component.

[0008] In some embodiments of the present disclosure, the second circuit board, the first adapter structure and the first circuit board are combined to form a plurality of first cavities, and the at least one first electrical component and the second electrical component disposed on the first circuit board are respectively located in different first cavities.

[0009] In some embodiments of the present disclosure, the first adapter structure and the second circuit board are an integrated structure, and the first adapter structure and the second circuit board are configured to shield electrical components in each of the first cavities.

[0010] In some embodiments of the present disclosure, the circuit board assembly also includes a second adapter structure, the second adapter structure and the third circuit board are an integral structure or a split structure, the second adapter structure and the third circuit board are combined to form a second cavity, and at least one of the second electrical components is arranged in the second cavity.

[0011] In some embodiments of the present disclosure, projections of the second circuit board and the third circuit board on the first circuit board are staggered, and the third circuit board is connected to the first circuit board via the second adapter structure.

[0012] In some embodiments of the present disclosure, the projections of the second circuit board and the third circuit board on the first circuit board have an overlapping area, and the second transfer structure is located in the overlapping area and connects the third circuit board with the second circuit board.

[0013] In some embodiments of the present disclosure, the third circuit board includes a first extension portion extending outward from the second adapter structure and opposite to the first circuit board, the second electrical device is arranged on the surface of the first extension portion opposite to the second circuit board, and / or the third electrical device is arranged on the surface of the second circuit board opposite to the first extension portion.

[0014] In some embodiments of the present disclosure, the at least one second electrical component includes a first sub-component disposed on the third circuit board, and a first avoidance groove or a first avoidance through hole is disposed on a surface of the second circuit board opposite to the first sub-component.

[0015] In some embodiments of the present disclosure, a second avoidance groove and / or a second avoidance through hole is provided on the surface of the second circuit board facing away from the first circuit board, and the circuit board assembly also includes a fourth electrical component installed in the second avoidance groove and / or the second avoidance through hole.

[0016] In some embodiments of the present disclosure, the circuit board assembly further includes a first shielding cover. At least a part of the structure of the first shielding cover extends into the second avoidance through hole, and the opening of the first shielding cover faces away from the side of the first circuit board. The fourth electrical component is installed into the first shielding cover through the opening.

[0017] In some embodiments of the present disclosure, a limiting portion is provided at the opening edge of the first shielding cover. The limiting portion abuts against the surface of the second circuit board facing away from the first circuit board. A heightening portion and a fifth electrical component are further provided on the second circuit board. The heightening portion includes a first surface close to the second circuit board and a second surface facing away from the second circuit board. The first surface abuts against the surface of the second circuit board facing away from the first circuit board. The fifth electrical component is disposed on the second surface, and the projection of the second surface on the second circuit board partially overlaps with the projection of the limiting portion on the second circuit board.

[0018] In some embodiments of the present disclosure, the third circuit board further includes a second extension portion offset from the first circuit board. A sixth electrical component is provided on the surface of the second extension portion facing the first circuit board.

[0019] According to a second aspect of the present disclosure, there is provided an electronic device, which includes the above-mentioned circuit board assembly.

[0020] In some embodiments of the present disclosure, the electronic device further includes a rotating shaft and folding portions provided on both sides of the rotating shaft. The folding portions can be folded or opened relative to the rotating shaft. At least one of the folding portions is provided with the circuit board assembly, and the second extension portion of the third circuit board extends to the back side of the rotating shaft.

[0021] The technical solutions provided by the embodiments of the present disclosure may include the following beneficial effects:

[0022] In the circuit board assembly of the present disclosure, a first distance between the second circuit board and the first circuit board is less than a second distance between the third circuit board and the first circuit board, that is, the second circuit board and the third circuit board have different heights, so as to realize the staggered layer design of the second circuit board and the third circuit board. At least one first electrical component is provided on the surface of the second circuit board facing the first circuit board and / or on the surface of the first circuit board facing the second circuit board. At least one second electrical component is provided on the surface of the third circuit board facing the first circuit board and / or on the surface of the first circuit board facing the third circuit board. With such a design, the thickness space of the circuit board assembly can be maximally utilized, the positions of the electrical components can be reasonably arranged according to the sizes of the respective electrical components, the space utilization rate of the circuit board assembly can be effectively improved, and the size of the circuit board assembly can be further reduced, thereby facilitating the miniaturization and thinning design of the circuit board assembly and optimizing the user experience.

[0023] It should be understood that the above general description and the following detailed description are merely exemplary and explanatory, and do not limit the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The accompanying drawings herein are incorporated into and constitute a part of this specification, showing embodiments consistent with the present disclosure, and together with the specification are used to explain the principles of the present disclosure.

