Processing equipment and processing method of circuit board

Abstract

The invention relates to the technical field of circuit board processing, in particular to circuit board processing equipment and method, and the equipment comprises a bearing frame, a lifting frame, a bearing plate, a clamping plate, a sliding plate and the like. A lifting frame is arranged right above the bearing frame; two bearing plates are fixedly connected to the lower part of the hoisting frame; two clamping plates are slidably connected to the upper portion of the lifting frame. The bearing groove of each bearing plate is connected with a sliding plate in a sliding mode, and the upper portion of each sliding plate is provided with a protruding part. The lifting frame is moved to the position over the bearing frame through the lifting equipment, the linkage part is driven to press downwards, and the sliding plate moves upwards and lifts the circuit board in the bearing groove; after the bottom surfaces of all the circuit boards are flush with the bearing surface, limitation of the limiting grooves of the clamping plates is relieved manually, the tail ends of the circuit boards are held, horizontal thrust is applied, the boards are gathered towards the front end along the bearing surface, concentrated discharging of the whole batch of boards is completed, and the operation efficiency is improved.

Description

Technical Field

[0001] The present application relates to the technical field of circuit board processing, and in particular to a processing device and a processing method for a circuit board. Background Art

[0002] At present, when copper plating is performed on the holes of a circuit board, a receiving rack is generally used to receive the circuit board. The receiving rack is provided with a plurality of grooves arranged at equal intervals for placing the circuit board, and a certain distance is left between adjacent circuit boards to facilitate the contact between the copper plating liquid and various parts of the circuit board, thereby ensuring the uniformity of the copper plating. However, after the copper plating process is completed, the circuit boards need to be manually taken out of the grooves one by one, which results in low work efficiency. Summary of the invention

[0003] In order to overcome the disadvantage of low working efficiency that the circuit boards need to be taken out of the grooves one by one manually after the copper plating process is completed, the present invention provides a processing device and a processing method for the circuit board.

[0004] The technical solution is as follows: a circuit board processing equipment, including a receiving frame, a hanging frame, and a receiving plate clamp; a hanging frame is arranged directly above the receiving frame; two receiving plates are fixedly connected to the lower part of the hanging frame; two clamps are slidably connected to the upper part of the hanging frame; it also includes a sliding plate, a connecting plate and a protrusion; a sliding plate is slidably connected to the receiving groove of each receiving plate, a protrusion is arranged on the upper part of each sliding plate, and the upper surface of the protrusion has the same structure as the upper surface of the receiving plate; a connecting plate is commonly fixedly connected to the lower part of all sliding plates on the same receiving plate; a protrusion is arranged directly below each connecting plate; each protrusion is fixedly connected to the receiving frame.

[0005] Preferably, the limiting groove of each clamping plate is in a flared shape, and the flared shape of the limiting groove faces the circuit board.

[0006] Preferably, locking structures are provided at the front and rear of the splint.

[0007] Preferably, a positioning plate is further included; the receiving frame is fixedly connected to the positioning plate; the rear side of the positioning plate is flush with the front side wall of the receiving groove at the front of the receiving plate; and the spacing between adjacent receiving grooves on the same receiving plate is equal to the thickness of a single circuit board.

[0008] Preferably, it further includes a limiting plate; all the sliding plates on one of the receiving plates are fixedly connected to a limiting plate; one of the protrusions is configured as a spring telescopic block, and the spring telescopic block is located directly below the limiting plate.

[0009] Preferably, the edges on the upper side of the receiving plate and the edges on the upper side of the sliding plate are both rounded.

[0010] Preferably, both connecting plates are designed to be widened and lengthened.

[0011] Preferably, the upper side of the connecting plate is configured to be conical.

[0012] Preferably, sponge pads are provided on both the receiving plate and the clamping plate.

[0013] Preferably, a method for processing a circuit board comprises the following steps: Step 1: Place the multi-layered circuit boards on the bearing surface composed of the receiving plate and the sliding plate, and use the external lifting equipment to drive the lifting frame and the linkage components to move downward, so that the odd-numbered and even-numbered circuit boards are arranged alternately; the operator holds the non-contact area of ​​the adjacent circuit boards to achieve the rapid separation of the adjacent plates, and places the separated circuit boards one by one into the receiving groove; Step 2: The hoisting equipment moves the hoisting frame to the cleaning pool, micro-etching pool, activation pool and copper deposition pool in turn to complete the cleaning, micro-etching, activation and chemical copper deposition processes on the surface of the circuit board; the temperature, concentration and immersion time of each pool liquid are automatically controlled according to the preset parameters; Step 3: The hoisting equipment moves the hoisting frame to the top of the receiving frame, drives the linkage component to press down, moves the sliding plate up and lifts the circuit board in the receiving slot; after the bottom surface of all circuit boards is flush with the bearing surface, manually release the limit slot constraint of the clamping plate, hold the end of the circuit board and apply horizontal thrust to make the board gather toward the front end along the bearing surface, complete the centralized unloading of the entire batch of boards, and improve work efficiency.

[0014] Beneficial effects of the present invention: 1. The present invention moves the hoisting frame to the top of the receiving frame through the hoisting equipment, drives the linkage component to press down, so that the sliding plate moves up and lifts the circuit board in the receiving groove; after the bottom surface of all circuit boards is flush with the bearing surface, the limit groove constraint of the clamping plate is manually released, the end of the circuit board is held and a horizontal thrust is applied to gather the plates toward the front end along the bearing surface, complete the centralized unloading of the entire batch of plates, and improve the working efficiency.

[0015] 2. The present invention places multiple layers of stacked circuit boards on a bearing surface composed of a receiving plate and a sliding plate, and drives a hoisting frame and linkage components downward through an external hoisting device, so that odd-numbered circuit boards and even-numbered circuit boards are arranged alternately; an operator holds the non-contact areas of adjacent circuit boards to achieve rapid separation of adjacent plates, and places the separated circuit boards one by one into receiving grooves.

[0016] 3. After the hoisting frame is lifted from the liquid, the present invention controls the hoisting frame to move up and down in a small range, so that the circuit board as a whole shakes up and down along with the hoisting frame, thereby accelerating the falling speed of the liquid on the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a three-dimensional structural schematic diagram of the circuit board processing equipment of the present invention; Figure 2It is a schematic diagram of the three-dimensional structure of the receiving frame, the hanging frame, the receiving plate, the connecting plate and the protrusion combination of the circuit board processing equipment of the present invention; Figure 3 It is a schematic diagram of the combined three-dimensional structure of the sliding plate, the connecting plate, the convex block and the limiting plate of the circuit board processing equipment of the present invention; Figure 4 A circuit board state diagram of the circuit board processing equipment of the present invention; Figure 5 It is a schematic diagram of the three-dimensional structure of the clamping plate of the circuit board processing equipment of the present invention; Figure 6 The present invention is a schematic diagram of the combined three-dimensional structure of a receiving plate, a sliding plate and a connecting plate of the circuit board processing equipment.

[0018] Explanation of the accompanying drawings: 1-supporting frame, 2-hanging frame, 3-supporting plate, 301-supporting groove, 4-clamping plate, 401-limiting groove, 402-convex part, 5-sliding plate, 6-connecting plate, 7-bump, 21-limiting plate, 22-positioning plate. DETAILED DESCRIPTION

[0019] The present invention is further described below in conjunction with the accompanying drawings and specific embodiments.