[0025] Figure 1 is a schematic structural view showing the cooperation between a circuit board assembly and a rotating shaft according to a first exemplary embodiment;

[0026] Figure 2 is a schematic structural view showing the cooperation between a circuit board assembly and a rotating shaft according to a second exemplary embodiment;

[0027] Figure 3 is a schematic structural view showing the cooperation between a circuit board assembly and a rotating shaft according to a third exemplary embodiment;

[0028] Figure 4 is a schematic structural view showing the cooperation between a circuit board assembly and a rotating shaft according to a fourth exemplary embodiment;

[0029] Figure 5 is a schematic structural view showing the cooperation between a circuit board assembly and a rotating shaft according to a fifth exemplary embodiment;

[0030] Figure 6 is an exploded schematic view showing a circuit board assembly according to an exemplary embodiment;

[0031] Figure 7 is a schematic sectional view showing a circuit board assembly according to an exemplary embodiment;

[0032] Figure 8 is a partial sectional schematic view showing a circuit board assembly according to an exemplary embodiment;

[0033] Figure 9 is a schematic structural view showing an electronic device according to an exemplary embodiment.

[0034] In the figures:

[0035] 1-first circuit board; 11-first surface; 12-second surface; 121-fourth shielding cover; 2-second circuit board; 21-third surface; 22-fourth surface; 221-first avoidance groove; 222-second avoidance through hole; 223-first avoidance through hole; 224-third electrical component; 23-first transfer structure; 24-heightening part; 241-fixing part; 242-bearing part; 25-fifth electrical component; 3-third circuit board; 31-fifth surface; 32-sixth surface; 321-fifth shielding cover; 33-second transfer structure; 34-second extension part; 35-first extension part Extension; 341-sixth electrical component; 4-first cavity; 41-first electrical component; 5-second cavity; 51-second electrical component; 511-first sub-component; 512-second sub-component; 52-third shielding cover; 6-first shielding cover; 61-limiting portion; 62-fourth electrical component; 7-camera module; 8-electronic device; 81-first folding portion; 811-main board area; 812-first battery area; 813-first sub-board area; 82-second folding portion; 821-second sub-board area; 822-second battery area; 823-third sub-board area; 83-rotating axis area; 831-rotating axis. DETAILED DESCRIPTION

[0036] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present disclosure. Instead, they are merely examples of devices and methods consistent with some aspects of the present disclosure as detailed in the appended claims.

[0037] In order to minimize the area occupied by the motherboard, electronic devices currently on the market, such as foldable phones, usually adopt a motherboard stacking arrangement. For example, multiple circuit boards are stacked on top of each other, and electronic components are arranged on multiple circuit boards, so that the motherboard stacking can expand the ornament space in the height direction, thereby reducing the area occupied by the motherboard. However, due to inherent technical limitations, the thickness space cannot be maximized, which is not conducive to the miniaturization and thinning design of circuit board components.

[0038] To solve the above technical problems, the present disclosure provides a circuit board assembly in which a first distance between a second circuit board and a first circuit board is less than a second distance between a third circuit board and the first circuit board, that is, the second circuit board and the third circuit board have different heights, so as to implement a staggered layer design of the second circuit board and the third circuit board. At least one first electrical component is provided on a surface of the second circuit board opposite to the first circuit board and / or on a surface of the first circuit board opposite to the second circuit board. At least one second electrical component is provided on a surface of the third circuit board opposite to the first circuit board and / or on a surface of the first circuit board opposite to the third circuit board. With such a design, the thickness space of the circuit board assembly can be utilized to the maximum extent, the positions of the electrical components can be reasonably arranged according to the sizes of the respective electrical components, the space utilization rate of the circuit board assembly can be effectively improved, and the size of the circuit board assembly can be further reduced, thereby facilitating the miniaturization and thinning design of the circuit board assembly and optimizing the user experience.

[0039] An exemplary embodiment of the present disclosure provides a circuit board assembly, as Figure 1 and Figure 5 shown, the circuit board assembly includes a first circuit board 1, a second circuit board 2, and a third circuit board 3. The second circuit board 2 is disposed opposite to the first circuit board 1 and has a first distance from the first circuit board 1. Exemplarily, the first circuit board 1 includes opposite first surface 11 and second surface 12, and the second circuit board 2 includes a third surface 21 opposite to the first circuit board 1 and a fourth surface 22 facing away from the first circuit board 1. The third surface 21 of the second circuit board 2 is opposite to and electrically connected to the first surface 11 of the first circuit board 1. A first distance exists between the fourth surface 22 of the second circuit board 2 and the first surface 11 of the first circuit board 1.

[0040] At least one first electrical component 41 is provided on the surface of the second circuit board 2 facing the first circuit board 1 and / or on the surface of the first circuit board 1 facing the second circuit board 2. Exemplarily, at least one first electrical component 41 can be provided on the third surface 21 of the second circuit board 2, can also be provided on the first surface 11 of the first circuit board 1, and can also be respectively provided on the third surface 21 of the second circuit board 2 and the first surface 11 of the first circuit board 1. Exemplarily, when at least one first electrical component 41 is respectively provided on the third surface 21 of the second circuit board 2 and the first surface 11 of the first circuit board 1, the circuit board assembly further includes at least one second shielding cover (not shown in the figure). The second shielding cover only covers each first electrical component 41 located on the third surface 21 of the second circuit board 2, or only covers each first electrical component 41 located on the first surface 11 of the first circuit board 1, or respectively covers each first electrical component 41 located on the third surface 21 of the second circuit board 2 and each first electrical component 41 located on the first surface 11 of the first circuit board 1, so as to avoid electromagnetic interference between each first electrical component 41 on the third surface 21 of the second circuit board 2 and each first electrical component 41 on the first surface 11 of the first circuit board 1.

[0041] The third circuit board 3 and the second circuit board 2 are located on the same side of the first circuit board 1 and are disposed opposite to the first circuit board 1. There is a second distance between the third circuit board 3 and the first circuit board 1. Exemplarily, the third circuit board 3 includes a fifth surface 31 facing the first circuit board 1 and a sixth surface 32 facing away from the first circuit board 1. The fifth surface 31 of the third circuit board 3 faces the first surface 11 of the first circuit board 1, and there is a second distance between the sixth surface 32 of the third circuit board 3 and the first surface 11 of the first circuit board 1. By making the second distance greater than the first distance, a stepped design between the second circuit board 2 and the third circuit board 3 is achieved. With such a design, the positions of the electrical components can be reasonably arranged according to the sizes of the respective electrical components, and the thickness space of the circuit board assembly can be utilized to the maximum extent. Exemplarily, the space height between the fifth surface 31 and the first surface 11 is greater than the space height between the third surface 21 and the first surface 11. Further, electrical components with a smaller height can be arranged in the space between the first surface 11 and the third surface 21, and electrical components with a larger height can be arranged in the space between the first surface 11 and the fifth surface 31. Instead of increasing the height between two adjacent circuit boards for arranging higher electrical components, it is beneficial to the thinning design of the circuit board assembly. Exemplarily, two layers of electrical components can be arranged in the space between the fifth surface 31 and the first surface 11, and one layer of electrical components can be arranged in the space between the third surface 21 and the first surface 11. That is, in the space between the fifth surface 31 and the first surface 11, electrical components can be arranged on both the fifth surface 31 and the first surface. In the space between the third surface 21 and the first surface 11, the electrical components are arranged on the third surface 21 or the first surface 21. Adopting such an arrangement form can also effectively improve the space utilization rate of the circuit board assembly, further reduce the size of the circuit board assembly, which is beneficial to the miniaturization design of the circuit board assembly and optimizes the user experience.

[0042] At least one second electrical component 51 is provided on the surface of the third circuit board 3 opposite to the first circuit board 1 and / or on the surface of the first circuit board 1 opposite to the third circuit board 3. Exemplarily, at least one second electrical component 51 can be provided on the fifth surface 31 of the third circuit board 3, can also be provided on the first surface 11 of the first circuit board 1, and can also be provided on the fifth surface 31 of the third circuit board 3 and the first surface 11 of the first circuit board 1 respectively. Exemplarily, when at least one second electrical component 51 is provided on the fifth surface 31 of the third circuit board 3 and the first surface 11 of the first circuit board 1 respectively, the circuit board assembly further includes at least one third shielding cover 52. The third shielding cover 52 only covers each second electrical component 51 located on the fifth surface 31 of the third circuit board 3, or only covers each second electrical component 51 located on the first surface 11 of the first circuit board 1, or covers each second electrical component 51 located on the fifth surface 31 of the third circuit board 3 and each second electrical component 51 located on the first surface 11 of the first circuit board 1 respectively, so as to avoid electromagnetic interference between each second electrical component 51 on the fifth surface 31 of the third circuit board 3 and each second electrical component 51 on the first surface 11 of the first circuit board 1.

[0043] Exemplarily, the first electrical component 41 and the second electrical component 51 can be resistors, capacitors, inductors, etc.

[0044] Exemplarily, the first circuit board 1 can be a printed circuit board (PCB for short). Similarly, the second circuit board 2 and the third circuit board 3 can be PCB boards.

[0045] Exemplarily, the first electrical component 41 can be mounted on the substrate of the first circuit board 1 or the second circuit board 2 by surface mount technology (SMT for short). Similarly, the second electrical component 51 can also be mounted on the substrate of the third circuit board 3 or the first circuit board 1 by SMT technology.

[0046] Exemplarily, the first circuit board 1 can be a main board, and the electronic device 8 processes data and transmits data through the main board. The second circuit board 2 and the third circuit board 3 can be radio frequency boards, and the radio frequency boards can wirelessly receive and transmit data. Of course, the first circuit board 1, the second circuit board 2, and the third circuit board 3 can also be circuit boards with other functions, and this embodiment does not limit this.

[0047] Continue to refer to Figure 1In one embodiment, the second surface 12 of the first circuit board 1, the fourth surface 22 of the second circuit board 2, and the sixth surface 32 of the third circuit board 3 can also be provided with electrical components as required, and the electrical components on the second surface 12 and the electrical components on the sixth surface 32 are electromagnetically shielded by the fourth shielding cover 121 and the fifth shielding cover 321, respectively, thereby further improving the space utilization of the circuit board assembly.