[0020] Example 1 A circuit board processing equipment, such as Figure 1-Figure 6 As shown, it includes a receiving frame 1, a hanging frame 2, a receiving plate 3 and a clamping plate 4; a hanging frame 2 is arranged directly above the receiving frame 1; two receiving plates 3 are welded at the lower part of the hanging frame 2; two clamping plates 4 are slidably connected to the upper part of the hanging frame 2; a plurality of receiving grooves 301 are evenly spaced on each receiving plate 3; a plurality of limiting grooves 401 are evenly spaced on each clamping plate 4, and the limiting grooves 401 and the corresponding receiving grooves 301 are located on the same horizontal plane, and a convex portion 402 is arranged between adjacent limiting grooves 401 on the same clamping plate 4; It also includes a sliding plate 5, a connecting plate 6 and a protrusion 7; each receiving groove 301 of each receiving plate 3 is slidably connected to a sliding plate 5, and a protrusion is provided on the upper part of each sliding plate 5, and the upper surface of the protrusion has the same structure as the upper surface of the receiving plate 3; all the sliding plates 5 on the same receiving plate 3 are fixedly connected to a connecting plate 6 at the lower part; a protrusion 7 is provided directly below each connecting plate 6; each protrusion 7 is welded to the receiving frame 1.

[0021] In order to facilitate the restraint of the circuit board, the limiting groove 401 of each clamping plate 4 is in an expanded shape, and the expanded opening of the limiting groove 401 faces the circuit board.

[0022] In order to prevent the clamping plate 4 from sliding arbitrarily on the hanging frame 2 and affecting the effect of restraining the circuit board, locking structures are provided at the front and rear of the clamping plate 4.

[0023] It also includes a positioning plate 22; the positioning plate 22 is welded on the receiving frame 1; the rear side of the positioning plate 22 is flush with the front side wall of the receiving groove 301 at the front of the receiving plate 3; the spacing between adjacent receiving grooves 301 on the same receiving plate 3 is equal to the thickness of a single circuit board.

[0024] It also includes a limit plate 21 ; all the sliding plates 5 on the right receiving plate 3 are welded together with a limit plate 21 ; the right protrusion 7 is set as a spring telescopic block, and the spring telescopic block is located directly below the limit plate 21 .

[0025] In order to prevent the circuit board from being scratched, the edges on the upper side of the receiving plate 3 and the edges on the upper side of the sliding plate 5 are both rounded.

[0026] The following description is based on Figure 1 The angle of view is taken as the reference, wherein the side where the number of the receiving frame 1 is located is the front side, and the side where the number of the clamping plate 4 is located is the rear side; the hoisting frame 2 is hoisted by the external hoisting equipment, in the initial state, such as Figure 6 As shown, the sliding plate 5 and the connecting plate 6 are acted upon by gravity, so that the protruding portion of the upper end of the sliding plate 5 abuts against the bottom of the receiving groove 301 .

[0027] Step 1: Manually place the circuit boards to be copper plated one by one in the receiving slot 301 until the slot is fully loaded, and then push the two clamps 4 inward in the horizontal direction synchronously to align the limit grooves 401 on the clamps 4 with the side edges of the circuit boards, and radially constrain the circuit boards through the limit grooves 401 to ensure that the spacing between adjacent circuit boards is constant (the spacing value is set according to the flow parameters of the copper plating liquid) to meet the uniformity requirements of the copper plating process; after the limit grooves 401 on the clamps 4 are aligned with the side edges of the circuit boards, manually fix the clamps 4 on the hanging frame 2 through the locking structure (screw) provided on the clamps 4.

[0028] Step 2: The external hoisting equipment immerses the hoisting frame 2 in the cleaning tank, micro-etching tank, activation tank and chemical copper deposition tank in turn. After the copper deposition reaction is completed, the hoisting frame 2 is hoisted to the top of the receiving frame 1; then, the hoisting equipment is controlled to drive the hoisting frame 2 and the linkage components to move downward, so that the connecting plate 6 contacts the protrusion 7. When the hoisting frame 2 and the linkage components continue to move downward, the protrusion 7 forces the sliding plate 5 and the connecting plate 6 to move upward until the upper surface of the sliding plate 5 is coplanar with the upper surface of the receiving plate 3. In this process, the sliding plate 5 will receive the receiving frame 1. The plates in the groove 301 are lifted vertically, so that the bottoms of all the plates are separated from the receiving groove 301 and placed flat on the bearing surface composed of the receiving plate 3 and the sliding plate 5; then, the limit constraint of the clamping plate 4 is manually released (the clamping plate 4 is manually pulled outward to separate the limit groove 401 from the circuit board), the end plate is manually grasped and a horizontal forward force is applied to gather the plates toward the front end along the bearing surface, and finally the centralized unloading of the entire batch of plates is completed through a single operation, which greatly improves the working efficiency compared with the traditional method of taking the plates one by one.