[0048] Continue to refer Figure 1 In one embodiment, the projections of the second circuit board 2 and the third circuit board 3 on the first circuit board 1 are staggered. Such a design can further improve the utilization rate of the second circuit board 2 and the third circuit board 3. Exemplarily, the fourth surface 22 of the second circuit board 2 can also be provided with electrical components, and the height of the electrical components provided on the fourth surface 22 is not limited by the setting height of the third circuit board 3, and the fifth surface 31 of the third circuit board 3 can also be provided with a second electrical component 51 with a larger height, so that the various electrical components on the circuit board assembly can be arranged more reasonably to maximize the use of the thickness space of the circuit board assembly.

[0049] In another embodiment, if Figures 2 to 4 As shown, the projections of the second circuit board 2 and the third circuit board 3 on the first circuit board 1 have an overlapping area. For example, the length of the second circuit board 2 can be extended so that a part of the second circuit board 2 is located below the third circuit board 3 to form an overlapping area. The length of the third circuit board 3 can also be extended so that a part of the third circuit board 3 is located above the second circuit board 2 to form an overlapping area. Alternatively, the lengths of the two can be extended to form an overlapping area. With such a design, the area of ​​the second circuit board 2 or the third circuit board 3 is expanded, and the use area of ​​the second circuit board 2 or the third circuit board 3 is effectively expanded without increasing the overall size and thickness of the circuit board assembly, thereby improving the space utilization rate of the circuit board assembly.

[0050] In one embodiment, if Figures 1 to 4 As shown, the second circuit board 2 is connected to the first circuit board 1 through the first adapter structure 23 and realizes electrical connection with each other. For example, a conductive through hole or a conductive line can be set in the first adapter structure 23, so that the conductive layer on the first circuit board 1 can be electrically connected to the conductive layer on the second circuit board 2 through the conductive through hole or the conductive line. The second circuit board 2, the first adapter structure 23 and the first circuit board 1 are enclosed to form a first cavity 4, and at least one first electrical component 41 is located in the first cavity 4. With such a design, on the one hand, the first cavity 4 protects each first electrical component 41 arranged in the first cavity 4. On the other hand, the use area of ​​the first circuit board 1 and the second circuit board 2 is saved, the utilization rate of the two is improved, and the size of the circuit board assembly is further reduced.

[0051] Continue to referFigures 1 to 4 In one embodiment, the first transfer structure 23 and the second circuit board 2 are an integrated structure. For example, the second circuit board 2 is a PCB board. The third surface 21 of the second circuit board 2 is processed by a Cavity (local depression) process, and a part of the substrate on the third surface 21 of the second circuit board 2 is removed to obtain a circuit board with a concave cavity structure, so that the circuit board is arranged on the first circuit board 1 to form a first cavity 4, and the side wall of the concave cavity structure constitutes the first transfer structure 23. For example, the first transfer structure 23 is electrically connected to the first surface 11 of the first circuit by welding. Such a design can effectively save the use area of ​​the first circuit board 1 and improve the utilization rate of the circuit board assembly.

[0052] In another embodiment, the first adapter structure 23 and the second circuit board 2 are separate structures. For example, the first adapter structure 23 is configured with a first hollow structure, and the openings on both sides of the first hollow structure are blocked by the third surface 21 of the second circuit board 2 and the first surface 11 of the first circuit board 1 to form a first cavity 4. With such a setting form, the utilization rate of the circuit board assembly can also be improved.

[0053] In one embodiment, if Figure 1 As shown, when the first adapter structure 23 and the second circuit board 2 are an integral structure, the second circuit board 2 and the first adapter structure 23 are configured to shield at least one first electrical device 41 disposed in the first cavity 4. Exemplarily, when the first adapter structure 23 and the second circuit board 2 are an integral structure, the second circuit board 2 with a concave cavity structure includes at least one metal layer and at least one conductive circuit layer. The at least one metal layer may be a copper layer, for example. The at least one metal layer is used to shield the first electrical device 41 in the first cavity 4. With such a design, there is no need to set up a shielding cover separately. While simplifying the structure, the space utilization of the first circuit board 1 and the second circuit board 2 is improved, and the thickness and size of the circuit board assembly can be effectively reduced, which is conducive to the miniaturization and thinning design of the circuit board assembly.

[0054] In another embodiment, if Figure 1As shown, when the first adapter structure 23 and the second circuit board 2 are separate structures, the second circuit board 2 and the first adapter structure 23 are configured to shield at least one first electrical device 41 disposed in the first cavity 4. For example, a shielding portion is provided in the first adapter structure 23. For example, the shielding portion may be a metal layer, and the material of the metal layer may be copper, aluminum, zinc, and alloys thereof. In this way, electromagnetic interference between the first electrical device 41 in the first cavity 4 and other electrical devices outside the first cavity 4 can be prevented, and there is no need to provide a shielding cover. While simplifying the structure, the space utilization rate of the first circuit board 1 and the second circuit board 2 can be effectively improved, and the thickness and size of the circuit board assembly can be further reduced, thereby facilitating the miniaturization and thinning design of the circuit board assembly. It should be understood that the first adapter structure 23 can be configured as a shielding portion in its entirety, or a portion of the first adapter structure 23 can be configured as a shielding portion, that is, the first adapter structure 23 can be used as a shielding portion as a whole, or a portion of the first adapter structure 23 can be used as a shielding portion.