[0029] The processes before copper deposition on the circuit board are drilling and deburring / cleaning. After completing these processes, in order to save space and facilitate transportation, the circuit boards will be temporarily stacked together, which causes the air between adjacent circuit boards to be squeezed out, forming a state close to vacuum. The external atmospheric pressure will exert pressure on the plates, making them fit more tightly, making it difficult to separate, which in turn makes it difficult to manually place the circuit boards to be copper deposited one by one into the receiving groove 301 in the first step; therefore, before placing the circuit boards to be copper deposited one by one into the receiving groove 301, first hoist the hoisting frame 2 to the top of the receiving frame 1, and control The hoisting equipment drives the hoisting frame 2 and the linkage components to move downward until the protrusion 7 forces the upper surface of the sliding plate 5 to be coplanar with the upper surface of the receiving plate 3, and a positioning plate 22 is set on the receiving frame 1, and its rear end is aligned with the front side wall of the frontmost receiving groove 301 of the receiving plate 3, and then the stacked circuit boards are manually placed on the bearing surface composed of the receiving plate 3 and the sliding plate 5, and it is ensured that the frontmost plate is in contact with the positioning plate 22, and the spacing between adjacent receiving grooves 301 on the same receiving plate 3 is equal to the thickness of a single circuit board; at this time, counting from front to back, the circuit boards with odd numbers are located directly above the sliding plate 5, and the circuit boards with even numbers are located The receiving plate 3 is then placed on the receiving plate 3, and the external lifting equipment is then controlled to drive the lifting frame 2 and the linkage components to move downward, and the protrusion 7 forces the sliding plate 5 and the connecting plate 6 to continue to move upward, so that the sliding plate 5 moves upward to lift the odd-numbered circuit board upward and protrude from the even-numbered circuit board; it should be noted that in order to prevent the odd-numbered circuit board from moving upward with the even-numbered circuit board when it is lifted upward, before performing the above operation, the two clamping plates 4 are manually pushed inward in the horizontal direction synchronously, so that the protrusion 402 on the clamping plate 4 contacts the side of the even-numbered circuit board, and the even-numbered circuit board is radially lifted through the protrusion 402 Constraints ensure that the circuit boards with even numbers will not move upward with the circuit boards with odd numbers; when the limit plate 21 on the right sliding plate 5 contacts the receiving plate 3, the sliding plate 5, the connecting plate 6 and the limit plate 21 on the right are blocked by the receiving plate 3 and no longer move upward; as the hanging frame 2 and the linkage components continue to move downward, the receiving plate 3 on the right drives the corresponding sliding plate 5 and the connecting plate 6 to move downward to compress the right protrusion 7, and the right protrusion 7 is set as a spring expansion block, while the left protrusion 7 will continue to force the left sliding plate 5 and the connecting plate 6 to move upward, so that the left end of the odd-numbered circuit board is tilted and lifted, as shown in FIG. Figure 4 As shown; subsequently, the external lifting equipment is controlled to drive the lifting frame 2 and the linkage components to rise and reset, the sliding plate 5 returns to the initial position, and then the limit constraint of the clamping plate 4 is manually released (the clamping plate 4 is manually pulled outward to make the protrusion 402 separate from the circuit board). At this time, the circuit boards with odd numbers and the circuit boards with even numbers are arranged alternately, and then the non-contact areas of the adjacent circuit boards are manually grasped to easily separate the adjacent circuit boards, so that the circuit boards can be placed one by one into the receiving groove 301.