[0055] In one embodiment, if Figures 2 to 4 As shown, the second circuit board 2, the first adapter structure 23 and the first circuit board 1 are enclosed to form a plurality of first cavities 4. For example, the third surface 21 of the second circuit board 2 is processed by the Cavity (local depression) process to obtain a second circuit board 2 with a plurality of concave cavity structures, so that the third surface 21 of the second circuit board 2 is arranged on the first surface 11 of the first circuit board 1 to form a plurality of first cavities 4. At least one first electrical device 41 and a second electrical device 51 arranged on the first circuit board 1 are respectively located in different first cavities 4. For example, two first cavities 4 are enclosed to form, at least one first electrical device 41 is arranged in one first cavity 4, and the second electrical device 51 located on the first circuit board 1 is arranged in another first cavity 4. With such a setting form, not only can the at least one first electrical device 41 and the second electrical device 51 located on the first circuit board 1 be protected respectively, but also the first electrical device 41 and the second electrical device 51 are divided, thereby improving the standardization of the arrangement of electrical devices and facilitating subsequent maintenance.

[0056] In one embodiment, if Figure 2 As shown, the first adapter structure 23 and the second circuit board 2 are an integral structure, and the first adapter structure 23 and the second circuit board 2 are constructed to shield the electrical components in each first cavity 4, respectively shielding the electrical components in each first cavity 4 instead of adding a shielding cover, thereby improving the space utilization of the circuit board assembly and further reducing the thickness and size of the circuit board assembly.

[0057] In one embodiment, if Figures 1 to 4As shown, the circuit board assembly also includes a second adapter structure 33. The second adapter structure 33 and the third circuit board 3 can be an integral structure or a split structure. The effect achieved is the same as that achieved between the first adapter structure 23 and the second circuit board 2, which will not be repeated here.

[0058] In one embodiment, reference Figure 1 When the projections of the second circuit board 2 and the third circuit board 3 on the first circuit board 1 are staggered, the third circuit board 3 is connected to the first circuit board 1 through the second adapter structure 33, and the third circuit board 3, the second adapter structure 33 and the first circuit board 1 are enclosed together to form a second cavity 5, and at least one second electrical component 51 is disposed in the second cavity 5. Such a design can simplify the structure of the circuit board assembly on the one hand, and on the other hand, the second cavity 5 can protect the second electrical component 51.

[0059] In another embodiment, referring to Figures 2 to 4 When the projections of the second circuit board 2 and the third circuit board 3 on the first circuit board 1 have an overlapping area, the second adapter structure 33 is located in the overlapping area and connects the third circuit board 3 to the second circuit board 2. The third circuit board 3, the second adapter structure 33 and the fourth surface 22 of the second circuit board 2 are enclosed together to form a second cavity 5, and at least one second electrical device 51 is arranged in the second cavity 5. Such a setting form not only simplifies the structure of the circuit board assembly, but also effectively improves the space utilization rate of the circuit board assembly without increasing the overall size and thickness of the circuit board assembly.

[0060] In one embodiment, if Figures 2 to 4 As shown, the third circuit board 3 includes a first extension portion 35 extending outward from the second adapter structure 33 and opposite to the first circuit board 1, and the first extension portion 35 and the second circuit board 2 are designed in a staggered layer. A second electrical component 51 is arranged on the surface of the first extension portion 35 opposite to the second circuit board 2. Such a design can effectively expand the use area of ​​the third circuit board 3, thereby effectively improving the utilization rate of the circuit board assembly. The surface of the second circuit board 2 opposite to the first extension portion 35 can also be provided with a third electrical component 224, thereby further improving the utilization rate of the second circuit board 2.

[0061] In one embodiment, if Figure 3As shown, when the projections of the second circuit board 2 and the third circuit board 3 on the first circuit board 1 have an overlapping area, at least one second electrical component 51 includes a first sub-component 511 disposed on the third circuit board 3 and a second sub-component 512 disposed on the first circuit board 1, and a first avoidance groove 221 is disposed on the surface of the second circuit board 2 opposite to the first sub-component 511, and the second circuit board 2, the third circuit board 3 and the second adapter structure 33 enclose and form a second cavity 5. Exemplarily, the first avoidance groove 221 is disposed on the fourth surface 22 of the second circuit board 2 corresponding to the position of the second cavity 5. The second circuit board 2 can, for example, be processed by a Cavity (local depression) process to remove part of the base material of the second circuit board 2 to obtain a second circuit board 2 with a groove structure, thereby forming a first avoidance groove 221.

[0062] In this embodiment, by providing the first avoidance groove 221 on the fourth surface 22 of the second circuit board 2, on the one hand, the height of the second cavity 5 is increased, so that a first sub-component 511 with a higher height can be provided in the second cavity 5, so as to more reasonably utilize the thickness space of the circuit board assembly. Figure 3 As shown, by setting a first avoidance groove 221 on the second circuit board 2, the first sub-component 511 and the second sub-component 512 are separated by the second circuit board 2, the first circuit board 1, the first adapter structure 23 and the second circuit board 2 shield the second sub-component 512, and the second circuit board 2, the second adapter structure 33 and the third circuit board 3 shield the first sub-component 511, without the need to set up a shielding cover separately, thereby effectively improving the space utilization of the circuit board assembly and further reducing the thickness and size of the circuit board assembly.