[0030] Example 2 On the basis of Example 1, Figure 2 and Figure 3 As shown, the two connecting plates 6 are both designed to be widened and lengthened.

[0031] In order to facilitate the downward flow of water on the upper side of the connecting plate 6 , the upper side of the connecting plate 6 is configured to be conical.

[0032] In order to prevent damage to the circuit board, sponge pads are provided on the receiving plate 3 and the clamping plate 4.

[0033] In the second step of Example 1: when the circuit board is immersed in the cleaning pool, the micro-etching pool, the activation pool and the copper precipitation pool, it is necessary to stand for a period of time after coming out of each pool to allow the liquid remaining on the circuit board to flow back into the pool, and the natural reflux speed of the liquid is slow, and the operation efficiency is low; therefore, after the lifting frame 2 is lifted from the liquid, the lifting frame 2 is controlled to move up and down reciprocatingly in a small range, so that the circuit board as a whole follows the lifting frame 2 to shake up and down, thereby accelerating the liquid on the circuit board to fall back; and, the two connecting plates 6 are widened and lengthened, and after the lifting frame 2 is lifted from the liquid, the connecting plates 6 are still allowed to be located in the liquid, and then the lifting frame 2 is controlled to move up and down reciprocatingly in a small range. During the up and down movement, the lifting frame 2 is always located above the liquid surface, and the connecting plates 6 are always located in the liquid; the connecting plates When 6 follows the hanging frame 2 to move downward, since the connecting plate 6 is wide, the resistance it encounters from the liquid is large, so the downward movement speed of the connecting plate 6 and the sliding plate 5 is slower than the downward movement speed of the circuit board. Relative to the circuit board, the sliding plate 5 moves upward, that is, the sliding plate 5 forces the circuit board to be pushed out from the receiving groove 301; when the connecting plate 6 follows the hanging frame 2 to move upward, similarly, the resistance encountered by the connecting plate 6 and the sliding plate 5 is greater, and the protruding portion on the upper part of the sliding plate 5 will first be located at the bottom of the receiving groove 301, so that when the hanging frame 2 stops, the circuit board will fall back into the receiving groove 301, so that the circuit board as a whole follows the hanging frame 2 to shake up and down, and at the same time, the circuit board can shake up and down individually with a small amplitude, further accelerating the falling speed of the liquid on the circuit board and improving the working efficiency.

[0034] Preferably, a method for processing a circuit board comprises the following steps: Step 1: Place the multi-layered circuit boards on the bearing surface formed by the receiving plate 3 and the sliding plate 5, and drive the lifting frame 2 and the linkage components downward through the external lifting equipment, so that the odd-numbered and even-numbered circuit boards are arranged alternately; the operator holds the non-contact area of ​​the adjacent circuit boards to achieve rapid separation of the adjacent plates, and places the separated circuit boards one by one into the receiving groove 301; Step 2: The hoisting equipment moves the hoisting frame 2 to the cleaning pool, micro-etching pool, activation pool and copper deposition pool in sequence to complete the cleaning, micro-etching, activation and chemical copper deposition processes on the surface of the circuit board; wherein the temperature, concentration and immersion time of each pool liquid are automatically controlled according to preset parameters; Step three: The hoisting equipment moves the hoisting frame 2 to the top of the receiving frame 1, drives the linkage component to press down, moves the sliding plate 5 upward and lifts the circuit board in the receiving groove 301; after the bottom surface of all circuit boards is flush with the bearing surface, manually release the constraint of the limit groove 401 of the clamping plate 4, hold the end of the circuit board and apply horizontal thrust to make the board gather toward the front end along the bearing surface, complete the centralized unloading of the whole batch of boards, and improve the working efficiency.

[0035] Although the present invention is described in detail with reference to the above embodiments, it is obvious to those skilled in the art through this disclosure that various changes or modifications may be made to the present invention without departing from the principle and spirit of the present invention defined by the claims. Therefore, the detailed description of the embodiments of the present disclosure is only used to explain, not to limit the present invention, but the scope of protection is limited by the content of the claims.