[0063] At the same time, the area occupied by the second adapter structure 33 on the first circuit board 1 can be saved, thereby improving the utilization rate of the first circuit board 1.

[0064] In another embodiment, if Figure 4 and Figure 6 As shown, when the projections of the second circuit board 2 and the third circuit board 3 on the first circuit board 1 have an overlapping area, the second circuit board 2, the third circuit board 3 and the second adapter structure 33 enclose a second cavity 5, the first sub-component 511 arranged on the third circuit board 3 is located in the second cavity 5, and the fourth surface 22 of the second circuit board 2 is provided with a first avoidance through hole 223 corresponding to the position of the second cavity 5. Exemplarily, the second circuit board 2 is processed by a Cavity (local recess) process to remove part of the substrate of the second circuit board 2 to obtain a second circuit board 2 with a through hole structure, thereby forming a first avoidance through hole 223. Figure 4As shown, the first avoidance through-hole 223 enables the second cavity 5 and the first cavity 4 to communicate and merge to form a single cavity, expanding the height of the cavity. In this cavity, electrical components with a greater height can be arranged. With such a design, it is also possible to maximize the utilization of the thickness space of the circuit board assembly, improving the space utilization rate of the circuit board assembly.

[0065] Exemplarily, when the first avoidance through-hole 223 is provided on the second circuit board 2, as Figure 4 shown, by providing at least one third shielding cover 52, the third shielding cover 52 covers the second electrical component 51 located on the third circuit board 3, or covers the second electrical component 51 located on the first circuit board 1, or respectively covers the second electrical component 51 located on the third circuit board 3 and the second electrical component 51 located on the first circuit board 1, so as to avoid electromagnetic interference between the second electrical component 51 on the third circuit board 3 and the second electrical component 51 on the first circuit board 1.

[0066] In one embodiment, as Figures 2 to 4 shown, a second avoidance groove is provided on the surface of the second circuit board 2 facing away from the first circuit board 1. The circuit board assembly further includes a fourth electrical component 62 installed in the second avoidance groove. The fourth electrical component 62 can be, for example, a camera module. With such a design, the structure is more compact. It not only improves the space utilization rate of the circuit board assembly, but also can reduce the thickness and size of the circuit board assembly, thereby facilitating the miniaturization and thinning design of the circuit board assembly and optimizing the user experience.

[0067] In another embodiment, as Figures 4 to 6 shown, a second avoidance through-hole 222 (as Figure 6 shown) is provided on the surface of the second circuit board 2 facing away from the first circuit board 1. The fourth electrical component 62 is installed in the second avoidance through-hole 222. With such a design, the space utilization rate of the circuit board assembly is also improved.

[0068] In one embodiment, as Figure 5 and Figure 7 shown, a plurality of through-holes can also be provided on the first circuit board 1, and a camera module 7 is provided at each through-hole. With such a design, not only the utilization rate of the first circuit board 1 is improved, but also the multi-camera mode of the electronic device 8 is realized.

[0069] When the second avoidance through-hole 222 is provided on the second circuit board 2, it will interrupt the closed space in the first cavity 4, thus affecting the shielding effect on the first electrical component 41 in the first cavity 4. Based on this, in one embodiment, as Figures 4 to 8As shown, the circuit board assembly further includes a first shielding cover 6. By providing the first shielding cover 6 to block the second avoidance through hole 222, the shielding effect on the first electrical component 41 in the first cavity 4 is ensured, effectively preventing the first electrical component 41 in the first cavity 4 from being affected by electromagnetic interference. At least part of the structure of the first shielding cover 6 extends into the second avoidance through hole 222 and the opening of the first shielding cover 6 faces away from the first circuit board 1. The fourth electrical component 62 is inserted into the first shielding cover 6 through the opening. With such a design, the first shielding cover 6 not only serves to support the fourth electrical component 62, but also makes the structure of the circuit board assembly more compact, improves the space utilization rate of the circuit board assembly, and reduces the thickness and size of the circuit board assembly.

[0070] In one embodiment, as Figure 4 and Figure 8 shown, a limiting portion 61 is provided at the opening edge of the first shielding cover 6. By making the limiting portion 61 abut against the fourth surface 22 of the second circuit board 2, the fixing of the first shielding cover 6 is achieved, effectively preventing the first shielding cover 6 from falling into the first cavity 4 and causing damage to the first electrical component 41, thereby effectively improving the reliability and safety of the circuit board assembly. A heightening portion 24 and a fifth electrical component 25 are also provided on the second circuit board 2. The fifth electrical component 25 can be, for example, a board-to-board connector. The heightening portion 24 includes a first surface disposed close to the second circuit board 2 and a second surface disposed away from the second circuit board 2. The first surface of the heightening portion 24 abuts against the fourth surface 22 of the second circuit board 2. The fifth electrical component 25 is disposed on the second surface of the heightening portion 24. The projection of the second surface of the heightening portion 24 on the second circuit board 2 partially overlaps with the projection of the limiting portion 61 on the second circuit board 2. Exemplarily, in combination with Figure 8 shown, the heightening portion 24 includes a fixing portion 241 abutting against the fourth surface 22 of the second circuit board 2 and a bearing portion 242 connected to the fixing portion 241. The fifth electrical component 25 is disposed on the bearing portion 242. Along a plane parallel to the second circuit board 2, the cross-sectional area of the bearing portion 242 is larger than the cross-sectional area of the fixing portion 241, thereby forming a stepped structure between the bearing portion 242 and the fixing portion 241. The fixing portion 241 also abuts against the fourth surface 22 of the second circuit board 2. The limiting portion 61 abuts against the fourth surface 22 of the second circuit board 2 and is between the bearing portion 242 and the second circuit board 2, such that the projection of the bearing portion 242 on the second circuit board 2 partially overlaps with the projection of the limiting portion 61 on the second circuit board 2.

[0071] Such a design, on the one hand, can expand the mounting area of ​​the heightened portion 24, so that the fifth electrical component 25 can be better fixed, and the stability of the fifth electrical component 25 when fixed is improved. On the other hand, the heightened portion 24 can cleverly avoid the thickness of the limiting portion 61 and its welding space by using a step structure, which can minimize the area occupied by the fifth electrical component 25 on the second circuit board 2, save space, and effectively improve the space utilization rate of the circuit board assembly.

[0072] In one embodiment, if Figures 1 to 4 Combined with Figure 7 As shown, the third circuit board 3 further includes a second extension portion 34 staggered from the first circuit board 1, and a sixth electrical component 341 is provided on the surface of the second extension portion 34 facing the first circuit board 1. The sixth electrical component 341 can be, for example, a board-to-board connector. With such a design, the use area of ​​the third circuit board 3 is expanded, and the utilization rate of the third circuit board 3 is improved.

[0073] An exemplary embodiment of the present disclosure provides an electronic device, such as Figures 1 to 9 As shown, the electronic device 8 includes the above-mentioned circuit board assembly. The first distance between the second circuit board 2 and the first circuit board 1 is less than the second distance between the third circuit board 3 and the first circuit board 1, that is, the second circuit board 2 and the third circuit board 3 have different heights, thereby realizing the staggered design of the third circuit board 3 and the second circuit board 2, and at least one first electrical component 41 is arranged on the surface of the second circuit board 2 opposite to the first circuit board 1 and / or the surface of the first circuit board 1 opposite to the second circuit board 2, and at least one second electrical component 51 is arranged on the surface of the third circuit board 3 opposite to the first circuit board 1 and / or the surface of the first circuit board 1 opposite to the third circuit board 3. Such a design can maximize the use of the thickness space of the circuit board assembly, reasonably arrange the positions of the electrical components according to the sizes of each electrical component, effectively improve the space utilization rate of the circuit board assembly, and further reduce the size of the circuit board assembly, which is conducive to the miniaturization and thinning design of the electronic device 8 and optimizes the user experience.

[0074] Exemplarily, the electronic device 8 can be a mobile device such as a mobile phone, a tablet computer, a laptop computer, a PDA, a vehicle-mounted electronic device 8, a wearable device, an ultra-mobile personal computer (UMPC), a netbook or a personal digital assistant (PDA), and can also be a non-mobile device such as a personal computer (PC), a television (TV), a teller machine or a self-service machine, etc.

[0075] Continue to refer Figures 1 to 8, In one embodiment, the electronic device 8 further includes a rotating shaft 831 and folding portions disposed on both sides of the rotating shaft 831. The folding portions can be folded or opened relative to the rotating shaft 831, and a circuit board assembly is disposed on at least one of the folding portions. Exemplarily, the folding portions include a first folding portion 81 and a second folding portion 82, and the first folding portion 81 and the second folding portion 82 can be opened or folded relative to the rotating shaft 831. The first folding portion 81 includes a main board area 811, a first battery area 812, and a first auxiliary board area 813. The second folding portion 82 includes a second auxiliary board area 821, a second battery area 822, and a third auxiliary board area 823. A rotating shaft area 83 for the rotating shaft 831 to rotate is provided at the connection between the first folding portion 81 and the second folding portion 82. The circuit board assembly is disposed on the main board area 811, and the second extension portion 34 of the third circuit board 3 extends to the back side of the rotating shaft 831, and the sixth electrical component 341 is located on the surface of the second extension portion 34 facing the rotating shaft 831. With such a design, the space of the rotating shaft area 83 can be effectively utilized, which is beneficial to the miniaturization design of the electronic device 8.

[0076] Those skilled in the art will readily conceive of other embodiments of the present disclosure after considering the specification and practicing the invention disclosed herein. The present disclosure is intended to cover any variations, uses, or adaptations of the present disclosure that follow the general principles of the present disclosure and include known common knowledge or conventional technical means in the technical field not disclosed in the present disclosure. The specification and examples are only illustrative, and the true scope and spirit of the present disclosure are pointed out by the following claims.