Claims

1. A circuit board processing device, comprising a receiving frame (1), a hanging frame (2), a receiving plate (3) and a clamping plate (4); the receiving frame (1) is provided with a hanging frame (2) directly above the receiving frame (1); two receiving plates (3) are fixedly connected to the lower part of the hanging frame (2); two clamping plates (4) are slidably connected to the upper part of the hanging frame (2); the characteristics are as follows: It also comprises a sliding plate (5), a connecting plate (6) and a protrusion (7); a sliding plate (5) is slidably connected to the receiving groove (301) of each receiving plate (3); a protrusion is arranged on the upper part of each sliding plate (5); the upper surface of the protrusion has the same structure as the upper surface of the receiving plate (3); the lower parts of all the sliding plates (5) on the same receiving plate (3) are fixedly connected to a connecting plate (6); a protrusion (7) is arranged directly below each connecting plate (6); and each protrusion (7) is fixedly connected to the receiving frame (1).

2. A circuit board processing equipment according to claim 1, characterized in that: The limiting groove (401) of each clamping plate (4) is in a flared shape, and the flared shape of the limiting groove (401) faces the circuit board.

3. A circuit board processing equipment according to claim 1, characterized in that: The front and rear parts of the clamping plate (4) are both provided with locking structures.

4. A circuit board processing equipment according to claim 1, characterized in that: It also includes a positioning plate (22); the positioning plate (22) is fixedly connected to the receiving frame (1); the rear side surface of the positioning plate (22) is flush with the front side wall of the receiving groove (301) at the front of the receiving plate (3); and the spacing between adjacent receiving grooves (301) on the same receiving plate (3) is equal to the thickness of a single circuit board.

5. A circuit board processing equipment according to claim 4, characterized in that: It also includes a limiting plate (21); all the sliding plates (5) on one of the receiving plates (3) are fixedly connected to a limiting plate (21); one of the protrusions (7) is configured as a spring telescopic block, and the spring telescopic block is located directly below the limiting plate (21).

6. A circuit board processing equipment according to claim 5, characterized in that: The edges on the upper side of the receiving plate (3) and the edges on the upper side of the sliding plate (5) are both rounded.

7. The circuit board processing equipment according to claim 1, characterized in that: The two connecting plates (6) are both designed to be widened and lengthened.

8. A circuit board processing equipment according to claim 7, characterized in that: The upper side of the connecting plate (6) is configured to be conical.

9. The circuit board processing equipment according to claim 1, characterized in that: Sponge pads are provided on the receiving plate (3) and the clamping plate (4).

10. A method for processing a circuit board, characterized in that: The circuit board processing equipment according to claim 9 comprises the following steps: Step 1: placing multiple layers of stacked circuit boards on a bearing surface formed by a receiving plate (3) and a sliding plate (5), and driving the lifting frame (2) and the linkage components downward by means of an external lifting device, so that the odd-numbered and even-numbered circuit boards are arranged alternately; an operator holds the non-contact areas of adjacent circuit boards to achieve rapid separation of adjacent boards, and places the separated circuit boards one by one into the receiving groove (301); Step 2: The hoisting equipment moves the hoisting frame (2) to the cleaning pool, micro-etching pool, activation pool and copper deposition pool in sequence to complete the cleaning, micro-etching, activation and chemical copper deposition processes on the surface of the circuit board; wherein the temperature, concentration and immersion time of each pool liquid are automatically controlled according to preset parameters; Step 3: The lifting equipment moves the lifting frame (2) to the top of the receiving frame (1), drives the linkage component to press down, moves the sliding plate (5) upward and lifts the circuit board in the receiving groove (301); after the bottom surface of all the circuit boards is flush with the bearing surface, manually release the limit groove (401) of the clamping plate (4), hold the end of the circuit board and apply horizontal thrust, so that the board gathers toward the front end along the bearing surface, completes the centralized unloading of the whole batch of boards, and improves the working efficiency.

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