[0077] It should be understood that the present disclosure is not limited to the exact structures described above and shown in the drawings, and various modifications and changes can be made without departing from its scope. The scope of the present disclosure is only limited by the appended claims.

Claims

1. A circuit board assembly, It is characterized in that The circuit board assembly comprises: a first circuit board; A second circuit board is arranged opposite to the first circuit board and has a first distance from the first circuit board, and at least one first electrical component is arranged on a surface of the second circuit board opposite to the first circuit board and / or on a surface of the first circuit board opposite to the second circuit board; A third circuit board is located on the same side of the first circuit board as the second circuit board and is arranged opposite to the first circuit board. A second distance is between the third circuit board and the first circuit board. At least one second electrical component is arranged on a surface of the third circuit board opposite to the first circuit board and / or a surface of the first circuit board opposite to the third circuit board. The second distance is greater than the first distance.

2. The circuit board assembly according to claim 1, It is characterized in that The projections of the second circuit board and the third circuit board on the first circuit board are staggered with each other; or, Projections of the second circuit board and the third circuit board on the first circuit board have an overlapping area.

3. The circuit board assembly according to claim 2, It is characterized in that The second circuit board is connected to the first circuit board through a first adapter structure. The second circuit board, the first adapter structure and the first circuit board together form a first cavity. The at least one first electrical component is located in the first cavity. The first adapter structure and the second circuit board are an integral structure or a separate structure.

4. The circuit board assembly according to claim 3, It is characterized in that The first transfer structure and the second circuit board are an integrated structure, and the second circuit board and the first transfer structure are configured to shield the at least one first electrical component.

5. The circuit board assembly according to claim 3, It is characterized in that The second circuit board, the first adapter structure and the first circuit board are combined to form a plurality of first cavities, and the at least one first electrical component and the second electrical component disposed on the first circuit board are respectively located in different first cavities.

6. The circuit board assembly according to claim 5, It is characterized in that The first adapter structure and the second circuit board are an integrated structure, and the first adapter structure and the second circuit board are configured to shield the electrical components in each of the first cavities.

7. The circuit board assembly according to claim 2, It is characterized in that The circuit board assembly also includes a second adapter structure, which is an integral structure or a separate structure with the third circuit board. The second adapter structure and the third circuit board enclose a second cavity, and at least one of the second electrical components is disposed in the second cavity.

8. The circuit board assembly according to claim 7, It is characterized in that The projections of the second circuit board and the third circuit board on the first circuit board are staggered with each other, and the third circuit board is connected to the first circuit board via the second adapter structure.

9. The circuit board assembly according to claim 7, It is characterized in that The projections of the second circuit board and the third circuit board on the first circuit board have an overlapping area, and the second transfer structure is located in the overlapping area and connects the third circuit board with the second circuit board.

10. The circuit board assembly according to claim 7, It is characterized in that The third circuit board includes a first extension portion extending outwardly from the second transfer structure and opposite to the first circuit board. The second electrical component is disposed on a surface of the first extension portion opposite to the second circuit board, and / or a third electrical component is disposed on a surface of the second circuit board opposite to the first extension portion.

11. The circuit board assembly according to any one of claims 2 to 10, It is characterized in that The at least one second electrical component includes a first sub-component disposed on the third circuit board, and a first avoidance groove or a first avoidance through hole is disposed on a surface of the second circuit board opposite to the first sub-component.

12. The circuit board assembly according to any one of claims 1 to 10, It is characterized in that A second avoidance groove and / or a second avoidance through hole is provided on a surface of the second circuit board facing away from the first circuit board, and the circuit board assembly further includes a fourth electrical component installed in the second avoidance groove and / or the second avoidance through hole.

13. The circuit board assembly according to claim 12, It is characterized in that The circuit board assembly further comprises a first shielding cover, at least part of which extends into the second avoidance through hole and an opening of which faces a side away from the first circuit board, and the fourth electrical component is installed into the first shielding cover through the opening.

14. The circuit board assembly according to claim 13, It is characterized in that A limiting portion is provided on the opening edge of the first shielding cover, and the limiting portion abuts against the surface of the second circuit board facing away from the first circuit board. The second circuit board is also provided with a heightened portion and a fifth electrical component. The heightened portion includes a first surface arranged close to the second circuit board and a second surface arranged away from the second circuit board. The first surface abuts against the surface of the second circuit board facing away from the first circuit board. The fifth electrical component is arranged on the second surface, and the projection of the second surface on the second circuit board partially overlaps with the projection of the limiting portion on the second circuit board.

15. The circuit board assembly according to any one of claims 1 to 10, It is characterized in that The third circuit board further includes a second extension portion offset from the first circuit board, and a sixth electrical component is disposed on a surface of the second extension portion facing the first circuit board.

16. An electronic device, It is characterized in that The electronic device comprises the circuit board assembly according to any one of claims 1 to 15.

17. The electronic device according to claim 16, It is characterized in that The electronic device also includes a rotating shaft and folding parts arranged on both sides of the rotating shaft, the folding parts can be folded or opened relative to the rotating shaft, the circuit board assembly is arranged on at least one of the folding parts, and the second extension part of the third circuit board extends to the back side of the rotating shaft.

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